JP2018098126A - Light emitting device and luminaire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device and the like capable of radiating light of all light distribution in which flicker and a shadow by a circuit element is suppressed.SOLUTION: A light emitting device includes: a long substrate 110; a plurality of light emitting elements 120 arrayed on the substrate 110 along the longer direction of the substrate 110; and a plurality of circuit elements 130 arrayed in parallel with the row of the plurality of light emitting elements 120. The plurality of circuit elements 130 include a tall first circuit element 131 whose height from the substrate 110 is equal to or higher than 5 mm. The first circuit element 131 is arranged in the lateral position in the substrate width direction in a region between the two adjacent light emitting elements 120 out of the plurality of light emitting elements 120.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a light emitting device and a lighting device including the same.

  2. Description of the Related Art In recent years, lighting devices (LED lighting) using LEDs (Light Emitting Diodes) are rapidly spreading from the viewpoint of energy saving. Conventionally, as this type of LED illumination, a long and thin lighting device including a long housing and a light-emitting device disposed in the housing is known (for example, Patent Document 1).

JP 2012-84367 A

  As a light emitting device incorporated in an illumination device, an LED module including a substrate and an LED element mounted on the substrate is known.

  As this type of light-emitting device, a power-integrated light-emitting device in which a light-emitting element such as an LED element and a circuit element that constitutes a power supply circuit that generates power for causing the light-emitting element to be mounted are mounted on the same substrate has been studied. ing.

  In order to suppress flicker, when using such a power supply integrated light emitting device to realize a long and thin lighting device that suppresses flicker due to frequency and emits light of all light distribution, Large parts (such as electrolytic capacitors) are required as circuit elements constituting the power supply circuit. However, in this case, when a large component is mounted on the substrate, there is a problem that a shadow is generated in the light emitted from the light emitting element by the large component.

  On the other hand, in order to suppress the occurrence of shadows when realizing a long and thin lighting device that irradiates light of all light distribution without using a light emitting device integrated with a power supply, It is necessary to avoid the use of large parts such as electrolytic capacitors as circuit elements constituting the power supply circuit. For this reason, there is a problem that flicker cannot be appropriately suppressed and the quality of light emitted from the light emitting device is deteriorated.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a light-emitting device and an illumination device that can irradiate light with a total light distribution in which shadows caused by flicker and circuit elements are suppressed. .

  In order to achieve the above object, one embodiment of a light-emitting device according to the present invention includes a long substrate, a plurality of light-emitting elements arranged on the substrate along a longitudinal direction of the substrate, and the plurality of light-emitting devices. A plurality of circuit elements arranged in parallel with a row of elements, wherein the plurality of circuit elements include a first circuit element having a height of 5 mm or more from the substrate, and the first circuit element comprises: It arrange | positions in the position of the side of the board | substrate width direction of the area | region between two adjacent light emitting elements among these light emitting elements.

  Another embodiment of the lighting device according to the present invention is a lighting device including the light-emitting device.

  A light-emitting device and a lighting device that can irradiate light with a total light distribution in which shadows caused by flicker and circuit elements are suppressed can be realized.

1 is a perspective view showing an external appearance of a lighting device according to Embodiment 1. FIG. 1 is a sectional view of a lighting device according to Embodiment 1. FIG. 3 is a plan view of the LED module according to Embodiment 1. FIG. 3 is an enlarged plan view of the LED module according to Embodiment 1. FIG. FIG. 3 is a diagram showing a luminance distribution of the LED module according to Embodiment 1. 6 is a plan view schematically showing a configuration of an LED module according to Embodiment 2. FIG. It is a figure which shows the luminance distribution of the LED module which concerns on Embodiment 2. FIG. 6 is a plan view schematically showing a configuration of an LED module according to Embodiment 3. FIG. 6 is a diagram illustrating a luminance distribution of an LED module according to Embodiment 3. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each of the embodiments described below shows a preferred specific example of the present invention. Therefore, numerical values, shapes, materials, components, component positions, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily shown strictly. In each figure, substantially the same configuration is denoted by the same reference numeral, and redundant description may be omitted or simplified.

  In the present specification and drawings, the X axis, the Y axis, and the Z axis represent the three axes of the three-dimensional orthogonal coordinate system. In the present embodiment, the Z axis direction is the vertical direction and the Z axis is perpendicular to the Z axis. This direction (the direction parallel to the XY plane) is the horizontal direction. The X axis and the Y axis are orthogonal to each other, and both are orthogonal to the Z axis.

(Embodiment 1)
First, the whole structure of the illuminating device 1 which concerns on Embodiment 1 is demonstrated using FIG.1 and FIG.2. FIG. 1 is a perspective view showing an appearance of lighting apparatus 1 according to Embodiment 1. FIG. FIG. 2 is a cross-sectional view of the illumination device 1. 2 is a cross-sectional view taken along line II-II in FIG. 3 to be described later.

  The lighting device 1 is installed, for example, in a living room or bedroom of a house and used as indirect lighting such as cove lighting or cornice lighting, or installed in a kitchen or the like and used as kitchen lighting or the like. In addition, you may use the illuminating device 1 as main illuminations, such as a base light installed in a ceiling etc. instead of indirect illumination.

  As shown in FIG. 1, the illuminating device 1 is a thin and long illuminating device (slim line illumination) as a whole, and emits line-shaped illumination light. Although the whole shape of the illuminating device 1 in this Embodiment is a flat substantially rectangular parallelepiped, it is not restricted to this. As an example, the lighting device 1 has a height H of about 15 mm, a width W of about 37.5 mm, and a total length of about 300 mm, but is not limited thereto. For example, the total length of the lighting device 1 may be about 600 mm, about 1500 mm, or the like. In addition, the aspect ratio (W / H) of the illumination device 1 when viewed from the side along the Y-axis direction is about 1 or more and 4 or less.

  As shown in FIGS. 1 and 2, the lighting device 1 according to the present embodiment includes an LED module 100, a housing 200, and a cover 300.

  Hereafter, each structural member of the illuminating device 1 in this Embodiment is demonstrated in detail using FIG.3 and FIG.4, referring FIG.1 and FIG.2. FIG. 3 is a plan view of the LED module 100 according to the first embodiment. FIG. 4 is an enlarged plan view of the LED module 100.

[LED module]
The LED module 100 is an example of a light emitting device, and emits white light, for example. As shown in FIG. 2, the LED module 100 is housed in a housing 200. The light of the LED module 100 passes through the cover 300 and is emitted to the outside.

  As shown in FIGS. 2 and 3, the LED module 100 includes a substrate 110, a light emitting element 120, and a circuit element 130.

[substrate]
As shown in FIGS. 2 and 3, the substrate 110 is a long plate member. In the present embodiment, the substrate 110 is a long rectangular substrate. That is, the planar view shape of the substrate 110 is an elongated rectangle. As an example, the substrate 110 has a long side length L1 of about 286 mm, a short side L2 of about 34 mm, and a thickness t1 of 1.0 mm, but is not limited thereto. Further, the shape of the substrate 110 in plan view is not limited to a rectangular shape, and may be a curved shape or the like. The substrate 110 is placed on the bottom of the housing 200.

  The substrate 110 is, for example, a resin substrate based on resin, a ceramic substrate made of ceramic, or a metal base substrate based on metal.

  As the resin substrate, for example, a glass epoxy substrate (CEM-3, FR-4, etc.) made of glass fiber and epoxy resin, or a substrate (FR-1 etc.) made of paper phenol or paper epoxy is used. it can. As the ceramic substrate, an alumina substrate made of alumina, an aluminum nitride substrate made of aluminum nitride, or the like can be used. As the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate or the like whose surface is coated with an insulating film can be used. The substrate 110 is not limited to a rigid substrate, and may be a flexible flexible substrate made of polyimide or the like.

  A light emitting element 120 is disposed on the substrate 110. In the present embodiment, not only the light emitting element 120 but also the circuit element 130 is arranged on the substrate 110. That is, the light emitting element 120 and the circuit element 130 are arranged on the same substrate 110.

  The substrate 110 is a printed board on which metal wiring is formed. For example, the metal wiring is formed in a pattern having a predetermined shape on one main surface of the substrate 110. The metal wiring is formed as a wiring pattern for electrically connecting a plurality of light emitting elements 120, connecting a plurality of circuit elements 130, or electrically connecting the light emitting elements 120 and the circuit elements 130. ing.

  In the present embodiment, a FR-4 double-sided substrate is used as the substrate 110. That is, as the substrate 110, a resin substrate having metal films (copper foil or the like) formed on both main surfaces is used. The metal film on one surface of the substrate 110 is formed in a predetermined shape as a metal wiring.

  In addition, a pair of connectors 140 that receive power for causing the light emitting elements 120 to emit light are disposed on the substrate 110. The pair of connectors 140 are electrically connected to the plurality of circuit elements 130 by metal wiring formed on the substrate 110, and the power received by the pair of connectors 140 is supplied to the circuit elements 130. In the present embodiment, the pair of connectors 140 is electrically connected to an external commercial power source via an electric wire 400 (see FIG. 1) such as a VVF cable, and the pair of connectors 140 includes commercial AC power. Is supplied.

[Light emitting element]
The plurality of light emitting elements 120 are light emitting units that serve as light sources of the LED module 100 and the lighting device 1. In the present embodiment, the plurality of light emitting elements 120 are arranged in a straight line shape (linear shape), but are not limited thereto, and may be arranged in a line shape such as a curved shape or a wave shape. The plurality of light emitting elements 120 arranged in a line function as a line light source that emits light along the line.

  As shown in FIG. 3, the plurality of light emitting elements 120 are arranged on the substrate 110 along the longitudinal direction (Y-axis direction) of the substrate 110. Specifically, all the light emitting elements 120 on the substrate 110 are mounted on the substrate 110 in a straight line along the longitudinal direction of the substrate 110 so as to pass through the center of the substrate 110 in the width direction (X-axis direction). Has been. The plurality of light emitting elements 120 being arranged along the longitudinal direction of the substrate 110 is not limited to the case where the row of the plurality of light emitting elements 120 is parallel to the long side of the substrate 110. It means that they are arranged from one end of the direction toward the other end.

  The plurality of light emitting elements 120 are arranged at equal intervals (equal pitch). That is, the center distance between two adjacent light emitting elements 120 is constant. As shown in FIG. 4, in the present embodiment, the center interval (pitch P1) between two adjacent light emitting elements 120 is 18 mm, but is not limited thereto. Further, the plurality of light emitting elements 120 are not limited to being arranged at equal intervals.

  Each light emitting element 120 is an SMD type LED element in which an LED chip is packaged, and is a resin or ceramic white container having a recess and one or more LED chips primarily mounted on the bottom surface of the recess of the container. And a sealing member enclosed in the recess of the container. The sealing member is made of a translucent resin material such as silicone resin. The sealing member may be a phosphor-containing resin containing a wavelength conversion material such as a phosphor.

  The LED chip is an example of a semiconductor light emitting element that emits light with a predetermined DC power, and is a bare chip that emits monochromatic visible light. The LED chip is, for example, a blue LED chip that emits blue light when energized. In this case, in order to obtain white light, the sealing member contains a yellow phosphor such as YAG (yttrium, aluminum, garnet) that emits fluorescence using blue light from the blue LED chip as excitation light.

  As described above, the light emitting element 120 in the present embodiment is a BY type white LED light source including the blue LED chip and the yellow phosphor. Specifically, the yellow phosphor absorbs a part of the blue light emitted from the blue LED chip and is excited to emit yellow light, and the yellow light and the blue light not absorbed by the yellow phosphor are mixed. White light.

  The plurality of light emitting elements 120 emit light by direct current power supplied from the circuit elements 130 constituting the power supply circuit. Note that the connection mode of the plurality of light emitting elements 120 (series connection, parallel connection, combination connection of series connection and parallel connection, and the like) is not particularly limited.

[Circuit elements]
The plurality of circuit elements 130 include electronic components (circuit parts) that constitute a power supply circuit that generates power for causing at least the plurality of light emitting elements 120 to emit light. That is, the plurality of circuit elements 130 include power supply circuit elements that constitute a power supply circuit.

  In the present embodiment, since the LED module 100 is driven by the AC direct method, the plurality of circuit elements 130 configuring the power supply circuit cause the light emitting element 120 to emit the AC power supplied to the connector 140. Convert to DC power. Therefore, the plurality of circuit elements 130 include a rectifying element that rectifies an AC voltage and converts it into a DC rectified voltage, and the plurality of light emitting elements 120 emit light according to the rectified voltage. The DC power generated by the plurality of circuit elements 130 constituting the power supply circuit is supplied to each of the plurality of light emitting elements 120 via the metal wiring formed on the substrate 110.

  Since the power supply circuit in the present embodiment generates DC power that does not cause flicker, the circuit element 130 includes at least an electrolytic capacitor. The plurality of circuit elements 130 constituting the power supply circuit include, for example, a ceramic capacitor, a resistor element such as a resistor, a rectifier element, a noise filter, a diode, or a semiconductor element such as an integrated circuit element in addition to the electrolytic capacitor. It may be.

  The plurality of circuit elements 130 may include elements that do not constitute a power supply circuit. For example, the plurality of circuit elements 130 may include a control circuit element for controlling the light emission state of the light emitting element 120 or a communication circuit element for performing communication with other devices.

  As shown in FIGS. 2 and 3, the plurality of circuit elements 130 are arranged along the longitudinal direction of the substrate 110. In the present embodiment, the plurality of circuit elements 130 and the plurality of light emitting elements 120 are mounted on the same surface of the substrate 110.

  In addition, the plurality of circuit elements 130 are arranged in parallel with a row (element row) of the plurality of light emitting elements 120. That is, the plurality of circuit elements 130 are arranged side by side with the plurality of light emitting elements 120.

  The plurality of circuit elements 130 includes a tall first circuit element 131 (a tall component) having a height of 5 mm or more from the substrate 110 and a short second circuit having a height from the substrate 110 of less than 5 mm. Element 132 (low profile component). In the present embodiment, a plurality of first circuit elements 131 and second circuit elements 132 are mounted. Specifically, eight first circuit elements 131 are mounted. The eight first circuit elements 131 are mounted in a straight line.

  The first circuit element 131 is, for example, an electrolytic capacitor, but the first circuit element 131 may be a choke coil or a transformer. Further, many electronic components with leads having leads penetrating the substrate 110 are relatively tall, and many of them can be the first circuit elements 131.

  The second circuit element 132 is, for example, a resistance element, a rectifying element, or a small semiconductor element. Many surface-mounted electronic components mounted on the surface of the substrate 110 are relatively short, and many of them can be the second circuit element 132.

  The first circuit element 131 and the second circuit element 132 are each divided into predetermined regions of the substrate 110 and arranged.

  As shown in FIG. 3, the tall first circuit element 131 is disposed in the high-profile region 131 a of the substrate 110. The high-profile region 131a is a region in the vicinity of the long side of the substrate 110, and is a linear region having a substantially constant width extending from one end in the longitudinal direction of the substrate 110 to the other end. As shown in FIG. 4, in the present embodiment, the distance d1 between the center of the first circuit element 131 and the long side of the substrate 110 is 6.5 mm.

  The plurality of first circuit elements 131 are disposed near the ends in the longitudinal direction of the substrate 110 in the high-profile region 131a. In the present embodiment, the plurality of first circuit elements 131 are arranged in half near each end of the substrate 110 in the longitudinal direction. Specifically, four first circuit elements 131 out of the eight first circuit elements 131 are arranged as one group near one end in the longitudinal direction of the substrate 110, and the remaining four first circuit elements 131 are arranged. The circuit elements are arranged as a group near the other end in the longitudinal direction of the substrate 110.

  Each of the four first circuit elements 131 is arranged at equal intervals (equal pitch). That is, in each group including four first circuit elements 131 as one group, the center distance between two adjacent first circuit elements 131 is constant. In the present embodiment, the interval between each of the four first circuit elements 131 and the interval between the plurality of light emitting elements 120 are the same. Specifically, as shown in FIG. 4, the center interval (pitch P2) between two adjacent first circuit elements 131 is the same as the center interval (pitch P1) between two adjacent light emitting elements 120, and is 18 mm. . In this embodiment, the column interval d2 between the columns of the light emitting elements 120 and the columns of the first circuit elements 131 is 10.5 mm.

  The tall first circuit element 131 is arranged at a position in the substrate width direction (X-axis direction) side of the region between two adjacent light emitting elements 120 among the plurality of light emitting elements 120. That is, as shown in FIG. 4, the first circuit element 131 is disposed at a side position in the substrate width direction of the inter-element region of the width A that is sandwiched between the opposing side surfaces of the two adjacent light emitting elements 120. Yes.

  In the present embodiment, the first circuit element 131 is disposed so as to overlap with a lateral position in the substrate width direction at the midpoint between two adjacent light emitting elements 120. That is, the first circuit element 131 is arranged so as to pass through the center line (bisector) of the interval between the opposing side surfaces of the two adjacent light emitting elements 120. More preferably, the center line of the first circuit element 131 in the width direction of the substrate 110 may coincide with the center line of the interval between the opposing side surfaces of the two adjacent light emitting elements 120.

  The second circuit element 132 having a short height is disposed in the low-profile region 132 a of the substrate 110. In the present embodiment, the low-profile regions 132a are regions on both sides of the row of the plurality of light emitting elements 120 and have a substantially constant width extending from one end portion in the longitudinal direction of the substrate 110 to the other end portion. It is a linear region. That is, the low-profile region 132a is centered on the plurality of light emitting elements 120, and the first low-profile region 132a1 on the side where the first circuit element 131 exists and the second low-profile region on the side where the first circuit element 131 does not exist. 132a2. The first low-profile region 132a1 is a region between the plurality of first circuit element 131 columns and the plurality of light emitting element 120 columns.

[Case]
As shown in FIGS. 1 and 2, the housing 200 is a base member that supports the LED module 100. The LED module 100 is fixed to the bottom of the housing 200. Specifically, the substrate 110 of the LED module 100 is placed on the bottom of the housing 200 and the substrate 110 is fixed to the housing 200. In the present embodiment, the casing 200 is an outer casing that forms an outer casing of the lighting device 1 together with the cover 300.

  The housing 200 is made of, for example, a white insulating resin material. Therefore, the housing 200 has light reflectivity with respect to visible light. In the present embodiment, the housing 200 is made of white polycarbonate. Note that the housing 200 may be made of a metal material such as aluminum or iron instead of the resin material. For example, the housing 200 may be made of a sheet metal made of a steel plate or an aluminum plate.

  Note that both ends of the casing 200 in the longitudinal direction may be opened, and end covers (end caps) may be attached so as to close the openings.

[cover]
As shown in FIG. 2, the cover 300 is disposed so as to cover the plurality of light emitting elements 120 (LED modules 100). In the present embodiment, the cover 300 has a plate shape, but is not limited thereto, and may be a semi-cylindrical shape or the like.

  The cover 300 is a translucent member that transmits light emitted from the light emitting element 120. The cover 300 is made of a translucent material such as a translucent resin material such as acrylic or polycarbonate or a glass material.

  The cover 300 may further have a light diffusing property (light scattering property). By providing the cover 300 with light diffusibility, light from the light emitting element 120 which is a highly directional LED light source can be diffused. ) Can be suppressed.

  When the cover 300 has light diffusibility, a light diffusing material such as light reflecting fine particles is dispersed in a light-transmitting resin material to produce the cover 300, or on the surface (inner surface or outer surface) of the cover 300 made of a transparent member. By forming a milky white light diffusing film including a light diffusing material or the like, the cover 300 can have light diffusibility. Alternatively, instead of using a light diffusing material, a fine unevenness is formed on the surface of the cover 300 made of a transparent member by applying a texture or the like, or a dot pattern is printed on the surface of the cover 300 made of a transparent member. Thus, the cover 300 may have light diffusibility. Note that the cover 300 may be configured to control the light distribution of the light emitting element 120. For example, the cover 300 may have a lens function of a light collecting action or a diverging action.

  In the present embodiment, the cover 300 is a diffusing cover having light diffusing properties made of polycarbonate. Moreover, the thickness t2 of the cover 300 is, for example, 1.5 mm.

  The cover 300 is fixed to the housing 200. Specifically, the cover 300 is fixed to the opening of the housing 200. The cover 300 and the housing 200 are fixed by, for example, a locking structure such as an adhesive or snap-in, or a screw. Note that the distance h between the inner surface of the cover 300 and the upper surface of the substrate 110 is, for example, 11 mm.

[Summary]
As described above, the LED module 100 (light emitting device) in the present embodiment includes a long substrate 110, a plurality of light emitting elements 120 arranged on the substrate 110 along the longitudinal direction of the substrate 110, and a plurality of light emitting devices. A plurality of circuit elements 130 arranged in parallel with the columns of the elements 120 are provided. The plurality of circuit elements 130 include a tall first circuit element 131 having a height of 5 mm or more from the substrate 110, and the first circuit element 131 is adjacent to two adjacent light emitting elements 120. The region between the two light emitting elements 120 is disposed at a lateral position in the substrate width direction.

  Accordingly, even if the first circuit element 131 which is a tall and large component is used as the circuit element 130 constituting the power supply circuit in order to suppress flicker, the light emitted from the light emitting element 120 by the first circuit element 131 The generation of shadows can be suppressed.

  This effect will be described with reference to FIG. FIG. 5 is a diagram showing a luminance distribution of the LED module 100 according to the first embodiment. In FIG. 5, the luminance distribution is calculated using the layouts shown in FIGS.

  Specifically, the height H of the lighting device 1 was about 15 mm, and the width W was about 37.5 mm. The cover 300 was made of polycarbonate having a thickness t2 of 1.5 mm (EKD2105U, manufactured by Mitsubishi Engineering Plastics Co., Ltd.). Further, the distance h between the inner surface of the cover 300 and the upper surface of the substrate 110 is, for example, 11 mm.

  As the substrate 110, a glass composite substrate having a long side length L1 of 286 mm, a short side length L2 of 34 mm, and a thickness t1 of 1.0 mm was used. As the light emitting element 120, 16 package type LED elements (NFSL757GT-V1, manufactured by Nichia Corporation) are used, and the pitch P1 is 18 mm along the center line in the width direction of the substrate 110 and arranged at equal intervals. did. In addition, the 16 light emitting elements 120 were connected in series (16 in series), and the current IF applied to the light emitting element 120 was 65 mA. As the first circuit element 131, eight electrolytic capacitors (φ6.3 × 6.1L) were used, and the pitch P2 was set to 18 mm and arranged at equal intervals. The first circuit element 131 is disposed so as to pass through the center line of two adjacent light emitting elements 120. The distance d1 between the center of the first circuit element 131 and the long side of the substrate 110 is 6.5 mm, and the column interval d2 between the column of the light emitting elements 120 and the column of the first circuit element 131 is 10.5 mm. did.

  As a result, as shown in FIG. 5, it can be seen that the light emitted from the LED module 100 is not shaded by the first circuit element 131 by adopting the configuration of the LED module 100 in the present embodiment. Moreover, it turns out that it is the light of the whole line form light distribution.

  As described above, according to the LED module 100 and the lighting device 1 of the present embodiment, it is possible to easily obtain high-quality light with high quality in which flicker can be suppressed and shadows by the circuit elements 130 are suppressed. .

  In the LED module 100 according to the present embodiment, the plurality of first circuit elements 131 may be arranged at equal intervals.

  Thereby, the shadow of the light by the 1st circuit element 131 can be suppressed further.

  Moreover, in the LED module 100 in the present embodiment, the plurality of light emitting elements 120 may be arranged at equal intervals.

  Thereby, the shadow of the light by the 1st circuit element 131 can be suppressed effectively.

  In the LED module 100 according to the present embodiment, the intervals between the plurality of first circuit elements 131 and the intervals between the plurality of light emitting elements 120 may be the same.

  Thereby, the shadow of the light by the 1st circuit element 131 can be suppressed further.

  Further, in the LED module 100 according to the present embodiment, the first circuit element 131 may be disposed so as to overlap with a lateral position in the substrate width direction at the midpoint between two adjacent light emitting elements 120. .

  Thereby, the shadow of the light by the 1st circuit element 131 can be suppressed further.

  In the LED module 100 according to the present embodiment, the first circuit element 131 may be disposed near the end of the substrate 110 in the longitudinal direction.

  Thereby, compared with the case where the 1st circuit element 131 is arrange | positioned in the center part of the board | substrate 110, the shadow of the light by the 1st circuit element 131 can be suppressed further.

  Further, in the LED module 100 according to the present embodiment, the plurality of circuit elements 130 include a second short circuit element 132 having a height of less than 5 mm from the substrate 110, and the second circuit element 132 includes: It may be arranged in a region between the plurality of first circuit elements 131 and the plurality of light emitting elements 120.

  As a result, the tall first circuit element 131 can be separated from the light emitting element 120 to further suppress the shadow of light from the first circuit element 131, and the first circuit element 131 can be separated from the light emitting element 120. Thus, the region between the first circuit element 131 and the light emitting element 120 can be used as a space for arranging the second circuit element 132. That is, the effect of suppressing the shadow of light by the first circuit element 131 can be increased, and the arrangement space for the second circuit element 132 can be secured.

  In the LED module 100 according to the present embodiment, the second circuit element 132 may be disposed in each of the regions on both sides of the row of the plurality of light emitting elements 120.

  As a result, even when the second circuit element 132 is frequently used, the second circuit element 132 can be disposed on the substrate 110 without affecting the light of the light emitting element 120.

  In the present embodiment, an electrolytic capacitor is used as the first circuit element 131.

  Thereby, direct-current power that can suppress flicker of the light emitting element 120 can be easily generated.

(Embodiment 2)
Next, the lighting device and the LED module according to Embodiment 2 will be described with reference to FIG. FIG. 6 is a plan view schematically showing the configuration of the LED module 100A according to the second embodiment. In addition, since the structure of the illuminating device in this Embodiment is the same as Embodiment 1, the structure of only LED module 100A is demonstrated.

  In the LED module 100 in the first embodiment, only one row of the plurality of light emitting elements 120 is provided. However, in the LED module 100A in the present embodiment, as shown in FIG. Two rows.

  In the present embodiment, the light emitting elements 120 are arranged in a staggered manner in the two element rows of the light emitting elements 120. Specifically, the light emitting elements 120 are arranged in two rows so that the light emitting elements 120 of one element row and the light emitting elements 120 of the other element row do not face each other.

  In the LED module 100 </ b> A (light emitting device) in the present embodiment, the first circuit element 131 is a lateral position in the substrate width direction of the region between two adjacent light emitting elements 120 among the plurality of light emitting elements 120. Is arranged.

  Therefore, even if the first circuit element 131, which is a tall and large component, is used as the circuit element 130 constituting the power supply circuit in order to suppress flicker, the first circuit element 131 affects the light emitted from the light emitting element 120. Can be suppressed.

  This effect will be described with reference to FIG. FIG. 7 is a diagram showing a luminance distribution of the LED module 100A according to the second embodiment. In FIG. 7, the luminance distribution is calculated using the layout shown in FIG.

  Specifically, as the light emitting element 120, 32 LED elements (NFSL757GT-V1, manufactured by Nichia Corporation), which are the same package type as in the first embodiment, are arranged in two rows, and the pitch of each row P1 was 18 mm and was arranged at equal intervals. The pitch P3 between the light emitting elements 120 in one element row and the light emitting elements 120 in the other element row was 9 mm. The 32 light emitting elements 120 were all connected in series (32 in parallel), and the current flow IF of the light emitting element 120 was 65 mA. As the first circuit element 131, eight electrolytic capacitors (φ6.3 × 6.1L) same as those in the first embodiment were used, and the pitch P2 was set to 18 mm and arranged at equal intervals. The same substrate 110 as in FIG. 5 (L1 = 286 mm, L2 = 34 mm, t1 = 1.0) was used. The external shape of the illumination device was also the same as in FIG. 5 (H = 15 mm, W = 37.5 mm, h = 11 mm), and the cover 300 was also the same as in FIG.

  As a result, as shown in FIG. 7, it can be seen that the light emitted from the LED module 100A is not shaded by the first circuit element 131 even in the configuration of the LED module 100A in the present embodiment. It can also be seen that the light is a linear light distribution.

  As described above, the LED module 100 </ b> A and the lighting device according to the present embodiment can also suppress flicker and obtain high-quality light with a high quality in which shadows from the circuit element 130 are suppressed.

(Embodiment 3)
Next, the lighting device and the LED module according to Embodiment 3 will be described with reference to FIG. FIG. 8 is a plan view schematically showing the configuration of the LED module 100B according to the third embodiment. In addition, since the structure of the illuminating device in this Embodiment is also the same as Embodiment 1, only LED module 100B is demonstrated.

  The LED module 100B in the present embodiment has two element rows of the plurality of light emitting elements 120 as in the LED module 100A in the second embodiment, but in the LED module 100B in the present embodiment, The first circuit element 131 is disposed between two rows of the plurality of light emitting elements 120. Specifically, the element row of the first circuit element 131 is arranged at the center of the two element rows of the light emitting element 120. Note that the two element rows of the light emitting elements 120 are arranged so that the light emitting elements 120 of one element row face each other and the light emitting elements 120 of the other element row are not limited to this.

  In the LED module 100B according to the present embodiment, the second circuit element 132 includes a first low-profile region between the plurality of first circuit elements 131 and one of the plurality of light emitting elements 120. 132 a 1 and a second low-profile region 132 a 2 between the plurality of first circuit elements 131 and the other two columns of the plurality of light emitting elements 120.

  In the LED module 100 </ b> B (light emitting device) according to the present embodiment, the first circuit element 131 is positioned laterally in the substrate width direction in the region between two adjacent light emitting elements 120 among the plurality of light emitting elements 120. Is arranged.

  Therefore, even if the first circuit element 131, which is a tall and large component, is used as the circuit element 130 constituting the power supply circuit in order to suppress flicker, the first circuit element 131 affects the light emitted from the light emitting element 120. Can be suppressed.

  This effect will be described with reference to FIG. FIG. 9 is a diagram showing a luminance distribution of the LED module 100B according to the third embodiment. In FIG. 9, the luminance distribution is calculated with the layout shown in FIG.

  Specifically, as the light emitting element 120, 32 LED elements (NFSL757GT-V1, manufactured by Nichia Corporation), which are the same package type as in the first embodiment, are arranged in two rows, and the pitch of each row P1 was 18 mm and was arranged at equal intervals. The 32 light emitting elements 120 were all connected in series (32 in parallel), and the current flow IF of the light emitting element 120 was 65 mA. As the first circuit element 131, eight electrolytic capacitors (φ6.3 × 6.1L) same as those in the first embodiment were used, and the pitch P2 was set to 18 mm and arranged at equal intervals. The column interval d2 between the column of the light emitting elements 120 and the column of the first circuit elements 131 was 10.5 mm. The same substrate 110 as in FIG. 5 (L1 = 286 mm, L2 = 34 mm, t1 = 1.0) was used. The external shape of the illumination device was also the same as in FIG. 5 (H = 15 mm, W = 37.5 mm, h = 11 mm), and the cover 300 was also the same as in FIG.

  As a result, as shown in FIG. 9, it can be seen that the light emitted from the LED module 100B is not shaded by the first circuit element 131 even in the configuration of the LED module 100B in the present embodiment. It can also be seen that the light is a linear light distribution.

  As described above, the LED module 100 </ b> B and the lighting device according to the present embodiment can also suppress flicker and obtain high-quality light with a high quality in which shadows from the circuit element 130 are suppressed.

(Other variations)
As mentioned above, although the illuminating device and LED module which concern on this invention were demonstrated based on embodiment, this invention is not limited to the said embodiment.

  For example, in the above-described embodiment, one LED module is arranged in one casing 200. However, the present invention is not limited to this, and a plurality of LED modules may be arranged in one casing 200. In this case, a plurality of LED modules may be arranged so as to be adjacent along the longitudinal direction of the LED module (longitudinal direction of the substrate 110), and two adjacent LED modules may be connected by an electric wire or the like.

  In the above embodiment, the element rows of the plurality of light emitting elements 120 are one or two rows, but the present invention is not limited to this, and the element rows of the plurality of light emitting elements 120 are three or more rows. Also good.

  Moreover, in the said embodiment, although the LED module was the SMD type which used the SMD type LED element as the light emitting element 120, it is not restricted to this, A COB type may be sufficient. In this case, an LED chip (bare chip) may be used as the light emitting element 120, a plurality of LED chips may be arranged on the substrate 110, and the plurality of LED chips may be collectively sealed with a line-shaped sealing member.

  Moreover, in the said embodiment, although the light emitting element 120 was set as LED, it is not restricted to this. For example. As the light emitting element 120, other solid light emitting elements such as a semiconductor laser or an organic EL (Electro Luminescence) may be used.

  Moreover, in the said embodiment, although the circuit element 130 and the light emitting element 120 were mounted in the same board | substrate 110, it is not restricted to this. For example, the substrate on which the circuit element 130 is mounted and the substrate on which the light emitting element 120 is mounted may be separately provided. In this case, the substrate on which the circuit element 130 is mounted (circuit board) and the substrate on which the light emitting element 120 is mounted (light source substrate) are preferably placed side by side on the bottom of the housing 200.

  In addition, any combination of the components and functions in the embodiment and the modification can be arbitrarily combined without departing from the gist of the present invention, and the form obtained by making various modifications conceived by those skilled in the art with respect to the embodiment and the modification. The embodiment realized by the above is also included in the present invention.

1 Illumination device 100, 100A, 100B LED module (light emitting device)
DESCRIPTION OF SYMBOLS 110 Board | substrate 120 Light emitting element 130 Circuit element 131 1st circuit element 131a High back area 132 2nd circuit element 132a Low back area 132a1 1st low back area 132a2 2nd low back area 140 Connector 200 Case 300 Cover

Claims (12)

A long substrate;
A plurality of light emitting elements arranged on the substrate along a longitudinal direction of the substrate;
A plurality of circuit elements arranged in parallel with the plurality of light emitting element rows,
The plurality of circuit elements include a first circuit element having a height of 5 mm or more from the substrate,
The first circuit element is disposed at a lateral position in a substrate width direction of a region between two adjacent light emitting elements among the plurality of light emitting elements.
Light emitting device. A plurality of the first circuit elements;
The plurality of first circuit elements are arranged at equal intervals.
The light emitting device according to claim 1. The plurality of light emitting elements are arranged at equal intervals.
The light emitting device according to claim 2. The intervals between the plurality of first circuit elements and the intervals between the plurality of light emitting elements are the same.
The light emitting device according to claim 3. The first circuit element is disposed so as to overlap with a lateral position in the substrate width direction at the midpoint between the two adjacent light emitting elements.
The light-emitting device of any one of Claims 1-4. The first circuit element is disposed near an end in a longitudinal direction of the substrate.
The light emitting device according to claim 1. The plurality of circuit elements include a second circuit element having a height of less than 5 mm from the substrate,
The second circuit element is disposed in a region between a plurality of the first circuit element columns and the plurality of light emitting element columns.
The light emitting device according to claim 1. The plurality of circuit elements include a plurality of second circuit elements having a height of less than 5 mm from the substrate,
The plurality of second circuit elements are disposed in each of regions on both sides of the row of the plurality of light emitting elements,
The light emitting device according to claim 1. The rows of the plurality of light emitting elements are two rows,
The first circuit element is disposed between two rows of the plurality of light emitting elements.
The light emitting device according to claim 1. The plurality of circuit elements include a second circuit element having a height of less than 5 mm from the substrate,
The second circuit element includes a first low-profile region between a plurality of the first circuit element columns and one of the two light emitting element columns, and the plurality of first circuit element columns. It is arranged in a second low-profile region between the other row of the two rows of the plurality of light emitting elements,
The light emitting device according to claim 9. The first circuit element is an electrolytic capacitor;
The light-emitting device of any one of Claims 1-10. The light-emitting device according to claim 1 is provided.
Lighting device.