WO2010106741A1 - スクリーン印刷機及びスクリーン印刷方法 - Google Patents
スクリーン印刷機及びスクリーン印刷方法 Download PDFInfo
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- WO2010106741A1 WO2010106741A1 PCT/JP2010/001161 JP2010001161W WO2010106741A1 WO 2010106741 A1 WO2010106741 A1 WO 2010106741A1 JP 2010001161 W JP2010001161 W JP 2010001161W WO 2010106741 A1 WO2010106741 A1 WO 2010106741A1
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- electrode pattern
- substrate
- screen printing
- mask
- corresponding mask
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
- B41F15/26—Supports for workpieces for articles with flat surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Definitions
- the present invention relates to a screen printing machine and a screen printing method for performing screen printing on a so-called cavity substrate in which an electrode pattern is formed on an upper surface of a substrate and a bottom surface of an opening provided on a part of the upper surface of the substrate.
- a so-called cavity substrate in which an upper layer side substrate member is bonded to the upper surface of a lower layer side substrate member, and an electrode pattern is formed on the upper surface and the bottom surface of an opening (cavity portion) provided in a part of the upper surface. It is used in various devices as a lightweight and high-density substrate (Patent Document 1).
- a flat plate portion that contacts the upper surface of the substrate and a protrusion protruding from the flat plate portion is fitted into the cavity portion.
- a three-dimensional mask member having a fitting portion to be used is used.
- a mask pattern corresponding to an electrode pattern (flat portion electrode pattern) provided on the upper surface of the substrate is formed on the flat plate portion, and an electrode pattern provided on the bottom surface of the cavity portion on the bottom surface of the fitting portion.
- a mask pattern corresponding to (cavity electrode pattern) is formed. For this reason, the paste can be printed (transferred) simultaneously on both the flat part electrode pattern and the cavity part electrode pattern by performing screen printing by bringing the substrate and the mask member into contact with each other.
- an object of the present invention is to provide a screen printing machine and a screen printing method capable of making it difficult to cause printing misalignment in screen printing for a cavity substrate formed by bonding substrate members.
- the screen printing machine includes a first electrode pattern and an upper layer side formed on the upper surface of the upper layer side substrate member of the substrate in which the upper layer side substrate member is bonded to the upper surface of the lower layer side substrate member.
- a screen printing machine that performs screen printing on a second electrode pattern formed on an upper surface of a lower layer side substrate member that is a bottom surface of an opening provided on a part of an upper surface of the substrate member, wherein the opening of the upper layer side substrate member
- a mask member having a first electrode pattern corresponding mask region in which the electrode pattern corresponding mask pattern is formed as a separate region, and a second electrode pattern corresponding mask of the mask member
- the second electrode pattern is screen-printed by aligning the area with the second electrode pattern of the substrate, and the first electrode pattern corresponding mask region of the mask member and the first electrode pattern of the substrate are aligned.
- a printing execution means for performing screen printing on the first electrode pattern.
- a screen printing machine is the screen printing machine according to the first aspect, wherein the printing execution means includes a second electrode pattern corresponding mask area of the mask member and a second electrode pattern of the substrate. And the second electrode pattern is subjected to screen printing, and then the first electrode pattern corresponding mask region of the mask member and the first electrode pattern of the substrate are aligned. Screen print the pattern.
- the screen printing machine of the 3rd mode concerning the present invention is the screen printing machine of the 1st mode or the 2nd mode, and is the 1st electrode pattern corresponding to the 1st electrode pattern corresponding to the mask member, and the 1st electrode pattern of a substrate Are provided on the upper surface of the first electrode pattern corresponding mask region and the upper layer side substrate member, and the second electrode pattern corresponding mask region of the mask member and the second electrode pattern of the substrate The second mark for alignment with the second electrode pattern corresponding mask region and the upper surface of the lower layer side substrate member which is the bottom surface of the opening of the upper layer side substrate member.
- the screen printing method is the first electrode pattern and the upper layer side formed on the upper surface of the upper layer side substrate member of the substrate in which the upper layer side substrate member is bonded to the upper surface of the lower layer side substrate member.
- the bottom surface of the fitting portion that fits into the opening of the upper layer side substrate member on the second electrode pattern formed on the upper surface of the lower layer side substrate member, which is the bottom surface of the opening portion provided on a part of the upper surface of the substrate member A second electrode pattern corresponding mask region in which a second electrode pattern corresponding mask pattern corresponding to the second electrode pattern is formed, and a first electrode pattern corresponding mask pattern corresponding to the first electrode pattern are formed.
- a screen printing method is the screen printing method according to the fourth aspect, wherein the second electrode pattern corresponding mask region of the mask member and the second electrode pattern of the substrate are aligned. And performing the step of performing screen printing on the second electrode pattern, and then aligning the first electrode pattern corresponding mask region of the mask member with the first electrode pattern of the substrate to form the first electrode pattern A step of applying screen printing is executed.
- the second electrode pattern corresponding mask pattern corresponding to the second electrode pattern is formed on the bottom surface of the fitting portion where the mask member is fitted to the opening (cavity portion) of the upper layer side substrate member.
- the pattern and the first electrode pattern are separately aligned with the mask region (second electrode pattern corresponding mask region or first electrode pattern corresponding mask region) and screen printed. . For this reason, in screen printing for a cavity substrate in which substrate members are bonded together, even if there is a positional shift when bonding the lower layer side substrate member and the upper layer side substrate member, a printing shift occurs. Can be difficult.
- the partial top view of the screen printer in one embodiment of this invention (A) Top view (b) Side sectional view of cavity substrate to be printed by screen printer in one embodiment of the present invention
- the front view of the printing execution part with which the screen printer in one embodiment of this invention is provided (A) Top view (b) Side sectional view of a mask member provided in a screen printing machine according to an embodiment of the present invention
- the block diagram which shows the control system of the screen printer in one embodiment of this invention (A) (b) (c) (d) Side view of mask member and cavity substrate provided in screen printing machine in one embodiment of the present invention (A) (b) (c) (d) Side view of mask member and cavity substrate provided in screen printing machine in one embodiment of the present invention
- the flowchart which shows the screen printing process which the screen printer in one embodiment of this invention performs (A) (b) Operation
- FIG. 1 is a partial plan view of a screen printer according to an embodiment of the present invention.
- FIG. 2 is a plan view of a cavity substrate to be printed by the screen printer according to an embodiment of the present invention.
- FIG. 3 is a side sectional view,
- FIG. 3 is a front view of a print execution unit provided in the screen printer in one embodiment of the present invention, and
- FIG. 4 is a plane (a) of a mask member provided in the screen printer in one embodiment of the present invention.
- FIG. 5 (b) is a side sectional view,
- FIG. 5 is a block diagram showing a control system of a screen printing machine according to an embodiment of the present invention, and FIGS.
- FIG. 6 (a), (b), (c), (d) and FIG. 7 (a), (b), (c), and (d) are side views of the mask member and the cavity substrate provided in the screen printing machine according to the embodiment of the present invention
- FIG. 8 is the embodiment of the present invention.
- FIGS. 9A, 9B, 10A, 10B, 11A, 12B, and 12A, 12B are flowcharts showing the steps.
- FIG. 13A and FIG. 13B are operation explanatory views of the cleaning device provided in the screen printer according to the embodiment of the present invention.
- a screen printing machine 1 includes a base 2, a substrate transport path 3 that is provided on the base 2, and transports and positions a substrate PB that is a printing target, and a substrate transport path. 3 includes a print execution unit 4 that performs screen printing on the substrate PB positioned by 3.
- the transport direction of the substrate PB in the screen printer 1 is defined as the X-axis direction
- the horizontal plane direction orthogonal to the X-axis direction is defined as the Y-axis direction
- the vertical direction is the Z-axis direction.
- the substrate PB is formed by bonding the upper layer side substrate member 12 to the upper surface of the lower layer side substrate member 11.
- a plurality of flat portion electrodes 12d are provided on the upper surface of the upper layer side substrate member 12, and a flat portion electrode pattern 12dp is formed on the upper surface of the upper layer side substrate member 12 by the plurality of flat portion electrodes 12d.
- a plurality of cavity electrodes 11 d are provided on the bottom surface (the upper surface of the lower layer side substrate member 11) of the cavity portion CV that is an opening provided on a part of the upper surface of the upper layer side substrate member 12.
- a cavity portion electrode pattern 11dp is formed on the bottom surface of the cavity portion CV by the plurality of cavity portion electrodes 11d.
- the substrate PB has a flat electrode pattern 12dp (first electrode pattern) formed on the upper surface (the upper surface of the upper layer side substrate member 12) and a bottom surface of the opening (cavity portion CV) provided on a part of the upper surface.
- the substrate transport path 3 includes a carry-in conveyor 21, a positioning conveyor 22 and a carry-out conveyor 23 provided side by side in the X-axis direction.
- the carry-in conveyor 21 carries the substrate PB input from the outside of the screen printing machine 1 (the left side in FIG. 1) into the screen printing machine 1 and delivers it to the positioning conveyor 22.
- the positioning conveyor 22 positions the substrate PB received from the carry-in conveyor 21 at a predetermined position, and transfers the substrate PB to the carry-out conveyor 23 after screen printing on the substrate PB is completed.
- the carry-out conveyor 23 carries the substrate PB received from the positioning conveyor 22 out of the screen printer 1.
- the print execution unit 4 clamps the substrate PB on the positioning conveyor 22 and moves the substrate PB in the horizontal plane (X-axis and Y-axis directions) and in the vertical direction (Z-axis direction).
- a substrate moving unit 31 to be performed, a pair of support rails 32 extending in the horizontal direction (Y-axis direction) above the substrate moving unit 31, and a plate-like mask member 33 supported by the support rails 32 are provided.
- the print execution unit 4 includes a substrate moving unit by a paste supply head 34 provided so as to be movable up and down in the horizontal plane above the mask member 33 and an XY robot 35 (FIG. 1) provided on the base 2.
- the camera unit 36 that is movable in the horizontal plane direction between the space 31 and the mask member 33 and the lower side of the support rail 32 are movable in the horizontal plane direction and can be moved up and down, and contact the lower surface of the mask member 33 from below. Then, a cleaning device 37 is provided for cleaning the paste residue remaining on the lower surface of the mask member 33 after the screen printing process.
- the substrate moving unit 31 of the print execution unit 4 includes a Y table 31a that moves relative to the base 2 in the Y axis direction, an X table 31b that moves relative to the Y table 31a in the X axis direction, and X A ⁇ table 31c that rotates relative to the table 31b around the Z axis, a base plate 31d fixed to the ⁇ table 31c, a first elevating plate 31e that elevates relative to the base plate 31d, and a relative elevating relative to the first elevating plate 31e A second elevating plate 31f, a receiving unit 31g fixed to the second elevating plate 31f, a positioning conveyor 22 constituting the substrate transport path 3, and a pair of clampers 31h that open and close in the Y-axis direction above the positioning conveyor 22 Become.
- the mask member 33 is supported on four sides by a frame member 33w having a rectangular shape in plan view, and the rectangular regions surrounded by the frame member 33w are mutually connected.
- a cavity portion corresponding mask region MRC and a flat portion corresponding mask region MRF, which are separate regions, are provided.
- the cavity portion corresponding mask region MRC is formed with a plurality of downwardly protruding fitting portions 33a that fit into the cavity portion CV of the substrate PB.
- Each fitting portion 33a is provided with a plurality of pattern holes h1 corresponding to a plurality of cavity portion electrodes 11d provided on the upper surface (the bottom surface of the cavity portion CV) of the lower layer side substrate member 11, and the cavity portion corresponding mask pattern MPC is formed.
- a plurality of pattern holes h2 corresponding to the plurality of flat part electrodes 12d provided on the upper surface of the upper layer side substrate member 12 are provided to form a flat part corresponding mask pattern MPF. Yes.
- the mask member 33 is formed with the cavity portion corresponding mask pattern MPC corresponding to the cavity portion electrode pattern 11dp on the bottom surface of the fitting portion 33a to be fitted into the cavity portion CV (opening portion of the upper layer side substrate member 12) of the substrate PB.
- the cavity portion corresponding mask region MRC and the flat portion corresponding mask region MRF in which the flat portion corresponding mask pattern MPF corresponding to the flat portion electrode pattern 12dp are formed are respectively provided as separate regions.
- the flat portion corresponding mask area MRF is an area of the two mask members 33 located across the center line CL of the mask member 33 parallel to the transport direction (X-axis direction) of the substrate PB.
- the cavity part corresponding mask region MRC is formed on one side, and is formed on the other side of the two mask member 33 regions located across the center line CL of the mask member 33 parallel to the transport direction of the substrate PB.
- a pair of cavity portion side alignment marks 11m are provided at the diagonal position of the lower layer side substrate member 11, and the diagonal position of the upper layer side substrate member 12 is provided at the diagonal position.
- a pair of flat portion side alignment marks 12m are provided.
- the cavity portion corresponding mask region MRC is located at the diagonal position of the cavity portion corresponding mask region MRC in which the cavity portion corresponding mask pattern MPC of the mask member 33 is formed.
- a pair of cavity portion corresponding mask region side alignment marks MKC for alignment with the partial electrode patterns 11dp are provided corresponding to the cavity portion side alignment marks 11m.
- Two portions for aligning the flat portion corresponding mask region MRF to the flat portion electrode pattern 12dp of the substrate PB are provided at the diagonal positions of the flat portion corresponding mask region MRF on which the flat portion corresponding mask pattern MPF of the mask member 33 is formed.
- a set of flat portion corresponding alignment mark MKF is provided corresponding to the flat portion alignment mark 12m.
- the paste supply head 34 is provided above the support rail 32 so as to be movable in the Y-axis direction with respect to the substrate moving unit 31.
- the head main body 34a and the Y provided below the head main body 34a are provided. It consists of two guide members 34g that face each other in the axial direction.
- Each guide member 34g is a “spar” -like member extending in the X-axis direction, and a paste such as a solder paste or a conductive paste that is pumped downward from a paste cartridge (not shown) built in the head main body 34a. It guides so that it may concentrate on the target location on the mask member 33, and may be supplied.
- an XY robot 35 extends above the base 2 in the Y-axis direction, and is provided with a Y-axis stage 35a that is fixed relative to the base 2, and extends in the X-axis direction, on the Y-axis stage 35a.
- a moving plate 35c provided to be movable in the X-axis direction on the X-axis stage 35b.
- the camera unit 36 has a configuration in which a first camera 36 a with an imaging surface facing downward and a second camera 36 b with an imaging surface facing upward are attached to a moving plate 35 c of an XY robot 35. Yes.
- the cleaning device 37 contacts the lower surface of the mask member 33 from below while the cleaning paper 37a is stretched in the horizontal direction, and sends the cleaning paper 37a in the horizontal direction by a pair of rollers 37b. Can be cleaned.
- the substrate PB is transported and positioned by the carry-in conveyor 21, the positioning conveyor 22 and the carry-out conveyor 23 constituting the substrate transport path 3, and the control device 40 (FIG. 5) included in the screen printing machine 1 includes an actuator or the like (not shown). This is done by controlling the operation of the transport path operating mechanism 41 (FIG. 5).
- the controller 40 controls the Y table to move the first elevating plate 31e (with respect to the table 31c), the second elevating plate 31f with respect to the first elevating plate 31e (that is, the lowering unit 31g) and the opening / closing operation of the clamper 31h. This is done by controlling the operation of the substrate moving unit operating mechanism 42 (FIG. 5) including actuators such as the drive motor My and the X table drive motor Mx (FIG. 3).
- the movement of the paste supply head 34 in the horizontal plane direction is performed when the control device 40 controls the operation of the paste supply head horizontal movement mechanism 43 (FIG. 5) including an actuator (not shown).
- the operation is performed when the control device 40 controls the operation of the paste supply head lifting mechanism 44 (FIG. 5) including an actuator (not shown).
- the paste supply operation from the paste supply head 34 is performed by the control device 40 controlling the operation of a paste supply mechanism 45 (FIG. 5) including an actuator (not shown).
- the movement operation of the X-axis stage 35b constituting the XY robot 35 in the Y-axis direction and the movement operation of the movement plate 35c in the X-axis direction are performed by an XY robot operation mechanism 46 (FIG. 5) including an actuator (not shown). ).
- the first camera 36a is controlled by the control device 40, and the cavity portion side alignment mark 11m provided on the lower layer side substrate member 11 of the substrate PB and the flat portion side alignment mark 12m provided on the upper layer side substrate member 12.
- the second camera 36b is controlled by the control device 40 to image the cavity portion corresponding mask region side alignment mark MKC and the flat portion corresponding mask region side alignment mark MKF.
- Image data obtained by imaging with the first camera 36a and image data obtained by imaging with the second camera 36b are input to the control device 40 (FIG. 5).
- the moving operation of the cleaning device 37 in the horizontal plane direction is performed by the control device 40 controlling the operation of the cleaning device horizontal moving mechanism 47 (FIG. 5) including an actuator (not shown). This is done by controlling the operation of the cleaning device lifting mechanism 48 including an actuator (not shown) by the control device 40.
- the cleaning operation by the cleaning device 37 (the feeding operation of the cleaning paper 37a by the pair of rollers 37b) is performed by the control device 40 controlling the operation of a cleaning operation mechanism 49 (FIG. 5) including an actuator (not shown). .
- the control device 40 first corresponds to the cavity portion side alignment mark 11m provided on the lower layer side substrate member 11 of the substrate PB and the cavity portion of the mask member 33.
- the cavity region corresponding mask region side alignment mark MKC provided in the mask region MRC aligned in the vertical direction (FIG. 6A)
- the substrate PB and the mask member 33 are relatively close to each other in the vertical direction ( 6A, the fitting portion 33a in the mask portion MRC corresponding to the cavity portion of the mask member 33 is fitted into the corresponding cavity portion CV of the substrate PB from above (FIG. 6B).
- the paste PT is fed from above to each fitting portion 33a in the cavity portion corresponding mask region MRC by the paste supply head 34, and the cavity portion electrode pattern is passed through each pattern hole h1 constituting the cavity portion corresponding mask pattern MPC.
- the paste PT is supplied onto each cavity part electrode 11d constituting 11dp (FIG. 6C).
- the paste PT is printed (transferred) on each cavity electrode 11d (FIG. 6). (D)).
- the control device 40 first sets the flat portion side alignment mark 12m provided on the upper layer side substrate member 12 of the substrate PB and the flatness of the mask member 33.
- the substrate PB and the mask member 33 With the flat portion corresponding mask region side alignment mark MKF provided in the portion corresponding mask region MRF aligned in the vertical direction (FIG. 7A), the substrate PB and the mask member 33 are relatively close to each other in the vertical direction. Then, the substrate PB and the mask member 33 are brought into contact with each other (arrow B1 shown in FIG. 7A) (FIG. 7B).
- the alignment between the flat part corresponding mask region MRF of the mask member 33 and the flat part electrode pattern 12dp of the substrate PB is performed.
- the paste PT is fed from above to the flat portion corresponding mask region MRF by the paste supply head 34, and each flat portion constituting the flat portion electrode pattern 12dp is passed through each pattern hole h2 constituting the flat portion corresponding mask pattern MPF.
- the paste PT is supplied onto the electrode 12d (FIG. 7C).
- the paste PT is printed (transferred) on each flat portion electrode 12d (FIG. 7). (D)).
- the flat portion corresponding mask region MRF of the mask member 33 Since the flat portion corresponding mask region MRF of the mask member 33 is flat, the flat portion corresponding mask region MRF of the mask member 33 is brought into contact with the upper surface of the substrate PB in a state where the paste PT is printed on the cavity electrode 11d. However, the paste PT on the cavity electrode 11d and the mask member 33 do not interfere with each other. Therefore, the printing of the paste PT on the flat part electrode pattern 12dp using the flat part corresponding mask region MRF of the mask member 33 can be performed in a state where the paste PT is printed on the cavity part electrode 11d (see FIG. 7). ).
- the paste PT is printed on the cavity electrode pattern 11dp before the paste PT is printed on the flat electrode pattern 12dp, the printing of the paste PT on the cavity electrode pattern 11dp and the flat part are performed. Both the printing of the paste PT on the electrode pattern 12dp can be performed.
- the control device 40 detects that the substrate PB has been input from the operator (or another device (not shown) installed on the upstream side of the screen printing machine 1) to the substrate transport path 3 (loading conveyor 21) by a detection means (not shown). Then, the carry-in conveyor 21 and the positioning conveyor 22 are operated in conjunction to carry the substrate PB into the screen printer 1 (step ST1 in FIG. 8).
- the control device 40 fixes the substrate PB to the substrate moving unit 31 (step ST2 in FIG. 8).
- the second lifting plate 31f of the substrate moving unit 31 is raised relative to the first lifting plate 31e (arrow C1 shown in FIG. 9A), and the upper surface of the lower receiving unit 31g is placed on the substrate PB.
- the substrate PB is supported on the lower receiving unit 31g by contacting the lower surface with the lower surface (FIG. 9A).
- the substrate PB is clamped by the clamper 31h, and then the second elevating plate 31f is further raised (arrow C2 shown in FIG. 9B), and the lower receiving unit 31g is used for the substrate.
- control device 40 aligns the cavity portion corresponding mask region MRC of the mask member 33 and the cavity portion electrode pattern 11dp of the substrate PB (step ST3 in FIG. 8).
- the control device 40 first moves the camera unit 36 and controls the imaging operation of the first camera 36a to acquire image data of the cavity portion side alignment mark 11m provided on the lower layer side substrate member 11. Then, the position of the cavity part electrode pattern 11dp is grasped, and the image data of the cavity part corresponding mask area side alignment mark MKC provided on the mask member 33 by controlling the movement of the camera unit 36 and the imaging operation of the second camera 36b. And the position of the cavity portion corresponding mask region MRC is grasped.
- the control device 40 After grasping the position of the cavity part electrode pattern 11dp and the position of the cavity part corresponding mask region MRC, the control device 40 performs a movement operation of the substrate PB in the horizontal plane by the substrate moving unit 31 to move the substrate PB to the mask member 33. After being positioned directly below the cavity region corresponding mask region MRC, the substrate moving unit 31 performs a vertical movement of the substrate PB (upward movement of the first elevating plate 31e) to bring the substrate PB into contact with the mask member 33 from below. (Arrow C3 shown in FIG. 10A). Thereby, alignment between the cavity portion corresponding mask region MRC of the mask member 33 and the cavity portion electrode pattern 11dp of the substrate PB is performed (FIG. 10A).
- the control device 40 When the alignment between the cavity portion corresponding mask region MRC of the mask member 33 and the cavity portion electrode pattern 11dp of the substrate PB is completed, the control device 40 performs screen printing on the cavity portion electrode pattern 11dp (step ST4 in FIG. 8). .
- the control device 40 first moves the paste supply head 34 above the cavity portion corresponding mask region MRC, and the upper surface of the mask member 33 (the cavity portion corresponding mask region MRC) from the paste supply head 34.
- the paste PT is filled into the pattern hole h1 of the cavity portion corresponding mask pattern MPC by supplying the paste PT between the guide members 34g (inside) (FIG. 10B).
- the control device 40 After filling the pattern hole h1 of the cavity part corresponding mask pattern MPC with the paste PT, the control device 40 lowers the first elevating plate 31e (arrow C4 shown in FIG. 11A), and the substrate PB and the mask. The member 33 is separated (step ST5 in FIG. 8). As a result, the plate separation is performed, and the paste PT filled in the pattern hole h1 of the cavity part corresponding mask pattern MPC is printed on the cavity part electrode pattern 11dp (FIG. 11A).
- step ST5 for the cavity electrode pattern 11dp is completed, and the screen printing process (second screen printing process, step) for the flat part electrode pattern 12dp described below. Steps ST6 to ST9) are executed.
- control device 40 first aligns the flat portion corresponding mask region MRF of the mask member 33 with the flat portion electrode pattern 12dp of the substrate PB (step ST6 in FIG. 8).
- the control device 40 first moves the camera unit 36 and controls the imaging operation of the first camera 36a to acquire image data of the flat portion side alignment mark 12m provided on the upper layer side substrate member 12.
- the image data of the flat portion corresponding mask region side alignment mark MKF provided on the mask member 33 by grasping the position of the flat portion electrode pattern 12dp and controlling the movement of the camera unit 36 and the imaging operation of the second camera 36b. And the position of the flat portion corresponding mask region MRF is grasped.
- the control device 40 After grasping the position of the flat part electrode pattern 12dp and the position of the flat part corresponding mask region MRF, the control device 40 performs a movement operation of the substrate PB in the horizontal plane by the substrate moving unit 31 (in FIG. 11B). Arrow C5), after the substrate PB is positioned immediately below the flat portion corresponding mask region MRF of the mask member 33 (FIG. 11B), the substrate moving unit 31 moves the substrate PB in the vertical direction (first lifting plate). 31e is raised), the substrate PB is brought into contact with the lower surface of the mask member 33 from below (arrow C6 shown in FIG. 12A). As a result, the flat portion corresponding mask region MRF of the mask member 33 and the flat portion electrode pattern 12dp of the substrate PB are aligned (FIG. 12A).
- the flat portion corresponding mask region MRF and the flat portion electrode pattern 12dp are aligned by the flat portion corresponding mask region MRF of the mask member 33 and the flat portion electrode pattern of the substrate PB.
- the first mark (flat portion corresponding mask region side alignment mark MKF and flat portion side position) provided on the upper surface of the mask portion 33 corresponding to the flat portion of the mask member 33 and the upper layer side substrate member 12 for alignment with 12 dp.
- the alignment mark 12m) is used.
- the alignment of the cavity portion corresponding mask region MRC and the cavity portion electrode pattern 11dp is performed by aligning the cavity of the mask member 33 with respect to the alignment of the cavity portion corresponding mask region MRC of the mask member 33 and the cavity portion electrode pattern 11dp of the substrate PB.
- Second mark (cavity part corresponding mask region side alignment mark MKC and second part mark provided on the upper surface of the lower layer side substrate member 11 which is the bottom surface of the opening part (cavity part CV) of the upper part side substrate member 12 and the part corresponding mask region MRC.
- the cavity portion side alignment mark 11m) is used.
- the alignment of the flat portion corresponding mask region MRF and the flat portion electrode pattern 12dp and the alignment of the cavity portion corresponding mask region MRC and the cavity portion electrode pattern 11dp are performed using different marks.
- control device 40 When the alignment between the flat portion corresponding mask region MRF of the mask member 33 and the flat portion electrode pattern 12dp of the substrate PB is completed, the control device 40 performs screen printing on the flat portion electrode pattern 12dp (step ST7 in FIG. 8). .
- the control device 40 first moves the paste supply head 34 above the flat portion corresponding mask region MRF, and the upper surface of the mask member 33 (flat portion corresponding mask region MRF) from the paste supply head 34.
- the paste PT is filled into the pattern hole h2 of the flat part corresponding mask pattern MPF by supplying the paste PT between the guide members 34g (inside) (FIG. 12B).
- the control device 40 After filling the pattern hole h2 of the flat part corresponding mask pattern MPF with the paste PT, the control device 40 lowers the first elevating plate 31e to separate the substrate PB and the mask member 33 (step ST8 in FIG. 8). . As a result, plate separation is performed, and the paste PT filled in the pattern hole h2 in the flat part corresponding mask pattern MPF is printed on the flat part electrode pattern 12dp. Thus, the second screen printing process for the flat portion electrode pattern 12dp is completed.
- the control device 40 opens the clamper 31h and releases the fixation of the substrate PB to the substrate moving unit 31 (step ST9 in FIG. 8). Then, the second elevating plate 31f is lowered to place the substrate PB on the positioning conveyor 22, and the substrate moving unit 31 is operated to adjust the position of the positioning conveyor 22 relative to the carry-out conveyor 23.
- the control device 40 operates the positioning conveyor 22 and the carry-out conveyor 23 in an interlocked manner to carry out the substrate PB from the screen printing machine 1 (step ST10 in FIG. 8).
- the control device 40 determines whether there is another substrate PB to be screen-printed (step ST11 in FIG. 8). As a result, when there is another substrate PB to be screen-printed, the process returns to step ST1 to carry in the substrate PB, and when there is no substrate PB to be screen-printed, the series of screen printing steps is terminated.
- the control device 40 performs screen printing on the flat portion electrode pattern 12dp first, the mask member 33 (cavity portion corresponding mask region MRC) for the cavity portion electrode pattern 11dp to be performed later and the substrate are used.
- the paste PT previously printed on the flat portion electrode pattern 12dp adheres to the lower surface of the mask member 33 at the time of contact with the PB.
- the control device 40 performs a step (first screen printing step) of performing screen printing on the cavity portion electrode pattern 11dp by aligning the cavity portion corresponding mask region MRC of the mask member 33 with the cavity portion electrode pattern 11dp of the substrate PB.
- the mask region MR corresponding to the flat portion of the mask member 33 And the flat part electrode pattern 12dp of the substrate PB are aligned to perform a screen printing process (second screen printing process) on the flat part electrode pattern 12dp. Can be prevented.
- the control device 40 cleans the lower surface of the mask member 33 by the cleaning device 37 after completing a series of screen printing steps. In the cleaning of the lower surface of the mask member 33, the cleaning for the cavity portion corresponding mask region MRC and the cleaning for the flat portion corresponding mask region MRF are performed separately.
- the cleaning of the mask member 33 corresponding to the cavity portion corresponding mask region MRC is performed by placing the cleaning paper 37a of the cleaning device 37 on the bottom surface of the fitting portion 33a in the cavity portion corresponding mask region MRC. After the contact, the cleaning device 37 is moved in the horizontal plane (arrow D1 shown in FIG. 13A), and the cleaning paper 37a is sent by the pair of rollers 37b, and the lower surface of the cavity corresponding mask region MRC. This is performed by removing the remaining residue of the paste PT adhering to (first cleaning step). Further, as shown in FIG.
- the cleaning of the mask portion 33 corresponding to the flat portion corresponding mask region MRF is performed by bringing the cleaning paper 37a of the cleaning device 37 into contact with the lower surface of the flat portion corresponding mask region MRF. While moving the cleaning device 37 in the horizontal plane direction (arrow D2 shown in FIG. 13B), the cleaning paper 37a is sent by a pair of rollers 37b, and the paste PT adhered to the lower surface of the flat portion corresponding mask region MRF is sent. It is performed by removing the remaining soot (second cleaning step).
- the screen printing machine 1 is a flat plate formed on the upper surface of the upper layer side substrate member 12 of the substrate PB in which the upper layer side substrate member 12 is bonded to the upper surface of the lower layer side substrate member 11.
- Cavity portion formed on the upper surface of the lower layer side substrate member 11 which is the bottom surface of the opening portion (cavity portion CV) provided in a part of the upper surface of the upper layer side substrate member 12 and the partial electrode pattern 12dp (first electrode pattern)
- the electrode pattern 11dp (second electrode pattern) is subjected to screen printing, and the cavity portion corresponding mask pattern MPC (second) corresponding to the cavity portion electrode pattern 11dp is formed on the bottom surface of the fitting portion 33a fitted to the cavity portion CV.
- the cavity region corresponding mask region MRC (second electrode pattern corresponding mask pattern) in which the electrode pattern corresponding mask pattern) is formed.
- Flat portion corresponding mask region MRF (first electrode pattern corresponding mask region) in which a flat portion corresponding mask pattern MPF (first electrode pattern corresponding mask pattern) corresponding to the flat portion electrode pattern 12dp is formed.
- the mask member 33 as a separate area, the cavity portion corresponding mask region MRC of the mask member 33 and the cavity portion electrode pattern 11dp of the substrate PB are aligned, screen printing is performed on the cavity portion electrode pattern 11dp, and the mask member 33
- the flat portion electrode pattern corresponding mask region MRF and the flat portion electrode pattern 12dp of the substrate PB are aligned to perform screen printing on the flat portion electrode pattern 12dp (the print execution portion 4 and the control device 40). Have become .
- the screen printing method according to the present embodiment is a flat electrode pattern 12dp (formed on the upper surface of the upper substrate member 12 of the substrate PB in which the upper substrate member 12 is bonded to the upper surface of the lower substrate member 11).
- Cavity portion electrode pattern 11dp first electrode pattern
- a cavity portion corresponding mask pattern MPC second electrode pattern corresponding mask pattern
- Part corresponding mask region MRC (second electrode pattern corresponding mask region) and flat portion electrode pattern 12dp
- a mask member 33 having a flat portion corresponding mask region MRF (first electrode pattern corresponding mask region) in which a corresponding flat portion corresponding mask pattern MPF (first electrode pattern corresponding mask pattern) is formed as a separate region is used.
- a screen printing method for performing screen printing in which the cavity portion corresponding mask region MRC of the mask member 33 and the cavity portion electrode pattern 11dp of the substrate PB are aligned to perform screen printing on the cavity portion electrode pattern 11dp (first step).
- the mask member 33 is formed on the cavity electrode pattern 11dp on the bottom surface of the fitting portion 33a that fits in the opening (cavity portion CV) of the upper layer side substrate member 12.
- the cavity portion corresponding mask region MRC in which the corresponding cavity portion corresponding mask pattern MPC is formed and the flat portion corresponding mask region MRF in which the flat portion corresponding mask region MRF corresponding to the flat portion electrode pattern 12dp are formed as separate regions.
- the cavity portion electrode pattern 11dp and the flat portion electrode pattern 12dp are separately aligned with the mask region (the cavity portion corresponding mask region MRC or the flat portion corresponding mask region MRF) and screen printed. It has become. For this reason, in screen printing for a cavity substrate in which a substrate member is bonded, even if a positional shift occurs when the lower layer side substrate member 11 and the upper layer side substrate member 12 are bonded, the printing shift Can make it harder to get up.
- the present invention is not limited to those shown in the above-described embodiments.
- the case where the substrate PB is a cavity substrate formed by bonding two substrate members (the lower layer side substrate member 11 and the upper layer side substrate member 12) is exemplified. Since the substrate PB to be included only needs to include at least two bonded substrate members (the lower layer side substrate member 11 and the upper layer side substrate member 12), three or more substrate members are bonded to each other. Also good.
- the paste supply method may be an open squeegee supply, and is not limited to a paste cartridge.
- a screen printing machine and a screen printing method capable of making printing misalignment less likely to occur in screen printing for a cavity substrate formed by bonding substrate members.
- Print execution unit 11 Lower layer side substrate member 11dp Cavity part electrode pattern (second electrode pattern) 11m Cavity side alignment mark (second mark) 12 Upper layer side substrate member 12dp Flat part electrode pattern (first electrode pattern) 12m flat part side alignment mark (first mark) 33 mask member 33a fitting part 40 control device (print execution means) MPC cavity part corresponding mask pattern (second electrode pattern corresponding mask pattern) MPF flat part corresponding mask pattern (first electrode pattern corresponding mask pattern) MRC cavity region corresponding mask region (second electrode pattern corresponding mask region) MRF flat part corresponding mask region (first electrode pattern corresponding mask region) PB substrate CV cavity (opening) MKC Cavity part corresponding mask area side alignment mark (second mark) MKF Flat part corresponding mask area side alignment mark (first mark)
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
4 印刷実行部(印刷実行手段)
11 下層側基板部材
11dp キャビティ部電極パターン(第2の電極パターン)
11m キャビティ部側位置合わせマーク(第2のマーク)
12 上層側基板部材
12dp フラット部電極パターン(第1の電極パターン)
12m フラット部側位置合わせマーク(第1のマーク)
33 マスク部材
33a 嵌合部
40 制御装置(印刷実行手段)
MPC キャビティ部対応マスクパターン(第2の電極パターン対応マスクパターン)
MPF フラット部対応マスクパターン(第1の電極パターン対応マスクパターン)
MRC キャビティ部対応マスク領域(第2の電極パターン対応マスク領域)
MRF フラット部対応マスク領域(第1の電極パターン対応マスク領域)
PB 基板
CV キャビティ部(開口部)
MKC キャビティ部対応マスク領域側位置合わせマーク(第2のマーク)
MKF フラット部対応マスク領域側位置合わせマーク(第1のマーク)
Claims (5)
- 下層側基板部材の上面に上層側基板部材が貼り合わされた基板の、上層側基板部材の上面に形成された第1の電極パターン及び上層側基板部材の上面の一部に設けられた開口部の底面である下層側基板部材の上面に形成された第2の電極パターンにスクリーン印刷を施すスクリーン印刷機であって、
上層側基板部材の開口部に嵌合する嵌合部の底面に第2の電極パターンに対応する第2の電極パターン対応マスクパターンが形成された第2の電極パターン対応マスク領域及び第1の電極パターンに対応する第1の電極パターン対応マスクパターンが形成された第1の電極パターン対応マスク領域をそれぞれ別個の領域として有するマスク部材と、
マスク部材の第2の電極パターン対応マスク領域と基板の第2の電極パターンとの位置合わせを行って第2の電極パターンにスクリーン印刷を施し、マスク部材の第1の電極パターン対応マスク領域と基板の第1の電極パターンとの位置合わせを行って第1の電極パターンにスクリーン印刷を施す印刷実行手段と、
を備えたことを特徴とするスクリーン印刷機。 - 印刷実行手段は、マスク部材の第2の電極パターン対応マスク領域と基板の第2の電極パターンとの位置合わせを行って第2の電極パターンにスクリーン印刷を施した後、マスク部材の第1の電極パターン対応マスク領域と基板の第1の電極パターンとの位置合わせを行って第1の電極パターンにスクリーン印刷を施すことを特徴とする請求項1に記載のスクリーン印刷機。
- マスク部材の第1の電極パターン対応マスク領域と基板の第1の電極パターンとの位置合わせのための第1のマークが第1の電極パターン対応マスク領域及び上層側基板部材の上面に設けられ、
マスク部材の第2の電極パターン対応マスク領域と基板の第2の電極パターンとの位置合わせのための第2のマークが第2の電極パターン対応マスク領域及び上層側基板部材の開口部の底面である下層側基板部材の上面に設けられたことを特徴とする請求項1又は2に記載のスクリーン印刷機。 - 下層側基板部材の上面に上層側基板部材が貼り合わされた基板の、上層側基板部材の上面に形成された第1の電極パターン及び上層側基板部材の上面の一部に設けられた開口部の底面である下層側基板部材の上面に形成された第2の電極パターンに、上層側基板部材の開口部に嵌合する嵌合部の底面に第2の電極パターンに対応する第2の電極パターン対応マスクパターンが形成された第2の電極パターン対応マスク領域及び第1の電極パターンに対応する第1の電極パターン対応マスクパターンが形成された第1の電極パターン対応マスク領域をそれぞれ別個の領域として有するマスク部材を用いてスクリーン印刷を施すスクリーン印刷方法であって、
マスク部材の第2の電極パターン対応マスク領域と基板の第2の電極パターンとの位置合わせを行って第2の電極パターンにスクリーン印刷を施す工程と、
マスク部材の第1の電極パターン対応マスク領域と基板の第1の電極パターンとの位置合わせを行って第1の電極パターンにスクリーン印刷を施す工程と、
を含むことを特徴とするスクリーン印刷方法。 - マスク部材の第2の電極パターン対応マスク領域と基板の第2の電極パターンとの位置合わせを行って第2の電極パターンにスクリーン印刷を施す工程を実行した後、マスク部材の第1の電極パターン対応マスク領域と基板の第1の電極パターンとの位置合わせを行って第1の電極パターンにスクリーン印刷を施す工程を実行することを特徴とする請求項4に記載のスクリーン印刷方法。
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CN201080011942XA CN102356702B (zh) | 2009-03-16 | 2010-02-22 | 丝网印刷机及丝网印刷方法 |
US13/255,367 US8720331B2 (en) | 2009-03-16 | 2010-02-22 | Screen printing apparatus and method for printing of circuit board including a mask having two different patterns for printing different parts of the circuit board in separate printing steps |
GB1115394.7A GB2480579B (en) | 2009-03-16 | 2010-02-22 | Screen printing machine and screen printing method |
DE112010001165T DE112010001165T5 (de) | 2009-03-16 | 2010-02-22 | Siebdruckmaschine und Siebdruckverfahren |
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JP2009062317A JP5018812B2 (ja) | 2009-03-16 | 2009-03-16 | スクリーン印刷機及びスクリーン印刷方法 |
JP2009-062317 | 2009-03-16 |
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JP (1) | JP5018812B2 (ja) |
KR (1) | KR20110129885A (ja) |
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DE (1) | DE112010001165T5 (ja) |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120107489A1 (en) * | 2010-11-03 | 2012-05-03 | International Business Machines Corporation | Cartridge Block for Multilayer Ceramic Screening |
US20120322334A1 (en) * | 2011-06-15 | 2012-12-20 | Sony Corporation | Method of manufacturing film and method of manufacturing display |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012176229A1 (ja) * | 2011-06-21 | 2012-12-27 | ヤマハ発動機株式会社 | スクリーン印刷装置 |
US9426901B2 (en) | 2011-10-12 | 2016-08-23 | General Electric Company | Patterning method for component boards |
JP5937932B2 (ja) * | 2012-09-14 | 2016-06-22 | 富士機械製造株式会社 | スクリーン印刷機 |
JP5681695B2 (ja) | 2012-12-19 | 2015-03-11 | ヤマハ発動機株式会社 | 基板印刷装置 |
US9126398B2 (en) * | 2013-07-26 | 2015-09-08 | Asm Assembly Systems Singapore Pte Ltd | Apparatus for paste material printing, and printing method |
JP2015083364A (ja) * | 2013-09-19 | 2015-04-30 | パナソニックIpマネジメント株式会社 | スクリーン印刷機及び部品実装ライン |
JP6142290B2 (ja) * | 2013-10-01 | 2017-06-07 | パナソニックIpマネジメント株式会社 | スクリーン印刷機、部品実装ライン及びスクリーン印刷方法 |
JP6209742B2 (ja) * | 2014-03-18 | 2017-10-11 | パナソニックIpマネジメント株式会社 | スクリーン印刷システム、スクリーン印刷装置及び部品実装ライン |
CN103963431B (zh) * | 2014-04-26 | 2019-05-07 | 昆山允升吉光电科技有限公司 | 一种印刷用掩模板及其使用方法 |
DE102014212374B4 (de) * | 2014-06-26 | 2019-05-16 | Ekra Automatisierungssysteme Gmbh | Drucksystem zum Bedrucken von Substraten, Verfahren zum Bedrucken eines Substrats |
JP6424334B2 (ja) * | 2014-12-01 | 2018-11-21 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置及び部品実装ライン |
DE102015220746A1 (de) * | 2015-10-23 | 2017-04-27 | Ersa Gmbh | Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile |
CN107215096A (zh) * | 2017-06-28 | 2017-09-29 | 武汉华星光电半导体显示技术有限公司 | 涂胶设备 |
KR101857203B1 (ko) * | 2017-12-01 | 2018-05-11 | 주식회사 이노티스 | 이종패턴 인쇄가 가능한 마스킹유닛이 구비된 스크린 프린터 |
CN108674007A (zh) * | 2018-03-27 | 2018-10-19 | 广东欧珀移动通信有限公司 | 用于锡膏印刷生产线的钢网及锡膏印刷生产线 |
EP4102943A1 (en) * | 2021-06-11 | 2022-12-14 | ZF CV Systems Europe BV | Printed circuit board (pcb) and method of manufacturing the same |
US11718087B2 (en) | 2021-08-24 | 2023-08-08 | Robert Bosch Gmbh | Squeegee for stencil printing |
US20230064682A1 (en) * | 2021-08-24 | 2023-03-02 | Robert Bosch Gmbh | Stencil for stencil printing process |
US11622452B2 (en) | 2021-08-24 | 2023-04-04 | Robert Bosch Gmbh | Method of manufacturing a conductive track on a board via stencil printing |
CN114987064B (zh) * | 2022-07-08 | 2024-03-22 | 武汉华星光电半导体显示技术有限公司 | 喷涂设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61164895A (ja) * | 1985-01-18 | 1986-07-25 | Matsushita Electric Ind Co Ltd | クリ−ム半田の印刷版 |
JP2006213000A (ja) * | 2005-02-07 | 2006-08-17 | Bonmaaku:Kk | スクリーン印刷版およびその製造方法 |
JP2006269555A (ja) * | 2005-03-22 | 2006-10-05 | Tdk Corp | 複合基板装置の製造方法 |
JP2006332254A (ja) * | 2005-05-25 | 2006-12-07 | Alps Electric Co Ltd | クリーム半田の塗布方法 |
JP2008272964A (ja) * | 2007-04-26 | 2008-11-13 | Fuji Mach Mfg Co Ltd | スクリーン印刷方法、スクリーン印刷機及びプリント基板生産ライン |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5724889A (en) * | 1995-09-22 | 1998-03-10 | Motorola, Inc. | Stencil shifter |
JP2001130160A (ja) | 1999-11-08 | 2001-05-15 | Matsushita Electric Ind Co Ltd | スクリーン印刷方法とその装置及びそれらに用いるスクリーンマスクと回路基板 |
JP2001199177A (ja) * | 2000-01-18 | 2001-07-24 | Sony Corp | スクリーン及びスクリーン印刷方法 |
JP5194505B2 (ja) | 2007-03-23 | 2013-05-08 | パナソニック株式会社 | キャビティ付きプリント配線基板とその製造方法 |
TW200906250A (en) * | 2007-07-27 | 2009-02-01 | Samsung Electro Mech | Mask for screen printing and screen printing method using the same |
JP2009062317A (ja) | 2007-09-06 | 2009-03-26 | Nissan Chem Ind Ltd | チオフェン誘導体を用いたフォトクロミック材料および光記録媒体 |
-
2009
- 2009-03-16 JP JP2009062317A patent/JP5018812B2/ja active Active
-
2010
- 2010-02-22 GB GB1115394.7A patent/GB2480579B/en not_active Expired - Fee Related
- 2010-02-22 KR KR1020117020924A patent/KR20110129885A/ko not_active Application Discontinuation
- 2010-02-22 CN CN201080011942XA patent/CN102356702B/zh active Active
- 2010-02-22 DE DE112010001165T patent/DE112010001165T5/de not_active Withdrawn
- 2010-02-22 US US13/255,367 patent/US8720331B2/en active Active
- 2010-02-22 WO PCT/JP2010/001161 patent/WO2010106741A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61164895A (ja) * | 1985-01-18 | 1986-07-25 | Matsushita Electric Ind Co Ltd | クリ−ム半田の印刷版 |
JP2006213000A (ja) * | 2005-02-07 | 2006-08-17 | Bonmaaku:Kk | スクリーン印刷版およびその製造方法 |
JP2006269555A (ja) * | 2005-03-22 | 2006-10-05 | Tdk Corp | 複合基板装置の製造方法 |
JP2006332254A (ja) * | 2005-05-25 | 2006-12-07 | Alps Electric Co Ltd | クリーム半田の塗布方法 |
JP2008272964A (ja) * | 2007-04-26 | 2008-11-13 | Fuji Mach Mfg Co Ltd | スクリーン印刷方法、スクリーン印刷機及びプリント基板生産ライン |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120107489A1 (en) * | 2010-11-03 | 2012-05-03 | International Business Machines Corporation | Cartridge Block for Multilayer Ceramic Screening |
US8642116B2 (en) * | 2010-11-03 | 2014-02-04 | International Business Machines Corporation | Cartridge block for multilayer ceramic screening |
US9283589B2 (en) | 2010-11-03 | 2016-03-15 | International Business Machines Corporation | Cartridge block for multilayer ceramic screening |
US9327305B2 (en) | 2010-11-03 | 2016-05-03 | International Business Machines Corporation | Cartridge block for multilayer ceramic screening |
US20120322334A1 (en) * | 2011-06-15 | 2012-12-20 | Sony Corporation | Method of manufacturing film and method of manufacturing display |
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CN102356702A (zh) | 2012-02-15 |
JP2010219179A (ja) | 2010-09-30 |
CN102356702B (zh) | 2013-07-03 |
GB201115394D0 (en) | 2011-10-19 |
GB2480579B (en) | 2014-05-14 |
US20110315028A1 (en) | 2011-12-29 |
US8720331B2 (en) | 2014-05-13 |
KR20110129885A (ko) | 2011-12-02 |
DE112010001165T5 (de) | 2012-01-26 |
JP5018812B2 (ja) | 2012-09-05 |
GB2480579A (en) | 2011-11-23 |
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