JP5863773B2 - Resin composition and adhesive - Google Patents
Resin composition and adhesive Download PDFInfo
- Publication number
- JP5863773B2 JP5863773B2 JP2013509982A JP2013509982A JP5863773B2 JP 5863773 B2 JP5863773 B2 JP 5863773B2 JP 2013509982 A JP2013509982 A JP 2013509982A JP 2013509982 A JP2013509982 A JP 2013509982A JP 5863773 B2 JP5863773 B2 JP 5863773B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- adhesive
- resin composition
- meth
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims description 71
- 230000001070 adhesive effect Effects 0.000 title claims description 67
- 239000011342 resin composition Substances 0.000 title claims description 28
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 32
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 32
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 18
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 16
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 11
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical group CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 10
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 8
- 229920002284 Cellulose triacetate Polymers 0.000 claims description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 claims description 7
- 230000003078 antioxidant effect Effects 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical group CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 125000002897 diene group Chemical group 0.000 claims 2
- 238000001723 curing Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 14
- -1 2-hydroxypropyl Chemical group 0.000 description 10
- 150000001993 dienes Chemical group 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000004809 Teflon Substances 0.000 description 6
- 229920006362 Teflon® Polymers 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 229920001195 polyisoprene Polymers 0.000 description 6
- 150000001925 cycloalkenes Chemical class 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 4
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 3
- 239000004831 Hot glue Substances 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000007127 saponification reaction Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- SYYDEXILBJXXIA-UHFFFAOYSA-N trimethoxy(pent-4-enyl)silane Chemical compound CO[Si](OC)(OC)CCCC=C SYYDEXILBJXXIA-UHFFFAOYSA-N 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- OBGBGHKYJAOXRR-UHFFFAOYSA-N 2-methoxy-1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C(OC)=CC(=O)C2=C1 OBGBGHKYJAOXRR-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012567 medical material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- JMIZWXDKTUGEES-UHFFFAOYSA-N 2,2-di(cyclopenten-1-yloxy)ethyl 2-methylprop-2-enoate Chemical compound C=1CCCC=1OC(COC(=O)C(=C)C)OC1=CCCC1 JMIZWXDKTUGEES-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- ZZYASVWWDLJXIM-UHFFFAOYSA-N 2,5-di-tert-Butyl-1,4-benzoquinone Chemical compound CC(C)(C)C1=CC(=O)C(C(C)(C)C)=CC1=O ZZYASVWWDLJXIM-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- QYXHDJJYVDLECA-UHFFFAOYSA-N 2,5-diphenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=C(C=2C=CC=CC=2)C(=O)C=C1C1=CC=CC=C1 QYXHDJJYVDLECA-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical compound CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- MRBKEAMVRSLQPH-UHFFFAOYSA-N 3-tert-butyl-4-hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1 MRBKEAMVRSLQPH-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- 125000006181 4-methyl benzyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000006677 Appel reaction Methods 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- WMONOXOCMIPNNU-UHFFFAOYSA-N C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O Chemical compound C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O WMONOXOCMIPNNU-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- FEXQDZTYJVXMOS-UHFFFAOYSA-N Isopropyl benzoate Chemical compound CC(C)OC(=O)C1=CC=CC=C1 FEXQDZTYJVXMOS-UHFFFAOYSA-N 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
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- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
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- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/82—Testing the joint
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
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- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
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- B29C66/1122—Single lap to lap joints, i.e. overlap joints
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
- B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/94—Measuring or controlling the joining process by measuring or controlling the time
- B29C66/949—Measuring or controlling the joining process by measuring or controlling the time characterised by specific time values or ranges
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J115/00—Adhesives based on rubber derivatives
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- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
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- C08C19/00—Chemical modification of rubber
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- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
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- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
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Description
本発明は、接着剤に関する。 The present invention relates to an adhesive.
シクロオレフィンポリマーは、電子材料、光学レンズ及び医療材料等の用途に使用されている。シクロオレフィンポリマーは極性が小さく、表面に多くの官能基を持たないことから、難被着体として知られている。このようなシクロオレフィン系樹脂を接着する接着剤としては溶剤型接着剤やホットメルト接着剤が挙げられる。 Cycloolefin polymers are used in applications such as electronic materials, optical lenses and medical materials. Cycloolefin polymers are known as difficult adherends because of their low polarity and lack of many functional groups on the surface. Examples of the adhesive for adhering such a cycloolefin-based resin include a solvent-type adhesive and a hot melt adhesive.
オレフィン系樹脂を接着する方法として、特許文献1に開示されているように、プライマーによる処理を行ってから瞬間接着剤により接着するという方法がある。特許文献2に開示されるように、(メタ)アクリレートを含有することを特徴とするエネルギー線硬化性樹脂組成物が開示されている。 As a method for adhering an olefin-based resin, as disclosed in Patent Document 1, there is a method of adhering with an instantaneous adhesive after performing a treatment with a primer. As disclosed in Patent Document 2, an energy ray curable resin composition containing (meth) acrylate is disclosed.
溶剤型接着剤は、溶剤を使用する。溶剤型接着剤は、人体に有害である上、溶剤の揮発に時間がかかり、接着強度自体も十分なものが得られない。 A solvent type adhesive uses a solvent. Solvent-type adhesives are harmful to the human body, and it takes time for the solvent to evaporate, so that sufficient adhesive strength itself cannot be obtained.
ホットメルト接着剤は、接着剤を溶融させる手間及び装置が必要である。又、この接着剤の場合も十分な接着強度を得ることができない。尚、ホットメルト接着剤を用いる場合、シクロオレフィンポリマーを予め加熱しておけば、接着強度は向上するが、樹脂が変形してしまうという新たな問題が発生する。 The hot melt adhesive requires labor and equipment for melting the adhesive. Also, this adhesive cannot provide sufficient adhesive strength. In the case of using a hot melt adhesive, if the cycloolefin polymer is heated in advance, the adhesive strength is improved, but a new problem that the resin is deformed occurs.
特許文献1に開示されている接着方法によれば、プライマー処理に手間がかかるという問題がある上、接着強度も十分なものが得られない。 According to the adhesion method disclosed in Patent Document 1, there is a problem that it takes time and effort for primer treatment, and a sufficient adhesion strength cannot be obtained.
特許文献2は、(メタ)アクリレートを含有することを特徴とするエネルギー線硬化性樹脂組成物が開示されている。しかし、ジシクロペンテニル基を有する(メタ)アクリレートについては記載がない。 Patent Document 2 discloses an energy ray curable resin composition containing (meth) acrylate. However, there is no description about (meth) acrylate having a dicyclopentenyl group.
特許文献3は、ポリイソプレン、ポリブタジエン、ポリウレタン骨格をもつ(メタ)アクリレートオリゴマー及び柔軟化成分を含む光硬化型接着組成物が開示されている。しかし、(メタ)アクリル酸については記載がない。 Patent Document 3 discloses a photocurable adhesive composition containing polyisoprene, polybutadiene, a (meth) acrylate oligomer having a polyurethane skeleton, and a softening component. However, there is no description about (meth) acrylic acid.
シクロオレフィンポリマーは、低吸水性、高透明性、低比重を特徴としている。そのため、シクロオレフィンポリマーは、ガラス代替材料、透明プラスチック代替材料として、電子材料、光学レンズ及び医療材料等の用途に使用されている。
しかしながら、シクロオレフィンポリマーは、極性は小さく、表面に多くの官能基を持たないため、接着しにくいといった課題があった。Cycloolefin polymers are characterized by low water absorption, high transparency, and low specific gravity. Therefore, cycloolefin polymers are used as applications for glass materials and transparent plastics in applications such as electronic materials, optical lenses, and medical materials.
However, since the cycloolefin polymer has a small polarity and does not have many functional groups on the surface, there is a problem that it is difficult to adhere.
本発明はそのような実情に鑑みてなされたものである。本発明は、例えば、シクロオレフィンポリマーに対して短時間で十分な接着強度を発現でき、且つ無溶剤型で環境に優しいシクロオレフィンポリマー用接着剤の提供を目的とする。 The present invention has been made in view of such circumstances. An object of this invention is to provide the adhesive agent for cycloolefin polymers which can express sufficient adhesive strength in a short time with respect to a cycloolefin polymer, for example, and is a solvent-free type and environmentally friendly.
本発明者は、前記の課題を解決するべく鋭意研究を重ね、本発明に至ったものである。 The present inventor has intensively studied to solve the above-described problems and has arrived at the present invention.
即ち、本発明は一側面において、
下記(A)〜(F)成分を含有してなる樹脂組成物である。
(A)成分は、ジシクロペンテニル基を有する(メタ)アクリレート
(B)成分は、水酸基を有する(メタ)アクリレート
(C)成分は、ジエン系の骨格又は水素添加されたジエン系の骨格を有し、かつ、(メタ)アクリロイル基を有しないオリゴマー
(D)成分は、シランカップリング剤
(E)成分は、光重合開始剤
(F)成分は、(メタ)アクリル酸That is, the present invention in one aspect,
A resin composition comprising the following components (A) to (F).
The component (A) is a (meth) acrylate (B) component having a dicyclopentenyl group, the (meth) acrylate (C) component having a hydroxyl group has a diene skeleton or a hydrogenated diene skeleton. In addition, the oligomer (D) component not having a (meth) acryloyl group is a silane coupling agent (E) component, a photopolymerization initiator (F) component is (meth) acrylic acid
本発明に係る樹脂組成物は一実施形態において、更に(G)成分として、ポリビニルアルコールを含有してなる。 In one embodiment, the resin composition according to the present invention further contains polyvinyl alcohol as the component (G).
本発明に係る樹脂組成物は一実施形態において、(A)成分がジシクロペンテニル(メタ)アクリレートである。 In one embodiment of the resin composition according to the present invention, the component (A) is dicyclopentenyl (meth) acrylate.
本発明に係る樹脂組成物は一実施形態において、更に(C)成分の数平均分子量が500〜50000である。 In one embodiment of the resin composition according to the present invention, the number average molecular weight of the component (C) is 500 to 50,000.
本発明に係る樹脂組成物は一実施形態において、厚み0.03mmとして、波長365nm、積算光量2000mJ/cm2の条件にて15秒間照射することによって、硬化させたときに、硬化物の貯蔵弾性率が0.1〜100000MPa(23℃)の範囲内となる。In one embodiment, the resin composition according to the present invention has a thickness of 0.03 mm, and when cured by irradiation for 15 seconds under conditions of a wavelength of 365 nm and an integrated light quantity of 2000 mJ / cm 2 , the storage elasticity of the cured product. The rate falls within the range of 0.1 to 100000 MPa (23 ° C.).
本発明に係る樹脂組成物は一実施形態において、更に酸化防止剤を含有してなる。 In one embodiment, the resin composition according to the present invention further contains an antioxidant.
本発明は別の一側面において、本発明に係る該樹脂組成物からなる接着剤である。 In another aspect, the present invention is an adhesive comprising the resin composition according to the present invention.
本発明に係る接着剤は一実施形態において、シクロオレフィンポリマー用接着剤である。 In one embodiment, the adhesive according to the present invention is a cycloolefin polymer adhesive.
本発明に係る接着剤は一実施形態において、ジシクロペンタジエン環構造を有するシクロオレフィンポリマー用接着剤である。 In one embodiment, the adhesive according to the present invention is an adhesive for a cycloolefin polymer having a dicyclopentadiene ring structure.
本発明は更に別の一側面において、本発明に係る該接着剤を用いて被着体同士が接着された接着体である。 In still another aspect, the present invention is an adhesive body in which adherends are bonded to each other using the adhesive according to the present invention.
本発明に係る接着体は一実施形態において、被着体が、シクロオレフィンポリマー、ポリカーボネート、セルローストリアセテート、ポリビニルアルコール及びガラスからなる群から選ばれる1種以上である。 In one embodiment, the adherend according to the present invention is at least one member selected from the group consisting of cycloolefin polymer, polycarbonate, cellulose triacetate, polyvinyl alcohol and glass.
本発明は更に別の一側面において、被着体表面に、本発明に係る該接着剤を厚み0.0001〜5mmになるように塗布し、被着体同士を貼り合わせ、波長200〜500nm、積算光量200〜6000J/cm2、照射時間1〜60秒の条件下で接着剤を硬化することを含む接着体の製造方法である。In yet another aspect of the present invention, on the surface of the adherend, the adhesive according to the present invention is applied so as to have a thickness of 0.0001 to 5 mm, and the adherends are bonded together, and the wavelength is 200 to 500 nm. It is the manufacturing method of the adhesive body including hardening an adhesive agent on the conditions of the integrated light quantity 200-6000 J / cm < 2 > and irradiation time 1-60 seconds.
本発明の樹脂組成物は、例えば、シクロオレフィンポリマーに対して高い接着強度を示し、耐湿性にも優れているという特徴を有する。 The resin composition of the present invention has, for example, characteristics that it exhibits high adhesive strength with respect to a cycloolefin polymer and is excellent in moisture resistance.
本発明における(A)成分は、ジシクロペンテニル基を有する(メタ)アクリレートである。より具体的には、(A)成分は分子の末端又は側鎖に1個以上のジシクロペンテニル基を含有する(メタ)アクリレートである。(A)成分の(メタ)アクリレートとしては、ジシクロペンテニルオキシエチル(メタ)アクリレート、ジシクロペンテニルオキシプロピル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート等が挙げられる。これらの中では、ジシクロペンテニル(メタ)アクリレートが好ましい。 The component (A) in the present invention is a (meth) acrylate having a dicyclopentenyl group. More specifically, the component (A) is a (meth) acrylate containing one or more dicyclopentenyl groups at the terminal or side chain of the molecule. Examples of the (meth) acrylate of the component (A) include dicyclopentenyloxyethyl (meth) acrylate, dicyclopentenyloxypropyl (meth) acrylate, and dicyclopentenyl (meth) acrylate. Of these, dicyclopentenyl (meth) acrylate is preferred.
(B)成分は、水酸基を含有する(メタ)アクリレートである。より具体的には、(B)成分は分子の末端又は側鎖に1個以上の水酸基を含有する(メタ)アクリレートである。水酸基を含有する(メタ)アクリレートとしては、2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、2−ヒドロキシブチル(メタ)アクリレート、2−ヒドロキシ−3−フェノキシプロピル(メタ)アクリレート、2−(メタ)アクリロイルオキシエチル−2−ヒドロキシプロピルフタレート、4−ヒドロキシシクロヘキシル(メタ)アクリレート等が挙げられる。これらの中では、接着性の観点から、2−ヒドロキシ−3−フェノキシプロピル(メタ)アクリレートがより好ましい。 The component (B) is a (meth) acrylate containing a hydroxyl group. More specifically, the component (B) is a (meth) acrylate containing one or more hydroxyl groups at the end or side chain of the molecule. Examples of the (meth) acrylate containing a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 2-hydroxy-3-phenoxypropyl (meth) acrylate. 2- (meth) acryloyloxyethyl-2-hydroxypropyl phthalate, 4-hydroxycyclohexyl (meth) acrylate, and the like. Among these, 2-hydroxy-3-phenoxypropyl (meth) acrylate is more preferable from the viewpoint of adhesiveness.
(C)成分は、ジエン系の骨格又は水素添加されたジエン系の骨格を有するオリゴマーである。(C)成分は、(メタ)アクリレロイル基を有しないことが好ましい。(C)成分は、樹脂の柔軟性付与の観点から、以下のような成分が挙げられる。 The component (C) is an oligomer having a diene skeleton or a hydrogenated diene skeleton. (C) It is preferable that a component does not have a (meth) acryloyl group. Examples of the component (C) include the following components from the viewpoint of imparting flexibility of the resin.
オリゴマーの主鎖骨格は、ジエン系の骨格又は水素添加されたジエン系の骨格である。ジエン系の骨格又は水素添加されたジエン系の骨格としては、ポリブタジエン、ポリイソプレン、ポリブタジエンの水素添加物及びポリイソプレンの水素添加物からなる群から選ばれる1種以上の骨格が挙げられる。これらの中では、ポリイソプレン及びポリイソプレンの水素添加物からなる群から選ばれる1種以上が好ましく、ポリイソプレンがより好ましい。 The main chain skeleton of the oligomer is a diene skeleton or a hydrogenated diene skeleton. Examples of the diene skeleton or the hydrogenated diene skeleton include one or more skeletons selected from the group consisting of polybutadiene, polyisoprene, a hydrogenated polybutadiene, and a hydrogenated polyisoprene. Among these, at least one selected from the group consisting of polyisoprene and a hydrogenated product of polyisoprene is preferable, and polyisoprene is more preferable.
(C)成分のオリゴマーの数平均分子量は500〜50000が好ましく、5000〜45000がより好ましく、8000〜40000が最も好ましい。数平均分子量が500以上であれば、本発明の接着剤にエネルギー線を照射して得られる硬化体の硬度が高いので接着剤層を形成しやすくなる。数平均分子量が50000以下であれば、得られる接着剤の粘度が小さいので、製造過程での混合等における作業性や実用用途において当該接着剤を用いる際の作業性が良好である。 The number average molecular weight of the component (C) oligomer is preferably 500 to 50000, more preferably 5000 to 45000, and most preferably 8000 to 40000. If the number average molecular weight is 500 or more, the cured product obtained by irradiating the adhesive of the present invention with energy rays has a high hardness, so that it is easy to form an adhesive layer. If the number average molecular weight is 50000 or less, the viscosity of the resulting adhesive is small, so that the workability in mixing during the production process and the workability when using the adhesive in practical applications are good.
(C)成分のオリゴマーとしては、クラレ社製「LIR−50」(イソプレンオリゴマー)、クラレ社製「LIR−30」(イソプレンオリゴマー)、クラレ社製「LBR−307」(ブタジエンオリゴマー)、クラレ社製「LBR−305」(ブタジエンオリゴマー)、クラレ社製「LBR−300」(ブタジエンオリゴマー)が挙げられる。これらの中では、イソプレンオリゴマー及び/又はブタジエンオリゴマーの1種以上が柔軟性と接着性の観点より好ましい。 As the oligomer of component (C), Kuraray "LIR-50" (isoprene oligomer), Kuraray "LIR-30" (isoprene oligomer), Kuraray "LBR-307" (butadiene oligomer), Kuraray “LBR-305” (butadiene oligomer) manufactured by Kuraray Co., Ltd. and “LBR-300” (butadiene oligomer) manufactured by Kuraray Co., Ltd. may be mentioned. In these, 1 or more types of an isoprene oligomer and / or a butadiene oligomer are preferable from a viewpoint of a softness | flexibility and adhesiveness.
(D)成分は、シランカップリング剤である。シランカップリング剤としては、γ−クロロプロピルトリメトキシシラン、ビニルトリメトキシシラン、ビニルトリクロルシラン、ビニルトリエトキシシラン、ビニルプロピルトリメトキシシラン、ビニル−トリス(β−メトキシエトキシ)シラン、γ−(メタ)アクリロキシプロピルトリメトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−メルカプトプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、N−β−(アミノエチル)−γ−アミノプロピルトリメトキシシラン、N−β−(アミノエチル)−γ−アミノプロピルメチルジメトキシシラン、γ−ユレイドプロピルトリエトキシシラン、ヒドロキシエチル(メタ)アクリレートリン酸エステル、(メタ)アクリロキシオキシエチルアシッドフォスフェート、(メタ)アクリロキシオキシエチルアシッドフォスフェートモノエチルアミンハーフソルト等が挙げられる。これらの中では、ガラス等への密着性という観点から、γ−グリシドキシプロピルトリメトキシシラン、γ−(メタ)アクリロキシプロピルトリメトキシシラン及びビニルプロピルトリメトキシシランからなる群のうちの1種以上が好ましい。 (D) A component is a silane coupling agent. The silane coupling agent includes γ-chloropropyltrimethoxysilane, vinyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinylpropyltrimethoxysilane, vinyl-tris (β-methoxyethoxy) silane, γ- (meta ) Acryloxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N -Β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane, γ-ureidopropyltriethoxysilane, hydroxyethyl (meth) acrylate Ester, (meth) acrylate Roxio carboxyethyl acid phosphate, and (meth) acrylate Roxio carboxyethyl acid phosphate Tomono ethylamine half salt and the like. Among these, from the viewpoint of adhesion to glass or the like, one kind of the group consisting of γ-glycidoxypropyltrimethoxysilane, γ- (meth) acryloxypropyltrimethoxysilane, and vinylpropyltrimethoxysilane. The above is preferable.
(E)成分は、光重合開始剤である。光重合開始剤としては紫外線重合開始剤や可視光重合開始剤等が挙げられるが、どちらも制限無く用いられる。紫外線重合開始剤としては、ベンゾイン系、ベンゾフェノン系、アセトフェノン系等が挙げられる。可視光重合開始剤としては、アシルホスフィンオキサイド系、チオキサントン系、メタロセン系、キノン系、α−アミノアルキルフェノン系等が挙げられる。 (E) A component is a photoinitiator. Examples of the photopolymerization initiator include an ultraviolet polymerization initiator and a visible light polymerization initiator, both of which are used without limitation. Examples of the ultraviolet polymerization initiator include benzoin, benzophenone, and acetophenone. Examples of visible light polymerization initiators include acylphosphine oxides, thioxanthones, metallocenes, quinones, and α-aminoalkylphenones.
光重合開始剤としては、ベンゾフェノン、4−フェニルベンゾフェノン、ベンゾイル安息香酸、2,2−ジエトキシアセトフェノン、ビスジエチルアミノベンゾフェノン、ベンジル、ベンゾイン、ベンゾイルイソプロピルエーテル、ベンジルジメチルケタール、1−ヒドロキシシクロヘキシルフェニルケトン、チオキサントン、2−メチルチオキサントン、2,4−ジメチルチオキサントン、イソプロピルチオキサントン、2,4−ジエチルチオキサントン、2,4−ジイソプロピルチオキサントン、1−(4−イソプロピルフェニル)2−ヒドロキシ−2−メチルプロパン−1−オン、1−(4−(2−ヒドロキシエトキシ)−フェニル)−2−ヒドロキシ−2−メチル−1―プロパン−1−オン、2−ヒドロキシ−2−メチル−1−フェニルプロパン−1−オン、カンファーキノン、2,4,6−トリメチルベンゾイルジフェニルホスフィンオキサイド、ビス(2,4,6−トリメチルベンゾイル)−フェニルホスフィンオキサイド、2−メチル−1−(4−(メチルチオ)フェニル)−2−モルフォリノプロパン−1−オン、2−ベンジル―2−ジメチルアミノ−1−(4−モルフォリノフェニル)−1−ブタノン−1、2−ジメチルアミノ−2−(4−メチル−ベンジル)−1−(4−モリフォリン−4−イル−フェニル)−ブタン−1−オン、ビス(2,6−ジメトキシベンゾイル)−2,4,4−トリメチル−ペンチルホスフィンオキサイド等が挙げられる。これらの中では、ベンジルジメチルケタールが好ましい。
(F)成分は、(メタ)アクリル酸(アクリル酸またはメタクリル酸)である。これは特に耐湿性などの耐久性の観点より使用する。Photopolymerization initiators include benzophenone, 4-phenylbenzophenone, benzoylbenzoic acid, 2,2-diethoxyacetophenone, bisdiethylaminobenzophenone, benzyl, benzoin, benzoylisopropyl ether, benzyldimethyl ketal, 1-hydroxycyclohexyl phenyl ketone, thioxanthone 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 1- (4-isopropylphenyl) 2-hydroxy-2-methylpropan-1-one 1- (4- (2-hydroxyethoxy) -phenyl) -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-2-methyl-1-phen Rupropan-1-one, camphorquinone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2-methyl-1- (4- (methylthio) phenyl ) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone-1,2-dimethylamino-2- (4-methyl-benzyl) ) -1- (4-Morifolin-4-yl-phenyl) -butan-1-one, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide, and the like. Of these, benzyldimethyl ketal is preferred.
(F) A component is (meth) acrylic acid (acrylic acid or methacrylic acid). This is particularly used from the viewpoint of durability such as moisture resistance.
本発明の樹脂組成物は、前記(A)〜(F)成分を必須成分として含有する。前記(A)〜(F)成分を含有する樹脂組成物は、これに光を照射されることにより硬化する。硬化物はシクロオレフィンポリマーに対して接着性が良好であるとともに、前記硬化に際して表面硬化性が高い特徴を示す。本発明の樹脂組成物は、例えば、ポリカーボネート、セルローストリアセテート、ポリビニルアルコール等の汎用プラスチック樹脂、ガラス被着体に対しても高い接着強さを示す。 The resin composition of the present invention contains the components (A) to (F) as essential components. The resin composition containing the components (A) to (F) is cured by being irradiated with light. The cured product has good adhesiveness to the cycloolefin polymer and has a high surface curability during the curing. The resin composition of the present invention exhibits high adhesive strength even for general-purpose plastic resins such as polycarbonate, cellulose triacetate, and polyvinyl alcohol, and glass adherends.
本発明における樹脂組成物には、(G)成分として、ポリビニルアルコールを含有することができる。これは、ポリビニルアルコール樹脂からなる被着体への密着性の観点から、以下のような成分が挙げられる。 The resin composition in the present invention can contain polyvinyl alcohol as the component (G). This includes the following components from the viewpoint of adhesion to an adherend made of polyvinyl alcohol resin.
前記ポリビニルアルコールは、ポリ酢酸ビニルをけん化して得られるポリビニルアルコール誘導体であれば、特に限定されるものではない。ポリビニルアルコールの平均重合度は100〜5000が好ましく、1000〜4000がより好ましい。ポリビニルアルコールの平均けん化度は85〜100モル%が好ましく、90〜100モル%がより好ましい。 The polyvinyl alcohol is not particularly limited as long as it is a polyvinyl alcohol derivative obtained by saponifying polyvinyl acetate. The average degree of polymerization of polyvinyl alcohol is preferably from 100 to 5,000, more preferably from 1,000 to 4,000. The average saponification degree of polyvinyl alcohol is preferably 85 to 100 mol%, more preferably 90 to 100 mol%.
本発明の樹脂組成物の使用量は、接着剤のシクロオレフィンポリマーに対する接着性が特段に高くなり、且つ、他の被着体に対しても高い接着強さを有するようになる観点から、以下の通りである。 The use amount of the resin composition of the present invention is as follows, from the viewpoint that the adhesiveness of the adhesive to the cycloolefin polymer is particularly high and also has high adhesive strength to other adherends. It is as follows.
(A)成分、(B)成分及び(C)成分の使用量は、(A)成分、(B)成分及び(C)成分の合計100質量部中、(A)成分:(B)成分:(C)成分=40〜90:1〜20:5〜45(質量比)が好ましく、(A)成分:(B)成分:(C)成分=55〜85:3〜10:10〜40(質量比)がより好ましい。 Component (A), component (B) and component (C) are used in a total of 100 parts by weight of component (A), component (B) and component (C), component (A): component (B): (C) component = 40-90: 1-20: 5-45 (mass ratio) is preferable, (A) component: (B) component: (C) component = 55-85: 3-10: 10-40 ( (Mass ratio) is more preferable.
(D)成分の使用量は、(A)成分、(B)成分、(C)成分及び(F)成分の合計量100質量部に対して、0.01〜10質量部が好ましく、0.1〜5質量部がより好ましく、典型的には0.5〜1.0質量部である。 The amount of component (D) used is preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the total amount of components (A), (B), (C) and (F). 1-5 mass parts is more preferable, and it is 0.5-1.0 mass part typically.
(E)成分の使用量は、(A)成分、(B)成分、(C)成分及び(F)成分の合計量100質量部に対して、0.01〜30質量部が好ましく、0.1〜20質量部がより好ましく、典型的には5〜10質量部である。 The amount of the component (E) used is preferably 0.01 to 30 parts by mass with respect to 100 parts by mass of the total amount of the components (A), (B), (C) and (F). 1-20 mass parts is more preferable, and it is 5-10 mass parts typically.
(F)成分の使用量は、(A)成分、(B)成分、(C)成分及び(F)成分の合計量100質量部中、0.1〜30質量部が好ましく、1〜20質量部がより好ましく、典型的には10〜15質量部である。 The amount of component (F) used is preferably 0.1 to 30 parts by mass, and 1 to 20 parts by mass, in 100 parts by mass of the total amount of components (A), (B), (C) and (F). Part is more preferred, typically 10-15 parts by weight.
(G)成分の使用量は、(A)成分、(B)成分、(C)成分及び(F)成分の合計量100質量部に対して、0.01〜50質量部が好ましく、0.1〜30質量部がより好ましく、典型的には0.5〜1.0質量部である。 The amount of component (G) used is preferably 0.01 to 50 parts by mass with respect to 100 parts by mass of the total amount of components (A), (B), (C) and (F). 1-30 mass parts is more preferable, and it is 0.5-1.0 mass part typically.
尚、本発明の樹脂組成物は、本発明の目的を損なわない範囲で、グラフト共重合体、溶剤、増量材、補強材、可塑剤、増粘剤、染料、顔料、難燃剤、酸化防止剤、及び界面活性剤等の添加剤を使用することができる。 The resin composition of the present invention is within the range that does not impair the object of the present invention, and is a graft copolymer, solvent, extender, reinforcing material, plasticizer, thickener, dye, pigment, flame retardant, antioxidant. , And additives such as surfactants can be used.
本発明の樹脂組成物の硬化物は0.1〜100000MPa(23℃)の貯蔵弾性率を有することが好ましく、10〜10000MPaの貯蔵弾性率を有することがより好ましく、典型的には500〜5000MPaである。樹脂組成物の硬化物の貯蔵弾性率が0.1MPa以上である場合、硬化物が硬化し、未反応成分が残らない。貯蔵弾性率が100000MPa以下である場合、硬化物が剛直になりすぎず、接着力が低下しない。 The cured product of the resin composition of the present invention preferably has a storage elastic modulus of 0.1 to 100000 MPa (23 ° C.), more preferably has a storage elastic modulus of 10 to 10,000 MPa, and typically 500 to 5000 MPa. It is. When the storage elastic modulus of the cured product of the resin composition is 0.1 MPa or more, the cured product is cured and no unreacted component remains. When the storage elastic modulus is 100000 MPa or less, the cured product does not become too rigid and the adhesive force does not decrease.
本発明の樹脂組成物は、接着剤として使用できる。本発明の接着剤は、例えば、シクロオレフィンポリマー、ポリカーボネート、セルローストリアセテート(トリアセチルセルロース)、ポリビニルアルコール及びガラスからなる群から選ばれる1種以上に対して高い接着強度を示す。すなわち、これらの樹脂を被着体として有用な接着剤として用いることができる。本発明の接着剤は、これらの被着体の中でも特に、シクロオレフィンポリマーに対して高い接着強度を示す。 The resin composition of the present invention can be used as an adhesive. The adhesive of the present invention exhibits high adhesive strength with respect to one or more selected from the group consisting of, for example, cycloolefin polymer, polycarbonate, cellulose triacetate (triacetylcellulose), polyvinyl alcohol, and glass. That is, these resins can be used as an adhesive useful as an adherend. Among these adherends, the adhesive of the present invention exhibits high adhesive strength to cycloolefin polymers.
本発明の用途としての接着剤が適用可能な被着体のシクロオレフィンポリマーとは、例えば、ノルボルネンや多環ノルボルネン系モノマー等の環状オレフィン(シクロオレフィン)モノマー由来の構成単位を有する熱可塑性樹脂である。シクロオレフィンポリマーとしては、例えば、シクロオレフィンの開環重合体、2種以上のシクロオレフィンを用いた開環共重合体の水素添加物、鎖状オレフィンやビニル基を有する芳香族化合物とシクロオレフィンとの付加共重合体等が挙げられ、本発明に係る接着剤はとりわけジシクロペンタジエン環構造を有するシクロオレフィンポリマーに有効である。又、シクロオレフィンポリマーに、極性基を導入してもよい。 The cycloolefin polymer of the adherend to which the adhesive as an application of the present invention can be applied is, for example, a thermoplastic resin having a structural unit derived from a cyclic olefin (cycloolefin) monomer such as norbornene or a polycyclic norbornene monomer. is there. Examples of cycloolefin polymers include cycloolefin ring-opening polymers, hydrogenated ring-opening copolymers using two or more cycloolefins, chain olefins, aromatic compounds having a vinyl group, and cycloolefins. The adhesive according to the present invention is particularly effective for cycloolefin polymers having a dicyclopentadiene ring structure. Moreover, you may introduce | transduce a polar group into a cycloolefin polymer.
市販のシクロオレフィンポリマーとしては、例えば、独Ticona社製の「Topas」、ジェイエスアール社製の「アートン」、日本ゼオン社製の「ゼオノア(ZEONOR)」や「ゼオネックス(ZEONEX)」、三井化学社製の「アペル」等が挙げられる。 Examples of commercially available cycloolefin polymers include “Topas” manufactured by Ticona, Germany, “Arton” manufactured by JSR, “ZEONOR” and “ZEONEX” manufactured by Nippon Zeon, Mitsui Chemicals, Inc. “Appel” made by the manufacturer can be mentioned.
本発明の接着剤の接着方法は、例えば、以下の通りである。被着体2枚のうち少なくとも1枚の被着体表面に接着剤を厚み0.0001〜5mm、典型的には0.01〜0.50mmになるように塗布し、その後、被着体同士を貼り合わせ、波長200〜500nm、典型的には350〜420nm、積算光量200〜6000mJ/cm2、典型的には300〜2000mJ/cm2、照射時間1〜60秒、典型的には2〜30秒の条件下で接着剤を硬化し、被着体を接着する方法が好ましい。The adhesive bonding method of the present invention is as follows, for example. An adhesive is applied to at least one adherend surface of two adherends to a thickness of 0.0001 to 5 mm, typically 0.01 to 0.50 mm. And a wavelength of 200 to 500 nm, typically 350 to 420 nm, an integrated light quantity of 200 to 6000 mJ / cm 2 , typically 300 to 2000 mJ / cm 2 , an irradiation time of 1 to 60 seconds, typically 2 A method in which the adhesive is cured under a condition of 30 seconds to adhere the adherend is preferable.
本発明は、その他の成分として酸化防止剤を使用してもよい。酸化防止剤としてはフェノール系、ハイドロキノン系を使用でき、好ましくはフェノール系が用いられる。酸化防止剤としては、β―ナフトキノン、2−メトキシー1,4−ノフトキノン、メチルハイドロキノン、ハイドロキノン、2,2−メチレン−ビス(4−メチル−6−ターシャリーブチルフェノール)、カテコール、ハイドロキノンモノメチルエーテル、モノターシャリーブチルハイドロキノン、2,5−ジターシャリーブチルハイドロキノン、p−ベンゾキノン、2,5−ジフェニル−p−ベンゾキノン、2,5−ジターシャリーブチル−p−ベンゾキノン、ピクリン酸、クエン酸、フェノチアジン、ターシャリーブチルカテコール、2−ブチル−4−ヒドロキシアニソール及び2,6−ジターシャリーブチル−p−クレゾール等が例示できる。これらの中では、2,2−メチレン−ビス(4−メチル−6−ターシャリーブチルフェノール)が好ましい。 In the present invention, an antioxidant may be used as the other component. As the antioxidant, a phenol type or a hydroquinone type can be used. Antioxidants include β-naphthoquinone, 2-methoxy-1,4-naphthoquinone, methylhydroquinone, hydroquinone, 2,2-methylene-bis (4-methyl-6-tertiarybutylphenol), catechol, hydroquinone monomethyl ether, mono Tertiary butyl hydroquinone, 2,5-ditertiary butyl hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-ditertiary butyl-p-benzoquinone, picric acid, citric acid, phenothiazine, tertiary Examples include butyl catechol, 2-butyl-4-hydroxyanisole, and 2,6-ditertiary butyl-p-cresol. Among these, 2,2-methylene-bis (4-methyl-6-tertiary butylphenol) is preferable.
酸化防止剤の使用量は、(A)成分、(B)成分、(C)成分及び(F)成分の合計量100質量部に対して、0.01〜10質量部が好ましく、0.1〜8質量部がより好ましく、2.0〜8.0質量部がより好ましい。 The amount of the antioxidant used is preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the total amount of component (A), component (B), component (C) and component (F). -8 mass parts is more preferable, and 2.0-8.0 mass parts is more preferable.
以下に、実験例をあげて、本発明を更に詳細に説明するが、本発明はこれらに限定されるものではない。尚、実験例に記載の接着剤中の各成分には以下の化合物を選択した。 Hereinafter, the present invention will be described in more detail with reference to experimental examples, but the present invention is not limited thereto. In addition, the following compounds were selected for each component in the adhesive described in the experimental examples.
(A)成分、ジシクロペンテニル基を含有する(メタ)アクリレートとして、ジシクロペンテニルアクリレート(日立化成社製「FA−511AS」)
(A)成分、ジシクロペンテニル基を含有する(メタ)アクリレートとして、ジシクロペンテニルオキシエチルメタクリレート(日立化成社製社製「FA−512MT」)
(B)成分、水酸基を含有する(メタ)アクリレートとして、2−ヒドロキシ−3−フェノキシプロピルアクリレート(東亞合成社製「M−5700」)
(B)成分、水酸基を含有する(メタ)アクリレートとして、2−ヒドロキシエチルメタクリレート(共栄社化学社製社製「ライトエステルHO」)
(C)成分、オリゴマー、イソプレンオリゴマー(クラレ社製「LIR−30」)(GPCによるポリスチレン換算の数平均分子量28000)
(C)成分、オリゴマー、ブタジエンオリゴマー(クラレ社製「LBR−307」)(GPCによるポリスチレン換算の数平均分子量8000)
(D)成分、シランカップリング剤、γ−グリシドキシプロピルトリメトキシシラン(信越化学社製「KBM−403」)
(D)成分、シランカップリング剤、ビニルプロピルトリメトキシシラン(信越化学社製「KBM−1003」)
(D)成分、シランカップリング剤、γ−メタクリロキシプロピルトリメトキシシラン(信越化学社製社製「KBM−503」)
(E)成分、光開始剤として、ベンジルジメチルケタール(チバ・スペシャルティー・ケミカルズ社製「IRGACURE651」)
(E)成分、光開始剤として、ビス(2,4,6−トリメチルベンゾイル)−フェニルホスフィンオキサイド(チバ・スペシャルティー・ケミカルズ社製「IRGACURE819」)
(F)成分、メタクリル酸(三菱レイヨン社製「AM」)
(F)成分、アクリル酸(日本触媒社製社製「アクリル酸メチルAM」)
(G)成分、ポリビニルアルコール(電気化学工業社製「デンカポバールH−17」)(平均重合度1200、平均けん化度97モル%)
(G)成分、ポリビニルアルコール(電気化学工業社製「デンカポバールF−12」)(平均重合度1200、平均けん化度99モル%)
酸化防止剤、(D−1)2,2−メチレン−ビス(4−メチル−6−ターシャリーブチルフェノール)(住友化学社製「スミライザーMDP−S」)As component (A), a (meth) acrylate containing a dicyclopentenyl group, dicyclopentenyl acrylate ("FA-511AS" manufactured by Hitachi Chemical Co., Ltd.)
As component (A), a (meth) acrylate containing a dicyclopentenyl group, dicyclopentenyloxyethyl methacrylate ("FA-512MT" manufactured by Hitachi Chemical Co., Ltd.)
(B) Component, 2-hydroxy-3-phenoxypropyl acrylate ("M-5700" manufactured by Toagosei Co., Ltd.) as a (meth) acrylate containing a hydroxyl group
(B) Component, 2-hydroxyethyl methacrylate (“light ester HO” manufactured by Kyoeisha Chemical Co., Ltd.) as a (meth) acrylate containing a hydroxyl group
(C) Component, oligomer, isoprene oligomer ("LIR-30" manufactured by Kuraray Co., Ltd.) (number average molecular weight 28000 in terms of polystyrene by GPC)
(C) Component, oligomer, butadiene oligomer (“LBR-307” manufactured by Kuraray Co., Ltd.) (number average molecular weight 8000 in terms of polystyrene by GPC)
Component (D), silane coupling agent, γ-glycidoxypropyltrimethoxysilane (“KBM-403” manufactured by Shin-Etsu Chemical Co., Ltd.)
(D) component, silane coupling agent, vinylpropyltrimethoxysilane (“KBM-1003” manufactured by Shin-Etsu Chemical Co., Ltd.)
Component (D), silane coupling agent, γ-methacryloxypropyltrimethoxysilane (“KBM-503” manufactured by Shin-Etsu Chemical Co., Ltd.)
As component (E) and photoinitiator, benzyldimethyl ketal (“IRGACURE651” manufactured by Ciba Specialty Chemicals)
As component (E) and photoinitiator, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (“IRGACURE819” manufactured by Ciba Specialty Chemicals)
Component (F), methacrylic acid (“AM” manufactured by Mitsubishi Rayon Co., Ltd.)
Component (F), acrylic acid (“Methyl acrylate AM” manufactured by Nippon Shokubai Co., Ltd.)
(G) component, polyvinyl alcohol ("DENKA POVAL H-17" manufactured by Denki Kagaku Kogyo Co., Ltd.) (average polymerization degree 1200, average saponification degree 97 mol%)
(G) component, polyvinyl alcohol ("DENKA POVAL F-12" manufactured by Denki Kagaku Kogyo Co., Ltd.) (average polymerization degree 1200, average saponification degree 99 mol%)
Antioxidant, (D-1) 2,2-methylene-bis (4-methyl-6-tertiary butylphenol) (“Sumilyzer MDP-S” manufactured by Sumitomo Chemical Co., Ltd.)
各種物性は、次のように測定した。 Various physical properties were measured as follows.
〔光硬化性〕
温度23℃で測定した。光硬化性に関しては、ZEONEX480R(日本ゼオン社製)試験片(幅25mm×長さ25mm×厚み2.0mm)表面に接着剤を厚み0.03mmになるように塗布した。厚みは0.03mmガラスビーズによって制御した。その後、無電極放電ランプを使用したフュージョン社製硬化装置を用い、波長365nm、積算光量2000mJ/cm2の条件にて15秒間照射し、硬化させた。光硬化性として、硬化率を記載した。硬化率は、FT−IRを使用し、以下の式により算出した。
(硬化率)=[100−((硬化後の、炭素と炭素の二重結合の吸収スペクトルの強度)/(硬化前の、炭素と炭素の二重結合の吸収スペクトルの強度))]×100(%)[Photocurability]
Measurement was performed at a temperature of 23 ° C. Regarding photocuring property, an adhesive was applied to the surface of a ZEONEX 480R (manufactured by Zeon Corporation) test piece (width 25 mm × length 25 mm × thickness 2.0 mm) to a thickness of 0.03 mm. The thickness was controlled by 0.03 mm glass beads. Thereafter, using a curing device manufactured by Fusion Corporation using an electrodeless discharge lamp, irradiation was carried out for 15 seconds under conditions of a wavelength of 365 nm and an integrated light amount of 2000 mJ / cm 2 , and cured. Curing rate was described as photocurability. The curing rate was calculated by the following formula using FT-IR.
(Curing rate) = [100-((Intensity of absorption spectrum of carbon-carbon double bond after curing) / (Intensity of absorption spectrum of carbon-carbon double bond before curing))] × 100 (%)
〔シクロオレフィンポリマー接着性評価(シクロオレフィンポリマー(ZEONEX)試験片間の引張接着強さ)〕
ZEONEX480R(日本ゼオン社製)試験片12a(幅25mm×長さ100mm×厚み2.0mm)の長さ方向の先端部分に、中央に0.5cm2の大きさの穴11が空いたテフロン(登録商標)テープ10(厚み80μm×幅25mm×長さ25mm)を接着剤厚さ制御のために貼った。当該穴11に接着剤13を厚み80μmとなるように供給した後、当該穴11を覆うようにしてテフロン(登録商標)テープ10の上に、もう一方のZEONEX480R(日本ゼオン社製)試験片12b(幅25mm×長さ100mm×厚み2.0mm)の先端部分を貼り合わせた。このときの様子を図1に示す。硬化後、接着剤で接着した該試験片を用いて図1の矢印の左右に引っ張って引張接着強さを測定した。硬化条件は〔光硬化性〕に記載の方法に従った。[Evaluation of cycloolefin polymer adhesion (tensile bond strength between cycloolefin polymer (ZEONEX) specimens)]
ZEONEX 480R (manufactured by ZEON Corporation) Teflon with a
〔耐湿性〕
前記シクロオレフィンポリマー接着性評価用試験片を85℃×85%RHに24時間暴露し、該試験片を用いて引張接着強さを測定した。[Moisture resistance]
The test piece for evaluating the cycloolefin polymer adhesion was exposed to 85 ° C. × 85% RH for 24 hours, and the tensile bond strength was measured using the test piece.
〔汎用ポリマー接着性評価(ポリカーボネート(帝人社製)試験片間の引張接着強さ)〕
パンライト(帝人社製)試験片(幅25mm×長さ25mm×厚み2.0mm)同士を、厚み80μm×幅11.5mm×長さ25mmのテフロン(登録商標)テープをスペーサーとして用い、接着剤を接着させた(接着面積3.125cm2)。硬化後、接着剤で接着した該試験片を用いて引張接着強さを測定した。硬化条件は〔光硬化性〕に記載の方法に従った。[Evaluation of general-purpose polymer adhesion (Tensile bond strength between polycarbonate (made by Teijin Limited) specimens)]
Panlite (manufactured by Teijin Limited) specimens (width 25 mm x length 25 mm x thickness 2.0 mm), Teflon (registered trademark) tape 80 mm thick x 11.5 mm wide x 25 mm long used as a spacer Were bonded (bonding area 3.125 cm 2 ). After curing, the tensile bond strength was measured using the test piece bonded with an adhesive. Curing conditions followed the method described in [Photocurability].
〔汎用ポリマー接着性評価(ポリビニルアルコール(クラレ社製)試験片間の引張接着強さ)〕
試験片(幅25mm×長さ25mm×厚み0.03mm)同士を、厚み80μm×幅11.5mm×長さ25mmのテフロン(登録商標)テープをスペーサーとして用い、接着剤を接着させた(接着面積3.125cm2)。硬化後、接着剤で接着した該試験片を用いて引張接着強さを測定した。硬化条件は〔光硬化性〕に記載の方法に従った。[Evaluation of general-purpose polymer adhesion (tensile bond strength between test pieces of polyvinyl alcohol (Kuraray))]
The test pieces (width 25 mm × length 25 mm × thickness 0.03 mm) were bonded to each other using a Teflon (registered trademark) tape having a thickness of 80 μm × width 11.5 mm × length 25 mm as a spacer (adhesion area). 3.125 cm 2 ). After curing, the tensile bond strength was measured using the test piece bonded with an adhesive. Curing conditions followed the method described in [Photocurability].
〔汎用ポリマー接着性評価(トリアセチルセルロース(コニカミノルタ社製)試験片間の引張接着強さ)〕
試験片(幅25mm×長さ25mm×厚み0.03mm)同士を、厚み80μm×幅11.5mm×長さ25mmのテフロン(登録商標)テープをスペーサーとして用い、接着剤を接着させた(接着面積3.125cm2)。硬化後、接着剤で接着した該試験片を用いて引張接着強さを測定した。硬化条件は〔光硬化性〕に記載の方法に従った。[Evaluation of general-purpose polymer adhesion (tensile bond strength between test pieces of triacetylcellulose (Konica Minolta)]]
The test pieces (width 25 mm × length 25 mm × thickness 0.03 mm) were bonded to each other using a Teflon (registered trademark) tape having a thickness of 80 μm × width 11.5 mm × length 25 mm as a spacer (adhesion area). 3.125 cm 2 ). After curing, the tensile bond strength was measured using the test piece bonded with an adhesive. Curing conditions followed the method described in [Photocurability].
〔ガラス接着性評価(耐熱ガラス 試験片間の引張接着強さ)〕
耐熱ガラス試験片(25mm×25mm×2.0mm)同士を、厚み80μm×幅11.5mm×長さ25mmのテフロン(登録商標)テープをスペーサーとして用い、接着剤を接着させた(接着面積3.125cm2)。硬化条件は〔光硬化性〕に記載の方法に従った。上記条件にて接着剤を硬化させた後、更に、試験片の裏側に電気化学工業社製接着剤「G−55」を使用し、亜鉛メッキ鋼板(100mm×25mm×2.0mm、エンジニアリングテストサービス社製)を接着させた。23℃×50%RH×24時間養生により硬化後、接着剤で接着した該試験片を用いて引張接着強さを測定した。引っ張り剪断接着強さ(単位:MPa)は、温度23℃、湿度50%の環境下で引張速度10mm/分で測定した。[Evaluation of glass adhesion (Tensile bond strength between heat-resistant glass specimens)]
Heat resistant glass test pieces (25 mm × 25 mm × 2.0 mm) were bonded to each other using a Teflon (registered trademark) tape having a thickness of 80 μm, a width of 11.5 mm, and a length of 25 mm as a spacer (bonding area: 3. 125 cm 2 ). Curing conditions followed the method described in [Photocurability]. After the adhesive is cured under the above conditions, an adhesive “G-55” manufactured by Denki Kagaku Kogyo Co., Ltd. is used on the back side of the test piece, and a galvanized steel sheet (100 mm × 25 mm × 2.0 mm, engineering test service) Were attached. After curing by curing at 23 ° C. × 50% RH × 24 hours, the tensile bond strength was measured using the test piece adhered with an adhesive. The tensile shear bond strength (unit: MPa) was measured at a tensile rate of 10 mm / min in an environment of a temperature of 23 ° C. and a humidity of 50%.
〔貯蔵弾性率評価〕
接着剤を硬化させて、長さ20mm、幅5mm、×厚み1mmの硬化物試料を調製した。硬化条件は〔光硬化性〕に記載の方法に従った。この硬化物試料を評価した。セイコー電子工業(株)社製テンションモジュールDMS210を使用し、周波数1Hz、歪み0.05%の条件で温度を変更して、引っ張りモードで動的粘弾性スペクトルを測定し、23℃における貯蔵弾性率E’の値を求めた。[Evaluation of storage modulus]
The adhesive was cured to prepare a cured product sample having a length of 20 mm, a width of 5 mm, and a thickness of 1 mm. Curing conditions followed the method described in [Photocurability]. This cured product sample was evaluated. Using a tension module DMS210 manufactured by Seiko Denshi Kogyo Co., Ltd., changing the temperature under conditions of a frequency of 1 Hz and a strain of 0.05%, a dynamic viscoelastic spectrum was measured in a tensile mode, and a storage elastic modulus at 23 ° C. The value of E ′ was determined.
(実験例1〜14)
表1に示す種類の原材料を表1に示す組成で混合して接着剤を調製した。得られた接着剤について、各種物性の測定を実施した。それらの結果を表1に示す。(Experimental Examples 1-14)
Adhesives were prepared by mixing raw materials of the types shown in Table 1 with the compositions shown in Table 1. Various physical properties of the obtained adhesive were measured. The results are shown in Table 1.
本願発明は、シクロオレフィンポリマー、ポリカーボネート、ポリビニルアルコール、セルローストリアセテート、及びガラスに対して、十分な接着強度を発現できる。本願発明は、耐湿性を有する。 This invention can express sufficient adhesive strength with respect to a cycloolefin polymer, a polycarbonate, polyvinyl alcohol, a cellulose triacetate, and glass. The present invention has moisture resistance.
シクロオレフィンポリマーは、極性は小さく、表面に多くの官能基を持たないため、接着しにくいといった課題があった。シクロオレフィンポリマーを接着するためには、接着剤を使用した上で、更に、プライマー処理や表面コロナ処理を併用する必要があった。プライマー処理や表面コロナ処理を実施することは、工程増になるおそれがあった。
本願発明は、接着剤のみでシクロオレフィンポリマーに対して高い接着性を示す。本願発明は、プライマー処理や表面コロナ処理を併用しなくても、シクロオレフィンポリマーに対して高い接着性を示すため、省力化が可能である。本願発明は、有用な技術である。The cycloolefin polymer has a problem that it is difficult to adhere because the polarity is small and it does not have many functional groups on the surface. In order to adhere the cycloolefin polymer, it was necessary to use a primer treatment and a surface corona treatment together with an adhesive. Implementation of primer treatment or surface corona treatment may increase the number of processes.
This invention shows high adhesiveness with respect to a cycloolefin polymer only with an adhesive agent. Since the present invention shows high adhesiveness to the cycloolefin polymer without using primer treatment or surface corona treatment in combination, labor saving can be achieved. The present invention is a useful technique.
10 テープ
11 穴
12a、12b 試験片
13 接着剤10
Claims (13)
(A)成分は、ジシクロペンテニル基を有する(メタ)アクリレート
(B)成分は、水酸基を有する(メタ)アクリレート
(C)成分は、ジエン系の骨格又は水素添加されたジエン系の骨格を有し、かつ、(メタ)アクリロイル基を有しないオリゴマー
(D)成分は、シランカップリング剤
(E)成分は、光重合開始剤
(F)成分は、(メタ)アクリル酸
(G)成分は、ポリビニルアルコール A resin composition comprising the following components (A) to ( G ).
The component (A) is a (meth) acrylate (B) component having a dicyclopentenyl group, the (meth) acrylate (C) component having a hydroxyl group has a diene skeleton or a hydrogenated diene skeleton. In addition, the oligomer (D) component not having a (meth) acryloyl group is a silane coupling agent (E) component, a photopolymerization initiator (F) component is (meth) acrylic acid
(G) component is polyvinyl alcohol
(D)成分の使用量は、(A)成分、(B)成分、(C)成分、及び(F)成分の合計量100質量部に対して、0.01〜10質量部であり、
(E)成分の使用量は、(A)成分、(B)成分、(C)成分、及び(F)成分の合計量100質量部に対して、0.01〜30質量部である、
請求項1に記載の樹脂組成物。 Component (A), component (B) and component (C) are used in a total of 100 parts by weight of component (A), component (B) and component (C), component (A): component (B): (C) component = 40-90: 1-20: 5-45 (mass ratio),
(D) The usage-amount of a component is 0.01-10 mass parts with respect to 100 mass parts of total amounts of (A) component, (B) component, (C) component, and (F) component,
(E) The usage-amount of a component is 0.01-30 mass parts with respect to 100 mass parts of total amounts of (A) component, (B) component, (C) component, and (F) component,
The resin composition according to claim 1 .
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS528856B2 (en) * | 1972-05-11 | 1977-03-11 | ||
JPS5249033B1 (en) * | 1971-04-14 | 1977-12-14 | ||
JPS5918773A (en) * | 1982-07-22 | 1984-01-31 | Denki Kagaku Kogyo Kk | Adhesive composition |
JPS5925855A (en) * | 1982-08-03 | 1984-02-09 | Denki Kagaku Kogyo Kk | Adhesive composition |
JP2007077321A (en) * | 2005-09-15 | 2007-03-29 | Denki Kagaku Kogyo Kk | Energy ray curable resin composition and adhesive using the same |
WO2010126123A1 (en) * | 2009-04-30 | 2010-11-04 | 電気化学工業株式会社 | Curable resin composition, adhesive composition, and cured object or composite |
JP2010270316A (en) * | 2009-04-20 | 2010-12-02 | Denki Kagaku Kogyo Kk | Method for disassembling bonded member |
WO2011046120A1 (en) * | 2009-10-14 | 2011-04-21 | 電気化学工業株式会社 | Resin composition and adhesive agent |
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US7829605B2 (en) * | 2005-05-31 | 2010-11-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Energy ray-curable resin composition and adhesive using same |
JP2008101104A (en) * | 2006-10-19 | 2008-05-01 | Denki Kagaku Kogyo Kk | Curable composition |
JP5382989B2 (en) * | 2006-10-19 | 2014-01-08 | 電気化学工業株式会社 | adhesive |
TWI485214B (en) * | 2008-09-05 | 2015-05-21 | Kyoritsu Chemical Co Ltd | And a photohardenable resin composition for bonding an optical functional material |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5249033B1 (en) * | 1971-04-14 | 1977-12-14 | ||
JPS528856B2 (en) * | 1972-05-11 | 1977-03-11 | ||
JPS5918773A (en) * | 1982-07-22 | 1984-01-31 | Denki Kagaku Kogyo Kk | Adhesive composition |
JPS5925855A (en) * | 1982-08-03 | 1984-02-09 | Denki Kagaku Kogyo Kk | Adhesive composition |
JP2007077321A (en) * | 2005-09-15 | 2007-03-29 | Denki Kagaku Kogyo Kk | Energy ray curable resin composition and adhesive using the same |
JP2010270316A (en) * | 2009-04-20 | 2010-12-02 | Denki Kagaku Kogyo Kk | Method for disassembling bonded member |
WO2010126123A1 (en) * | 2009-04-30 | 2010-11-04 | 電気化学工業株式会社 | Curable resin composition, adhesive composition, and cured object or composite |
WO2011046120A1 (en) * | 2009-10-14 | 2011-04-21 | 電気化学工業株式会社 | Resin composition and adhesive agent |
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CN103476859B (en) | 2016-01-27 |
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KR20140021643A (en) | 2014-02-20 |
TW201245319A (en) | 2012-11-16 |
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