Classifications

• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
  • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/10—Esters; Ether-esters
  • C08K5/101—Esters; Ether-esters of monocarboxylic acids
  • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols

Definitions

• the present invention relates to a heat-resistant transparent resin molded article suitably used as an optical member for electronic equipment parts, and a method for producing the same.
• various optical films are used as light guide plates, light diffusion sheets, light condensing sheets, and the like.
• Various optical lenses such as a pickup lens, a camera lens, a microarray lens, a projector lens, and a Fresnel lens are used.
• a pickup lens a camera lens
• a microarray lens a projector lens
• a Fresnel lens a Fresnel lens
• replacement with an optical member having a thermoplastic resin that is easily mass-produced as a constituent material has been promoted.
• this thermoplastic resin Acrylic resin and polycarbonate are widely used.
• the above-mentioned optical members can also be mounted by solder reflow using lead-free solder, so that the shape is maintained without melting even at the reflow temperature (260 ° C) of lead-free solder.
• the heat resistance which can be performed is desired.
• Patent Document 1 discloses an aromatic polycarbonate resin having an aromatic dihydroxy component and improved heat resistance as a resin for forming a transparent resin molded article having excellent heat resistance, and is compatible with reflow soldering. It is described that it is used for an optical member.
• the glass transition temperatures of the aromatic polycarbonate resins described in the examples are all 200 ° C. or lower. Therefore, in order to obtain a material that can withstand solder reflow at 260 ° C. or higher, it is necessary to greatly increase the amount of a special monomer. In this case, there are problems such as difficulty in polymerization and a significant increase in cost. .
• Patent Document 2 discloses a sealing material and a camera lens made of a two-component heat-resistant transparent resin molded product (molded product), and the transmittance does not decrease after 200 hours in an atmosphere of 200 ° C. High heat resistance is shown. However, in the examples, the molding time is very long, such as 1 hour for curing and 3 hours for baking, making mass production difficult.
• the present invention provides a transparent resin molded body that has both high heat resistance that can be used for solder reflow using lead-free solder, high transparency that can be used as an optical member, and that is easy to produce, and a method for manufacturing the same. Let it be an issue.
• the present inventor has applied ionizing radiation to a molded body of a resin composition made of a fluororesin having a carbon-hydrogen bond, at a temperature atmosphere lower than the melting point of the fluororesin and above the melting point of the fluororesin
• the present invention was completed by finding that a transparent resin molded article having both high heat resistance and high transparency and excellent productivity can be obtained by crosslinking the resin by irradiating at least once in each temperature atmosphere. .
• the present invention relates to a molded article of a resin composition comprising a fluororesin having a carbon-hydrogen bond, which is irradiated with ionizing radiation at least once in a temperature atmosphere lower than the melting point of the fluororesin, and the fluororesin
• a transparent resin molded product (the first invention of the present application) is provided in which the resin composition is crosslinked by irradiation with ionizing radiation at least once in an atmosphere having a temperature equal to or higher than its melting point.
• the fluororesin constituting the resin composition is a thermoplastic resin having a carbon-hydrogen bond and containing fluorine, which can be formed into a transparent molded body and crosslinks by irradiation with ionizing radiation. If it is, it will not specifically limit. Since the fluororesin is a thermoplastic resin, a molded body that becomes an optical member can be easily produced with high productivity by a molding method described later.
• fluororesin having a carbon-hydrogen bond examples include ethylene-tetrafluoroethylene copolymer, polyvinylidene fluoride, polyvinyl fluoride, and ethylene-tetrafluoroethylene-hexafluoropropylene terpolymer.
• the carbon - as fluororesin having a hydrogen bond, ethylene and tetrafluoroethylene or formula (1): in CF 2 CF-Rf 1 (wherein, Rf 1 is, .Rf representing a -CF 3 or-ORF 2 2 represents a perfluoroalkyl group having 1 to 5 carbon atoms.) And a copolymer with a perfluoroethylenically unsaturated compound. These copolymers can change the transparency, melting point, and crosslinking characteristics depending on the ratio, but those having a transmittance of 20% or more at a wavelength of 400 nm before irradiation with ionizing radiation are more preferable. .
• the fluororesin used in the present invention those having a reactive functional group at the main chain end and / or side chain end can also be used.
• the reactive functional group include a carbonyl group and a group having a carbonyl group, such as a carbonyldioxy group or haloformyl, a hydroxyl group and an epoxy group.
• fluororesin used in the present invention those obtained by copolymerizing other components and those obtained by graft-polymerizing other components on the ethylene site may be used as long as the effects of the present invention are not impaired.
• a fluororesin a commercially available product can be used, and examples thereof include NEOFRON RP-4020 (trade name) manufactured by Daikin Industries.
• the resin composition forming the molded body is made of the fluororesin.
• the resin composition may contain other resin components in the fluororesin as long as the effects of the present invention are not impaired. It is also possible to use an added polymer alloy. Examples of such other resin components include polyethylene, polypropylene, polystyrene, engineering plastics, super engineering plastics, thermoplastic elastomers, fluororesins having no carbon-hydrogen bonds, and copolymers of these resins.
• the resin composition comprises 0.05 parts by weight or more and 20 parts by weight or less of an additive having a molecular weight of 1000 or less and having at least two carbon-carbon double bonds in the molecule with respect to 100 parts by weight of the fluororesin. It may be contained (second invention of the present application).
• the resin composition comprising the fluororesin has a molecular weight of 1000 or less and a polyfunctionality having at least two carbon-carbon double bonds in the molecule in order to improve crosslinking efficiency by irradiation with ionizing radiation. It is preferable to add a functional monomer, and the addition amount is preferably 0.05 parts by weight or more and 20 parts by weight or less with respect to 100 parts by weight of the fluororesin.
• this polyfunctional monomer is less than 0.05 parts by weight, it is crosslinked by irradiation with ionizing radiation, and the heat resistance intended by the present invention is obtained, but the crosslinking efficiency is slightly low, A large amount of irradiation dose is required.
• the addition amount is more than 20 parts by weight, it becomes difficult to handle at the time of kneading at the time of preparing the resin composition, the additive bleeds out from the molded product, and transparency is achieved by self-polymerization of the additive itself. Problems such as degradation may occur, which may cause degradation of characteristics.
• the addition to the resin composition is facilitated by setting the addition amount to 0.05 parts by weight or more and 20 parts by weight or less. More preferably, it is 1 to 15 parts by weight.
• the molecular weight of the polyfunctional monomer (additive) is 1000 or less, but by making the molecular weight 1000 or less, it is more effective that a molded article excellent in heat resistance can be obtained while maintaining transparency. Become prominent. Those having a molecular weight of 1000 or less are also preferred in that they have a viscosity that can be easily kneaded with a fluororesin, and many additives are less colored.
• polyfunctional monomer (additive) examples include 1,6-hexanediol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, ethylene oxide-modified tri Methylolpropane tri (meth) acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, ethylene oxide modified bisphenol A di (meth) acrylate, diethylene glycol di (meth) acrylate, dipentaerythritol hexaacrylate, dipentaerythritol monohydroxypentaacrylate , Caprolactone-modified dipentaerythritol hexaacrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) Acrylate, polyethylene glycol di (meth) acrylate, tris (ethylene
• tris (acryloxyethyl) isocyanurate tris (methacryloxyethyl) isocyanurate, trimethylolpropane tri (meth) acrylate, 1,6-divinyl (perfluorohexane) and the like are preferably used.
• a commercially available polyfunctional monomer can be used.
• commercially available polyfunctional monomers may contain stabilizers or the like that may affect the effects of the present invention, a simple preliminary test on the effects of the present invention should be performed before use. It is preferable to confirm that it does not affect the effect of the present invention.
• the thing of 1000 ppm or less of a stabilizer's compounding quantity is used normally, and in order to prevent the influence on the effect of this invention, the thing with a small compounding quantity is preferable.
• additives such as antioxidants, flame retardants, ultraviolet absorbers, light stabilizers, heat stabilizers, lubricants and the like can be mixed into the resin composition.
• This resin composition can be produced by mixing these materials using a known mixing apparatus such as an open roll, a pressure kneader, a single-screw mixer, or a twin-screw mixer. It is preferable to melt and mix at a temperature equal to or higher than the melting point of the fluororesin (base resin) to be used.
• a method for molding the resin composition produced above will be described.
• a molding method for producing the transparent resin molded product of the present invention a method widely used as an existing molding method such as injection molding, press molding, extrusion molding or the like can be employed.
• the melting point of the resin composition used in the present invention can be adjusted by the type of fluororesin, for example, the ratio of monomers constituting the fluororesin.
• a fluororesin having a melting point of less than 300 ° C. is used, the above existing molding method can be easily applied.
• a fluororesin having a melting point of 300 ° C. or higher it is necessary to perform a plating process in consideration of mechanical corrosion due to hydrogen fluoride.
• the mold / molding roll surface is easily transferred to the surface of the material, and if a rough surface is transferred, light scattering can be induced and the transmittance can be reduced. Therefore, it is preferable that the mold and the molding roll surface of the equipment that is in direct contact with the molded body are polished, and it is particularly preferable that the surface roughness Ra is about 1.6a.
• the molded body formed as described above is irradiated with ionizing radiation one or more times (first irradiation) in a temperature atmosphere less than the melting point of the fluororesin constituting the molded body. Further, the resin composition is crosslinked by performing ionizing radiation irradiation (second irradiation) one or more times in a temperature atmosphere equal to or higher than the melting point of the fluororesin.
• the fluororesin constituting the resin composition that is the material of the transparent resin molded body of the present invention is a thermoplastic resin that can easily obtain a molded body, but after being crosslinked by irradiation with ionizing radiation, the thermoplastic resin is Regardless of the material used, the molded article has heat resistance that can withstand solder reflow using lead-free solder.
• ionizing radiation sources include accelerating electron beams, gamma rays, X-rays, ⁇ rays, ultraviolet rays, and the like. From the viewpoint, an accelerated electron beam is preferable. What is necessary is just to set the acceleration voltage of an acceleration electron beam suitably according to the thickness etc. of a molded article. For example, in the case of a molded product having a thickness of about 2 mm, the acceleration voltage is selected between 100 and 10,000 kV.
• the first irradiation dose is preferably 1000 kGy or less. Within this range, heat resistance that can withstand solder reflow using lead-free solder can be obtained, and the above problems do not occur.
• this molded body is irradiated with ionizing radiation.
• the irradiation with ionizing radiation is performed at a temperature atmosphere lower than the melting point of the fluororesin, preferably the glass transition point. It is performed at least once in the following temperature atmosphere and at least once in a temperature atmosphere equal to or higher than the melting point of the fluororesin.
• the molded body After the first irradiation, the molded body is heated to the melting point of the fluororesin or higher, and the second irradiation is performed. As a result, a molded body having high transparency can be obtained.
• the fluororesin crystals In an atmosphere with a temperature higher than the melting point of the fluororesin, the fluororesin crystals are in a molten state and no crystals exist. However, since irradiation occurs in this state to form crosslinks, the amount of crystals is reduced and the molded body is transparent It seems to improve the performance.
• the irradiation dose for the first irradiation is preferably 50 kGy or more. When the irradiation dose is less than 50 kGy, crosslinking is insufficient, and the molded body may melt or deform when heated to a temperature atmosphere higher than the melting point of the fluororesin for the second irradiation.
• the irradiation dose of the first irradiation is preferably 1000 kGy or less. If it exceeds 1000 kGy, even if it is heated to a temperature atmosphere equal to or higher than the melting point of the fluororesin, the crystals do not melt and it is difficult to obtain a molded article with high transparency.
• the irradiation dose for the second irradiation is preferably 50 kGy or more.
• the temperature of the second irradiation is preferably a temperature that is 10 ° C. or more higher than the melting point of the fluororesin. If the temperature of the second irradiation is close to the melting point of the fluororesin, it is not possible to crosslink in a state where the crystals are sufficiently melted, resulting in insufficient reduction of the amount of crystals and insufficient improvement of transparency. is there.
• the transparent resin molded body of the present invention can be heat resistant to withstand solder reflow using lead-free solder since the resin composition constituting the molded body is crosslinked by irradiation with ionizing radiation. Specifically, even if heat exposure is performed at 280 ° C. for 60 seconds, it can have excellent heat resistance such that deformation, shrinkage, and change in transmittance (400 nm) are not observed.
• the resin composition constituting the molded body is crosslinked by irradiation with ionizing radiation, the stability to light is also improved. Specifically, even when the transparent resin molded product of the present invention is exposed to a 20 cd white LED for 100 days, a high transmittance can be maintained.
• Such a transparent resin molded body having high heat resistance and such a transparent resin molded body having high light stability are novel ones that could not be obtained by the prior art. Therefore, the present invention further provides these transparent resin moldings in the third invention and the fourth invention of the present application.
• a third invention of the present application is a molded product of a resin composition made of a fluororesin having a carbon-hydrogen bond, and has a transmittance of light of 400 nm wavelength when the thickness is 2 mm, being 85% or more, and 280 ° C.
• the transparent resin molding is characterized in that the shrinkage due to heating for 60 seconds is 3% or less in both the vertical and horizontal directions, and the transmittance after heating for 60 seconds at 280 ° C. is 85% or more. Is the body.
• a fourth invention of the present application is a molded body of a resin composition made of a fluororesin having a carbon-hydrogen bond, and has a transmittance of 85% or more at a wavelength of 400 nm when the thickness is 2 mm.
• the present invention provides a molding step for molding a resin composition comprising a fluororesin having a carbon-hydrogen bond in addition to the transparent resin molding, and a molding obtained in the molding step.
• providing a method for producing a transparent resin molded product characterized by having a second irradiation step (the fifth invention of the present application).
• the invention of this production method is based on the production method according to the first invention of the present application, and the transparent resin molded product can be produced by this method.
• the meanings of fluororesin, ionizing radiation, first irradiation, and second irradiation are the same as in the description of the first invention of the present application.
• the transparent resin molded body of the present invention is a transparent resin molded body that has both high heat resistance that can be used for solder reflow using lead-free solder and high transparency that can be used as an optical member, and is easy to produce.
• This transparent resin molded product can be easily produced by the method for producing a transparent resin molded product of the present invention.
• Electron beam irradiation conditions An acceleration electron beam with an acceleration voltage of 2000 kV was irradiated to the plate produced by the above molding at a predetermined temperature and a predetermined dose shown in Tables 1 to 3. Specifically, in the Examples, electron beam irradiation in a temperature atmosphere below the melting point of the fluororesin at the temperature and dose described in the first irradiation column of the table (hereinafter referred to as “first irradiation”). After that, the transmittance 1 was measured by the following method, and then the electron beam irradiation (hereinafter referred to as the temperature and dose in the column of the second irradiation in the table) in a temperature atmosphere equal to or higher than the melting point of the fluororesin.
• first irradiation electron beam irradiation in a temperature atmosphere below the melting point of the fluororesin at the temperature and dose described in the first irradiation column of the table
• the electron beam was not irradiated in a temperature atmosphere below the melting point of the fluororesin, but even in this case, an electron beam in an atmosphere above the melting point of the fluororesin was used.
• the irradiation is referred to as “second irradiation”.
• Temperature control was performed in a thermostatic chamber installed inside the irradiator. The temperature control can be performed by a hot plate type temperature controller that applies heat from one of the molded bodies, but a thermostatic bath type that can heat the entire atmosphere around the molded body is more preferable.
• Example 2 after the first irradiation, the second irradiation was continuously performed without measuring the transmittance 1.
• Comparative Example 1 neither the first irradiation nor the second irradiation was performed.
• the first irradiation and / or the second irradiation were performed under the conditions described in Tables 2 and 3.
• Comparative Examples 2 and 5 the second irradiation was not performed, and the comparative example In No. 3, the first irradiation was not performed.
• Transmittance 1 The sample obtained by cutting with a 10 mm ⁇ 10 mm square from the plate taken out after the first irradiation is completed, the transmittance from the ultraviolet region 200 nm to the near infrared region 1000 nm is measured, and the waveform is continuous. It was confirmed. The transmittance at 400 nm obtained by this measurement is shown in Tables 1 to 3 as transmittance 1. In Comparative Example 1 in which the electron beam irradiation was not performed and in Comparative Example 3 in which the first irradiation was not performed, the above transmittance was measured for the plate obtained by molding, and the transmittance was set to 1.
• Transmittance 2 and Transmittance 3 Transmittance after electron beam irradiation in a temperature atmosphere above the melting point of the fluororesin
• a 10 mm ⁇ 10 mm square sample was cut from the plate subjected to the second electron beam irradiation by the above method.
• the transmittance of the obtained sample from the ultraviolet region 200 nm to the near infrared region 1000 nm was measured, and it was confirmed that the waveform was continuous.
• Tables 1 to 3 show the transmittance at 400 nm obtained by this measurement as transmittance 2, and the transmittance at 850 nm as transmittance 3.
• Comparative Example 1 this measurement was performed for a plate that was not irradiated with an electron beam, in Comparative Example 2 for a plate after the first irradiation, and in Comparative Example 5 for a plate that was annealed after the first irradiation. .
• Transmittance 4 and Transmittance 5 Transmittance after heating
• Tables 1 to 3 show the transmittance at 400 nm obtained by this measurement as transmittance 4 and the transmittance at 850 nm as transmittance 5.
• Comparative Example 1 this measurement was performed for a plate that was not irradiated with an electron beam, in Comparative Example 2 for a plate after the first irradiation, and in Comparative Example 5 for a plate that was annealed after the first irradiation. .
• Transmittance 6 and Transmittance 7 Transmittance after exposure to light
• Tables 1 to 3 show the transmittance at 400 nm obtained by this measurement as transmittance 6, and the transmittance at 850 nm as transmittance 7.
• PC Polycarbonate
• Example 1 Fluorine resin EFEP (melting point: 155 to 170 ° C.) was used as the resin, and resin composition pellets were prepared and injection-molded without adding an additive (crosslinking aid). The first irradiation was performed under the conditions shown in Table 1. And the 2nd irradiation was performed and the plate for evaluation was produced, and said evaluation was implemented using this plate for evaluation. From the evaluation results shown in Table 1, the following is clear.
• Transmittance 1 shows a low value of 74%, but transmittance 2 shows 90% or more, and transmittance after heating at 280 ° C. ⁇ 60 seconds for 4 days, after exposure to white LED for 100 days The rate 6 also had a high transmittance of 85% or more. As shown by this result, high transparency, excellent heat resistance, and stability to light were confirmed for the sample (product of the present invention) after the second irradiation.
• Example 2 As in Example 1, resin composition pellets were prepared and injection molded without adding an additive (crosslinking aid), and the first irradiation and the second irradiation were performed under the conditions shown in Table 1. An evaluation plate was prepared, and the above evaluation was performed using this evaluation plate. However, unlike Example 1, the first and second irradiations were performed continuously (thus, the transmittance 1 could not be measured), and the first dose was increased compared to Example 1, while The second dose is reduced. From the evaluation results shown in Table 1, the following is clear.
• Transmittance 2 indicates 90% or more, transmittance 4 after heating at 280 ° C. for 60 seconds, and transmittance 6 after exposure to white LED for 100 days has a high transmittance of 85% or more. It was. As shown by this result, high transparency, excellent heat resistance, and stability to light were confirmed for the sample (product of the present invention) after the second irradiation.
• Examples 3-8 The resin composition pellets shown in Tables 1 and 2 were added using a fluororesin EFEP as the resin, and the resin composition pellets were produced and molded by adding the additives (crosslinking aid).
• the first time under the conditions shown in Table 1 This is a case where an evaluation plate is produced by performing the irradiation and the second irradiation, and the above evaluation is performed using this evaluation plate.
• the amount of electron beam irradiation is the same as in Example 1 for the first irradiation (less than that in Example 2), and the same as in Example 2 for the second irradiation (less than in Example 1).
• Example 4 the thickness of the molded product is 0.15 mm. In Example 5, the thickness of the molded product is 8 mm. In Examples 3, 6, and 7, the same 2 mm as in Examples 1 and 2, and in Example 8, the molding is performed. The thickness of the product was 0.5 mm. Therefore, the molding was performed by press molding in Example 4, injection molding in Examples 3, 5, 6, and 7, and extrusion molding in Example 8.
• Example 6 is a case performed under the same conditions as Example 3 except that the amount of additive 1 was increased.
• Example 7 is a case where it carried out on the conditions similar to Example 3 except having used the additive 2 instead of the additive 1.
• Example 9 An evaluation plate was prepared in the same manner as in Example 3 except that a fluororesin ETFE (melting point: 265 ° C.) was used as the resin, and the temperature of the second irradiation was set to 300 ° C. Evaluation was performed. The evaluation results are shown in Table 2.
• the transmittance 2, the transmittance 4 after heating at 280 ° C. for 60 seconds, and the transmittance 6 after the white LED exposure for 100 days all show 85% or more. From this result Even when the resin was replaced with ETFE, high transparency, excellent heat resistance, and stability to light were confirmed.
• Comparative Example 1 An evaluation plate was produced in the same manner as in Example 1 except that neither the first irradiation nor the second irradiation was performed, and the above evaluation was performed using this evaluation plate. The evaluation results are shown in Table 2.
• the transmittance 6 and the transmittance 7 after exposure to the white LED for 100 days are lower than the transmittance 2 and the transmittance 3 before the exposure, respectively, and it is determined that the stability to light is not sufficient.
• Comparative Example 2 An evaluation plate was prepared in the same manner as in Example 3 except that only the first irradiation was performed and the second irradiation was not performed, and the above evaluation was performed using this evaluation plate. The results are shown in Table 2.
• Comparative Example 3 An evaluation plate was produced in the same manner as in Example 3, except that the transmittance 1 was measured without performing the first irradiation and only the second irradiation was performed. Since irradiation is not performed in a temperature atmosphere below the melting point of the fluororesin, crosslinking is not performed at this stage. Therefore, melting occurs when the temperature atmosphere exceeds the melting point, and electron beam irradiation is performed in this molten state. As a result of being cross-linked, the shape as a molded body could not be maintained. Therefore, it was not possible to measure the transmittances 2 and 3, evaluate the heat resistance, and evaluate the light stability.
• Comparative Example 4 An evaluation plate was prepared under the same conditions as in Example 1 (the first irradiation dose was 100 kGy) except that the first irradiation dose was 1500 kGy, and the above evaluation was performed using this evaluation plate. The evaluation results are shown in Table 3.
• Comparative Example 5 Evaluation was performed in the same manner as in Example 3 except that the second irradiation was not performed, the first irradiation was performed and the transmittance 1 was measured, and then the annealing treatment was performed in a temperature atmosphere of 220 ° C. above the melting point. An evaluation plate was prepared, and the above evaluation was performed using this evaluation plate. The evaluation results are shown in Table 3.
• Comparative Example 6 Evaluation was performed under the same conditions as in Example 3 except that FEP (melting point: 255 ° C.) having no carbon-hydrogen bond was used as the resin instead of EFEP, and the temperature of the second irradiation was set to 300 ° C. An evaluation plate was prepared, and the above evaluation was performed using this evaluation plate. The evaluation results are shown in Table 3. Decomposition progressed more than cross-linking due to electron beam irradiation, and the molded body was brittle and difficult to maintain its shape (shown as “Battery” in the “Color / Shape” column of Table 3). Therefore, this result shows that even a fluororesin cannot use FEP having no carbon-hydrogen bond.
• Comparative Example 7 A general-purpose PC was used as the resin instead of EFEP, and an evaluation plate was produced under the same conditions as in Example 3 except that the temperature of the second irradiation was 250 ° C. (above the PC softening point). Then, the above evaluation was performed using this evaluation plate, and the evaluation results are shown in Table 3. It is judged that the use as a transparent member is difficult because the green color is seen by irradiation. Furthermore, since crosslinking was insufficient, melting was observed during the second irradiation, indicating that the effect of the present invention could not be obtained with a general-purpose PC.
• the transparent resin molding of the present invention has both high stability against heat and light and high transparency. Therefore, it can be suitably used as an optical member such as an optical lens or an optical film, and has high heat resistance, so that it can be mounted on a circuit board or the like by solder reflow using lead-free solder.

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