JP2018085212A - Luminaire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a luminaire capable of suppressing deterioration of a light distribution characteristic due to a circuit element, even in a case where a plurality of circuit elements are juxtaposed to a row of light-emitting elements in order to make the luminaire thin.SOLUTION: A luminaire 1 includes: a long substrate 10; a plurality of light-emitting elements 20 arrayed on the substrate 10 along a longitudinal direction of the substrate 10; a plurality of circuit elements 30 arrayed in parallel with a row of the light-emitting elements 20; a housing 40 having a light shielding part covering the plurality of circuit elements 30 and a light-transmissive part covering the plurality of light-emitting elements 20; and a partition plate 50 positioned between the row of the light-emitting elements 20 and a row of the circuit elements 30, and extending along the longitudinal direction of the substrate 10.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a lighting device.

  2. Description of the Related Art In recent years, lighting devices (LED lighting) using LEDs (Light Emitting Diodes) are rapidly spreading from the viewpoint of energy saving. In LED illumination, a COB (Chip On Board) type or SMD (Surface Mount Device) type LED module is used as a light emitting unit.

  The COB type LED module has a structure in which an LED chip is directly mounted on a substrate. The SMD type LED module has a structure in which an SMD type LED element in which an LED chip is packaged is surface-mounted on a substrate.

  2. Description of the Related Art Conventionally, as LED lighting, a long lighting device including a long housing and an LED module arranged in the housing is known (see, for example, Patent Document 1). In such a long illuminating device, a long LED module is used as a line-shaped light emitting section (line light source).

  For example, a long LED module of a COB type has a long substrate, a plurality of LED chips (light emitting elements) arranged on the substrate along the longitudinal direction of the substrate, and a plurality of LED chips sealed together. And a sealing member to be stopped.

  In addition, the long LED module of the SMD type includes a long substrate and a plurality of SMD LED elements (light emitting devices) arranged on the substrate along the longitudinal direction of the substrate.

JP 2012-84367 A

  In the lighting device, the LED module is electrically connected to a power supply unit (power supply circuit) configured by a plurality of circuit elements, and emits light by power supplied from the power supply unit. The power supply unit is known to have a structure separated from the light emitting unit within the housing of the lighting device (built-in separation type) or a structure separated from the lighting device housing as a power supply box (external separation type). It has been.

  The power supply unit of the lighting device has a merit that construction is easier when it is built in the housing than when it is arranged outside the housing. However, when the power supply unit is built in the housing in the long illuminating device, the height of the illuminating device (the height of the housing) increases or the outer size of the illuminating device increases.

  Therefore, in order to realize a thin and long lighting device with a built-in power supply unit, a plurality of circuit elements constituting the power supply unit are arranged in parallel with a plurality of light emitting elements arranged in a line. It is possible. That is, it is conceivable to arrange a plurality of circuit elements and a plurality of light emitting elements side by side along the longitudinal direction of the housing.

  However, when the row of light emitting elements and the row of circuit elements are arranged in parallel, the line-shaped light emitted from the plurality of light emitting elements is partially shielded by the circuit elements. For this reason, there is a problem that the light distribution characteristics of the lighting device deteriorate due to a part of the line-shaped illumination light being lost due to the shadow of the circuit element. Specifically, a bad-looking shadow is generated in the illumination light by the circuit element.

  The present invention has been made to solve such a problem, and even if a plurality of circuit elements are arranged in parallel in a row of light emitting elements in order to reduce the thickness, the deterioration of light distribution characteristics due to the circuit elements is suppressed. An object of the present invention is to provide a lighting device that can be used.

  In order to achieve the above object, one embodiment of a lighting device according to the present invention includes a long substrate, a plurality of light emitting elements arranged on the substrate along a longitudinal direction of the substrate, and the light emitting device. A plurality of circuit elements arranged in parallel with the columns; a housing having a light-shielding portion that covers the plurality of circuit elements; and a light-transmitting portion that covers the plurality of light-emitting elements; the row of light-emitting elements and the row of circuit elements And a partition plate extending along the longitudinal direction of the substrate.

  A thin and long lighting device capable of obtaining desired light distribution characteristics can be easily realized.

It is a perspective view which shows the external appearance of the illuminating device which concerns on embodiment. It is a disassembled perspective view of the illuminating device which concerns on embodiment. It is sectional drawing of the illuminating device which concerns on embodiment of FIG. It is a figure which shows a mode when the illuminating device which concerns on embodiment is assembled. It is a figure which shows the example of installation of the conventional illuminating device. It is a figure which shows the example of installation of the illuminating device which concerns on embodiment. It is a figure which shows the other example of installation of the conventional illuminating device. It is a figure which shows the other example of installation of the illuminating device which concerns on embodiment. It is a figure which shows another example of installation of the illuminating device of a comparative example, and the illuminating device which concerns on embodiment. It is sectional drawing which shows the structure of the illuminating device which concerns on the modification 1. It is sectional drawing which shows the structure of the illuminating device which concerns on the modification 2.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each of the embodiments described below shows a preferred specific example of the present invention. Therefore, numerical values, shapes, materials, components, component positions, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily shown strictly. In each figure, substantially the same configuration is denoted by the same reference numeral, and redundant description may be omitted or simplified. In this specification, “substantially” or “about” means that a manufacturing error, a dimensional tolerance, and the like are included.

  In the present specification and drawings, the X axis, the Y axis, and the Z axis represent the three axes of the three-dimensional orthogonal coordinate system. In the present embodiment, the Z axis direction is the vertical direction and the Z axis is perpendicular to the Z axis. This direction (the direction parallel to the XY plane) is the horizontal direction. The X axis and the Y axis are orthogonal to each other, and both are orthogonal to the Z axis.

(Embodiment)
First, the illuminating device 1 which concerns on embodiment is demonstrated using FIGS. 1-3. FIG. 1 is a perspective view illustrating an appearance of a lighting device 1 according to an embodiment. FIG. 2 is an exploded perspective view of the illumination device 1. FIG. 3 is a cross-sectional view of the illumination device 1 of FIG.

  As shown in FIG.1 and FIG.2, the illuminating device 1 is provided with the lighting fixture 2 and the attachment member 3 for attaching the lighting fixture 2 to construction materials, such as a ceiling or a wall.

  The lighting fixture 2 includes a substrate 10, a plurality of light emitting elements 20, a plurality of circuit elements 30, a housing 40, a partition plate 50, and an end cover 60. In the present embodiment, since the SMD type LED element is used as the light emitting element 20, the substrate 10 and the light emitting element 20 constitute an SMD type LED module.

  The attachment member 3 is disposed on the side surface on the side of the plurality of circuit elements 30 among the two side surfaces along the longitudinal direction of the housing 40. That is, the attachment member 3 is disposed on the side surface on the power source unit side of the side surface on the light emitting unit side and the side surface on the power source unit side of the housing 40. The mounting member 3 is a long mounting bracket made of a metal material such as an aluminum alloy. The total length of the attachment member 3 is substantially the same as that of the lighting fixture 2 (housing 40).

  When installing the luminaire 2 on the construction material, first, the attachment member 3 is fixed to the construction material with screws 4 (see FIG. 2). Next, as shown in FIG. 3, the claw part 3a is hooked on the groove part 2a by hooking the groove part 2a of the lighting fixture 2 on the claw part 3a of the mounting member 3 fixed to the construction material. Thereby, the lighting fixture 2 can be installed in the construction material. In addition, the claw part 3a has a structure in which, for example, the cross-sectional shape is T-shaped and is fitted in the groove 2a.

  The lighting device 1 configured as described above is installed in a living room or bedroom of a house, for example, and used as indirect lighting such as cove lighting or cornice lighting, or installed in a kitchen or the like and used as kitchen lighting or the like. Or In addition, you may use the illuminating device 1 as main illuminations, such as a base light installed in a ceiling etc. instead of indirect illumination.

  As shown in FIG. 1, the illuminating device 1 is a thin and long illuminating device (slim line illumination) as a whole, and emits line-shaped illumination light. Although the whole shape of the illuminating device 1 in this Embodiment is a flat substantially rectangular parallelepiped, it is not restricted to this. The lighting device 1 (lighting fixture 2) has a height of about 15 mm, a width of about 35 mm, and a total length of about 30 cm, but is not limited thereto. For example, the total length of the lighting device 1 may be about 60 cm, about 150 cm, or the like. In addition, the aspect ratio (horizontal / vertical) of the lighting device 1 when viewed from the side is about 1 or more and 4 or less.

  Hereinafter, each component of the lighting fixture 2 in embodiment is demonstrated in detail, referring FIGS. 1-3.

[substrate]
The substrate 10 is a long plate member. In the present embodiment, the substrate 10 is a long rectangular substrate. That is, the planar view shape of the substrate 10 is an elongated rectangle. As an example, the substrate 10 has a long side length of about 29 cm and a short side length of about 35 mm, but the length of the long side and the short side is not limited thereto. Further, one substrate 10 is disposed in the housing 40, but a plurality of substrates 10 may be disposed in the housing 40 according to the length of the housing 40 in the longitudinal direction. The shape of the substrate 10 in plan view is not limited to a rectangular shape, and may be a curved shape. The substrate 10 is placed on the bottom 41 c of the housing 40.

  The substrate 10 is a mounting substrate for mounting the light emitting element 20. As the substrate 10, a resin substrate based on resin, a ceramic substrate made of ceramic, a metal base substrate based on metal, or the like can be used.

  As the resin substrate, for example, a glass epoxy substrate (CEM-3, FR-4, etc.) made of glass fiber and epoxy resin, or a substrate (FR-1 etc.) made of paper phenol or paper epoxy is used. it can. As the ceramic substrate, an alumina substrate made of alumina, an aluminum nitride substrate made of aluminum nitride, or the like can be used. As the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate or the like whose surface is coated with an insulating film can be used.

  The substrate 10 is a printed board on which metal wiring is formed. For example, the metal wiring is formed in a pattern with a predetermined shape on one main surface (front surface) of the substrate 10. The plurality of light emitting elements 20, the plurality of circuit elements 30, and the light emitting elements 20 and the circuit elements 30 are electrically connected by metal wiring (wiring pattern) formed on one main surface of the substrate 10. . In the present embodiment, an FR-4 double-sided substrate is used as the substrate 10, and metal films (copper foil or the like) are formed on both main surfaces. The substrate 10 is not limited to a rigid substrate, and may be a flexible flexible substrate made of polyimide or the like.

  In the present embodiment, not only the light emitting element 20 but also the circuit element 30 is mounted on the substrate 10. That is, the substrate 10 not only functions as a light source substrate, but also functions as a circuit substrate. And then. In the present embodiment, the region of one main surface of the substrate 10 is divided into two in the width direction, and one region is set as a light emitting region (first region) for mounting the light emitting element 20, and the other The region is set as a circuit region (second region) for mounting the circuit element 30. That is, the light emitting region and the circuit region are two regions adjacent to each other in the width direction of the substrate 10, and each extend along the longitudinal direction of the substrate 10. The width of the light emitting region and the circuit region may be divided into two equal parts in the width direction, but either one may be larger.

  The circuit element 30 and the light emitting element 20 are not mounted on the same substrate 10, but a substrate different from the substrate 10 on which the light emitting element 20 is mounted is prepared, and the circuit element 30 is mounted on this different substrate. May be implemented. In this case, for example, the substrate 10 on which the light emitting element 20 is mounted (light source substrate) and the substrate on which the circuit element 30 is mounted (circuit board) are placed side by side on the bottom 41c of the housing 40.

  In addition, a pair of connectors 11 that receive power for causing the plurality of light emitting elements 20 to emit light are disposed on the substrate 10. The pair of connectors 11 are electrically connected to the plurality of circuit elements 30 by metal wiring formed on the substrate 10, and the power received by the pair of connectors 11 is supplied to the circuit elements 30. In the present embodiment, the pair of connectors 11 is electrically connected to an external commercial power source via an electric wire 70 such as a VVF cable, and commercial AC power is supplied to the pair of connectors 11.

  The pair of connectors 11 are arranged in the same row as the plurality of circuit elements 30. That is, the pair of connectors 11 are mounted in the circuit area like the circuit element 30, and are arranged side by side with the light emitting element 20. In the present embodiment, the pair of connectors 11 is arranged at the tail (or the head) of the row of the plurality of circuit elements 30.

  Although not shown, when two or more lighting devices 1 are connected, another pair of connectors is provided on the opposite side of the pair of connectors 11 of the substrate 10, and the lighting device adjacent to the other pair of connectors is provided. What is necessary is just to connect the electric wire (cable) for power supply for supplying alternating current power to 1. FIG. That is, it is only necessary to electrically connect two adjacent lighting devices 1 with power supply wires.

[Light emitting element]
The plurality of light emitting elements 20 are light emitting units that serve as light sources of the lighting device 1 (lighting fixture 2). In the present embodiment, the plurality of light emitting elements 20 are arranged in a linear shape (linear shape) such as a linear shape or a curved shape. The plurality of light emitting elements 20 arranged in a line function as a line light source that emits a line of light.

  The plurality of light emitting elements 20 are arranged on the substrate 10 along the longitudinal direction of the substrate 10. In the present embodiment, all the light emitting elements 20 on the substrate 10 are mounted on the substrate 10 in a straight line. The element rows of the light-emitting elements 20 configured by the plurality of line-shaped light-emitting elements 20 are not limited to a linear shape, may be curved, and are not limited to a single row, and may be a plurality of rows. Moreover, although the several light emitting element 20 is arrange | positioned at equal intervals, it does not restrict to this.

  The plurality of light emitting elements 20 being arranged along the longitudinal direction of the substrate 10 is not limited to the case where the row of the plurality of light emitting elements 20 is parallel to the long side of the substrate 10, but the longitudinal direction of the substrate 10. It means that they are arranged from one end of the direction toward the other end.

  Each light emitting element 20 is an SMD type LED element in which an LED chip is packaged, and is a resin or ceramic white container having a recess, and one or more LED chips primarily mounted on the bottom surface of the recess of the container. And a sealing member enclosed in the recess of the container. The sealing member is made of a translucent resin material such as silicone resin. The sealing member may be a phosphor-containing resin containing a wavelength conversion material such as a phosphor.

  The LED chip is an example of a semiconductor light emitting element that emits light with a predetermined DC power, and is a bare chip that emits monochromatic visible light. The LED chip is, for example, a blue LED chip that emits blue light when energized. In this case, in order to obtain white light, the sealing member contains a yellow phosphor such as YAG (yttrium, aluminum, garnet) that emits fluorescence using blue light from the blue LED chip as excitation light.

  Thus, the light emitting element 20 in this Embodiment is a BY type white LED light source comprised by the blue LED chip and the yellow fluorescent substance. Specifically, the yellow phosphor absorbs a part of the blue light emitted from the blue LED chip and is excited to emit yellow light, and the yellow light and the blue light not absorbed by the yellow phosphor are mixed. White light.

  In the present embodiment, the plurality of light emitting elements 20 are driven by an AC direct method. Therefore, the plurality of circuit elements 30 include a rectifying element that rectifies an AC voltage and converts it into a DC rectified voltage, and the plurality of light emitting elements 20 emit light according to the rectified voltage.

  Note that the connection mode of the plurality of light emitting elements 20 (series connection, parallel connection, combination connection of series connection and parallel connection, etc.) is not particularly limited.

[Circuit elements]
The plurality of circuit elements 30 constitute a power supply unit that generates electric power for causing at least the plurality of light emitting elements 20 to emit light.

  The plurality of circuit elements 30 are arranged along the longitudinal direction of the substrate 10. In addition, the plurality of circuit elements 30 are arranged in parallel with an element row including the plurality of light emitting elements 20. That is, the plurality of circuit elements 30 are arranged side by side with the plurality of light emitting elements 20.

  As described above, in the present embodiment, the plurality of circuit elements 30 are arranged on the substrate 10. That is, the plurality of circuit elements 30 and the plurality of light emitting elements 20 are arranged on the same substrate and configured as one module. The plurality of circuit elements 30 and the plurality of light emitting elements 20 are mounted on the same surface of the substrate 10.

  The plurality of circuit elements 30 are electronic parts (circuit parts) that constitute a drive circuit for driving the plurality of light emitting elements 20. In the present embodiment, the plurality of circuit elements 30 include power supply circuit elements that constitute a power supply circuit that generates power for causing the plurality of light emitting elements 20 to emit light.

  The plurality of circuit elements 30 constituting the power supply circuit convert AC power supplied from a commercial power source into DC power. The direct-current power generated by the plurality of circuit elements 30 is supplied to each of the plurality of light emitting elements 20 via the metal wiring formed on the substrate 10, whereby each light emitting element 20 emits light. The plurality of circuit elements 30 constituting the power supply circuit are, for example, capacitive elements such as electrolytic capacitors or ceramic capacitors, resistance elements such as resistors, rectifier elements, fuses, noise filters, diodes, or semiconductor elements such as integrated circuit elements Etc.

  In the present embodiment, since the light emitting element 20 is driven by an AC direct method, a coil element (inductor) such as a choke coil or choke transformer which is a relatively tall circuit element is not used. In addition, as for the capacitor, a single capacitor having a large capacity is not used, but the necessary capacity is distributed to a plurality of short capacitors. Furthermore, in the present embodiment, all the circuit elements 30 are not components with leads, but are surface-mounted components that are solder-connected on one main surface of the substrate 10 (the mounting surface of the light emitting element 20). Therefore, the capacitor is not a leaded capacitor but a surface mount capacitor. Thereby, since all the circuit elements 30 can be comprised with a comparatively short component, the height of the housing | casing 40 can be made low and the thin illuminating device 1 (luminaire 2) is implement | achieved easily. Can do. Since the light emitting element 20 is also a surface mount type, all components on the substrate 10 are a surface mount type. Thereby, all the components on the board | substrate 10 can be solder-mounted only by reflow.

  The plurality of circuit elements 30 include not only the power supply circuit elements constituting the power supply circuit but also the control circuit elements for controlling the light emission state of the light emitting elements 20 or communication devices for communicating with other devices. A circuit element or the like may be included.

[Case]
The casing 40 is an outer casing that forms the outer casing of the lighting fixture 2, and houses the substrate 10, the light emitting element 20, and the circuit element 30. The housing 40 is composed of a plurality of members. In the present embodiment, the housing 40 includes a first housing 41 that includes a light shielding unit that covers the plurality of circuit elements 30 (power supply units), and a first light transmission unit that includes a plurality of light emitting elements 20 (light emitting units). The two casings 42 are configured by two members. Specifically, the entire first housing 41 forms a light shielding portion, and the entire second housing 42 forms a light transmitting portion. In the present embodiment, the first casing 41 and the second casing 42 are integrally formed by two-color molding, but the present invention is not limited to this. For example, the 1st housing | casing 41 and the 2nd housing | casing 42 may be produced separately, and these may be mutually fixed by a locking structure, an adhesive agent, a screw | thread, etc.

  The first housing 41 is a support member (base) that supports the substrate 10 and is a main body of the lighting device 1. The first housing 41 is entirely made of a light shielding material. For example, the first casing 41 is made of a white insulating resin material. Therefore, the surface of the first housing 41 is white and has light reflectivity with respect to visible light. The surface of the first housing 41 is not limited to a white light reflecting surface, and may be a light reflecting surface made of a metal surface. Alternatively, the first housing 41 may be made of a black insulating resin material, and the surface of the first housing 41 may be a black light absorbing surface instead of a light reflecting surface. In the present embodiment, the first housing 41 is made of white polycarbonate. Note that the first housing 41 may be made of a metal material such as aluminum or iron instead of the resin material.

  The first housing 41 includes a plate-shaped first front surface portion 41 a, a plate-shaped first side surface portion 41 b, and a plate-shaped bottom portion 41 c that supports the substrate 10. The first front surface portion 41 a, the first side surface portion 41 b, and the bottom portion 41 c are formed so as to extend in the longitudinal direction of the substrate 10. Moreover, the 1st front surface part 41a, the 1st side part 41b, and the bottom part 41c are comprised integrally. For example, the first front surface portion 41a, the first side surface portion 41b, and the bottom portion 41c are integrally formed by resin molding.

  The first front surface portion 41 a faces the plurality of circuit elements 30. The first front surface portion 41a is formed at a position facing the bottom portion 41c, and the plurality of circuit elements 30 are accommodated in a space region between the first front surface portion 41a and the bottom portion 41c. The 1st front part 41a comprises the outline of the lighting fixture 2, and the outer surface of the 1st front part 41a is exposed to external air.

  The first side surface portion 41b is formed so as to stand up from the first front surface portion 41a. Moreover, the 1st side part 41b is formed so that it may stand also at the bottom part 41c. That is, the first side surface portion 41b is formed so as to stand on each of the first front surface portion 41a and the bottom portion 41c between the first front surface portion 41a and the bottom portion 41c. The first side surface portion 41 b is located on the side of the circuit element 30. In addition, a connection portion 41b1 for connecting the lighting fixture 2 to the attachment member 3 is formed on the first side surface portion 41b. The connecting portion 41b1 is formed with a groove portion 2a on which the claw portion 3a of the mounting member 3 is hooked.

  The bottom 41c is a substrate placement portion on which the substrate 10 is placed. As described above, the bottom portion 41c faces the first front surface portion 41a. Specifically, the bottom 41c is disposed substantially parallel to the first front surface 41a. In the present embodiment, the bottom portion 41 c faces not only the first front surface portion 41 a but also the second front surface portion 42 a of the second housing 42. That is, the bottom portion 41 c is formed to extend from a position facing the first front surface portion 41 a of the first housing 41 to a position facing the second front surface portion 42 a of the second housing 42. In the present embodiment, the width of the bottom 41c is approximately the sum of the width of the first front surface 41a of the first housing 41 and the width of the second front surface 42a of the second housing 42. Combined length.

  The second housing 42 is a translucent cover that transmits light emitted from the light emitting element 20. The second housing 42 is entirely made of a translucent material. For example, the 2nd housing | casing 42 is comprised by translucent materials, such as translucent resin materials or glass materials, such as an acrylic or a polycarbonate, for example.

  The second housing 42 may further have a light diffusing property (light scattering property). By providing the second casing 42 with light diffusibility, light from the light emitting element 20 that is a highly directional LED light source can be scattered. (Luminance unevenness) can be suppressed.

  When the second casing 42 has light diffusibility, the second casing 42 is manufactured by dispersing a light diffusing material such as light reflecting fine particles in a translucent resin material, or a second casing made of a transparent member. By forming a milky white light diffusing film containing a light diffusing material or the like on the surface (inner surface or outer surface) of 42, the second casing 42 can have light diffusibility. Alternatively, instead of using a light diffusing material, fine irregularities are formed on the surface of the second casing 42 made of a transparent member by applying a texture or the like, or dots are formed on the surface of the second casing 42 made of a transparent member. The second casing 42 may have light diffusibility by printing a pattern.

  In the present embodiment, the second housing 42 is a light transmissive cover (diffusion cover) made of polycarbonate and having light diffusibility. The second housing 42 may be configured to control the light distribution of the light emitting element 20. For example, the second housing 42 may have a condensing or diverging lens function.

  The second housing 42 has a plate-like second front surface portion 42a and a plate-shaped second side surface portion 42b. The second front surface portion 42 a and the second side surface portion 42 b are formed so as to extend in the longitudinal direction of the substrate 10. Moreover, the 2nd front surface part 42a and the 2nd side part 42b are comprised integrally. For example, the second front surface portion 42a and the second side surface portion 42b are integrally formed by resin molding.

  The second front surface portion 42a faces the plurality of light emitting elements 20. In addition, the second front surface portion 42a is formed at a position facing the bottom portion 41c of the first housing 41, and the plurality of light emitting elements 20 are stored in a space region between the second front surface portion 42a and the bottom portion 41c. Has been. The 2nd front part 42a comprises the outline of the lighting fixture 2, and the outer surface of the 2nd front part 42a is exposed to external air.

  In the present embodiment, the outer surface of the second front surface portion 42 a is substantially flush with the outer surface of the first front surface portion 41 a of the first housing 41. That is, the outer surface of the second front surface portion 42a is flush with the outer surface of the first front surface portion 41a. Specifically, the outer surface of the second front surface portion 42a and the outer surface of the first front surface portion 41a are continuous surfaces having no step. In addition, since the thickness of the 2nd front part 42a and the thickness of the 1st front part 41a are substantially the same, the inner surface of the 2nd front part 42a and the inner surface of the 1st front part 41a have comprised the substantially the same plane.

  The second side surface portion 42b is formed so as to stand up from the second front surface portion 42a. The second side surface portion 42 b is located on the side of the light emitting element 20. The 2nd side part 42b also comprises the outline of the lighting fixture 2, and the outer surface of the 2nd side part 42b is exposed to external air.

  As described above, the second casing 42 is formed by the second front surface portion 42a and the second side surface portion 42b so that the cross-sectional shape is L-shaped. Therefore, the light of the light emitting element 20 is transmitted through the second housing 42 having an L-shaped cross section and is emitted to the outside.

  In addition, the housing 40 includes a first groove portion 40a into which one end portion in the width direction of the substrate 10 is inserted, and a second groove portion 40b into which the other end portion in the width direction of the substrate 10 is inserted. The first groove portion 40 a and the second groove portion 40 b are concave portions formed by projecting in a L-shaped cross section from both ends in the width direction of the bottom portion 41 c of the first housing 41.

  The first groove portion 40 a and the second groove portion 40 b are guide rails (slide rails) for sliding the substrate 10 in the housing 40, and extend in the longitudinal direction of the housing 40. That is, the first groove portion 40a and the second groove portion 40b hold the substrate 10 so as to be slidable.

  As shown in FIG. 4, the substrate 10 can be accommodated in the housing 40 by inserting the substrate 10 into the first groove portion 40 a and the second groove portion 40 b and sliding the substrate 10. Specifically, the light emitting element 20 and the circuit element 30 are mounted on the substrate 10 to be modularized, and both end portions of the modularized substrate 10 are inserted from the end portions of the first groove portion 40a and the second groove portion 40b. Is slid along the longitudinal direction of the housing 40 and pushed into the back. At this time, the substrate 10 inserted into the first groove portion 40a and the second groove portion 40b has the first groove portion 40a and the second groove portion 40b in a state where both end portions of the substrate 10 are supported by the first groove portion 40a and the second groove portion 40b. As the back surface slides on the surface of the bottom 41c, the sliding movement of the casing 40 in the longitudinal direction occurs. Thereby, the board | substrate 10 can be hold | maintained in the 1st groove part 40a and the 2nd groove part 40b. As described above, the substrate 10 is held in the first groove portion 40 a and the second groove portion 40 b in a state in which the substrate 10 is slidable along the longitudinal direction of the housing 40.

  In the present embodiment, the substrate 10 is slid and inserted into the first housing 40, but is not limited thereto. The first groove portion 40a and the second groove portion 40b are both provided in the first housing 41, but are not limited thereto, and are provided in each of the first housing 41 and the second housing 42. Also good.

[Partition plate]
The partition plate 50 is a partition member that partitions the plurality of light-emitting elements 20 (light-emitting portions) and the plurality of circuit elements 30 (power supply portions). When viewed from above, the partition plate 50 includes an element array including the plurality of light-emitting elements 20 and a plurality of circuit elements. It is located between the element rows of 30 and extends along the longitudinal direction of the substrate 10. That is, the light emitting element 20 exists on one side of the partition plate 50 in the width direction of the substrate 10, and the circuit element 30 exists on the other side. The shape of the partition plate 50 is, for example, a long rectangle.

  The partition plate 50 is formed so as to protrude from the first front surface portion 41 a of the first housing 41 of the housing 40 toward the substrate 10. That is, the partition plate 50 is formed to stand from the first front surface portion 41a.

  Further, the partition plate 50 protrudes to the vicinity of one main surface (front surface) of the substrate 10, but the tip of the partition plate 50 is not in contact with the substrate 10. Accordingly, there is a gap between the tip of the partition plate 50 and the substrate 10. The space | interval of this clearance gap is 0.1 mm-1.0 mm, for example.

  In this Embodiment, the partition plate 50 is formed so that a cross-sectional shape may become L shape with the 1st front surface part 41a. By providing the partition plate 50 in this manner, the circuit element 30 can be arranged in a state in which the four directions of up, down, left, and right are surrounded by the partition plate 50, the first front surface portion 41a, the first side surface portion 41b, and the bottom portion 41c. 40.

  The partition plate 50 may have a light shielding property. As a result, light traveling from the light emitting element 20 to the partition plate 50 side is shielded by the partition plate 50. Therefore, the light transmittance of the partition plate 50 should be low. In this case, the partition plate 50 is opaque and may block light completely, but a slight amount of light may pass through the partition plate 50. That is, the fact that the partition plate 50 has a light shielding property includes not only the case where all the light is absorbed or reflected by the partition plate 50 but also the case where the partition plate 50 transmits light.

  In the present embodiment, the partition plate 50 is a part of the first housing 41. That is, the partition plate 50 is formed integrally with the first housing 41. Therefore, the partition plate 50 is made of the same white insulating resin material as the first housing 41 and has light reflectivity. As a result, the light traveling from the light emitting element 20 to the partition plate 50 side is reflected by the partition plate 50 and then emitted from the second housing 42 to the outside.

  In the present embodiment, the partition plate 50 is made of a resin material. However, the present invention is not limited to this, and the partition plate 50 may be a metal plate. Moreover, although the partition plate 50 is a part of the first housing 41, the present invention is not limited to this, and the partition plate 50 and the first housing 41 may be separate. In this case, the partition plate 50 may be fixed to the first housing 41, for example, but is not limited thereto.

[End cover]
The end cover (end cover) 60 is an end cap that covers an end of the casing 40 in the longitudinal direction. In the present embodiment, the end cover 60 is attached to each of both ends in the longitudinal direction of the housing 40. At least one of the two end covers 60 is provided with an insertion hole through which the electric wire 70 is inserted. When connecting a plurality of lighting devices 1, the other end cover 60 is provided with an insertion hole through which the power supply line is inserted.

  The end cover 60 is fixed to the housing 40 by, for example, an adhesive, a screw, or a claw structure. The end cover 60 is a resin molded product made of a resin material such as polybutylene terephthalate, but may be made of a metal material.

[Effects]
As described above, the lighting device 1 according to the present embodiment includes the long substrate 10, the plurality of light emitting elements 20 arranged on the substrate 10 along the longitudinal direction of the substrate 10, and the row of the light emitting elements 20. A plurality of circuit elements 30 arranged in parallel with each other, a housing 40 having a light-shielding portion covering the plurality of circuit elements 30 and a light-transmitting portion covering the plurality of light-emitting elements 20, a row of the light-emitting elements 20, and the circuit elements 30 A partition plate 50 is provided between the columns and extends along the longitudinal direction of the substrate 10.

  As described above, in the lighting device 1, since the plurality of circuit elements 30 are arranged in parallel in the row of the light emitting elements 20, the height of the housing 40 that houses the light emitting elements 20 and the circuit elements 30 can be reduced. Thereby, the elongate and thin illuminating device 1 is realizable.

  In addition, a partition plate 50 is disposed between the row of light emitting elements 20 and the row of circuit elements 30. Thereby, even if the row | line | column of the circuit element 30 and the row | line | column of the light emitting element 20 are paralleled, about the light which progresses to the partition plate 50 side among the lights radiate | emitted from the light emitting element 20, along the longitudinal direction of the board | substrate 10. The extended partition plate 50 is uniformly shielded from light. As a result, it can be avoided that the line-shaped illumination light emitted from the plurality of light-emitting elements 20 is partially blocked by the circuit element 30 and a part of the line-shaped illumination light is lost. It can suppress that a characteristic deteriorates.

  As described above, according to the present embodiment, it is possible to easily provide a thin and long illumination device 1 that can obtain a desired light distribution characteristic by avoiding the shadow caused by the circuit element 30 in the illumination light. Can be realized. For example, the illuminating device 1 which irradiates uniform linear illumination light can be obtained.

  Moreover, according to the illuminating device 1 in this Embodiment, an illumination space without a noise can be produced and there exists an outstanding effect as indirect illumination. This point will be described in detail below in comparison with a conventional lighting device. FIG. 5A is a diagram illustrating an installation example of the conventional lighting device 100, and FIG. 5B is a diagram illustrating an installation example of the lighting device 1 according to the embodiment. In FIGS. 5A and 5B, the numerical value is an example.

  5A and 5B, the illumination devices 100 and 1 as indirect illumination are used as cove illumination that reflects light to the ceiling.

  In this case, as shown in FIG. 5A, since the height of the casing is relatively high in the conventional lighting device 100, in order to make the lighting device 100 invisible to the user, the architectural structure in which the lighting device 100 is installed is used. It is necessary to provide the curtain 200. For this reason, the user gets a heavy impression due to the presence of the curtain 200.

  On the other hand, as shown in FIG. 5B, the lighting device 1 according to the present embodiment is thin, and therefore it is not necessary to provide a curtain plate in the building structure where the lighting device 1 is installed. Thereby, it is possible to reduce a user's heavy impression due to the presence of the curtain, and it is possible to realize an architectural work with a clean impression.

  6A is a diagram illustrating another installation example of the conventional lighting device 100, and FIG. 6B is a diagram illustrating another installation example of the lighting device 1 according to the embodiment. 6A and 6B, the numerical value is an example.

  In FIG. 6A and FIG. 6B, the illuminating devices 100 and 1 as indirect illumination are used as cornice illumination which reflects light on a wall surface.

  Also in this case, as shown in FIG. 6A, since the casing of the conventional lighting device 100 is relatively high, it is necessary to provide a curtain plate 200 in the building construction in order to make the lighting device 100 invisible to the user. There is. For this reason, the opening dimension of the recessed part of the installation location of the illuminating device 100 becomes large.

  On the other hand, as shown in FIG. 6B, the lighting device 1 according to the present embodiment is thin, so that it is not necessary to provide a curtain on the building structure where the lighting device 1 is installed. Thereby, since the opening dimension of the recessed part of the installation location of the illuminating device 1 can be made small and slim, it can implement | achieve the architectural work of the neat impression.

  Moreover, FIG. 7 is a figure which shows another example of installation of the illuminating device 100A of a comparative example, and the illuminating device 1 which concerns on embodiment. In FIG. 7, the numerical value is an example.

  Although a comparatively thin lighting fixture having a height of about 35 mm has been studied like the lighting device 100A of the comparative example shown in FIG. 7, the lighting device 100A of the comparative example is 1.6 m from the wall. The lighting device 100A can be seen at a position (position at an elevation angle of 21 °).

  On the other hand, in the lighting device 1 according to the present embodiment, the lighting device 1 can be thinned to a height of about 15 mm. . That is, the illumination device 1 cannot be seen within 4 m from the wall.

  Thus, according to the illuminating device 1 in this Embodiment, it is very excellent in the accommodation dimension with respect to a building construction. The above numerical values are calculated assuming that the ceiling height is 2.4 m and the height of the user is 1.8 m.

  Moreover, since the illuminating device 1 in this Embodiment is thin, even if it installs on an exposed beam or on partition furniture, it is hard to see, and even if it sees temporarily, it is not conspicuous. At least the user can hardly see the light emitting element 20 (light emitting unit) of the lighting device 1. Thus, according to the illuminating device 1 in this Embodiment, an architectural work is unnecessary and it can also construct simply by mounting on a beam etc.

  Furthermore, since the lighting device 1 according to the present embodiment is thin, it can be incorporated into a thin shelf. That is, generally, a shelf plate with a thickness of 15 mm is the mainstream, but the lighting device 1 according to the present embodiment can be thinned to a height of about 15 mm, so the thickness is 15 mm. Even if it is plate | board thickness, the illuminating device 1 can be integrated in a shelf board. Thereby, the lighting apparatus built-in type shelf board which makes the surface of a shelf board and the upper surface of the housing | casing 40 the same surface is realizable.

  As described above, according to the lighting device 1 in the present embodiment, it can be installed in a building structure without presence, and an illumination space without noise can be produced.

  Moreover, in the lighting device 1 according to the present embodiment, the housing 40 includes a first housing 41 that includes a light shielding portion and a second housing 42 that includes a light transmitting portion.

  In this way, by configuring the housing 40 with two members, the first housing 41 and the second housing 42, a light transmitting portion that transmits light of the light emitting element 20 and a light shielding portion that hides the circuit element 30 are provided. Can be easily formed on the housing 40.

  In the lighting device 1 according to the present embodiment, the partition plate 50 is a part of the first housing 41.

  Thereby, the partition plate 50 can be simultaneously formed when the light-shielding first housing 41 is formed. Moreover, by providing the partition plate 50 in the housing 40, the partition plate 50 functions as a reinforcing plate for the housing 40, and the strength of the long housing 40 can be improved. Thereby, it can reduce that the housing | casing 40 bends.

  In the lighting device 1 according to the present embodiment, the first housing 41 has a first front surface portion 41 a that faces the plurality of circuit elements 30, and the partition plate 50 extends from the first front surface portion 41 a to the substrate 10. It is formed so as to protrude.

  Thereby, the light which goes to the circuit element 30 from the light emitting element 20 can be effectively shielded by the partition plate 50.

  In the present embodiment, the tip of the partition plate 50 is not in contact with the surface of the substrate 10, and a gap exists between the tip of the partition plate 50 and the substrate 10.

  Accordingly, the substrate 10 can be easily slid into the housing 40 by preventing the tip of the partition plate 50 from coming into contact with the surface of the substrate 10 while the tip of the partition plate 50 faces the substrate 10. Can be inserted.

  In the lighting device 1 according to the present embodiment, the second housing 42 has a second front surface portion 42 a having an outer surface that is substantially flush with the outer surface of the first front surface portion 41 a of the first housing 41.

  Thereby, since the outer surface of the front part of the 1st housing | casing 41 and the 2nd housing | casing 42 can be flush | level and can arrange height, the thin and long illuminating device 1 excellent in the design property is implement | achieved. it can.

  Moreover, in the illuminating device 1 in this Embodiment, the 1st housing | casing 41 has the bottom part 41c as a board | substrate mounting part in which the board | substrate 10 is mounted.

  Thereby, the circuit element 30 can be accommodated by the first casing 41 and the substrate 10 on which the light emitting element 20 is arranged can be supported.

  Further, in the lighting device 1 according to the present embodiment, the housing 40 has the first groove portion 40a into which one end portion in the width direction of the substrate 10 is inserted and the other end portion in the width direction of the substrate 10 inserted therein. Second groove portion 40b.

  Thereby, the board | substrate 10 can be hold | maintained in the housing | casing 40 by the 1st groove part 40a and the 2nd groove part 40b.

  Moreover, in the illuminating device 1 in this Embodiment, the 1st groove part 40a and the 2nd groove part 40b hold | maintain the board | substrate 10 so that a slide movement is possible.

  Thereby, the both ends of the board | substrate 10 can be inserted in the 1st groove part 40a and the 2nd groove part 40b, and the board | substrate 10 can be slid along the 1st groove part 40a and the 2nd groove part 40b. Therefore, the substrate 10 on which the light emitting element 20 and the circuit element 30 are mounted can be easily accommodated in the housing 40.

  Moreover, in the illuminating device 1 in this Embodiment, the partition plate 50 has light reflectivity.

  As a result, the light traveling from the light emitting element 20 toward the circuit element 30 can be reflected by the partition plate 50 and emitted from the second housing 42 to the outside. Therefore, since the light extraction efficiency can be improved, the illuminating device 1 that irradiates the illumination light with a high luminous flux can be easily realized while suppressing the deterioration of the light distribution characteristics due to the circuit elements.

  Moreover, in the illuminating device 1 in this Embodiment, the AC direct system is employ | adopted, the some circuit element 30 contains the rectifier which rectifies | straightens alternating voltage and converts it into direct current | flow rectified voltage, and several light emitting elements 20 emits light according to this rectified voltage.

  Thereby, since a power supply circuit can be comprised without using a comparatively tall coil element, the illuminating device 1 can be reduced in thickness easily.

  In the illumination device 1 according to the present embodiment, the plurality of circuit elements 30 are arranged on the substrate 10.

  Thereby, since the some light emitting element 20 and the some circuit element 30 can be arrange | positioned on the same board | substrate 10, a small light source module with a power supply circuit is realizable at low cost.

  In the lighting device 1 according to the present embodiment, the substrate 10 is provided with a connector 11 that receives power for causing the plurality of light emitting elements 20 to emit light. The connector 11 is arranged in the same row as the plurality of circuit elements 30. Is arranged in. That is, the connector 11 is arranged in the circuit area.

  Thereby, not only the shadow by the circuit element 30 but the influence by the shadow by the connector 11 can also be suppressed.

  Moreover, the illuminating device 1 in this Embodiment is further provided with the attachment member 3 for attaching the illuminating device 1 to a construction material, and the attachment member 3 is two side surfaces along the longitudinal direction of the housing | casing 40. As shown in FIG. It arrange | positions at the side surface by the side of the some circuit element 30 of them.

  By arranging the attachment member 3 on the side of the housing 40 in this way, the entire lighting device 1 can be thinned even if the attachment member 3 is included.

  Moreover, in the illuminating device 1 in this Embodiment, the board | substrate 10 is linear.

  Thereby, the illuminating device 1 which emits linear uniform light is realizable.

(Modification 1)
Next, an illuminating device 1A according to Modification 1 will be described with reference to FIG. FIG. 8 is a cross-sectional view showing a configuration of an illuminating device 1A according to Modification 1.

  In the illuminating device 1 according to the above embodiment, the partition plate 50 is provided so as to be substantially perpendicular to the substrate 10. However, in the illuminating device 1A according to this modification, as illustrated in FIG. 50 </ b> A is provided to be inclined with respect to the substrate 10. Other than that, it is the structure similar to the illuminating device 1 in the said embodiment.

  Thus, in 1 A of illuminating devices in this modification, 50 A of partition plates incline with respect to the board | substrate 10. As shown in FIG.

  Thereby, the light which goes to the circuit element 30 from the light emitting element 20 can be reflected diagonally upward by the partition plate 50A. Thereby, the light extraction efficiency can be improved.

  In addition, by inclining the partition plate 50A, the circuit area (mounting area of the circuit element 30) of the substrate 10 can be expanded without increasing the size (substrate area) of the substrate 10. Thereby, the freedom degree of the layout of the circuit element 30 and metal wiring in the board | substrate 10 can be enlarged.

  Further, by inclining the partition plate 50A, it is possible to prevent erroneous insertion of the substrate 10 when the substrate 10 (module) on which the light emitting element 20 and the circuit element 30 are mounted is inserted into the housing 40. That is, even if the board 10 is to be inserted into the casing 40 in the opposite direction, the board 10 cannot be inserted into the casing 40 when the circuit element 30 hits the inclined partition plate 50. Thereby, it can be noticed that the board 10 is erroneously inserted in the opposite direction. Therefore, erroneous insertion of the substrate 10 into the housing 40 can be prevented.

(Modification 2)
Next, the illuminating device 1B which concerns on the modification 2 is demonstrated using FIG. FIG. 9 is a cross-sectional view illustrating a configuration of a lighting device 1B according to the second modification.

  In the lighting device 1B in the present modification, a heat radiating plate 80 is further disposed between the bottom 41c (substrate mounting portion) of the first housing 41 and the substrate 10, compared to the lighting device 1 in the above embodiment. ing. That is, in the lighting device 1 in the above embodiment, the substrate 10 is directly placed on the bottom 41c so as to be in contact with the bottom 41c, whereas in the present modification, the substrate 10 is interposed via the heat dissipation plate 80. And is placed on the bottom 41c.

  The heat sink 80 is a metal plate or a metal sheet made of a metal material such as aluminum. Moreover, as the heat sink 80, the thing of the same size as the board | substrate 10, for example can be used. That is, as the heat radiating plate 80, a rectangular plate having the same width and length as the width and length of the substrate 10 can be used.

  In this modification, the heat radiating plate 80 is fixed to the back surface of the substrate 10 with screws 90. Thereby, when the board | substrate 10 is inserted in the housing | casing 40, the heat sink 80 can also be inserted in the housing | casing 40. FIG.

  Further, in the present modification, a concave groove 41c1 is formed in the bottom portion 41c so that screw feet of screws 90 for screwing the heat radiating plate 80 and the substrate 10 may protrude from the heat radiating plate 80. That is, the concave groove 41c1 is a recess formed so that the screw foot of the screw 90 protruding from the heat radiating plate 80 does not come into contact with the bottom portion 41c1, and is formed so as to release the screw foot of the screw 90 protruding from the heat radiating plate 80. ing. The recessed groove 41c1 can be formed in a rail shape from one end in the longitudinal direction of the housing 40 to the other end, for example. As a result, when the substrate 10 to which the heat sink 80 is fixed by the screw 90 is inserted and slid and moved into the housing 40, the screw 10 protruding from the heat sink 80 is released to the concave groove 41c1 while the substrate 10 is moved. Can slide.

  As described above, the lighting device 1B according to the present modification further includes the heat radiating plate 80 disposed between the bottom 41c serving as the substrate mounting portion and the substrate 10 with respect to the lighting device 1 according to the above embodiment. .

  Thereby, the heat generated in the light emitting element 20 disposed on the substrate 10 can be efficiently drawn by the heat radiating plate 80 and radiated. Further, the heat generated by the heat generating components included in the plurality of circuit elements 30 arranged on the substrate 10 can also be efficiently radiated by the heat sink 80. The heat generating component of the circuit element 30 is a semiconductor component such as an IC, for example. Thus, by disposing the heat radiating plate 80 between the bottom 41c and the substrate 10, the lighting device 1B having excellent heat dissipation can be realized.

  In addition, in this modification, although the heat sink 80 was arrange | positioned as a heat radiating member so that the whole back surface of the board | substrate 10 might be covered, it is not restricted to this. For example, a heat radiating member such as a heat radiating plate may be disposed only directly under and immediately under the light emitting element 20 or only directly under and immediately under the heat generating component in the plurality of circuit elements 30.

  Moreover, in this modification, although the metal material was used as a heat radiating member, it is not restricted to this. As the heat radiating member, a heat conductive sheet made of a material other than a metal material such as a resin material may be used as long as it has a high thermal conductivity. In particular, when a metal member is used as the heat radiating plate 80, an insulating sheet may be inserted between the heat radiating plate 80 and the substrate 10 in order to ensure the withstand voltage of the substrate 10. In this case, the insulating sheet has a thermal conductivity. It is preferable to use a highly insulating heat conductive sheet.

  Moreover, in this modification, the board | substrate 10 and the heat sink 80 were screwed with the screw 90, However, It is not restricted to this. That is, the substrate 10 and the heat radiating plate 80 may be fixed with an adhesive or the like without using the screw 90. Furthermore, the board | substrate 10 and the heat sink 80 do not need to be fixed.

(Other variations)
As mentioned above, although the illuminating device which concerns on this invention was demonstrated based on embodiment, this invention is not limited to the said embodiment.

  For example, in the above-described embodiment, the LED module is an SMD type using an SMD type LED element as the light emitting element 20, but is not limited to this, and may be a COB type. In this case, an LED chip (bare chip) may be used as the light emitting element 20, a plurality of LED chips may be arranged on the substrate 10, and the plurality of LED chips may be collectively sealed with a line-shaped sealing member.

  Moreover, in the said embodiment, although the light emitting element 20 was LED, it is not restricted to this. For example. As the light emitting element 20, you may use other solid light emitting elements, such as a semiconductor laser or organic EL (Electro Luminescence).

  Moreover, in the said embodiment, although the light emitting element 20 was driven with the power supply circuit by an AC direct system, it is not restricted to this. For example, the light emitting element 20 may be driven by a power supply circuit including a switching power supply including a coil element such as a choke coil or a choke transformer.

  In the above embodiment, a multilayer substrate in which a plurality of conductive layers (wiring layers) are stacked with an insulating layer interposed therebetween may be used as the substrate 10. Thereby, since the metal wiring of the board | substrate 10 can be divided and formed in several different wiring layers, size reduction and thickness reduction of the illuminating device 1 can be implement | achieved easily. Further, since heat generated in the light emitting element 20 and the circuit element 30 can be efficiently radiated using the wiring layer of the multilayer substrate, desired heat radiation can be achieved without using the heat radiating plate 80 as in the third embodiment. Characteristics can be obtained. Therefore, it is possible to easily realize the thin lighting device 1 while having excellent heat dissipation.

  In addition, any combination of the components and functions in the embodiment and the modification can be arbitrarily combined without departing from the gist of the present invention, and the form obtained by making various modifications conceived by those skilled in the art with respect to the embodiment and the modification. The embodiment realized by the above is also included in the present invention.

DESCRIPTION OF SYMBOLS 1, 1A, 1B Lighting device 3 Mounting member 10 Board | substrate 11 Connector 20 Light emitting element 30 Circuit element 40 Case 40a 1st groove part 40b 2nd groove part 41 1st housing | casing 41a 1st front part 41c Bottom part (board | substrate mounting part)
42 2nd housing | casing 42a 2nd front part 50, 50A Partition plate 80 Heat sink

Claims (19)

A long substrate;
A plurality of light emitting elements arranged on the substrate along a longitudinal direction of the substrate;
A plurality of circuit elements arranged in parallel with the row of light emitting elements;
A housing having a light-shielding portion that covers the plurality of circuit elements and a light-transmitting portion that covers the plurality of light-emitting elements;
A partition plate located between the row of light emitting elements and the row of circuit elements and extending along the longitudinal direction of the substrate;
Lighting device. The casing is constituted by a first casing including the light shielding portion and a second casing including the light transmitting portion.
The lighting device according to claim 1. The partition plate is a part of the first housing.
The lighting device according to claim 2. The first housing has a first front face portion facing the plurality of circuit elements,
The partition plate is formed so as to protrude from the first front surface portion toward the substrate.
The lighting device according to claim 3. There is a gap between the tip of the partition plate and the substrate.
The lighting device according to claim 4. The second housing has a second front surface portion having an outer surface that is substantially flush with the outer surface of the first front surface portion.
The illuminating device of any one of Claims 2-5. The first housing has a substrate placement portion on which the substrate is placed.
The illumination device according to any one of claims 2 to 6. Furthermore, a heat sink disposed between the substrate mounting portion and the substrate is provided.
The illuminating device of any one of Claims 1-7. The plurality of circuit elements include at least a heat generating component,
Furthermore, a heat dissipating member is provided only directly below and around the heat generating component.
The illuminating device of any one of Claims 1-7. The housing includes a first groove portion into which one end portion in the width direction of the substrate is inserted, and a second groove portion into which the other end portion in the width direction of the substrate is inserted.
The illuminating device of any one of Claims 1-9. The first groove portion and the second groove portion hold the substrate in a slidable manner,
The lighting device according to claim 10. The partition plate has light reflectivity,
The illuminating device of any one of Claims 1-11. The partition plate is inclined with respect to the substrate;
The illuminating device of any one of Claims 1-12. The plurality of circuit elements include a rectifying element that rectifies an AC voltage and converts it into a DC rectified voltage,
The plurality of light emitting elements emit light according to the rectified voltage.
The lighting device according to claim 1. The plurality of circuit elements are disposed on the substrate,
The illuminating device of any one of Claims 1-14. On the substrate, a connector for receiving power for causing the plurality of light emitting elements to emit light is disposed,
The connector is arranged in the same row as the plurality of circuit elements,
The illuminating device of any one of Claims 1-15. Furthermore, an attachment member for attaching the lighting device to a construction material is provided,
The mounting member is disposed on a side surface on the circuit element side of the two side surfaces along the longitudinal direction of the housing.
The illuminating device of any one of Claims 1-16. The substrate is linear.
The illuminating device of any one of Claims 1-17. The substrate is a multilayer substrate;
The lighting device according to any one of claims 1 to 18.

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