WO2011010729A1 - 基板の貼合せ装置、基板の貼合せ方法、及び、基板貼合せヘッド - Google Patents

基板の貼合せ装置、基板の貼合せ方法、及び、基板貼合せヘッド Download PDF

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Publication number
WO2011010729A1
WO2011010729A1 PCT/JP2010/062453 JP2010062453W WO2011010729A1 WO 2011010729 A1 WO2011010729 A1 WO 2011010729A1 JP 2010062453 W JP2010062453 W JP 2010062453W WO 2011010729 A1 WO2011010729 A1 WO 2011010729A1
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WIPO (PCT)
Prior art keywords
substrate
holding
curable resin
head
substrates
Prior art date
Application number
PCT/JP2010/062453
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
寺田勝美
Original Assignee
東レエンジニアリング株式会社
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Publication date
Application filed by 東レエンジニアリング株式会社 filed Critical 東レエンジニアリング株式会社
Priority to CN201080032985.6A priority Critical patent/CN102474991B/zh
Priority to KR1020127004711A priority patent/KR101726899B1/ko
Publication of WO2011010729A1 publication Critical patent/WO2011010729A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
    • H03K3/36—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of semiconductors, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Definitions

  • the present invention relates to a substrate bonding apparatus and method for bonding substrates having wiring electrode patterns formed on surfaces using a curable resin.
  • the semiconductor chip and substrate are increased in size and area, and a substrate having a relatively large area is mounted on the substrate. It has become to.
  • Bonding of substrates with a curable resin is an effective technique for solving the problem that the warpage of individual substrates varies depending on the temperature change, and can prevent product failure.
  • an apparatus or a method for pasting by applying a curable resin to a joint portion or its periphery and pressing the substrate is conventionally used.
  • voids air bubbles
  • the void that has been mixed is surrounded by a curable resin having a high viscosity, it is difficult to completely remove the void even when the substrate is pressed.
  • curable resin is fluid at room temperature, but is thermosetting resin that cures by heating, and maintains fluidity before being irradiated with light such as ultraviolet rays, but is irradiated with light such as ultraviolet rays. It means a resin having a property of being cured by a physical change or chemical reaction, although initially containing fluidity, including an ultraviolet curable resin or a photocurable resin that is cured by the above-described method.
  • the electrode and the nitrogen, oxygen, moisture, impurities, etc. contained in the void cause a chemical reaction, which causes the electrode to corrode.
  • the substrate material and the void portion have different coefficients of thermal expansion, and thus the degree of deformation of the substrate differs.
  • the difference in the degree of deformation of the substrate due to the temperature change causes stress on the wiring electrode pattern on the substrate and the bonding surface between the substrates. When the stress occurs, it leads to product failure such as tearing or breaking of the wiring or peeling of the joint surface.
  • Patent Document 1 a method is disclosed in which a protective substrate is bonded to an organic EL element forming substrate with a curable resin using a plurality of retainers. According to this method, it is possible to perform bonding in which bubbles are not easily generated, and the film thickness of the curable resin becomes uniform at a predetermined thickness.
  • Patent Document 2 a method of manufacturing an EL display device is disclosed in which a substrate is warped in a convex shape and brought into contact with a resin adhesive, and is gradually returned to a flat shape from the top of the convex surface toward an outer peripheral region, and the substrate is bonded. Yes. According to this method, the entire surface can be bonded without entraining bubbles.
  • JP 2005-317273 A Japanese Patent Laid-Open No. 11-283737
  • the curable resin that is an insulating material remains between the opposing wiring electrode patterns, which prevents current from flowing between the opposing electrodes and prevents the product from operating normally. Increases nature. Therefore, when the substrates having undulations on the surfaces are bonded to each other, it is necessary to perform the bonding while appropriately removing the curable resin while preventing the entry of voids.
  • an object of the present invention is to prevent the entry of voids while minimizing the coating amount of the curable resin, and to oppose the wiring electrode pattern facing the entire substrate having a relatively large area on which the wiring electrode pattern is formed.
  • An object of the present invention is to provide an apparatus and a method for bonding together by increasing the contact area between each other.
  • the invention described in claim 1 In the apparatus for laminating the first substrate having the wiring electrode pattern formed on the surface and the second substrate having the wiring electrode pattern on the surface with the electrode wiring patterns facing each other, Means for holding the second substrate; Means for bending in a state of holding the second substrate; A curable resin is applied to at least one of the first substrate or the second substrate, Means for bringing the first substrate and the second substrate close to each other; A substrate laminating apparatus comprising: means for pressing the second substrate toward the first substrate.
  • the invention described in claim 2 Means for holding the second substrate and means for bending the second substrate; Provided in the means for pressing the second substrate toward the first substrate; 2.
  • the invention according to claim 3 The substrate bonding apparatus according to claim 1 or 2, wherein the curable resin is cured in a state where the second substrate is pressed against the first substrate.
  • the invention according to claim 4 In the method of laminating the first substrate having the wiring electrode pattern on the surface and the second substrate having the wiring electrode pattern on the surface with the electrode wiring patterns facing each other, Holding the second substrate; Bending the second substrate while holding it, A curable resin is applied to at least one of the first substrate or the second substrate, Bringing the first substrate and the second substrate close to each other; Bonding the second substrate and the first substrate while matching the second substrate to the surface shape of the first substrate; A method for bonding substrates, comprising the step of pressing the second substrate toward the first substrate.
  • the invention described in claim 5 The substrate bonding method according to claim 4, further comprising a step of curing the curable resin in a state where the second substrate is pressed against the first substrate.
  • a substrate laminating head comprising a housing of a container structure, and at least one surface is an elastic body, Means for holding the second substrate using the surface of the elastic body;
  • a substrate laminating head comprising: means for deforming a surface for holding the second substrate and bending the second substrate.
  • the invention described in claim 7 Means for deforming a surface holding the second substrate;
  • the invention according to claim 8 provides: Means for adjusting the pressure inside the housing, 7.
  • the invention according to claim 9 is: When the second substrate is pressed against the first substrate, the second substrate is made to conform to the surface shape of the first substrate so that an equal load can be applied to the second substrate.
  • the substrates having wiring electrode patterns on the surfaces are bonded to each other via a curable resin, thereby preventing the entry of voids and opposing wiring on the entire surface of the substrate. It is possible to increase the contact area between the electrode patterns. As a result, the reliability with respect to the continuity of the wiring is improved, and the product failure due to the continuity failure can be prevented.
  • FIG. 1 It is a perspective view which shows an example of embodiment of this invention. It is a front view of the main component apparatus which shows an example of embodiment of this invention. It is a system configuration figure showing an example of an embodiment of the present invention. It is a flowchart which shows the procedure of the board
  • FIG. 1 is a perspective view showing an example of an embodiment of the present invention.
  • FIG. 2 is a front view of main components showing an example of the embodiment of the present invention.
  • the three axes of the orthogonal coordinate system are X, Y, and Z
  • the XY plane is the horizontal plane
  • the Z direction is the vertical direction.
  • the direction of the arrow is represented as the top
  • the opposite direction is represented as the bottom.
  • the substrate bonding apparatus 1 includes a stage unit 2, a head unit 3, a tray transport unit 4, a coating unit unit 5, a curing unit unit 6, a balloon head unit 7, and a control unit 9. ,It is configured.
  • the stage unit 2 includes an X1 axis stage 21 attached on the apparatus base 20 of the substrate bonding apparatus 1 and a first substrate placement table 22 attached on the X1 axis stage 21. ,It is configured.
  • the X1-axis stage 1 can move the first substrate mounting table 22 in the X direction.
  • a carrier 60 for placing the first substrate 11 can be placed on the first substrate placement table 22.
  • the carrier 60 is a member of a frame body or a dish structure used for handling the first substrate 11.
  • the carrier 60 has various forms such as one case for one first substrate 11 and one case for a plurality of first substrates 11, and the size and dimensions can be changed without changing the external dimensions. It has the role which can handle different 1st board
  • the carrier 60 is placed on the first substrate placement table 22 and is held so that the position does not shift even when an external force is applied.
  • a flat surface is brought into contact with each other, a groove or a hole is previously provided in the contacted portion, and the groove or the hole is communicated with a vacuum source so that the portion is negatively adsorbed.
  • the substrate mounting table 22 is provided with grooves, holes, and protrusions in advance, and the corresponding protrusions, grooves, and holes of the carrier 60 are fitted into the substrate mounting table 22 and held by negative pressure adsorption after the fitting. There are various forms.
  • the first substrate 11 can be mounted on the substrate mounting table using the carrier 60 and moved in the X direction.
  • the head unit 3 is a head mounted on a Y1 axis stage 33 and a Y1 axis stage 33 mounted on a gate-shaped structure composed of a column 31 and a beam 32 mounted on the apparatus base 20.
  • a vertical movement mechanism 34, a ⁇ -axis motor 36 attached on the head vertical movement mechanism 34, and a balloon head portion 7 attached on the ⁇ -axis motor 36 are included.
  • the Y1-axis stage 33 is capable of moving the head vertical movement mechanism 34 placed thereon in the Y direction. Further, the head vertical movement mechanism 34 is equipped with a motor 35, and the ⁇ -axis motor 36 and the balloon head portion 7 can be moved in the Z direction.
  • the ⁇ -axis motor 36 can rotate the balloon head portion 7 in the ⁇ direction.
  • the tray transfer unit 4 is mounted on the apparatus base 40, the X2 axis stage 41 mounted on the apparatus base 40, the second substrate mounting table 42 mounted on the X2 axis stage 41, and the apparatus base 40.
  • the X2-axis stage 41 can move the second substrate mounting table 42 in the X direction.
  • the Y2 axis stage 45 can move the Z2 axis stage 46 in the Y direction.
  • the Z2-axis stage 46 can move the hand unit 47 in the Z direction.
  • a tray 48 for arranging the second substrates 12 side by side can be placed on the second substrate placement table 42.
  • the tray 48 has a structure that can be handled at a time by arranging a plurality of second substrates 12 and overlapping the trays 48 several times.
  • the tray 48 is placed on the second substrate placement table 42 and is held so that the position does not shift even when an external force is applied.
  • a flat surface is brought into contact with each other, a groove or a hole is previously provided in a contacted portion, and the groove or the hole is communicated with a vacuum source so that the portion is negatively adsorbed.
  • the substrate mounting table 42 is provided with grooves, holes, and protrusions in advance, and the corresponding protrusions, grooves, and holes of the tray 48 are fitted into the substrate mounting table 42, and held by negative pressure adsorption after the fitting. There are various forms.
  • the second substrate 12 is placed on the substrate placement table using the tray 48 and moved in the X direction, and the hand unit 47 is moved to the Y direction. And the second substrate 12 can be picked up.
  • a temporary placement table 26 is installed on the apparatus base 20, and the second substrate 12 picked up by the hand unit 47 of the tray transport unit 4 can be temporarily placed.
  • the temporary placement table 26 is arranged so that the temporarily placed second substrate 12 a can be picked up at the tip of the balloon head portion 7.
  • the upper surface of the temporary table 26 is substantially flat, and a large number of holes and grooves are provided on the surface. Since the holes and grooves communicate with a vacuum source through a valve, the temporarily placed second substrate 12a can be adsorbed and held at a negative pressure. Since the temporarily placed second substrate 12a is sucked and held at a negative pressure, the second substrate 12a slides down from the upper surface of the temporary placing table 26 when being transferred by the hand 47 or while being placed on the temporary placing table 26. There is nothing.
  • the coating unit unit 5 includes a Z-axis stage 51 provided in parallel on the Y1-axis stage 33 of the head unit 3, and a dispenser 53 attached on the Z-axis stage 51.
  • a motor 52 is mounted on the Z-axis stage 51, and the dispenser 53 has a structure that can move in the Z direction. Since the Z-axis stage 51 can be moved in the Y direction, the dispenser 53 can be moved to any position in the Y direction and the Z direction.
  • the dispenser 53 includes a syringe that fills the curable resin 55, a piston portion that pushes out the filled curable resin 55, and a needle portion that applies the curable resin 55 to a predetermined position on the first substrate 11. It consists of
  • Examples of the curable resin 55 include resins such as epoxy, phenol, melamine, polyester, polyurethane, and polyimide, and those obtained by adding a curing agent to the resin.
  • the application conditions such as the components, viscosity, and application amount of the curable resin 55 are appropriately set according to the desired strength after curing and the area of the second substrate 12 to be bonded.
  • the curable resin 55 in the syringe runs out, refill as appropriate.
  • the valve of the liquid feed line is switched, and the replenishment is performed by supplying pressure and pressure to prevent the generation of voids in the syringe.
  • the curable resin 55 to be applied generation of voids after application can be prevented.
  • the head unit 3 and the coating unit unit 5 are arranged side by side on the Y1-axis stage 33. However, a stage that can move in the Y direction is provided, and the coating unit unit 5 is mounted on the stage.
  • the head unit 3 and the coating unit unit 5 may be mounted on different Y-direction moving units.
  • the coating unit unit 5 may be attached to the head unit 3 so that the head unit 3 and the coating unit unit 5 move integrally in the Y direction.
  • the control unit 9 includes an information input unit 91, an information output unit 92, and a reporting unit 93, and has a structure capable of exchanging information with the outside.
  • FIG. 2 is a front view of main devices according to the embodiment of the present invention.
  • the curing unit 6 is disposed below the first substrate placement table 22 and on the X1-axis stage 21.
  • Examples of the curing unit 6 may radiate light including a predetermined wavelength, such as an ultraviolet irradiation unit for irradiating ultraviolet rays such as a UV lamp and an infrared irradiation unit for irradiating infrared rays such as an infrared heater.
  • the cured resin 55 absorbs the light irradiated from the curing unit 6 and the curing starts.
  • the substrate bonding apparatus 1 Since the substrate bonding apparatus 1 has the above-described structure, the second substrate 12b held at the tip of the balloon head portion 7 in the head portion 3 is bonded to the first substrate 11, and further Can press the second substrate 12b toward the first substrate 11 and irradiate it with ultraviolet rays or heat it in order to cure the curable resin.
  • the detailed structure of the balloon head unit 7 will be described later.
  • the first substrate mounting table 22 is structured to include a frame body with a central portion cut out. Therefore, the portion where the second substrate 12 is bonded onto the first substrate 11 has a structure in which the energy 61 irradiated from the curing unit 6 is transmitted and irradiated.
  • the hollowed-out portion is not limited to a simple space, but may be used in combination with a lattice-like or mesh reinforcing member that can substantially transmit the energy 61, a transparent material, or the like.
  • Examples of the carrier 60 include a structure in which an outer frame and a transparent glass material are combined inside thereof, and a structure in which an outer frame and a lattice-like member are combined inside.
  • the carrier 60 takes various forms depending on the size and thickness of the first substrate 11 and the layout to which the second substrate is attached, but generates a sufficient reaction force against the pressure from the head unit 3. Any material or structure that transmits the energy 61 irradiated from the curing unit 6 may be used.
  • a control computer 90 information input means 91, information output means 92, reporting means 93, information recording means 94, and device control unit 95 are connected to the control unit 9.
  • information input means 91 information input means 91
  • information output means 92 information output means 92
  • reporting means 93 information recording means 94
  • device control unit 95 device control unit 95
  • Examples of the control computer 90 include those equipped with a numerical operation unit such as a microcomputer, a personal computer, and a workstation.
  • Examples of the information input unit 91 include a keyboard, a mouse, and a switch.
  • Examples of the information output means 92 include an image display display and a lamp.
  • Examples of the reporting means 93 include those that can alert the operator, such as a buzzer, a speaker, and a lamp.
  • Examples of the information recording means 94 include semiconductor recording media, magnetic recording media, magneto-optical recording media, such as memory cards and data disks.
  • Examples of the device control unit 95 include devices called programmable controllers and motion controllers.
  • the equipment control unit 95 includes an X1-axis stage 21, a Y1-axis stage 33, a Z1-axis stage, a ⁇ -axis motor 36, an X2-axis stage 41, a Y2-axis stage 45, a Z2-axis stage 46, and a control amplifier. (Not shown).
  • the device control unit 95 can operate or stop each device by giving a control signal to the control amplifier of each connected device.
  • set application conditions can be registered in the information recording means 94 connected to the control computer 90, and can be read out, edited and changed as appropriate.
  • FIG. 4 is a flowchart showing a procedure for bonding the substrates for each step.
  • the first substrate 11 is placed on the substrate carrier 60 (s101), the substrate carrier 60 is placed on the first substrate placement table 22 (s102), and the substrate carrier 60 is held by vacuum suction (s102). s103).
  • an alignment mark (not shown) on the first substrate 11 is read by an observation camera (not shown) (s104), and position information of the alignment mark on the first substrate 11 is acquired.
  • the acquired positional information of the alignment mark on the first substrate 11 is transmitted to the control computer 90 of the control unit 9 and the position of the first substrate 11 placed on the substrate placement table 22 Used to calculate and determine the attitude.
  • the first substrate 11 is moved to the resin application position (s105), and a predetermined amount of curable resin is applied (s106). ).
  • the first substrate 11 coated with a predetermined amount of the curable resin 55 is moved to a pre-registered bonding position (s107).
  • a predetermined number of second substrates 12 are placed on the tray 48 (s111), the tray 48 is placed on the second substrate placement table 42 (s112), and the tray 48 is vacuum-sucked and held. (S113).
  • the second substrate 12 is picked up by the transfer hand 47 of the tray transport unit 4 (s114), and the second substrate 12 is placed on the temporary placement table 26 (s115).
  • the head part 3 of the stage part 2 is moved, and the second substrate 12a temporarily placed on the temporary placement table 26 is held at the tip of the balloon head part 7 of the head part 3 (s116).
  • An alignment mark (not shown) on the surface of the second substrate 12b held by the balloon head unit 7 is read by an observation camera (not shown) (s117), and is on the second substrate 12b. Acquires alignment mark position information.
  • the acquired position information of the alignment mark is transmitted to the control computer 90 of the control unit 9 to calculate and obtain the position and orientation of the first substrate 11 placed on the substrate placement table 22. Used for.
  • the second substrate 12b is moved to a pre-registered bonding position (s118). At this time, the first substrate 11 and the second substrate 12b face each other in contact with the wiring electrode patterns in a state where the alignment is completed.
  • the second substrate 12b held at the tip of the balloon head portion 7 is bent (s121).
  • the mechanism and flow for bending the second substrate 12b will be disclosed in the detailed description of the balloon head section 7 to be described later.
  • the second substrate 12b is lowered downward in the Z direction (s122), and is brought into contact with the curable resin 55 applied on the first substrate 11 (s123).
  • the second substrate 12b is lowered downward in the Z direction (s124), and is made to be the same as the first substrate 11 (s125).
  • a mechanism and a flow for making the second substrate 12b similar to the first substrate 11 will be disclosed in the detailed description of the balloon head section 7 to be described later.
  • the second substrate 12b is pushed toward the first substrate 11 (s126), and the entire surface of the second substrate 12b is pressed and irradiated with ultraviolet rays for a predetermined time (s127) to cure the curable resin 55.
  • the suction holding of the second substrate 12b is released, and the head unit 3 is raised (s128).
  • next second substrate is picked up from the tray 48 in the same manner as described above in order to attach the next second substrate to the next bonding position set on the first substrate 11. Then, it is placed on the temporary placement table 26. Subsequently, the operation of picking up the next second substrate temporarily placed on the temporary placement table 26, reading the alignment marks, aligning them, and attaching them to the first substrate is repeated.
  • the first substrate 11 is removed from the first substrate mounting table 22 together with the carrier 60. Thereafter, the first substrate placed on the next carrier to which the second substrate has not yet been attached is placed on the first substrate placement table 22.
  • the first substrate 11 on which a predetermined number of second substrates are bonded is taken out of the substrate bonding apparatus 1 together with the carrier 60.
  • the first substrate taken out is removed from the carrier 60 and carried to the next step.
  • the tray 48 in which the second substrate 12 is stored becomes empty when a predetermined number of second substrates are picked up. Therefore, the empty tray is removed from the apparatus, and the next tray in which the second substrate 12 is stored. Replenish.
  • FIGS. 5A to 5E are cross-sectional views showing the internal configuration of the balloon head section 7 and how the substrates are bonded.
  • FIG. 5A is a view showing a state in which the second substrate 12 b is held at the tip of the balloon head portion 7.
  • the balloon head unit 7 has a box or cylindrical container structure, and has a casing 70 in which at least one surface thereof is opened, a substrate deformation mechanism unit 71 disposed inside the casing 70, and a casing 70. And a substrate holding film 72 attached so as to close the opening.
  • the substrate holding film 72 As the substrate holding film 72, a stretchable elastic material such as rubber or soft resin, or an elastic body that is stretchable in a three-dimensional direction such as a combination of a metal material and the elastic material is used.
  • the substrate holding film 72 can be implemented even when it is the same as or smaller than the plan view size of the second substrate 12b, but is preferably larger than the plan view size of the second substrate 12b. Then, even if the temporarily placed second substrate 12 a is placed on the temporary placement table 26, the entire surface of the second substrate 12 b is covered with the substrate holding film 72.
  • the substrate holding film 72 is provided with a substrate holding film communication port 721 for sucking and holding the second substrate 12b, and is connected to a suction means (not shown) outside the balloon head portion 7 via a switching valve. Connected.
  • the air chamber 73 of the balloon head unit 7 communicates with an external pressure adjusting means (not shown) through an air chamber communication port 731 provided in the housing 70.
  • the pressure adjusting means appropriately includes a pressure supply means outside the apparatus, a pressure reducing means, and a switching valve means connected to the outside air.
  • the substrate deformation mechanism 71 includes a cylinder 711, a piston 712, a pressing head 713 attached to the piston, a piston pushing side communication port 714 and a piston pulling side port 715 communicating with the cylinder 711. Yes.
  • the piston push side communication port 714 and the piston pull side port 715 are each in communication with an external pressure adjusting means (not shown).
  • the pressure adjusting means appropriately includes a pressure supply means outside the apparatus, a pressure reducing means, and a switching valve means connected to the outside air.
  • the substrate holding film 72 has a structure that is deformed when pressed downward in the Z direction by the substrate deformation mechanism 71. Therefore, the second substrate 12b held at the tip of the balloon head portion 7 can be bent.
  • the above operation corresponds to the step (s121) of bending the second substrate 12b held at the tip of the balloon head portion 7 described above.
  • FIG. 5B is a diagram showing a state in which the second substrate 12b held by the balloon head unit 7 is bent.
  • the pressure in the air chamber 73 is the same as that of the outside air because the air chamber communication port 731 communicates with the outside air.
  • the piston pulling side communication port 715 is communicated with the outside air, and the piston pushing side communication port 714 is pressurized to a predetermined pressure (for example, 0.3 MPa).
  • the piston 712 and the pressing head 713 connected to the piston 712 move downward in the Z direction and become stationary.
  • the substrate holding film 72 is deformed when the piston 712 is pushed down, and at the same time, the holding second substrate 12 is bent.
  • the deformation stops and the equilibrium state is obtained.
  • the air chamber communication port 731 is closed and the air chamber is sealed.
  • air pressurized to a predetermined pressure for example, 0.2 MPa
  • a predetermined pressure for example, 0.2 MPa
  • the air chamber 73 is a space sealed by the housing 70 and the substrate holding film 72, and when a pressurized fluid is sent to the air chamber communication port 731, the pressure inside the air chamber 73 is changed to the outside air.
  • the substrate holding film 72 is deformed so as to swell outward. In a state where the pressure in the air chamber 73 is balanced with the tension generated inside the elastic body when the elastic body is deformed, the deformation of the substrate holding film 72 is stopped and an equilibrium state is obtained.
  • FIG. 5C is a diagram showing a state where the deformed second substrate 12 and the curable resin 55 applied on the first substrate 11 are in contact with each other.
  • FIG. 5D is a diagram showing a state where the deformed second substrate 12 and the first substrate 11 are in contact with each other.
  • the curable resin 55 applied on the first substrate 11 is spread to the periphery and penetrates into the slight uneven gap between the first substrate 11 and the second substrate 12. It is thinly spread and applied.
  • the wiring electrode patterns facing each other on the first substrate 11 and the second twelfth substrate are in contact with each other, and mixing of voids is prevented.
  • the head portion 3 is lowered so that the peripheral portion of the second substrate 12 is in contact with the first substrate 11.
  • the curable resin 55 reaches the outside of the peripheral portion of the second substrate 12, and the second substrate 12 is pushed toward the first substrate 11 to close a slight gap between the substrates. .
  • the operation corresponds to the step (s125) in which the second substrate 12 is made to be the first substrate 11 described above.
  • the air chamber 73 is in a sealed state, the internal pressure is high, and the second substrate holding film 72 is an elastic body having a size in plan view larger than that of the second substrate 12 and is thus held. A uniform force is applied to the entire surface of the second substrate 12.
  • air pressurized to a predetermined pressure for example, 0.4 MPa
  • a predetermined pressure for example, 0.4 MPa
  • FIG. 5E is a diagram showing a state in which the curable resin 55 is cured in a state where the second substrate 12 is pushed toward the first substrate 11.
  • Ultraviolet rays 61 are irradiated from the ultraviolet irradiation unit 6 for a predetermined time.
  • the ultraviolet ray 91 is irradiated from the ultraviolet ray irradiation unit 90 for a predetermined time (for example, 5 seconds).
  • the energy intensity and irradiation time of the ultraviolet ray 91 to be irradiated may be appropriately adjusted according to the curing characteristics of the applied curable resin 55.
  • the piston push-side communication port 714 is opened to the atmosphere, pressurized air is sent to the piston pull-side communication port 715, and the piston 712 moves upward in the Z direction (that is, ascends). )
  • the substrate holding film communication port 721 is opened to the atmosphere, and optionally compressed air is sent to release the adsorption holding of the substrate.
  • the air chamber communication port 731 is opened to the atmosphere, the pressurized state of the air chamber 731 is released, and the balloon head portion 7 is raised.
  • the balloon head portion 7 is formed of a container-structured housing, and has a structure as a substrate bonding head in which at least one surface is an elastic body. Therefore, after the second substrate 12 is bent, the second substrate 12 is bonded to the first substrate 11 to conform to the surface shape, and an equal load can be applied. Therefore, when the second substrate 12 is bonded to the first substrate 11, it is possible to prevent the entry of voids.
  • the balloon head unit 7 has a structure in which the second substrate 12 can be continuously deformed and pressed by a single head, the substrates can be bonded together in a short time. Become. As a result, the production quantity per unit time can be increased.
  • the wiring electrode pattern of the first substrate 11 and the second substrate 12 facing each other. Increases contact area. Thereafter, by curing the curable resin, the adhesion between the first substrate and the second substrate is maintained, and the contact area of the wiring electrode pattern is also maintained. As a result, the reliability with respect to conduction is further improved.
  • the adhesion between the first substrate and the second substrate is improved. Further increase.
  • the adhesiveness between the first substrate and the second substrate is further increased after curing. Thereby, the contact area of the wiring electrode pattern which the 1st board
  • the second substrate 12 is lowered downward in the Z direction, and the lowering is stopped immediately before contacting the first substrate 11, and then the second substrate is stopped. 12 may be bent and brought into contact with the curable resin 55 applied on the substrate 11 at the first position.
  • the force that pushes down the piston 712, the reaction force inside the substrate holding film 72, the reaction force against the bending of the second substrate 12, and the reaction force from the first substrate 11 are balanced to provide a stable equilibrium state. I can make it.
  • the time for which the ultraviolet rays are applied while the entire surface of the second substrate 12 is pressed takes the time necessary for the curable resin to be completely cured.
  • the time necessary for temporary curing to such an extent that the electrode wiring patterns of the first substrate 11 and the second substrate 12 are not separated For example, ultraviolet rays or heating may be performed only for 5 seconds, and then the substrate may be taken out and completely cured for a predetermined time (for example, 1 hour) using another apparatus.
  • the time for bonding the substrates using the apparatus and method of the present invention can be shortened. By doing so, the quantity that can be produced per unit time can be increased.
  • the substrate deformation mechanism portion 71 is omitted, the pressure of the air chamber 73 is adjusted, the substrate holding film 72 is deformed, and the held second substrate 12b is bent.
  • An example is the structure. With this structure, the second substrate 12b can be bent and bonded to the first substrate 11 even if the substrate deformation mechanism portion 71 is omitted. Therefore, it is possible to bond the substrates with a simple structure, and it is possible to prevent a void from being mixed during the bonding.
  • the method of irradiating ultraviolet rays using a material curable by ultraviolet rays and the method of heating using a material curable by heating are mainly described.
  • a method of heating and cooling using a material that softens and cures by cooling, a method of humidifying using a material that cures by humidification, a method of drying using a material that cures by drying, or a combination of each It is also possible to implement.
  • Materials that can be cured by ultraviolet rays are those that have the property of undergoing polymerization when irradiated with ultraviolet rays to form a polymer network structure that cannot be restored to the original state.
  • Epoxy resins, polythiol resins, unsaturated polyester resins, urethanes Resin etc. can be illustrated.
  • a material that cures by heating As a material that cures by heating, it has the property that when heated, it will polymerize to form a polymer network, and will not cure and return to its original state, such as phenol resin, epoxy resin, melamine resin, urea resin, unsaturated Examples include polyester resin, alkyd resin, urethane resin, thermosetting polyimide, and the like.
  • Materials that are softened by heating and hardened by cooling have the property of being softened by heating to the melting point and then solidifying by cooling.
  • the material that is cured by humidification has a property of absorbing and curing moisture, and examples thereof include silicon resin.
  • Examples of materials that are cured by drying include materials that solidify when moisture in the materials is released to the outside, and materials that are naturally dried can be exemplified.
  • a material that can be cured by forcibly applying energy such as microwaves or X-rays from the outside can also be used as the curable resin 55.
  • the X1-axis stage 21 and the first substrate placement are arranged.
  • a means for changing the angle of the first substrate mounting table 22 in the ⁇ direction may be added between the mounting table 22 and the mounting table 22. In this case, the position of the alignment mark on the first substrate 11 is read, the ⁇ direction of the first substrate mounting table 22 is adjusted, and the first substrate 11 can be aligned in a predetermined direction.
  • the carrier 60 is used for explanation, but the first substrate 11 has a strength capable of generating a sufficient reaction force against the pressurization from the head portion 3, and the first substrate 11
  • the carrier 60 may not be used as long as it can be directly placed on the substrate placement table 22.
  • the sheet may be extended on the carrier 60 or the substrate mounting table 22 and held flat.
  • it can be regarded as a substrate and the second substrate 12 can be attached using the present invention.
  • the present invention can be used when a substrate having a wiring electrode pattern formed on the surface thereof is mounted on a substrate having a wiring electrode pattern formed on the surface.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Wire Bonding (AREA)
PCT/JP2010/062453 2009-07-24 2010-07-23 基板の貼合せ装置、基板の貼合せ方法、及び、基板貼合せヘッド WO2011010729A1 (ja)

Priority Applications (2)

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CN201080032985.6A CN102474991B (zh) 2009-07-24 2010-07-23 基板粘合装置、基板粘合方法及基板粘合头
KR1020127004711A KR101726899B1 (ko) 2009-07-24 2010-07-23 기판의 접합 장치, 기판의 접합 방법 및 기판 접합 헤드

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JP2009173003A JP5314523B2 (ja) 2009-07-24 2009-07-24 基板の貼合せ装置及び方法、並びに、基板貼合せヘッド

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Cited By (1)

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KR101367668B1 (ko) * 2011-11-23 2014-02-28 엘아이지에이디피 주식회사 기판 합착 장치 및 기판 합착 방법

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JP6188123B2 (ja) 2012-12-28 2017-08-30 芝浦メカトロニクス株式会社 貼合装置および貼合処理方法
CN108664171A (zh) * 2018-05-22 2018-10-16 新辉开科技（深圳）有限公司 一种塑料盖板与玻璃贴合的方法
CN109633945A (zh) * 2019-01-21 2019-04-16 信利半导体有限公司 一种显示模组的全贴合方法
CN112670215B (zh) * 2020-12-31 2023-06-20 北京中电科电子装备有限公司 用于晶圆键合和解键合的装置及晶圆键合和解键合方法
TWI823702B (zh) * 2022-12-05 2023-11-21 斯託克精密科技股份有限公司 用以頂推電子基板之裝置

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JP4300476B2 (ja) * 2004-04-27 2009-07-22 セイコーエプソン株式会社 有機ｅｌ装置の製造方法

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JPH0929918A (ja) * 1995-07-14 1997-02-04 Matsushita Electric Works Ltd 積層板製造用の積層物の積載装置
JPH11214842A (ja) * 1998-01-26 1999-08-06 Matsushita Electric Works Ltd 多層板の製造方法
JP2004273980A (ja) * 2003-03-12 2004-09-30 Canon Inc 基板間配線電極接合の方法及び構造体
JP2004296139A (ja) * 2003-03-25 2004-10-21 Sony Corp 貼合装置および貼合方法、ならびに表示装置の製造方法
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JP5314523B2 (ja) 2013-10-16
TWI494220B (zh) 2015-08-01
JP2011029368A (ja) 2011-02-10
KR20120037500A (ko) 2012-04-19
CN102474991B (zh) 2015-07-08
TW201107138A (en) 2011-03-01
CN102474991A (zh) 2012-05-23
KR101726899B1 (ko) 2017-04-13

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