TWI523906B - Resin composition and adjuvant - Google Patents
Resin composition and adjuvant Download PDFInfo
- Publication number
- TWI523906B TWI523906B TW101112804A TW101112804A TWI523906B TW I523906 B TWI523906 B TW I523906B TW 101112804 A TW101112804 A TW 101112804A TW 101112804 A TW101112804 A TW 101112804A TW I523906 B TWI523906 B TW I523906B
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- adhesive
- resin composition
- meth
- mass
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims description 29
- 239000002671 adjuvant Substances 0.000 title 1
- 239000000853 adhesive Substances 0.000 claims description 58
- 230000001070 adhesive effect Effects 0.000 claims description 56
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 32
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 30
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 18
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 16
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 16
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 12
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 10
- 150000001993 dienes Chemical group 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 10
- 239000003963 antioxidant agent Substances 0.000 claims description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 7
- 239000007822 coupling agent Substances 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 229920002284 Cellulose triacetate Polymers 0.000 claims description 6
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 claims description 6
- 230000003078 antioxidant effect Effects 0.000 claims description 6
- 230000001186 cumulative effect Effects 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 239000003505 polymerization initiator Substances 0.000 claims description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- -1 2-hydroxypropyl Chemical group 0.000 description 17
- 238000000034 method Methods 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 7
- 239000004809 Teflon Substances 0.000 description 6
- 229920006362 Teflon® Polymers 0.000 description 6
- 229920001195 polyisoprene Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000004831 Hot glue Substances 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000007127 saponification reaction Methods 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- MFAWEYJGIGIYFH-UHFFFAOYSA-N 2-[4-(trimethoxymethyl)dodecoxymethyl]oxirane Chemical compound C(C1CO1)OCCCC(C(OC)(OC)OC)CCCCCCCC MFAWEYJGIGIYFH-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- OBGBGHKYJAOXRR-UHFFFAOYSA-N 2-methoxy-1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C(OC)=CC(=O)C2=C1 OBGBGHKYJAOXRR-UHFFFAOYSA-N 0.000 description 2
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- NDZXTZNYOPJWKI-UHFFFAOYSA-N C(=C)CCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C(=C)CCCC(C(OC)(OC)OC)CCCCCCCC NDZXTZNYOPJWKI-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 150000001925 cycloalkenes Chemical class 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012567 medical material Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- OJNNAJJFLWBPRS-UHFFFAOYSA-N phenyl-[(2,4,6-trimethylphenyl)methyl]-[(2,4,6-trimethylphenyl)methylidene]phosphanium Chemical compound CC1=C(C=P(C2=CC=CC=C2)=CC2=C(C=C(C=C2C)C)C)C(=CC(=C1)C)C OJNNAJJFLWBPRS-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- ZSQCNVWYBBKUHS-UHFFFAOYSA-N (2,3-dimethylphenyl)-phenylmethanone Chemical compound CC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1C ZSQCNVWYBBKUHS-UHFFFAOYSA-N 0.000 description 1
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- NCRNCSZWOOYBQF-UHFFFAOYSA-N 1,1-Dimethoxydecane Chemical compound CCCCCCCCCC(OC)OC NCRNCSZWOOYBQF-UHFFFAOYSA-N 0.000 description 1
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- XJKSTNDFUHDPQJ-UHFFFAOYSA-N 1,4-diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=C(C=2C=CC=CC=2)C=C1 XJKSTNDFUHDPQJ-UHFFFAOYSA-N 0.000 description 1
- YSVQGHIOJPVICX-UHFFFAOYSA-N 1-(1-hydroxycyclohexyl)-1-phenylpropan-2-one Chemical compound C1CCCCC1(O)C(C(=O)C)C1=CC=CC=C1 YSVQGHIOJPVICX-UHFFFAOYSA-N 0.000 description 1
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 description 1
- SMLNDVNTPWRZJH-UHFFFAOYSA-N 1-chloro-4-(trimethoxymethyl)dodecane Chemical compound ClCCCC(C(OC)(OC)OC)CCCCCCCC SMLNDVNTPWRZJH-UHFFFAOYSA-N 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- JMIZWXDKTUGEES-UHFFFAOYSA-N 2,2-di(cyclopenten-1-yloxy)ethyl 2-methylprop-2-enoate Chemical compound C=1CCCC=1OC(COC(=O)C(=C)C)OC1=CCCC1 JMIZWXDKTUGEES-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- ZZYASVWWDLJXIM-UHFFFAOYSA-N 2,5-di-tert-Butyl-1,4-benzoquinone Chemical compound CC(C)(C)C1=CC(=O)C(C(C)(C)C)=CC1=O ZZYASVWWDLJXIM-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- QYXHDJJYVDLECA-UHFFFAOYSA-N 2,5-diphenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=C(C=2C=CC=CC=2)C(=O)C=C1C1=CC=CC=C1 QYXHDJJYVDLECA-UHFFFAOYSA-N 0.000 description 1
- MBIZFBDREVRUHY-UHFFFAOYSA-N 2,6-Dimethoxybenzoic acid Chemical compound COC1=CC=CC(OC)=C1C(O)=O MBIZFBDREVRUHY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- XRCRJFOGPCJKPF-UHFFFAOYSA-N 2-butylbenzene-1,4-diol Chemical compound CCCCC1=CC(O)=CC=C1O XRCRJFOGPCJKPF-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- CFSRYSNJOVVGIH-UHFFFAOYSA-N 3-(trichloromethyl)undec-1-ene Chemical compound C(=C)C(C(Cl)(Cl)Cl)CCCCCCCC CFSRYSNJOVVGIH-UHFFFAOYSA-N 0.000 description 1
- LBIHNTAFJVHBLJ-UHFFFAOYSA-N 3-(triethoxymethyl)undec-1-ene Chemical compound C(=C)C(C(OCC)(OCC)OCC)CCCCCCCC LBIHNTAFJVHBLJ-UHFFFAOYSA-N 0.000 description 1
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical group CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- MRBKEAMVRSLQPH-UHFFFAOYSA-N 3-tert-butyl-4-hydroxyanisole Chemical group COC1=CC=C(O)C(C(C)(C)C)=C1 MRBKEAMVRSLQPH-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- SXPGQGNWEWPWQZ-UHFFFAOYSA-N 4-(triethoxymethyl)dodecan-1-amine Chemical compound NCCCC(C(OCC)(OCC)OCC)CCCCCCCC SXPGQGNWEWPWQZ-UHFFFAOYSA-N 0.000 description 1
- DFYGYTNMHPUJBY-UHFFFAOYSA-N 4-(trimethoxymethyl)dodecane-1-thiol Chemical compound SCCCC(C(OC)(OC)OC)CCCCCCCC DFYGYTNMHPUJBY-UHFFFAOYSA-N 0.000 description 1
- VZDDUFFXSBGRMP-UHFFFAOYSA-N 9h-fluoren-1-ylphosphane Chemical compound C12=CC=CC=C2CC2=C1C=CC=C2P VZDDUFFXSBGRMP-UHFFFAOYSA-N 0.000 description 1
- JJEZQZXVEMTRSW-UHFFFAOYSA-N C(=C)C(C(OC)(OC)OC)(CCCCCCCC)CCC Chemical compound C(=C)C(C(OC)(OC)OC)(CCCCCCCC)CCC JJEZQZXVEMTRSW-UHFFFAOYSA-N 0.000 description 1
- JZHKIUBMQMDQRG-UHFFFAOYSA-N C(=C)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C(=C)C(C(OC)(OC)OC)CCCCCCCC JZHKIUBMQMDQRG-UHFFFAOYSA-N 0.000 description 1
- DBJFSFSBHGPDPG-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C(C(=C)C)(=O)OCCCC(C(OC)(OC)OC)CCCCCCCC DBJFSFSBHGPDPG-UHFFFAOYSA-N 0.000 description 1
- HRLSHCPEHLRSBS-UHFFFAOYSA-N C(C)OC1(C(C=CC=C1)CCNN)OCC Chemical compound C(C)OC1(C(C=CC=C1)CCNN)OCC HRLSHCPEHLRSBS-UHFFFAOYSA-N 0.000 description 1
- VPLKXGORNUYFBO-UHFFFAOYSA-N C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC VPLKXGORNUYFBO-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
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- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
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- 229920000297 Rayon Polymers 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- WUIXMACUOWFWAA-UHFFFAOYSA-N [phenyl(propan-2-yloxy)methyl]benzene Chemical compound C=1C=CC=CC=1C(OC(C)C)C1=CC=CC=C1 WUIXMACUOWFWAA-UHFFFAOYSA-N 0.000 description 1
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- 150000001298 alcohols Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
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- 101150059062 apln gene Proteins 0.000 description 1
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- 239000011324 bead Substances 0.000 description 1
- VSMKVYMEPNUODT-UHFFFAOYSA-N benzenecarboximidamide;benzoic acid Chemical compound NC(=[NH2+])C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 VSMKVYMEPNUODT-UHFFFAOYSA-N 0.000 description 1
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- 150000001875 compounds Chemical class 0.000 description 1
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- ARPJZLLWCWXWJQ-UHFFFAOYSA-N dihydrogen phosphate;ethylazanium Chemical compound CCN.OP(O)(O)=O ARPJZLLWCWXWJQ-UHFFFAOYSA-N 0.000 description 1
- UKXCWLFBHULELL-UHFFFAOYSA-N diphenylmethanone;n-ethylethanamine Chemical compound CCNCC.C=1C=CC=CC=1C(=O)C1=CC=CC=C1 UKXCWLFBHULELL-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- 229930003658 monoterpene Natural products 0.000 description 1
- 150000002773 monoterpene derivatives Chemical class 0.000 description 1
- 235000002577 monoterpenes Nutrition 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1409—Visible light radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
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- B29C65/485—Multi-component adhesives, i.e. chemically curing as a result of the mixing of said multi-components
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/82—Testing the joint
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- B29C65/8215—Tensile tests
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
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- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
- B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/94—Measuring or controlling the joining process by measuring or controlling the time
- B29C66/949—Measuring or controlling the joining process by measuring or controlling the time characterised by specific time values or ranges
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J115/00—Adhesives based on rubber derivatives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
- C08C19/00—Chemical modification of rubber
- C08C19/02—Hydrogenation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
Landscapes
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Medicinal Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Description
本發明係關於一種接著劑。 The present invention is directed to an adhesive.
環烯烴聚合物能使用於電子材料、光學透鏡及醫療材料等用途。環烯烴聚合物因極性小、於表面沒有許多的官能基,故以其為難被接著體而為人所知悉。做為接著此種環烯烴系樹脂之接著劑能舉出溶劑型接著劑與熱熔接著劑。 The cycloolefin polymer can be used for applications such as electronic materials, optical lenses, and medical materials. Since a cycloolefin polymer has a small polarity and does not have many functional groups on the surface, it is known that it is difficult to be a binder. A solvent-based adhesive and a hot-melt adhesive can be given as an adhesive for the cycloolefin-based resin.
做為接著烯烴系樹脂之方法,如專利文獻1所開示,在以底漆進行處理後再以瞬間接著劑接著之方法。專利文獻2中開示了一種特徵為含有(甲基)丙烯酸酯之能量線硬化性樹脂組成物。 As a method of following the olefin-based resin, as disclosed in Patent Document 1, the method of treating with a primer is followed by an instant adhesive. Patent Document 2 discloses an energy ray-curable resin composition characterized by containing (meth) acrylate.
專利文獻1 日本專利公開昭62-18485號公報 Patent Document 1 Japanese Patent Publication No. Sho 62-18485
專利文獻2 日本專利公開2007-77321號公報 Patent Document 2 Japanese Patent Publication No. 2007-77321
專利文獻3 專利申請WO2010/027041號公報 Patent Document 3 Patent Application WO2010/027041
溶劑型接著劑係有使用溶劑。溶劑型接著劑除了對人體有害,溶劑的揮發耗時,且接著強度本身亦不充分。 A solvent-based adhesive is a solvent used. The solvent-based adhesive is not only harmful to the human body, but also the solvent is volatilized, and the strength itself is insufficient.
熱熔接著劑必須有使接著劑熔融之手續及裝置。又,在為此接著劑之情形亦得不到充分的接著強度。此外,在使用熱熔接著劑之情形,若預先加熱環烯烴聚合物,雖然接著強度提升,但會有造成樹脂變形之新問題發生。 The hot melt adhesive must have procedures and means for melting the adhesive. Moreover, sufficient adhesion strength cannot be obtained in the case of this adhesive. Further, in the case of using a hot-melt adhesive, if the cycloolefin polymer is heated in advance, although the strength is increased, a new problem of deformation of the resin may occur.
若依據專利文獻1所開示之接著方法,除了會有底漆處理費時之問題外,亦得不到充分的接著強度。 According to the following method disclosed in Patent Document 1, in addition to the problem that the primer treatment is time consuming, sufficient bonding strength is not obtained.
專利文獻2開示一種特徵為含有(甲基)丙烯酸酯之能量線硬化性樹脂組成物。但是,對於具有雙環戊烯基之(甲基)丙烯酸酯並未有所記載。 Patent Document 2 discloses an energy ray-curable resin composition characterized by containing (meth) acrylate. However, there is no description of the (meth) acrylate having a dicyclopentenyl group.
專利文獻3開示一種含有具聚異戊二烯、聚丁二烯、聚胺基甲酸酯骨架之(甲基)丙烯酸酯寡聚物及柔軟化成分的光硬化型接著組成物。但是對(甲基)丙烯酸並未有所記載。 Patent Document 3 discloses a photocurable secondary composition comprising a (meth) acrylate oligomer having a polyisoprene, a polybutadiene, a polyurethane skeleton, and a softening component. However, there is no description of (meth)acrylic acid.
環烯烴聚合物特徵為低吸水性、高透明性、低比重。因此,環烯烴聚合物被作為玻璃代替材料、透明塑膠代替材料,使用於電子材料、光學透鏡及醫療材料等用途。 The cycloolefin polymer is characterized by low water absorption, high transparency, and low specific gravity. Therefore, the cycloolefin polymer is used as a glass substitute material or a transparent plastic substitute material, and is used for applications such as electronic materials, optical lenses, and medical materials.
然而,環烯烴聚合物因極性小、於表面沒有許多的官能基,而有難以接著之課題。 However, since the cycloolefin polymer has a small polarity and does not have many functional groups on the surface, it is difficult to continue the problem.
本發明係有鑑於如此之實情而得。本發明之目的為例如提供能對環烯烴聚合物在短時間展現充分的接著強度,且係無溶劑型、對環境友善之環烯烴聚合物用接著劑。 The present invention has been made in view of such circumstances. An object of the present invention is to provide, for example, an adhesive for a cycloolefin polymer which exhibits sufficient adhesion strength to a cycloolefin polymer in a short period of time and which is solvent-free and environmentally friendly.
本案發明人為了解決前述課題而不斷專心研究,終至完成本發明。 The inventors of the present invention have continually studied in order to solve the above problems, and finally completed the present invention.
亦即,本發明之一個面向係:一種樹脂組成物,其係含有下述(A)~(F)成分:(A)成分為具有雙環戊烯基之(甲基)丙烯酸酯;(B)成分為具有羥基之(甲基)丙烯酸酯;(C)成分為具有二烯系骨架或經氫化之二烯系骨架,且沒有(甲基)丙烯醯基之寡聚物; (D)成分為矽烷偶合劑;(E)成分為光聚合起始劑;及(F)成分為(甲基)丙烯酸。 That is, one aspect of the present invention is a resin composition comprising the following components (A) to (F): (A) is a (meth) acrylate having a dicyclopentenyl group; (B) The component is a (meth) acrylate having a hydroxyl group; the component (C) is an oligomer having a diene skeleton or a hydrogenated diene skeleton and having no (meth) acrylonitrile group; The component (D) is a decane coupling agent; the component (E) is a photopolymerization initiator; and the component (F) is (meth)acrylic acid.
於本發明之樹脂組成物的一實施形態中,其係進一步含有(G)成分:聚乙烯醇。 In one embodiment of the resin composition of the present invention, the component (G) further contains polyvinyl alcohol.
於本發明之樹脂組成物的一實施形態中,該(A)成分係(甲基)丙烯酸雙環戊烯酯。 In one embodiment of the resin composition of the present invention, the component (A) is biscyclopentenyl (meth)acrylate.
於本發明之樹脂組成物的一實施形態中,其中(C)成分的數量平均分子量為500~50000。 In an embodiment of the resin composition of the present invention, the component (C) has a number average molecular weight of 500 to 50,000.
於本發明之樹脂組成物的一實施形態中,其在厚度為0.03mm,以波長365nm、累積光量2000mJ/cm2之條件照射15秒來予以硬化時,硬化物之儲藏彈性模數係在0.1~100000MPa(23℃)之範圍內。 In one embodiment of the resin composition of the present invention, when the thickness is 0.03 mm and the film is cured by irradiation for 15 seconds under the conditions of a wavelength of 365 nm and a cumulative light amount of 2000 mJ/cm 2 , the storage elastic modulus of the cured product is 0.1. Within the range of ~100000 MPa (23 ° C).
於本發明之樹脂組成物的一實施形態中,其進一步含有抗氧化劑。 In an embodiment of the resin composition of the present invention, the antioxidant further contains an antioxidant.
本發明之另一面向係:一種接著劑,其係由本發明之該樹脂組成物所構成。 Another aspect of the present invention is an adhesive comprising the resin composition of the present invention.
於本發明之接著劑的一實施形態中,其係環烯烴聚合物用接著劑。 In one embodiment of the adhesive of the present invention, it is an adhesive for a cycloolefin polymer.
於本發明之接著劑的一實施形態中,其係具有雙環戊二烯環構造之環烯烴聚合物用接著劑。 In one embodiment of the adhesive of the present invention, it is an adhesive for a cycloolefin polymer having a dicyclopentadiene ring structure.
本發明之另一面向係:一種接著體,其係使用本發明之接著劑將被接著體彼此接著而成。 Another aspect of the present invention is a binder which is formed by adhering the adherends to each other using the adhesive of the present invention.
於本發明之接著體的一實施形態中,被接著體係由環烯烴聚合物、聚碳酸酯、纖維素三乙酸酯、聚乙烯醇及玻璃所構成之群組中選出的1種以上。 In one embodiment of the battery of the present invention, one or more selected from the group consisting of a cycloolefin polymer, a polycarbonate, a cellulose triacetate, a polyvinyl alcohol, and a glass are used.
本發明之又另一面向係:一種接著體之製造方法,其係包含將本發明之接著劑,以塗布成厚度為0.0001~5mm之方式塗布在被接著體表面上,使被接著體彼此貼合,再於波長200~500nm、累積光量200~6000J/cm2、照射時間1~60秒之條件下使接著劑硬化。 Still another aspect of the present invention is a method for producing a laminate comprising applying an adhesive of the present invention to a surface of a adherend so as to have a thickness of 0.0001 to 5 mm, so that the adherends are attached to each other. Further, the adhesive is cured under the conditions of a wavelength of 200 to 500 nm, a cumulative light amount of 200 to 6000 J/cm 2 , and an irradiation time of 1 to 60 seconds.
本發明之樹脂組成物具有例如對環烯烴聚合物顯示高接著強度,且耐濕性亦優良之特徵。 The resin composition of the present invention is characterized in that, for example, it exhibits high adhesion strength to a cycloolefin polymer and is excellent in moisture resistance.
本發明中(A)成分為具有雙環戊烯基之(甲基)丙烯酸酯。更具體而言,(A)成分為在分子末端或側鎖含有1個以上雙環戊烯基之(甲基)丙烯酸酯。(A)成分之(甲基)丙烯酸酯能舉出(甲基)丙烯酸雙環戊烯氧基乙酯、(甲基)丙烯酸雙環戊烯氧基丙酯、(甲基)丙烯酸雙環戊烯酯等。此等之中,較佳為(甲基)丙烯酸雙環戊烯酯。 In the present invention, the component (A) is a (meth) acrylate having a dicyclopentenyl group. More specifically, the component (A) is a (meth) acrylate containing one or more dicyclopentenyl groups at the molecular terminal or in the side. Examples of the (meth) acrylate of the component (A) include dicyclopentenyloxyethyl (meth)acrylate, dicyclopentenyloxypropyl (meth)acrylate, and dicyclopentenyl (meth)acrylate. . Among these, dicyclopentenyl (meth)acrylate is preferred.
(B)成分為含有羥基之(甲基)丙烯酸酯。更具體而言,(B)成分係於分子末端或側鎖含有1個以上羥基之(甲基)丙烯酸酯。含有羥基之(甲基)丙烯酸酯能舉出(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丙酯、(甲基)丙烯酸2-羥丁酯、(甲基)丙烯酸2-羥基-3-苯氧基丙酯、酞酸2-(甲基)丙烯醯氧乙基-2-羥丙酯、(甲基)丙烯酸4-羥基環己酯等。此等之中,從接著性的觀點來看,較佳為(甲基)丙烯酸2-羥基-3-苯氧基丙酯。 The component (B) is a hydroxyl group-containing (meth) acrylate. More specifically, the component (B) is a (meth) acrylate having one or more hydroxyl groups at the molecular terminal or in the side. Examples of the hydroxyl group-containing (meth) acrylate include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, and (meth)acrylic acid. 2-hydroxy-3-phenoxypropyl ester, 2-(meth)acryloyloxyethyl-2-hydroxypropyl phthalate, 4-hydroxycyclohexyl (meth)acrylate, and the like. Among these, 2-hydroxy-3-phenoxypropyl (meth)acrylate is preferred from the viewpoint of adhesion.
(C)成分為具有二烯系骨架或經氫化之二烯系骨架之寡聚物。(C)成分較佳沒有(甲基)丙烯醯基。(C)成分由賦予樹脂柔軟性的觀點來看,能舉出下述成分。 The component (C) is an oligomer having a diene skeleton or a hydrogenated diene skeleton. The component (C) is preferably free of (meth)acrylonitrile. The component (C) is the following component from the viewpoint of imparting flexibility to the resin.
寡聚物的主鏈骨架為二烯系骨架或經氫化之二烯系骨架。二烯系骨架或經氫化之二烯系骨架能舉出由聚丁二烯、聚異戊二烯、聚丁二烯之氫化物及聚異戊二烯之氫化物所構成之群組中選出的1種以上骨架。此等之中,較佳為由聚異戊二烯及聚異戊二烯之氫化物所構成之群組中選出的1種以上,更佳為聚異戊二烯。 The main chain skeleton of the oligomer is a diene skeleton or a hydrogenated diene skeleton. The diene skeleton or the hydrogenated diene skeleton can be selected from the group consisting of polybutadiene, polyisoprene, hydride of polybutadiene, and hydride of polyisoprene. One or more skeletons. Among these, one or more selected from the group consisting of polyisoprene and a hydrogenated product of polyisoprene are preferred, and polyisoprene is more preferred.
(C)成分的寡聚物之數量平均分子量較佳為500~50000,更佳為5000~45000,最佳為8000~40000。數量平均分子量若在500以上,則因以能量線照射本發明之接著劑所得到之硬化體的硬度高,而容易形成接著劑層。數量平均分子量若在50000以下,則因所得到的接著劑之黏度小,故於製造過程之混合等的作業性,與在實用用途中使用該接著劑時的作業性良好。 The number average molecular weight of the oligomer of the component (C) is preferably from 500 to 50,000, more preferably from 5,000 to 45,000, most preferably from 8,000 to 40,000. When the number average molecular weight is 500 or more, the hardness of the hardened body obtained by irradiating the adhesive of the present invention with an energy ray is high, and the adhesive layer is easily formed. When the number average molecular weight is 50,000 or less, since the viscosity of the obtained adhesive is small, the workability in mixing in the production process and the workability in using the adhesive in practical use are good.
(C)成分之寡聚物能舉出:Kuraray公司製「LIR-50」(異戊二烯寡聚物)、Kuraray公司製「LIR-30」(異戊二烯寡聚物)、Kuraray公司製「LBR-307」(丁二烯寡聚物)、Kuraray公司製「LBR-305」(丁二烯寡聚物)、Kuraray公司製「LBR-300」(丁二烯寡聚物)。此等之中,由柔軟性與接著性之觀點來看,較佳為異戊二烯寡聚物及/或丁二烯寡聚物之1種以上。 Examples of the oligomer of the component (C) include "LIR-50" (isoprene oligomer) manufactured by Kuraray Co., Ltd., "LIR-30" (isoprene oligomer) manufactured by Kuraray Co., Ltd., and Kuraray Co., Ltd. "LBR-307" (butadiene oligomer), "LBR-305" (butadiene oligomer) manufactured by Kuraray Co., Ltd., and "LBR-300" (butadiene oligomer) manufactured by Kuraray Co., Ltd. Among these, from the viewpoint of flexibility and adhesion, one or more kinds of isoprene oligomers and/or butadiene oligomers are preferable.
(D)成分為矽烷偶合劑。矽烷偶合劑能舉出:γ-氯丙基三甲氧基矽烷、乙烯基三甲氧基矽烷、乙烯基三氯矽烷、乙烯基三乙氧基矽烷、乙烯基丙基三甲氧基矽烷、乙烯基-參(β-甲氧基乙氧基)矽烷、γ-(甲基)丙烯醯氧基丙基三甲氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、γ-巰基丙基三甲氧基矽烷、γ- 胺基丙基三乙氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基三甲氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基甲基二甲氧基矽烷、γ-脲基丙基三乙氧基矽烷、(甲基)丙烯酸羥乙酯磷酸酯、酸式(甲基)丙烯醯氧基氧乙基磷酸鹽、酸式(甲基)丙烯醯氧基氧乙基磷酸單乙胺半鹽等。此等之中,從對玻璃等的附著性之觀點來看,較佳為由γ-環氧丙氧基丙基三甲氧基矽烷、γ-(甲基)丙烯醯氧基丙基三甲氧基矽烷及乙烯基丙基三甲氧基矽烷所構成之群組中選出的1種以上。 The component (D) is a decane coupling agent. Examples of the decane coupling agent include γ-chloropropyltrimethoxydecane, vinyltrimethoxydecane, vinyltrichlorodecane, vinyltriethoxydecane, vinylpropyltrimethoxydecane, and vinyl- Reference (β-methoxyethoxy)decane, γ-(meth)acryloxypropyltrimethoxydecane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, Γ-glycidoxypropyltrimethoxydecane, γ-mercaptopropyltrimethoxydecane, γ- Aminopropyltriethoxydecane, N-β-(aminoethyl)-γ-aminopropyltrimethoxydecane, N-β-(aminoethyl)-γ-aminopropylmethyl Dimethoxy decane, γ-ureidopropyl triethoxy decane, hydroxyethyl (meth) acrylate, acid (meth) propylene oxy oxyethyl phosphate, acid (A) Base) propylene methoxy oxyethyl phosphate monoethylamine half salt and the like. Among these, from the viewpoint of adhesion to glass or the like, γ-glycidoxypropyltrimethoxydecane and γ-(meth)acryloxypropyltrimethoxy group are preferred. One or more selected from the group consisting of decane and vinyl propyl trimethoxy decane.
(E)成分為光聚合起始劑。光聚合起始劑能舉出紫外線聚合起始劑與可見光聚合起始劑等,無論是哪個均無限制皆可使用。紫外線聚合起始劑能舉出苯偶姻系、二苯基酮系、苯乙酮系等。可見光聚合起始劑能舉出氧化醯基膦系、9-噻吨酮系、茂金屬系、醌系、α-胺基烷基苯酮系等。 The component (E) is a photopolymerization initiator. The photopolymerization initiator may, for example, be an ultraviolet polymerization initiator, a visible light polymerization initiator, or the like, and may be used without limitation. Examples of the ultraviolet polymerization initiator include a benzoin system, a diphenylketone system, and an acetophenone system. Examples of the visible light polymerization initiator include a fluorenylphosphine oxide system, a 9-thioxanthone system, a metallocene system, an anthraquinone system, and an α-aminoalkylphenone.
光聚合起始劑能舉出二苯基酮、4-苯基二苯基酮、苯甲醯苯甲酸、2,2-二乙氧基苯乙硐、雙二乙胺二苯基酮、二苯乙二酮、苯偶姻、苯甲醯基異丙基醚、二甲醇縮二苯乙二酮(benzil dimethyl ketal)、1-羥基環己基苯基丙酮、9-噻吨酮、2-甲基-9-噻吨酮、2,4-二甲基9-噻吨酮、異丙基9-噻吨酮、2,4-二乙基-9-噻吨酮、2,4-二異丙基-9-噻吨酮、1-(4-異丙基苯基)2-羥基-2-甲基丙-1-酮、1-(4-(2-羥基乙氧基)-苯基)-2-羥基-2-甲基-1-丙-1-酮、2-羥基-2-甲基-1-苯基丙-1-酮、莰醌、氧化2,4,6-三甲基苯甲醯基二苯基膦、氧化雙(2,4,6-三甲基苯甲醯基)-苯基膦、2-甲基-1-(4-(甲基硫)苯基)-2-N-嗎啉基丙-1-酮、2-苄基-2-二甲基胺-1-(4-N-嗎啉基苯基)-1-丁酮-1、2-二甲基胺-2-(4-甲基苄基)-1-(4-嗎啉-4-基-苯基)-丁-1-酮、氧化雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基戊基 膦等。此等之中,較佳為二甲醇縮二苯乙二酮。 The photopolymerization initiator can be exemplified by diphenyl ketone, 4-phenyl diphenyl ketone, benzamidine benzoic acid, 2,2-diethoxy phenethyl hydrazine, bis diethylamine diphenyl ketone, and Phenylenedione, benzoin, benzhydryl isopropyl ether, benzil dimethyl ketal, 1-hydroxycyclohexylphenylacetone, 9-thioxanthone, 2-methyl Base-9-thioxanthone, 2,4-dimethyl 9-thioxanthone, isopropyl 9-thioxanthone, 2,4-diethyl-9-thioxanthone, 2,4-diiso Propyl-9-thioxanthone, 1-(4-isopropylphenyl)2-hydroxy-2-methylpropan-1-one, 1-(4-(2-hydroxyethoxy)-phenyl )-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one, hydrazine, oxidized 2,4,6-trimethyl Benzobenzyldiphenylphosphine, bis(2,4,6-trimethylbenzylidene)-phenylphosphine oxide, 2-methyl-1-(4-(methylthio)phenyl) -2-N-morpholinylpropan-1-one, 2-benzyl-2-dimethylamine-1-(4-N-morpholinylphenyl)-1-butanone-1, 2-di Methylamine-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, bis(2,6-dimethoxybenzoate) Mercapto)-2,4,4-trimethylpentyl Phosphine and the like. Among these, dimethyl benzophenone is preferred.
(F)成分為(甲基)丙烯酸(丙烯酸或甲基丙烯酸)。其係由特別是耐濕性等耐久性之觀點來看而來使用。 The component (F) is (meth)acrylic acid (acrylic acid or methacrylic acid). It is used from the viewpoint of durability such as moisture resistance.
本發明之樹脂組成物以前述(A)~(F)成分為必須成分來含有。含有前述(A)~(F)成分之樹脂組成物係藉由對其照射光來加以硬化。硬化物顯示對環烯烴聚合物良好接著性,並在前述硬化時表面硬化性高之。本發明之樹脂組成物即便對例如聚碳酸酯、纖維素三乙酸酯、聚乙烯醇等泛用塑膠樹脂、玻璃被接著體,亦顯示高接著強度。 The resin composition of the present invention contains the components (A) to (F) as essential components. The resin composition containing the components (A) to (F) described above is cured by irradiating light thereto. The cured product shows good adhesion to the cycloolefin polymer and is highly surface hardenable in the aforementioned hardening. The resin composition of the present invention exhibits high adhesion strength even for a general-purpose plastic resin such as polycarbonate, cellulose triacetate or polyvinyl alcohol, or a glass-attached body.
本發明之樹脂組成物中可含有(G)成分:聚乙烯醇。其由對以聚乙烯醇樹脂所構成之被接著體的附著性之觀點來看,舉例為下述成分。 The resin composition of the present invention may contain a component (G): polyvinyl alcohol. The following components are exemplified from the viewpoint of adhesion to a adherend composed of a polyvinyl alcohol resin.
前述聚乙烯醇只要是皂化聚乙酸乙烯酯而得之聚乙烯醇衍生物即無特別限定。聚乙烯醇的平均聚合度較佳為100~5000,更佳為1000~4000。聚乙烯醇的平均皂化度較佳為85~100莫耳%,更佳為90~100莫耳%。 The polyvinyl alcohol is not particularly limited as long as it is a polyvinyl alcohol derivative obtained by saponifying polyvinyl acetate. The average degree of polymerization of the polyvinyl alcohol is preferably from 100 to 5,000, more preferably from 1,000 to 4,000. The average degree of saponification of the polyvinyl alcohol is preferably from 85 to 100 mol%, more preferably from 90 to 100 mol%.
本發明之樹脂組成物的使用量,從使接著劑對環烯烴聚合物之接著性特別高,且對其它被接著體亦具有高接著強度的觀點來看,係如以下所述。 The amount of the resin composition of the present invention used is as follows from the viewpoint of making the adhesion of the adhesive to the cycloolefin polymer particularly high and also having high adhesion strength to other adherends.
(A)成分、(B)成分及(C)成分之使用量,在合計100質量份之(A)成分、(B)成分及(C)成分中,較佳為(A)成分:(B)成分:(C)成分=40~90:1~20:5~45(質量比),更佳為(A)成分:(B)成分:(C)成分=55~85:3~10:10~40(質量比)。 The amount of the component (A), the component (B), and the component (C) is preferably a component (A), a component (B), and a component (C) in a total amount of 100 parts by mass. ) Component: (C) component = 40~90: 1~20: 5~45 (mass ratio), more preferably (A) component: (B) component: (C) component = 55~85: 3~10: 10~40 (mass ratio).
(D)成分之使用量,相對於(A)成分、(B)成分、(C)成分及(F)成分之合計量100質量份,較佳為0.01~10質量份,更佳為0.1~5質量份,典型上為0.5~1.0質量份。 The amount of the component (D) to be used is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 100 parts by mass based on 100 parts by mass of the total of the components (A), (B), (C) and (F). 5 parts by mass, typically 0.5 to 1.0 part by mass.
(E)成分之使用量,相對於(A)成分、(B)成分、(C)成分及(F)成分之合計量100質量份,較佳為0.01~30質量份,更佳為0.1~20質量份,典型上為5~10質量份。 The amount of the component (E) to be used is preferably 0.01 to 30 parts by mass, more preferably 0.1 to 100 parts by mass based on 100 parts by mass of the total of the components (A), (B), (C) and (F). 20 parts by mass, typically 5 to 10 parts by mass.
(F)成分之使用量,在(A)成分、(B)成分、(C)成分及(F)成分之合計量100質量份中,較佳為0.1~30質量份,更佳為1~20質量份,典型上為10~15質量份。 The amount of the component (F) to be used is preferably 0.1 to 30 parts by mass, more preferably 1 to 1 part by mass, based on 100 parts by mass of the total of the component (A), the component (B), the component (C), and the component (F). 20 parts by mass, typically 10 to 15 parts by mass.
(G)成分之使用量,相對於(A)成分、(B)成分、(C)成分及(F)成分之合計量100質量份,較佳為0.01~50質量份,更佳為0.1~30質量份,典型上為0.5~1.0質量份。 The amount of the component (G) to be used is preferably 0.01 to 50 parts by mass, more preferably 0.1 to 100 parts by mass based on 100 parts by mass of the total of the components (A), (B), (C) and (F). 30 parts by mass, typically 0.5 to 1.0 part by mass.
此外,本發明之樹脂組成物在不損及本發明之目的的範圍內,能使用接枝共聚物、溶劑、填充材、補強材、可塑劑、增黏劑、染料、顏料、阻燃劑、抗氧化劑、及界面活性劑等添加劑。 Further, the resin composition of the present invention can use a graft copolymer, a solvent, a filler, a reinforcing material, a plasticizer, a tackifier, a dye, a pigment, a flame retardant, etc., within a range not impairing the object of the present invention. Additives such as antioxidants and surfactants.
本發明之樹脂組成物的硬化物較佳具有0.1~100000MPa(23℃)之儲藏彈性模數,更佳具有10~10000Mpa之儲藏彈性模數,典型上係500~5000MPa。在樹脂組成物之硬化物的儲藏彈性模數為0.1MPa以上之情況,硬化物係硬化且不殘存未反應成分。在儲藏彈性模數為100000MPa以下之情況,硬化物不會變得過於剛硬、接著力不會降低。 The cured product of the resin composition of the present invention preferably has a storage elastic modulus of 0.1 to 100,000 MPa (23 ° C), more preferably a storage elastic modulus of 10 to 10,000 MPa, and is typically 500 to 5000 MPa. When the storage elastic modulus of the cured product of the resin composition is 0.1 MPa or more, the cured product is hardened and no unreacted components remain. When the storage elastic modulus is 100,000 MPa or less, the cured product does not become too rigid and the adhesive force does not decrease.
本發明之樹脂組成物能使用作為接著劑。本發明之接著劑係對例如由環烯烴聚合物、聚碳酸酯、纖維素三乙酸酯(三乙醯纖維素)、聚乙烯醇及玻璃所構成之群組中選出的1種以上顯示高接著強度。亦即,在以此等樹脂為被接著體時,能做為有用的接著劑來使用。本發明之接著劑在此等被接著體中,特別對環烯烴聚合物顯示高接著強度。 The resin composition of the present invention can be used as an adhesive. The adhesive agent of the present invention exhibits, for example, one or more selected from the group consisting of a cycloolefin polymer, a polycarbonate, a cellulose triacetate (triacetyl cellulose), a polyvinyl alcohol, and a glass. Then the intensity. That is, when such a resin is used as a adherend, it can be used as a useful adhesive. The adhesive of the present invention exhibits high adhesion strength to the cycloolefin polymer in these adherends.
作為本發明用途之接著劑所能適用的被接著體之環烯烴聚合物,係例如具有源自降莰烯或多環降莰烯系單體等環狀烯烴(環烯烴)單體之構成單位的熱塑性樹脂。環烯烴聚合物可舉出例如環烯烴之開環聚合物、使用2種以上環烯烴之開環共聚物的氫化物、具有鏈狀烯烴或乙烯基之芳香族化合物與環烯烴的加成共聚物等,本發明之接著劑以具有雙環戊二烯環構造之環烯烴聚合物特別有效。又,環烯烴聚合物中亦可導入極性基。 The cyclic olefin polymer to be used as the binder of the application of the present invention is, for example, a constituent unit derived from a cyclic olefin (cycloolefin) monomer such as a norbornene or a polycyclic norbornene-based monomer. Thermoplastic resin. The cycloolefin polymer may, for example, be a ring-opening polymer of a cyclic olefin, a hydrogenated product of a ring-opening copolymer using two or more kinds of cyclic olefins, an addition copolymer of an aromatic compound having a chain olefin or a vinyl group and a cyclic olefin. Etc., the binder of the present invention is particularly effective as a cycloolefin polymer having a dicyclopentadiene ring configuration. Further, a polar group may be introduced into the cycloolefin polymer.
市售之環烯烴聚合物例如可舉出:德國Ticona公司製的「Topas」、JSR公司製的「ARTON」、日本ZEON公司製的「ZEONOR」與「ZEONEX」、三井化學公司製的「APEL」等。 Examples of the commercially available cycloolefin polymer include "Topas" manufactured by Ticona Co., Ltd., "ARTON" manufactured by JSR Corporation, "ZEONOR" and "ZEONEX" manufactured by Japan ZEON Co., Ltd., and "APEL" manufactured by Mitsui Chemicals Co., Ltd. Wait.
本發明之接著劑的接著方法係例如依下述進行。較佳為將接著劑以厚度為0.0001~5mm、典型上為0.01~0.50mm之方式,塗布於2片被接著體中至少1片被接著體表面,其後,使被接著體彼此貼合,再於波長200~500nm、典型上為350~420nm,累積光量200~6000mJ/cm2、典型上為300~2000mJ/cm2,照射時間1~60秒、典型上為2~30秒之條件下使接著劑硬化,來將被接著體加以接著之方法。 The subsequent method of the adhesive of the present invention is carried out, for example, as follows. Preferably, the adhesive is applied to at least one of the two adherends in a thickness of 0.0001 to 5 mm, typically 0.01 to 0.50 mm, and then the adherends are bonded to each other. Further, the wavelength is 200 to 500 nm, typically 350 to 420 nm, the cumulative light amount is 200 to 6000 mJ/cm 2 , typically 300 to 2000 mJ/cm 2 , and the irradiation time is 1 to 60 seconds, typically 2 to 30 seconds. The adhesive is hardened to carry out the subsequent method of the adherend.
本發明亦可使用抗氧化劑作為其他成分。抗氧化劑能使用酚系、氫醌系,較佳可使用酚系。抗氧化劑能例示有:β-萘醌、2-甲氧基-1,4-萘醌、甲基氫、氫醌、2,2-亞甲基-雙(4-甲基-6-三級丁基酚)、兒茶酚、氫醌單甲基醚、單三級丁基氫醌、2,5-雙三級丁基氫醌、對苯醌、2,5-二苯基對苯醌、2,5-雙三級丁基對苯醌、苦味酸、檸檬酸、啡噻嗪、三級丁基兒茶酚、2-丁基-4-羥基大茴香醚及2,6-雙三級丁基- 對甲酚等。此等之中較佳為2,2-亞甲基-雙(4-甲基-6-三級丁基酚)。 Antioxidants can also be used as other ingredients in the present invention. A phenol type or a hydroquinone type can be used for an antioxidant, and a phenol type is preferable. Antioxidants can be exemplified by β-naphthoquinone, 2-methoxy-1,4-naphthoquinone, methyl hydrogen, hydroquinone, 2,2-methylene-bis(4-methyl-6-tris Butyl phenol), catechol, hydroquinone monomethyl ether, monoterpene butyl hydroquinone, 2,5-di-tertiary butyl hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone , 2,5-di-tertiary butyl-p-benzoquinone, picric acid, citric acid, phenothiazine, tertiary butyl catechol, 2-butyl-4-hydroxyanisole and 2,6-double Butyl-butyl P-cresol and so on. Among these, 2,2-methylene-bis(4-methyl-6-tertiarybutylphenol) is preferred.
相對於(A)成分、(B)成分、(C)成分及(F)成分的合計量100質量份,抗氧化劑之使用量較佳為0.01~10質量份、更佳為0.1~8質量份、更佳為2.0~8.0質量份。 The antioxidant is preferably used in an amount of 0.01 to 10 parts by mass, more preferably 0.1 to 8 parts by mass, per 100 parts by mass of the total of the components (A), (B), (C) and (F). More preferably, it is 2.0 to 8.0 parts by mass.
以下,以實驗例進一步詳細說明本發明,但本發明並不限定於此。還有,實驗例中記載之接著劑中的各成分係選自以下化合物。 Hereinafter, the present invention will be described in further detail by way of Experimental Examples, but the present invention is not limited thereto. Further, each component in the adhesive described in the experimental examples was selected from the following compounds.
(A)成分:含有雙環戊烯基之(甲基)丙烯酸酯,丙烯酸雙環戊烯酯(日立化成公司製「FA-511AS」) (A) component: (meth) acrylate containing dicyclopentenyl, dicyclopentenyl acrylate ("FA-511AS" by Hitachi Chemical Co., Ltd.)
(A)成分:含有雙環戊烯基之(甲基)丙烯酸酯,A:甲基丙烯酸雙環戊烯氧基乙酯(日立化成公司製「FA-512MT」) (A) component: (meth) acrylate containing dicyclopentenyl, A: dicyclopentenyloxyethyl methacrylate ("FA-512MT" by Hitachi Chemical Co., Ltd.)
(B)成分:含有羥基之(甲基)丙烯酸酯,丙烯酸2-羥基-3苯氧基丙酯(東亞合成公司製「M-5700」) (B) component: (meth) acrylate containing a hydroxyl group, 2-hydroxy-3 phenoxypropyl acrylate ("M-5700" manufactured by Toagosei Co., Ltd.)
(B)成分:含有羥基之(甲基)丙烯酸酯,甲基丙烯酸2-羥基乙酯(共榮社化學公司製「Light Ester HO」) (B) component: (meth) acrylate containing a hydroxyl group, 2-hydroxyethyl methacrylate ("Light Ester HO" by Kyoeisha Chemical Co., Ltd.)
(C)成分:寡聚物,異戊二烯寡聚物(Kuraray公司製「LIR-30」)(以GPC換算成聚苯乙烯之數量平均分子量28000) (C) component: oligomer, isoprene oligomer ("LIR-30" manufactured by Kuraray Co., Ltd.) (quantitative molecular weight of 28,000 in terms of GPC to polystyrene)
(C)成分:寡聚物,丁二烯寡聚物(Kuraray公司製「LBR-307」)(以GPC換算成聚苯乙烯之數量平均分子量8000) (C) component: oligomer, butadiene oligomer ("LBR-307" manufactured by Kuraray Co., Ltd.) (the average molecular weight of 8,000 in terms of GPC converted to polystyrene)
(D)成分:矽烷偶合劑,γ-環氧丙氧基丙基三甲氧基矽烷(信越化學公司製「KBM-403」) (D) component: decane coupling agent, γ-glycidoxypropyltrimethoxy decane ("KBM-403" manufactured by Shin-Etsu Chemical Co., Ltd.)
(D)成分:矽烷偶合劑,(乙烯基丙基)三甲氧基矽烷(信越化學公司製「KBM-1003」) (D) component: decane coupling agent, (vinyl propyl) trimethoxy decane ("KBM-1003" manufactured by Shin-Etsu Chemical Co., Ltd.)
(D)成分:矽烷偶合劑,γ-甲基丙烯醯氧基丙基三甲氧基矽烷(信越化學公司製「KBM-503」) (D) component: decane coupling agent, γ-methacryloxypropyltrimethoxydecane ("KBM-503" manufactured by Shin-Etsu Chemical Co., Ltd.)
(E)成分:光起始劑,二甲醇縮二苯乙二酮(Ciba Specialty Chemicals公司製「IRGACURE651」) (E) component: photoinitiator, dimethylene diphenylethanedione ("IRGACURE651" by Ciba Specialty Chemicals Co., Ltd.)
(E)成分:光起始劑,氧化雙(2,4,6-三甲基苯甲醯基)苯基膦(Ciba Specialty Chemicals公司製「IRGACURE819」) (E) component: photoinitiator, bis(2,4,6-trimethylbenzylidene)phenylphosphine ("IRGACURE 819" by Ciba Specialty Chemicals Co., Ltd.)
(F)成分:甲基丙烯酸(三菱麗陽公司製「AM」) (F) component: methacrylic acid ("AM" by Mitsubishi Rayon Co., Ltd.)
(F)成分:丙烯酸(日本觸媒公司製「丙烯酸甲酯AM」) (F) component: Acrylic ("Methyl acrylate AM" manufactured by Nippon Shokubai Co., Ltd.)
(G)成分:聚乙烯醇(電氣化學工業公司製「Denka POVOL H-17」)(平均聚合度1200、平均皂化度97莫耳%) (G) component: polyvinyl alcohol ("Denka POVOL H-17" by Electric Chemical Industry Co., Ltd.) (average polymerization degree 1200, average saponification degree: 97 mol%)
(G)成分:聚乙烯醇(電氣化學工業公司製「Denka POVOL F-12」)(平均聚合度1200、平均皂化度99莫耳%) (G) component: polyvinyl alcohol (Denka POVOL F-12, manufactured by Denki Kagaku Kogyo Co., Ltd.) (average polymerization degree 1200, average saponification degree: 99 mol%)
抗氧化劑(D-1)2,2-亞甲基-雙(4-甲基-6-三級丁基酚)(住友化學公司製「SUMILIZER MDP-S」) Antioxidant (D-1) 2,2-methylene-bis(4-methyl-6-tertiary butyl phenol) (Sumitomo Chemical Co., Ltd. "SUMILIZER MDP-S")
各種物性係如下述般測定。 Various physical properties were measured as follows.
在23℃之溫度下測定。關於光硬化性,以使接著劑的厚度為0.03mm之方式將接著劑塗布在ZEONEX 480R(日本ZEON公司製)試驗片(寬25mm×長25mm×厚2.0mm)表面。厚度係藉0.03mm玻璃珠控制。其後,用使用無電極放電燈之Fusion公司製硬化裝置,以波長365nm、累積光量2000mJ/cm2之條件照射15秒鐘照射,加以硬。將硬化率記載為光硬化性。硬化率係使用FT-IR,以下式算出。 Measured at a temperature of 23 °C. In the photocurability, the adhesive was applied to a surface of a test piece (width: 25 mm × length 25 mm × thickness: 2.0 mm) of a ZEONEX 480R (manufactured by Nippon Zeon Co., Ltd.) so that the thickness of the adhesive was 0.03 mm. The thickness is controlled by 0.03mm glass beads. Then, it was irradiated by irradiation with a curing device manufactured by Fusion Co., Ltd. using an electrodeless discharge lamp at a wavelength of 365 nm and a cumulative light amount of 2000 mJ/cm 2 for 15 seconds, and hardened. The curing rate is described as photocurability. The hardening rate was calculated by the following formula using FT-IR.
(硬化率)=[100-((硬化後之碳-碳雙鍵的吸收光譜強度)/(硬化前之碳-碳雙鍵的吸收光譜強度))]×100(%) (hardening rate) = [100 - ((absorption spectrum intensity of carbon-carbon double bond after hardening) / (absorption spectrum intensity of carbon-carbon double bond before hardening))] × 100 (%)
為了控制接著劑厚度,將於中央空出0.5cm2之大小的洞11的鐵氟龍(Teflon,註冊商標)膠帶10(厚80μm×寬25mm×長25mm)貼在ZEONEX 480R(日本ZEON公司製)試驗片12a(寬25mm×長100mm×厚2.0mm)的長度方向的前端部分。以使接著劑之厚度為80μm方式將接著劑13供給至該洞11後,以覆蓋該洞11之方式,將另一片ZEONEX 480R(日本ZEON公司製)試驗片12b(寬25mm×長100mm×厚2.0mm的前端部分貼合在鐵氟龍(註冊商標)膠帶10上。此時的樣子示於圖1。硬化後,使用經接著劑接著之該試驗片,依圖1之箭頭左右拉伸,測定拉伸接著強度。硬化條件係依〔光硬化性〕所記載之方法。 In order to control the thickness of the adhesive, a Teflon (registered trademark) tape 10 (thickness 80 μm × width 25 mm × length 25 mm) of a hole 11 having a size of 0.5 cm 2 is affixed to the center, and is attached to the ZEONEX 480R (manufactured by Japan ZEON Co., Ltd.). The front end portion of the test piece 12a (width 25 mm × length 100 mm × thickness 2.0 mm) in the longitudinal direction. After the adhesive 13 was supplied to the hole 11 so that the thickness of the adhesive was 80 μm, another piece of ZEONEX 480R (manufactured by ZEON CORPORATION, Japan) test piece 12b (width 25 mm × length 100 mm × thickness) was applied so as to cover the hole 11 The front end portion of 2.0 mm is attached to the Teflon (registered trademark) tape 10. The appearance at this time is shown in Fig. 1. After the hardening, the test piece is passed through the adhesive, and the arrow is stretched left and right according to the arrow of Fig. 1. The tensile strength was measured, and the curing conditions were as described in [Photocurability].
讓前述環烯烴聚合物接著性評價用試驗片在85℃×85%RH下暴露24小時,使用該試驗片測定拉伸接著強度。 The test piece for the evaluation of the adhesion of the above cyclic olefin polymer was exposed to 85 ° C × 85% RH for 24 hours, and the tensile strength was measured using the test piece.
使用厚80μm×寬11.5mm×長25mm之鐵氟龍(註冊商標)膠帶作為間隔物,以接著劑將PANLITE(帝人公司製)試驗片(寬25mm×長25mm×厚2.0mm)彼此接著(接著面積3.125cm2)。硬化後,使用經接著劑接著之該試驗片,測定拉伸接著強度。硬化條件係依〔光硬化性〕所記載之方法。 A Teflon (registered trademark) tape having a thickness of 80 μm × a width of 11.5 mm × a length of 25 mm was used as a spacer, and PANLITE (manufactured by Teijin Co., Ltd.) test pieces (width 25 mm × length 25 mm × thickness 2.0 mm) were adhered to each other (following) The area is 3.125cm 2 ). After the hardening, the tensile strength was measured using the test piece followed by the adhesive. The curing conditions are based on the method described in [Photocurability].
使用厚80μm×寬11.5mm×長25mm之鐵氟龍(註冊商標)膠帶作為間隔物,以接著劑將試驗片(寬25mm×長25mm×厚0.03mm)彼此接著(接著面積3.125cm2)。硬化後,使用經接著劑接著之該試驗片,測定拉伸接著強度。硬化條件係依〔光硬化性〕所記載之方法。 A Teflon (registered trademark) tape having a thickness of 80 μm × a width of 11.5 mm × a length of 25 mm was used as a spacer, and test pieces (width 25 mm × length 25 mm × thickness 0.03 mm) were adhered to each other with an adhesive (the area was 3.125 cm 2 ). After the hardening, the tensile strength was measured using the test piece followed by the adhesive. The curing conditions are based on the method described in [Photocurability].
使用厚80μm×寬11.5mm×長25mm之鐵氟龍(註冊商標)膠帶作為間隔物,以接著劑將試驗片(寬25mm×長25mm×厚0.03mm)彼此接著(接著面積3.125cm2)。硬化後,使用經接著劑接著之該試驗片,測定拉伸接著強度。硬化條件係依〔光硬化性〕所記載之方法。 A Teflon (registered trademark) tape having a thickness of 80 μm × a width of 11.5 mm × a length of 25 mm was used as a spacer, and test pieces (width 25 mm × length 25 mm × thickness 0.03 mm) were adhered to each other with an adhesive (the area was 3.125 cm 2 ). After the hardening, the tensile strength was measured using the test piece followed by the adhesive. The curing conditions are based on the method described in [Photocurability].
使用厚80μm×寬11.5mm×長25mm之鐵氟龍(註冊商標)膠帶作為間隔物,以接著劑將耐熱玻璃試驗片(25mm×25mm×2.0mm)彼此接著(接著面積3.125cm2)。硬化條件係依〔光硬化性〕所記載之方法。以上述條件使接著劑硬化後,進一步使用電氣化學工業公司製接著劑「G-55」,將鍍鋅鋼板(100mm×25mm×2.0mm,Engineering Test Service公司製)接著在試驗片內側。經過23℃×50%RH×24小時養護硬化後,使用經接著劑接著之該試驗片測定拉伸接著強度。拉伸剪切接著強度(單位:MPa)係在溫度23℃、濕度50%之環境下,以拉伸速度10mm/分測定。 A Teflon (registered trademark) tape having a thickness of 80 μm × a width of 11.5 mm × a length of 25 mm was used as a spacer, and a heat-resistant glass test piece (25 mm × 25 mm × 2.0 mm) was adhered to each other with an adhesive (the area was 3.125 cm 2 ). The curing conditions are based on the method described in [Photocurability]. After the adhesive was cured under the above conditions, a galvanized steel sheet (100 mm × 25 mm × 2.0 mm, manufactured by Engineering Test Service Co., Ltd.) was further placed on the inside of the test piece, using an adhesive "G-55" manufactured by Denki Kogyo Co., Ltd. After curing at 23 ° C × 50% RH × 24 hours, the tensile strength was measured using the test piece followed by the adhesive. The tensile shear strength (unit: MPa) was measured at a tensile speed of 10 mm/min under an environment of a temperature of 23 ° C and a humidity of 50%.
使接著劑硬化,調製長20mm、寬5mm、×厚1mm之硬化物試料。硬化條件係依〔光硬化性〕所記載之方法。評價此硬化物試料。使用精工電子工業(股)公司製Tension Module DMS 210,在頻率1Hz、畸變度0.05%之條件下變更溫度,測定拉伸模式下的動態黏彈性頻譜,求得23℃之儲藏彈性模數E’值。 The adhesive was cured to prepare a cured sample having a length of 20 mm, a width of 5 mm, and a thickness of 1 mm. The curing conditions are based on the method described in [Photocurability]. This hardened sample was evaluated. The temperature was changed at a frequency of 1 Hz and a distortion of 0.05% using a Tension Module DMS 210 manufactured by Seiko Instruments Inc., and the dynamic viscoelastic spectrum in the tensile mode was measured to obtain a storage elastic modulus E' at 23 °C. value.
以表1所示之組成混合表1所示之種類的原料以調製接著劑。對所得到的接著劑實施各種物性之測定。其結果示於表1。 The raw materials of the types shown in Table 1 were mixed in the composition shown in Table 1 to prepare an adhesive. Various physical properties were measured for the obtained adhesive. The results are shown in Table 1.
本案發明能對環烯烴聚合物、聚碳酸酯、聚乙烯醇、纖維素三乙酸酯、及玻璃展現充分的接著強度。且本案發明具有耐濕性。 The invention of the present invention exhibits sufficient bond strength to the cyclic olefin polymer, polycarbonate, polyvinyl alcohol, cellulose triacetate, and glass. Moreover, the invention of the present invention has moisture resistance.
環烯烴聚合物因極性小,且於表面沒有許多的官能基,而有不易接著之問題。為了接著環烯烴聚合物,在使用接著劑後,有必要進一步合併使用底漆處理與表面電暈處理。而實施底漆處理與表面電暈處理,恐使製程增多。 The cycloolefin polymer has a small polarity and does not have many functional groups on the surface, and has a problem that it is difficult to proceed. In order to follow the cycloolefin polymer, it is necessary to further combine the primer treatment with the surface corona treatment after the use of the adhesive. The implementation of primer treatment and surface corona treatment may increase the number of processes.
本案發明僅以接著劑即對環烯烴聚合物顯示高接著性。本案發明因即便不合併使用底漆處理與表面電暈處理,亦對環烯烴聚合物顯示高接著性,故能省力化。因此本案發明為有用之技術。 The invention of the present invention exhibits high adhesion only to the cyclic olefin polymer by the adhesive agent. In the present invention, since the primer treatment and the surface corona treatment are not combined, the cyclic olefin polymer exhibits high adhesion, so that labor can be saved. Therefore, the invention of the present invention is a useful technique.
10‧‧‧膠帶 10‧‧‧ Tape
11‧‧‧洞 11‧‧‧ hole
12a、12b‧‧‧試驗片 12a, 12b‧‧‧ test strips
13‧‧‧接著劑 13‧‧‧Binder
圖1為顯示實施例中測定拉伸接著強度之順序的示意圖。 Fig. 1 is a schematic view showing the order of measuring the tensile strength in the examples.
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JPS5918773A (en) * | 1982-07-22 | 1984-01-31 | Denki Kagaku Kogyo Kk | Adhesive composition |
JPH0237953B2 (en) * | 1982-08-03 | 1990-08-28 | Denki Kagaku Kogyo Kk | SETSUCHAKUZAISOSEIBUTSU |
KR101144029B1 (en) * | 2005-05-31 | 2012-05-09 | 덴끼 가가꾸 고교 가부시키가이샤 | Energy ray-curable resin composition and adhesive using same |
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