WO2011001550A1 - 機能膜付粘着テープおよび機能膜の転写方法 - Google Patents
機能膜付粘着テープおよび機能膜の転写方法 Download PDFInfo
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- WO2011001550A1 WO2011001550A1 PCT/JP2009/068385 JP2009068385W WO2011001550A1 WO 2011001550 A1 WO2011001550 A1 WO 2011001550A1 JP 2009068385 W JP2009068385 W JP 2009068385W WO 2011001550 A1 WO2011001550 A1 WO 2011001550A1
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- functional film
- adhesive layer
- pressure
- sensitive adhesive
- adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
- B32B37/025—Transfer laminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
- B32B37/065—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method resulting in the laminate being partially bonded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/201—Adhesives in the form of films or foils characterised by their carriers characterised by the release coating composition on the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
Definitions
- the present invention relates to a pressure-sensitive adhesive tape having a functional film such as an inorganic sealing film and a method for transferring the functional film.
- a sealing film made of an organic material is inferior in gas barrier properties to a sealing film made of an inorganic material such as glass (inorganic sealing film). Therefore, a device sealed with an organic sealing film has a problem that it is easily deteriorated due to the influence of moisture, oxygen, etc. in the outside air and has a short life.
- Patent Document 3 describes a transfer sheet for forming a wiring board in which a fluorine-containing silicone rubber layer and a metal foil are laminated in this order on a resin film. According to this transfer sheet, it is considered that the inorganic sealing film can be handled relatively safely by laminating the thinned inorganic sealing film on the silicone rubber layer instead of the metal foil.
- the transfer sheet described in Patent Document 3 uses silicone rubber for the adhesive layer, it has the following problems. That is, the adhesive strength of the silicone rubber is usually constant, and the adhesive strength when holding the inorganic sealing film is substantially the same as the adhesive strength when removing it. Therefore, if the adhesive strength of the silicone rubber is designed to be weak and the inorganic sealing film is easily removed, the inorganic sealing film may be peeled off from the silicone rubber during transportation. On the contrary, if the adhesive strength of the silicone rubber is designed strongly, an excessive force is applied to the inorganic sealing film at the time of removal, and the inorganic sealing film is deformed or damaged. Silicone rubber is expensive and cannot be used repeatedly, so it is inferior in recyclability and is not economical.
- JP 2009-40951 A JP 2009-110873 A JP 2003-60329 A
- An object of the present invention is to provide an adhesive tape with a functional film that can handle the functional film safely and is excellent in recyclability, and a method for transferring the functional film.
- the functional film-attached pressure-sensitive adhesive tape of the present invention comprises a base film, an adhesive layer laminated on one side of the base film, and a functional film laminated on the surface of the adhesive layer.
- the pressure-sensitive adhesive layer contains a pressure-sensitive adhesive and a side chain crystalline polymer, and the adhesive strength decreases at a temperature equal to or higher than the melting point of the side chain crystalline polymer.
- the functional film transfer method of the present invention is a method of transferring the functional film in the functional film-attached pressure-sensitive adhesive tape to a transfer member, and includes the following steps (i) and (ii).
- (I) A step of adhering a transfer member to the surface of the functional film via an adhesive layer.
- the “functional film” in the present invention means a film having a predetermined function and difficult to handle due to insufficient strength.
- the functions include, for example, electrical / electronic functions (conductivity, insulation, piezoelectricity, dielectricity, etc.), optical functions (reflection, light shielding, polarization, refractive index control function, etc.) ), Magnetic function (hard magnetic, soft magnetic, non-magnetic, magnetic permeability, etc.), chemical function (water repellency, adsorptive, catalytic, water absorption, ion conductivity, redox, etc.), thermal function (Thermal conductivity, heat insulation, thermal expansion control function, etc.) and the like, and other functions other than these may be used.
- the functional film is held by the base film and the pressure-sensitive adhesive layer provided on one side of the base film, rigidity can be imparted to the functional film by the base film, and Since the pressure-sensitive adhesive layer functions as a cushioning material, it is possible to absorb the external force that the functional film receives during transportation.
- the pressure-sensitive adhesive layer contains a pressure-sensitive adhesive and a side-chain crystalline polymer, when the pressure-sensitive adhesive layer is heated to a temperature equal to or higher than the melting point of the side-chain crystalline polymer, the side-chain crystalline polymer becomes fluid. It is possible to inhibit the pressure-sensitive adhesive of the pressure-sensitive adhesive, thereby reducing the adhesive strength. Therefore, when removing the functional film, the adhesive force can be sufficiently reduced by heating the temperature of the pressure-sensitive adhesive layer to a temperature equal to or higher than the melting point of the side chain crystalline polymer. It can be handled.
- the pressure-sensitive adhesive layer functions as a cushioning material, so that depending on the configuration of the functional film, it can be wound into a roll shape, and can correspond to continuous production by a so-called roll-to-roll method.
- FIG. 1 It is sectional drawing which shows the adhesive tape with a functional film concerning one Embodiment of this invention.
- (A)-(e) is a schematic explanatory drawing which shows the transfer method of the functional film in the adhesive tape with a functional film shown in FIG.
- the pressure-sensitive adhesive tape with a functional film of the present invention (hereinafter sometimes referred to as “adhesive tape”), an example in which an inorganic sealing film is used as the functional film is shown in FIG. Details will be described with reference to FIG.
- the pressure-sensitive adhesive tape with a functional film 10 according to the present embodiment has a pressure-sensitive adhesive layer 2, an inorganic sealing film 3, and a release layer 4 in this order on one side of the base film 1. It is laminated.
- Examples of the base film 1 include synthetic resins such as polyethylene, polyethylene terephthalate, polypropylene, polyester, polyamide, polyimide, polycarbonate, ethylene vinyl acetate copolymer, ethylene ethyl acrylate copolymer, ethylene polypropylene copolymer, and polyvinyl chloride. A film is mentioned.
- the base film 1 may be composed of a single layer or a multilayer, and the thickness is preferably about 25 to 250 ⁇ m. Thereby, rigidity can be imparted to the inorganic sealing film 3.
- the base film 1 can be subjected to surface treatment such as corona discharge treatment, plasma treatment, blast treatment, chemical etching treatment, and primer treatment.
- the pressure-sensitive adhesive layer 2 contains a pressure-sensitive adhesive and a side chain crystalline polymer.
- the pressure-sensitive adhesive is not particularly limited as long as it is a polymer having tackiness.
- natural rubber adhesive synthetic rubber adhesive
- styrene / butadiene latex base adhesive acrylic adhesive, and the like. Is mentioned.
- the acrylic adhesive will be described as an example.
- the monomer constituting the acrylic adhesive include (meth) acrylate having an alkyl group having 1 to 12 carbon atoms, and the (meth) acrylate. Examples thereof include ethylhexyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, and butyl (meth) acrylate.
- (meth) acrylate etc. which have a hydroxyalkyl group can also be used.
- As this (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxyhexyl (meth) acrylate etc. are mentioned, for example. It is done.
- These exemplified monomers can be used alone or in combination of two or more.
- the polymerization method is not particularly limited, and for example, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method and the like can be employed.
- the monomer when the solution polymerization method is adopted, the monomer can be polymerized by mixing the monomer exemplified above in a solvent and stirring at about 40 to 90 ° C. for about 2 to 10 hours.
- the weight average molecular weight of the polymer obtained by polymerizing the monomer is preferably 250,000 to 1,000,000. If the weight average molecular weight is too small, when the inorganic sealing film 3 is removed, the adhesive layer 2 may remain on the inorganic sealing film 3, so-called adhesive residue may increase. Moreover, when the said weight average molecular weight is too large, there exists a possibility that the cohesion force of the adhesive layer 2 may become high too much, and adhesive force may become low.
- the weight average molecular weight is a value obtained by measuring the polymer by gel permeation chromatography (GPC) and converting the obtained measurement value to polystyrene.
- the side chain crystalline polymer is a polymer that crystallizes at a temperature below the melting point and exhibits fluidity at a temperature above the melting point. That is, the side chain crystalline polymer reversibly causes a crystalline state and a fluid state in response to a temperature change.
- the pressure-sensitive adhesive layer 2 contains the side-chain crystalline polymer in such a ratio that the adhesive strength decreases when the side-chain crystalline polymer exhibits fluidity at a temperature equal to or higher than the melting point.
- the inorganic sealing film 3 when removing the inorganic sealing film 3, if the pressure-sensitive adhesive layer 2 is heated to a temperature equal to or higher than the melting point of the side-chain crystalline polymer, the side-chain crystalline polymer exhibits fluidity, thereby causing the pressure-sensitive property. Since the adhesiveness of the adhesive is hindered and the adhesive strength is thereby reduced, the inorganic sealing film 3 can be easily removed. Also, if the pressure-sensitive adhesive layer 2 is cooled to a temperature lower than the melting point of the side chain crystalline polymer, the adhesive strength is recovered by crystallization of the side chain crystalline polymer, and therefore, it can be used repeatedly.
- the melting point means a temperature at which a specific portion of the polymer originally aligned in an ordered arrangement becomes disordered by an equilibrium process, and is measured by a differential thermal scanning calorimeter (DSC) at 10 ° C./min. It is a value obtained by measuring under conditions.
- the melting point is 30 ° C. or higher, preferably 30 to 70 ° C.
- the melting point can be arbitrarily set to a predetermined value by changing the composition of the side chain crystalline polymer.
- the composition of the side chain crystalline polymer is, for example, 20 to 100 parts by weight of a (meth) acrylate having a linear alkyl group having 16 or more carbon atoms and (meth) acrylate 0 having an alkyl group having 1 to 6 carbon atoms.
- a (meth) acrylate having a linear alkyl group having 16 or more carbon atoms and (meth) acrylate 0 having an alkyl group having 1 to 6 carbon atoms.
- examples thereof include a polymer obtained by polymerizing ⁇ 70 parts by weight and 0 to 10 parts by weight of a polar monomer.
- Examples of the (meth) acrylate having a linear alkyl group having 16 or more carbon atoms include 16 to 16 carbon atoms such as cetyl (meth) acrylate, stearyl (meth) acrylate, eicosyl (meth) acrylate, and behenyl (meth) acrylate.
- Examples of the (meth) acrylate having 22 linear alkyl groups include (meth) acrylate having an alkyl group having 1 to 6 carbon atoms, such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) ) Acrylate, hexyl (meth) acrylate and the like.
- Examples of the polar monomer include carboxyl group-containing ethylenically unsaturated monomers such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid and fumaric acid; 2 -Hydroxyethyl (meth) acrylate, 2 Hydroxypropyl (meth) acrylate, 2-hydroxyhexyl (meth) ethylenically unsaturated monomer having a hydroxyl group such as acrylate and the like, which may be used alone or in combination.
- carboxyl group-containing ethylenically unsaturated monomers such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid and fumaric acid
- 2 -Hydroxyethyl (meth) acrylate 2 Hydroxypropyl (meth) acrylate
- the polymerization method is not particularly limited, and for example, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method and the like can be employed.
- the monomer when the solution polymerization method is adopted, the monomer can be polymerized by mixing the monomer exemplified above in a solvent and stirring at about 40 to 90 ° C. for about 2 to 10 hours.
- the weight average molecular weight of the side chain crystalline polymer is 2,000 or more, preferably 2,000 to 20,000. If the weight average molecular weight is too small, the adhesive residue may increase when the inorganic sealing film 3 is removed. On the other hand, if the weight average molecular weight is too large, even if the temperature of the side chain crystalline polymer is set to a temperature equal to or higher than the melting point, it becomes difficult to show fluidity, so that the adhesive strength is hardly lowered.
- the weight average molecular weight is a value obtained by measuring the side chain crystalline polymer by GPC and converting the obtained measurement value to polystyrene.
- the side chain crystalline polymer may be contained in a proportion of 1 to 20 parts by weight, preferably 1 to 10 parts by weight, based on 100 parts by weight of the pressure-sensitive adhesive in terms of solid content.
- sufficient adhesive force can be secured at a temperature lower than the melting point of the side chain crystalline polymer, and when the side chain crystalline polymer exhibits fluidity at a temperature equal to or higher than the melting point, the adhesive strength decreases.
- the content of the side chain crystalline polymer is too small, the adhesive strength is hardly lowered even when the pressure-sensitive adhesive layer 2 is heated to a temperature equal to or higher than the melting point of the side chain crystalline polymer.
- the adhesive force of the adhesive layer 2 will fall and it will become difficult to hold
- the thickness of the pressure-sensitive adhesive layer 2 is 15 to 400 ⁇ m, preferably 120 to 150 ⁇ m. If the thickness of the pressure-sensitive adhesive layer 2 is too thin, the pressure-sensitive adhesive layer 2 will hardly function as a cushioning material, and it will be difficult to absorb the external force received by the inorganic sealing film 3 during transportation. On the other hand, when the thickness of the pressure-sensitive adhesive layer 2 is too large, it becomes difficult to prepare a pressure-sensitive adhesive layer having a uniform thickness, and it becomes difficult to stably hold the inorganic sealing film 3.
- a coating solution in which a pressure-sensitive adhesive and a side chain crystalline polymer are added to the solvent in a predetermined ratio is applied to one side of the base film 1 and dried. You can do it.
- Various additives such as a crosslinking agent, a tackifier, a plasticizer, an anti-aging agent, and an ultraviolet absorber can be added to the coating solution.
- the application can be generally performed by a knife coater, a roll coater, a calendar coater, a comma coater or the like. Further, depending on the coating thickness and the viscosity of the coating solution, a gravure coater, a rod coater or the like can be used.
- the inorganic sealing film 3 is made of an inorganic material and has a sealing function.
- the material constituting the inorganic sealing film 3 include glass such as quartz glass, alkali glass, soda lime glass, lead glass, borosilicate glass, aluminosilicate glass, and silica glass; and metals such as aluminum, molybdenum, and tantalum. Can be mentioned.
- the thickness of the inorganic sealing film 3 is 0.01 to 100 ⁇ m, preferably 0.01 to 1 ⁇ m.
- the inorganic sealing film 3 having such a thickness is very weak and easily damaged, and is inferior in handleability. According to this embodiment, it becomes possible to handle the inorganic sealing film 3 safely by supporting the inorganic sealing film 3 with the base film 1 and the pressure-sensitive adhesive layer 2 described above.
- the release layer 4 protects the surface of the inorganic sealing film 3.
- examples of the release layer 4 include a film surface made of polyethylene terephthalate or the like and a release agent such as silicone applied thereto.
- a suitable thickness of the release layer 4 is about 10 to 100 ⁇ m.
- the release layer 4 of the adhesive tape 10 is moved in the direction of arrow A, and the release layer 4 is peeled off from the inorganic sealing film 3. Thereby, the surface 3a of the inorganic sealing film 3 is exposed.
- the adhesive tape 10a from which the release layer 4 has been peeled is turned upside down as shown in FIG. Thereby, the surface 3a of the inorganic sealing film 3 faces downward.
- the transfer member 20 is disposed below the inorganic sealing film 3.
- the transfer member 20 is sealed by the inorganic sealing film 3, and examples thereof include a solar battery cell in a solar battery and a light emitting element in a flat panel display.
- the adhesive layer 21 is formed on the surface of the transfer member 20.
- the adhesive constituting the adhesive layer 21 is not particularly limited as long as the inorganic sealing film 3 and the transfer member 20 can be bonded and fixed.
- a reactive curable adhesive a thermosetting adhesive, an ultraviolet curable adhesive, and the like.
- photocurable adhesives such as mold adhesives.
- the adhesive layer 21 can be formed by applying the adhesive to the surface of the transfer member 20.
- the adhesive layer 21 can also be formed by applying the adhesive to the surface 3 a of the inorganic sealing film 3.
- the thickness of the adhesive layer 21 is 1 to 100 ⁇ m, preferably about 10 to 50 ⁇ m.
- the adhesive tape 10 a is moved in the direction of arrow B, and the surface 3 a of the inorganic sealing film 3 is interposed via the adhesive layer 21 as shown in FIG.
- the transfer member 20 is adhered. This adhesion is performed by curing the adhesive by a curing method corresponding to each adhesive exemplified above.
- the atmospheric temperature is heated to a temperature equal to or higher than the melting point of the side-chain crystalline polymer using a heating means such as gas, and the adhesive strength of the adhesive layer 2 is reduced.
- a heating means such as gas
- the adhesive strength of the pressure-sensitive adhesive layer 2 is sufficiently lowered when heated to about 60 ° C.
- the adhesive layer 2 and the base film 1 are moved in the direction of arrow C. Thereby, the inorganic sealing film 3 is removed from the pressure-sensitive adhesive layer 2, and the inorganic sealing film 3 is transferred from the pressure-sensitive adhesive layer 2 to the transfer member 20. At this time, since the adhesive strength of the pressure-sensitive adhesive layer 2 is sufficiently reduced for the reason described above, the load applied to the inorganic sealing film 3 during removal is small.
- the pressure-sensitive adhesive tape 10b from which the inorganic sealing film 3 has been removed has an adhesive force due to crystallization of the side chain crystalline polymer. Recover. Therefore, if the other inorganic sealing film 3 and the release layer 4 are laminated in this order on the pressure-sensitive adhesive layer 2 whose adhesive strength has been recovered, it can be repeatedly used as a new pressure-sensitive adhesive tape 10 with a functional film.
- the present invention is not limited to the above embodiments, and various improvements and modifications can be made within the scope of the claims. is there.
- the inorganic sealing film has been described as an example of the functional film.
- the functional film according to the present invention is not limited to this, and the inorganic sealing film It can be suitably used for a functional film other than a film, that is, a film that has a function other than a sealing function and is difficult to handle due to insufficient strength.
- the non-adhesive layer means a layer having substantially no adhesive force.
- the non-adhesive layer is not a uniform layer that covers the entire surface of the pressure-sensitive adhesive layer, but a non-uniform layer that partially exposes the surface of the pressure-sensitive adhesive layer. That is, the non-adhesive layer is a non-adhesive layer having, for example, a dot shape or a mottled shape.
- the contact area between the pressure-sensitive adhesive layer and the functional film can be adjusted. Increasing the contact area increases the adhesive strength. Conversely, when the contact area is reduced, the adhesive strength is weakened. Therefore, when the non-adhesive layer is interposed between the adhesive layer and the functional film, the adhesive force of the adhesive layer can be easily controlled, so that the functional film can be more easily removed.
- the ratio of the surface area of the adhesive layer exposed from a non-adhesive layer can be arbitrarily set according to the adhesive force and functional film of an adhesive layer, and is not specifically limited.
- the non-adhesive layer can be formed, for example, by vapor deposition, spray drying, sputtering, or the like.
- vapor deposition is preferable for efficiently forming the non-adhesive layer.
- the vapor deposition may be stopped before the entire surface of the pressure-sensitive adhesive layer is covered with the non-adhesive layer. The same applies when spray drying or sputtering is employed.
- composition of the said non-adhesion layer what does not have an adhesive force substantially should just be.
- Specific examples include silicone, fluororesin, silicon dioxide (SiO 2 ) and the like, and fluororesin is particularly preferable.
- fluororesin include tetrafluoroethylene / hexafluoropropylene copolymer (FEP), polytetrafluoroethylene (PTFE), and tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA).
- the thickness of the non-adhesive layer is preferably 1 ⁇ m or less, and more preferably 600 nm or less. If the thickness of the non-adhesive layer is too large, it is difficult to uniformly contact the adhesive layer and the functional film. Note that peeling when a non-adhesive layer is interposed usually occurs between the non-adhesive layer and the functional film.
- the copolymers of Synthesis Examples 1 to 4 are shown in Table 1.
- the said weight average molecular weight is a value which measured the copolymer by GPC and converted the obtained measured value into polystyrene.
- fusing point is the value measured on 10 degree-C / min measurement conditions using DSC.
- the solution was applied to one side of a polyethylene terephthalate film having a thickness of 100 ⁇ m and dried to prepare a pressure-sensitive adhesive tape on which a pressure-sensitive adhesive layer having a thickness of 30 ⁇ m was formed.
- a non-adhesive layer was formed on the surface of the adhesive layer in the adhesive tape of Example 1.
- the formation conditions are as follows. (Non-adhesive layer) Composition: Fluororesin (PTFE) Shape: Dot shape Thickness: 500nm Forming method: Vapor deposition
- the inorganic sealing film As the inorganic sealing film, an aluminum film and a quartz glass film each having a thickness of 50 ⁇ m were used. Each of these inorganic sealing films was laminated on the surface of the pressure-sensitive adhesive layer at an ambient temperature of 23 ° C. Next, an acrylic pressure-sensitive adhesive tape (“No-535A” manufactured by Nitto Denko Corporation) was attached to the surface of each inorganic sealing film. Next, after the ambient temperature was raised from 23 ° C. to 60 ° C., the removal property of the inorganic sealing film was evaluated by lightly lifting the acrylic adhesive tape with a finger. Evaluation criteria were set as follows.
- A The inorganic sealing film could be easily removed from the pressure-sensitive adhesive layer without damaging it.
- ⁇ Although a slight load was applied, there was no problem in practical use, and the inorganic sealing film could be removed from the adhesive layer without damaging it.
- X A large load was applied, and the inorganic sealing film was deformed or damaged.
- Examples 1 to 3 are superior to Comparative Example 1 in terms of removal of the inorganic sealing film.
- Example 3 provided with a non-adhesive layer showed better detachability than Example 1.
- peeling occurred between the non-adhesive layer and the inorganic sealing film.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
(i)前記機能膜の表面に、接着層を介して転写部材を接着する工程。
(ii)ついで前記粘着剤層の温度を、前記側鎖結晶性ポリマーの融点以上の温度にして粘着力を低下させ、前記粘着剤層から機能膜を取り外し、機能膜を粘着剤層から転写部材に転写する工程。
以下、本発明の機能膜付粘着テープ(以下、「粘着テープ」と言うことがある。)にかかる一実施形態について、機能膜に無機封止膜を用いた場合を例に挙げ、図1を参照して詳細に説明する。同図に示すように、本実施形態にかかる機能膜付粘着テープ10は、基材フィルム1の片面に、粘着剤層2と、無機封止膜3と、離型層4とが、この順に積層されてなる。
次に、前記した機能膜付粘着テープ10における無機封止膜3の転写方法について、図2を参照して詳細に説明する。なお、図2においては、前述した図1と同一の構成部分には同一の符号を付して説明は省略する。
エチルヘキシルアクリレートを52部、メチルアクリレートを40部、ヒドロキシエチルアクリレートを8部、および開始剤としてパーブチルND(日油社製)を0.2部の割合で、それぞれトルエン200部に加え、60℃で5時間攪拌して、これらのモノマーを重合させた。得られた共重合体の重量平均分子量は46万であった。
エチルヘキシルアクリレートを92部、ヒドロキシエチルアクリレートを8部、および開始剤としてパーブチルND(日油社製)を0.2部の割合で、それぞれトルエン200部に加え、60℃で5時間攪拌して、これらのモノマーを重合させた。得られた共重合体の重量平均分子量は47万であった。
ベヘニルアクリレートを40部、ステアリルアクリレートを35部、メチルアクリレートを20部、アクリル酸を5部、連鎖移動剤としてドデシルメルカプタンを6部、および開始剤としてパーヘキシルPV(日油社製)を1.0部の割合で、それぞれトルエン100部に加え、80℃で5時間攪拌して、これらのモノマーを重合させた。得られた共重合体の重量平均分子量は8,000、融点は52℃であった。
ステアリルアクリレートを95部、アクリル酸を5部、連鎖移動剤としてドデシルメルカプタンを5部、および開始剤としてパーヘキシルPV(日油社製)を1.0部の割合で、それぞれトルエン100部に加え、80℃で5時間攪拌して、これらのモノマーを重合させた。得られた共重合体の重量平均分子量は8,500、融点は51℃であった。
(非粘着層)
組成:フッ素樹脂(PTFE)
形状:ドット状
厚さ:500nm
形成方法:蒸着
(蒸着)
雰囲気温度:200℃
真空度:10-2torr
アクリル系粘着剤(綜研化学社製の「SK-1340」)100部に対し、固形分換算で架橋剤(綜研化学社製の「M-5A」)を2.4部添加して得た粘着剤溶液を、厚さ100μmのポリエチレンテレフタレートフィルムの片面に塗布して乾燥させ、厚さ30μmの粘着剤層が形成された粘着テープを作製した。
上記で得た各粘着テープについて、無機封止膜の取り外し性を評価した。評価方法を以下に示すとともに、その結果を表2に示す。
無機封止膜として、いずれも厚さ50μmのアルミニウム膜および石英ガラス膜を用いた。これら各無機封止膜を、23℃の雰囲気温度において、前記粘着剤層の表面に積層した。ついで、各無機封止膜表面に、アクリル系粘着テープ(日東電工社製の「No-535A」)を貼着した。ついで、雰囲気温度を23℃から60℃に昇温した後、前記アクリル系粘着テープを指で軽く持ち上げることによって、無機封止膜の取り外し性を評価した。評価基準は以下のように設定した。
△:若干の負荷がかかるものの、実使用上は問題のない範囲であり、無機封止膜を破損することなく粘着剤層から取り外すことができた。
×:大きな負荷がかかり、無機封止膜が変形するか破損した。
Claims (11)
- 基材フィルムと、
この基材フィルムの片面に積層される粘着剤層と、
この粘着剤層の表面に積層される機能膜と、を備え、
前記粘着剤層は、
感圧性接着剤および側鎖結晶性ポリマーを含有するとともに、
該側鎖結晶性ポリマーの融点以上の温度で粘着力が低下することを特徴とする機能膜付粘着テープ。 - 前記側鎖結晶性ポリマーは、前記融点未満の温度で結晶化し、かつ前記融点以上の温度で流動性を示す請求項1記載の機能膜付粘着テープ。
- 前記側鎖結晶性ポリマーが、炭素数16以上の直鎖状アルキル基を有する(メタ)アクリレート20~100重量部と、炭素数1~6のアルキル基を有する(メタ)アクリレート0~70重量部と、極性モノマー0~10重量部と、を重合させて得られる重合体である請求項1または2記載の機能膜付粘着テープ。
- 前記粘着剤層と機能膜との間に介在され、前記粘着剤層の表面を部分的に露出させる非粘着層と、を更に備えた請求項1~3のいずれかに記載の機能膜付粘着テープ。
- 前記非粘着層は、蒸着により形成されている請求項4記載の機能膜付粘着テープ。
- 前記非粘着層がフッ素樹脂からなる請求項4または5記載の機能膜付粘着テープ。
- 前記非粘着層の厚さが1μm以下である請求項4~6のいずれかに記載の機能膜付粘着テープ。
- 前記機能膜の厚さが0.01~100μmである請求項1~7のいずれかに記載の機能膜付粘着テープ。
- 前記機能膜の表面に離型層を設けた請求項1~8のいずれかに記載の機能膜付粘着テープ。
- 前記機能膜が無機封止膜である請求項1~9のいずれかに記載の機能膜付粘着テープ。
- 請求項1~10のいずれかに記載の機能膜付粘着テープにおける機能膜を転写部材に転写する方法であって、
前記機能膜の表面に、接着層を介して転写部材を接着する工程と、
ついで前記粘着剤層の温度を、前記側鎖結晶性ポリマーの融点以上の温度にして粘着力を低下させ、前記粘着剤層から機能膜を取り外し、機能膜を粘着剤層から転写部材に転写する工程と、
を含むことを特徴とする機能膜の転写方法。
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CN106047231A (zh) * | 2015-04-03 | 2016-10-26 | 霓达株式会社 | 温敏性粘合剂 |
JPWO2016158413A1 (ja) * | 2015-04-01 | 2018-01-25 | ニッタ株式会社 | 感温性粘着剤組成物 |
JPWO2016158414A1 (ja) * | 2015-04-03 | 2018-02-01 | ニッタ株式会社 | 感温性粘着テープおよび感温性粘着シート |
WO2021065801A1 (ja) * | 2019-09-30 | 2021-04-08 | ニッタ株式会社 | 調光フィルム用添加剤および感温性調光フィルム |
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KR101931336B1 (ko) * | 2012-04-16 | 2018-12-20 | 엘지디스플레이 주식회사 | 평판 표시장치의 보호필름 부착용 전사필름 및 전사필름을 이용한 평판 표시장치의 제조 방법 |
KR101991863B1 (ko) * | 2012-08-28 | 2019-06-24 | 삼성디스플레이 주식회사 | 봉지용 시트, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 유기 발광 디스플레이 장치 |
WO2015152006A1 (ja) * | 2014-04-04 | 2015-10-08 | ニッタ株式会社 | 側鎖結晶性ポリマー、感温性粘着剤、感温性粘着シートおよび感温性粘着テープ |
KR101574923B1 (ko) | 2015-01-20 | 2015-12-04 | 김영수 | 탈부착이 가능한 윈도우를 포함하는 디스플레이 장치 및 그 탈부착 방법 |
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JPWO2011001550A1 (ja) | 2012-12-10 |
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