TW201124463A - Resin composition and adhesive agent - Google Patents

Resin composition and adhesive agent Download PDF

Info

Publication number
TW201124463A
TW201124463A TW099134932A TW99134932A TW201124463A TW 201124463 A TW201124463 A TW 201124463A TW 099134932 A TW099134932 A TW 099134932A TW 99134932 A TW99134932 A TW 99134932A TW 201124463 A TW201124463 A TW 201124463A
Authority
TW
Taiwan
Prior art keywords
component
resin composition
adhesive
acrylate
patent application
Prior art date
Application number
TW099134932A
Other languages
Chinese (zh)
Other versions
TWI492979B (en
Inventor
Yuki Hisha
Kimihiko Yoda
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of TW201124463A publication Critical patent/TW201124463A/en
Application granted granted Critical
Publication of TWI492979B publication Critical patent/TWI492979B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1807C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1811C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04Acids; Metal salts or ammonium salts thereof
    • C08F220/06Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/04Anhydrides, e.g. cyclic anhydrides
    • C08F222/06Maleic anhydride

Abstract

Provided is a resin composition exhibiting high adhesive strength. The resin composition contains the following components (A) to (E). Component (A) is a (meth)acrylate having a dicyclopentenyl group; component (B) is a (meth)acrylate having a hydroxyl group; component (C) is a (meth)acrylate having a (meth)acryloyl group, and a diene structure or a diene structure added with hydrogen; component (D) is a silane coupling agent; and component (E) is a photopolymerization initiator. Moreover, the resin composition may contain a (meth)acrylic acid as component (F) and a polyvinyl alcohol as component (G).

Description

201124463 六、發明說明: 【發明所屬之技術領域】 ' 本發明係關於黏合劑。 【先前技術】 環烯烴聚合物被使用在電子材料、光學透鏡及醫 料等用途。環稀烴聚合物的極性小,表面不帶有許多官妒 基’因此作為難被黏合體而為人所知。作為黏合這樣的^ 稀煙系樹脂之黏合劑,可舉出溶劑型黏合劑或熱炫黏合齊^ 又’作為黏合環稀烴樹脂的方丨,如專利文獻1所揭 示,有藉由底漆(primer)之處理之後以瞬間黏合劑黏合的方 法。另^卜,如專利文獻2所揭示,以含有(甲基)丙稀酸 特徵的能量線硬化性樹脂組成物也被揭示。 先前技術文獻 專利文獻 專利文獻1特開昭62-18485號公報 專利文獻2特開2007-77321號公報 發明之揭示 發明所欲解決之問題 溶劑型黏合劑係使用溶劑。溶劑型黏合劑不僅對人邮 有害,且溶翻揮發㈣,黏合強度本身亦無法充分得到仏 熱《占合劑,欲使黏合劑炫融,時間勞力及裝置 必要。又,鱗黏合财無法得到充分的黏合強度。再者’、, 於使用熱轉合_纽,若將環馳聚合财以預熱, 雖可增進黏合強度,但會產生如樹脂變形之㈣問題^ =據專利文獻1關故黏合枝,底祕理 費時費工的問題,亦無法充分得到黏合強度。 有 3/22 201124463 專利文獻2揭相含有(甲基)㈣酸 線硬化性樹脂組成物。可是,並無 為^之能量 基)丙烯酸酯。 有一%戊烯基的(曱 的為提供例 ,且為無溶 本發明係有鑑於此實情而成。本發明的目 如對環烯《合物糾示充分的黏合強度 劑型’可保護環境之環稀烴聚合物用黏合劑。 【發明内容】 解決問題之手段 不斷致力於研究,而達成 本發明者為解決上述問題, 本發明。 也就是說,本發明於其中一方面,係提供: 含有下述(A)〜(E)成分而成的樹脂組成物。 (A) 成分為具有二環戊烯基之(曱基)丙烯酸酯。 (B) 成分為具有羥基之(曱基)丙烯酸酯。 (C) 成分為具有(曱基)丙烯醯基,且具有二烯系的骨架 或具有被氫化之二烯系骨架之(1基)丙烯酸酯。 (D) 成分為矽烷偶合劑。 (E) 成分為光聚合起始劑。 本發明相關之樹脂組成物係在其一實施形態中,更含 有作為(F)成分之(曱基)丙烯酸而形成。 本發明相關之樹脂組成物係在其一實施形態中,更含 有作為(G)成分之聚乙烯醇而形成。 本發明相關之樹脂組成物係在其一實施形態中,(A)成 分為二環戊烯(曱基)丙烯酸酯。 本發明相關之樹脂組成物係在其一實施形態中,更進 一步(C)成分之數量平均分子量為500〜50000。 4/22 201124463 本發明相關之樹脂組成物於其一實施形態,作為厚度 0‘03mm,在波長365nm、累積光量2〇〇〇mj/cm2的條件下藉 由照射15秒予以硬化之時’硬化物之儲存模數在 0.1 〜100000MPa(23°C)的範圍内。 本發明的另一方面,為本發明相關之該樹脂組成物所 成之黏合劑。 本發明相關之黏合劑係在其一實施形態中,其為環稀 烴聚合物用黏合劑。 抑本發明相關之黏合劑係在其—實施形態中,其為具有 雙環戊二烯環構造之環烯烴聚合物用黏合劑。 再者,本發明的另一方面,為使用本發明相關之該勒 合劑,使被黏合體之間互相黏合之黏合體。 本發明相關之黏合體於其一實施形態,被黏合體為考 烯烴聚合物、聚碳酸,、三乙酸纖維素、聚乙烯醇及破璃 所構成群組中選出的I種以上者。 再者’於本發明的另一方面,係將本發明相關之該黏 合劑塗布於_合體表如使其厚度為㈣㈣咖,將被 黏合體彼此貼合,並在波長200〜50〇nm,累積光量 〜6_W,照射時間〗〜6G秒的條件下包含使黏合劑硬 化的黏合體製造方法。 發明的效果 本發明的樹脂組成物,具有顯示高黏合強度,於耐渴 性上亦為優越的特徵。 ··、、 【實施方式】 於本發明之(A)成分,為具有二環戊稀基之(曱基) 酸m體而言’⑷成分為分子末端或側鏈中含有!個 5/22 201124463 以上的二環戊烯基之(甲基)丙烯酸酯。作為(A)成分的(甲基) 丙烯酸醋,可舉出二環戊烯氧基乙基(甲基)丙烯酸醋、二^ 戊婦氧基丙基(曱基)丙稀酸酉旨、二環戊稀(甲基)丙稀酸酿 等。此等之中,較佳為二環戊烯(曱基)丙烯酸酯。 (B)成分為含有羥基之(甲基)丙烯酸酯。更具體而言,(B) 成分為分子末端或側鏈中含有丨個以上的羥基之(甲°基)丙 烯酸醋。作為含有經基的(甲基)丙稀酸酿,可舉出(甲基)丙 烯酸2-羥乙酯、(曱基)丙烯酸2_羥丙酯、(甲基)丙烯ς孓 羥丁醋、(甲基)丙婦酸2_經基_3_苯氧丙醋、峨 丙烯醯氧乙基-2-經丙酉旨、(甲基)丙稀酸4嚷基環己醋等土。 此等之中,由樹脂薄膜黏合性的觀點,2_經基201124463 VI. Description of the invention: [Technical field to which the invention pertains] ' The present invention relates to a binder. [Prior Art] The cycloolefin polymer is used in applications such as electronic materials, optical lenses, and medical materials. The cycloaliphatic polymer has a small polarity and does not have many bureaucratic groups on the surface, and thus is known as being difficult to be bonded. As a binder for bonding such a thin-smoke resin, a solvent-based adhesive or a heat-resistant adhesive can be used as a binder of a binder ring-diffusing resin. As disclosed in Patent Document 1, there is a primer. (primer) after the treatment with an instant adhesive bonding method. Further, as disclosed in Patent Document 2, an energy ray-curable resin composition containing a characteristic of (meth)acrylic acid is also disclosed. CITATION LIST Patent Literature PTL No. 2007-77321 DISCLOSURE OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION Problems to be Solved by the Invention A solvent-based adhesive is a solvent. Solvent-based adhesives are not only harmful to people's mail, but also dissolve and volatilize (4), the adhesive strength itself can not be fully obtained. Heat "occupies the agent, wants to make the adhesive melt, time labor and equipment necessary. Moreover, the scale bond is not able to obtain sufficient adhesive strength. Furthermore, ',, in the use of heat transfer _ 纽, if the ring kinetic polymerization to preheat, although the adhesion strength can be improved, but the phenomenon of resin deformation (four) will occur ^ = according to patent document 1 closed sticks, bottom The problem of time-consuming labor and the inability to fully obtain the bonding strength. 3/22 201124463 Patent Document 2 discloses a (meth)(tetra) acid curable resin composition. However, there is no energy base acrylate. There is a pentanyl group which is provided as an example and is insoluble. The present invention has been made in view of the facts. The object of the present invention is to protect the environment by refining a sufficient adhesive strength dosage form. The present invention has been made in an effort to solve the above problems, and the present invention has been made in order to solve the above problems. In other words, the present invention provides: A resin composition obtained by the following components (A) to (E): (A) The component is a (fluorenyl) acrylate having a dicyclopentenyl group. (B) The component is a (fluorenyl) acrylate having a hydroxyl group. (C) The component is a (meth) fluorenyl group and has a diene-based skeleton or a (1-based) acrylate having a hydrogenated diene skeleton. (D) The component is a decane coupling agent. The component is a photopolymerization initiator. In one embodiment, the resin composition according to the present invention further comprises (mercapto)acrylic acid as the component (F). The resin composition according to the present invention is In one embodiment, it further contains as component (G) The resin composition according to the present invention is an embodiment of the present invention, wherein the component (A) is dicyclopentene (mercapto) acrylate. The resin composition according to the present invention is in one embodiment. Further, the number average molecular weight of the component (C) is 500 to 50,000. 4/22 201124463 The resin composition according to the present invention is in the form of a thickness of 0'03 mm at a wavelength of 365 nm and a cumulative light amount of 2 〇〇〇mj. The storage modulus of the hardened material is hardened by irradiation for 15 seconds under the condition of /cm 2 in the range of 0.1 to 100,000 MPa (23 ° C). Another aspect of the present invention is the resin composition related to the present invention. The adhesive according to the present invention is an adhesive for a cycloaliphatic polymer in one embodiment. The adhesive according to the present invention is in the embodiment, which has a double ring. A binder for a cycloolefin polymer having a pentadiene ring structure. Further, in another aspect of the invention, the binder of the present invention is bonded to each other by using the binder according to the present invention. Bonding In one embodiment, the adherend is one or more selected from the group consisting of olefin polymer, polycarbonate, cellulose triacetate, polyvinyl alcohol, and glaze. Further, in the present invention In one aspect, the adhesive of the present invention is applied to a _body surface such as a thickness of (4) (4) coffee, and the adherends are adhered to each other, and at a wavelength of 200 to 50 〇 nm, the accumulated light amount is ~6_W, and the irradiation time is 〗 The method of producing a bonded body which cures the adhesive is carried out under conditions of ~6 Gsec. Advantages of the Invention The resin composition of the present invention is characterized in that it exhibits high adhesive strength and is excellent in thirst resistance. In the case of the component (A) of the present invention, the (()) component of the (indenyl) acid m body having a dicyclopentanyl group is contained in a molecular terminal or a side chain! 5/22 201124463 or more of the (cyclo)pentenyl (meth) acrylate. Examples of the (meth)acrylic acid vinegar as the component (A) include dicyclopentenyloxyethyl (meth)acrylic acid vinegar, dimethoxypentyloxypropyl (decyl)acrylic acid, and Cyclopental (methyl) acrylic acid and the like. Among these, dicyclopentene (mercapto) acrylate is preferred. The component (B) is a hydroxyl group-containing (meth) acrylate. More specifically, the component (B) is a (meth) acrylate having at least one or more hydroxyl groups in a molecular terminal or a side chain. Examples of the (meth)acrylic acid containing a transradical group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and (meth)acryl hydroxybutyrate. (Methyl)-p-butanoic acid 2_transcarbyl_3_phenoxypropane vinegar, propylene propylene oxyethyl-2- propyl acrylate, (methyl) acrylic acid 4 fluorenylcyclohexan vinegar and the like. Among these, from the viewpoint of the adhesion of the resin film, 2_base

基)丙烯酸酯為較佳。 孔】丞IT ()成刀為具有(甲基)丙稀醯基而成,且具有二 骨系或被IL化之二歸系f架之(甲基) 丙烯酸酉旨,較佳為分之二稀系骨架的(甲基) ,且含有,骨二=== :,。此乃由賦予樹脂柔軟性之觀點,而可=Acrylates are preferred.丞 丞 ( IT () knives are made of (meth) acrylonitrile, and have a skeletal or IL-incorporated tributary f (meth) acrylate, preferably divided into The (methyl) of the dicholine skeleton, and contains, bone two === :,. This is given by the viewpoint of imparting softness to the resin, and

Jli17 ^ 架,可舉出聚丁二婦n之一骨架或被氫化之二稀系骨 聚異戊二烯之氫化物所、—^、聚了二狀氫化物及 架。此等之中,較佳為聚』所選出之1種以上的骨 所構成群組中所選出之=、戍二烯及聚異戊二烯之氫化物 之1細上者,更佳為聚異戊二烯。 6/22 201124463 (c)成分之(曱基)丙烯酸酯乃於前述主鏈骨架末端或於 側鏈具有1個以上之(曱基)丙烯醯基。此等之中,較佳為於 主鏈骨架之兩末端具有(曱基)丙烯醯基者。 、 (c)成分的(曱基)丙烯酸酯之數量平均分子量較佳為 500〜50000 ’更佳為8000〜45_。若數量平均分子量為· 以上,則因為於本發明之黏合劑照射能量線可得之硬化體 的硬度為高,黏合劑層變得容易形成。若數量平均分子量 為50_以下,因為可得之黏合難度為低,於製造過程 混合等作業性或實用用途上使用該黏合麟,作業性為良 好。 作為(C)成分之(曱基)丙烯酸酯,可舉出Kuraray公司製 「UC-203」(異戊二烯聚合物之順丁烯二酸酐加成物與孓 羥乙基異丁烯酸酯之酯化物寡聚合物)、日本曹達公司製 「TEAI-1GGG」(氫化ι,2_聚丁二稀末端基曱酸乙§旨)、日本 曹達公司製「11£.()」(1,2-聚丁二稀末端基曱酸6醋)及其 衍生物、Sartomer 公司製「QK-301」「CN-303」「CN-307」 (聚丁一炸系丙稀酸酯寡聚合物)等。 (D)成分為矽烷偶合劑。作為矽烷偶合劑,可舉出氣 丙基二甲氧基魏、乙稀三甲氧基魏、乙稀三氯石夕院、 乙烯二乙氧基矽烷、乙烯丙基三甲氧基矽烷 、乙卸基-二(β- 甲氧基乙氧基)矽烷、γ_(甲基)丙烯醯氧基丙基三曱氧基矽 烷、β-(3,4-%氧基環己基)乙基三甲氧基矽烷、丫_環氧丙氧 基丙基二曱氧基矽烷、γ_氫硫基丙基三曱氧基矽烷、丫_胺丙 基三乙氧基矽烷、Ν_β-(胺乙基)-γ-胺丙基三曱氧基矽烷、 Ν·β-(胺乙基)个胺丙基曱基二曱氧基矽烷、丫_腺丙基三乙氧 基矽烷、羥乙基(曱基)丙烯酸酯磷酸酯、(甲基)丙烯醯氧基 7/22 201124463 氧乙基酸性磷酸鹽、(甲基)丙烯醯氧基氧乙基酸性磷酸鹽單 乙基胺半鹽等。此等之中,由對玻璃等的黏著性的觀點, 較佳為由γ·環氧丙氧基丙基三曱氧基矽烷、γ_(曱基)丙烯酿 氧基丙基三曱氧基矽统及乙烯丙基三甲氧基矽烷所構成群 組中的1種以上者。 (E)成分為光聚合起始劑。作為光聚合起始劑,可舉出 紫外線聚合起始劑或可見光聚合起始劑等,不管何者均可 無限制使用。作為紫外線聚合起始劑,可舉出笨偶姻系、 二苯基酮系、苯乙酮系。做為可見光聚合起始劑,可舉出 酿基膦氧化物系、。塞吨g同(thi〇xanth〇ne)系、二茂金屬系、 醌系、α-苯胺基烷基酮系等。 作為光聚合起始劑,可舉出二苯基酮、4_苯基二笨基 _、笨曱酿笨偶姻酸、2,2_二乙氧基苯乙酮、雙二乙基胺: 苯基酮、二笨基乙二酮、苯偶姻、苯曱醯異丙基醚、笨曱 基一曱基縮酮、1-羥基環己苯基縮酮、噻吨酮、2_甲基噻吨 酮、2,4·二曱基噻吨酮、異丙基噻吨酮、2,4_二乙基噻吨_、 2,4-二異丙基噻吨酮、μ(4_異丙基笨基)2•羥基_2_甲基丙烷 •1,、Η4·(2-經基乙氧基苯基)_2•羥基_2_甲基小丙 酉同2-沒基-2-曱基小苯基丙烧]·^同、樟腦醌、2,4,6_三甲笨 曱醯基二笨基膦氧化物、雙(2,4,6_三曱苯,)_苯基鱗氧化 物、1曱基小(4·(曱硫基)苯基)-2-嗎琳基丙烧-1·酮、2-笨曱 基-2-一曱基胺嗎啉基苯基)_ι_丁酮a、2_二曱基胺 8/22 1 (4'甲基-苯甲基)_1_(4_嗎。林-4-基·笨基)-丁炫-1-酮、雙(2,6-一曱氧基笨甲酿)_2,4,4·三曱基-戊基膦氧化物等。此等之 中,較佳為苯甲基二甲基縮酮。 本發明之樹脂組成物,含有以前述〜(E)成分為必須 201124463 =而石tr述⑷〜(E)成分之樹脂組成物,藉由受到光的 二、射而硬化。硬化物對環雜聚合物有良好黏合性,勺 二述硬化之時可顯示高絲面硬化性之特徵。本發明2 脂組成物:例如對聚碳酸gl、三乙酸纖維素、聚乙歸醇t 通用之塑膠樹脂、玻璃被黏合體亦可顯示高度之黏合強声。 基) <方;本發明中的樹脂組成物,可含有作為(F)成分之(曱 丙烯酸。此乃特別由耐濕性等的耐久性觀點而使用。 乙 …於本發明中的樹脂組成物,可含有作為(G)成分之聚。 稀醇。此乃由對聚乙_樹脂的黏著性之㈣,可: 以下的成分。 . 刖述聚乙烯醇,若為皂化聚乙酸乙烯酯所得到之聚乙 烯醇衍生物’則並無特縣定。紅_之平均聚合度較 佳為〗00〜5000,更佳為1〇〇〇〜4〇〇〇。聚乙烯醇的平均皂化 值較佳為85〜1〇〇莫耳%,更佳為9〇〜1〇〇莫耳%。 本發明之樹脂組成物的使用量係使黏合劑對環烯烴聚 合物之黏合性為特別高,並且由對其他被黏合體而言也為 具有高度黏合強度的觀點來說,係如以下所示。 (A)成分、(B)成分及(〇成分之使用量,在(A)成分、(b) 成分及(C)成分之合計1〇〇質量份中,較佳為(A)成分:(B)成 分:(C)成分=40〜90:1〜20:5〜45(質量比),更佳為(A)成分:⑻ 成分:(C)成分=55〜85:3〜10:10〜40(質量比)。 (D) 成分之使用量,相對於(A)成分、(b)成分、(c)成分 及按照需要而使用的(F)成分之合計量1〇〇質量份,較佳為 0.01〜10質量份,更佳為0.1〜5質量份,具代表性為〇.5〜1.0 質量份。 (E) 成分之使用量,相對於(A)成分、(B)成分、(Q成分 9/22 201124463 及按照需要而使用的(F)成分之合計量100質量份,較佳為 0.01〜30質量份,更佳為0.1〜20質量份,具代表性為5〜1〇 質量份。 (F) 成分之使用量,在(A)成分、(B)成分、(C)成分及按 照需要而使用的(F)成分之合計量100質量份中,較佳為 0.1〜30質量份,更佳為1〜20質量份,具代表性為10〜15質 量份。 (G) 成分之使用量,相對於(A)成分、(B)成分、(C)成分 及按照需要而使用的(F)成分之合計量!00質量份,較佳為 0.01〜50質量份’更佳為〇.1〜3〇質量份,具代表性為0.5〜1.0 質量份。 再者’本發明之樹脂組成物,在不損及本發明的目的 之範圍,可使用接枝共聚物、溶劑、增量劑、補強材、可 塑劑、增4劑、染料、顏料、阻燃劑、坑氧化劑、及界面 活性劑等的添加劑。 本發明之樹脂組成物的硬化物較佳為具: 0·1〜1(K)_MPa(23 °c )的儲存模數,更佳為具: \0〜10000MPa的儲存模數,具代表性為5〇〇〜5〇〇〇Mpa^ 脂組成物之硬化物的儲存模數為〇1MPa以上的情況,硬' 物0硬化+留下未反應成分。儲存模數為刚_购, 下的情況’硬化物會變得不過度剛硬,黏合力不會低下。 本發明之樹脂組成物可作_合舰用 合劑係對例如環烯烴聚合物、 發月之< 聚乙稀醇及破璃所構成群組中選 =嫌三乙酸纖維素 合聚合物_==' 衣、坆聚合物係為例如降莰烯或多環降莰9 10/22 201124463 具:=¾單體構成單位之熱 環聚合體、制2種以上環物」二舉出環稀烴之開 含有鏈狀触或乙縣之芳香族化;聚物之氮化物、 聚物笠化合物與環烯烴的加成丘 、,本U«之黏合顺別 =環稀烴聚合物有效。又,亦可於環==== 司制!!為市售之環稀煙聚合物,例如可舉出德國Ti_公 =T〇pas」、JSR公司製的「art〇n」、日本ze〇n ^的「脱職」或「ZEONEx」、三井化學公司製的 APEX」等。 、+本發明的黏合劑之黏合方法,較佳例如為以下所述。 被^合體2片當中對至少1片的被黏合體表面塗布厚度為 =0001〜5mm的黏合劑,具代表性為使成為〇 〇1〜〇 5〇mm而 塗布’其後,將被黏合體彼此貼合;波長為200 〜500nm , 具代表性為350〜420nm ;累積光量為200〜6000mJ/cm2,具 代表性為300〜2000mJ/cm2;照射時間為〗〜60秒,具代表性 為2〜3 0秒之條件下使黏合劑硬化,使被黏合體黏合的方法。 本發明亦可使用作為其他成分之抗氧化劑使用。作為 抗氧化劑可使用酚系、氫醌系,較佳為使用酚系。作為抗 氧化劑’可舉例化萘酚醌、2_F氧基-丨,4_萘酚醌、甲基氫 醌、氫醌、2,2-甲烯基-雙(4_甲基_6-第三丁基酚)、鄰苯二酚、 氫醌單甲醚、單第三丁基氫醌、2,5-二第三丁基氫醌、對苯 Stt、2,5-二苯基-對笨醌、2,5-二第三丁基-對苯醌、苦味酸、 知才冡酸、硫二苯胺、第.三丁基鄰苯二酚、2_丁基_4_羥基苯 甲醚及2,6-二第三丁基-對甲酚等。此等之中,較佳為2,2- 11/22 201124463 曱烯基-雙(4-甲基-6-第三丁基酚)。 抗氧化劑之使用量,相對於(A)成分、(B)成分、(c)成 分及按照需要而使用的(F)成分之合計量1〇〇質量份,較佳 為0.01〜10質量份’更佳為〇,1〜8質量份,再更佳為2 〇〜8 〇 質量份。 於以下舉出貫驗例,更詳細地說明本發明,但本發明 並不限於此等。再者,實驗例中記载之黏合射的各成分, 選擇了以下的化合物。 (A)成分作為含有二環戊烯基之(曱基)丙烯酸酯,係二 環戊烯丙烯酸酯(日立化成公司製rFA_511AS」) (A) 成分作為含有二環戊烯基之(甲基)丙稀酸酯,係曱 基丙細酸二環戊烯氧乙S旨(日立化成公司製「fa_512MT」) (B) 成分作為含有羥基之(曱基)丙烯酸酯,係丙烯酸2_ 羥基-3-笨氧丙酯(東亞合成公司製「m_57〇〇」)。 (B) 成分作為含有羥基之(曱基)丙烯酸酯,係甲基丙烯 酸2-羥乙酯(共榮社化學公司製「LIGHT ESTER HO」)。 (C) 成分係寡聚合物、KURARAY公司製「UC-203」(異 戊二烯聚合物之順丁烯二酸酐加成物與曱基丙烯酸2-羥乙 酯之酯化物寡聚合物)(由GPC換算聚苯乙烯之數量平均分 子量為36000)。 (D) 成分係矽烷偶合劑,γ·環氧丙氧基丙基三曱氧基矽 烷(信越化學公司製「ΚΒΜ-403」)。 (D)成分係矽烷偶合劑,乙烯丙基三曱氧基矽烷(信越化 學社製「ΚΒΜ-1003」)。 (D)成分係矽烷偶合劑,γ-曱基丙烯醯氧丙基三曱氧基 矽烷(信越化學公司製「ΚΒΜ-503」)。 12/22 201124463 (E)成分作為光起始劑’係笨曱基二曱基縮酮(ciba Specialty Chemicals 公司製「IRGACURE651」)。 (E) 成分作為光起始劑’係雙(2,4,6-三曱基笨曱醯)_苯基 膦氧化物(Ciba Specialty Chemicals 公司製 「IRGACURE819」)。 (F) 成分係曱基丙稀酸(三菱rayon公司製「am」)。 (F) 成分係丙烯酸(日本觸媒公司製「丙烯酸曱酯AM」)。 (G) 成分係聚乙烯醇(電氣化學工業公司製 「DENKAPOVAL H-17」)(平均聚合度1200 ’平均皂化值 97莫耳%)。 (G)成分係聚乙烯醇(電氣化學工業公司製 「DENKAPOVAL F-12」)(平均聚合度1200、平均皂化值 99莫耳%)、曱基丙烯酸笨曱酯(共榮社化學公司製 Ester BZ」)、曱基丙烯酸月桂酯(共榮社化學公司製「乙匕以 Ester L」)、抗氧化劑、(D-l)2,2-曱烯基-雙(4-曱基_6_第三丁 基酚)(住友化學公司製「SUMILIZER-MDP-S」)。 各種物理性為如下的方式測定。 〔光硬化性〕於温度23。(:測定。關於光硬化性,於 ZEONEX480R(日本ZE0N公司製)試驗片 (25mmx25mmx2.0mm)表面以成為0.03mm之厚度塗布黏合 劑。藉由厚度〇.〇3mm之玻璃珠控制。之後,利用使用無電 極放電,具之FUSI0N公司製硬化裝置’在波長365nm, 累積光量20〇〇mJ/cm2的條件下照射】5秒,使之硬化。作 為光硬化性,記載下硬化率。硬化率係使用FT-IR,由以下 之公式算出。 (硬化率)=[1 〇〇((硬化後碳碳雙鍵之吸收光譜強度)/(硬 13/22 201124463 化前碳碳雙鍵吸收光譜強度))]X1 〇〇(%) 〔環烯烴聚合物黏合性評價(ZEONEX試驗片之間的 拉伸黏合強度)〕於ZEONEX480R(日本ΖΕΟΝ公司製)試驗 片12a(寬25mmx長lOOmmx厚度2.0mm)長度方向之先端部 分’在中央所開〇,5cm2大小之洞11貼上鐵氟龍(註冊商標) 膠帶10(厚度80μιηχ寬25mmx長度25mm)以控制黏合劑厚 度。於該洞11以成為厚度80μιη之方式供給黏合劑13之 後,以覆蓋邊洞11的方式,於鐵敗龍膠帶1〇之上,貼合 另一面之ZEONEX480R(曰本ΖΕΟΝ公司製)試驗片12b(寬 25mmx長度l〇〇mmx厚度2.〇mm)的先端部分。此時的樣子 顯示於圖1。硬化後,使用以黏合劑黏合的該試驗片依圖j 的前頭之左右拉伸,測定拉伸黏合強度。硬化條件係遵從 〔光硬化性〕裡記載之方法。 〔耐濕性〕前述環烯烴聚合物黏合性評價用試驗片暴 露於85°Cx85%RH 24小時暴露,使用該試驗片測定拉伸 黏合強度。 〔通用聚合物黏合性評價(聚碳酸酯(帝人社製)試驗片 之間的拉伸黏合強度)〕 以厚度80μιηχ寬li.5mmx長度25mm之鐵氟龍(註冊商 標)膠帶作為間隔物使用的方式,將pANLITE(帝人公司製) 试驗片(^5mmx25mmx2.0mm)彼此以黏合劑黏合(黏合面積 3.125cm2)。硬化後,使用以點合劑黏合之該試驗片測定拉 伸黏合強度。硬化條件係遵從〔光硬化性〕裡記載之方法。 〔通用聚合物黏合性評價(聚乙烯醇(kuraray公司 製)試驗片之間的拉伸黏合強度)〕以厚度卿⑽寬115_ 長度25_之鐵氟龍(註冊商標)膠帶作為間隔物使用的方 14/22 201124463 式’將試驗片(25mmx25mmx〇.〇3mm)彼此以黏合劑點合(點 • 合面積3.125cm2)。硬化後,使用以黏合劑黏合之該試驗片 測定拉伸黏合強度。硬化條件係遵從〔光硬化性〕裡#己載 之方法。 〔通用聚合物黏合性評價(三乙酸纖維责 (Konica Minolta公司製)試驗片之間的拉伸黏合強度)〕以厚 度80μηιχ寬11.5mmx長度25mm之鐵敦龍(註冊商標)膠帶 作為間隔物使用的方式,將試驗片(25mmx25mmx〇,〇3mmj 彼此以4合劑黏合(黏合面積125cm‘)。硬化後,使用以巧占 合劑黏合之該試驗片測定拉伸黏合強度。硬化條件係遵從 〔光硬化性〕裡記載之方法。 〔玻璃黏合性評價(耐熱玻璃試驗片之間的拉伸黏合 強度)〕以厚度80μιηχ寬11.5mmx長度25mm之鐵氟龍(註 冊商標)膠帶作為間隔物使用的方式,將耐熱玻j离試驗片 (25mmx25mmx2.0mm)彼此,以黏合劑黏合(黏合面積 3‘125cm2)。硬化條件係遵從〔光硬化性〕裡記載之方法。 以前述條件使黏合劑硬化後,更進一步於試驗片背側使用 電氣化學工業公司製之黏合劑「G-55」,將電鍍鋅鋼板 (100mm><25mmx2.0mm,Engineering Test Service 公司製)考占 合。藉由23°C X50%RH><24小時遮蔽硬化後,使用以黏合劑 黏合之該試驗片測定拉伸黏合強度。拉伸剪裂黏合強度(單 位:MPa)係於温度23°C,濕度50%的環境下以拉伸速度 10mm/分測定。 〔儲存模數評價〕使黏合劑硬化,調製長度20mm、寬 5mm、X厚度1mm之硬化物試料。硬化條件係遵從〔光硬 化性〕裡記載之方法。評價此硬化物試料。使用SEIKO電 15/22 201124463 子工業公司製之TENSION MODULE DMS210,頻率1Hz, 歪扭度0.05%的條件下變更温度,於拉伸模式測定動態黏彈 性光譜,求得於23°C儲存模數E‘之値。 (實驗例1〜17)以表1所示之組成,混合如表1所示種 類之原料以調製黏合劑。對所得到之黏合劑實行各種物理 性的測定。其結果顯示於表1。 16/22 201124463 表1-1 宵_例1 苗眹例2 宵眹刚3 宵眹例4 宵眹例5 宵眹例5 A : _抿由棟丙相敌fig FiFl.fl π·η FiFi.n FiFi.n a :二塚戊烯a乙基@丙_1 55.0 B : 211基-3每氣丙基丙删| 5.0 5.0 5.0 5.0 5.0 曰· ,乙基巨 UU C : 物「UC-203J sn.n ίιΊ.η ?:n.n ?η.π ?n.n sri.n D : y _痕致丙S3丙基三甲 院 0.5 0.5 0.5 0.5 0.5 0.5 D : 7.枨丙某=田筑雜难 組成 D : r -甲基丙烯_丙基三甲 全成分中 E :笨田某二田某筛S目 2笪里份 f n Fi n F; fl f: η F: η F, fl E : !Ci4>三甲基翠甲肢 化物 f : inn in n in n in. η in n F :丙讎 <3 :聚乙烤S?「DENKAPOW丄 H-1?」 0.5 0.5 0.5 0.5 3 :聚乙:*涵I「DEMKAPOVALF-ISj 甲某丙烯酸芘 甲苺丙烯瞭日样脂....................................... ^im\ 4.n 光硬化竹 inn inn Kin inn inn 1ΓΙΓΙ 頃烯垤聚合构 (ZE0NEX) 試驗片2W的拉伸黏合度 MPa 5.0 5.0 另.0 5.0 5.0 0.1 聚碳_11(帝人公司製) 試驗片2蘭的垃伸黏台 MPa 15.0 9.0 1『丨.0 3.0 1.0 15.0 聚乙烯5?(KUEAEAY公司製) 試験片2間的拉伸黏台度 MPa 15.0 15.0 15.0 3.0 15.0 15.0 If價 特性 三賭酸缌维卖 試驗片2間的垃伸黏台^电® MPa 10.0 8.0 e.o 10.0 e.o 8.0 耐熟坡荏 試驗片2間的垃伸黏激电度 MPa 15.0 8.0 9.0 9.0 1.0 8.0 耐渴性 ZE0NEX Ιί_.Κ:7閱的柃伸职岛电帝 MPa 5.0 4.8 1.0 包·0 2.4 0.1 Μ存棋數(23Ό MPa 1000 1200 1000 1200 0.01 800 甯協例 甫fSf例 卜h前例 )7/22 201124463 表1-2 苗眹刚7 窗眹例8 宵眹刚9 ^5??··?· :C 兰社?,?,:: A: _活步枨丙伤 ΕΚ.Π BB.n 55. η FiFi.n inn.η a :二瑕戊烯a乙基甲基丙jt^gg 55.0 B : 2ϋ基-3每a丙基丙祐發|| 5.0 5.0 5.0 5.0 B : 2^7.苕田某丙嫌激gg C :其锻合物「UC-203J sn.n ?n.n ?.η.η fl.9. sn.n d : 7· _宿a丙a基丙基三甲苗基政 0.5 0.5 0.5 2.8 0.5 D : 7.描丙其二田筑^倍 組成 D: r ·甲基丙烯睡S丙基三甲 全成分中 E :笼甲甚二甲甚湖目 2S里份 F.fl s.n s.n F.n E :雙〇;4令三甲基笨甲眭 仆物 F :田额獅 m n in n in η m n n f: inn F :丙麵 G :聚乙保81「DHiKAFOVALH-l?』 0.5 0.5 0.5 0.5 0.5 <3 :聚乙為81「denkapovalf-q 田某丙烯敢自 田某丙祿敢日括能 F.n 4.ΙΊ 来5P仆忡 inn n inn inn inn mn 瑕恶合物 (ZE0NEX) 試驗片2間的拉伸黏台?£度 MPa 3.0 因未硬化 蔌法測定 1.0 〇.〇 8.0 5.0 聚碳酸醒@人公司製) 試験片2除的位伸黏台k度 MPa 1.0 因未硬化 葙法測定 3.0 13.0 1·0 9.8 蜃_®縐) MPa 3.0 因未晅化 庙法測定 7.0 2.0 0.0 10.0 評僳 掊性 三賭歃缁睢索 試騃片2闈的垃伸黏台?矣度 MPa 1.0 E未頃化 振法測定 1.0 S.O 1.0 12.0 耐熟圾瑶 試験片2間的垃伸黏台度 MPa 9.0 因未硬化 蔌法測定 1.0 9.0 1.0 10.0 耐遅性 Σ E ON EX 試騃閱的泠伸_电审 MPa 0.1 因未硬化 寂法測定 2.0 0.0 0.0 4.9 锸存棋軟(23Ό MPa 800 因未硬化 蔌法測定 1000 1000000 0.01 1000 借老 卜hi?刚 卜h莳则 hhivi9)l H:節例 卜h筘刚 18/22 201124463 表1-3 1 5 ^'Ί4 ^=??·~Ί5 ^=^-*16 ^=^'17 A :-适戍描丙^^5岩 55.0 55.0 55.0 55.0 55.0 A :二塚戊烯氣乙基甲基丙烤酸0音 B : g基-3却氣丙基丙烯酸61 5.0 5·0 5.0 5.0 R : WT;某田某丙 Fi.fl C : S:取会物「LM:-203l HI ?Π.Π 加·η in.η ί:η.η D : y -環氣丙気基^三甲完 0.5 0.5 0.5 0.5 D : 7.烯丙某三田运某剧完 组成 D : 甲基丙烯眭+E丙基三甲§^5乃完 全成分中 0.5 E :笨甲基二甲基觸同 之質量份 5.0 5.0 S.G 5.η E : 甲基笨甲睦诗.基臟似自 5.0 F :申甚葙保5S m.n in.η in.π in.η f : 1il.fl G :聚乙烯g|「DENKAPOVALH-l?」 0.5 0.5 0.5 0.5 G :聚乙烯Bl「DENKAFOVALF-12j 0.5 甲基丙烯歃笨 甲某丙烯歃日样^ ^Ahm 4.0 4.0 4.0 4.0 4.0 光 ίΡ(Μΐ 100 100 100 100 100 璟烯烴聚合物 (Ξ ΕΟΝΕΧ) 試験片2間的拉伸黏台度 MPa 4.8 5.0 5.0 5.2 δ_2 聚碳酸醒人公司製) 試險片2間的位伸黏台度 MPa 10.0 10.0 3.0 10.0 10.ϋ 聚乙烯薛(KURARAY公司製) 試險片2間的拉伸黏台度 MPa 11.0 10.0 9.0 11.0 10.0 1?價 特性 三賭酸锻維盎 試験片2間的位伸黏台度 MPa 11,0 10.0 10.0 10.0 12.0 amim 試驗片2間的m伸黏台^矣度 MPa 13.0 14.0 7.0 13.0 9.0 耐渴性 ΖΕΟΝΕΧ 試驗片之間的拉伸黏部度 MPa 4.5 4.9 4.3 5.0 4.7 锸存棋軟(23Ό MPa 1000 1000 1000 900 1000 ί造者 苗旃例 苗旃例 甘旃例 官旃例 本案發明,對於環烯烴聚合物、聚碳酸酯、聚乙烯醇及玻 璃,可顯示充分的黏合強度。本案發明具有耐濕性。 19'/ 22 201124463 【圖式簡單說明】 圖1係顯示於實施例中之拉伸黏合強度測定順序的模 式圖。 【主要元件符號說明】 10 鐵氟龍膠帶 11 洞 12a > 12b 試驗片 13 黏合劑 20/22The Jli17 ^ frame can be exemplified by one of the skeletons of the polybutanin or the hydrogenated two-distilled polyisoprene, a polyhydride and a hydride. Among these, it is preferred that the hydride of the decadiene and the polyisoprene selected in the group consisting of one or more kinds of selected bones is more preferably agglomerated. Isoprene. 6/22 201124463 The (mercapto) acrylate of the component (c) has one or more (fluorenyl) acrylonitrile groups at the terminal of the main chain skeleton or in the side chain. Among these, those having a (fluorenyl) acrylonitrile group at both ends of the main chain skeleton are preferred. The number average molecular weight of the (mercapto) acrylate of the component (c) is preferably from 500 to 50,000 Å or more preferably from 8,000 to 45 Å. When the number average molecular weight is · or more, the hardness of the hardened body which is obtained by irradiating the energy ray to the adhesive of the present invention is high, and the adhesive layer is easily formed. If the number average molecular weight is 50 Å or less, since the available bonding difficulty is low, the adhesive lining is used for workability or practical use such as mixing in the manufacturing process, and the workability is good. The (mercapto) acrylate of the component (C) includes "UC-203" manufactured by Kuraray Co., Ltd. (an ester of a maleic anhydride adduct of isoprene polymer and oxime hydroxyethyl methacrylate) "Chemical oligopolymer", "TEAI-1GGG" manufactured by Japan Soda Co., Ltd. (hydrogenated ι, 2_ polybutylene dibasic decanoic acid), and "11£.()" made by Japan Soda Co., Ltd. (1,2- Polybutylene dilute terminal decanoic acid 6 vinegar) and its derivatives, "QK-301", "CN-303" and "CN-307" manufactured by Sartomer Co., Ltd. (polybutylene-based emulsifier oligoacrylate). The component (D) is a decane coupling agent. Examples of the decane coupling agent include gas propyl dimethoxy wei, ethylene trimethoxy wei, ethylene triclosan, ethylene diethoxy decane, vinyl propyl trimethoxy decane, and ethyl bromide. - bis(β-methoxyethoxy)decane, γ-(meth)acryloxypropyltrimethoxy decane, β-(3,4-%oxycyclohexyl)ethyltrimethoxydecane , 丫_glycidoxypropyl decyloxydecane, γ-hydrothiopropyltrimethoxy decane, hydrazine-aminopropyltriethoxy decane, Ν_β-(aminoethyl)-γ- Aminopropyltrimethoxy decane, Ν·β-(aminoethyl)amine propyl decyl decyloxydecane, 丫_glycol triethoxy decane, hydroxyethyl (fluorenyl) acrylate Phosphate ester, (meth) propylene oxime 7/22 201124463 oxyethyl acid phosphate, (meth) propylene oxy oxyethyl acid phosphate monoethylamine half salt, and the like. Among these, from the viewpoint of adhesion to glass or the like, γ·glycidoxypropyltrimethoxy decane and γ-(indenyl)acryloxypropyltrimethoxy oxime are preferred. One or more of the group consisting of vinyl propyl trimethoxy decane. The component (E) is a photopolymerization initiator. The photopolymerization initiator may, for example, be an ultraviolet polymerization initiator or a visible light polymerization initiator, and may be used without limitation. Examples of the ultraviolet polymerization initiator include a benzoin system, a diphenylketone system, and an acetophenone system. As the visible light polymerization initiator, a styrene phosphine oxide system can be mentioned. The ton is the same as the (thi〇xanth〇ne) system, the metallocene system, the lanthanide system, the α-anilinoalkyl ketone system, and the like. Examples of the photopolymerization initiator include diphenyl ketone, 4-phenyl diphenyl group, abbreviated benzoate acid, 2,2-diethoxyacetophenone, and di-diethylamine: Phenyl ketone, dipyridylethylenedione, benzoin, phenylhydrazine isopropyl ether, alum, fluorenyl ketone, 1-hydroxycyclohexyl ketal, thioxanthone, 2-methyl Thioxanthone, 2,4·dimercaptothioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthene, 2,4-diisopropylthioxanthone, μ(4_iso Propyl stupyl) 2•hydroxy-2-methylpropane•1, Η4·(2-p-ethoxyphenyl)_2•hydroxy-2-methylpyridinium-2-nonyl-2-曱基小phenyl丙烧]·^同, camphor 醌, 2,4,6_ 三甲曱醯曱醯基二笨基phosphine oxide, bis(2,4,6_triphenyl), phenyl scale Oxide, 1 fluorenyl small (4·(decylthio)phenyl)-2-morphinylpropan-1-yl ketone, 2-crackanyl-2-monodecylamine morpholinylphenyl)_ι _butanone a, 2_didecylamine 8/22 1 (4'methyl-benzyl)_1_(4_? Lin-4-yl·stupyl)-Dingxuan-1-one, double ( 2,6-monooxyl stupid)_2,4,4·tridecyl-pentylphosphine oxide, and the like. Among these, benzyldimethylketal is preferred. The resin composition of the present invention contains a resin composition in which the above-mentioned (E) component is required, and the resin composition of the components (4) to (E) is hardened by exposure to light. The hardened material has good adhesion to the ring-shaped polymer, and the scoring of the high-filament surface can be characterized by scoring. The lipid composition of the present invention: for example, a plastic resin which is commonly used for polycarbonate gl, cellulose triacetate, polyethylene glycol, and glass-adhered body can also exhibit a high degree of adhesion and strong sound. The resin composition in the present invention may contain (F) as a component (F). This is particularly useful from the viewpoint of durability such as moisture resistance. B... Resin composition in the present invention The material may contain as a component (G). A dilute alcohol. This is the adhesion to the polyethylene-resin (4), and may be: The following components: . A description of polyvinyl alcohol, if it is a saponified polyvinyl acetate The obtained polyvinyl alcohol derivative 'is not particularly determined. The average degree of polymerization of red _ is preferably from 00 to 5,000, more preferably from 1 to 4 Å. The average saponification value of polyvinyl alcohol is higher. Preferably, it is 85 to 1% by mole, more preferably 9% to 1% by mole. The resin composition of the present invention is used in an amount such that the adhesion of the binder to the cycloolefin polymer is particularly high, and From the viewpoint of having high adhesion strength to other adherends, it is as follows. (A) component, (B) component, and (〇 component usage amount, in (A) component, (b) In the total of 1 part by mass of the component and the component (C), it is preferably (A) component: (B) component: (C) component = 40 to 90: 1 to 20: 5 to 45 (quality) More preferably, it is (A) component: (8) Component: (C) component = 55 to 85: 3 to 10: 10 to 40 (mass ratio) (D) The amount of the component used, relative to the component (A), The total amount of the component (b), the component (c), and the component (F) used as needed is 1 part by mass, preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, representatively 〇.5 to 1.0 parts by mass. (E) The amount of the component used, relative to the total amount of (A) component, (B) component, (Q component 9/22 201124463, and (F) component used as needed The component is preferably 0.01 to 30 parts by mass, more preferably 0.1 to 20 parts by mass, and is typically 5 to 1 part by mass. (F) The amount of the component used, in the component (A), the component (B), The 100 parts by mass of the total amount of the component (C) and the component (F) used as needed are preferably 0.1 to 30 parts by mass, more preferably 1 to 20 parts by mass, and typically 10 to 15 parts by mass. (G) The amount of use of the component is preferably 0.01 to 50 parts by mass based on the total amount of the component (A), the component (B), the component (C), and the component (F) used as needed. 'More preferably 〇.1~3〇 parts by mass, Typically, it is 0.5 to 1.0 part by mass. Further, the resin composition of the present invention may be a graft copolymer, a solvent, a bulking agent, a reinforcing material, a plasticizer, or the like, without departing from the object of the present invention. Adding 4 agents, dyes, pigments, flame retardants, pit oxidants, and surfactants, etc. The cured product of the resin composition of the present invention preferably has: 0·1~1(K)_MPa (23 °c) The storage modulus is more preferably: storage modulus of \0~10000MPa, representatively 5〇〇~5〇〇〇Mpa^ The storage modulus of the cured product of the fat composition is 〇1MPa or more , hard 'object 0 hardening + leaving unreacted ingredients. When the storage modulus is just _, the next case, the hardened material will become excessively rigid and the adhesive force will not be lowered. The resin composition of the present invention can be used as a mixture of a mixture of, for example, a cyclic olefin polymer, a fluorinated polymer, a polyethylene glycol, and a glass granule. =' The clothing and bismuth polymers are, for example, norbornene or polycyclic hydrazine 9 10/22 201124463 with: = 3⁄4 monomeric unit of thermal ring polymer, two or more kinds of rings are produced" The opening contains a chain-like contact or the aromaticization of the county; the addition of the nitride of the polymer, the addition of the ruthenium compound to the cyclic olefin, and the bonding of the U« are effective. In addition, it can also be used in the ring ==== system!! It is a commercially available ring-thin smoked polymer, for example, German Ti_gong = T〇pas, "art〇n" by JSR, and Japanese ze脱n ^ "Dismissal" or "ZEONEx", APEX by Mitsui Chemicals Co., Ltd., etc. Preferably, the bonding method of the adhesive of the present invention is as follows. An adhesive having a thickness of =0001 to 5 mm is applied to at least one of the surfaces of the bonded body of the two bonded sheets, and is typically coated so as to be 〇〇1 to 〇5〇mm, and then to be bonded. They are bonded to each other; the wavelength is 200 to 500 nm, representatively 350 to 420 nm; the cumulative light amount is 200 to 6000 mJ/cm 2 , and the representative is 300 to 2000 mJ/cm 2 ; the irradiation time is 〖60 seconds, representative is 2 A method of hardening the adhesive under conditions of ~30 seconds to bond the bonded body. The present invention can also be used as an antioxidant for other components. As the antioxidant, a phenol type or a hydroquinone type can be used, and a phenol type is preferably used. As an antioxidant, it can be exemplified by naphthol quinone, 2_F oxy-indole, 4-naphthol quinone, methylhydroquinone, hydroquinone, 2,2-methenyl-bis (4-methyl-6-third) Butyl phenol), catechol, hydroquinone monomethyl ether, mono-tert-butylhydroquinone, 2,5-di-t-butylhydroquinone, p-phenylene Stt, 2,5-diphenyl-pair Bismuth, 2,5-di-t-butyl-p-benzoquinone, picric acid, chloric acid, thiodiphenylamine, butyl catechol, 2-butyl-4-hydroxyanisole and 2,6-di-t-butyl-p-cresol and the like. Among these, 2,2- 11/22 201124463 nonenyl-bis(4-methyl-6-tert-butylphenol) is preferred. The amount of the antioxidant to be used is preferably 0.01 to 10 parts by mass based on the total amount of the component (A), the component (B), the component (c), and the component (F) used as needed. More preferably, it is 1 to 8 parts by mass, and more preferably 2 to 8 parts by mass. The present invention will be described in more detail by way of the following examples, but the invention is not limited thereto. Further, the following compounds were selected for each component of the adhesive shot described in the experimental examples. (A) component is a dicyclopentenyl-containing (fluorenyl) acrylate, which is a dicyclopentene acrylate (rFA_511AS, manufactured by Hitachi Chemical Co., Ltd.). (A) Component as a dicyclopentenyl group (methyl) Acrylate, thiol propionate dicyclopentene oxyethylene S ("fa_512MT" manufactured by Hitachi Chemical Co., Ltd.) (B) Component as a hydroxyl group-containing (mercapto) acrylate, 2 - hydroxy-3-acrylate Alkyl propyl ester ("m_57〇〇" manufactured by Toagosei Co., Ltd.). (B) The component is a hydroxy group-containing (mercapto) acrylate, which is 2-hydroxyethyl methacrylate ("LIGHT ESTER HO" manufactured by Kyoeisha Chemical Co., Ltd.). (C) Component-based oligopolymer, "UC-203" manufactured by KURARAY Co., Ltd. (maleate anhydride of isoprene polymer and esterified oligopolymer of 2-hydroxyethyl methacrylate) The number average molecular weight of polystyrene converted by GPC is 36,000). (D) The component is a decane coupling agent, γ·glycidoxypropyltrimethoxy decane (“ΚΒΜ-403”, manufactured by Shin-Etsu Chemical Co., Ltd.). The component (D) is a decane coupling agent, and a vinyl propyl trimethoxy decane ("-1003" manufactured by Shin-Etsu Chemical Co., Ltd.). The component (D) is a decane coupling agent, γ-mercaptopropenyloxypropyltrimethoxy decane ("ΚΒΜ-503" manufactured by Shin-Etsu Chemical Co., Ltd.). 12/22 201124463 The component (E) is a photoinitiator, which is a fluorene-based didecyl ketal ("IRGACURE 651" manufactured by Ciba Specialty Chemicals Co., Ltd.). The component (E) is a photoinitiator's bis(2,4,6-tridecyl alum)-phenylphosphine oxide ("IRGACURE 819" manufactured by Ciba Specialty Chemicals Co., Ltd.). (F) The component is mercaptoacrylic acid ("am" manufactured by Mitsubishi Rayon Corporation). (F) The component is acrylic acid ("Acrylate acrylate AM" manufactured by Nippon Shokubai Co., Ltd.). (G) The component is polyvinyl alcohol ("DENKAPOVAL H-17", manufactured by Denki Kagaku Kogyo Co., Ltd.) (average degree of polymerization: 1200 Å, average saponification value: 97 mol%). The component (G) is polyvinyl alcohol ("DENKAPOVAL F-12" manufactured by Denki Kagaku Kogyo Co., Ltd.) (average degree of polymerization: 1200, average saponification value: 99 mol%), and cumyl methacrylate (Ester, manufactured by Kyoeisha Chemical Co., Ltd.) BZ"), lauryl methacrylate ("Ester L" manufactured by Kyoeisha Chemical Co., Ltd.), antioxidant, (Dl) 2,2-decenyl-bis(4-mercapto-6_third Butyl phenol) ("Sumitil Chemical Co., Ltd." "SUMILIZER-MDP-S"). Various physical properties were measured in the following manner. [Photocurability] at a temperature of 23. (Measurement: For the photocurability, the surface of the test piece (25 mm x 25 mm x 2.0 mm) of ZEONEX 480R (manufactured by JEOL Ltd., Japan) was applied to a thickness of 0.03 mm, and was controlled by a glass bead having a thickness of 〇3 mm. Using a non-electrode discharge, the curing device of the FUSI0N company has been irradiated for 5 seconds at a wavelength of 365 nm and a cumulative light amount of 20 〇〇mJ/cm 2 to cure it. As a photocurability, the lower hardening rate is described. Using FT-IR, it is calculated by the following formula: (hardening rate) = [1 〇〇 ((absorption spectrum intensity of carbon-carbon double bond after hardening) / (hard 13/22 201124463 pre-carbon carbon double bond absorption spectrum intensity) )] X1 〇〇 (%) [Evaluation of adhesion of cycloolefin polymer (stretch adhesive strength between ZEONEX test pieces)] length of test piece 12a (width 25 mm x length lOOmm x thickness 2.0 mm) of ZEONEX 480R (manufactured by Nippon Paint Co., Ltd.) The tip end portion of the direction is opened at the center, and the hole 11 of 5 cm2 is attached with Teflon (registered trademark) tape 10 (thickness 80 μm χ width 25 mm x length 25 mm) to control the thickness of the adhesive. The hole 11 is made to have a thickness of 80 μm. After the way of supplying the adhesive 13, The method of covering the side hole 11 is applied to the tip end portion of the ZEONEX 480R (manufactured by Sakamoto Co., Ltd.) test piece 12b (width 25 mm x length l 〇〇 mm x thickness 2. 〇 mm) on the other side of the iron tape. The state at this time is shown in Fig. 1. After the curing, the test piece bonded with the adhesive was stretched to the left and right of the front side of the figure j, and the tensile bonding strength was measured. The curing conditions were as follows: [photohardenability] [Hygroresity resistance] The test piece for evaluation of adhesion of the above cycloolefin polymer was exposed to 85 ° C x 85% RH for 24 hours, and the test piece was used to measure the tensile bond strength. [General Polymer Adhesive Evaluation (Polycarbonate) (Tension Co., Ltd.) Tensile bond strength between test pieces)] PANLITE (manufactured by Teijin Co., Ltd.) was tested by using a Teflon (registered trademark) tape having a thickness of 80 μm χ χ li . . . . The sheets (^5 mm x 25 mm x 2.0 mm) were bonded to each other with an adhesive (adhesive area: 3.125 cm 2 ). After hardening, the tensile strength was measured using the test piece bonded with a dot-bonding agent. The hardening conditions were as described in [Photohardenability]. [Evaluation of general polymer adhesion (stretch bonding strength between test pieces of polyvinyl alcohol (manufactured by Kuraray Co., Ltd.)] is used as a spacer with a thickness of (10) width 115_length 25_Teflon (registered trademark) tape. Party 14/22 201124463 Type 'The test pieces (25mmx25mmx〇.〇3mm) are glued to each other (dot • area 3.125cm2). After the hardening, the tensile bond strength was measured using the test piece bonded with a binder. The hardening conditions are in accordance with the method of [photocuring]. [Evaluation of general polymer adhesion (stretch adhesive strength between test pieces of triacetate fiber (Konica Minolta) test piece)] is used as a spacer with a thickness of 80 μηιχ11.5 mmx and a length of 25 mm of iron Dunlong (registered trademark) tape. In the manner of the test piece (25 mm x 25 mm x 〇, 〇 3 mmj bonded to each other with a mixture of 4 (adhesive area: 125 cm'). After hardening, the tensile bond strength was measured using the test piece bonded with a cling agent. The hardening conditions were followed by photohardening. [Methods described in the article] [Evaluation of glass adhesion (stretch bonding strength between heat-resistant glass test pieces)] A method of using a Teflon (registered trademark) tape having a thickness of 80 μm, a width of 11.5 mm, and a length of 25 mm as a spacer. The heat-resistant glass is separated from the test piece (25 mm x 25 mm x 2.0 mm) by an adhesive (adhesive area: 3'125 cm2). The curing conditions are as follows: the method described in [Photocurability]. After the above conditions are used to harden the adhesive, Further, the adhesive "G-55" made by Electric Chemical Industry Co., Ltd. was used on the back side of the test piece, and the electrogalvanized steel plate (100 mm ><25 mm x 2.0 mm, Engineering Test S) was used. The ervice company made a test. After 23 hours of X50% RH> <24 hours of masking and hardening, the test piece was bonded with a binder to determine the tensile bond strength. Tensile shear bond strength (unit: MPa) It is measured at a tensile speed of 10 mm/min in an environment of a temperature of 23 ° C and a humidity of 50%. [Evaluation of storage modulus] The adhesive is cured to prepare a cured sample having a length of 20 mm, a width of 5 mm, and an X thickness of 1 mm. The conditions were as follows. The cured product sample was evaluated. The temperature was changed using a EISION MODULE DMS210 manufactured by SEIKO Electric Co., Ltd., 1524, 201124463 Sub-Industrial Co., Ltd. at a frequency of 1 Hz and a twist of 0.05%. The dynamic viscoelastic spectrum was measured by a tensile mode, and the modulus E' was stored at 23 ° C. (Experimental Examples 1 to 17) The compositions shown in Table 1 were mixed to prepare a bonding material of the type shown in Table 1. The physical properties of the obtained adhesive were measured. The results are shown in Table 1. 16/22 201124463 Table 1-1 宵_Example 1 Nursery Example 2 宵眹 just 3 宵眹 Example 4 宵眹 Example 5 Example 5 A : _ 抿 栋 栋 Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi Fi a : Dipentene pentene a ethyl@丙_1 55.0 B : 211 yl-3 per propyl propyl group | 5.0 5.0 5.0 5.0 5.0 曰· , Ethyl giant UU C : "UC-203J sn.n ίιΊ. η ?:nn ?η.π ?nn sri.n D : y _ trace-induced S3 propyl tri-aluminum 0.5 0.5 0.5 0.5 0.5 0.5 D : 7. 枨 某 = = Tian Zhu miscellaneous composition D : r - methyl Propylene propylene propylene triglyceride in the whole component E: 笨田某二田一筛 S mesh 2笪里分 fn Fi n F; fl f: η F: η F, fl E : !Ci4> trimethyl emerald f : inn in n in n in. η in n F : 雠 雠 <3 : 聚乙烤 S? "DENKAPOW 丄 H-1?" 0.5 0.5 0.5 0.5 3 : Poly B: * 涵 I "DEMKAPOVALF-ISj A An acrylic 芘 莓 丙烯 丙烯 日 日 ... .......................................... ^ Im\ 4.n Light-hardened bamboo inn Kin inn inn 1ΓΙΓΙ 垤 垤 垤 (ZE0NEX) Test piece 2W tensile adhesion MPa 5.0 5.0 Other.0 5.0 5.0 0.1 Polycarbon _11 (made by Teijin) Test piece 2 Lan's stretch-adhesive table MPa 15.0 9.0 1『丨.0 3.0 1.0 15.0 Polyethylene 5? (made by KUEAEAY Co., Ltd.) Tensile adhesion degree of test piece 2 MPa 15.0 15.0 15.0 3.0 15.0 15.0 If the price characteristic three sizzling 缌 缌 试验 试验 试验 试验 试验 2 2 2 2 2 2 0.0 0.0 0.0 0.0 0.0 8.0 8.0 8.0 8.0 8.0 8.0 The fatigue resistance of the mature prosthetic test piece 2 is MPa 15.0 8.0 9.0 9.0 1.0 8.0 Thirst resistance ZE0NEX Ιί_.Κ: 7 reading of the 柃 职 岛 岛 MPa 5.0 4.8 1.0 pack·0 2.4 0.1 Μ Chess number (23Ό MPa 1000 1200 1000 1200 0.01 800 Ningxie case fSf case h preceded) 7/22 201124463 Table 1-2 Miao Weigang 7 Window example 8 宵眹 just 9 ^5??··?· : C Lanshe?,? ,:: A: _活步枨丙ΕΚ.ΕΚ BB.n 55. η FiFi.n inn.η a : Dipentene aethyl methyl propyl jt^gg 55.0 B : 2 mercapto-3 per a Propyl propyl ke || 5.0 5.0 5.0 5.0 B : 2^7. Putian a C. agonist gg C: its forged compound "UC-203J sn.n ?nn ?.η.η fl.9. sn. Nd : 7· _ 宿 a prop-propyl propyl trimethylmethane basal 0.5 0.5 0.5 2.8 0.5 D : 7. Description of the two fields of the building of the second building D: r · methacrylic sleeping S propyl trimethyl all in the E : Cage, dimethyl sulphate, 2S, F.fl sn sn Fn E: scorpion; 4, trimethyl scorpion servant F: Tian lion mn in n in η mnnf: inn F : G: Poly B&B 81 "DHiKAFOVALH-l?" 0.5 0.5 0.5 0.5 0.5 <3: Poly B is 81"denkapovalf-q Tianmian propylene dare from Tianmou Lulu dare day can be Fn 4.ΙΊ Come 5P servant inn n inn inn inn mn 瑕 合物 (ZE0NEX) tensile sheet of test piece 2? £ MPa 3.0 Determination by unhardened 蔌 method 1.0 〇. 〇 8.0 5.0 Polycarbonate awake @人公司) Test 2 2 Sticky stick K degree MPa 1.0 Measured by unhardened 葙 method 3.0 13.0 1·0 9.8 蜃_®绉) MPa 3.0 Measured by the method of undecided temple 7.0 2.0 0.0 10.0 Evaluation of the three gambling 试 试 test film 2 闱伸 MPa MPa E MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa SO SO SO SO SO SO SO SO SO SO SO SO SO SO SO SO SO SO SO SO SO SO MPa MPa MPa MPa MPa MPa MPa 因E ON EX try to read the 泠 _ _ MPa 0.1 Measured by the unhardened dead method 2.0 0.0 0.0 4.9 锸 棋 chess soft (23 Ό MPa 800 due to the unhardened 蔌 method determination 1000 1000000 0.01 1000 borrowed old ji hi?莳则hhivi9)l H: Festival example h筘 just 18/22 201124463 Table 1-3 1 5 ^'Ί4 ^=??·~Ί5 ^=^-*16 ^=^'17 A :- Suitable scanning丙^^5岩 55.0 55.0 55.0 55.0 55.0 A : Dipentene pentene ethyl methyl propylene roasting acid 0 tone B: g-group-3 but gas propyl acrylate 61 5.0 5·0 5.0 5.0 R : WT; C. Fi.fl C : S: Take the meeting object "LM: -203l HI ?Π.Π Plus·η in.η ί:η.η D : y - ring gas 気 ^ ^ ^ 三 三 finished 0.5 0.5 0.5 0.5 D : 7. Allene C. : methacryl oxime + E propyl trimethyl § ^ 5 is the complete component of 0.5 E : stupid methyl dimethyl contact mass parts 5.0 5.0 SG 5.η E : methyl stupid 睦 . .. 5.0 F : Shen Nabao 5S mn in.η in.π in.η f : 1il.fl G : Polyethylene g|"DENKAPOVALH-l?" 0.5 0.5 0.5 0.5 G : Polyethylene Bl "DENKAFOVALF-12j 0.5 A Acetylene 歃 甲 甲 甲 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ A 100 100 100 100 100 100 100 100 璟 聚合物 100 100 100 100 100 MPa MPa MPa MPa MPa MPa MPa MPa MPa MPa Δ_2 Polycarbonate awake company) The position and adhesion of the test piece 2 MPa 10.0 10.0 3.0 10.0 10.ϋ Polyethylene Xue (made by KURARAY) The tensile bond degree of the test piece 2 MPa 11.0 10.0 9.0 11.0 10.0 1? Price characteristics Three gambling acid forging 盎 験 験 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Thirsty ΖΕΟΝΕΧ Tensile adhesion between test pieces MPa 4.5 4.9 4.3 5.0 4.7 锸 棋 棋 (23 MPa 1000 1000 1000 900 1000 ί creature seedlings seedlings Zhan Zhan Example Example Example officer Zhan case Gan Zhan invention, cycloolefin polymer, polycarbonate, polyvinyl alcohol, and glass, can exhibit sufficient bond strength. The invention of the present invention has moisture resistance. 19'/ 22 201124463 [Simplified description of the drawings] Fig. 1 is a pattern diagram showing the order of measurement of the tensile bonding strength in the examples. [Main component symbol description] 10 Teflon tape 11 hole 12a > 12b test piece 13 adhesive 20/22

Claims (1)

201124463 七、申請專利範圍: 1. 一種樹脂組成物,其特徵為含有下述(A)〜(E)成分而成: (A) 成分係具有二環戊烯基之(甲基)丙烯酸酯; (B) 成分係具有羥基之(曱基)丙烯酸酯; (C) 成分係具有(甲基)丙烯醯基,且具有二烯系的骨架或具 有被氫化之二烯系骨架之(甲基)丙烯酸酯; (D) 成分係矽燒偶合劑; (E) 成刀係光聚合起始劑。 2·如申請專利範圍第1項之樹脂組成物,其中更含有作為(F) 成分之(曱基)丙烯酸而成。 3. 如申請專利範圍第1或2項之樹脂組成物,其中更含有作 為(G)成分之聚乙烯醇而成。 4. 如申請專利範圍第1或2項之樹脂組成物,其中(A)成分、 (B)成分及(C)成分之使用量,係在(A)成分、成分及(C) 成分合計10〇質量份中,(A)成分:(B)成分:(C)成分 =40〜90:1〜20:5〜45(質量比); (D) 成分之使用量,係相對於成分、(B)成分、及(q成 分合計量100質量份,或(F)成分被使用時則相對於(A)成 分、(B)成分、(〇成分、及(F)成分合計量1〇〇質量份,為 0.01〜10質量份; (E) 成分之使用量,係相對於(A)成分、(B)成分、及〇成分 合計量100質量份,或(F)成分被使用時則相對於(A)成分、 (B)成分、(C)成分、及(F)成分合計量100質量份,為0.01〜30 質量份。 5. 如申請專利範圍第1或2項之樹脂組成物,其中(A)成分係 二環戊烯(曱基)丙烯酸酯。 21 /22 201124463 6. 如申請專利範圍第!或2項之樹脂組成物,其 數量平均分子量為500〜50000。 刀之 7. 如申請專利範圍第1或2項之樹脂組成物,其中 成物係厚度為0.03mm,且藉由波長365nm,St 2000mW之條件下照射15秒,使其硬化之^硬化二 之儲存模數係成為0.1〜100000MPa(23°C)的範圍内。 δ· 合劑’其係由如中請專利範圍第i至? 之樹脂組成物形成。 、 9.如申請專利範圍第8項之黏合劑,其係環婦煙聚合物用黏 合劑。 瓜如申請專利範圍第8或9項之黏合劑,其係具有雙環戊二 蝉環構造之環烯烴聚合物用黏合劑。 —種黏合體’其係使用如申請專利範圍第8至】〇項中任一 項之黏合劑使被黏合體彼此被黏合而成。 汝申明專利範圍第10項之黏合體,其中該被黏合體係由環 烯烴聚合物、聚碳酸酯、三乙酸纖維素、聚乙烯醇及玻璃 所構成群組中選出之1種以上。 13· 種黏合體之製造方法,其係包含將如申請專利範圍第8 至10項中任一項之黏合劑塗布於被黏合體表面以使其厚 度為0.0001〜5mm,將被黏合體彼此貼合,並於波長 2〇〇〜5〇〇nm、累積光量2〇〇〜6〇〇〇J/cm2、照射時間1〜6〇秒 之條件下使黏合劑硬化。 22/22201124463 VII. Patent Application Range: 1. A resin composition characterized by containing the following components (A) to (E): (A) a component having a (cyclo)pentenyl (meth) acrylate; (B) the component is a (hydroxy) acrylate having a hydroxyl group; (C) the component has a (meth) acrylonitrile group and has a diene skeleton or a (meth) group having a hydrogenated diene skeleton Acrylate; (D) component is a oxime coupling agent; (E) a knife-forming photopolymerization initiator. 2. The resin composition of the first aspect of the patent application, which further comprises (mercapto)acrylic acid as the component (F). 3. The resin composition of claim 1 or 2, which further comprises polyvinyl alcohol as the component (G). 4. For the resin composition of the first or second patent application, the amount of the component (A), the component (B) and the component (C) is the total amount of the component (A), the component and the component (C). In the mass part, the component (A): (B) component: (C) component = 40 to 90: 1 to 20: 5 to 45 (mass ratio); (D) the amount of the component used, relative to the component, B) Component and (q component total amount of 100 parts by mass, or (F) component is used in combination with (A) component, (B) component, (〇 component, and (F) component The amount of the component (E) is 100 parts by mass based on the total amount of the component (A), the component (B), and the barium component, or the component (F) is used as it is. The total amount of the component (A), the component (B), the component (C), and the component (F) is 0.01 to 30 parts by mass, and the resin composition of the first or second aspect of the patent application, wherein (A) The component is dicyclopentene (mercapto) acrylate. 21 / 22 201124463 6. The resin composition of claim 2 or 2 has a number average molecular weight of 500 to 50000. Patent application range 1 or 2 The resin composition, wherein the thickness of the adult system is 0.03 mm, and the storage modulus of the hardened two is 0.1 to 100,000 MPa (23 ° C) by irradiating for 15 seconds under the condition of a wavelength of 365 nm and St 2000 mW. In the range of δ· Mixtures, which are formed from the resin composition of the first to the patent range of the patent application, 9. The adhesive of the eighth aspect of the patent application, which is a binder for the ringtone polymer. The adhesive of the invention of claim 8 or 9 is a binder for a cyclic olefin polymer having a bicyclopentadienyl ring structure. The type of the binder is used as in the scope of the patent application No. 8 to 〇 The adhesive of any one of the items is obtained by bonding the adherends to each other. The adhesive of claim 10, wherein the bonded system is composed of a cyclic olefin polymer, a polycarbonate, a cellulose triacetate, a poly One or more selected from the group consisting of vinyl alcohol and glass. The method for producing a binder comprising applying the adhesive according to any one of claims 8 to 10 to the surface of the adherend So that its thickness is 0.0001~5mm The adherends are bonded to each other, and the adhesive is cured at a wavelength of 2 〇〇 to 5 〇〇 nm, a cumulative light amount of 2 〇〇 6 6 J/cm 2 , and an irradiation time of 1 to 6 sec. /twenty two
TW099134932A 2009-10-14 2010-10-13 Resin composition and adhesive TWI492979B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009237801 2009-10-14

Publications (2)

Publication Number Publication Date
TW201124463A true TW201124463A (en) 2011-07-16
TWI492979B TWI492979B (en) 2015-07-21

Family

ID=43876170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099134932A TWI492979B (en) 2009-10-14 2010-10-13 Resin composition and adhesive

Country Status (5)

Country Link
JP (1) JP5684714B2 (en)
KR (1) KR101696332B1 (en)
CN (1) CN102686622B (en)
TW (1) TWI492979B (en)
WO (1) WO2011046120A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5579463B2 (en) * 2010-02-24 2014-08-27 株式会社クラレ Adhesive for polyvinyl alcohol polymer film
TWI523906B (en) * 2011-04-13 2016-03-01 Denka Company Ltd Resin composition and adjuvant
KR102132158B1 (en) 2012-11-30 2020-07-09 린텍 가부시키가이샤 Adhesive agent composition, adhesive sheet, and electronic device
TWI627218B (en) * 2013-03-29 2018-06-21 日商可樂麗股份有限公司 Polymer, method for producing the same, and resin composition containing the polymer
JP5826238B2 (en) * 2013-12-03 2015-12-02 デンカ株式会社 Temporary fixing adhesive composition, and structure and member temporary fixing method using the same
JP6667442B2 (en) * 2014-09-08 2020-03-18 デンカ株式会社 Composition and dismantling method
KR101900529B1 (en) * 2014-09-16 2018-09-20 주식회사 엘지화학 Adhesive composition for touch screen panel, optical adhesive film and touch screen panel
JP6429679B2 (en) * 2015-03-03 2018-11-28 積水フーラー株式会社 UV curable adhesive composition
KR20170014668A (en) 2015-07-30 2017-02-08 전자부품연구원 Capacitance change measuring apparatus
EP3546492A4 (en) 2016-11-25 2020-07-29 Adeka Corporation Curable composition, cured product thereof, and curing method therefor
CN114930448A (en) * 2019-12-27 2022-08-19 三菱化学株式会社 Sound insulation structure
JP7465101B2 (en) * 2020-02-10 2024-04-10 三星エスディアイ株式会社 Pressure-sensitive adhesive composition for photocurable optical film, pressure-sensitive adhesive layer for photocurable optical film, optical member, and image display device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218485A (en) 1985-07-16 1987-01-27 Alpha Giken:Kk Primer for instantaneous adhesive
JPS63238104A (en) * 1987-03-26 1988-10-04 Matsushita Electric Works Ltd Photo-setting resin composition
JPH1036801A (en) * 1996-07-18 1998-02-10 Daicel Chem Ind Ltd Water-based adhesive and its production
JP4766777B2 (en) * 2001-05-22 2011-09-07 電気化学工業株式会社 Two-component curing composition consisting of liquid / powder
TWI285298B (en) * 2003-01-14 2007-08-11 Sumitomo Chemical Co Photosensitive resin composition
JP4400415B2 (en) * 2004-10-26 2010-01-20 パナソニック電工株式会社 Photocurable resin composition
US7829605B2 (en) * 2005-05-31 2010-11-09 Denki Kagaku Kogyo Kabushiki Kaisha Energy ray-curable resin composition and adhesive using same
JP4916681B2 (en) * 2005-07-04 2012-04-18 電気化学工業株式会社 Photocurable adhesive for temporary fixing method and temporary fixing method of member using the same
EP2383303A1 (en) * 2005-07-04 2011-11-02 Denki Kagaku Kogyo Kabushiki Kaisha Curable composition and temporary fixation method of member using it
JP4459880B2 (en) 2005-09-15 2010-04-28 電気化学工業株式会社 Energy ray curable resin composition and adhesive using the same
JP2008101105A (en) * 2006-10-19 2008-05-01 Denki Kagaku Kogyo Kk Curable composition
JP5382989B2 (en) * 2006-10-19 2014-01-08 電気化学工業株式会社 adhesive
JP2008101104A (en) * 2006-10-19 2008-05-01 Denki Kagaku Kogyo Kk Curable composition
JP5570752B2 (en) * 2008-05-12 2014-08-13 電気化学工業株式会社 Adhesive
TWI485214B (en) * 2008-09-05 2015-05-21 Kyoritsu Chemical Co Ltd And a photohardenable resin composition for bonding an optical functional material

Also Published As

Publication number Publication date
WO2011046120A1 (en) 2011-04-21
CN102686622A (en) 2012-09-19
JPWO2011046120A1 (en) 2013-03-07
JP5684714B2 (en) 2015-03-18
KR101696332B1 (en) 2017-01-13
KR20120086314A (en) 2012-08-02
TWI492979B (en) 2015-07-21
CN102686622B (en) 2015-06-17

Similar Documents

Publication Publication Date Title
TW201124463A (en) Resin composition and adhesive agent
TWI460245B (en) An adhesive composition and a method using its temporary fixing member
TWI567151B (en) Adhesive composition for polarizing plate and polarizing plate using the same
JP6260278B2 (en) Photocurable adhesive composition and display panel
TWI518119B (en) The method of disintegrating the binder by irradiating the excimer
TW201213482A (en) Light-curing composition for use in transparent pressure-sensitive adhesive sheet
KR20120023123A (en) Photocurable composition
JP2009299037A (en) Adhesive
JP6712459B2 (en) Photocurable resin composition
WO2012029960A1 (en) Resin composition and adhesive
JP4170861B2 (en) Photocurable resin composition
CN108239487A (en) Adhesive sheet and liquid crystal display component
JP4382069B2 (en) Acrylic adhesive for industrial glass
TW201003311A (en) Resin composition for energy ray-curable layer and sheet for forming through hole
JP5812989B2 (en) Composition and adhesive
JP2010132876A (en) Curable (meth)acrylic resin composition, laminated material intermediate membrane, and laminated material
JP5517776B2 (en) Method for producing member with optical laminated sheet
JP5350055B2 (en) (Meth) acrylic resin composition for adhesives
JP2008106189A (en) Adhesive composition
TWI522742B (en) Photocurable resin composition and use thereof
JP5863773B2 (en) Resin composition and adhesive
TW202112832A (en) Photocurable resin composition and a method of producing the display device
JP2002105421A (en) Tape for fixing floor curing sheet
Meredith Enhancing the bonding of synthetic polymers mimicking marine bioadhesives
JP2022064608A (en) Curable composition for impact absorbing material, impact absorbing material, and acoustic apparatus