JP5538609B2 - LED lighting device - Google Patents

LED lighting device Download PDF

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JP5538609B2
JP5538609B2 JP2013185673A JP2013185673A JP5538609B2 JP 5538609 B2 JP5538609 B2 JP 5538609B2 JP 2013185673 A JP2013185673 A JP 2013185673A JP 2013185673 A JP2013185673 A JP 2013185673A JP 5538609 B2 JP5538609 B2 JP 5538609B2
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led
led lamp
connecting plate
housing
substrate
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JP2014112523A (en
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明彦 奥村
昌明 峯田
賢一 茂木
大輔 尾形
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Iris Ohyama Inc
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Description

本発明は、LED素子を光源に使用したLED照明装置に関し、特に天井に直接取り付ける天井直付け型のLED照明装置に関するものである。   The present invention relates to an LED lighting device using an LED element as a light source, and more particularly to a ceiling-mounted LED lighting device directly attached to a ceiling.

近年、環境意識の高まりから、省電力化に優れたLED素子を光源に使用した、電源内蔵型の電球型LEDランプが普及してきた。更に最近は、天井埋め込み型のダウンライトや、天井直付け型のシーリングライトにおいても、LED素子を使用した照明装置が開発され、市場に導入されてきている。
天井埋め込み型のダウンライトは、天井面に大きな孔をあけるものであり、その孔あけ作業や、また孔部の補強が必要であり、施工時に手間がかかるものである。そこで、大きな孔をあけることのない照明装置が検討されている(特許文献1、2)。
また天井直付けシーリングライトは、天井面に取り付けられた引掛シーリングボディに、引掛シーリングアダプタを取り付けた照明装置を装着するものであり、特に最近は厚みの薄いシーリングライトも検討されている(特許文献3)。
2. Description of the Related Art In recent years, due to an increase in environmental awareness, a light bulb type LED lamp with a built-in power source using an LED element excellent in power saving as a light source has been widely used. More recently, lighting devices using LED elements have also been developed and introduced into the market for ceiling-mounted downlights and ceiling-mounted ceiling lights.
The ceiling-embedded downlight is for making a large hole in the ceiling surface, and it is necessary to reinforce the hole and reinforce the hole, which takes time during construction. Then, the illuminating device which does not open a big hole is examined (patent document 1, 2).
In addition, the ceiling-mounted ceiling light is a device in which a lighting device having a hook ceiling adapter is attached to a hook ceiling body attached to the ceiling surface. Recently, a ceiling light with a small thickness has been studied (patent document). 3).

例えば特許文献1に記載されている照明装置は、給電部、LED、LEDと同一平面上にある点灯装置とが取り付けられたベース板が取付ネジにより天井面に直接ネジ止めされるもので、天井面には円筒形状の給電部が挿入される挿入孔が形成されており、挿入孔に挿入された給電部に対して、電力供給用の電源線が接続される。それによって天井面に大きな孔をあけることなく天井面に直接取り付けることができる照明装置が提供される。
また特許文献2に記載されている照明装置は、光源及び当該光源に電源を供給する電源ブロックが内部に収納され、天井面に取り付けられる器具本体内部に、外部電線が電気的に接続される速結端子を備えたものであり、薄型化を図りつつ施工性を向上させた照明器具が提供される。
For example, in the illumination device described in Patent Document 1, a base plate to which a power feeding unit, an LED, and a lighting device on the same plane as the LED are attached is directly screwed to a ceiling surface with an attachment screw. An insertion hole into which a cylindrical power feeding part is inserted is formed on the surface, and a power supply power line is connected to the power feeding part inserted into the insertion hole. Accordingly, an illumination device that can be directly attached to the ceiling surface without providing a large hole in the ceiling surface is provided.
In addition, the lighting device described in Patent Document 2 includes a light source and a power block that supplies power to the light source, and a speed at which an external electric wire is electrically connected to the interior of the fixture body attached to the ceiling surface. Provided is a lighting fixture that includes a connection terminal and has improved workability while being thin.

特許文献3に記載されている照明装置は、照明モジュールと、照明モジュールに電力を供給する電源部と、照明モジュール及び電源部を保持するシャーシと、シャーシを引掛シーリングボディに取り付ける引掛シーリングアダプタとを備え、照明モジュール、電源部及び引掛シーリングアダプタは、夫々が引掛シーリングボディに対して互いに重なり合わないようにシャーシに配されている。それによって引掛シーリングボディからの照明モジュール、電源部及び引掛シーリングアダプタの突設高さを低減することができ、薄型化を図った照明装置が提供される。   The illumination device described in Patent Document 3 includes an illumination module, a power supply unit that supplies power to the illumination module, a chassis that holds the illumination module and the power supply unit, and a hooking ceiling adapter that attaches the chassis to the hooking ceiling body. The lighting module, the power supply unit, and the hooking ceiling adapter are arranged on the chassis so as not to overlap each other with respect to the hooking sealing body. As a result, the protruding heights of the lighting module, the power supply unit, and the hooking ceiling adapter from the hooking ceiling body can be reduced, and a lighting device that is reduced in thickness is provided.

特許第4565307号Japanese Patent No. 4565307 特開2011−233272JP2011-233272A 特開2011−134684JP2011-134684A

しかしながら、特許文献1〜特許文献3に記載の照明装置は、天井等への取り付け作業性が劣るばかりでなく、特許文献1に記載されている照明装置においては、LED素子や電子部品が発生する熱の放熱対策がなされておらず、特許文献2に記載されている照明装置は、光源部の上面部に放熱板を配置しているものの、部品点数が増えるばかりか、放熱板の熱を器具本体外部に効率的に放散することができないという問題がある。また特許文献3に記載されている照明器具は、電源部等により発生した熱をセンタカバーの格子穴から照明装置の外部に放散しているだけであるから、放熱効果が不十分であるという問題がある。   However, the lighting devices described in Patent Literature 1 to Patent Literature 3 are not only inferior in workability to the ceiling or the like, but in the lighting device described in Patent Literature 1, LED elements and electronic components are generated. Although no heat dissipation measures have been taken, the lighting device described in Patent Document 2 has a heat sink disposed on the upper surface of the light source, but the number of parts increases and the heat of the heat sink is There is a problem that it cannot be efficiently diffused outside the main body. Moreover, since the lighting fixture described in Patent Document 3 only dissipates heat generated by the power supply unit or the like from the lattice holes of the center cover to the outside of the lighting device, the heat dissipation effect is insufficient. There is.

本発明は、以上のような課題を解決するため提案されたものであり、天井面等への取り付け作業性に優れたLED照明装置を提供するとともに、少ない部品点数で、LED素子や電子部品等から発生する熱を効率的に外部に放散できるLED照明装置を提供することを目的とする。   The present invention has been proposed in order to solve the above-described problems, and provides an LED lighting device with excellent workability for mounting on a ceiling surface and the like, and with a small number of components, LED elements, electronic components, and the like. An object of the present invention is to provide an LED lighting device that can efficiently dissipate heat generated from the outside.

上記課題を解決するため、請求項1に係る発明にあっては、LED素子が実装されたLED基板と、前記LED素子を点灯駆動するための点灯回路を構成する電子部品が実装された点灯回路基板を筐体に収納するLEDランプ本体と、
被取付部に固定され、前記LEDランプに着脱自在に装着することができる連結板と、を備え、
前記連結板は、一枚の板金を成形加工したものであり、かつ、前記被取付部に形成された外部電源電線の通孔から引き出された外部電源線を挿通する電力供給開口部を有しており、
前記連結板と前記LEDランプ本体は、前記LEDランプ本体を前記連結板に対して回動して止着する係止手段により着脱自在に装着され、
前記筐体は熱伝導性を有しており、
前記LED素子が実装される領域の基板が、前記筐体の内壁の少なくとも一部に接触していることを特徴とする。
In order to solve the above-mentioned problem, in the invention according to claim 1, a lighting circuit on which an LED board on which an LED element is mounted and an electronic component that constitutes a lighting circuit for lighting the LED element is mounted. An LED lamp body that houses a substrate in a housing;
A connecting plate fixed to the attached portion and detachably attached to the LED lamp,
The connecting plate is formed by processing a single sheet metal and has a power supply opening through which an external power supply line drawn out from a through hole of an external power supply wire formed in the attached portion is inserted. And
The connecting plate and the LED lamp body are detachably mounted by a locking means for rotating and fixing the LED lamp body with respect to the connecting plate,
The housing has thermal conductivity,
The board | substrate of the area | region where the said LED element is mounted is contacting at least one part of the inner wall of the said housing | casing.

また請求項2に係る発明にあっては、前記連結板は、前記LEDランプ本体に装着した状態で、前記LEDランプ本体の上面外周縁部に収まるものであることを特徴とする請求項1に記載のLED照明装置。 The invention according to claim 2 is characterized in that the connecting plate is fitted in the outer peripheral edge of the upper surface of the LED lamp body in a state of being mounted on the LED lamp body. LED lighting apparatus of description.

また請求項3に係る発明にあっては、前記筐体の前記基板の収納側に凸部を形成し、該凸部に前記LED素子が実装される領域の基板が接触することを特徴とする。   The invention according to claim 3 is characterized in that a convex portion is formed on the housing side of the substrate of the housing, and a substrate in a region where the LED element is mounted contacts the convex portion. .

また請求項4に係る発明にあっては、前記LED素子と前記点灯回路を構成する電子部品とが、同一の基板上に実装されており、前記LED素子が実装される領域の裏面部が前記筐体の凸部に接触しており、前記点灯回路を構成する電子部品が実装される領域の基板の裏面が、前記LEDランプ本体の筐体の内壁から離間していることを特徴とするMoreover, in the invention which concerns on Claim 4, the said LED element and the electronic component which comprises the said lighting circuit are mounted on the same board | substrate, and the back surface part of the area | region where the said LED element is mounted is the said part. A back surface of a substrate in a region where an electronic component constituting the lighting circuit is mounted is spaced apart from an inner wall of the housing of the LED lamp body .

また請求項5に係る発明にあっては、前記基板の裏面部に、前記LED素子の実装領域と前記点灯回路を構成する電子部品の実装領域に対応して放熱面が形成されており、前記LED素子が実装される領域の放熱面が前記筐体の凸部に接触していることを特徴とする。   Moreover, in the invention which concerns on Claim 5, the thermal radiation surface is formed in the back surface part of the said board | substrate corresponding to the mounting area | region of the said LED element, and the mounting area | region of the electronic component which comprises the said lighting circuit, The heat radiation surface of the area where the LED element is mounted is in contact with the convex portion of the housing.

また請求項6に係る発明にあっては、前記点灯回路を構成する電子部品が実装される領域の基板の裏面と、前記LEDランプ本体の筐体の内壁とが離間して形成される空間に、電気絶縁性の放熱樹脂または放熱シートが備えられていることを特徴とする。   In the invention according to claim 6, in the space formed by separating the back surface of the substrate in the area where the electronic components constituting the lighting circuit are mounted and the inner wall of the casing of the LED lamp body. An electrically insulating heat radiating resin or a heat radiating sheet is provided.

また請求項7に係る発明にあっては、前記連結板は熱伝導性材料であることを特徴とする。   The invention according to claim 7 is characterized in that the connecting plate is a heat conductive material.

請求項1〜請求項7に係る発明によれば、LED照明装置を天井面等に取り付ける際の取り付け作業性が向上するとともに、少ない部品点数で、LED素子や電子部品等から発生する熱を効率的に外部に放散できる等の効果が得られる。 According to the invention of claims 1 to 7, efficiency with the LED lighting device is improved attachment workability in attaching the ceiling surface or the like, a small number of components, the heat generated from the LED devices and electronic parts, etc. The effect that it can dissipate outside is obtained.

本実施形態に係わるLED照明装置の天井面側から見た取り付け前外観斜視図The external perspective view before attachment seen from the ceiling surface side of the LED lighting device according to the present embodiment 本実施形態に係わるLED照明装置の被照射面側から見た取り付け前外観斜視図The external perspective view before attachment seen from the irradiated surface side of the LED lighting device according to the present embodiment 本実施形態に係わるLED照明装置の天井面側から見た外観斜視図External appearance perspective view seen from the ceiling surface side of the LED lighting device according to the present embodiment 本実施形態に係わるLED照明装置の被照射面側から見た外観斜視図The external appearance perspective view seen from the to-be-irradiated surface side of the LED lighting apparatus concerning this embodiment 本実施形態に係わる連結板の天井面側から見た外観斜視図External perspective view of the connecting plate according to the present embodiment viewed from the ceiling surface side 本実施形態に係わる連結板の被照射面側から見た外観斜視図External perspective view of the connecting plate according to this embodiment as seen from the irradiated surface side 本実施形態に係わる連結板の天井面側から見た正面図The front view seen from the ceiling surface side of the connection board concerning this embodiment 本実施形態に係わる連結板の図7X方向から見た側面図Side view of the connecting plate according to the present embodiment as viewed from the direction of FIG. 7X. 本実施形態に係わる連結板の図7Y−Y線断面図FIG. 7Y-Y cross-sectional view of the connecting plate according to the present embodiment. 本実施形態に係わるLEDランプを天井面側から見た外観斜視図External perspective view of the LED lamp according to this embodiment as seen from the ceiling surface side 本実施形態に係わるLEDランプを被照射面側から見た外観斜視図External perspective view of the LED lamp according to this embodiment viewed from the irradiated surface side 本実施形態に係わるLEDランプを天井面側から見た正面図The front view which looked at the LED lamp concerning this embodiment from the ceiling surface side 本実施形態に係わるLEDランプの図12X−X線断面図FIG. 12X-X sectional view of the LED lamp according to the present embodiment. 本実施形態に係わるLEDランプの図12Y−Y線断面図12Y-Y sectional view of the LED lamp according to this embodiment. 本実施形態に係わる図13の速結端子収納部近傍の拡大図13 is an enlarged view of the vicinity of the quick connection terminal storage portion in FIG. 13 according to the present embodiment. 本実施形態に係わる速結端子の外観斜視図External perspective view of quick connection terminal according to this embodiment 本実施形態に係わる速結端子収納部の外観斜視図External perspective view of the quick connection terminal storage according to the present embodiment 本実施形態に係わる速結端子収納部を天井面側から見た正面図The front view which looked at the quick connection terminal storage part concerning this embodiment from the ceiling surface side 本実施形態に係わる速結端子収納部の図18X−X線断面図18X-X sectional view of the quick connection terminal storage portion according to the present embodiment. 本実施形態に係わるLEDランプを上側から見た分解斜視図The exploded perspective view which looked at the LED lamp concerning this embodiment from the upper part 本実施形態に係わるLEDランプを下側から見た分解斜視図(LED素子、電子部品は省略)The exploded perspective view which looked at the LED lamp concerning this embodiment from the lower side (a LED element and electronic parts are omitted) 本実施形態に係わる基板の実装面側正面図Mounting surface side front view of substrate according to this embodiment 本実施形態に係わる基板の裏面側正面図Front side view of back side of substrate according to this embodiment 本実施形態に係わる基板の別形態の実装面側正面図Mounting surface side front view of another form of the substrate according to this embodiment 本実施形態に係わる基板の別形態の裏面側正面図The back side front view of another form of the board concerning this embodiment 本実施形態に係わる遮蔽板の天井面側から見た外観斜視図External perspective view of the shielding plate according to this embodiment viewed from the ceiling side 本実施形態に係わる遮蔽板の被照射面側から見た外観斜視図External perspective view of the shielding plate according to the present embodiment viewed from the irradiated surface side 本実施形態に係わる導光板近傍の拡大断面図Enlarged sectional view of the vicinity of the light guide plate according to this embodiment

以下に本発明の好適な実施の形態について、図面を参照しながら説明する。なお本実施形態は一例であり、これに限定されるものではない。   Preferred embodiments of the present invention will be described below with reference to the drawings. This embodiment is an example, and the present invention is not limited to this.

図1から図4に示したように、本実施形態に係わるLED照明装置100は、連結板1と、LEDランプ本体2とからなり、外部電源線(F−ケーブル)3が出ている直径15mmの通孔4aがあいた天井面4に連結板1がネジ止めされ、該連結板1にLEDランプ本体2が着脱自在に装着される。連結板1にLEDランプ本体2が装着されるときに、LEDランプ本体2と外部電源線3とが接続され、LED照明装置100はダウンライトとして使用可能となる。なお直径15mm以下の通孔4aであれば、天井に特別な補強を施すことがないので、施工性良くLED照明装置を取り付けることができる。   As shown in FIGS. 1 to 4, the LED lighting device 100 according to the present embodiment includes a connecting plate 1 and an LED lamp body 2, and a diameter of 15 mm from which an external power line (F-cable) 3 comes out. The connecting plate 1 is screwed to the ceiling surface 4 having the through holes 4a, and the LED lamp body 2 is detachably attached to the connecting plate 1. When the LED lamp body 2 is mounted on the connecting plate 1, the LED lamp body 2 and the external power supply line 3 are connected, and the LED lighting device 100 can be used as a downlight. In addition, if it is the through-hole 4a of diameter 15mm or less, since a special reinforcement is not given to a ceiling, an LED lighting apparatus can be attached with sufficient workability.

連結板1は、ステンレス板を使用して、打抜加工、プレス加工、折曲加工によって作成される。連結板1は円板形状で、図5から図9に示すように、中心部に円形の連結板電力供給部11が開口し、また該開口部の縁部から1対の連結板位置固定延出部12と、1対の回動規制孔部13とが形成されている。   The connecting plate 1 is made by punching, pressing, or bending using a stainless steel plate. As shown in FIGS. 5 to 9, the connecting plate 1 has a circular shape, and a circular connecting plate power supply unit 11 is opened at the center, and a pair of connecting plate positions are fixedly extended from the edge of the opening. A protruding portion 12 and a pair of rotation restricting hole portions 13 are formed.

連結板位置固定延出部12は、連結板1の回転軸と平行に天井面4側に突出した、連結板1と同一中心を有する直径14mm、外壁厚1mm、高さ15mmの仮想円筒の外壁の一部からなるように、対向する所定の長さの円弧から延出した2つの延出片である。この2つの連結板位置固定延出部12によって、連結板1を通孔4aに挿通する際の位置決めが容易となり、連結板1を簡単に天井面4に取り付けることができる。
更に、連結板位置固定延出部12が設けられていない前記仮想円筒の円弧から、扇型に開口した1対の回動規制孔部13があけられており、連結板電力供給部11と1対の回動規制孔部13とは、連通したリボン型(拡口形状)の貫通孔を形成している。
The connecting plate position fixed extending portion 12 protrudes toward the ceiling surface 4 in parallel with the rotation axis of the connecting plate 1 and has an outer wall of a virtual cylinder having the same center as the connecting plate 1 and a diameter of 14 mm, an outer wall thickness of 1 mm and a height of 15 mm. These are two extended pieces extended from arcs of a predetermined length facing each other. Positioning when the connecting plate 1 is inserted into the through hole 4a is facilitated by the two connecting plate position fixing extension portions 12, and the connecting plate 1 can be easily attached to the ceiling surface 4.
Furthermore, a pair of rotation restricting hole portions 13 opened in a fan shape are opened from the arc of the virtual cylinder where the connecting plate position fixing extension portion 12 is not provided, and the connecting plate power supply portions 11 and 1 are opened. The pair of rotation restricting hole portions 13 form a communicating ribbon type (opening shape) through hole.

また連結板1には、LEDランプ本体2と回動係合する回動係合部14が設けられている。回動係合部14は、回動係止片挿入開口14−1と係止舌片14−2とからなっており、回動係止片挿入開口14−1は、略扇形状の開口部で、90度間隔に4箇所設けられている。
係止舌片14−2は、回動係止片挿入開口14−1の開口部よりも小さく、該開口部と相似形に形成されており、連結板1のLEDランプ本体2と接合する面側(下面側)で、該開口部の半径方向周縁部の一端側に、回動係止片挿入開口14−1を臨むように設置されている。なお係止舌片14−2の先端には、回動係合が外れるのを防止するための爪14−3が形成されている。
The connecting plate 1 is provided with a rotation engaging portion 14 that rotates and engages with the LED lamp body 2. The rotation engaging portion 14 includes a rotation locking piece insertion opening 14-1 and a locking tongue piece 14-2, and the rotation locking piece insertion opening 14-1 is a substantially fan-shaped opening. Thus, four locations are provided at intervals of 90 degrees.
The locking tongue piece 14-2 is smaller than the opening of the rotation locking piece insertion opening 14-1, is formed in a similar shape to the opening, and is a surface that joins the LED lamp body 2 of the connecting plate 1. On the side (lower surface side), it is installed on one end side of the peripheral edge in the radial direction of the opening so as to face the rotation locking piece insertion opening 14-1. A claw 14-3 is formed at the tip of the locking tongue piece 14-2 to prevent the rotational engagement from being released.

LEDランプ本体2は、図20、図21、図13に示すように、筐体21と、筐体21の内部に収納される外部電源線が接続される速結端子22と、速結端子22を収納する速結端子収納部23と、複数のLED素子24と、LED素子24を点灯させる点灯回路を構成する各種電子部品25とが実装された基板26と、電子部品25を覆う遮蔽板27と、筐体21の開口部を覆う透光性カバー28とから概略構成されている。   As shown in FIGS. 20, 21, and 13, the LED lamp main body 2 includes a housing 21, a quick connection terminal 22 to which an external power line housed in the housing 21 is connected, and a quick connection terminal 22. A board 26 on which a quick-connection terminal storage portion 23 for storing the LED, a plurality of LED elements 24, and various electronic components 25 constituting a lighting circuit for lighting the LED elements 24 are mounted, and a shielding plate 27 covering the electronic components 25. And a translucent cover 28 that covers the opening of the housing 21.

筐体21は、図10〜図14に示すように、アルミニウムを使用して、一端面が開口した中空の有底円筒で高さの低い扁平な形状に形成されている。
連結板1に接合される筐体21の上面21−1には、連結板1の係止舌片14−2が入り込める、筐体21の内部に向かって円形に凹んだ凹部21−2が形成され、また該上面21−1の外周縁から、連結板1の厚みと同じ高さの延出部21−10が形成されており、LEDランプ本体2を連結板1に装着したときに、一体化する構造となっている。
The housing | casing 21 is formed in the flat shape with a low height with the hollow bottomed cylinder which one end surface opened using aluminum, as shown in FIGS.
On the upper surface 21-1 of the housing 21 joined to the connecting plate 1, a concave portion 21-2 that is recessed in a circular shape toward the inside of the housing 21 is formed so that the locking tongue piece 14-2 of the connecting plate 1 can enter. Further, an extension portion 21-10 having the same height as the thickness of the connecting plate 1 is formed from the outer peripheral edge of the upper surface 21-1, and when the LED lamp main body 2 is attached to the connecting plate 1, it is integrated. It becomes the structure which becomes.

筐体21の凹部21−2の中心部に、長方形に開口した筒状のLEDランプ電力供給開口部21−3が立設されている。またLEDランプ電力供給開口部21−3の周縁部には、連結板1に向かって延出する、外径が14mmの円筒形状のLEDランプ位置固定延出部21−4が形成されている。   A cylindrical LED lamp power supply opening 21-3 opened in a rectangular shape is erected at the center of the recess 21-2 of the housing 21. Further, a cylindrical LED lamp position fixing extension portion 21-4 having an outer diameter of 14 mm and extending toward the connecting plate 1 is formed at the peripheral edge portion of the LED lamp power supply opening portion 21-3.

更に、LEDランプ位置固定延出部21−4の外壁には、連結板位置固定延出部12が係合する深さ1mmで、円筒側壁に沿った係合溝21−5が対向して1対形成されている(この実施形態では、筒状のLEDランプ電力供給開口部21−3の肉厚部がLEDランプ位置固定延出部21−4となり、薄肉部が係合溝21−5となっている)。前記凹部21−2の上面部にはLEDランプ位置固定延出部21−4と一体に小片状の回動規制突起21−6が形成されている。なお、該回動規制突起21−6の内部は後述する速結端子収納部23を収納するために空洞となっている。   Furthermore, the outer wall of the LED lamp position fixing extension portion 21-4 has a depth of 1 mm at which the connecting plate position fixing extension portion 12 engages, and an engagement groove 21-5 along the cylindrical side wall 1 (In this embodiment, the thick portion of the cylindrical LED lamp power supply opening 21-3 is the LED lamp position fixing extension portion 21-4, and the thin portion is the engagement groove 21-5. ) A small piece-like rotation restricting projection 21-6 is formed integrally with the LED lamp position fixing extension 21-4 on the upper surface of the recess 21-2. The inside of the rotation restricting projection 21-6 is hollow to accommodate a quick connection terminal accommodating portion 23 described later.

前記回動規制突起21−6は、連結板1の回動規制孔部13に挿入され、扇形の回動規制孔部13の拡角度で、LEDランプ本体2の回動範囲が決定されている。また係合溝21−5の溝幅も、前記回動できる角度に対応して連結板位置固定延出部12の幅よりも広く形成されている。   The rotation restricting projection 21-6 is inserted into the turn restricting hole 13 of the connecting plate 1, and the turning range of the LED lamp body 2 is determined by the expansion angle of the fan-shaped turn restricting hole 13. . The groove width of the engaging groove 21-5 is also formed wider than the width of the connecting plate position fixing extension portion 12 corresponding to the pivotable angle.

これら各種部材の構造や寸法によって、連結板位置固定延出部12と、LEDランプ位置固定延出部21−4とが係合したときにできる係合体は、薄さを保った状態で外径14mmの円筒空間に収まる構造となっている。それによって、連結板1を介していても、扁平なLED照明装置100を実現でき、かつ天井面4に設けられた孔に対して、それぞれの電力供給部の開口部がずれることなく簡単に開口面が合わせられ取り付けやすい構造となっている。   Depending on the structure and dimensions of these various members, the engaging body formed when the connecting plate position fixing extension portion 12 and the LED lamp position fixing extension portion 21-4 are engaged with each other has an outer diameter in a thin state. It is structured to fit in a 14 mm cylindrical space. Thereby, even though the connecting plate 1 is interposed, the flat LED lighting device 100 can be realized, and the opening of each power supply unit can be easily opened with respect to the hole provided in the ceiling surface 4. It has a structure where the surfaces are matched and easy to install.

LEDランプ本体1の前記凹部21−2の段部近傍の筐体21の上面21−1に、LEDランプ本体2の中心方向に向けて延出する台形の回動係止片21−7が複数形成されている。該回動係止片21−7は、連結板1の回動係止片挿入開口14−1に挿入可能な大きさに形成されている。回動係止片21−7は、前記連結板1の回動係止片挿入開口14−1に挿入され、筐体21の上面21−1と連結板1の一端面側(下面側)が接合された後に回動され、係止舌片14−2の上面に嵌入される。   A plurality of trapezoidal rotation locking pieces 21-7 extending toward the center of the LED lamp body 2 are provided on the upper surface 21-1 of the casing 21 in the vicinity of the stepped portion of the recess 21-2 of the LED lamp body 1. Is formed. The rotation locking piece 21-7 is formed in a size that can be inserted into the rotation locking piece insertion opening 14-1 of the connecting plate 1. The rotation locking piece 21-7 is inserted into the rotation locking piece insertion opening 14-1 of the connection plate 1, and the upper surface 21-1 of the housing 21 and one end surface side (lower surface side) of the connection plate 1 are arranged. After being joined, it is turned and inserted into the upper surface of the locking tongue piece 14-2.

係止舌片14−2の先端には爪14−3が形成されているので、LEDランプ本体2の装着が完了したことがわかるようになっている。また前述したように、爪14−3によって嵌合後の回動が規制され、不用意に取り外れないようになっているが、連結板1とLEDランプ本体2とを繋ぐ落下防止用チェーンや、回動を規制、解除するロック構造を別途設けてもよい。   Since the claw 14-3 is formed at the tip of the locking tongue piece 14-2, it can be seen that the mounting of the LED lamp body 2 is completed. Further, as described above, the rotation after the fitting is restricted by the claw 14-3 so that it cannot be removed carelessly. However, the fall prevention chain that connects the connecting plate 1 and the LED lamp body 2 A lock structure for restricting and releasing the rotation may be separately provided.

前記速結端子22は、金属板を加工してL字状に形成されたものであり、図16に示すように、一端側に外部電源が差し込まれる速結端子部22−1を備え、他端側に接触子22−2を一体に備えている。速結端子部22−1は電源端子台等に用いられている公知の速結端子と同じ構造であり、外部電源線の芯線が差し込まれる。接触子22−2は、板バネとなっており、基板26の電力入力面に押圧されて接触するものであり、該速結端子22によって、外部電源線3と基板26とが電気的に接続される。   The quick connection terminal 22 is formed in an L shape by processing a metal plate, and includes a quick connection terminal portion 22-1 into which an external power source is inserted at one end as shown in FIG. A contact 22-2 is integrally provided on the end side. The quick connection terminal portion 22-1 has the same structure as a known quick connection terminal used in a power supply terminal block or the like, and a core wire of an external power supply line is inserted therein. The contact 22-2 is a leaf spring that is pressed against and contacts the power input surface of the substrate 26. The external power line 3 and the substrate 26 are electrically connected by the quick connection terminal 22. Is done.

速結端子収納部23は、電気絶縁性の樹脂で形成されたものであり、図17から図19に示すように、T字形状で、外部電源線3が挿入される開口部23−1を備えた中空筒状のT字の縦筒部分23−2の内部に、前記速結端子22の2個の速結端子部22−1が収容され、T字の横枠部分23−3に接触子22−2が収容される。縦筒部分23−2の開口部の形状は長形の矩形状であり、内部中央部に絶縁板23−4が設けられ、筒状の内部に電線挿入孔23−5を有する2つに分割された収容空間23−6が備えられている。2個の速結端子22が収容空間23−6に離されて配置され、また中央部に設けた絶縁板23−4が、開口部23−1まで延出されているので沿面距離が大きく取られており、外部電源線の2本の芯線や、2個の速結端子の間には十分な絶縁性が確保されている。   The quick connection terminal accommodating portion 23 is formed of an electrically insulating resin, and as shown in FIGS. 17 to 19, is T-shaped and has an opening portion 23-1 into which the external power supply line 3 is inserted. The two quick connection terminal portions 22-1 of the quick connection terminal 22 are accommodated in the hollow cylindrical T-shaped vertical cylinder portion 23-2 provided and are in contact with the T-shaped horizontal frame portion 23-3. The child 22-2 is accommodated. The shape of the opening of the vertical cylinder portion 23-2 is a long rectangular shape, and an insulating plate 23-4 is provided at the center of the inside, and is divided into two having an electric wire insertion hole 23-5 inside the cylinder. The accommodation space 23-6 is provided. Two quick connection terminals 22 are arranged apart from the accommodation space 23-6, and the insulating plate 23-4 provided at the center extends to the opening 23-1, so that the creepage distance is large. Therefore, sufficient insulation is ensured between the two core wires of the external power supply line and the two quick connection terminals.

速結端子22を収納した速結端子収納部23は、筐体21の内側から挿入され、T字の縦筒部分23−2が筐体21のLEDランプ位置固定延出部21−4の内部空間に収納され、T字の横枠部分23−3が回動規制突起21−6の内部空間に収納される。   The quick connection terminal storage portion 23 storing the quick connection terminals 22 is inserted from the inside of the housing 21, and the T-shaped vertical cylinder portion 23-2 is inside the LED lamp position fixing extension portion 21-4 of the housing 21. The T-shaped horizontal frame portion 23-3 is stored in the space, and is stored in the internal space of the rotation restricting projection 21-6.

なお本実施形態では、外部電源線の芯線を直接装着する速結端子を用いたが、外部電源線の芯線に外径14mmのプラグを取り付け、LEDランプ本体2の内部に該プラグが挿着されるコネクタを収納してもよい。更に該コネクタの前記プラグ挿着側の他端側に、前述の速結端子22と同様に、基板26の電力入力面に押圧されて接触する接触子を設けてもよい。   In this embodiment, the quick connection terminal for directly attaching the core wire of the external power supply line is used. However, a plug having an outer diameter of 14 mm is attached to the core wire of the external power supply wire, and the plug is inserted into the LED lamp body 2. A connector may be housed. Further, a contact that is pressed against and contacted with the power input surface of the substrate 26 may be provided on the other end side of the connector on the plug insertion side, similarly to the above-described quick connection terminal 22.

また本実施形態では、速結端子22をLEDランプ本体2に収容したが、これに限定されず、連結板1の連結板電力供給部11に速結端子22を取り付けてもよく、更に速結端子部22−1と接触子22−2を分割し、速結端子部22−1を連結板1に取り付け、接触子22−2をLEDランプ本体2に取り付け、連結板1にLEDランプ本体2を装着するときに、速結端子部22−1と接触子22−2が接続され、一体となる速結端子としてもよい。
また、LEDランプ本体2から点灯回路に繋がった電源線を伸ばし、その先端にプラグ/ソケットを取り付け、前記外部電源線のソケット/プラグに挿着してもよい。
Moreover, in this embodiment, although the quick connection terminal 22 was accommodated in the LED lamp main body 2, it is not limited to this, You may attach the quick connection terminal 22 to the connection board electric power supply part 11 of the connection board 1, and also quick connection. The terminal portion 22-1 and the contact 22-2 are divided, the quick connection terminal portion 22-1 is attached to the connecting plate 1, the contact 22-2 is attached to the LED lamp body 2, and the LED lamp body 2 is attached to the connecting plate 1. The quick connection terminal portion 22-1 and the contact 22-2 may be connected to form an integrated quick connection terminal.
Further, a power supply line connected to the lighting circuit may be extended from the LED lamp main body 2, a plug / socket may be attached to the tip of the power supply line, and the power supply line may be inserted into the socket / plug of the external power supply line.

LED素子24としては公知の種々のLEDを用いることができる。本実施形態では、照明用の白色光を発光する高輝度タイプのLED素子が用いられている。また、点灯回路を構成する電子部品25は、過電流保護、ノイズカット、整流、平滑、調光制御などを行うための各種ダイオード、コンデンサー、IC、抵抗などの公知の電子部品である。   Various known LEDs can be used as the LED element 24. In this embodiment, a high-luminance type LED element that emits white light for illumination is used. The electronic component 25 constituting the lighting circuit is a known electronic component such as various diodes, capacitors, ICs, resistors for performing overcurrent protection, noise cut, rectification, smoothing, dimming control, and the like.

前記基板26は、円盤形状の平板で、両面に銅箔が貼られたガラスエポキシ基板であり、片面側にLED素子24と電子部品25とが実装されている。
図22は、基板26の実装面側(表側)であり、基板26の中心部側に円形の実装領域Aが、該実装領域Aの外側に帯状の半円環形状(略3/4周)の実装領域Bが形成されている。実装領域AにLED素子24が実装されており、実装領域Bに電子部品25が実装されている。また実装領域Bの一部には貫通孔26−1が備えられていて、他の電子部品に比べて大きな電解コンデンサーが横向きに設置されている。
The said board | substrate 26 is a glass epoxy board | substrate with which copper foil was affixed on both surfaces, and the LED element 24 and the electronic component 25 are mounted in the single side | surface.
FIG. 22 is the mounting surface side (front side) of the substrate 26, a circular mounting area A on the center side of the substrate 26, and a belt-like semi-annular shape (approximately 3/4 round) outside the mounting area A Mounting region B is formed. The LED element 24 is mounted in the mounting area A, and the electronic component 25 is mounted in the mounting area B. Further, a through hole 26-1 is provided in a part of the mounting region B, and a large electrolytic capacitor is installed sideways as compared with other electronic components.

実装領域Aと実装領域Bの間は、電流が流れる部分を残して前記銅箔が取り除かれ、両側の実装領域よりも熱抵抗が大きい円環状領域C(熱伝導係数の小さな高熱抵抗領域)となっている。円環状領域Cの幅は、基板26の厚みよりも大きく形成されており、LED素子24で発生した熱は、実装領域Bよりも、基板裏面に早く到達する。
なお、円環状領域Cの基板を切り取って貫通したスリットを形成してもよい。これによって更に円環状領域Cの熱抵抗を大きくすることができる。
Between the mounting area A and the mounting area B, the copper foil is removed leaving a portion where current flows, and an annular area C (high thermal resistance area having a small thermal conductivity coefficient) having a higher thermal resistance than the mounting areas on both sides, and It has become. The width of the annular region C is formed larger than the thickness of the substrate 26, and the heat generated in the LED element 24 reaches the substrate back surface earlier than the mounting region B.
In addition, you may form the slit which cut off the board | substrate of the annular | circular shaped area | region C and penetrated. As a result, the thermal resistance of the annular region C can be further increased.

図23は、基板26の裏面側であり、表側の各実装領域に対応した基板裏面に、各実装領域A、Bと略同形状の銅箔が貼られている。筐体21の凹部21−2は、筐体21の裏面方向から見て、内部に円形の凸部(図21に示した21−8)を形成し、その凸部の周囲に円環状の凹部(図21に示した21−9)を形成している。該凸部21−8を形成している筐体21の内壁に、実装領域Aに対応した裏面位置に貼られた銅箔が接触しており、LED素子24で発生した熱は、電子部品25に伝導することなく、基板裏面の銅箔を通って筐体21に伝導し、筐体21の外壁を形成している上面や側面から放熱される。
なお、該接触部に、電気絶縁性の放熱性のグリースを塗布したり、シートを挟んだりすることによって放熱性を更に向上させることもできる。
FIG. 23 is a back surface side of the substrate 26, and a copper foil having substantially the same shape as the mounting regions A and B is attached to the back surface of the substrate corresponding to the mounting regions on the front side. The concave portion 21-2 of the housing 21 is formed with a circular convex portion (21-8 shown in FIG. 21) inside as viewed from the rear surface direction of the housing 21, and an annular concave portion around the convex portion. (21-9 shown in FIG. 21) is formed. The copper foil affixed to the back surface position corresponding to the mounting area A is in contact with the inner wall of the casing 21 forming the convex portion 21-8, and the heat generated in the LED element 24 is generated by the electronic component 25. Without being conducted, the heat is conducted to the housing 21 through the copper foil on the back surface of the substrate, and is radiated from the upper surface and the side surface forming the outer wall of the housing 21.
In addition, heat dissipation can be further improved by applying an electrically insulating heat dissipating grease or sandwiching a sheet to the contact portion.

実装領域Bに対応した裏面位置に貼られた銅箔は、前記円環状の凹部21−9に位置しており、筐体21と直接接触しない。実装領域Bにはスルーホールが形成され一部の電子部品25のリードが基板裏面に出ているが、実装領域Bが該凹部21−9に位置していることで、該リードと金属製の筐体21とは接触せず、ショートが防止されている。   The copper foil affixed to the back surface position corresponding to the mounting region B is located in the annular recess 21-9 and does not directly contact the housing 21. Through holes are formed in the mounting area B, and the leads of some electronic components 25 are exposed on the back surface of the substrate. However, since the mounting area B is located in the recess 21-9, the leads and metal Short circuit is prevented without contact with the casing 21.

実装領域Bと、前記円環状の凹部21−9との間には、電気絶縁性の硬化性の放熱樹脂が充填されていてもよい。これによって、電子部品25で発生した熱は、裏面の銅箔を通って筐体21に伝熱しやすくなっており、電子部品25の温度上昇が抑制される。また放熱樹脂の熱伝導性よりも、アルミニウム製筐体の熱伝導性の方が100倍程度大きいので、LED素子24で発生した熱が、電子部品25に逆流してくることはなく、LED素子4及び電子部品25で発生した熱は筐体21の外壁から効果的に放熱される。
また硬化した樹脂によって、LEDランプ本体2に何らかの衝撃が加えられても、前記リードが筐体21の内壁に接触することがないので、樹脂の充填は信頼性の向上にもつながる。
Between the mounting area | region B and the said annular | circular shaped recessed part 21-9, you may be filled with an electrically insulating curable thermal radiation resin. Thereby, the heat generated in the electronic component 25 is easily transferred to the casing 21 through the copper foil on the back surface, and the temperature rise of the electronic component 25 is suppressed. Further, since the heat conductivity of the aluminum casing is about 100 times larger than the heat conductivity of the heat radiation resin, the heat generated in the LED element 24 does not flow back to the electronic component 25, and the LED element. 4 and the electronic component 25 are effectively radiated from the outer wall of the casing 21.
Moreover, even if some impact is applied to the LED lamp main body 2 by the cured resin, the lead does not contact the inner wall of the housing 21, so that the resin filling also improves the reliability.

更に基板26の裏面には、速結端子22の接触子22−2が接触する電力入力面26−2が設けられている。電力入力面26−2は銅箔であり、実装領域Aに対応した裏面位置に設けられ、また電力入力面26−2から、実装領域Bに電力を供給するための電力供給経路26−3が設けられている。これら電力入力面26−2、電力供給経路26−3は、実装領域Aに対応した裏面位置に設けられた銅箔から分断されており、また該電力供給経路26−3が筐体21の前記凸部内壁に接触しないよう前記凸部21−8の一部に(図示していない)溝が形成されている。電力供給経路26−3は実装領域Bの裏面まで延びており、電力はスルーホールを通って実装領域Bの電力供給部26−4に達する。
なお、前述の電気絶縁性の放熱シートを凸部21−8の表面に備えれば該電力供給経路26−3のための溝を設ける必要がなくなり、位置合わせ等の必要もなくなって製造上好ましい。
Further, on the back surface of the substrate 26, a power input surface 26-2 that contacts the contact 22-2 of the quick connection terminal 22 is provided. The power input surface 26-2 is a copper foil, is provided at a back surface position corresponding to the mounting region A, and a power supply path 26-3 for supplying power to the mounting region B from the power input surface 26-2. Is provided. The power input surface 26-2 and the power supply path 26-3 are separated from the copper foil provided at the back surface position corresponding to the mounting area A, and the power supply path 26-3 is the above-mentioned of the casing 21. A groove (not shown) is formed in a part of the convex portion 21-8 so as not to contact the inner wall of the convex portion. The power supply path 26-3 extends to the back surface of the mounting region B, and the power reaches the power supply unit 26-4 in the mounting region B through the through hole.
If the above-described electrically insulating heat radiation sheet is provided on the surface of the convex portion 21-8, it is not necessary to provide a groove for the power supply path 26-3, and there is no need for alignment, which is preferable in manufacturing. .

一方、基板26の銅箔の形状を図24、図25に示したように形成し、実装領域Aの銅箔の面積を増やし、それらに全面接触する形状の凸部を筐体21の上面21−1に設けてもよい。これによって、LED素子24の温度上昇が更に抑制される。
また、速結端子収納部23のT字の横枠部分23−3と接触子22−2を長く伸ばし、電力入力面26−2を実装領域Bに対応した裏面位置に設けてもよい。
On the other hand, the shape of the copper foil of the substrate 26 is formed as shown in FIG. 24 and FIG. -1 may be provided. Thereby, the temperature rise of the LED element 24 is further suppressed.
Further, the T-shaped horizontal frame portion 23-3 and the contact 22-2 of the quick-connection terminal accommodating portion 23 may be elongated and the power input surface 26-2 may be provided at the back surface position corresponding to the mounting region B.

なお、本実施形態では、実装領域AにLED素子24を実装し、実装領域Bに電子部品25を実装したが、これとは逆に実装領域Aに電子部品25を実装し、実装領域BにLED素子24を実装してもよい。これに応じて筐体21の上面21−1の内壁は、中央部が円形の凹部で、その周囲が円環状の凸部に形成される。
またLED素子実装基板と、点灯回路用基板を別体の基板として、LED素子の光軸上に点灯回路用基板を配置しない範囲で、両方の基板が略同一平面に位置するように配設してLEDランプ本体を扁平にすることもできる。
In the present embodiment, the LED element 24 is mounted in the mounting area A and the electronic component 25 is mounted in the mounting area B. On the contrary, the electronic component 25 is mounted in the mounting area A and the mounting area B is mounted. The LED element 24 may be mounted. Accordingly, the inner wall of the upper surface 21-1 of the housing 21 is formed with a circular concave portion at the center and an annular convex portion around it.
In addition, the LED element mounting board and the lighting circuit board are separated from each other, and the lighting circuit board is not disposed on the optical axis of the LED element so that both boards are positioned on substantially the same plane. The LED lamp body can be made flat.

このように、本発明のLEDランプ本体の構造と基板構造とによって、扁平でありながらも各LED素子や点灯回路を構成する電子部品の温度上昇が抑えられた、寿命の長いLED照明装置を提供することができる。   In this way, the LED lamp main body and the substrate structure of the present invention provide a long-life LED lighting device that is flat but suppresses the temperature rise of the electronic components constituting each LED element and lighting circuit. can do.

前記遮蔽板27は、酸化チタンを含有した光を透過しないポリカーボネート樹脂を用いて、両端部が開口した朝顔型の曲面形状であって中空円筒に成型されている。開口した一端面(上端面)の周縁から内側に拡径状のリング部27−1が設けられている。リング部27−1の上端面は、基板26の実装領域Aと実装領域Bとの間の前記円環状領域Cに接合され、筐体21の上面21−1との間に基板26を挟持して、該上面21−1にネジ止めされている(図13)。
遮蔽板27の開口した他端面(下端面)は、外側に大きく拡大した鍔部27−2が形成されている。該鍔部27−2は、外側から電子部品25が見えないように、実装領域Bを覆い隠し、その鍔部27−2の最端部は筐体21の内周に接している(図13、図28)。
なお、遮蔽板27の内壁面27−3は鏡面加工された拡散反射面を形成しており、LED素子24の出射光を吸収することなく反射し、LEDランプ2から光をロスすることなく出射させる機能を有している。
The shielding plate 27 is made of a morning glory-shaped curved surface having both ends opened using a polycarbonate resin containing titanium oxide and not transmitting light, and is formed into a hollow cylinder. A ring portion 27-1 having an enlarged diameter is provided on the inner side from the periphery of the opened one end surface (upper end surface). The upper end surface of the ring portion 27-1 is joined to the annular region C between the mounting region A and the mounting region B of the substrate 26, and the substrate 26 is sandwiched between the upper surface 21-1 of the housing 21. The upper surface 21-1 is screwed (FIG. 13).
The other end surface (lower end surface) where the shielding plate 27 is opened is formed with a flange portion 27-2 that is greatly enlarged outward. The flange portion 27-2 covers and hides the mounting region B so that the electronic component 25 cannot be seen from the outside, and the outermost end portion of the flange portion 27-2 is in contact with the inner periphery of the housing 21 (FIG. 13). , FIG. 28).
The inner wall surface 27-3 of the shielding plate 27 forms a mirror-diffused diffuse reflection surface, which reflects the light emitted from the LED element 24 without absorbing it and emits the light from the LED lamp 2 without losing light. It has a function to make it.

前記透光性カバー28は、ポリカーボネートを使用して、円形のドーム形状に成型されている。図28に示すように該透光性カバー28の端部に延出部28−1が、光照射方向の逆側に向けて設けられており、遮蔽板27の鍔部27−2の縁部と、筐体21の内壁とに接触して固定されている。   The translucent cover 28 is molded into a circular dome shape using polycarbonate. As shown in FIG. 28, an extended portion 28-1 is provided at the end of the translucent cover 28 toward the opposite side of the light irradiation direction, and the edge of the flange portion 27-2 of the shielding plate 27. And is fixed in contact with the inner wall of the housing 21.

延出部28−1によって、遮蔽板27との間に空間ができており、透光性カバー28で反射された光が、遮蔽板27の内壁面27−3で拡散反射され、これが繰り返されて、透光性カバー28の端部側まで光が達する。これによって遮蔽板27を覆っている部分も含め、透光性カバー28の全面が光ることができている。   A space is formed between the extending portion 28-1 and the shielding plate 27, and the light reflected by the translucent cover 28 is diffusely reflected by the inner wall surface 27-3 of the shielding plate 27, and this is repeated. Thus, the light reaches the end side of the translucent cover 28. As a result, the entire surface of the translucent cover 28 including the portion covering the shielding plate 27 can be illuminated.

また遮蔽板27と透光性カバー28との間に、アクリル製の円環形状の導光板29を挿入してもよい。図28に示すように前記導光板29の内周側端面が光導入面29−1を形成し、遮蔽板側に位置する面が光出射面29−2となっており、散乱光が透光性カバーに向けて出射される。これによって、更に遮蔽板27を覆っている部分からの照射光を増やせ、透光性カバーをより均一に光らせることができる。
なお実装領域BにLED素子24が実装されるような、基板26の外周側にLED素子が配置されるときは、円盤状の導光板の外周側に光導入面が設けられ、円盤状の全面を光出射面とした導光板が、遮蔽板27と透光性カバー28との間に設置されることで、透光性カバー全体が均一に発光するLED照明装置100が得られる。
Further, an acrylic annular light guide plate 29 may be inserted between the shielding plate 27 and the translucent cover 28. As shown in FIG. 28, the inner peripheral side end surface of the light guide plate 29 forms a light introducing surface 29-1, and the surface located on the shielding plate side is a light emitting surface 29-2, and the scattered light is transmitted through. It is emitted toward the sex cover. Thereby, the irradiation light from the part which covers the shielding board 27 can be increased further, and a translucent cover can be made to shine more uniformly.
When the LED element is arranged on the outer peripheral side of the substrate 26 such that the LED element 24 is mounted in the mounting region B, a light introduction surface is provided on the outer peripheral side of the disc-shaped light guide plate, and the disc-shaped entire surface is provided. By installing the light guide plate with the light exit surface between the shielding plate 27 and the translucent cover 28, the LED illumination device 100 in which the entire translucent cover emits light uniformly is obtained.

このように、遮蔽板27や導光板29を備えることによって、明るさムラのないLED照明装置を提供することができる。   Thus, by providing the shielding plate 27 and the light guide plate 29, it is possible to provide an LED illumination device without uneven brightness.

本実施形態のLED照明装置100は、以下のように被取り付け面である天井面4や壁等に取り付けられる。
まず、天井面4に直径15mmの通孔4aを開けて、該通孔4aから外部電源線3を引き出す。次に、連結板1の連結板位置固定延出部12を、前記通孔4aに挿入すると同時に連結板電力供給部11から、外部電源線3を引き出し、連結板1を天井面4にネジ止めする。その後、外部電源線の2本の芯線を、LEDランプ本体2の速結端子収納部23の開口部23−1から挿入し、速結端子部22−1に挿着する。
The LED lighting device 100 of this embodiment is attached to the ceiling surface 4 or a wall, which is a surface to be attached, as follows.
First, a through hole 4a having a diameter of 15 mm is formed in the ceiling surface 4, and the external power supply line 3 is pulled out from the through hole 4a. Next, the connecting plate position fixing extension portion 12 of the connecting plate 1 is inserted into the through hole 4a, and at the same time, the external power line 3 is pulled out from the connecting plate power supply portion 11, and the connecting plate 1 is screwed to the ceiling surface 4. To do. Thereafter, the two core wires of the external power supply line are inserted from the opening 23-1 of the quick connection terminal storage portion 23 of the LED lamp body 2, and are inserted into the quick connection terminal portion 22-1.

次に、連結板1にLEDランプ本体2を装着する。すなわち、LEDランプ本体2の位置固定延出部21−4を連結板1の位置固定延出部12に挿入するとともに、LEDランプ本体2の係合溝21−5が連結板位置固定延出部12と係合し、LEDランプ本体2の回動係止片21−7が連結板1の回動係合部14と係合するようにする。
最後に、LEDランプ本体2の上面21−1を連結板1に密着するように接合し、LEDランプ本体2を上述した回動規制範囲内で所定角度回動させる。これにより、LEDランプ本体2の回動係止片21−7が連結板1の係止舌片14−2と係合し、回動連結板1にLEDランプ本体2が装着される。
Next, the LED lamp body 2 is mounted on the connecting plate 1. That is, the position fixing extension portion 21-4 of the LED lamp body 2 is inserted into the position fixing extension portion 12 of the connecting plate 1, and the engaging groove 21-5 of the LED lamp body 2 is connected to the connecting plate position fixing extension portion. 12, and the rotation locking piece 21-7 of the LED lamp main body 2 is engaged with the rotation engagement portion 14 of the connecting plate 1.
Finally, the upper surface 21-1 of the LED lamp body 2 is joined so as to be in close contact with the connecting plate 1, and the LED lamp body 2 is rotated by a predetermined angle within the above-described rotation restriction range. Thereby, the rotation locking piece 21-7 of the LED lamp body 2 is engaged with the locking tongue piece 14-2 of the connection plate 1, and the LED lamp body 2 is mounted on the rotation connection plate 1.

以上のように、本実施形態では、連結板1は1枚の板であり、LEDランプ本体2の筐体21は、扁平な円筒形状であり、被照射面側に近い側から順番に、透光性カバー28と、遮蔽板27と、基板26と、筐体上面側21−1の内壁に形成された凸部21−8と、連結板1とが、これら各部材の回転軸線とLED素子24の光軸とが略平行となるように配置されている。これらによってLED照明装置100は、天井面4からの突出量が少なく、良好な意匠性を示している。
なお本実施形態では筐体21の形状を円筒形にしたが、これに限定されず断面が4角形等からなる扁平な多角柱であってもよい。
As described above, in the present embodiment, the connecting plate 1 is a single plate, and the housing 21 of the LED lamp main body 2 has a flat cylindrical shape, and sequentially penetrates from the side closer to the irradiated surface side. The optical cover 28, the shielding plate 27, the substrate 26, the convex portion 21-8 formed on the inner wall of the housing upper surface side 21-1, and the connecting plate 1, the rotation axis of each of these members and the LED element The 24 optical axes are arranged so as to be substantially parallel. Thus, the LED lighting device 100 has a small amount of protrusion from the ceiling surface 4 and exhibits a good design.
In the present embodiment, the casing 21 has a cylindrical shape, but is not limited thereto, and may be a flat polygonal column having a quadrangular cross section.

1:連結板
11:連結板電力供給開口部
12:連結板位置固定延出部
13:回動規制孔部
14:回動係合部
2:LEDランプ本体
21:筐体
22:速結端子
23:速結端子収納部
24:LED素子
25:電子部品
26:基板
27:遮蔽板
28:透光性カバー
29:導光板
3: 外部電源線
4: 天井面
100:LED照明装置
1: Connection plate 11: Connection plate power supply opening 12: Connection plate position fixed extension 13: Rotation restricting hole 14: Rotation engagement portion 2: LED lamp body 21: Housing 22: Fast connection terminal 23 : Quick connection terminal storage unit 24: LED element 25: Electronic component 26: Substrate 27: Shielding plate 28: Translucent cover 29: Light guide plate 3: External power supply line 4: Ceiling surface 100: LED lighting device

Claims (7)

LED素子が実装されたLED基板と、前記LED素子を点灯駆動するための点灯回路を構成する電子部品が実装された点灯回路基板を筐体に収納するLEDランプ本体と、
被取付部に固定され、前記LEDランプに着脱自在に装着することができる連結板と、を備え、
前記連結板は、一枚の板金を成形加工したものであり、かつ、前記被取付部に形成された外部電源電線の通孔から引き出された外部電源線を挿通する電力供給開口部を有しており、
前記連結板と前記LEDランプ本体は、前記LEDランプ本体を前記連結板に対して回動して止着する係止手段により着脱自在に装着され、
前記筐体は熱伝導性を有しており、
前記LED素子が実装される領域の基板が、前記筐体の内壁の少なくとも一部に接触していることを特徴とするLED照明装置。
An LED lamp body on which an LED element is mounted; and an LED lamp body that houses a lighting circuit board on which an electronic component that constitutes a lighting circuit for driving the LED element is mounted;
A connecting plate fixed to the attached portion and detachably attached to the LED lamp,
The connecting plate is formed by processing a single sheet metal and has a power supply opening through which an external power supply line drawn out from a through hole of an external power supply wire formed in the attached portion is inserted. And
The connecting plate and the LED lamp body are detachably mounted by a locking means for rotating and fixing the LED lamp body with respect to the connecting plate,
The housing has thermal conductivity,
The LED lighting device, wherein a substrate in a region where the LED element is mounted is in contact with at least a part of an inner wall of the housing.
前記連結板は、前記LEDランプ本体に装着した状態で、前記LEDランプ本体の上面外周縁部に収まるものであることを特徴とする請求項1に記載のLED照明装置。The LED lighting device according to claim 1, wherein the connection plate is fitted on the outer peripheral edge of the upper surface of the LED lamp body in a state of being mounted on the LED lamp body. 前記筐体の前記基板の収納側に凸部を形成し、該凸部に前記LED素子が実装される領域の基板が接触することを特徴とする請求項1又は請求項2に記載のLED照明装置。 The LED illumination according to claim 1 , wherein a convex portion is formed on the housing side of the substrate of the housing, and the substrate in a region where the LED element is mounted is in contact with the convex portion. apparatus. 前記LED素子と前記点灯回路を構成する電子部品とが、同一の基板上に実装されており、前記LED素子が実装される領域の裏面部が前記筐体の凸部に接触しており、前記点灯回路を構成する電子部品が実装される領域の基板の裏面が、前記LEDランプ本体の筐体の内壁から離間していることを特徴とする請求項1〜請求項3のいずれかに記載のLED照明装置。 An electronic part constituting the lighting circuit and the LED elements are mounted on the same substrate, the back surface portion of a region where the LED element is mounted is in contact with the convex portion of the housing, wherein The back surface of the board | substrate of the area | region where the electronic component which comprises a lighting circuit is mounted is spaced apart from the inner wall of the housing | casing of the said LED lamp main body, The Claim 1 characterized by the above-mentioned. LED lighting device. 前記基板の裏面部に、前記LED素子の実装領域と前記点灯回路を構成する電子部品の実装領域に対応して放熱面が形成されており、前記LED素子が実装される領域の放熱面が前記筐体の凸部に接触していることを特徴とする請求項4に記載のLED照明装置。 A heat radiating surface is formed on the back surface portion of the substrate corresponding to a mounting region of the LED element and a mounting region of an electronic component constituting the lighting circuit, and the heat radiating surface of the region where the LED element is mounted The LED lighting device according to claim 4 , wherein the LED lighting device is in contact with a convex portion of the housing. 前記点灯回路を構成する電子部品が実装される領域の基板の裏面と、前記LEDランプ本体の筐体の内壁とが離間して形成される空間に、電気絶縁性の放熱樹脂または放熱シートが備えられていることを特徴とする請求項4又は請求項5に記載のLED照明装置。 An electrically insulating heat-dissipating resin or heat-dissipating sheet is provided in a space formed by separating the back surface of the substrate in the region where the electronic components constituting the lighting circuit are mounted and the inner wall of the housing of the LED lamp body. The LED illumination device according to claim 4 or 5, wherein the LED illumination device is provided. 前記連結板は熱伝導性材料であることを特徴とする請求項1〜請求項6のいずれかに記載のLED照明装置。   The LED lighting device according to claim 1, wherein the connecting plate is a heat conductive material.
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