WO2011045863A1 - 電子装置及び電子装置の筐体 - Google Patents
電子装置及び電子装置の筐体Info
- Publication number
- WO2011045863A1 WO2011045863A1 PCT/JP2009/067930 JP2009067930W WO2011045863A1 WO 2011045863 A1 WO2011045863 A1 WO 2011045863A1 JP 2009067930 W JP2009067930 W JP 2009067930W WO 2011045863 A1 WO2011045863 A1 WO 2011045863A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- printed circuit
- circuit board
- electronic device
- plate
- housing
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the present invention relates to an electronic device and a casing of the electronic device.
- the printed circuit board 200 is arranged in the casing 100c of the electronic device so as to be parallel to the first side plate 103 of the casing 100c.
- the cooling air sucked from the suction surface 126 of the front plate 115 of the casing 100c of the electronic device first changes in the vertical direction with respect to the first side plate 103 of the casing 100c.
- the electronic component 201a disposed on the printed circuit board 200 is disposed perpendicular to the side plate 103 so as not to block the flow of the internal wind.
- the cooling air cools the electronic components on the printed circuit board 200, the flow path changes so as to be parallel to the first side plate 103.
- cooling air is discharged
- the cooling air cannot smoothly take a flow path through the printed circuit board, so that there is a problem that the cooling efficiency of the electronic components mounted on the printed circuit board is low. there were. Further, since a large intake / exhaust space is required in the housing, there is a problem that the housing itself becomes large.
- the disclosed technology has been made in view of the above-described problems, and in an electronic device in which a printed circuit board on which electronic components are mounted is disposed in a housing, a flow path through which cooling air smoothly circulates on the printed circuit board is formed. It is an object of the present invention to improve the cooling efficiency of electronic components.
- an electronic device of the disclosed technology includes a front plate having an intake hole, a back plate having an exhaust hole and facing the front plate, a first side plate, It has the housing
- the heat generating component is mounted, and the first side is the first side in the space defined by the first and second side, front plate, back plate, first and second side plate, and shelf.
- the printed circuit board is disposed so as to have a first angle ⁇ (0 ° ⁇ ⁇ 90 °) with respect to one side plate.
- the cooling efficiency of the electronic component is improved by forming a flow path through which cooling air flows smoothly on the printed circuit board.
- FIG. 1A is a cross-sectional view of a housing of an electronic device according to an example of the first embodiment.
- 1B is a diagram illustrating a position in a vertical direction in the housing of the electronic device in the cross-sectional view of FIG. 1A.
- FIG. 2A is a perspective view of the housing of the electronic device according to an example of the second embodiment as seen from the front.
- FIG. 2B is a perspective view of the housing of the electronic device according to the example of the second embodiment as seen from the back.
- FIG. 2C is a perspective view of a part of a housing in which a plurality of printed circuit board units are mounted on an electronic device according to an example of the second embodiment as viewed from the front.
- FIG. 1A is a cross-sectional view of a housing of an electronic device according to an example of the first embodiment.
- 1B is a diagram illustrating a position in a vertical direction in the housing of the electronic device in the cross-sectional view of FIG. 1A.
- FIG. 2D is a perspective view of a part of the inside of a housing in which a plurality of printed circuit board units are mounted on an electronic device according to an example of the second embodiment as viewed from the front.
- FIG. 3A is a perspective view of a printed circuit board unit according to an example of the second embodiment.
- FIG. 3B is a perspective view of a cooling device according to an example of the second embodiment.
- FIG. 3C is a perspective view of a connection board according to an example of the second embodiment.
- FIG. 4 is a horizontal cross-sectional view of the housing of the electronic device according to the example of the second embodiment.
- FIG. 5A is a diagram illustrating maintainability of an electronic device according to an example of the second embodiment.
- FIG. 5B is a diagram illustrating maintainability of the electronic device according to the example of the second embodiment.
- FIG. 5C is a diagram illustrating maintainability of an electronic device according to an example of the second embodiment.
- FIG. 5D is a diagram illustrating maintainability of the electronic device according to the example of the second embodiment.
- FIG. 6A is a diagram illustrating an arrangement example of printed circuit boards in a housing of the electronic device.
- FIG. 6B is a diagram illustrating an arrangement example of the printed circuit boards in the housing of the electronic device.
- FIG. 6C is a diagram illustrating an arrangement example of the printed circuit boards in the housing of the electronic device.
- FIG. 6D is a diagram illustrating an arrangement example of the printed circuit boards in the housing of the electronic device.
- FIG. 6A is a diagram illustrating an arrangement example of printed circuit boards in a housing of the electronic device.
- FIG. 6B is a diagram illustrating an arrangement example of the printed circuit boards in the housing of the electronic device.
- FIG. 6C is
- FIG. 7 is a diagram illustrating a change in the air volume ratio according to a change in the arrangement of the printed circuit boards in the housing of the electronic device according to the example of the second embodiment.
- FIG. 8 is a diagram illustrating the wind direction with respect to the printed circuit board of the electronic device according to the example of the second embodiment.
- FIG. 9 is a diagram illustrating the relationship between the temperature of the DIMM mounted on the printed circuit board of the electronic device according to the example of the second embodiment and the wind speed.
- FIG. 10A is a diagram illustrating a wind speed distribution on the printed circuit board of the electronic device according to the example of the second embodiment.
- FIG. 10B is a diagram illustrating a temperature distribution on the printed circuit board of the electronic device according to the example of the second embodiment.
- FIG. 11: A is a figure which shows the outline
- FIG. 11B is a diagram illustrating an outline (part 2) of intake and exhaust in the electronic apparatus according
- the electronic apparatus will be described by taking as an example a server apparatus in which a plurality of system boards on which at least a processing device and a storage device are mounted are arranged in a housing.
- the chassis is a server rack.
- the processing device is represented by, for example, a CPU (Central Processing Unit), an MPU (Micro Processing Unit), an MCU (Micro Control Unit), a DSP (Digital Signal Processor), or the like.
- the storage device is represented by a semiconductor storage device including, for example, a RAM (Random Access Memory), a ROM (Read Only Memory), and the like.
- an integrated circuit typified by a processing device or a storage device, which is an electronic component that generates heat, a power supply device, or a heat sink having a fin that radiates heat generated by the electronic component is mounted.
- the present invention is widely applicable to electronic devices in which at least one printed circuit board is disposed in a housing.
- the disclosed technology can be applied to communication devices such as exchanges, routers, and LAN switches.
- the disclosed technology may be applied to a personal computer or the like on which a motherboard is mounted. That is, the disclosed technology is not limited by the following exemplary embodiment.
- FIG. 1A is a cross-sectional view of a housing of an electronic device according to an example of the first embodiment.
- FIG. 1B is a diagram illustrating a position in a vertical direction in the housing of the electronic device in the cross-sectional view of FIG. 1A.
- FIG. 1B is a front view of the housing of the electronic device according to the example of the first embodiment.
- the housing 100 includes a top plate 101, a bottom plate 102, a first side plate 103, a second side plate 104, a shelf 108a, and a shelf 108b.
- FIG. 1B shows a state in which a front plate 115, which will be described later, which is an openable / closable door disposed on the front surface of the housing 100 is released, but the illustration of the front plate 115 is omitted.
- 1A is a cross-sectional view taken along the line AA of the casing 100 in FIG. 1B.
- the housing 100 may be formed of a sheet metal material. Alternatively, it may be formed of a resin material.
- the shelf 108a and the shelf 108b each include two guide panels 109a1 and 109a2 having the same number of guide rails arranged in parallel, as will be described later.
- the guide panels 109a1 and 109a2 are arranged perpendicular to the bottom plate 102 so that the horizontal positions of the bottom side, the top side, and the guide rails coincide, and the guide rails face each other.
- 1A is a cross-sectional view taken along the line AA of the casing 100 in which the uppermost printed circuit board 200 is exposed in the shelf 108a.
- the line segments that divide the shelf 108a so as to be parallel to AA and to expose the printed circuit board 200 can be used.
- the cross-sectional view in any line segment is the same as FIG. 1A.
- the housing 100 includes a front plate 115 including an intake surface 118 having an intake hole 118a, an exhaust surface 119 having an exhaust hole 119a, and a back plate 105 facing the front plate 115.
- the housing 100 includes a first side plate 103 disposed perpendicular to the bottom plate 102 and a second side plate 104 facing the first side plate 103.
- the front plate 115, the back plate 105, the first side plate 103, and the second side plate 104 are arranged perpendicular to the bottom plate 102 of the housing 100. That is, in the housing 100, the top plate 101, the bottom plate 102, the first side plate 103, the second side plate 104, the front plate 115, and the back plate 105 are arranged to form a rectangular parallelepiped.
- a printed circuit board 200 is disposed inside the housing 100 surrounded by the front plate 115, the back plate 105, the first side plate 103, and the second side plate 104.
- the printed circuit board 200 includes a heat generating component 201.
- the heat generating component 201 is, for example, a RAM or a power supply device. Alternatively, it may be a heat radiating component such as a heat sink provided with fins that radiate heat generated by the heat generating component 201.
- a guide panel 109a1 included in the shelf 108a and a guide panel 109a2 facing the guide panel 109a1 are disposed inside the housing 100.
- a connection substrate 114 that is disposed perpendicular to the bottom plate 102 of the housing 100 is disposed inside the housing 100.
- a cooling device 113 that is disposed perpendicular to the bottom plate 102 of the housing 100 is disposed inside the housing 100.
- the cooling device 113 generates cooling air that flows from the intake hole 118 a of the intake surface 118 to the exhaust hole 119 a of the exhaust surface 119 inside the housing 100.
- the cooling device 113 is, for example, an axial fan.
- the printed circuit board 200 is disposed on the guide rails facing the guide panel 109a1 and the guide panel 109a2, and is connected to the connection substrate 114.
- the shape of the printed circuit board 200 is a rectangle or a square having a first side 200-1 and a second side 200-2.
- the first side 200-1 is arranged on the guide rail of the guide panel 109a1, and the second side 200-2 is arranged on the guide rail of the guide panel 109a2.
- the printed circuit board 200 is arranged on the shelf 108a.
- the printed circuit board 200 is arranged on the shelf 108b.
- the printed circuit board 200 is arranged on the shelf 108 a so that the first side 200-1 has a first angle ⁇ ° (0 ° ⁇ ⁇ 90 °) with respect to the first side plate 103. Further, the cooling device 113 is arranged so as to have a second angle ⁇ (0 ° ⁇ ⁇ ⁇ 90 °) with respect to the first side plate 103.
- the cooling air sucked from the suction holes 118a is The flow path changes in a direction perpendicular to the side 200-1.
- the flow path change amount is 90 °.
- the change amount of the flow path is (90 ° ⁇ ⁇ °). Therefore, the amount of change in the flow path of the cooling air can be reduced, and the cooling air sucked from the intake holes 118a can be efficiently distributed on the printed circuit board 200.
- the cooling air circulated on the printed circuit board 200 is transmitted to the casing 100.
- the flow path changes in a direction perpendicular to the exhaust surface 119.
- the change amount of the flow path is 90 ° including the change amount of the flow path by the cooling device 113.
- the amount of change in the flow path by the cooling device 113 is reduced. Including the change amount of the flow path is less than (90 ° - ⁇ °). Therefore, the amount of change in the flow path of the cooling air can be reduced, and the cooling air from the printed circuit board 200 can be efficiently distributed to the exhaust hole 119a.
- the first side 200-1 is arranged in parallel.
- the horizontal length of the intake surface 118 and the exhaust surface 119 can be increased. That is, more intake holes 118a and exhaust holes 119a can be provided in the intake surface 118 and the exhaust surface 119, respectively. Therefore, it is possible to increase the amount of cooling air sucked and exhausted through the intake hole 118a and the exhaust hole 119a, thereby improving the cooling efficiency of the heat generating component 201 of the printed circuit board 200.
- the exhaust surface 119 is compared with the case where the printed board 200 is arranged in parallel.
- the surrounding space can be widened. Therefore, the cooling device 113 can be added as compared with the case where the first side 200-1 is arranged so as to be parallel to the first side plate 103.
- a large cooling device 113 or a plurality of cooling devices 113 having a larger air volume can be arranged. Therefore, the cooling efficiency of the heat generating component 201 of the printed circuit board 200 can be improved.
- the printed circuit board 200 is compared with the case where the cooling device 113 is disposed so as to be parallel to the first side plate 103.
- the air intake surface of the cooling device 113 facing the air can be widened. Therefore, since the efficiency of intake and exhaust of the cooling device 113 is improved, the cooling efficiency of the heat generating component 201 of the printed circuit board 200 can be improved.
- FIG. 2A is a perspective view of the housing of the electronic device according to an example of the second embodiment as seen from the front.
- FIG. 2B is a perspective view of the housing 100a of the electronic device according to the example of the second embodiment as viewed from the back. Note that, in the case 100a of the electronic device according to the example of the second embodiment, the same reference numerals are given to the same components as those of the case 100 of the electronic device according to the example of the first embodiment. .
- FIG. 2A shows a state in which the front plate 115 which is an openable / closable door disposed on the front surface of the housing 100a is released, but the front plate 115 is not shown.
- FIG. 2B the back plate 105 included in the housing 100a is not shown.
- an electronic device casing 100 a includes a top plate 101, a bottom plate 102, a first side plate 103, a second side plate 104, a shelf. 108a and a shelf 108b.
- the bottom plate 102 is disposed so as to be parallel to the installation surface of the housing 100a. Further, the first side plate 103 and the second side plate 104 are arranged perpendicular to the bottom plate 102. The top plate 101 is arranged so as to be perpendicular to the first side plate 103 and the second side plate 104.
- the casing 100a includes a front plate 115 (not shown) and a back plate 105 (not shown) arranged so as to face the front plate 115.
- the front plate 115 is openable and closable so as to close a rectangular opening formed on the front surface of the housing 100a by the top plate 101, the bottom plate 102, the first side plate 103, and the second side plate 104. Door.
- the back plate 105 is disposed so as to close a rectangular opening formed on the back surface of the housing 100 a by the top plate 101, the bottom plate 102, the first side plate 103, and the second side plate 104.
- a door body that can be opened and closed.
- the housing 100 a includes a shelf 108 a and a shelf 108 b in a space defined by the first side plate 103 and the second side plate 104.
- a printed circuit board unit 200a in which the printed circuit board 200 is disposed in a blade-shaped housing is disposed on the shelf 108a and the shelf 108b.
- the printed circuit board 200 or the printed circuit board unit 200a is called a system board.
- the shelf 108a includes a guide panel 109a1 having the same number of guide rails arranged in parallel and a guide panel 109a2 (not shown).
- the shelf 108b includes a guide panel 109b1 and a guide panel 109b2 having the same number of guide rails arranged in parallel.
- the guide panel 109a1 and the guide panel 109a2 are arranged perpendicular to the bottom plate 102 so that the bottom side of the guide panel and the horizontal position of each guide rail coincide and the guide rails face each other.
- the guide panel 109b1 and the guide panel 109b2 are arranged in the same manner as the guide panel 109a1 and the guide panel 109a2.
- the shelf 108a and the shelf 108b are configured such that the guide panel 109a1 and the guide panel 109b1 in the housing 100 have a first angle ⁇ ° (0 ° ⁇ ⁇ 90 °) in the horizontal direction with respect to the first side plate 103. Arranged to have. Then, by arranging printed circuit board units 200a, which will be described later, on a plurality of guide rails facing each other, it is possible to arrange a plurality of printed circuit board units 200a in layers on the shelves 108a and 108b. As a result, the plurality of printed circuit board units 200 a are arranged so as to have a first angle ⁇ ° (0 ° ⁇ ⁇ 90 °) in the horizontal direction with respect to the first side plate 103.
- an intake duct opening 106a is provided in a space defined by the shelf 108a and the first side plate 103 on the front surface of the housing 100a.
- an intake duct opening 106b is provided in a space defined by the shelf 108b and the first side plate 103 on the front surface of the housing 100a.
- the power supply device 110 and the shelf 111 are arranged side by side between the shelf 108a and the shelf 108b.
- the power supply device 110 is disposed on the first side plate 103 side
- the shelf 111 is disposed on the second side plate 104 side.
- the power supply device 110 controls power supply to an electronic device in which a plurality of printed circuit boards on which electronic components are mounted are arranged in the housing 100a.
- a plurality of interface units in which printed circuit boards, which are connection interfaces through which electronic devices transmit and receive data to and from external devices, are arranged in a blade-shaped housing are arranged.
- the connection interface or interface unit is called an IO (Input Output) system board.
- the shelf 111 includes a guide panel 112a having the same number of guide rails arranged in parallel and a guide panel 112b (not shown).
- the guide panel 112a and the guide panel 112b are arranged perpendicular to the bottom plate 102 so that the bottom sides of the guide panel and the horizontal positions of the guide rails coincide with each other and the guide rails face each other.
- the interface units are arranged on a plurality of guide rails facing the guide panel 112a and the guide panel 112b, it is possible to arrange the plurality of interface units on the shelf 111 in layers.
- connection board 114a called a backplane is disposed on the back surface of the shelf 108a.
- the connection board 114a is disposed so as to be perpendicular to the guide panel 109a1 and the guide panel 109a2.
- the connection substrate 114a is disposed on the back surface of the shelf 108a so as to close a rectangular opening formed including the guide panel 109a1 and the guide panel 109a2.
- connection board 114a electrically connects the printed circuit boards 200 included in each of the plurality of printed circuit board units 200a arranged on the shelf 108a.
- the connection terminals of the printed circuit board 200 provided on the back surface of the casing of the plurality of printed circuit board units 200a are connected to the connection circuit board 114a, whereby the plurality of printed circuit board units 200a are electrically connected.
- the connection substrate 114a is provided with the first side plate. It is arranged so as to have an angle of 90 ° + ⁇ ° in the horizontal direction with respect to 103.
- An exhaust duct opening 107a is provided in a space defined by the second side plate 104 and the guide panel 109a2 on the rear surface of the housing 100a.
- a cooling device 113a is disposed in a space formed between the second side plate 104 and the guide panel 109a2.
- the cooling device 113a is formed by arranging a plurality of fans having the same configuration vertically and horizontally.
- the fan is an axial fan.
- the cooling device 113 a is arranged so as to have a second angle ⁇ ° (0 ° ⁇ ⁇ ⁇ 90 °) with respect to the first side plate 103.
- connection board 114b called a backplane is disposed on the back surface of the shelf 108b.
- the connection substrate 114b is arranged to be perpendicular to the guide panel 109b1 and the guide panel 109b2. Further, the connection substrate 114b is disposed on the back surface of the shelf 108a so as to close a rectangular opening formed including the guide panel 109b1 and the guide panel 109b2.
- connection board 114b electrically connects the printed boards 200 respectively included in the plurality of printed board units 200a arranged on the shelf 108b. Similar to the connection substrate 114 a, the connection substrate 114 b is disposed so as to have an angle of 90 ° + ⁇ ° in the horizontal direction with respect to the first side plate 103.
- An exhaust duct opening 107b is provided in a space defined by the second side plate 104 and the guide panel 109b2 on the rear surface of the housing 100a.
- the cooling device 113b is disposed in a space generated between the second side plate 104 and the guide panel 109b2. Similar to the cooling device 113a, the cooling device 113b is formed by arranging a plurality of fans having the same configuration vertically and horizontally. The cooling device 113 b is arranged so as to have a second angle ⁇ ° (0 ° ⁇ ⁇ ⁇ 90 °) with respect to the first side plate 103.
- the cooling device 116 and the connection board 117 are arranged side by side on the back surface of the shelf 111.
- the cooling device 116 cools electronic components mounted on a printed circuit board disposed in a housing of a plurality of interface units disposed on the shelf 111.
- the connection board 117 is a backplane that electrically connects the printed boards arranged in the housings of the plurality of interface units arranged on the shelf 111.
- the power supply device 110 is disposed between the connection substrate 117 and the first side plate 103.
- FIG. 2C is a perspective view of a part of a housing in which a plurality of printed circuit board units are mounted on an electronic device according to an example of the second embodiment as viewed from the front.
- a plurality of printed circuit board units 200a are arranged on a shelf 108a arranged in a space formed by the top plate 101, the first side plate 103, and the second side plate 104.
- the plurality of printed circuit board units 200a are arranged such that the front surfaces of the printed circuit board units 200a are aligned on the same surface.
- the shelf 108b is similar to the shelf 108a.
- FIG. 2D is a perspective view of a part of a housing in which a plurality of printed circuit board units are mounted on an electronic device according to an example of the second embodiment as viewed from the front.
- FIG. 2D shows a state in which the top plate of the casing of the printed board unit 200a arranged on the top layer of the top plate 101 and the shelf 108a is removed from FIG. 2C.
- the plurality of printed circuit board units 200a arranged on the shelf 108a are arranged so that the first side 200-1 has an angle in the horizontal direction with respect to the first side plate 103, It is connected to the connection board 114a.
- a space defined by the first side plate 103 and the guide panel 109a1 of the shelf 108a is an intake duct area DA1.
- An intake duct opening 106a is provided in the front portion of the casing 100a in the intake duct area DA1.
- 2D is disposed in a space defined by the shelf 108a and the second side plate 104 so as to have an angle of ⁇ ° in the horizontal direction with respect to the first side plate 103. .
- a space defined by the shelf 108a, the guide panel 109a2 of the shelf 108a, and the cooling device 113a is an intermediate duct area DA2.
- a space defined by the cooling device 113a and the second side plate 104 shown in FIG. 2D is an exhaust duct area DA3.
- An exhaust duct opening 107a is provided in the back surface portion of the casing 100a in the exhaust duct area DA3.
- the intake duct area DA1, the intermediate duct area DA2, and the exhaust duct area DA3 are collectively referred to as a cooling duct.
- the printed circuit board 200 is mounted with a DIMM (Dual Inline Memory Module) 201a as an electronic component that generates heat.
- the DIMM is a kind of RAM module, in which a highly integrated semiconductor memory element is mounted on both sides of a rectangular plate-like substrate.
- the DIMM 201a is arranged on the printed circuit board 200 so that the board of the DIMM 201a is perpendicular to the first side 200-1 of the printed circuit board 200.
- the cooling air that has passed over the printed circuit board 200 changes the direction of circulation toward the cooling device 113a in the intermediate duct area DA2. Then, the cooling air whose direction of distribution has changed to the cooling device 113a passes through the cooling device 113a and is then discharged from the exhaust duct opening 107a to the outside of the housing 100a via the exhaust duct area DA3.
- FIG. 3A is a perspective view of a printed circuit board unit according to an example of the second embodiment.
- a printed circuit board unit 200a according to an example of the second embodiment is a blade in which the printed circuit board 200 is arranged in a rectangular parallelepiped housing.
- the printed circuit board unit 200a is accommodated in the shelf 108a and the shelf 108b according to the direction of the arrow shown in FIG. 3A, and is connected to the connection boards 114a and 114b.
- FIG. 3B is a perspective view of a cooling device according to an example of the second embodiment.
- the cooling devices 113a and 113b according to the example of the second embodiment at least one fan 113-2 is arranged in a rectangular or square frame 113-1.
- the fan 113-2 has a rotating shaft 113-3 that is rotated by the power of a built-in motor, and a blade portion 113-4 that is rotatably attached to the rotating shaft 113-3.
- the cooling devices 113a and 113b suck and discharge the cooling air as the blade portion 113-4 rotates.
- FIG. 3C is a perspective view of a connection board according to an example of the second embodiment.
- connection boards 114a and 114b according to the example of the second embodiment a plurality of connection parts 114-2 are arranged on the surface of the rectangular or square frame 114-1 to which the printed circuit board 200 is connected. Is done.
- the connection terminal of one printed circuit board 200 is connected to one connection portion 114-2. Therefore, a plurality of printed circuit boards 200 are connected to the connection boards 114a and 114b.
- FIG. 4 is a horizontal sectional view of the casing of the electronic device according to the example of the second embodiment.
- FIG. 4 is a cross-sectional view of the casing 100a taken along a line segment that divides the shelf 108a so that the printed circuit board 200 can be exposed in parallel with AA or AA in FIG. 1B.
- the housing 100 a includes a front plate 115 including an intake surface 118 having an intake hole 118 a, an exhaust surface 119 having an exhaust hole 119 a, and a back plate 105 facing the front plate 115.
- the housing 100 a includes a first side plate 103 that is disposed perpendicular to the bottom plate 102 and a second side plate 104 that faces the first side plate 103.
- a printed circuit board unit 200a that houses the printed circuit board 200 on which the DIMM 201a is arranged is arranged. Is done.
- the DIMM 201a is disposed so that the substrate of the DIMM 201a is perpendicular to the first side 200-1 and the second side 200-2.
- a guide panel 109a1 included in the shelf 108a and a guide panel 109a2 facing the guide panel 109a1 are arranged.
- a connection substrate 114a that is disposed perpendicular to the bottom plate 102 of the housing 100a is disposed inside the housing 100a.
- a cooling device 113a that is disposed perpendicular to the bottom plate 102 of the housing 100 is disposed inside the housing 100a. The cooling device 113a generates cooling air flowing from the intake hole 118a of the intake surface 118 to the exhaust hole 119a of the exhaust surface 119 inside the housing 100a.
- the DIMM 201a is arranged so that the board of the DIMM 201a is perpendicular to the first side 200-1 and the second side 200-2, so that the intake air sucked by the cooling device 113a is printed.
- the substrate 200 circulates between the front side 200-3 and the rear side 200-4.
- the printed circuit board unit 200a is disposed on the guide rails facing the guide panel 109a1 and the guide panel 109a2, and is connected to the connection substrate 114a.
- the printed circuit board unit 200a is arranged so that the first side 200-1 of the printed circuit board 200 has a first angle ⁇ ° (0 ° ⁇ ⁇ 90 °) with respect to the first side plate 103. Is done.
- the cooling device 113 a is arranged so as to have a second angle ⁇ (0 ° ⁇ ⁇ ⁇ 90 °) with respect to the first side plate 103.
- the horizontal lengths of the intake surface 118 and the exhaust surface 119 are respectively set. “L1-1” and “L1-2”.
- a larger or more multiplexed cooling device can be employed. This is because when the thickness of the cooling device 113a is ignored and the simple calculation is performed, the maximum width of the cooling device that can be arranged becomes “(L1-2) / sin ⁇ ” as compared with “L1-2”. Because.
- the cooling air sucked through the suction holes 118a passes through the suction duct area DA1 defined by the first side plate 103 and the duct walls 120 and 121 to the printed circuit board 200 side.
- the flow path changes.
- the cooling air whose flow path has changed to the printed circuit board 200 side is urged by the cooling device 113a while passing through the printed circuit board 200, and is cooled via the intermediate duct area DA2 defined by the duct wall 122.
- the flow path changes to the device 113a side.
- the cooling air whose flow path has changed to the cooling device 113a side passes through the exhaust duct 119a through the exhaust duct area DA3 defined by the cooling device 113a, the second side plate 104, and the duct wall 122. Is exhausted.
- FIGS. 5A to 5D are diagrams illustrating maintainability of an electronic device according to an example of the second embodiment.
- the printed circuit board unit 200a, the cooling device 113a, and the connection substrate 114a arranged in the casing 100a of the electronic device according to the example of the second embodiment are in a state in which the front plate 115 or the back plate 105 is released and the maintenance is performed. Can be taken out for.
- the printed circuit board unit 200a releases the connection with the connection board 114a by moving it in the direction of arrow A1 with the front plate 115 released, and the shelf 108a and the casing 100a. It is possible to take it out from.
- the cooling device 113a can be taken out from the housing 100a by moving the cooling device 113a in the direction of arrow A2 in a state where the back plate 105 is released.
- the connection board 114a releases the back plate 105 and moves the printed board unit 200a in the direction along the arrow A3 while moving the printed board unit 200a in the direction of the arrow A1. It can be taken out from the housing 100a.
- connection board 114a has a fitting hole 129 into which the pin 128 that the first side plate 103 has on the inner surface side of the housing 100a is fitted.
- the connection board 114 a has a fitting hole 129 in the portion of the frame body 114-1 adjacent to the first side plate 103.
- the connection substrate 114 a is fixed to the first side plate 103 by fitting the pins 128 and the fitting holes 129.
- connection board 114a When removing the connection board 114a from the housing 100a, first, the connection of the pin 128 and the fitting hole 129 is released, and then the connection board 114a is moved. Therefore, as shown by the arrow A3, the direction in which the connection substrate 114a is moved changes during the movement.
- the printed circuit board unit 200a, the cooling device 113a, and the connection substrate 114a arranged in the housing 100a of the electronic device according to the example of the second embodiment include the housing.
- the body 100a can be easily taken out and maintained.
- Air volume according to the PCB layout angle 6A to 6D are diagrams showing examples of arrangement of printed circuit boards in the housing of the electronic device. That is, the example of arrangement
- the intake surface of the intake duct is 800 mm in width as an example.
- the length of the first side is 500 mm as an example.
- the printed circuit board is arranged such that the first side has an angle of 90 ° with respect to the first side plate.
- the cooling air sucked from the suction surface is not blocked by the shielding object, for example, the connection substrate.
- the intake surface can be secured up to the maximum lateral width of the housing. Therefore, a large amount of cooling air can be sucked and the printed circuit board can be efficiently distributed without changing the flow path of the sucked cooling air. That is, the arrangement in which the printed circuit board has an angle of 90 ° with respect to the first side plate is an arrangement that can efficiently cool the electronic component.
- connection direction of the printed circuit board and the connection circuit board has an angle of 90 ° with respect to the front plate. For this reason, even if the front plate of the casing that forms the same plane as the air intake surface is released, it is not easy to release the connection between the printed board and the connection board and take the printed board out of the casing.
- the printed circuit board is arranged such that the first side has an angle of 45 ° with respect to the first side plate.
- connection direction of the printed circuit board and the connection circuit board has an angle of 45 ° with respect to the front plate.
- the front plate of the housing that forms the same surface as the air intake surface is released, the connection between the printed circuit board and the connection substrate is released, and the printed circuit board is disposed in the housing. It becomes easy to take out the outside.
- the printed circuit board is arranged such that the first side has an angle of 15 ° with respect to the first side plate.
- connection direction of the printed circuit board and the connection board has an angle of 15 ° with respect to the front plate.
- front plate of the housing that forms the same surface as the air intake surface is released, the connection between the printed circuit board and the connection substrate is released, and the printed circuit board is disposed in the housing. It is even easier to take it out of the room.
- the printed circuit board is arranged such that the first side has an angle of 90 ° with respect to the first side plate.
- connection direction of the printed circuit board and the connection board has an angle of 0 ° with respect to the front plate.
- the front plate of the housing that forms the same surface as the air intake surface is released, the connection between the printed circuit board and the connection substrate is released, and the printed circuit board is disposed in the housing. It is even easier to take it out of the room.
- FIG. 7 is a diagram illustrating a change in the air volume ratio according to a change in the arrangement of the printed circuit boards in the housing of the electronic device according to the example of the second embodiment.
- FIG. 7 shows graphs g1 and g2 in which (90 ° - ⁇ °) is taken on the horizontal axis and the airflow ratio is taken on the vertical axis.
- the ratio of the air volume that takes into account the air volume according to the change in the width is shown.
- the graph g1 takes values of 0.75, 0.5, and 0.25, respectively. That is, the air volume ratio decreases monotonously with respect to (90 ° ⁇ °).
- the graph g2 takes a predetermined value of 3.25 or more and less than 3.5, and a predetermined value of 2, 0.75 or more and less than 1, respectively. That is, the air volume decreases monotonously with respect to (90 ° ⁇ °). That is, the air volume ratio monotonously decreases with respect to the width of the intake surface and (90 ° ⁇ °).
- the maintainability of the printed circuit board in which the connection between the printed circuit board and the connection circuit board is released and the printed circuit board is taken out of the casing is improved in accordance with an increase in (90 ° ⁇ °). Therefore, the air volume and the maintainability of the printed circuit board are in a trade-off relationship. Therefore, (90 ° ⁇ °), that is, ⁇ can be set to a value greater than 0 ° and less than 90 ° in accordance with a request for a balance between the air volume and the maintainability of the printed circuit board.
- FIG. 8 is a diagram illustrating the wind direction with respect to the printed circuit board of the electronic device according to the example of the second embodiment. As shown in FIG. 8, the cooling air is circulated on the printed circuit board 200 so as to be perpendicular or substantially perpendicular to the arrangement direction of the DIMMs 201a-1 and 201a-2 mounted on the printed circuit board 200.
- the resistance of the DIMMs 201a-1 and 201a-2 with respect to the cooling air according to the increase in the amount of cooling air
- the static pressure of the cooling device 113a decreases as the air volume of the cooling air increases.
- the static pressure is a pressure acting on a vertical surface with respect to the cooling air of the cooling device 113a arranged perpendicular to the flow path of the cooling air. Therefore, it is required to set the air volume of the cooling air so that the static pressure of the cooling device 113a exceeds the pressure loss of the cooling air by the DIMMs 201a-1 and 201a-2 with respect to the cooling air.
- FIG. 9 is a diagram illustrating the relationship between the temperature of the DIMM mounted on the printed circuit board of the electronic device according to an example of the second embodiment and the wind speed. That is, FIG. 9 is a graph g3 and a graph respectively showing changes in the temperatures of the DIMMs arranged in the front row and the rear row according to the wind speed of the cooling air when the cooling air is circulated on the printed circuit board 200 as shown in FIG. Indicated by g4.
- FIG. 9 is a graph g5 showing a change in the temperature difference ⁇ T between the DIMM 201a-1 and the DIMM 201a-2 according to the wind speed of the cooling air.
- “winding speed of cooling air” is the air speed when the cooling air flowing on the printed circuit board 200 passes through the first side 200-1 of the printed circuit board 200 in FIG. This wind speed is called “front wind speed”.
- DIMMs 201a-1 and 201a-1 are DIMMs with power consumption of 10.22W as an example.
- the threshold “Tcase” indicating the upper limit of the temperature of the 10.22 W DIMM is “85 [° C.]” as an example.
- the temperature of the DIMM 201a-1 decreases monotonously with respect to the wind speed. That is, the higher the wind speed, the lower the temperature of the DIMM 201a-1. This means that the DIMM 20a-1 is cooled more efficiently by the cooling air flowing faster on the printed circuit board 200.
- the temperature of the DIMM 201a-2 also decreases monotonously with respect to the wind speed, similarly to the temperature of the DIMM 201a-1. That is, the higher the wind speed, the lower the temperature of the DIMM 201a-2.
- ⁇ T obtained by subtracting the temperature of the DIMM 201a-1 from the temperature of the DIMM 201a-2 also decreases monotonously with respect to the wind speed. That is, the higher the wind speed, the smaller the temperature difference between DIMMs 201a-1 and 201a-2.
- the temperature of the DIMM 201a-2 is generally higher than the temperature of the DIMM 201a-1.
- the cooling wind that cools the DIMM 201a-2 has a lower wind speed than the front wind speed (see FIG. 10A), and the temperature has already increased due to the cooling of the DIMM 201a-1. (See FIG. 10B).
- FIG. 10A is a diagram illustrating a wind speed distribution on the printed circuit board of the electronic device according to the example of the second embodiment.
- FIG. 10A shows a case where the front wind speed is “3 [m / s]”. As shown in FIG. 10A, the wind speed of the cooling air that cools the DIMM 201a-2 is lower than the front wind speed and the wind speed of the cooling air that cools the DIMM 201a-1.
- FIG. 10B is a diagram illustrating a temperature distribution on the printed circuit board of the electronic device according to the example of the second embodiment.
- FIG. 10B shows a case where the front wind speed is “3 [m / s]”.
- the temperature of the cooling air that cools the DIMM 201a-2 is higher than the front wind speed and the temperature of the cooling air that cools the DIMM 201a-1.
- FIG. 11 A is a figure which shows the outline
- the printed circuit board 200 is disposed at an angle of 0 ° in the horizontal direction with respect to the first side 200-1.
- the DIMM 201a in which the semiconductor memory elements are mounted on both sides of a rectangular plate-like substrate is arranged on the printed circuit board 200 so that the substrate of the DIMM 201a is parallel to the first side 200-1 of the printed circuit board 200. .
- the cooling device 113c is disposed between the front plate 115 and the printed circuit board 200 in the housing 100b.
- the cooling air sucked from the suction holes provided in the front plate 115 of the housing 100a by the cooling device 113c cools the DIMM 201a and passes over the printed circuit board 200. Then, the cooling air that has passed over the printed circuit board 200 is exhausted to the outside through the duct having the minimum width “L2” and the holes of the connection board 114 and provided in the back plate 105.
- the circulation amount of the cooling air is limited. That is, the duct and the connection board 114 become a bottleneck with respect to the flow of the cooling air on the printed board 200.
- the intake / exhaust in the electronic device according to the prior art shown in FIG. 11A has low efficiency in discharging the cooling air sucked from the intake holes to the outside through the exhaust holes provided in the back plate 105. And the cooling efficiency of DIMM201a mounted in the printed circuit board 200 was low.
- FIG. 11B is a diagram showing an outline (part 2) of the intake and exhaust in the electronic device according to the related art. As shown in FIG. 11B, the printed circuit board 200 and the DIMM 201a are arranged in order to avoid the duct and the connection circuit board 114 becoming a bottleneck with respect to the flow of the cooling air on the printed circuit board 200 described above with reference to FIG. 11A. To do.
- the printed circuit board 200 is disposed at an angle of 0 ° in the horizontal direction with respect to the first side 200-1. Further, the DIMM 201a in which the semiconductor memory elements are mounted on both sides of a rectangular plate-like substrate is arranged on the printed circuit board 200 so that the substrate of the DIMM 201a is perpendicular to the first side 200-1 of the printed circuit board 200. .
- an intake duct area is provided by a partition formed by the duct walls 123 and 124 and the first side plate 103 in the housing 100c.
- an exhaust duct area is provided in the casing 100c by a partition formed by the duct wall 125, the second side plate 104, and the cooling device 113d.
- the cooling device 113d is disposed in parallel to the back plate 105.
- the front plate 115 is provided with an intake surface 126 having a width corresponding to “L3-1” which is the shortest distance between the first side plate 103 and the duct wall 124.
- the back plate 105 is provided with an exhaust surface 127 having a width corresponding to “L3-2” which is the maximum width of the cooling device 113d arranged perpendicularly or substantially perpendicular to the cooling air flow path.
- the width “L3-1” of the intake surface 126 is narrower than the width “L1-1” of the intake surface 118 shown in FIG.
- the width “L3-2” of the exhaust surface 127 is narrower than the width “L1-2” of the exhaust surface 119 shown in FIG. That is, the amount of cooling air sucked from the suction surface and the efficiency when the sucked cooling air circulates on the printed circuit board are low.
- An electronic apparatus solves the problems of the conventional technology as described above, and expands the intake surface, the intake duct area, the exhaust surface, and the exhaust duct area without increasing the housing size.
- a cooling device can be added to improve the cooling performance.
- high-density mounting of the electronic device and downsizing of the housing can be achieved.
- the electronic device according to the example of the second embodiment can mount the printed circuit board 200 on the electronic device with high density by improving the cooling performance.
- the individual processing performance of the electronic device on which the printed circuit board 200 and the printed circuit board 200 are mounted with high density is improved.
- the housing of the electronic device can be miniaturized, the cable length when connecting a plurality of electronic devices with a cable is shortened, and the construction of a high-performance large-scale server system is facilitated.
- the printed circuit board 200 is vertically arranged with the first side plate 103 of the casings 100 and 100a in the example of the first and second embodiments as a bottom plate and the second side plate 104 as a top plate. May be.
- the cooling air sucked into the housing 100 or 100a circulates in the direction from the bottom plate to the top plate inside the housing 100 or 100a.
- the cooling devices 113, 113a, and 113b are axial fans.
- the cooling devices 113, 113a, and 113b are not limited to axial fans, and may be mixed flow fans or blowers. . That is, the cooling devices 113, 113a, and 113b may be any blower that urges air in an appropriate direction and sucks and exhausts air in the housing of the electronic device.
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Abstract
Description
図1Aは、第1の実施の形態の一例にかかる電子装置の筐体の断面図である。また、図1Bは、図1Aの断面図の電子装置の筐体における垂直方向の位置を示す図である。なお、図1Bは、第1の実施の形態の一例にかかる電子装置の筐体の前面図である。
図1Bにおいて、筐体100は、天板101、底板102、第1の側面板103、第2の側面板104、棚108a、棚108bを有する。図1Bは、筐体100の前面に配置される開閉可能な扉体である後述する前面板115を解放した状態を示すが、前面板115の図示を省略している。図1Aは、図1Bにおける筐体100のA-Aの断面図である。筐体100は、板金素材で形成されてもよい。または、樹脂素材で形成されてもよい。
前面板115、背面板105、第1の側面板103および第2の側面板104で囲まれた筐体100の内部には、プリント基板200が配置される。
第1の側辺200-1が、第1の側面板103に対して、第1の角度α°を有するようにプリント基板200が配置されると、平行になるように配置した場合に比べ、吸気孔118aから排気孔119aへと流通する冷却風の流路の変化量が少ない。
図2Aは、第2の実施の形態の一例にかかる電子装置の筐体を前面からみた斜視図である。また、図2Bは、第2の実施の形態の一例にかかる電子装置の筐体100aを背面からみた斜視図である。なお、第2の実施の形態の一例にかかる電子装置の筐体100aにおいて、第1の実施の形態の一例にかかる電子装置の筐体100と同一の構成には同一の符号を付与している。
図2Aおよび図2Bに示すように、第2の実施の形態の一例にかかる電子装置の筐体100aは、天板101、底板102、第1の側面板103、第2の側面板104、棚108a、棚108bを有する。
先ず、図2Aを参照する。筐体100aは、第1の側面板103および第2の側面板104によって区画された空間内に棚108aおよび棚108bを有する。棚108aおよび棚108bには、プリント基板200がブレード状の筐体内に配置されたプリント基板ユニット200aが配置される。プリント基板200またはプリント基板ユニット200aは、システムボードと呼ばれる。
次に、図2Bを参照する。筐体100aにおいて、棚108aの背面には、バックプレーンと呼ばれる接続基板114aが配置される。接続基板114aは、ガイドパネル109a1およびガイドパネル109a2に対して垂直になるように配置される。また、接続基板114aは、棚108aの背面において、ガイドパネル109a1およびガイドパネル109a2を含んで形成される矩形の開口部を塞ぐように配置される。
図3Aは、第2の実施の形態の一例にかかるプリント基板ユニットの斜視図である。第2の実施の形態の一例にかかるプリント基板ユニット200aは、直方体の筐体内にプリント基板200が配置されたブレードである。プリント基板ユニット200aは、図3Aに示す矢印の方向にしたがって棚108aおよび棚108bに収納され、接続基板114aおよび114bに接続される。
図3Bは、第2の実施の形態の一例にかかる冷却装置の斜視図である。2の実施の形態の一例にかかる冷却装置113aおよび113bは、矩形または正方形の枠体113-1内に少なくとも1つのファン113-2が配置される。ファン113-2は、内蔵されるモータの動力によって回転する回転軸113-3、および、回転軸113-3に回転自在に取り付けられた羽根部113-4を有する。冷却装置113aおよび113bは、羽根部113-4が回転することによって、冷却風を吸入して排出する。
図3Cは、第2の実施の形態の一例にかかる接続基板の斜視図である。第2の実施の形態の一例にかかる接続基板114aおよび114bは、矩形または正方形の枠体114-1の面のうちのプリント基板200が接続される面に、複数の接続部114-2が配置される。図3Cに図示する矢印の方向にしたがって、一のプリント基板200の接続端子が一の接続部114-2に接続される。したがって、接続基板114aおよび114bは、複数のプリント基板200が接続される。
図4に示すように、筐体100aは、吸気孔118aを有する吸気面118を含む前面板115、排気孔119aを有する排気面119を含むとともに前面板115に対向する背面板105を有する。また、筐体100aは、底板102に対して垂直に配置される第1の側面板103、第1の側面板103に対向する第2の側面板104を有する。
図5A~図5Dは、第2の実施の形態の一例にかかる電子装置の保守性を示す図である。第2の実施の形態の一例にかかる電子装置の筐体100a内に配置されるプリント基板ユニット200a、冷却装置113aおよび接続基板114aは、前面板115または背面板105を解放した状態で、メンテナンスのために取り出すことができる。
図6A~図6Dは、電子装置の筐体内におけるプリント基板の配置例を示す図である。すなわち、電子装置の第1の側面板に対してプリント基板がα°の角度を有するように配置する配置例を示す。なお、吸気ダクトの吸気面は、幅が800mmを例とする。また、第1の側辺の長さは、500mmを例とする。
図8は、第2の実施の形態の一例にかかる電子装置のプリント基板に対する風向を示す図である。図8に示すように、プリント基板200に実装されるDIMM201a-1および201a-2の基板の配置方向に対して垂直または略垂直になるようにプリント基板200上で冷却風を流通させる。
図11Aは、従来技術にかかる電子装置における吸排気の概要(その1)を示す図である。従来技術にかかる電子装置の筐体100bにおいて、プリント基板200を第1の側辺200-1に対して水平方向に0°の角度で配置する。また、矩形の板状の基板に半導体記憶素子が両面実装されたDIMM201aをプリント基板200の第1の側辺200-1に対してDIMM201aの基板が平行になるようにプリント基板200上に配置する。
第2の実施の形態の一例にかかる電子装置は、上述したような従来技術の問題を解消し、筐体サイズを拡大することなく、吸気面、吸気ダクトエリア、排気面および排気ダクトエリアを拡大し、冷却装置を追加して冷却性能を高めることができる。また、電子装置の高密度実装および筐体の小型化を図ることができる。すなわち、第2の実施の形態の一例にかかる電子装置は、冷却性能の向上によって、電子装置にプリント基板200を高密度実装することが可能になる。
電子装置は、第1および第2の実施の形態の一例における筐体100および100aの第1の側面板103を底板とし、第2の側面板104を天板としてプリント基板200を垂直に配置してもよい。この場合には、筐体100または100aの内部に吸入された冷却風は、筐体100または100aの内部において底板から天板へ向かう方向で流通する。
101 天板
102 底板
103 第1の側面板
104 第2の側面板
105 背面板
106a、106b 吸気ダクト開口部
107a、107b 排気ダクト開口部
108a、108b 棚
109a1、109a2、109b1、109b2 ガイドパネル
110 電源装置
111 棚
112a、112b ガイドパネル
113-1 枠体
113-2 ファン
113-3 回転軸
113-4 羽根部
113、113a、113b、113c、113d 冷却装置
114、114a、114b 接続基板
114-1 枠体
114-2 接続部
115 前面板
116 冷却装置
117 接続基板
118 吸気面
118a 吸気孔
119 排気面
119a 排気孔
120、121、122、123、124、125 ダクト壁
126 吸気面
127 排気面
128 ピン
129 嵌合孔
200 プリント基板
200a プリント基板ユニット
200-1 第1の側辺
200-2 第2の側辺
200-3 前辺
200-4 後辺
201 発熱部品
201a 電子部品
201a-1、201a-2 DIMM
DA1 吸気ダクトエリア
DA2 中間ダクトエリア
DA3 排気ダクトエリア
α 第1の角度
β 第2の角度
Claims (17)
- 吸気孔を有する前面板と、排気孔を有するとともに前記前面板に対向する背面板と、第1の側面板と、前記第1の側面板に対向する第2の側面板と、水平に配置された棚を有する筐体と、
発熱部品が実装されるとともに、第1及び第2の側辺を有し、前記前面板と前記背面板と前記第1及び第2の側面板と前記棚で区画された空間内に、前記第1の側辺が前記第1の側面板に対し、第1の角度α(0°<α<90°)を有するように配置されるプリント基板と、
吸入孔を有する吸入面と排気孔を有する排気面を有し、前記空間内の前記プリント基板と前記排気孔の間に前記第1の側面板に対し、第2の角度β(0°≦β≦90°)を有するように配置されるとともに、前記発熱部品を冷却する冷却装置を有することを特徴とする電子装置。 - 前記電子装置において、
前記第2の角度βと前記第1の角度αは、β≧αの関係を有することを特徴とする請求項1記載の電子装置。 - 前記電子装置において、
前記発熱部品は、前記冷却装置が吸入する吸気が、前記プリント基板上において前記プリント基板が有する前辺と後辺の間を流通するように配置されることを特徴とする請求項1記載の電子装置。 - 前記電子装置はさらに、
前記プリント基板の第1の側辺と前記冷却装置の間に配置された第1のダクトと、
前記プリント基板の第2の側辺と前記第2の側面板の間に配置された第2のダクトを有することを特徴とする請求項1記載の電子装置。 - 前記電子装置において、
前記冷却装置は、回転自在な羽根部を備えたファンであることを特徴とする請求項1~4のいずれか1項に記載の電子装置。 - 前記電子装置において、
前記ファンは、軸流ファンであることを特徴とする請求項5に記載の電子装置。 - 吸気孔を有する前面板と、排気孔を有するとともに前記前面板に対向する背面板と、第1の側面板と、前記第1の側面板に対向する第2の側面板と、水平に配置された棚と、前記棚上に配置された接続基板を有する筐体と、
発熱部品が実装されるとともに、第1及び第2の側辺を有し、前記前面板と前記背面板と前記第1及び第2の側面板と前記棚で区画された空間内に、前記第1の側辺が前記第1の側面板に対し、第1の角度α(0°<α<90°)を有するように前記接続基板に接続された複数のプリント基板と、
吸入孔を有する吸入面と排気孔を有する排気面を有し、前記空間内の前記プリント基板と前記排気孔の間に前記第1の側面板に対し、第2の角度β(0°≦β≦90°)を有するように配置されるとともに、前記発熱部品を冷却する冷却装置を有することを特徴とする電子装置。 - 前記電子装置において、
前記第2の角度βと前記第1の角度αは、β≧αの関係を有することを特徴とする請求項7記載の電子装置。 - 前記電子装置において、
前記発熱部品は、前記冷却装置が吸入する吸気が、前記プリント基板上において前記プリント基板が有する前辺と後辺の間を流通するように配置されることを特徴とする請求項7記載の電子装置。 - 前記電子装置はさらに、
前記プリント基板の第1の側辺と前記冷却装置の間に配置された第1のダクトと、
前記プリント基板の第2の側辺と前記第2の側面板の間に配置された第2のダクトを有することを特徴とする請求項7記載の電子装置。 - 前記電子装置において、
前記冷却装置は、回転自在な羽根部を備えたファンであることを特徴とする請求項7~10のいずれか1項に記載の電子装置。 - 前記電子装置において、
前記ファンは、軸流ファンであることを特徴とする請求項11記載の電子装置。 - 吸気孔を有する前面板と、
排気孔を有するとともに前記前面板に対向する背面板と、
第1の側面板と、
前記第1の側面板に対向する第2の側面板と、
第1の側辺と、前記第1の側辺に対向する第2の側辺を有し、前記前面板と前記背面板と前記第1及び第2の側面板で区画された空間内に、前記第1の側辺が前記第1の側面板に対し、第1の角度α(0°<α<90°)を有するように水平に配置された棚と、
吸入孔を有する吸入面と排気孔を有する排気面を有し、前記空間内の前記棚と前記排気孔の間に前記第1の側面板に対し、第2の角度β(0°≦β≦90°)を有するように配置されるとともに、前記棚に配置される発熱部品を冷却する冷却装置を有することを特徴とする電子装置の筐体。 - 前記筐体において、
前記第2の角度βと前記第1の角度αは、β≧αの関係を有することを特徴とする請求項13記載の電子装置の筐体。 - 前記筐体はさらに、
前記棚の第1の側面と前記冷却装置の間に配置された第1のダクトと、
前記棚の第2の側面と前記第2の側面板の間に配置された第2のダクトを有することを特徴とする請求項13記載の電子装置の筐体。 - 前記筐体において、
前記冷却装置は、回転自在な羽根部を備えたファンであることを特徴とする請求項13、14又は15に記載の電子装置の筐体。 - 前記筐体において、
前記ファンは、軸流ファンであることを特徴とする請求項16に記載の電子装置の筐体。
Priority Applications (6)
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PCT/JP2009/067930 WO2011045863A1 (ja) | 2009-10-16 | 2009-10-16 | 電子装置及び電子装置の筐体 |
CN2009801619389A CN102577651A (zh) | 2009-10-16 | 2009-10-16 | 电子装置及电子装置的框体 |
JP2011543912A JP5056987B2 (ja) | 2009-10-16 | 2009-10-16 | 電子装置 |
KR1020127009672A KR101367241B1 (ko) | 2009-10-16 | 2009-10-16 | 전자 장치 |
EP09850405A EP2490517A1 (en) | 2009-10-16 | 2009-10-16 | Electronic device and casing for electronic device |
US13/445,386 US8953312B2 (en) | 2009-10-16 | 2012-04-12 | Electronic device and casing for electronic device |
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PCT/JP2009/067930 WO2011045863A1 (ja) | 2009-10-16 | 2009-10-16 | 電子装置及び電子装置の筐体 |
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EP (1) | EP2490517A1 (ja) |
JP (1) | JP5056987B2 (ja) |
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JP5056987B2 (ja) | 2012-10-24 |
US8953312B2 (en) | 2015-02-10 |
KR20120053082A (ko) | 2012-05-24 |
CN102577651A (zh) | 2012-07-11 |
KR101367241B1 (ko) | 2014-02-25 |
US20120201003A1 (en) | 2012-08-09 |
EP2490517A1 (en) | 2012-08-22 |
JPWO2011045863A1 (ja) | 2013-03-04 |
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