JP2014112470A - Led lighting device - Google Patents
Led lighting device Download PDFInfo
- Publication number
- JP2014112470A JP2014112470A JP2012265887A JP2012265887A JP2014112470A JP 2014112470 A JP2014112470 A JP 2014112470A JP 2012265887 A JP2012265887 A JP 2012265887A JP 2012265887 A JP2012265887 A JP 2012265887A JP 2014112470 A JP2014112470 A JP 2014112470A
- Authority
- JP
- Japan
- Prior art keywords
- led
- led lamp
- lighting device
- substrate
- connecting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 238000005286 illumination Methods 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- 238000005304 joining Methods 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 11
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 238000003860 storage Methods 0.000 description 7
- 210000000078 claw Anatomy 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
本発明は、LED素子を光源に使用したLED照明装置に関し、特に天井に直接取り付ける天井直付け型のLED照明装置に関するものである。 The present invention relates to an LED lighting device using an LED element as a light source, and more particularly to a ceiling-mounted LED lighting device directly attached to a ceiling.
近年、環境意識の高まりから、省電力化に優れたLED素子を光源に使用した、電源内蔵型の電球型LEDランプが普及してきた。更に最近は、天井埋め込み型のダウンライトや、天井直付け型のシーリングライトにおいても、LED素子を使用した照明装置が開発され、市場に導入されてきている。
天井埋め込み型のダウンライトは、天井面に大きな孔をあけるものであり、その孔あけ作業や、また孔部の補強が必要であり、施工時に手間がかかるものである。そこで、大きな孔をあけることのない照明装置が検討されている(特許文献1、2)。
また天井直付けシーリングライトは、天井面に取り付けられた引掛シーリングボディに、引掛シーリングアダプタを取り付けた照明装置を装着するものであり、特に最近は厚みの薄いシーリングライトも検討されている(特許文献3)。
2. Description of the Related Art In recent years, due to an increase in environmental awareness, a self-powered light bulb type LED lamp using an LED element excellent in power saving as a light source has been widespread. More recently, lighting devices using LED elements have also been developed and introduced into the market for ceiling-mounted downlights and ceiling-mounted ceiling lights.
The ceiling-embedded downlight is for making a large hole in the ceiling surface, and it is necessary to reinforce the hole and reinforce the hole, which takes time during construction. Then, the illuminating device which does not open a big hole is examined (patent document 1, 2).
In addition, the ceiling-mounted ceiling light is a device in which a lighting device having a hook ceiling adapter is attached to a hook ceiling body attached to the ceiling surface. Recently, a ceiling light with a small thickness has been studied (patent document). 3).
例えば特許文献1に記載されている照明装置は、給電部、LED、LEDと同一平面上にある点灯装置とが取り付けられたベース板が取付ネジにより天井面に直接ネジ止めされるもので、天井面には円筒形状の給電部が挿入される挿入孔が形成されていて、挿入孔に挿入された給電部に対して、電力供給用の電源線が接続される。それによって天井面に大きな孔をあけることなく天井面に直接取り付けることができる照明装置が提供される。
また特許文献2に記載されている照明装置は、光源及び当該光源に電源を供給する電源ブロックが内部に収納され、天井面に取り付けられる器具本体内部に、外部電線が電気的に接続される速結端子を備えたものであり、薄型化を図りつつ施工性を向上させた照明器具が提供される。
For example, in the illumination device described in Patent Document 1, a base plate to which a power feeding unit, an LED, and a lighting device on the same plane as the LED are attached is directly screwed to a ceiling surface with an attachment screw. An insertion hole into which a cylindrical power feeding part is inserted is formed on the surface, and a power supply power line is connected to the power feeding part inserted into the insertion hole. Accordingly, an illumination device that can be directly attached to the ceiling surface without providing a large hole in the ceiling surface is provided.
In addition, the lighting device described in Patent Document 2 includes a light source and a power block that supplies power to the light source, and a speed at which an external electric wire is electrically connected to the interior of the fixture body attached to the ceiling surface. Provided is a lighting fixture that includes a connection terminal and has improved workability while being thin.
特許文献3に記載されている照明装置は、照明モジュールと、照明モジュールに電力を供給する電源部と、照明モジュール及び電源部を保持するシャーシと、シャーシを引掛シーリングボディに取り付ける引掛シーリングアダプタとを備え、照明モジュール、電源部及び引掛シーリングアダプタは、夫々が引掛シーリングボディに対して互いに重なり合わないようにシャーシに配されている。それによって引掛シーリングボディからの照明モジュール、電源部及び引掛シーリングアダプタの突設高さを低減することができ、薄型化を図った照明装置が提供される。 The illumination device described in Patent Document 3 includes an illumination module, a power supply unit that supplies power to the illumination module, a chassis that holds the illumination module and the power supply unit, and a hooking ceiling adapter that attaches the chassis to the hooking ceiling body. The lighting module, the power supply unit, and the hooking ceiling adapter are arranged on the chassis so as not to overlap each other with respect to the hooking sealing body. As a result, the protruding heights of the lighting module, the power supply unit, and the hooking ceiling adapter from the hooking ceiling body can be reduced, and a lighting device that is reduced in thickness is provided.
しかしながら、特許文献1や2に記載されている照明装置においては、照明装置本体から透光性カバーを取り外し、照明装置本体のベース部を天井面にネジ止めし、再度透光性カバーを取り付ける構造であり、取り付け時にLED素子を傷つける虞があり、また簡単に照明装置を取り付けられるものではない。
また、特許文献3に記載されている照明装置においては、引掛シーリングボディの厚みと引掛シーリングアダプタの厚みを加えた厚みよりも、天井面から照明装置下面までの高さを薄くすることができない照明装置となっている。
However, in the illuminating device described in Patent Documents 1 and 2, the translucent cover is removed from the illuminating device body, the base portion of the illuminating device body is screwed to the ceiling surface, and the translucent cover is attached again. There is a possibility that the LED element may be damaged at the time of attachment, and the lighting device cannot be easily attached.
Moreover, in the illuminating device described in Patent Document 3, the height from the ceiling surface to the illuminating device lower surface cannot be made thinner than the thickness obtained by adding the thickness of the hooking ceiling body and the thickness of the hooking ceiling adapter. It is a device.
本発明は、以上のような課題を解決するため鋭意検討した結果なされたものであり、薄く扁平でありながらも、LED素子、電子部品の熱劣化が抑制され、天井面に簡単に取り付けられるLED照明装置を提供するものである。 The present invention has been made as a result of intensive studies to solve the above-described problems, and is an LED that can be easily mounted on a ceiling surface while suppressing thermal deterioration of the LED elements and electronic components while being thin and flat. An illumination device is provided.
請求項1に記載の発明にあたっては、LED素子が実装されたLED基板と、前記LED素子を点灯駆動するための点灯回路を構成する電子部品が実装された点灯回路基板を有するLEDランプ本体と、前記LEDランプ本体が取り付けられる連結板とを備えたLED照明装置において、天井等の被取付部に、前記連結板の一面が、固定手段によって取り付けられ、前記連結板の他面に、前記LEDランプ本体が着脱自在に取り付けられることを特徴とするものである。 In the invention according to claim 1, an LED lamp body having an LED board on which an LED element is mounted, and a lighting circuit board on which an electronic component that constitutes a lighting circuit for driving the LED element is mounted, In an LED lighting device including a connecting plate to which the LED lamp body is attached, one surface of the connecting plate is attached to a mounting portion such as a ceiling by a fixing means, and the LED lamp is attached to the other surface of the connecting plate. The main body is detachably attached.
請求項2に記載の発明にあたっては、前記LEDランプ本体及び前記連結板には、それぞれ電力供給開口部が形成されており、これら電力供給開口部が重なるように、前記連結板に、前記LEDランプ本体が取り付けられ、これら電力供給開口部を通して前記LEDランプ本体に、外部電源からの電力が供給されることを特徴とするものである。 According to a second aspect of the present invention, the LED lamp main body and the connecting plate are each formed with a power supply opening, and the LED lamp is mounted on the connecting plate so that these power supply openings overlap. A main body is attached, and power from an external power source is supplied to the LED lamp main body through these power supply openings.
請求項3に記載の発明にあたっては、前記LEDランプ本体の上面に回動係止部が形成され、前記連結板の下面に前記回動係止部を係合する回動係合部が形成されていることを特徴とするものである。 According to a third aspect of the present invention, a rotation engagement portion is formed on the upper surface of the LED lamp body, and a rotation engagement portion that engages the rotation engagement portion is formed on the lower surface of the connecting plate. It is characterized by that.
請求項4に記載の発明にあたっては、前記LEDランプ本体の上面の中央に凹部が設けられ、前記LEDランプの中心方向に向けて、前記凹部の底面から離間して延出する回動係止片が形成され、前記連結板下面で前記回動係止片と対応する位置に、該回動係止片と回動係合する係止舌片が設けられ、前記LEDランプ本体の上面と、前記連結板の下面を接合し、前記LEDランプを回動することによって、前記係止舌片の上面に前記回動係止片が係入されることを特徴とするものである。 According to a fourth aspect of the present invention, there is provided a recess in the center of the upper surface of the LED lamp body, and a rotation locking piece that extends away from the bottom surface of the recess toward the center of the LED lamp. Is formed at a position corresponding to the rotation locking piece on the lower surface of the connecting plate, and an upper surface of the LED lamp body, The rotation locking piece is engaged with the upper surface of the locking tongue piece by joining the lower surface of the connecting plate and rotating the LED lamp.
請求項5に記載の発明にあたっては、前記LEDランプ電力供給開口部の周縁部に、前記連結板に向かって延出するLEDランプ位置固定延出部が形成され、前記連結板電力供給開口部の周縁部に、前記被取付部に向かって延出する連結板位置固定延出部が形成され、前記LEDランプ位置固定延出部に、前記連結板位置固定延出部が係合する係合溝が形成されていることを特徴とするものである。 In invention of Claim 5, the LED lamp position fixed extension part extended toward the said connection board is formed in the peripheral part of the said LED lamp power supply opening part, An engagement groove in which a connecting plate position fixing extension portion extending toward the attached portion is formed in a peripheral portion, and the connecting plate position fixing extension portion engages with the LED lamp position fixing extension portion. Is formed.
請求項6に記載の発明にあたっては、前記係合溝の幅は、前記LEDランプ本体の一面と、前記連結板の一面が接合したときに、前記LEDランプ本体が、前記連結板に対して所定角度回動可能となるように、前記連結板位置固定延出部の幅よりも大きく形成されていることを特徴とするものである。 In the invention of claim 6, the width of the engagement groove is set such that the LED lamp body has a predetermined width relative to the connection plate when one surface of the LED lamp body and one surface of the connection plate are joined. The connecting plate position fixing extension portion is formed to be larger than the width of the connecting plate position fixing extension portion so that the angle can be rotated.
請求項7に記載の発明にあたっては、前記LEDランプ本体の上面に、回動規制突起が形成され、前記連結板に前記回動規制突起が嵌入する回動規制孔部が形成され、前記LEDランプ本体の上面と、前記連結板の下面を接合したときに、前記回動規制突部と、前記回動規制孔部との間に形成される間隙によって、前記LEDランプ本体の回動範囲を規制することを特徴とするものである。 In the invention according to claim 7, a rotation restricting projection is formed on the upper surface of the LED lamp body, and a rotation restricting hole portion into which the rotation restricting projection is fitted is formed in the connecting plate, and the LED lamp When the upper surface of the main body and the lower surface of the connecting plate are joined, the rotation range of the LED lamp main body is restricted by a gap formed between the rotation restriction protrusion and the rotation restriction hole. It is characterized by doing.
請求項8に記載の発明にあたっては、前記連結板が、熱伝導性材料を使用して形成されていることを特徴とするものである。 The invention according to claim 8 is characterized in that the connecting plate is formed using a heat conductive material.
請求項9に記載の発明にあたっては、前記LEDランプ本体の筐体が、熱伝導性材料を使用して成形されていることを特徴とするものである。 The invention according to claim 9 is characterized in that the casing of the LED lamp main body is formed using a heat conductive material.
請求項10に記載の発明にあたっては、前記LEDランプ本体には、前記LEDランプ電力供給開口部から挿入される外部電線が接続される速結端子が収納されていることを特徴とするものである。 The invention according to claim 10 is characterized in that the LED lamp main body contains a quick connection terminal to which an external electric wire inserted from the LED lamp power supply opening is connected. .
請求項11に記載の発明にあたっては、前記速結端子は、電気絶縁性の速結端子収納部に収納され、該速結端子収納部が前記LEDランプ電力供給開口部に収納されていることを特徴とするものである。 In the invention of claim 11, the quick connection terminal is housed in an electrically insulating fast connection terminal housing portion, and the quick connection terminal housing portion is housed in the LED lamp power supply opening. It is a feature.
請求項12に記載の発明にあたっては、前記LEDランプ本体には、前記速結端子に代えて、先端にプラグが設けられた外部電線が接続されるコネクタが収納されていることを特徴とするものである。 The invention according to claim 12 is characterized in that the LED lamp main body contains a connector to which an external electric wire provided with a plug at the tip is connected instead of the quick-connect terminal. It is.
請求項13に記載の発明にあたっては、前記速結端子に代えて、前記LEDランプ電力供給開口部から外部に導出されている電線の先端にプラグを設け、該プラグと外部電線のプラグを接続したことを特徴とするものである。 In the invention according to claim 13, instead of the quick connection terminal, a plug is provided at the tip of the electric wire led out from the LED lamp power supply opening, and the plug and the plug of the external electric wire are connected. It is characterized by this.
請求項14に記載の発明にあたっては、前記LED基板と、前記点灯回路基板とが、同一平面上に配置されていることを特徴とするものである。 In the invention described in claim 14, the LED substrate and the lighting circuit substrate are arranged on the same plane.
請求項15に記載の発明にあたっては、前記LED素子と、前記点灯回路を構成する電子部品とが、同一の基板上に実装されていることを特徴とするものである。 The invention according to claim 15 is characterized in that the LED element and the electronic components constituting the lighting circuit are mounted on the same substrate.
請求項16に記載の発明にあたっては、前記基板は、前記基板の中心側に位置する実装領域Aと、前記基板の外周側に位置する実装領域Bとを有しており、前記LED素子と前記点灯回路を構成する電子部品は、前記実装領域Aと実装領域Bに区分して実装されていることを特徴とするものである。 In the invention described in claim 16, the substrate has a mounting region A located on the center side of the substrate and a mounting region B located on the outer peripheral side of the substrate, and the LED element and the The electronic components that make up the lighting circuit are divided into the mounting area A and the mounting area B and are mounted.
請求項17に記載の発明にあたっては、前記基板は略円形の基板からなり、前記実装領域Aは、前記基板の中心と同一な中心を有する円からなり、前記基板の中央部に配置され、前記実装領域Bは、前記実装領域Aの外周の少なくとも一部と近接する帯形状からなり、前記基板の外周側に位置していることを特徴とするものである。 In the invention described in claim 17, the substrate is formed of a substantially circular substrate, and the mounting region A is formed of a circle having the same center as the center of the substrate, and is disposed in a central portion of the substrate. The mounting area B has a band shape close to at least a part of the outer periphery of the mounting area A, and is located on the outer peripheral side of the substrate.
請求項18に記載の発明にあたっては、前記LED素子が前記実装領域Aに実装され、前記点灯回路を構成する電子部品が前記実装領域Bに実装されていることを特徴とするものである。 The invention according to claim 18 is characterized in that the LED element is mounted in the mounting area A and the electronic components constituting the lighting circuit are mounted in the mounting area B.
請求項19に記載の発明にあたっては、前記点灯回路を構成する電子部品が前記実装領域Aに実装され、前記LED素子が前記実装領域Bに実装されていることを特徴とするものである。 The invention according to claim 19 is characterized in that an electronic component constituting the lighting circuit is mounted in the mounting area A, and the LED element is mounted in the mounting area B.
請求項20に記載の発明にあたっては、前記基板に、前記実装領域A及び前記実装領域Bよりも熱伝導係数の小さな高熱抵抗領域が備えられ、前記高熱抵抗領域は、前記実装領域Aと、前記実装領域Bとの間の境界に位置していることを特徴とするものである。 In the invention described in claim 20, the substrate is provided with a high thermal resistance region having a smaller thermal conductivity coefficient than the mounting region A and the mounting region B, and the high thermal resistance region includes the mounting region A and the mounting region A. It is located at the boundary with the mounting area B.
請求項21に記載の発明にあたっては、前記基板には、外部電源から電力が入力される面状の電力入力面が設けられていることを特徴とした特徴とするものである。 The invention according to claim 21 is characterized in that the substrate is provided with a planar power input surface to which power is input from an external power source.
請求項22に記載の発明にあたっては、前記速結端子には、前記電力入力面に押圧接触される、弾性力を有する接触子が設けられていることを特徴とするものである。 The invention according to claim 22 is characterized in that the quick-connection terminal is provided with a contact having an elastic force that is pressed against the power input surface.
請求項23に記載の発明にあたっては、前記LEDランプ本体に収納されるコネクタの一端部には、前記電力入力面に押圧接触される、弾性力を有する接触子が設けられていることを特徴とするものである。 In the invention described in claim 23, the one end portion of the connector housed in the LED lamp main body is provided with a contact member having an elastic force that is pressed against the power input surface. To do.
請求項24に記載の発明にあたっては、前記点灯回路を構成する電子部品が実装される基板の領域の一部に貫通孔が形成され、前記貫通孔に、前記点灯回路を構成する電子部品の一部が配置されていることを特徴とするものである。 According to a twenty-fourth aspect of the present invention, a through hole is formed in a part of a region of a substrate on which the electronic component constituting the lighting circuit is mounted, and one electronic component constituting the lighting circuit is formed in the through hole. The portion is arranged.
請求項25に記載の発明にあたっては、前記LED素子が実装される領域の基板の裏面が、前記LEDランプ本体の筐体の内壁の少なくとも一部に接触していることを特徴とするものである。 In the invention of claim 25, the back surface of the substrate in the region where the LED element is mounted is in contact with at least a part of the inner wall of the housing of the LED lamp body. .
請求項26に記載の発明にあたっては、前記LEDランプ本体の前記基板収納側に凸部を形成し、該凸部に前記基板の一部に接触することを特徴とするものである。 The invention described in claim 26 is characterized in that a convex portion is formed on the substrate housing side of the LED lamp main body, and the convex portion is in contact with a part of the substrate.
請求項27に記載の発明にあたっては、前記凸部に、前記基板のLED素子が実装された領域の裏面部を接触させたことを特徴とするものである。 The invention according to claim 27 is characterized in that a back surface portion of a region where the LED element of the substrate is mounted is brought into contact with the convex portion.
請求項28に記載の発明にあたっては、前記点灯回路を構成する電子部品が実装される領域の基板の裏面が、前記LEDランプ本体の筐体の内壁から離間していることを特徴とするものである。 In the invention described in claim 28, the back surface of the substrate in the region where the electronic components constituting the lighting circuit are mounted is separated from the inner wall of the housing of the LED lamp body. is there.
請求項29に記載の発明にあたっては、前記点灯回路を構成する電子部品が実装される領域の基板の裏面と、前記LEDランプ本体の筐体の内壁とが離間して形成される空間に、電気絶縁性の放熱樹脂または放熱シートが備えられていることを特徴とするものである。 In the invention according to claim 29, in the space formed by separating the back surface of the substrate in the area where the electronic components constituting the lighting circuit are mounted and the inner wall of the housing of the LED lamp body, An insulating heat radiating resin or a heat radiating sheet is provided.
請求項30に記載の発明にあたっては、前記LEDランプ本体には、前記LED素子が実装された側を覆う透光性カバーと、前記点灯回路を構成する電子部品が実装される領域を覆う遮蔽板とが設置されており、前記遮蔽板は、前記基板と前記透光性カバーとの間に配置されていることを特徴とするものである。 In the invention according to claim 30, the LED lamp main body includes a light-transmitting cover that covers a side on which the LED element is mounted, and a shielding plate that covers a region on which the electronic components constituting the lighting circuit are mounted. And the shielding plate is arranged between the substrate and the translucent cover.
請求項31に記載の発明にあたっては、前記遮蔽板は、前記LED素子の出射光を反射する反射面が備えられた曲面形状であって、前記遮蔽板の一端面は、前記基板の実装領域Aと実装領域Bとの境界に位置し、前記遮蔽板の他端面は、前記点灯回路を構成する電子部品が実装される領域を覆うように位置していることを特徴とするものである。 In the invention according to claim 31, the shielding plate has a curved surface shape provided with a reflecting surface for reflecting the emitted light of the LED element, and one end surface of the shielding plate is a mounting area A of the substrate. The other end face of the shielding plate is located so as to cover the area where the electronic components constituting the lighting circuit are mounted.
請求項32に記載の発明にあたっては、前記遮蔽板は、電気絶縁性の材料から成形されていることを特徴とするものである。 The invention according to claim 32 is characterized in that the shielding plate is formed of an electrically insulating material.
請求項33に記載の発明にあたっては、前記透光性カバーの内壁と、前記遮蔽板の前記透光性カバーの内壁と対向する面との間に空間を設けたことを特徴とするものである。 The invention according to claim 33 is characterized in that a space is provided between the inner wall of the translucent cover and the surface of the shielding plate facing the inner wall of the translucent cover. .
請求項34に記載の発明にあたっては、前記遮蔽板の前記透光性カバーの内壁と対向する面を反射面としたことを特徴とするものである。 The invention according to claim 34 is characterized in that a surface of the shielding plate facing the inner wall of the translucent cover is a reflecting surface.
請求項35に記載の発明にあたっては、前記遮蔽板の表面に、LED素子の出射光を受光し、前記透光性カバーの内壁に向けて光出射する導光板が備えられていることを特徴とするものである。 The invention according to claim 35 is characterized in that a light guide plate that receives light emitted from the LED element and emits light toward the inner wall of the translucent cover is provided on the surface of the shielding plate. To do.
請求項36に記載の発明にあたっては、前記導光板は、前記透光性カバーの内壁と、前記遮蔽板の前記透光性カバーの内壁と対向する面との間の空間に配置され、前記導光板の透光性カバーと対向する面が光出射面となることを特徴とするものである。 According to a thirty-sixth aspect of the present invention, the light guide plate is disposed in a space between an inner wall of the translucent cover and a surface of the shielding plate facing the inner wall of the translucent cover, A surface of the light plate that faces the translucent cover is a light emitting surface.
請求項37に記載の発明にあたっては、前記LEDランプの筐体は、扁平な円筒形状または、扁平な多角柱形状であって、被照射面側に近い側から順番に、前記透光性カバーと、前記遮蔽板と、前記基板と、前記筐体上面側の内壁に形成された凸部と、前記連結板とが、前記各部材の回転軸線と前記LED素子の光軸とが略平行となるように配置されていることを特徴とするものである。 In the invention according to claim 37, the casing of the LED lamp has a flat cylindrical shape or a flat polygonal column shape, and in order from the side closer to the irradiated surface side, the translucent cover and The shielding plate, the substrate, the convex portion formed on the inner wall on the upper surface side of the housing, and the connecting plate are such that the rotation axis of each member and the optical axis of the LED element are substantially parallel. It is characterized by being arranged like this.
本発明の連結板とLEDランプ本体との回動係合構造や基板構造によって、天井面へ小さな穴をあけるだけで簡単に取り付けられる施工性が良好な、扁平なLED照明装置を提供することができる。
また本発明のLEDランプ本体の構造と基板構造とによって、扁平でありながらも各LED素子や点灯回路を構成する電子部品の温度上昇が抑えられた、寿命の長いLED照明装置を提供することができる。
更に本発明の遮蔽板や導光板を備えることによって、明るさムラのないLED照明装置を提供することができる。
Provided is a flat LED lighting device with good workability that can be easily attached by simply making a small hole in the ceiling surface by the rotation engagement structure and the substrate structure of the connecting plate and the LED lamp body of the present invention. it can.
In addition, the LED lamp main body and the substrate structure of the present invention provide a long-life LED illuminating device that is flat but suppresses the temperature rise of electronic components that constitute each LED element and lighting circuit. it can.
Furthermore, by providing the shielding plate and the light guide plate of the present invention, an LED illumination device free from uneven brightness can be provided.
以下に本発明の好適な実施の形態について、図面を参照しながら説明する。なお本実施形態は一例であり、これに限定されるものではない。 Preferred embodiments of the present invention will be described below with reference to the drawings. This embodiment is an example, and the present invention is not limited to this.
図1から図4に示したように、本実施形態に係わるLED照明装置100は、連結板1と、LEDランプ本体2とからなり、外部電源線(F−ケーブル)3が出ている直径15mmの孔があいた天井面4に連結板1がネジ止めされ、該連結板1にLEDランプ本体2が着脱自在に装着される。連結板1にLEDランプ本体2が装着されるときに、LEDランプ本体2と外部電源線3とが接続され、LED照明装置100はダウンライトとして使用可能となる。なお直径15mm以下の孔であれば、天井に特別な補強を施すことがないので、施工性良くLED照明装置を取り付けることができる。 As shown in FIGS. 1 to 4, the LED lighting device 100 according to the present embodiment includes a connecting plate 1 and an LED lamp body 2, and a diameter of 15 mm from which an external power line (F-cable) 3 comes out. The connecting plate 1 is screwed to the ceiling surface 4 having the holes, and the LED lamp body 2 is detachably attached to the connecting plate 1. When the LED lamp body 2 is mounted on the connecting plate 1, the LED lamp body 2 and the external power supply line 3 are connected, and the LED lighting device 100 can be used as a downlight. If the hole has a diameter of 15 mm or less, no special reinforcement is applied to the ceiling, so that the LED lighting device can be attached with good workability.
連結板1は、ステンレス板を使用して、打抜加工、プレス加工、折曲加工によって作成される。連結板1は円盤形状で、図5から図9に示すように、中心部に円形の連結板電力供給部11が開口し、また該開口部の縁部から1対の連結板位置固定延出部12と、1対の回動規制孔部13とが形成されている。
連結板位置固定延出部12は、連結板1の回転軸と平行に天井面4側に突出した、連結板1と同一中心を有する直径14mm、外壁厚1mm、高さ15mmの仮想円筒の外壁の一部からなるように、対向する所定の長さの円弧から延出した2つの延出片である。この2つの連結板位置固定延出部12によって、連結板1の孔への位置決めが容易となり、連結板1を簡単に天井面4に取り付けることができる。
更に、連結板位置固定延出部12が設けられていない前記仮想円筒の円弧から、扇型に開口した1対の回動規制孔部13があけられており、連結板電力供給部12と1対の回動規制孔部13とは、連通したリボン型の貫通孔を形成している。
The connecting plate 1 is made by punching, pressing, or bending using a stainless steel plate. As shown in FIGS. 5 to 9, the connecting plate 1 has a circular shape, and a circular connecting plate power supply unit 11 is opened at the center, and a pair of connecting plate positions are fixedly extended from the edge of the opening. A portion 12 and a pair of rotation restricting hole portions 13 are formed.
The connecting plate position fixed extending portion 12 protrudes toward the ceiling surface 4 in parallel with the rotation axis of the connecting plate 1 and has an outer wall of a virtual cylinder having the same center as the connecting plate 1 and a diameter of 14 mm, an outer wall thickness of 1 mm, and a height of 15 mm. These are two extended pieces extended from arcs of a predetermined length facing each other. The two connecting plate position fixing extension portions 12 facilitate positioning of the connecting plate 1 in the hole, and the connecting plate 1 can be easily attached to the ceiling surface 4.
Further, a pair of rotation restricting hole portions 13 opened in a fan shape are opened from the arc of the virtual cylinder where the connecting plate position fixing extension portion 12 is not provided. The pair of rotation restricting hole portions 13 form a ribbon-shaped through hole communicating with the pair.
また連結板1には、LEDランプ本体2と回動係合する回動係合部14が設けられている。回動係合部14は、回動係止片挿入開口14−1と係止舌片14−2とからなる。
回動係止片挿入開口14−1は、略扇形状の開口部で、90度間隔に4箇所設けられている。
係止舌片14−2は、回動係止片挿入開口14−1の開口部よりも小さく、該開口部と相似形に形成されており、連結板1のLEDランプ本体2と接合する面側で、該開口部の半径方向周縁部の一端側に、回動係止片挿入開口14−1を臨むように設置されている。なお係止舌片14−2の先端には、回動係合が外れるのを防止するための爪14−3が形成されている。
The connecting plate 1 is provided with a rotation engaging portion 14 that rotates and engages with the LED lamp body 2. The rotation engaging portion 14 includes a rotation locking piece insertion opening 14-1 and a locking tongue piece 14-2.
The rotation locking piece insertion openings 14-1 are substantially fan-shaped openings, and are provided at four positions at intervals of 90 degrees.
The locking tongue piece 14-2 is smaller than the opening of the rotation locking piece insertion opening 14-1, is formed in a similar shape to the opening, and is a surface that joins the LED lamp body 2 of the connecting plate 1. On the side, it is installed on one end side of the peripheral edge in the radial direction of the opening so as to face the rotation locking piece insertion opening 14-1. A claw 14-3 is formed at the tip of the locking tongue piece 14-2 to prevent the rotational engagement from being released.
LEDランプ本体2は、図10から図14に示すように、筐体21と、筐体21の内部に収納される外部電源線が接続される速結端子22と、速結端子22を収納する速結端子収納部23と、複数のLED素子24と、LED素子24を点灯させる点灯回路を構成する各種電子部品25とが実装された基板26と、電子部品25を覆う遮蔽板27と、筐体21の開口部を覆う透光性カバー28とから概略構成されている。 As shown in FIGS. 10 to 14, the LED lamp main body 2 houses a housing 21, a quick connection terminal 22 to which an external power supply line housed in the housing 21 is connected, and a quick connection terminal 22. A substrate 26 on which a quick-connection terminal accommodating portion 23, a plurality of LED elements 24, and various electronic components 25 constituting a lighting circuit for lighting the LED elements 24 are mounted; a shielding plate 27 that covers the electronic components 25; A transparent cover 28 that covers the opening of the body 21 is schematically configured.
筐体21は、アルミニウムを使用して、一端面が開口した中空の有底円筒で高さの低い扁平な形状に形成されている。
連結板1に接合される筐体21の上面21−1には、連結板1の係止舌片14−2が入り込める、筐体21の内部に向かって円形に凹んだ凹部21−2が形成され、また該上面21−1の外周縁から、連結板1の厚みと同じ高さの延出部が形成されており、LEDランプ本体2を連結板1に装着したときに、一体化する構造となっている。
The casing 21 is made of aluminum and is formed into a flat shape with a low height by a hollow bottomed cylinder having an open end.
On the upper surface 21-1 of the housing 21 joined to the connecting plate 1, a concave portion 21-2 that is recessed in a circular shape toward the inside of the housing 21 is formed so that the locking tongue piece 14-2 of the connecting plate 1 can enter. Further, an extension part having the same height as the thickness of the connecting plate 1 is formed from the outer peripheral edge of the upper surface 21-1, and the LED lamp main body 2 is integrated when the connecting plate 1 is mounted. It has become.
凹部21−2の中心部に、長方形に開口した筒状のLEDランプ電力供給開口部21−3が立設されている。またLEDランプ電力供給開口部21−3の周縁部には、連結板1に向かって延出する、外径が14mmの円筒形状のLEDランプ位置固定延出部21−4が形成されている。
更に、LEDランプ位置固定延出部21−4の外壁には、連結板位置固定延出部12が係合する深さ1mmで、円筒側壁に沿った係合溝21−5が対向して1対形成されている(この実施形態では、筒状のLEDランプ電力供給開口部21−3の肉厚部がLEDランプ位置固定延出部21−4となり、薄肉部が係合溝21−5となっている)。前記凹部21−2の上面部にはLEDランプ位置固定延出部21−4と一体に小片状の回動規制突起21−6が形成されている。なお該回動規制突起21−6の内部は後述する速結端子収納部23を収納するために空洞となっている。
該回動規制突起は、連結板1の回動規制孔部13に挿入され、回動規制孔部13の扇を形成する角度で回動できる角度で、LEDランプ本体2の回動範囲が決定されている。また係合溝21−5の溝幅も、前記回動できる角度に対応して連結板位置固定延出部12の幅よりも広く形成されている。
A cylindrical LED lamp power supply opening 21-3 opened in a rectangular shape is erected at the center of the recess 21-2. Further, a cylindrical LED lamp position fixing extension portion 21-4 having an outer diameter of 14 mm and extending toward the connecting plate 1 is formed at the peripheral edge portion of the LED lamp power supply opening portion 21-3.
Furthermore, the outer wall of the LED lamp position fixing extension portion 21-4 has a depth of 1 mm at which the connecting plate position fixing extension portion 12 engages, and an engagement groove 21-5 along the cylindrical side wall 1 (In this embodiment, the thick portion of the cylindrical LED lamp power supply opening 21-3 is the LED lamp position fixing extension portion 21-4, and the thin portion is the engagement groove 21-5. ) A small piece-like rotation restricting projection 21-6 is formed integrally with the LED lamp position fixing extension 21-4 on the upper surface of the recess 21-2. Note that the inside of the rotation restricting projection 21-6 is hollow to accommodate a quick connection terminal accommodating portion 23 described later.
The rotation restricting projection is inserted into the rotation restricting hole 13 of the connecting plate 1, and the rotation range of the LED lamp body 2 is determined by an angle that can be rotated at an angle that forms a fan of the rotation restricting hole 13. Has been. The groove width of the engaging groove 21-5 is also formed wider than the width of the connecting plate position fixing extension portion 12 corresponding to the pivotable angle.
これら各種部材の構造や寸法によって、連結板位置固定延出部12と、LEDランプ位置固定延出部21−4とが係合したときにできる係合体は、薄さを保った状態で外径14mmの円筒空間に収まる構造となっている。それによって、連結板1を介していても、扁平なLED照明装置100を実現でき、かつ天井面4に設けられた孔に対して、それぞれの電力供給部の開口部がずれることなく簡単に開口面が合わせられ取り付けやすい構造となっている。 Depending on the structure and dimensions of these various members, the engaging body formed when the connecting plate position fixing extension portion 12 and the LED lamp position fixing extension portion 21-4 are engaged with each other has an outer diameter in a thin state. It is structured to fit in a 14 mm cylindrical space. Thereby, even though the connecting plate 1 is interposed, the flat LED lighting device 100 can be realized, and the opening of each power supply unit can be easily opened with respect to the hole provided in the ceiling surface 4. It has a structure where the surfaces are matched and easy to install.
凹部21−2の段部近傍の筐体21の上面21−1に、LEDランプ本体2の中心方向に向けて延出する台形の回動係止片21−7が形成されている。該回動係止片21−7は、連結板1の回動係止片挿入開口14−1に挿入可能な大きさに形成されている。
回動係止片21−7は、回動係止片挿入開口14−1に挿入され、筐体21の上面21−1と連結板1の一端面側が接合された後に回動され、係止舌片14−2の上面に嵌入される。
係止舌片14−2の先端には爪14−3が形成されているので、LEDランプ本体2の装着が完了したことがわかるようになっている。また前述したように、爪14−3によって嵌合後の回動が規制され、不用意に取り外れないようになっているが、連結板1とLEDランプ本体2とを繋ぐ落下防止用チェーンや、回動を規制、解除するロック構造を別途設けてもよい。
A trapezoidal rotation locking piece 21-7 extending toward the center of the LED lamp body 2 is formed on the upper surface 21-1 of the casing 21 in the vicinity of the stepped portion of the recess 21-2. The rotation locking piece 21-7 is formed in a size that can be inserted into the rotation locking piece insertion opening 14-1 of the connecting plate 1.
The rotation locking piece 21-7 is inserted into the rotation locking piece insertion opening 14-1, and rotated after the upper surface 21-1 of the housing 21 and the one end surface side of the connecting plate 1 are joined together. It is inserted in the upper surface of the tongue piece 14-2.
Since the claw 14-3 is formed at the tip of the locking tongue piece 14-2, it can be seen that the mounting of the LED lamp body 2 is completed. Further, as described above, the rotation after the fitting is restricted by the claw 14-3 so that it cannot be removed carelessly. A lock structure for restricting and releasing the rotation may be separately provided.
速結端子22は、金属板を加工してL字状に形成されたものであり、図16に示すように、一端側に外部電源が差し込まれる速結端子部22−1を備え、他端側に接触子22−2を一体に備えている。速結端子部22−1は電源端子台等に用いられている公知の速結端子と同じ構造であり、外部電源線の芯線が差し込まれる。接触子22−2は、板バネとなっており、基板26の電力入力面に押圧されて接触するものであり、該速結端子22によって、外部電源線3と基板26とが電気的に接続される。 The quick connection terminal 22 is formed by processing a metal plate into an L shape. As shown in FIG. 16, the quick connection terminal 22 includes a quick connection terminal portion 22-1 into which an external power source is inserted, and the other end. A contact 22-2 is integrally provided on the side. The quick connection terminal portion 22-1 has the same structure as a known quick connection terminal used in a power supply terminal block or the like, and a core wire of an external power supply line is inserted therein. The contact 22-2 is a leaf spring that is pressed against and contacts the power input surface of the substrate 26. The external power line 3 and the substrate 26 are electrically connected by the quick connection terminal 22. Is done.
速結端子収納部23は、電気絶縁性の樹脂で形成されたものであり、図17から図19に示すように、T字形状で、外部電源線3が挿入される開口部23−1を備えた中空筒状のT字の縦棒部分23−2の内部に2個の速結端子部22−1が収容され、T字の横棒部分23−3に接触子22−2が収容される。中空筒状部分の開口部の形状は長形の矩形形状であり、中央部に絶縁板23−4が設けられ、筒状の内部に電線挿入孔23−5を有する2つに分割された収容空間23−6が備えられている。2個の速結端子22が収容空間23−6に離されて配置され、また中央部に設けた絶縁板23−4が、開口部23−1まで延出されているので沿面距離が大きく取られており、外部電源線の2本の芯線や、2個の速結端子の間には十分な絶縁性が確保されている。 The quick connection terminal accommodating portion 23 is formed of an electrically insulating resin, and as shown in FIGS. 17 to 19, is T-shaped and has an opening portion 23-1 into which the external power supply line 3 is inserted. Two quick-connecting terminal portions 22-1 are accommodated in the hollow cylindrical T-shaped vertical bar portion 23-2 provided, and contacts 22-2 are accommodated in the T-shaped horizontal bar portion 23-3. The The shape of the opening of the hollow cylindrical portion is a long rectangular shape, an insulating plate 23-4 is provided at the center, and the housing is divided into two having a wire insertion hole 23-5 inside the cylindrical shape. A space 23-6 is provided. Two quick connection terminals 22 are arranged apart from the accommodation space 23-6, and the insulating plate 23-4 provided at the center extends to the opening 23-1, so that the creepage distance is large. Therefore, sufficient insulation is ensured between the two core wires of the external power supply line and the two quick connection terminals.
速結端子22を収納した速結端子収納部23は、筐体21の内側から挿入され、T字の縦棒部分23−2が筐体21のLEDランプ位置固定延出部21−4の内部空間に収納され、T字の横棒部分23−3が回動規制突起21−6の内部空間に収納される。
なお本実施形態では、外部電源線の芯線を直接装着する速結端子を用いたが、外部電源線の芯線に外径14mmのプラグを取り付け、LEDランプ本体2の内部に該プラグが挿着されるコネクタを収納してもよい。更に該コネクタの前記プラグ挿着側の他端側に、前述の速結端子22と同様に、基板26の電力入力面に押圧されて接触する接触子を設けてもよい。
また本実施形態では、速結端子22をLEDランプ本体2に収容したが、これに限定されず、連結板1の連結板電力供給部11に速結端子22を取り付けてもよく、更に速結端子部22−1と接触子22−2を分割し、速結端子部22−1を連結板1に取り付け、接触子22−2をLEDランプ本体2に取り付け、連結板1にLEDランプ本体2を装着するときに、速結端子部22−1と接触子22−2が接続され、一体となる速結端子としてもよい。
また、LEDランプ本体2から点灯回路に繋がった電源線を伸ばし、その先端にプラグを取り付け、前記外部電源線のプラグに挿着してもよい。
The quick connection terminal storage portion 23 storing the quick connection terminals 22 is inserted from the inside of the housing 21, and the T-shaped vertical bar portion 23-2 is inside the LED lamp position fixing extension portion 21-4 of the housing 21. The T-shaped horizontal bar portion 23-3 is stored in the space, and is stored in the internal space of the rotation restricting projection 21-6.
In this embodiment, the quick connection terminal for directly attaching the core wire of the external power supply line is used. However, a plug having an outer diameter of 14 mm is attached to the core wire of the external power supply wire, and the plug is inserted into the LED lamp body 2. A connector may be housed. Further, a contact that is pressed against and contacted with the power input surface of the substrate 26 may be provided on the other end side of the connector on the plug insertion side, similarly to the above-described quick connection terminal 22.
Moreover, in this embodiment, although the quick connection terminal 22 was accommodated in the LED lamp main body 2, it is not limited to this, You may attach the quick connection terminal 22 to the connection board electric power supply part 11 of the connection board 1, and also quick connection. The terminal portion 22-1 and the contact 22-2 are divided, the quick connection terminal portion 22-1 is attached to the connecting plate 1, the contact 22-2 is attached to the LED lamp body 2, and the LED lamp body 2 is attached to the connecting plate 1. The quick connection terminal portion 22-1 and the contact 22-2 may be connected to form an integrated quick connection terminal.
Moreover, the power supply line connected to the lighting circuit may be extended from the LED lamp main body 2, a plug may be attached to the tip of the power supply line, and the external power supply line may be inserted into the plug.
LED素子24としては公知の種々のLEDを用いることができる。本実施形態では、照明用の白色光を発光する高輝度タイプのLED素子が用いられている。 Various known LEDs can be used as the LED element 24. In this embodiment, a high-luminance type LED element that emits white light for illumination is used.
点灯回路を構成する電子部品25は、過電流保護、ノイズカット、整流、平滑、調光制御などを行うための各種ダイオード、コンデンサー、IC、抵抗などの公知の電子部品である。 The electronic component 25 constituting the lighting circuit is a known electronic component such as various diodes, capacitors, ICs, resistors for performing overcurrent protection, noise cut, rectification, smoothing, dimming control, and the like.
基板26は、円盤形状の平板で、両面に銅箔が貼られたガラスエポキシ基板であり、片面側にLED素子24と電子部品25とが実装されている。
図22は、基板の実装面側(表側)であり、基板26の中心部側に円形の実装領域Aが、該実装領域Aの外側に帯状の半円環形状(略3/4周)の実装領域Bが形成されている。実装領域AにLED素子24が実装されており、実装領域Bに電子部品25が実装されている。また実装領域Bの一部には貫通孔26−1が備えられていて、他の電子部品に比べて大きな電解コンデンサーが横向きに設置されている。
実装領域Aと実装領域Bの間は、電流が流れる部分を残して前記銅箔が取り除かれ、両側の実装領域よりも熱抵抗が大きい円環状領域C(熱伝導係数の小さな高熱抵抗領域)となっている。円環の幅は、基板の厚みよりも大きく形成されており、LED素子24で発生した熱は、実装領域Bよりも、基板裏面に早く到達する。
更に、円環状領域Cの基板を切り取って貫通したスリットを形成してもよい。これによって更に円環状領域Cの熱抵抗を大きくすることがでる。
The board | substrate 26 is a glass epoxy board | substrate with which copper foil was affixed on both surfaces, and the LED element 24 and the electronic component 25 are mounted in the single side | surface.
FIG. 22 is a mounting surface side (front side) of the substrate, and a circular mounting region A is formed on the center side of the substrate 26, and a strip-like semi-annular shape (approximately 3/4 round) is formed outside the mounting region A. A mounting region B is formed. The LED element 24 is mounted in the mounting area A, and the electronic component 25 is mounted in the mounting area B. Further, a through hole 26-1 is provided in a part of the mounting region B, and a large electrolytic capacitor is installed sideways as compared with other electronic components.
Between the mounting area A and the mounting area B, the copper foil is removed leaving a portion where current flows, and an annular area C (high thermal resistance area having a small thermal conductivity coefficient) having a higher thermal resistance than the mounting areas on both sides, and It has become. The width of the ring is formed larger than the thickness of the substrate, and the heat generated in the LED element 24 reaches the substrate back surface earlier than the mounting region B.
Furthermore, you may form the slit which cut off the board | substrate of the annular | circular shaped area | region C and penetrated. As a result, the thermal resistance of the annular region C can be further increased.
図23は、基板26の裏面側であり、表側の各実装領域に対応した基板裏面に、各実装領域A、Bと略同形状の銅箔が貼られている。筐体21の凹部21−2は、内部に円形の凸部(図21に示した21−8)を形成し、その凸部の周囲に円環状の凹部(図21に示した21−9)を形成している。該凸部21−8を形成している筐体21の内壁に、実装領域Aに対応した裏面位置に貼られた銅箔が接触しており、LED素子24で発生した熱は、電子部品25に伝導することなく、基板裏面の銅箔を通って筐体21に伝導し、筐体21の外壁を形成している上面や側面から放熱される。
なお、該接触部に、電気絶縁性の放熱性のグリースを塗布したり、シートを挟んだりすることによって放熱性を更に向上させることもできる。
FIG. 23 is a back surface side of the substrate 26, and a copper foil having substantially the same shape as the mounting regions A and B is attached to the back surface of the substrate corresponding to the mounting regions on the front side. The concave portion 21-2 of the housing 21 has a circular convex portion (21-8 shown in FIG. 21) formed therein, and an annular concave portion (21-9 shown in FIG. 21) around the convex portion. Is forming. The copper foil affixed to the back surface position corresponding to the mounting area A is in contact with the inner wall of the casing 21 forming the convex portion 21-8, and the heat generated in the LED element 24 is generated by the electronic component 25. Without being conducted, the heat is conducted to the housing 21 through the copper foil on the back surface of the substrate, and is radiated from the upper surface and the side surface forming the outer wall of the housing 21.
In addition, heat dissipation can be further improved by applying an electrically insulating heat dissipating grease or sandwiching a sheet to the contact portion.
実装領域Bに対応した裏面位置に貼られた銅箔は、前記円環状の凹部21−9に位置しており、筐体と直接接触しない。実装領域Bにはスルーホールが形成され一部の電子部品25のリードが基板裏面に出ているが、実装領域Bが該凹部21−9に位置していることで、該リードと金属製の筐体とは接触せず、ショートが防止されている。
実装領域Bと、前記円環状の凹部21−9との間には、電気絶縁性の硬化性の放熱樹脂が充填されていてもよい。これによって、電子部品25で発生した熱は、裏面の銅箔を通って筐体21に伝熱しやすくなっており、電子部品25の温度上昇が抑制される。また放熱樹脂の熱伝導性よりも、アルミニウム製筐体の熱伝導性の方が100倍程度大きいので、LED素子24で発生した熱が、電子部品25に逆流してくることはなく、LED素子4及び電子部品25で発生した熱は筐体21の外壁から効果的に放熱される。
また硬化した樹脂によって、LEDランプ本体2に何らかの衝撃が加えられても、前記リードが筐体21の内壁に接触することがないので、樹脂の充填は信頼性の向上にもつながる。
The copper foil affixed to the back surface position corresponding to the mounting region B is located in the annular recess 21-9 and does not directly contact the housing. Through holes are formed in the mounting area B, and the leads of some electronic components 25 are exposed on the back surface of the substrate. However, since the mounting area B is located in the recess 21-9, the leads and metal Short circuit is prevented without contact with the housing.
Between the mounting area | region B and the said annular | circular shaped recessed part 21-9, you may be filled with an electrically insulating curable thermal radiation resin. Thereby, the heat generated in the electronic component 25 is easily transferred to the casing 21 through the copper foil on the back surface, and the temperature rise of the electronic component 25 is suppressed. Further, since the heat conductivity of the aluminum casing is about 100 times larger than the heat conductivity of the heat radiation resin, the heat generated in the LED element 24 does not flow back to the electronic component 25, and the LED element. 4 and the electronic component 25 are effectively radiated from the outer wall of the casing 21.
Moreover, even if some impact is applied to the LED lamp main body 2 by the cured resin, the lead does not contact the inner wall of the housing 21, so that the resin filling also improves the reliability.
更に基板26の裏面には、速結端子22の接触子22−2が接触する電力入力面26−2が設けられている。基板入力面26−2は銅箔であり、実装領域Aに対応した裏面位置に設けられ、また電力入力面26−2から、実装領域Bに電力を供給するための電力供給経路26−3が設けられている。これら電力入力面26−2、電力供給経路26−3は、実装領域Aに対応した裏面位置に設けられた銅箔から分断されており、また該電力供給経路26−3が筐体21の前記凸部内壁に接触しないよう前記凸部21−8の一部に(図示していない)溝が形成されている。電力供給経路26−3は実装領域Bの裏面まで延びており、電力はスルーホールを通って実装領域Bの電力供給部26−4に達する。
なお、前述の電気絶縁性の放熱シートを凸部21−8の表面に備えれば該電力供給経路26−3のための溝を設ける必用がなくなり、位置合わせ等の必要がなくなり製造上好ましい。
Further, on the back surface of the substrate 26, a power input surface 26-2 that contacts the contact 22-2 of the quick connection terminal 22 is provided. The board input surface 26-2 is a copper foil, and is provided at a back surface position corresponding to the mounting region A. A power supply path 26-3 for supplying power to the mounting region B from the power input surface 26-2 is provided. Is provided. The power input surface 26-2 and the power supply path 26-3 are separated from the copper foil provided at the back surface position corresponding to the mounting area A, and the power supply path 26-3 is the above-mentioned of the casing 21. A groove (not shown) is formed in a part of the convex portion 21-8 so as not to contact the inner wall of the convex portion. The power supply path 26-3 extends to the back surface of the mounting region B, and the power reaches the power supply unit 26-4 in the mounting region B through the through hole.
In addition, if the above-mentioned electrically insulating heat dissipation sheet is provided on the surface of the convex portion 21-8, it is not necessary to provide a groove for the power supply path 26-3, which eliminates the need for alignment and the like, which is preferable in manufacturing.
また、基板26の銅箔の形状を図24、図25に示したように形成し、実装領域Aの銅箔の面積を増やし、それらに全面接触する形状の凸部を筐体21の上面21−1に設けてもよい。これによって、LED素子24の温度上昇が更に抑制される。
また、速結端子収納部23のT字の横棒部分23−3と接触子22−2を長く伸ばし、電力入力面26−2を実装領域Bに対応した裏面位置に設けてもよい。
なお、本実施形態では、実装領域AにLED素子24を実装し、実装領域Bに電子部品25を実装したが、これとは逆に実装領域Aに電子部品25を実装し、実装領域BにLED素子24を実装してもよい。これに応じて筐体21の上面21−1の内壁は、中央部が円形の凹部で、その周囲が円環状の凸部に形成される。
またLED素子実装基板と、点灯回路用基板を別体の基板として、LED素子の光軸上に点灯回路用基板を配置しない範囲で、両方の基板が略同一平面に位置するように配設してLEDランプ本体を扁平にすることもできる。
Further, the shape of the copper foil of the substrate 26 is formed as shown in FIGS. 24 and 25, the area of the copper foil in the mounting region A is increased, and the convex portion that is in contact with the entire surface is formed on the upper surface 21 of the housing 21. -1 may be provided. Thereby, the temperature rise of the LED element 24 is further suppressed.
Further, the T-shaped horizontal bar portion 23-3 and the contact 22-2 of the quick-connection terminal accommodating portion 23 may be elongated and the power input surface 26-2 may be provided at the back surface position corresponding to the mounting region B.
In the present embodiment, the LED element 24 is mounted in the mounting area A and the electronic component 25 is mounted in the mounting area B. On the contrary, the electronic component 25 is mounted in the mounting area A and the mounting area B is mounted. The LED element 24 may be mounted. Accordingly, the inner wall of the upper surface 21-1 of the housing 21 is formed with a circular concave portion at the center and an annular convex portion around it.
In addition, the LED element mounting board and the lighting circuit board are separated from each other, and the lighting circuit board is not disposed on the optical axis of the LED element so that both boards are positioned on substantially the same plane. The LED lamp body can be made flat.
遮蔽板27は、酸化チタンを含有した光を透過しないポリカーボネート樹脂を用いて、両端部が開口した朝顔型の曲面形状であって中空円筒に成型されている。開口した一端面の周縁から内側に鍔部27−1が設けられている。鍔部27−1の一面は、基板26の実装領域Aと実装領域Bとの間の前記円環状領域に接合され、筐体21の上面21−1との間に基板26を挟持して、該上面21−1にネジ止めされている。
開口した他端面27−2は、外側に大きく拡開し鍔状に成型されている。該他端面27−2は、外側から電子部品25が見えないように、実装領域Bを覆い隠し、その鍔状の最端部は筐体21の内周に接している。
遮蔽板27の内壁面27−3は鏡面加工された拡散反射面を形成しており、LED素子24の出射光を吸収することなく反射し、LEDランプ2から光をロスすることなく出射させる機能を有している。
The shielding plate 27 is formed of a morning glory-shaped curved surface having both ends opened using a polycarbonate resin containing titanium oxide and not transmitting light, and is formed into a hollow cylinder. A flange portion 27-1 is provided on the inner side from the peripheral edge of the opened one end surface. One surface of the flange portion 27-1 is joined to the annular region between the mounting region A and the mounting region B of the substrate 26, and the substrate 26 is sandwiched between the upper surface 21-1 of the housing 21. It is screwed to the upper surface 21-1.
The opened other end surface 27-2 is greatly expanded outward and is shaped like a bowl. The other end surface 27-2 covers and hides the mounting region B so that the electronic component 25 cannot be seen from the outside, and the bowl-shaped endmost portion is in contact with the inner periphery of the housing 21.
The inner wall surface 27-3 of the shielding plate 27 forms a diffuse reflection surface that is mirror-finished, and reflects the light emitted from the LED element 24 without absorbing it, and emits the light from the LED lamp 2 without loss. have.
透光性カバー28は、ポリカーボネートを使用して、円形のドーム形状に成型されている。図28に示すように該透光性カバー28の端部に延出部28−1が、光照射方向の逆側に向けて設けられており、遮蔽板27の他端面27−2の縁部と、筐体21の内壁とに接触して固定されている。
延出部28−1によって、遮蔽板27との間に空間ができており、透光性カバー28で反射された光が、遮蔽板27の内壁面27−3で拡散反射され、これが繰り返されて、透光性カバー28の端部側まで光が達する。これによって遮蔽板27を覆っている部分も含め、透光性カバー28の全面が光ることができている。
The translucent cover 28 is molded into a circular dome shape using polycarbonate. As shown in FIG. 28, an extended portion 28-1 is provided at the end of the translucent cover 28 toward the opposite side of the light irradiation direction, and the edge of the other end surface 27-2 of the shielding plate 27. And is fixed in contact with the inner wall of the housing 21.
A space is formed between the extending portion 28-1 and the shielding plate 27, and the light reflected by the translucent cover 28 is diffusely reflected by the inner wall surface 27-3 of the shielding plate 27, and this is repeated. Thus, the light reaches the end side of the translucent cover 28. As a result, the entire surface of the translucent cover 28 including the portion covering the shielding plate 27 can be illuminated.
また遮蔽板27と透光性カバー28との間に、アクリル製の円環形状の導光板29を挿入してもよい。図28に示すように前記導光板29の内周側端面が光導入面29−1を形成し、遮蔽板側に位置する面が光出射面29−2となっており、散乱光が透光性カバーに向けて出射される。これによって、更に遮蔽板27を覆っている部分からの照射光を増やせ、透光性カバーをより均一に光らせることができる。
なお実装領域BにLED素子24が実装されるような、基板の外周側にLED素子が配置されるときは、円盤状の導光板の外周側に光導入面が設けられ、円盤状の全面を光出射面とした導光板が、遮蔽板27と透光性カバー28との間に設置されることで、透光性カバー全体が均一に発光するLED照明装置100が得られる。
Further, an acrylic annular light guide plate 29 may be inserted between the shielding plate 27 and the translucent cover 28. As shown in FIG. 28, the inner peripheral side end surface of the light guide plate 29 forms a light introducing surface 29-1, and the surface located on the shielding plate side is a light emitting surface 29-2, and the scattered light is transmitted through. It is emitted toward the sex cover. Thereby, the irradiation light from the part which covers the shielding board 27 can be increased further, and a translucent cover can be made to shine more uniformly.
When the LED element is arranged on the outer peripheral side of the substrate such that the LED element 24 is mounted in the mounting region B, a light introduction surface is provided on the outer peripheral side of the disc-shaped light guide plate, and the disc-shaped entire surface is covered. By installing the light guide plate as the light emitting surface between the shielding plate 27 and the translucent cover 28, the LED illumination device 100 in which the entire translucent cover emits light uniformly is obtained.
本実施形態のLED照明装置100は、以下のように被取り付け面である天井面4や壁等に取り付けられる。
まず、天井面4に直径15mmの孔をあけて、該孔から外部電源線3を引き出す。
次に、連結板1の連結板位置固定延出部12を、前記孔に挿入すると同時に連結板電力供給部11から、外部電源線3を引き出し、連結板1を天井面4にネジ止めする。
次に、外部電源線の2本の芯線を、LEDランプ2の速結端子収納部23の開口部23−1から挿入し、速結端子部22−1に挿着する。
次に、LEDランプ本体の係合溝21−5が連結板位置固定延出部12と係合し、LEDランプ本体の回動係止片21−7が連結板1の回動係合部14と係合するように、LEDランプ位置固定延出部21−4を、連結板の連結板電力供給部11に挿入する。
最後に、LEDランプ本体2の上面21−1を連結板1に密着するように接合し、LEDランプ2を所定角度回動させて、連結板1にLEDランプ2を装着する。
The LED lighting device 100 of this embodiment is attached to the ceiling surface 4 or a wall, which is a surface to be attached, as follows.
First, a hole having a diameter of 15 mm is formed in the ceiling surface 4 and the external power supply line 3 is drawn out from the hole.
Next, the connecting plate position fixing extension portion 12 of the connecting plate 1 is inserted into the hole, and at the same time, the external power line 3 is pulled out from the connecting plate power supply portion 11 and the connecting plate 1 is screwed to the ceiling surface 4.
Next, the two core wires of the external power supply line are inserted from the opening 23-1 of the quick connection terminal storage portion 23 of the LED lamp 2, and are inserted into the quick connection terminal portion 22-1.
Next, the engagement groove 21-5 of the LED lamp body is engaged with the connecting plate position fixing extension portion 12, and the rotation locking piece 21-7 of the LED lamp body is the rotation engaging portion 14 of the connection plate 1. The LED lamp position fixing extension portion 21-4 is inserted into the connecting plate power supply portion 11 of the connecting plate so as to engage with the connecting plate.
Finally, the upper surface 21-1 of the LED lamp body 2 is joined so as to be in close contact with the connecting plate 1, the LED lamp 2 is rotated by a predetermined angle, and the LED lamp 2 is attached to the connecting plate 1.
以上のように、本実施形態では、連結板1は1枚の板であり、LEDランプ2の筐体21は、扁平な円筒形状であり、被照射面側に近い側から順番に、透光性カバー28と、遮蔽板27と、基板26と、筐体上面側21−1の内壁に形成された凸部21−8と、連結板1とが、これら各部材の回転軸線とLED素子24の光軸とが略平行となるように配置されている。これらによってLED照明装置100は、天井面4からの突出量が少なく、良好な意匠性を示している。
なお本実施形態では筐体21の形状を円筒形にしたが、これに限定されず断面が4角形等からなる扁平な多角柱であってもよい。
As described above, in the present embodiment, the connecting plate 1 is a single plate, and the housing 21 of the LED lamp 2 has a flat cylindrical shape, and sequentially transmits light from the side closer to the irradiated surface side. The cover 28, the shielding plate 27, the substrate 26, the convex portion 21-8 formed on the inner wall of the housing upper surface side 21-1, and the connecting plate 1 are connected to the rotation axis of these members and the LED element 24. The optical axis is arranged substantially parallel to the optical axis. Thus, the LED lighting device 100 has a small amount of protrusion from the ceiling surface 4 and exhibits a good design.
In the present embodiment, the casing 21 has a cylindrical shape, but is not limited thereto, and may be a flat polygonal column having a quadrangular cross section.
1:連結板
11:連結板電力供給開口部
12:連結板位置固定延出部
13:回動規制孔部
14:回動係合部
2:LEDランプ本体
21:筐体
22:速結端子
23:速結端子収納部
24:LED素子
25:電子部品
26:基板
27:遮蔽板
28:透光性カバー
29:導光板
3: 外部電源線
4: 天井面
100:LED照明装置
1: connecting plate 11: connecting plate power supply opening 12: connecting plate position fixing extension 13: rotation restricting hole 14: rotation engaging portion 2: LED lamp body 21: housing 22: quick connecting terminal 23 : Quick connection terminal storage unit 24: LED element 25: Electronic component 26: Substrate 27: Shield plate 28: Translucent cover 29: Light guide plate 3: External power supply line 4: Ceiling surface 100: LED lighting device
Claims (37)
前記LEDランプ本体が取り付けられる連結板とを備えたLED照明装置において、
天井等の被取付部に、前記連結板の一面が、固定手段によって取り付けられ、
前記連結板の他面に、前記LEDランプ本体が着脱自在に取り付けられることを特徴としたLED照明装置。 An LED lamp body having an LED board on which an LED element is mounted, and a lighting circuit board on which electronic components constituting a lighting circuit for driving the LED element are mounted;
In an LED lighting device comprising a connecting plate to which the LED lamp body is attached,
One surface of the connecting plate is attached to the attached portion such as a ceiling by a fixing means,
The LED lighting device, wherein the LED lamp body is detachably attached to the other surface of the connecting plate.
これら電力供給開口部が重なるように、前記連結板に、前記LEDランプ本体が取り付けられ、
これら電力供給開口部を通して前記LEDランプ本体に、外部電源からの電力が供給されることを特徴とした請求項1に記載のLED照明装置。 Each of the LED lamp body and the connecting plate is formed with a power supply opening,
The LED lamp body is attached to the connecting plate so that these power supply openings overlap,
The LED lighting device according to claim 1, wherein power from an external power source is supplied to the LED lamp body through the power supply openings.
前記連結板下面で前記回動係止片と対応する位置に、該回動係止片と回動係合する係止舌片が設けられ、
前記LEDランプ本体の上面と、前記連結板の下面を接合し、前記LEDランプを回動することによって、前記係止舌片の上面に前記回動係止片が係入されることを特徴とした請求項1から3のいずれかに記載のLED照明装置。 A concave portion is provided in the center of the upper surface of the LED lamp body, and a rotation locking piece extending away from the bottom surface of the concave portion is formed toward the center direction of the LED lamp,
A locking tongue piece that rotates and engages with the rotation locking piece is provided at a position corresponding to the rotation locking piece on the lower surface of the connecting plate,
By joining the upper surface of the LED lamp body and the lower surface of the connecting plate and rotating the LED lamp, the rotation locking piece is engaged with the upper surface of the locking tongue piece. The LED illumination device according to any one of claims 1 to 3.
前記連結板電力供給開口部の周縁部に、前記被取付部に向かって延出する連結板位置固定延出部が形成され、
前記LEDランプ位置固定延出部に、前記連結板位置固定延出部が係合する係合溝が形成されていることを特徴とした請求項1から4のいずれかに記載のLED照明装置。 An LED lamp position fixing extension portion extending toward the connection plate is formed at the peripheral edge portion of the LED lamp power supply opening,
A connecting plate position fixing extending portion extending toward the attached portion is formed at the peripheral edge of the connecting plate power supply opening,
The LED illumination device according to any one of claims 1 to 4, wherein an engagement groove with which the connecting plate position fixing extension portion is engaged is formed in the LED lamp position fixing extension portion.
前記連結板に前記回動規制突起が嵌入する回動規制孔部が形成され、
前記LEDランプ本体の上面と、前記連結板の下面を接合したときに、前記回動規制突部と、前記回動規制孔部との間に形成される間隙によって、前記LEDランプ本体の回動範囲を規制することを特徴とした請求項1から6に記載のLED照明装置。 A rotation restricting protrusion is formed on the upper surface of the LED lamp body,
A rotation restricting hole portion into which the rotation restricting protrusion is fitted is formed in the connection plate,
When the upper surface of the LED lamp main body and the lower surface of the connecting plate are joined, the rotation of the LED lamp main body is caused by a gap formed between the rotation restricting protrusion and the rotation restricting hole. The LED lighting device according to claim 1, wherein the range is restricted.
前記実装領域Aは、前記基板の中心と同一な中心を有する円からなり、前記基板の中央部に配置され、
前記実装領域Bは、前記実装領域Aの外周の少なくとも一部と近接する帯形状からなり、前記基板の外周側に位置していることを特徴とした請求項16に記載のLED照明装置。 The substrate comprises a substantially circular substrate,
The mounting area A consists of a circle having the same center as the center of the substrate, and is disposed at the center of the substrate.
The LED lighting device according to claim 16, wherein the mounting region B has a band shape close to at least a part of the outer periphery of the mounting region A, and is located on the outer peripheral side of the substrate.
前記点灯回路を構成する電子部品が前記実装領域Bに実装されていることを特徴とした請求項16または17に記載のLED照明装置。 The LED element is mounted in the mounting area A,
The LED lighting device according to claim 16 or 17, wherein an electronic component constituting the lighting circuit is mounted in the mounting region B.
前記LED素子が前記実装領域Bに実装されていることを特徴とした請求項16または17に記載のLED照明装置。 Electronic components constituting the lighting circuit are mounted in the mounting area A,
The LED lighting device according to claim 16 or 17, wherein the LED element is mounted in the mounting region B.
前記高熱抵抗領域は、前記実装領域Aと、前記実装領域Bとの間の境界に位置していることを特徴とした請求項16から19のいずれかに記載のLED照明装置。 The substrate is provided with a high thermal resistance region having a smaller thermal conductivity coefficient than the mounting region A and the mounting region B,
The LED lighting device according to any one of claims 16 to 19, wherein the high thermal resistance region is located at a boundary between the mounting region A and the mounting region B.
前記貫通孔に、前記点灯回路を構成する電子部品の一部が配置されていることを特徴とした請求項1から23のいずれかに記載のLED照明装置。 A through hole is formed in a part of the area of the substrate on which the electronic components constituting the lighting circuit are mounted,
The LED illumination device according to any one of claims 1 to 23, wherein a part of an electronic component constituting the lighting circuit is disposed in the through hole.
電気絶縁性の放熱樹脂または放熱シートが備えられていることを特徴とした請求項28に記載のLED照明装置。 In the space formed by separating the back surface of the substrate in the region where the electronic components constituting the lighting circuit are mounted and the inner wall of the housing of the LED lamp body,
The LED lighting device according to claim 28, further comprising an electrically insulating heat radiation resin or heat radiation sheet.
前記点灯回路を構成する電子部品が実装される領域を覆う遮蔽板とが設置されており、
前記遮蔽板は、前記基板と前記透光性カバーとの間に配置されていることを特徴とした請求項1から29のいずれかに記載のLED照明装置。 In the LED lamp body, a translucent cover that covers the side on which the LED element is mounted;
And a shielding plate that covers an area where the electronic components constituting the lighting circuit are mounted,
30. The LED lighting device according to claim 1, wherein the shielding plate is disposed between the substrate and the translucent cover.
前記遮蔽板の一端面は、前記基板の実装領域Aと実装領域Bとの境界に位置し、
前記遮蔽板の他端面は、前記点灯回路を構成する電子部品が実装される領域を覆うように位置していることを特徴とした請求項30に記載のLED照明装置。 The shielding plate is a curved surface provided with a reflecting surface for reflecting the emitted light of the LED element,
One end surface of the shielding plate is located at the boundary between the mounting area A and the mounting area B of the substrate,
The other end surface of the said shielding board is located so that the area | region where the electronic component which comprises the said lighting circuit is mounted may be covered.
前記導光板の透光性カバーと対向する面が光出射面となることを特徴とした請求項35に記載のLED照明装置。 The light guide plate is disposed in a space between an inner wall of the translucent cover and a surface of the shielding plate facing the inner wall of the translucent cover,
36. The LED lighting device according to claim 35, wherein a surface of the light guide plate facing the translucent cover is a light emitting surface.
被照射面側に近い側から順番に、前記透光性カバーと、前記遮蔽板と、前記基板と、前記筐体上面側の内壁に形成された凸部と、前記連結板とが、前記各部材の回転軸線と前記LED素子の光軸とが略平行となるように配置されていることを特徴とした請求項1から36に記載のLED照明装置。
The housing of the LED lamp has a flat cylindrical shape or a flat polygonal column shape,
In order from the side closer to the irradiated surface side, the translucent cover, the shielding plate, the substrate, a convex portion formed on the inner wall on the upper surface side of the housing, and the connecting plate, 37. The LED lighting device according to claim 1, wherein the rotation axis of the member and the optical axis of the LED element are arranged so as to be substantially parallel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012265887A JP2014112470A (en) | 2012-12-05 | 2012-12-05 | Led lighting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012265887A JP2014112470A (en) | 2012-12-05 | 2012-12-05 | Led lighting device |
Related Child Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013185666A Division JP5538607B2 (en) | 2013-09-06 | 2013-09-06 | LED lighting device |
JP2013185670A Division JP5538608B2 (en) | 2013-09-06 | 2013-09-06 | LED lighting device |
JP2013185673A Division JP5538609B2 (en) | 2013-09-06 | 2013-09-06 | LED lighting device |
JP2013185659A Division JP5538606B2 (en) | 2013-09-06 | 2013-09-06 | LED lighting device |
JP2013185656A Division JP5538605B2 (en) | 2013-09-06 | 2013-09-06 | LED lighting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014112470A true JP2014112470A (en) | 2014-06-19 |
Family
ID=51169479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012265887A Pending JP2014112470A (en) | 2012-12-05 | 2012-12-05 | Led lighting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2014112470A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015046374A (en) * | 2013-07-29 | 2015-03-12 | アイリスオーヤマ株式会社 | Led lighting device |
JP2016038976A (en) * | 2014-08-06 | 2016-03-22 | ミネベア株式会社 | Light fitting |
CN106704925A (en) * | 2017-01-17 | 2017-05-24 | 江苏宜美照明科技股份有限公司 | Lamp buckle structure and novel ultra-thin LED ceiling lamp |
CN107270196A (en) * | 2017-07-26 | 2017-10-20 | 安徽玉杉光电科技有限公司 | The LED ceiling lamp of one kind of multiple brightness changes |
JP2017195044A (en) * | 2016-04-19 | 2017-10-26 | レシップホールディングス株式会社 | Lighting fixture |
JP2019040706A (en) * | 2017-08-24 | 2019-03-14 | パナソニックIpマネジメント株式会社 | Lighting fixture |
JP2019133840A (en) * | 2018-01-31 | 2019-08-08 | パナソニックIpマネジメント株式会社 | Lighting device |
KR20190110792A (en) * | 2018-03-21 | 2019-10-01 | 이향진 | Apparatus for fixing LED lamp |
KR200491032Y1 (en) * | 2019-02-11 | 2020-02-07 | 주식회사 삼원하이텍 | Lamp having easy-detachable structure |
US10623615B2 (en) | 2018-01-17 | 2020-04-14 | Axis Ab | Fastening arrangement, a fastening arrangement kit and use of a fastening arrangement kit |
WO2022199280A1 (en) * | 2021-03-22 | 2022-09-29 | 苏州欧普照明有限公司 | Surface-mounted lamp |
-
2012
- 2012-12-05 JP JP2012265887A patent/JP2014112470A/en active Pending
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015046374A (en) * | 2013-07-29 | 2015-03-12 | アイリスオーヤマ株式会社 | Led lighting device |
JP2016038976A (en) * | 2014-08-06 | 2016-03-22 | ミネベア株式会社 | Light fitting |
JP2017195044A (en) * | 2016-04-19 | 2017-10-26 | レシップホールディングス株式会社 | Lighting fixture |
CN106704925A (en) * | 2017-01-17 | 2017-05-24 | 江苏宜美照明科技股份有限公司 | Lamp buckle structure and novel ultra-thin LED ceiling lamp |
CN107270196A (en) * | 2017-07-26 | 2017-10-20 | 安徽玉杉光电科技有限公司 | The LED ceiling lamp of one kind of multiple brightness changes |
CN107270196B (en) * | 2017-07-26 | 2023-10-31 | 安徽玉杉光电科技有限公司 | LED ceiling lamp with various brightness changes |
JP2019040706A (en) * | 2017-08-24 | 2019-03-14 | パナソニックIpマネジメント株式会社 | Lighting fixture |
US10623615B2 (en) | 2018-01-17 | 2020-04-14 | Axis Ab | Fastening arrangement, a fastening arrangement kit and use of a fastening arrangement kit |
JP2019133840A (en) * | 2018-01-31 | 2019-08-08 | パナソニックIpマネジメント株式会社 | Lighting device |
JP7022945B2 (en) | 2018-01-31 | 2022-02-21 | パナソニックIpマネジメント株式会社 | lighting equipment |
KR102036543B1 (en) | 2018-03-21 | 2019-10-25 | 이향진 | Apparatus for fixing LED lamp |
KR20190110792A (en) * | 2018-03-21 | 2019-10-01 | 이향진 | Apparatus for fixing LED lamp |
KR200491032Y1 (en) * | 2019-02-11 | 2020-02-07 | 주식회사 삼원하이텍 | Lamp having easy-detachable structure |
WO2022199280A1 (en) * | 2021-03-22 | 2022-09-29 | 苏州欧普照明有限公司 | Surface-mounted lamp |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2014112470A (en) | Led lighting device | |
JP2008098116A (en) | Lighting fixture | |
JP2012160332A (en) | Lamp device and lighting fixture | |
JP2011044412A (en) | Lighting fixture | |
JP5626528B2 (en) | Lamp apparatus and lighting apparatus | |
JP2014238984A (en) | Lighting device | |
JP2013127916A (en) | Lighting device and lighting fixture equipped with the same | |
JP5701422B2 (en) | LED lighting device | |
JP5705350B2 (en) | LED lighting device | |
JP5538606B2 (en) | LED lighting device | |
JP5538605B2 (en) | LED lighting device | |
JP5701423B2 (en) | LED lighting device | |
JP6268645B2 (en) | Illumination light source and illumination device | |
JP5538607B2 (en) | LED lighting device | |
JP5538608B2 (en) | LED lighting device | |
JP2016076402A (en) | Electrical equipment and manufacturing method of the same | |
JP5538609B2 (en) | LED lighting device | |
JP2015141753A (en) | Led lighting device | |
JP5701424B2 (en) | LED lighting device | |
JP6214883B2 (en) | LED lighting device | |
JP2014175090A (en) | LED lighting device | |
JP2015099797A (en) | Led lighting device | |
JP6566347B2 (en) | Lighting device | |
JP2014135299A (en) | Led lighting device | |
JP6681578B2 (en) | Lighting equipment |