WO2011046120A1 - Composition de résine et agent adhésif - Google Patents

Composition de résine et agent adhésif Download PDF

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Publication number
WO2011046120A1
WO2011046120A1 PCT/JP2010/067895 JP2010067895W WO2011046120A1 WO 2011046120 A1 WO2011046120 A1 WO 2011046120A1 JP 2010067895 W JP2010067895 W JP 2010067895W WO 2011046120 A1 WO2011046120 A1 WO 2011046120A1
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Prior art keywords
component
adhesive
meth
resin composition
acrylate
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PCT/JP2010/067895
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English (en)
Japanese (ja)
Inventor
佑基 比舎
公彦 依田
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電気化学工業株式会社
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Priority to JP2011536141A priority Critical patent/JP5684714B2/ja
Priority to KR1020127012210A priority patent/KR101696332B1/ko
Priority to CN201080046336.1A priority patent/CN102686622B/zh
Publication of WO2011046120A1 publication Critical patent/WO2011046120A1/fr

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1807C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1811C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04Acids; Metal salts or ammonium salts thereof
    • C08F220/06Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/04Anhydrides, e.g. cyclic anhydrides
    • C08F222/06Maleic anhydride

Definitions

  • the present invention relates to an adhesive.
  • Cycloolefin polymers are used in applications such as electronic materials, optical lenses and medical materials. Cycloolefin polymers are known as difficult adherends because of their low polarity and lack of many functional groups on the surface. Examples of the adhesive for adhering such a cycloolefin-based resin include a solvent-type adhesive and a hot melt adhesive.
  • Patent Document 1 As a method for adhering an olefin resin, there is a method of adhering with an instantaneous adhesive after performing a treatment with a primer as disclosed in Patent Document 1. Moreover, as disclosed in Patent Document 2, an energy ray-curable resin composition containing (meth) acrylate is disclosed.
  • a solvent type adhesive uses a solvent. Solvent-type adhesives are harmful to the human body, and it takes time for the solvent to evaporate, so that sufficient adhesive strength itself cannot be obtained.
  • the hot melt adhesive requires labor and equipment for melting the adhesive. Also, this adhesive cannot provide sufficient adhesive strength. In the case of using a hot melt adhesive, if the cycloolefin polymer is heated in advance, the adhesive strength is improved, but a new problem that the resin is deformed occurs.
  • Patent Document 1 According to the adhesion method disclosed in Patent Document 1, there is a problem that it takes time and effort for primer treatment, and a sufficient adhesion strength cannot be obtained.
  • Patent Document 2 discloses an energy ray curable resin composition containing (meth) acrylate. However, there is no description about (meth) acrylate having a dicyclopentenyl group.
  • An object of this invention is to provide the adhesive agent for cycloolefin polymers which can express sufficient adhesive strength in a short time with respect to a cycloolefin polymer, for example, and is a solvent-free type and environmentally friendly.
  • the present inventor has intensively studied to solve the above-described problems and has arrived at the present invention.
  • a resin composition comprising the following components (A) to (E).
  • (A) component is a (meth) acrylate having a dicyclopentenyl group
  • (B) component is a (meth) acrylate having a hydroxyl group
  • (C) component is having a (meth) acryloyl group and is a diene skeleton
  • the (meth) acrylate (D) component having a hydrogenated diene-based skeleton is a silane coupling agent (E) component is a photopolymerization initiator.
  • the resin composition according to the present invention further comprises (meth) acrylic acid as the component (F).
  • the resin composition according to the present invention further contains polyvinyl alcohol as the component (G).
  • the component (A) is dicyclopentenyl (meth) acrylate.
  • the component (C) has a number average molecular weight of 500 to 50,000.
  • the resin composition according to the present invention has a thickness of 0.03 mm, and when cured by irradiation for 15 seconds under conditions of a wavelength of 365 nm and an integrated light quantity of 2000 mJ / cm 2 , the storage elasticity of the cured product.
  • the rate is in the range of 0.1 to 100,000 MPa (23 ° C.).
  • the present invention is an adhesive comprising the resin composition according to the present invention.
  • the adhesive according to the present invention is a cycloolefin polymer adhesive.
  • the adhesive according to the present invention is an adhesive for a cycloolefin polymer having a dicyclopentadiene ring structure.
  • the present invention is an adhesive body in which adherends are bonded to each other using the adhesive according to the present invention.
  • the adherend according to the present invention is at least one member selected from the group consisting of cycloolefin polymer, polycarbonate, cellulose triacetate, polyvinyl alcohol and glass.
  • the adhesive according to the present invention is applied to the surface of the adherend so as to have a thickness of 0.0001 to 5 mm, and the adherends are bonded to each other to obtain a wavelength of 200 to 500 nm.
  • This is a method for producing an adhesive body comprising curing the adhesive under conditions of an integrated light quantity of 200 to 6000 J / cm 2 and an irradiation time of 1 to 60 seconds.
  • the resin composition of the present invention is characterized by high adhesive strength and excellent moisture resistance.
  • the component (A) in the present invention is a (meth) acrylate having a dicyclopentenyl group. More specifically, the component (A) is a (meth) acrylate containing one or more dicyclopentenyl groups at the terminal or side chain of the molecule.
  • Examples of (A) component (meth) acrylate include dicyclopentenyloxyethyl (meth) acrylate, dicyclopentenyloxypropyl (meth) acrylate, and dicyclopentenyl (meth) acrylate. Of these, dicyclopentenyl (meth) acrylate is preferred.
  • the component (B) is a (meth) acrylate containing a hydroxyl group. More specifically, the component (B) is a (meth) acrylate containing one or more hydroxyl groups at the end or side chain of the molecule.
  • hydroxyl group-containing (meth) acrylates include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 2-hydroxy-3-phenoxypropyl (meth) acrylate.
  • 2-hydroxy-3-phenoxypropyl (meth) acrylate is more preferable from the viewpoint of resin film adhesion.
  • the component (C) is a (meth) acrylate having a (meth) acryloyl group and having a diene skeleton or a hydrogenated diene skeleton. More specifically, the component (C) has one or more (meth) acryloyl groups at the terminal or side chain of the molecule, and has a diene skeleton or a hydrogenated diene skeleton.
  • (Meth) acrylates preferably (meth) acrylates having one or more (meth) acryloyl groups at the end of the molecule and having a diene skeleton or a hydrogenated diene skeleton. is there. This includes the following components from the viewpoint of imparting flexibility to the resin.
  • the main chain skeleton of (meth) acrylate is a diene skeleton or a hydrogenated diene skeleton.
  • the diene skeleton or the hydrogenated diene skeleton include one or more skeletons selected from the group consisting of polybutadiene, polyisoprene, a hydrogenated polybutadiene, and a hydrogenated polyisoprene.
  • at least one selected from the group consisting of polyisoprene and a hydrogenated product of polyisoprene is preferable, and polyisoprene is more preferable.
  • the (meth) acrylate of the component (C) has one or more (meth) acryloyl groups at the terminal or side chain of the main chain skeleton. Among these, those having (meth) acryloyl groups at both ends of the main chain skeleton are preferable.
  • the number average molecular weight of the component (C) (meth) acrylate is preferably 500 to 50,000, and more preferably 8000 to 45,000. If the number average molecular weight is 500 or more, the cured product obtained by irradiating the adhesive of the present invention with energy rays has a high hardness, so that it is easy to form an adhesive layer. If the number average molecular weight is 50000 or less, the viscosity of the resulting adhesive is small, so that the workability in mixing during the production process and the workability when using the adhesive in practical applications are good.
  • the component (C) (meth) acrylate includes “UC-203” manufactured by Kuraray Co., Ltd. (an esterified oligomer of maleic anhydride adduct of isoprene polymer and 2-hydroxyethyl methacrylate), “TEAI-” manufactured by Nippon Soda Co., Ltd. 1000 ”(hydrogenated 1,2-polybutadiene terminated urethane methacrylate),“ TE-2000 ”(1,2-polybutadiene terminated urethane methacrylate) manufactured by Nippon Soda Co., Ltd. and derivatives thereof,“ CN-301 ”“ CN-303 ”manufactured by Sartomer "CN-307" (polybutadiene acrylate oligomer).
  • Silane coupling agents include ⁇ -chloropropyltrimethoxysilane, vinyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinylpropyltrimethoxysilane, vinyl-tris ( ⁇ -methoxyethoxy) silane, ⁇ - (meta ) Acryloxypropyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, N - ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxysilane, N- ⁇ - (aminoethyl) - ⁇ -aminopropylmethyldime
  • one of the group consisting of ⁇ -glycidoxypropyltrimethoxysilane, ⁇ - (meth) acryloxypropyltrimethoxysilane and vinylpropyltrimethoxysilane is preferable.
  • a component is a photoinitiator.
  • the photopolymerization initiator include an ultraviolet polymerization initiator and a visible light polymerization initiator, both of which are used without limitation.
  • examples of the ultraviolet polymerization initiator include benzoin, benzophenone, and acetophenone.
  • examples of visible light polymerization initiators include acylphosphine oxide, thioxanthone, metallocene, quinone, and ⁇ -aminoalkylphenone.
  • Photopolymerization initiators include benzophenone, 4-phenylbenzophenone, benzoylbenzoic acid, 2,2-diethoxyacetophenone, bisdiethylaminobenzophenone, benzyl, benzoin, benzoyl isopropyl ether, benzyldimethyl ketal, 1-hydroxycyclohexyl phenyl ketone, thioxanthone 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 1- (4-isopropylphenyl) 2-hydroxy-2-methylpropan-1-one 1- (4- (2-hydroxyethoxy) -phenyl) -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-2-methyl-1-phenyl Rupropan-1-one, camphorquinone, 2,4,6-tri
  • the resin composition of the present invention contains the components (A) to (E) as essential components.
  • the resin composition containing the components (A) to (E) is cured when irradiated with light.
  • the cured product has good adhesiveness to the cycloolefin polymer and has a high surface curability during the curing.
  • the resin composition of the present invention exhibits high adhesive strength even for general-purpose plastic resins such as polycarbonate, cellulose triacetate, and polyvinyl alcohol, and glass adherends.
  • the resin composition in the present invention can contain (meth) acrylic acid as the component (F). This is particularly used from the viewpoint of durability such as moisture resistance.
  • the resin composition in the present invention can contain polyvinyl alcohol as the component (G). This includes the following components from the viewpoint of adhesiveness to the polyvinyl alcohol resin.
  • the polyvinyl alcohol is not particularly limited as long as it is a polyvinyl alcohol derivative obtained by saponifying polyvinyl acetate.
  • the average degree of polymerization of polyvinyl alcohol is preferably from 100 to 5,000, more preferably from 1,000 to 4,000.
  • the average degree of saponification of polyvinyl alcohol is preferably 85 to 100 mol%, more preferably 90 to 100 mol%.
  • the use amount of the resin composition of the present invention is as follows, from the viewpoint that the adhesiveness of the adhesive to the cycloolefin polymer is particularly high and also has high adhesive strength to other adherends. It is as follows.
  • Component (D) is used in an amount of 0.01 to 10 masses per 100 parts by mass of the total amount of component (A), component (B), component (C) and component (F) used as necessary. Part is preferable, 0.1 to 5 parts by weight is more preferable, and typically 0.5 to 1.0 part by weight.
  • Component (E) is used in an amount of 0.01 to 30 masses per 100 parts by mass of the total amount of component (A), component (B), component (C) and component (F) used as necessary. Part is preferable, 0.1 to 20 parts by weight is more preferable, and typically 5 to 10 parts by weight.
  • Component (F) is used in an amount of 0.1 to 30 parts by mass in 100 parts by mass of the total amount of component (A), component (B), component (C) and component (F) used as necessary.
  • the amount is preferably 1 to 20 parts by mass, and typically 10 to 15 parts by mass.
  • Component (G) is used in an amount of 0.01 to 50 masses per 100 parts by mass of the total amount of component (A), component (B), component (C) and component (F) used as necessary. Part is preferable, 0.1 to 30 parts by weight is more preferable, and typically 0.5 to 1.0 part by weight.
  • the resin composition of the present invention is within the range that does not impair the object of the present invention, and is a graft copolymer, solvent, extender, reinforcing material, plasticizer, thickener, dye, pigment, flame retardant, antioxidant. , And additives such as surfactants can be used.
  • the cured product of the resin composition of the present invention preferably has a storage elastic modulus of 0.1 to 100000 MPa (23 ° C.), more preferably has a storage elastic modulus of 10 to 10000 MPa, typically 500 to 5000 MPa. It is.
  • the storage elastic modulus of the cured product of the resin composition is 0.1 MPa or more, the cured product is cured and no unreacted component remains.
  • the storage elastic modulus is 100000 MPa or less, the cured product does not become too rigid and the adhesive force does not decrease.
  • the resin composition of the present invention can be used as an adhesive.
  • the adhesive of the present invention exhibits high adhesive strength with respect to one or more selected from the group consisting of, for example, cycloolefin polymer, polycarbonate, cellulose triacetate, polyvinyl alcohol, and glass. In particular, it exhibits high adhesive strength for cycloolefin polymers.
  • the cycloolefin polymer of the present invention is a thermoplastic resin having a structural unit derived from a cyclic olefin (cycloolefin) monomer such as norbornene or a polycyclic norbornene monomer.
  • cycloolefin polymers include cycloolefin ring-opening polymers, hydrogenated ring-opening copolymers using two or more cycloolefins, chain olefins, aromatic compounds having a vinyl group, and cycloolefins.
  • the adhesive according to the present invention is particularly effective for cycloolefin polymers having a dicyclopentadiene ring structure. Moreover, you may introduce
  • cycloolefin polymers examples include “Topas” manufactured by Ticona®, Germany, “Arton” manufactured by JSR, “ZEONOR” and “ZEONEX” manufactured by Zeon Japan, Mitsui Chemicals, Inc. “Appel” made by the manufacturer can be mentioned.
  • the adhesive bonding method of the present invention is as follows, for example.
  • An adhesive is applied to the surface of at least one of the two adherends so as to have a thickness of 0.0001 to 5 mm, typically 0.01 to 0.50 mm.
  • irradiation time 1 to 60 seconds, typically 2 to
  • a method in which the adhesive is cured under a condition of 30 seconds to adhere the adherend is preferable.
  • an antioxidant may be used as the other component.
  • a phenol type or a hydroquinone type can be used, and a phenol type is preferably used.
  • Antioxidants include ⁇ -naphthoquinone, 2-methoxy-1,4-naphthoquinone, methylhydroquinone, hydroquinone, 2,2-methylene-bis (4-methyl-6-tertiarybutylphenol), catechol, hydroquinone monomethyl ether, mono Tertiary butyl hydroquinone, 2,5-ditertiary butyl hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-ditertiary butyl-p-benzoquinone, picric acid, citric acid, phenothiazine, tertiary Examples thereof include butyl catechol, 2-butyl-4-hydroxyanisole and 2,6-ditertiary butyl-p-
  • the amount of the antioxidant used is 0.01 to 10 parts by mass with respect to 100 parts by mass of the total amount of component (A), component (B), component (C) and component (F) used as necessary. Is preferable, 0.1 to 8 parts by mass is more preferable, and 2.0 to 8.0 parts by mass is more preferable.
  • component (A) a (meth) acrylate containing a dicyclopentenyl group, dicyclopentenyl acrylate (“FA-511AS” manufactured by Hitachi Chemical Co., Ltd.)
  • component (A) a (meth) acrylate containing a dicyclopentenyl group, dicyclopentenyloxyethyl methacrylate (“FA-512MT” manufactured by Hitachi Chemical Co., Ltd.)
  • component (B) Component, 2-hydroxy-3-phenoxypropyl acrylate (“M-5700” manufactured by Toagosei Co., Ltd.) as a (meth) acrylate containing a hydroxyl group
  • B) Component, 2-hydroxyethyl methacrylate (“light ester HO” manufactured by Kyoeisha Chemical Co., Ltd.) as a (meth) acrylate containing a hydroxyl group
  • C Component, oligomer, “UC-203” (esterified oligomer of maleic anhydride
  • Light Ester BZ Lauryl methacrylate (Kyoeisha Chemical Co., Ltd. “Light Ester L”) Antioxidant, (D-1) 2,2-methylene-bis (4-methyl-6-tertiary butylphenol) (“Sumilyzer MDP-S” manufactured by Sumitomo Chemical Co., Ltd.)
  • Test piece 12a width 25 mm ⁇ length 100 mm ⁇ thickness 2.0 mm
  • a Teflon (registered trademark) tape 10 thickness 80 ⁇ m ⁇ width 25 mm ⁇ length 25 mm having a hole 11 having a size of 0.5 cm 2 in the center was attached to control the adhesive thickness.
  • Test pieces 25 mm ⁇ 25 mm ⁇ 0.03 mm are 80 ⁇ m thick ⁇ 11.5 mm wide ⁇ length
  • An adhesive was adhered using a 25 mm Teflon (registered trademark) tape as a spacer (adhesion area: 3.125 cm 2 ). After curing, the tensile bond strength was measured using the test piece bonded with an adhesive. Curing conditions followed the method described in [Photocurability].
  • a galvanized steel sheet 100 mm ⁇ 25 mm ⁇ 2.0 mm, engineering test service
  • the tensile bond strength was measured using the test piece adhered with an adhesive.
  • the tensile shear bond strength (unit: MPa) was measured at a tensile rate of 10 mm / min in an environment of a temperature of 23 ° C. and a humidity of 50%.
  • Adhesives were prepared by mixing raw materials of the types shown in Table 1 with the compositions shown in Table 1. Various physical properties of the obtained adhesive were measured. The results are shown in Table 1.
  • This invention can express sufficient adhesive strength with respect to a cycloolefin polymer, a polycarbonate, polyvinyl alcohol, and glass.
  • the present invention has moisture resistance.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

L'invention porte sur une composition de résine présentant une force d'adhésion élevée. La composition de résine contient les composants suivants : (A) à (E). Le composant (A) est un (méth)acrylate ayant un groupe dicyclopentényle ; le composant (B) est un (méth)acrylate ayant un groupe hydroxyle ; le composant (C) est un (méth)acrylate ayant un groupe (méth)acryloyle, et une structure diénique ou une structure diénique additionnée d'hydrogène ; le composant (D) est un agent de couplage de type silane ; et le composant (E) est un initiateur de photopolymérisation. De plus, la composition de résine peut contenir un acide (méth)acrylique comme composant (F) et un alcool polyvinylique comme composant (G).
PCT/JP2010/067895 2009-10-14 2010-10-12 Composition de résine et agent adhésif WO2011046120A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011536141A JP5684714B2 (ja) 2009-10-14 2010-10-12 樹脂組成物及び接着剤
KR1020127012210A KR101696332B1 (ko) 2009-10-14 2010-10-12 수지 조성물 및 접착제
CN201080046336.1A CN102686622B (zh) 2009-10-14 2010-10-12 树脂组合物及粘合剂

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JP2009237801 2009-10-14
JP2009-237801 2009-10-14

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WO2011046120A1 true WO2011046120A1 (fr) 2011-04-21

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JP (1) JP5684714B2 (fr)
KR (1) KR101696332B1 (fr)
CN (1) CN102686622B (fr)
TW (1) TWI492979B (fr)
WO (1) WO2011046120A1 (fr)

Cited By (7)

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JP2011173975A (ja) * 2010-02-24 2011-09-08 Kuraray Co Ltd ポリビニルアルコール系重合体フィルム用接着剤
WO2012141298A1 (fr) * 2011-04-13 2012-10-18 電気化学工業株式会社 Composition de résine et adhésif
JP2015108044A (ja) * 2013-12-03 2015-06-11 電気化学工業株式会社 仮固定用接着剤組成物、それを用いた構造体及び部材の仮固定方法
WO2016039277A1 (fr) * 2014-09-08 2016-03-17 電気化学工業株式会社 Composition et procédé de démontage
EP2927295A4 (fr) * 2012-11-30 2016-08-03 Lintec Corp Composition d'agent adhésif, feuille adhésive et dispositif électronique
JP2016160361A (ja) * 2015-03-03 2016-09-05 積水フーラー株式会社 紫外線硬化型接着剤組成物
WO2021132715A1 (fr) 2019-12-27 2021-07-01 三菱ケミカル株式会社 Structure d'insonorisation

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