CN101645714A - 一种远端射频模块 - Google Patents
一种远端射频模块 Download PDFInfo
- Publication number
- CN101645714A CN101645714A CN200910170152A CN200910170152A CN101645714A CN 101645714 A CN101645714 A CN 101645714A CN 200910170152 A CN200910170152 A CN 200910170152A CN 200910170152 A CN200910170152 A CN 200910170152A CN 101645714 A CN101645714 A CN 101645714A
- Authority
- CN
- China
- Prior art keywords
- hot channel
- module
- far
- evaporator
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明涉及通信设备,具体涉及一种远端射频模块,该远端射频模块包括远端射频模块RRU散热器结构件和外壳,其特征在于,所述外壳包括蒸发器、散热管道和壳体,所述蒸发器内部与所述散热管道相通并构成回路,以用于收容相变介质,所述散热管道排布于所述壳体上;所述蒸发器与所述RRU散热器结构件的散热器连接。使用本发明,能够提高散热效率。
Description
技术领域
本发明涉及通信设备,具体涉及一种远端射频模块(RRU:Remote RadioUnit)。
背景技术
远端射频模块(RRU:Remote Radio Unit)是一种新型的分布式网络覆盖模式,它将大容量宏蜂窝基站集中放置在可获得的中心机房中,基带部分集中处理,采用光纤将基站中的射频模块拉到远端射频模块,分置于网络规划所确定的站点上,从而节省了常规解决方案所需要的大量机房;同时通过采用大容量宏基站支持大量的光纤拉远,可实现容量与覆盖之间的转化。由于RRU的上述优势,因此RRU已经得到了广泛的应用。
现有的具有外壳的RRU包括RRU散热器结构件和外壳;RRU散热器结构件包括RRU和散热器,RRU的发热部位与散热器相连,RRU的发热部位具体可以是RRU的功放模块、双工器模块、收发模块等,该散热器包括散热翅片,用于与空气进行热交换实现散热。外壳将RRU与散热器包围,该外壳为塑胶材质,通过螺钉与RRU散热器结构件连接,能够起到美观和防止太阳辐射的作用。
在对现有技术的研究中,发明人发现:现有的RRU仅使用散热器的散热翅片与空气进行热交换实现散热,整机散热效率不高。
发明内容
本发明实施例提供了一种远端射频模块,能够提高散热效率。
一种远端射频模块,包括远端射频模块RRU散热器结构件和外壳,所述外壳包括蒸发器、散热管道和壳体,所述蒸发器内部与所述散热管道相通并构成回路,以用于收容相变介质,所述散热管道排布于所述壳体上;
所述蒸发器与所述RRU散热器结构件的散热器连接。
从本发明实施例提供的以上技术方案可以看出,由于本发明实施例中远端射频模块中外壳所包括的蒸发器与RRU散热器结构件的散热器连接,使散热器的热量能够通过传递到蒸发器,进而由于蒸发器与散热管道连接,从而使热量可以进一步通过散热管道传递到外壳,使外壳参与散热,能够提高散热效率,提高RRU工作的稳定性。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1a为本发明实施例中远端射频模块的结构图;
图1b为本发明实施例中远端射频模块中外壳的结构图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
图1a描述了本发明实施例提供的远端射频模块,包括RRU散热器结构件101和外壳102。
其中外壳102的结构如图1b所示,外壳102包括蒸发器1021、散热管道1022和壳体1023,其中:
蒸发器1021内部与散热管道1022相通,散热管道1022分布在壳体1023的表面;
散热管道1022可以是金属材质,如铜、铝等导热性能好的金属;也可以是塑胶材质,如导热塑胶等。壳体1023的材质可以与散热管道1022的材质相同,也可以与散热管道1022的材质不同。散热管道1022的长度和形状可以根据需要进行涉及或装配。
其中,蒸发器1021可以固设在壳体1023上,例如可以采用螺钉或卡扣等方式将蒸发器1021固设在壳体1023上,从而确保蒸发器1021与壳体1023的紧密相连。
蒸发器1021与RRU散热器结构件101的散热器连接。
从上可知,本发明实施例提供的远端射频模块中外壳所包括的蒸发器与RRU散热器结构件的散热器连接,使散热器的热量能够通过传递到蒸发器,进而由于蒸发器与散热管道连接,从而使热量可以进一步通过散热管道传递,能够提高散热效率,提高RRU工作的稳定性。
其中,在本发明的一个实施例中,为了使蒸发器能够与散热器连接后保持位置固定,可以通过螺钉对蒸发器进行锁固,从而确保散热器的热量能够传递到蒸发器。
进一步的,在蒸发器1021的内部设置槽道,使该槽道可以与散热管道1022连通构成环路,可以进一步提高热量的传导效率。
其中,可以在散热管道1022内填充可相变的介质,该介质可以是水、氨水、氟利昂等具有高效的相变换热能力的介质。
在散热管道1022内填充了可相变的介质后,热量可以通过可相变的介质在散热管道内传递,再通过散热管道进行散热;进一步,在散热管道与蒸发器的槽道连通构成环路时,热量可以更快地通过可相变的介质在蒸发器与散热管道之间传递,提高散热效率。
在本发明的一个实施例中,散热管道1022可以嵌于壳体1023,因此散热管道1022和壳体1023可以一体化成型制造,例如在壳体1023为塑胶材质时,可以对壳体1023采用吹胀工艺形成散热管道1022,此时散热管道1022也为塑胶材质;或者在壳体1023为塑胶材质,散热管道1022为金属材质时,可以在散热管道1022上注塑。
或者散热管道1022也可以不嵌于壳体1023,此时散热管道1022与蒸发器1021可以分别位于壳体1023一个面的两侧。散热管道1022和壳体1023可以分别加工,然后再与蒸发器1021进行装配构成外壳102;与散热管道1022和壳体1023可以一体化成型制造相比,可以降低加工的难度和制造的成本,同时也可以增加设计的灵活性。
在本发明的一个实施例中,为了进一步地提高RRU的散热效率,可以在壳体1023上开有通风孔,从而满足不同环境下RRU对通风量的要求。
易于理解的是,为了更好的散热,以及便于蒸发器和散热管道内的相变材料的流通,所述散热器的水平位置不高于所述散热管道,也就是说,所述散热器的水平位置低于或水平于所述散热管道。当然,在不考虑散热效率、或者蒸发器所产生的气化介质能提供足够的作用力以使得相变介质可以在蒸发器和散热管道构成的回路中流动、或者就在散热管道中加装了额外的动力器件的情况下,蒸发器也可以高于散热管道。
以上对本发明实施例所提供的一种远端射频模块进行了详细介绍,以上实施例的说明只是用于帮助理解本发明的方法及其思想;同时,对于本领域的一般技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本发明的限制。
Claims (10)
1、一种远端射频模块,包括远端射频模块散热器结构件和外壳,其特征在于,所述外壳包括蒸发器、散热管道和壳体,所述蒸发器内部与所述散热管道相通并构成回路,以用于收容相变介质,所述散热管道排布于所述壳体上;
所述蒸发器与所述远端射频模块散热器结构件的散热器连接。
2、如权利要求1所述的远端射频模块,其特征在于,所述蒸发器内部有槽道,所述槽道与所述散热管道连通构成环路。
3、如权利要求1或2所述的远端射频模块,其特征在于,所述散热管道内填充有可相变的介质。
4、如权利要求3所述的远端射频模块,其特征在于,所述可相变的介质是水、或氨水、或氟利昂。
5、如权利要求1或2所述的远端射频模块,其特征在于,所述散热管道内嵌于所述壳体;或
所述散热管道排布于所述壳体的外侧。
6、如权利要求1或2所述的远端射频模块,其特征在于,所述壳体为塑胶材质,所述散热管道为金属材质;或
所述壳体为塑胶材质,所述散热管道为塑胶材质;或
所述壳体为金属材质,所述散热管道为金属材质;或
所述壳体为金属材质,所述散热管道为塑胶材质。
7、如权利要求6所述的远端射频模块,其特征在于,所述金属材质为铜或铝。
8、如权利要求6所述的远端射频模块,其特征在于,所述塑胶材质为导热塑胶。
9、如权利要求1或2所述的远端射频模块,其特征在于,所述壳体开有通风孔。
10、如权利要求1所述的远端射频模块,其特征在于,所述蒸发器的水平位置水平于或低于所述散热管道。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101701525A CN101645714B (zh) | 2009-09-03 | 2009-09-03 | 一种远端射频模块 |
PCT/CN2010/076593 WO2011026436A1 (zh) | 2009-09-03 | 2010-09-03 | 一种远端射频模块 |
BR112012004821A BR112012004821A2 (pt) | 2009-09-03 | 2010-09-03 | unidade de rádio remota |
EP10813358.8A EP2467006B1 (en) | 2009-09-03 | 2010-09-03 | Remote radio unit |
US13/411,130 US20120222444A1 (en) | 2009-09-03 | 2012-03-02 | Remote radio unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101701525A CN101645714B (zh) | 2009-09-03 | 2009-09-03 | 一种远端射频模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101645714A true CN101645714A (zh) | 2010-02-10 |
CN101645714B CN101645714B (zh) | 2012-12-12 |
Family
ID=41657446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101701525A Expired - Fee Related CN101645714B (zh) | 2009-09-03 | 2009-09-03 | 一种远端射频模块 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120222444A1 (zh) |
EP (1) | EP2467006B1 (zh) |
CN (1) | CN101645714B (zh) |
BR (1) | BR112012004821A2 (zh) |
WO (1) | WO2011026436A1 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011026436A1 (zh) * | 2009-09-03 | 2011-03-10 | 华为技术有限公司 | 一种远端射频模块 |
WO2014026474A1 (zh) * | 2012-08-13 | 2014-02-20 | 华为技术有限公司 | 射频拉远单元设备及其组合件 |
WO2014134921A1 (zh) * | 2013-03-06 | 2014-09-12 | 华为技术有限公司 | 射频拉远模块以及通信设备 |
WO2016026259A1 (zh) * | 2014-08-21 | 2016-02-25 | 华为技术有限公司 | 通信产品和基站系统 |
WO2016123950A1 (zh) * | 2015-02-05 | 2016-08-11 | 中兴通讯股份有限公司 | 一种底板、底板组件以及底板安装系统 |
WO2016150318A1 (zh) * | 2015-03-24 | 2016-09-29 | 华为技术有限公司 | 散热装置、射频拉远模块、基站模块、通信基站及系统 |
WO2017020624A1 (zh) * | 2015-07-31 | 2017-02-09 | 中兴通讯股份有限公司 | 一种射频拉远单元、安装件及射频通信系统 |
CN106455431A (zh) * | 2016-10-12 | 2017-02-22 | 上海交通大学 | 板式环路热虹吸均温板 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105578837B (zh) * | 2014-10-16 | 2018-06-26 | 华为技术有限公司 | 射频拉远单元与有源天线系统 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3035419A (en) * | 1961-01-23 | 1962-05-22 | Westinghouse Electric Corp | Cooling device |
US3209062A (en) * | 1963-01-25 | 1965-09-28 | Westinghouse Electric Corp | Mounting and coolant system for semiconductor heat generating devices |
US3717009A (en) * | 1971-04-26 | 1973-02-20 | Gen Motors Corp | Refrigeration evaporator assembly |
FR2489490A1 (fr) * | 1980-08-27 | 1982-03-05 | Commissariat Energie Atomique | Appareil de production de froid comportant un panneau rayonnant et un panneau evaporateur |
US5383340A (en) * | 1994-03-24 | 1995-01-24 | Aavid Laboratories, Inc. | Two-phase cooling system for laptop computers |
TW346566B (en) * | 1996-08-29 | 1998-12-01 | Showa Aluminiun Co Ltd | Radiator for portable electronic apparatus |
US6069791A (en) * | 1997-08-14 | 2000-05-30 | Fujikura Ltd. | Cooling device for notebook personal computer |
US6097597A (en) * | 1998-06-30 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus |
US7305843B2 (en) * | 1999-06-08 | 2007-12-11 | Thermotek, Inc. | Heat pipe connection system and method |
US20010037880A1 (en) * | 1999-12-30 | 2001-11-08 | Max Aaron Solondz | Valved heat pipe and adaptive cooling system including the same |
US6789611B1 (en) * | 2000-01-04 | 2004-09-14 | Jia Hao Li | Bubble cycling heat exchanger |
JP4141613B2 (ja) * | 2000-03-09 | 2008-08-27 | 富士通株式会社 | 密閉サイクル冷凍装置および密閉サイクル冷凍装置用乾式蒸発器 |
DE10125636B4 (de) * | 2001-05-25 | 2004-03-25 | Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto | Kühler für elektrische und/oder elektronische Bauteile |
US6657121B2 (en) * | 2001-06-27 | 2003-12-02 | Thermal Corp. | Thermal management system and method for electronics system |
US6388882B1 (en) * | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
SE524204C2 (sv) * | 2001-07-19 | 2004-07-06 | Denso Corp | Värmeansamlare med ett membran vilket tar emot ett fluidtryck |
JP2003234590A (ja) * | 2002-02-08 | 2003-08-22 | Denso Corp | 沸騰冷却装置 |
JP3961843B2 (ja) * | 2002-02-08 | 2007-08-22 | 株式会社日立製作所 | 液体冷却システムを有する小型電子計算機 |
FR2845351B1 (fr) * | 2002-10-03 | 2005-07-22 | Cit Alcatel | Architecture modulaire pour le controle thermique d'un vehicule spatial |
US7031158B2 (en) * | 2002-10-30 | 2006-04-18 | Charles Industries, Ltd. | Heat pipe cooled electronics enclosure |
US20040250994A1 (en) * | 2002-11-05 | 2004-12-16 | Lalit Chordia | Methods and apparatuses for electronics cooling |
US7013955B2 (en) * | 2003-07-28 | 2006-03-21 | Thermal Corp. | Flexible loop thermosyphon |
US6827132B1 (en) * | 2003-09-23 | 2004-12-07 | Inventec Corporation | Radiation apparatus |
US20050257532A1 (en) * | 2004-03-11 | 2005-11-24 | Masami Ikeda | Module for cooling semiconductor device |
US7149086B2 (en) * | 2004-12-10 | 2006-12-12 | Intel Corporation | Systems to cool multiple electrical components |
CN100370890C (zh) * | 2005-06-27 | 2008-02-20 | 中山大学 | 一种平板式回路热管装置 |
JP4863843B2 (ja) * | 2006-04-28 | 2012-01-25 | 株式会社フジクラ | 蒸発器及びこの蒸発器を使用したループヒートパイプ |
US20070289313A1 (en) * | 2006-06-15 | 2007-12-20 | Mohinder Singh Bhatti | Thermosiphon with thermoelectrically enhanced spreader plate |
JP4789813B2 (ja) * | 2007-01-11 | 2011-10-12 | トヨタ自動車株式会社 | 半導体素子の冷却構造 |
CN101013011A (zh) * | 2007-02-05 | 2007-08-08 | 中山大学 | 一种多通道自调节回路热管装置 |
US7460367B2 (en) * | 2007-03-05 | 2008-12-02 | Tracewell Systems, Inc. | Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology |
CN201197257Y (zh) * | 2007-12-27 | 2009-02-18 | 华为技术有限公司 | 一种远端射频模块的散热装置 |
CN101645714B (zh) * | 2009-09-03 | 2012-12-12 | 华为技术有限公司 | 一种远端射频模块 |
JP5531571B2 (ja) * | 2009-11-12 | 2014-06-25 | 富士通株式会社 | 機能拡張ユニットシステム |
-
2009
- 2009-09-03 CN CN2009101701525A patent/CN101645714B/zh not_active Expired - Fee Related
-
2010
- 2010-09-03 WO PCT/CN2010/076593 patent/WO2011026436A1/zh active Application Filing
- 2010-09-03 BR BR112012004821A patent/BR112012004821A2/pt not_active Application Discontinuation
- 2010-09-03 EP EP10813358.8A patent/EP2467006B1/en not_active Not-in-force
-
2012
- 2012-03-02 US US13/411,130 patent/US20120222444A1/en not_active Abandoned
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011026436A1 (zh) * | 2009-09-03 | 2011-03-10 | 华为技术有限公司 | 一种远端射频模块 |
US9642284B2 (en) | 2012-08-13 | 2017-05-02 | Huawei Technologies Co., Ltd. | Radio remote unit device and assembly thereof |
US9167712B2 (en) | 2012-08-13 | 2015-10-20 | Huawei Technologies Co., Ltd. | Radio remote unit device and assembly thereof |
WO2014026474A1 (zh) * | 2012-08-13 | 2014-02-20 | 华为技术有限公司 | 射频拉远单元设备及其组合件 |
WO2014134921A1 (zh) * | 2013-03-06 | 2014-09-12 | 华为技术有限公司 | 射频拉远模块以及通信设备 |
US10219406B2 (en) | 2013-03-06 | 2019-02-26 | Huawei Technologies Co., Ltd. | Radio remote unit and communications device |
US10757832B2 (en) | 2013-03-06 | 2020-08-25 | Huawei Technologies Co., Ltd. | Radio remote unit and communications device |
WO2016026259A1 (zh) * | 2014-08-21 | 2016-02-25 | 华为技术有限公司 | 通信产品和基站系统 |
US9872416B2 (en) | 2014-08-21 | 2018-01-16 | Huawei Technologies Co., Ltd. | Communications product and base station system |
WO2016123950A1 (zh) * | 2015-02-05 | 2016-08-11 | 中兴通讯股份有限公司 | 一种底板、底板组件以及底板安装系统 |
WO2016150318A1 (zh) * | 2015-03-24 | 2016-09-29 | 华为技术有限公司 | 散热装置、射频拉远模块、基站模块、通信基站及系统 |
WO2017020624A1 (zh) * | 2015-07-31 | 2017-02-09 | 中兴通讯股份有限公司 | 一种射频拉远单元、安装件及射频通信系统 |
CN106455431A (zh) * | 2016-10-12 | 2017-02-22 | 上海交通大学 | 板式环路热虹吸均温板 |
Also Published As
Publication number | Publication date |
---|---|
EP2467006A4 (en) | 2012-08-01 |
EP2467006A1 (en) | 2012-06-20 |
EP2467006B1 (en) | 2015-01-07 |
WO2011026436A1 (zh) | 2011-03-10 |
CN101645714B (zh) | 2012-12-12 |
BR112012004821A2 (pt) | 2017-05-30 |
US20120222444A1 (en) | 2012-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101645714B (zh) | 一种远端射频模块 | |
CN101625178B (zh) | 半导体制冷、制热设备和空调 | |
CN103717036B (zh) | 射频拉远模块以及通信设备 | |
US20110116230A1 (en) | System for controlling temperature of antenna module | |
CN103096691A (zh) | 一种石墨膜导热体 | |
CN203523137U (zh) | 电路板及电子设备 | |
CN104952818A (zh) | 一种导热装置以及电子设备 | |
CN101227811A (zh) | 真空超热导散热器 | |
CN106163237A (zh) | 一种散热装置及电子设备 | |
CN206944496U (zh) | 热水器 | |
KR200472110Y1 (ko) | 냉온수매트용 보일러 어셈블리 | |
CN204230383U (zh) | 一种动力电池系统 | |
CN210463746U (zh) | 一种半导体制冷恒温水箱 | |
CN209963182U (zh) | 一种均温双管卡槽水冷板结构 | |
CN201039646Y (zh) | 槽道式平板热管均热器 | |
CN113727472A (zh) | 实现蜂窝网络重定位的5g基站散热系统 | |
CN103712304B (zh) | 移动基站储能空调系统 | |
CN205976027U (zh) | 相变保温结构 | |
CN110022664A (zh) | 一种利用仿生肺泡换热器进行电子元件散热的装置 | |
CN213343211U (zh) | 一种通信基站环境监控数据采集终端的防护机构 | |
CN214338956U (zh) | 蓄热北墙及温室大棚 | |
CN213811203U (zh) | 一种地理管换热系统 | |
CN220436609U (zh) | 一种导热效果良好的地板地暖模块 | |
CN210431695U (zh) | 一种aau冷却设备 | |
CN203813974U (zh) | 一种lte的移动分布系统 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121212 Termination date: 20190903 |