WO2011026436A1 - 一种远端射频模块 - Google Patents

一种远端射频模块 Download PDF

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Publication number
WO2011026436A1
WO2011026436A1 PCT/CN2010/076593 CN2010076593W WO2011026436A1 WO 2011026436 A1 WO2011026436 A1 WO 2011026436A1 CN 2010076593 W CN2010076593 W CN 2010076593W WO 2011026436 A1 WO2011026436 A1 WO 2011026436A1
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WIPO (PCT)
Prior art keywords
heat dissipation
remote radio
radio frequency
evaporator
frequency module
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PCT/CN2010/076593
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English (en)
French (fr)
Inventor
李志坚
冯踏青
洪宇平
施健
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华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to BR112012004821A priority Critical patent/BR112012004821A2/pt
Priority to EP10813358.8A priority patent/EP2467006B1/en
Publication of WO2011026436A1 publication Critical patent/WO2011026436A1/zh
Priority to US13/411,130 priority patent/US20120222444A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a communication device, and in particular to a remote radio unit (RRU).
  • RRU remote radio unit
  • the Remote Radio Unit is a new type of distributed network coverage mode. It centrally places large-capacity macrocell base stations in the available central equipment room. The baseband part is processed centrally, and the optical fiber is used in the base station. The RF module is pulled to the remote RF module and placed in the site determined by the network planning, thereby saving a large number of computer rooms required by the conventional solution. At the same time, by using a large-capacity macro base station to support a large number of optical fibers, the capacity can be realized. Conversion between overlays. Due to the above advantages of RRU, RRU has been widely used.
  • the existing RRU with the outer casing includes the RRU heat sink structural member and the outer casing; the RRU heat sink structural member includes the RRU and the heat sink, and the heat generating portion of the RRU is connected to the heat sink, and the heat generating portion of the RRU may specifically be a power amplifier module of the RRU, duplex The module, the transceiver module, etc., the heat sink includes heat dissipating fins for heat exchange with air for heat dissipation.
  • the housing encloses the RRU with a heat sink that is plastic and connected to the RRU heat sink structure by screws to provide aesthetics and prevent solar radiation.
  • a remote radio frequency module includes a remote radio frequency module RRU heat sink structure and a casing, and the outer casing includes an evaporator, a heat dissipation pipe and a casing, and the interior of the evaporator communicates with the heat dissipation pipe and forms a loop.
  • the heat dissipation pipe is arranged on the casing;
  • the evaporator is coupled to a heat sink of the RRU heat sink structure.
  • the evaporator included in the outer casing of the remote radio frequency module is connected with the radiator of the RRU radiator structural member, so that the heat of the radiator can be transmitted.
  • the evaporator is connected to the heat-dissipating pipe, so that heat can be further transmitted to the outer casing through the heat-dissipating pipe, so that the outer casing participates in heat dissipation, which can improve heat dissipation efficiency and improve the stability of the RRU work.
  • FIG. 1 is a structural diagram of a remote radio frequency module according to an embodiment of the present invention
  • FIG. 2 is a structural diagram of a housing of a remote radio frequency module according to an embodiment of the present invention.
  • FIG. 1 depicts a remote radio frequency module, including an RRU heat sink structural member 101 and a housing 102, provided by an embodiment of the present invention.
  • the structure of the outer casing 102 is as shown in FIG. 2, and the outer casing 102 includes an evaporator 1021 and a heat dissipation pipe 1022. And a housing 1023, wherein:
  • the interior of the evaporator 1021 is in communication with the heat dissipation pipe 1022, and the heat dissipation pipe 1022 is distributed on the surface of the casing 1023;
  • the heat dissipation pipe 1022 may be made of a metal material such as copper or aluminum, or may be a plastic material such as a heat conductive plastic.
  • the material of the casing 1023 may be the same as the material of the heat dissipation pipe 1022, or may be different from the material of the heat dissipation pipe 1022.
  • the length and shape of the heat pipe 1022 can be involved or assembled as needed.
  • the evaporator 1021 can be fixed to the housing 1023.
  • the evaporator 1021 can be fixed to the housing 1023 by means of screws or snaps, thereby ensuring the tight connection of the evaporator 1021 with the housing 1023.
  • the evaporator 1021 is coupled to the heat sink of the RRU heat sink structure 101.
  • the remote RF module provided by the embodiment of the present invention has an evaporator connected to the radiator of the RRU heat sink structure, so that the heat of the heat sink can be transmitted to the evaporator, and then the evaporator and the heat sink.
  • the pipes are connected so that heat can be further transferred through the heat pipe, which can improve the heat dissipation efficiency and improve the stability of the RRU work.
  • the evaporator in order to maintain the position of the evaporator after being connected to the heat sink, can be locked by screws to ensure that the heat of the heat sink can be transferred to the evaporator.
  • a channel is provided inside the evaporator 1021 so that the channel can communicate with the heat dissipation pipe 1022 to form a loop, which can further improve heat conduction efficiency.
  • the heat dissipating duct 1022 may be filled with a phase changeable medium, which may be a medium having high-efficiency phase change heat capability such as water, ammonia water, or Freon.
  • heat can pass through the phase changeable medium.
  • the heat is transferred inside the heat pipe and then radiated through the heat pipe; further, when the heat pipe and the channel of the evaporator form a loop, heat can be transferred between the evaporator and the heat pipe through the phase changeable medium. Improve heat dissipation efficiency.
  • the heat dissipation pipe 1022 can be embedded in the casing 1023. Therefore, the heat dissipation pipe 1022 and the casing 1023 can be integrally formed. For example, when the casing 1023 is made of plastic material, the casing 1023 can be blown. The expansion process forms a heat dissipation pipe 1022. At this time, the heat dissipation pipe 1022 is also made of a plastic material; or when the casing 1023 is made of a plastic material, and the heat dissipation pipe 1022 is made of a metal material, the heat dissipation pipe 1022 can be injection molded.
  • the heat dissipation pipe 1022 may not be embedded in the casing 1023.
  • the heat dissipation pipe 1022 and the evaporator 1021 may be respectively located on both sides of the casing 1023.
  • the heat dissipation pipe 1022 and the casing 1023 can be separately processed and then assembled with the evaporator 1021 to form the outer casing 102; compared with the heat dissipation pipe 1022 and the casing 1023, the processing difficulty and the manufacturing cost can be reduced, and at the same time, It also increases the flexibility of the design.
  • ventilation holes may be formed in the casing 1023 to meet the requirements of the RRU for ventilation in different environments.
  • the horizontal position of the heat sink is not higher than the heat dissipation pipe, that is, the heat sink The horizontal position is lower or horizontal to the heat dissipation duct.
  • the vaporization medium generated by the evaporator can provide sufficient force to make the phase change medium flow in the circuit formed by the evaporator and the heat dissipation pipe, or install in the heat dissipation pipe.
  • the evaporator can also be higher than the heat pipe.
  • the remote radio module provided by the embodiment of the present invention is described in detail above.
  • the description of the above embodiment is only used to help understand the method and the idea of the present invention. Meanwhile, one for the field.
  • the present invention is not limited by the scope of the present invention, and the details of the present invention are not limited by the scope of the present invention.

Abstract

本发明涉及通信设备，具体涉及一种远端射频模块，该远端射频模块包括远端射频模块RRU散热器结构件和外壳，其特征在于，所述外壳包括蒸发器、散热管道和壳体，所述蒸发器内部与所述散热管道相通并构成回路，以用于收容相变介质，所述散热管道排布于所述壳体上；所述蒸发器与所述RRU散热器结构件的散热器连接。使用本发明，能够提高散热效率。

Description

一种远端射频模块
本申请要求于 2009年 9月 3日提交中国专利局、申请号为 200910170152. 5、 发明名称为 "一种远端射频模块" 的中国专利申请的优先权， 其全部内容通过 引用结合在本申请中。 技术领域
本发明涉及通信设备， 具体涉及一种远端射频模块（RRU: Remote Radio Unit )e 背景技术
远端射频模块（RRU: Remote Radio Unit )是一种新型的分布式网络覆盖模 式， 它将大容量宏蜂窝基站集中放置在可获得的中心机房中， 基带部分集中处 理， 采用光纤将基站中的射频模块拉到远端射频模块， 分置于网络规划所确定 的站点上， 从而节省了常规解决方案所需要的大量机房； 同时通过采用大容量 宏基站支持大量的光纤拉远， 可实现容量与覆盖之间的转化。 由于 RRU的上述 优势， 因此 RRU已经得到了广泛的应用。
现有的具有外壳的 RRU包括 RRU散热器结构件和外壳； RRU散热器结构 件包括 RRU和散热器， RRU的发热部位与散热器相连， RRU的发热部位具体 可以是 RRU的功放模块、 双工器模块、 收发模块等， 该散热器包括散热翅片， 用于与空气进行热交换实现散热。 外壳将 RRU与散热器包围， 该外壳为塑胶材 质，通过螺钉与 RRU散热器结构件连接，能够起到美观和防止太阳辐射的作用。
在对现有技术的研究中， 发明人发现： 现有的 RRU仅使用散热器的散热翅 片与空气进行热交换实现散热， 整机散热效率不高。 发明内容
本发明实施例提供了一种远端射频模块， 能够提高散热效率。 一种远端射频模块， 包括远端射频模块 RRU散热器结构件和外壳， 所述夕卜 壳包括蒸发器、 散热管道和壳体， 所述蒸发器内部与所述散热管道相通并构成 回路， 以用于收容相变介质， 所述散热管道排布于所述壳体上；
所述蒸发器与所述 RRU散热器结构件的散热器连接。
从本发明实施例提供的以上技术方案可以看出， 由于本发明实施例中远端 射频模块中外壳所包括的蒸发器与 RRU散热器结构件的散热器连接， 使散热器 的热量能够通过传递到蒸发器， 进而由于蒸发器与散热管道连接， 从而使热量 可以进一步通过散热管道传递到外壳， 使外壳参与散热， 能够提高散热效率， 提高 RRU工作的稳定性。 附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将对实施 例或现有技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面描述 中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员来讲， 在不付 出创造性劳动性的前提下， 还可以根据这些附图获得其他的附图。 图 1为本发明实施例中远端射频模块的结构图； 图 2为本发明实施例中远端射频模块中外壳的结构图。
具体实施方式
下面将结合本发明实施例中的附图， 对本发明实施例中的技术方案进行清 楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是 全部的实施例。 基于本发明中的实施例， 本领域普通技术人员在没有作出创造 性劳动前提下所获得的所有其他实施例， 都属于本发明保护的范围。 图 1描述了本发明实施例提供的远端射频模块，包括 RRU散热器结构件 101 和外壳 102。 其中外壳 102的结构如图 2所示，外壳 102包括蒸发器 1021、散热管道 1022 和壳体 1023， 其中：
蒸发器 1021 内部与散热管道 1022相通， 散热管道 1022分布在壳体 1023 的表面；
散热管道 1022可以是金属材质， 如铜、 铝等导热性能好的金属； 也可以是 塑胶材质， 如导热塑胶等。 壳体 1023的材质可以与散热管道 1022的材质相同， 也可以与散热管道 1022的材质不同。 散热管道 1022的长度和形状可以根据需 要进行涉及或装配。
其中， 蒸发器 1021可以固设在壳体 1023上， 例如可以采用螺钉或卡扣等 方式将蒸发器 1021 固设在壳体 1023上， 从而确保蒸发器 1021与壳体 1023的 紧密相连。
蒸发器 1021与 RRU散热器结构件 101的散热器连接。
从上可知， 本发明实施例提供的远端射频模块中外壳所包括的蒸发器与 RRU散热器结构件的散热器连接， 使散热器的热量能够通过传递到蒸发器， 进 而由于蒸发器与散热管道连接， 从而使热量可以进一步通过散热管道传递， 能 够提高散热效率， 提高 RRU工作的稳定性。
其中， 在本发明的一个实施例中， 为了使蒸发器能够与散热器连接后保持 位置固定， 可以通过螺钉对蒸发器进行锁固， 从而确保散热器的热量能够传递 到蒸发器。
进一步的， 在蒸发器 1021的内部设置槽道， 使该槽道可以与散热管道 1022 连通构成环路， 可以进一步提高热量的传导效率。
其中，可以在散热管道 1022内填充可相变的介质，该介质可以是水、氨水、 氟利昂等具有高效的相变换热能力的介质。
在散热管道 1022内填充了可相变的介质后， 热量可以通过可相变的介质在 散热管道内传递， 再通过散热管道进行散热； 进一步， 在散热管道与蒸发器的 槽道连通构成环路时， 热量可以更快地通过可相变的介质在蒸发器与散热管道 之间传递， 提高散热效率。
在本发明的一个实施例中，散热管道 1022可以嵌于壳体 1023， 因此散热管 道 1022和壳体 1023可以一体化成型制造， 例如在壳体 1023为塑胶材质时， 可 以对壳体 1023采用吹胀工艺形成散热管道 1022， 此时散热管道 1022也为塑胶 材质； 或者在壳体 1023为塑胶材质， 散热管道 1022为金属材质时， 可以在散 热管道 1022上注塑。
或者散热管道 1022也可以不嵌于壳体 1023， 此时散热管道 1022与蒸发器 1021可以分别位于壳体 1023—个面的两侧。散热管道 1022和壳体 1023可以分 别加工， 然后再与蒸发器 1021进行装配构成外壳 102; 与散热管道 1022和壳体 1023 可以一体化成型制造相比， 可以降低加工的难度和制造的成本， 同时也可 以增加设计的灵活性。
在本发明的一个实施例中， 为了进一步地提高 RRU的散热效率， 可以在壳 体 1023上开有通风孔， 从而满足不同环境下 RRU对通风量的要求。
易于理解的是， 为了更好的散热， 以及便于蒸发器和散热管道内的相变材 料的流通， 所述散热器的水平位置不高于所述散热管道， 也就是说， 所述散热 器的水平位置低于或水平于所述散热管道。 当然， 在不考虑散热效率、 或者蒸 发器所产生的气化介质能提供足够的作用力以使得相变介质可以在蒸发器和散 热管道构成的回路中流动、 或者就在散热管道中加装了额外的动力器件的情况 下， 蒸发器也可以高于散热管道。
以上对本发明实施例所提供的一种远端射频模块进行了详细介绍， 以上实 施例的说明只是用于帮助理解本发明的方法及其思想； 同时， 对于本领域的一 般技术人员， 依据本发明的思想， 在具体实施方式及应用范围上均会有改变之 处， 综上所述， 本说明书内容不应理解为对本发明的限制。

Claims

权 利 要 求
1、 一种远端射频模块， 包括远端射频模块散热器结构件和外壳， 其特征在 于， 所述外壳包括蒸发器、 散热管道和壳体， 所述蒸发器内部与所述散热管道 相通并构成回路， 以用于收容相变介质， 所述散热管道排布于所述壳体上； 所述蒸发器与所述远端射频模块散热器结构件的散热器连接。
2、 如权利要求 1所述的远端射频模块， 其特征在于， 所述蒸发器内部有槽 道， 所述槽道与所述散热管道连通构成环路。
3、 如权利要求 1或 2所述的远端射频模块， 其特征在于， 所述散热管道内 填充有可相变的介质。
4、 如权利要求 3所述的远端射频模块， 其特征在于， 所述可相变的介质是 水、 或氨水、 或氟利昂。
5、 如权利要求 1或 2所述的远端射频模块， 其特征在于， 所述散热管道内 嵌于所述壳体； 或
所述散热管道排布于所述壳体的外侧。
6、 如权利要求 1或 2所述的远端射频模块， 其特征在于， 所述壳体为塑胶 材质， 所述散热管道为金属材质； 或
所述壳体为塑胶材质， 所述散热管道为塑胶材质； 或
所述壳体为金属材质， 所述散热管道为金属材质； 或
所述壳体为金属材质， 所述散热管道为塑胶材质。
7、 如权利要求 6所述的远端射频模块， 其特征在于， 所述金属材质为铜或 铝。
8、 如权利要求 6所述的远端射频模块， 其特征在于， 所述塑胶材质为导热 塑胶。
9、 如权利要求 1或 2所述的远端射频模块， 其特征在于， 所述壳体开有通 风孔。
10、 如权利要求 1 所述的远端射频模块， 其特征在于， 所述蒸发器的水平 位置水平于或低于所述散热管道。
PCT/CN2010/076593 2009-09-03 2010-09-03 一种远端射频模块 WO2011026436A1 (zh)

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EP2467006A1 (en) 2012-06-20
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US20120222444A1 (en) 2012-09-06
EP2467006A4 (en) 2012-08-01
BR112012004821A2 (pt) 2017-05-30

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