WO2010106742A1 - スクリーン印刷機及びスクリーン印刷機のクリーニング方法 - Google Patents
スクリーン印刷機及びスクリーン印刷機のクリーニング方法 Download PDFInfo
- Publication number
- WO2010106742A1 WO2010106742A1 PCT/JP2010/001162 JP2010001162W WO2010106742A1 WO 2010106742 A1 WO2010106742 A1 WO 2010106742A1 JP 2010001162 W JP2010001162 W JP 2010001162W WO 2010106742 A1 WO2010106742 A1 WO 2010106742A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode pattern
- substrate
- mask
- corresponding mask
- cavity
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/12—Machines with auxiliary equipment, e.g. for drying printed articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F35/00—Cleaning arrangements or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F35/00—Cleaning arrangements or devices
- B41F35/003—Cleaning arrangements or devices for screen printers or parts thereof
- B41F35/005—Cleaning arrangements or devices for screen printers or parts thereof for flat screens
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Definitions
- the present invention relates to a screen printing machine for performing screen printing on a so-called cavity substrate in which an electrode pattern is formed on the upper surface of a substrate and a bottom surface of an opening provided on a part of the upper surface of the substrate, and a cleaning method for the screen printing machine. It is.
- a so-called cavity substrate in which an electrode pattern is formed on the bottom surface of an opening (cavity portion) provided on a top surface of the substrate and a part of the top surface of the substrate.
- a flat plate portion that contacts the upper surface of the substrate and a protrusion protruding from the flat plate portion is fitted into the cavity portion.
- a three-dimensional mask member having a fitting portion to be used is used.
- a mask pattern corresponding to an electrode pattern (flat portion electrode pattern) provided on the upper surface of the substrate is formed on the flat plate portion, and an electrode pattern provided on the bottom surface of the cavity portion on the bottom surface of the fitting portion.
- a mask pattern corresponding to (cavity electrode pattern) is formed. For this reason, paste can be printed (transferred) simultaneously on both the flat portion electrode pattern and the cavity portion electrode pattern by performing screen printing by bringing the substrate and the mask member into contact with each other.
- the lower surface of the fitting portion corresponding to the cavity electrode pattern can be cleaned well.
- the lower surface of the flat plate portion corresponding to the flat portion electrode pattern has a problem in that it cannot be satisfactorily cleaned because the fitting portion becomes an obstacle.
- an object of the present invention is to provide a screen printing machine and a cleaning method for the screen printing machine that can satisfactorily clean a three-dimensional mask member for a cavity substrate.
- a screen printing machine includes a first electrode pattern formed on an upper surface of a substrate and a second electrode pattern formed on a bottom surface of an opening provided in a part of the upper surface of the substrate.
- a screen printing machine that performs screen printing on the second electrode, wherein a second electrode pattern corresponding mask pattern corresponding to the second electrode pattern is formed on the bottom surface of the fitting portion that fits into the opening of the substrate
- a mask member having a first electrode pattern corresponding mask region in which a pattern corresponding mask region and a first electrode pattern corresponding mask pattern corresponding to the first electrode pattern are formed as separate regions, and a second of the mask member
- the second electrode pattern corresponding mask region is cleaned by contacting the lower surface of the fitting portion in the electrode pattern corresponding mask region, and the first electrode pattern pair of the mask member And a cleaning device for cleaning the first electrode pattern corresponding mask region in contact with the lower surface of the mask region, with a.
- the screen printer of the second aspect is the screen printer of the first aspect, wherein the first electrode pattern corresponding mask region sandwiches the center line of the mask member parallel to the substrate transport direction.
- the second mask pattern-corresponding mask region is formed of one of the two mask member regions, and the second electrode pattern-corresponding mask region is one of the two mask member regions located across the center line of the mask member parallel to the substrate transport direction. Of the other side.
- the cleaning method for a screen printer includes a first electrode pattern formed on the upper surface of the substrate and a second electrode formed on the bottom surface of the opening provided in a part of the upper surface of the substrate.
- a cleaning method for a screen printing machine that performs screen printing using mask members each having a first electrode pattern corresponding mask region in which a first electrode pattern corresponding mask pattern corresponding to the electrode pattern is formed as separate regions.
- the cleaning device is brought into contact with the lower surface of the fitting portion in the mask area corresponding to the second electrode pattern of the mask member, so that the second electrode pattern corresponding mask.
- a step of cleaning the click region a cleaning step for cleaning the first electrode pattern corresponding mask region by contacting a cleaning device on the lower surface of the first electrode pattern corresponding mask region of the mask member.
- a cleaning method for a screen printing machine is the cleaning method for a screen printing machine according to the third aspect, wherein the first electrode pattern corresponding mask region is parallel to the substrate transport direction.
- the second electrode pattern-corresponding mask region is formed by one of two mask member regions located on both sides of the center line of the mask member, and the second electrode pattern corresponding mask region is located on both sides of the center line of the mask member parallel to the substrate transport direction. It consists of the other side of the area
- the mask member is a second electrode in which a mask pattern corresponding to the second electrode pattern corresponding to the second electrode pattern is formed on the bottom surface of the fitting portion that fits into the opening (cavity portion) of the substrate.
- the pattern-corresponding mask region and the first electrode pattern-corresponding mask region in which the first electrode pattern-corresponding mask pattern corresponding to the first electrode pattern is formed as separate regions, and the first electrode of the mask member The cleaning of the pattern corresponding mask area and the cleaning of the second electrode pattern corresponding mask area are performed separately. For this reason, the first electrode pattern corresponding mask region can be cleaned without obstructing the fitting portion in the second electrode pattern corresponding mask region, and the three-dimensional mask member for the cavity substrate is cleaned. Can be performed satisfactorily.
- the partial top view of the screen printer in one embodiment of this invention (A) Top view (b) Side sectional view of cavity substrate to be printed by screen printer in one embodiment of the present invention
- the mask member with which the screen printing machine in one embodiment of the present invention is provided (a) Plan view (b) Side sectional view
- the flowchart which shows the screen printing process which the screen printer in one embodiment of this invention performs (A) (b) Operation
- FIG. 1 is a partial plan view of a screen printer according to an embodiment of the present invention.
- FIG. 2 is a plan view of a cavity substrate to be printed by the screen printer according to an embodiment of the present invention.
- FIG. 3 is a side sectional view,
- FIG. 3 is a front view of a print execution unit provided in the screen printer in one embodiment of the present invention, and
- FIG. 4 is a plane (a) of a mask member provided in the screen printer in one embodiment of the present invention.
- FIG. 5 (b) is a side sectional view,
- FIG. 5 is a block diagram showing a control system of a screen printing machine according to an embodiment of the present invention, and FIGS.
- FIG. 6 (a), (b), (c), (d) and FIG. 7 (a), (b), (c), and (d) are side views of the mask member and the cavity substrate provided in the screen printing machine according to the embodiment of the present invention
- FIG. 8 is the embodiment of the present invention.
- FIGS. 9A, 9B, 10A, 10B, 11A, 12B, and 12A, 12B are flowcharts showing the steps.
- FIG. 13A and FIG. 13B are operation explanatory views of the cleaning device provided in the screen printer according to the embodiment of the present invention.
- a screen printing machine 1 includes a base 2, a substrate transport path 3 that is provided on the base 2, and transports and positions a substrate PB that is a printing target, and a substrate transport path. 3 includes a print execution unit 4 that performs screen printing on the substrate PB positioned by 3.
- the transport direction of the substrate PB in the screen printer 1 is defined as the X-axis direction
- the horizontal plane direction orthogonal to the X-axis direction is defined as the Y-axis direction
- the vertical direction is the Z-axis direction.
- the substrate PB is formed by bonding the upper layer side substrate member 12 to the upper surface of the lower layer side substrate member 11.
- a plurality of flat portion electrodes 12d are provided on the upper surface of the upper layer side substrate member 12, and a flat portion electrode pattern 12dp is formed on the upper surface of the upper layer side substrate member 12 by the plurality of flat portion electrodes 12d.
- a plurality of cavity electrodes 11 d are provided on the bottom surface (the upper surface of the lower layer side substrate member 11) of the cavity portion CV that is an opening provided on a part of the upper surface of the upper layer side substrate member 12.
- a cavity portion electrode pattern 11dp is formed on the bottom surface of the cavity portion CV by the plurality of cavity portion electrodes 11d.
- the substrate PB has a flat electrode pattern 12dp (first electrode pattern) formed on the upper surface (the upper surface of the upper layer side substrate member 12) and a bottom surface of the opening (cavity portion CV) provided on a part of the upper surface.
- the substrate transport path 3 includes a carry-in conveyor 21, a positioning conveyor 22 and a carry-out conveyor 23 provided side by side in the X-axis direction.
- the carry-in conveyor 21 carries the substrate PB input from the outside of the screen printing machine 1 (the left side in FIG. 1) into the screen printing machine 1 and delivers it to the positioning conveyor 22.
- the positioning conveyor 22 positions the substrate PB received from the carry-in conveyor 21 at a predetermined position, and transfers the substrate PB to the carry-out conveyor 23 after screen printing on the substrate PB is completed.
- the carry-out conveyor 23 carries the substrate PB received from the positioning conveyor 22 out of the screen printer 1.
- the print execution unit 4 clamps the substrate PB on the positioning conveyor 22 and moves the substrate PB in the horizontal plane (X-axis and Y-axis directions) and in the vertical direction (Z-axis direction).
- a substrate moving unit 31 to be performed, a pair of support rails 32 extending in the horizontal direction (Y-axis direction) above the substrate moving unit 31, and a plate-like mask member 33 supported by the support rails 32 are provided.
- the print execution unit 4 includes a substrate moving unit by a paste supply head 34 provided so as to be movable up and down in the horizontal plane above the mask member 33 and an XY robot 35 (FIG. 1) provided on the base 2.
- the camera unit 36 that is movable in the horizontal plane direction between the space 31 and the mask member 33 and the lower side of the support rail 32 are movable in the horizontal plane direction and can be moved up and down, and contact the lower surface of the mask member 33 from below. Then, a cleaning device 37 is provided for cleaning the paste residue remaining on the lower surface of the mask member 33 after the screen printing process.
- the substrate moving unit 31 of the print execution unit 4 includes a Y table 31a that moves relative to the base 2 in the Y axis direction, an X table 31b that moves relative to the Y table 31a in the X axis direction, and X A ⁇ table 31c that rotates relative to the table 31b around the Z axis, a base plate 31d fixed to the ⁇ table 31c, a first elevating plate 31e that elevates relative to the base plate 31d, and a relative elevating relative to the first elevating plate 31e A second elevating plate 31f, a receiving unit 31g fixed to the second elevating plate 31f, a positioning conveyor 22 constituting the substrate transport path 3, and a pair of clampers 31h that open and close in the Y-axis direction above the positioning conveyor 22 Become.
- the mask member 33 is supported on four sides by a frame member 33w having a rectangular shape in plan view, and the rectangular regions surrounded by the frame member 33w are mutually connected.
- a cavity portion corresponding mask region MRC and a flat portion corresponding mask region MRF, which are separate regions, are provided.
- the cavity portion corresponding mask region MRC is formed with a plurality of downwardly protruding fitting portions 33a that fit into the cavity portion CV of the substrate PB.
- Each fitting portion 33a is provided with a plurality of pattern holes h1 corresponding to a plurality of cavity portion electrodes 11d provided on the upper surface (the bottom surface of the cavity portion CV) of the lower layer side substrate member 11, and the cavity portion corresponding mask pattern MPC is formed.
- a plurality of pattern holes h2 corresponding to the plurality of flat part electrodes 12d provided on the upper surface of the upper layer side substrate member 12 are provided to form a flat part corresponding mask pattern MPF. Yes.
- the mask member 33 is formed with the cavity portion corresponding mask pattern MPC corresponding to the cavity portion electrode pattern 11dp on the bottom surface of the fitting portion 33a to be fitted into the cavity portion CV (opening portion of the upper layer side substrate member 12) of the substrate PB.
- the cavity portion corresponding mask region MRC and the flat portion corresponding mask region MRF in which the flat portion corresponding mask pattern MPF corresponding to the flat portion electrode pattern 12dp are formed are respectively provided as separate regions.
- the flat portion corresponding mask area MRF is an area of the two mask members 33 located across the center line CL of the mask member 33 parallel to the transport direction (X-axis direction) of the substrate PB.
- the cavity part corresponding mask region MRC is formed on one side, and is formed on the other side of the two mask member 33 regions located across the center line CL of the mask member 33 parallel to the transport direction of the substrate PB.
- a pair of cavity portion side alignment marks 11m are provided at the diagonal position of the lower layer side substrate member 11, and the diagonal position of the upper layer side substrate member 12 is provided at the diagonal position.
- a pair of flat portion side alignment marks 12m are provided.
- the cavity portion corresponding mask region MRC is located at the diagonal position of the cavity portion corresponding mask region MRC in which the cavity portion corresponding mask pattern MPC of the mask member 33 is formed.
- a pair of cavity portion corresponding mask region side alignment marks MKC for alignment with the partial electrode patterns 11dp are provided corresponding to the cavity portion side alignment marks 11m.
- Two portions for aligning the flat portion corresponding mask region MRF to the flat portion electrode pattern 12dp of the substrate PB are provided at the diagonal positions of the flat portion corresponding mask region MRF on which the flat portion corresponding mask pattern MPF of the mask member 33 is formed.
- a set of flat portion corresponding alignment mark MKF is provided corresponding to the flat portion alignment mark 12m.
- the paste supply head 34 is provided above the support rail 32 so as to be movable in the Y-axis direction with respect to the substrate moving unit 31.
- the head main body 34a and the Y provided below the head main body 34a are provided. It consists of two guide members 34g that face each other in the axial direction.
- Each guide member 34g is a “spar” -like member extending in the X-axis direction, and a paste such as a solder paste or a conductive paste that is pumped downward from a paste cartridge (not shown) built in the head main body 34a. It guides so that it may concentrate on the target location on the mask member 33, and may be supplied.
- an XY robot 35 extends above the base 2 in the Y-axis direction, and is provided with a Y-axis stage 35a that is fixed relative to the base 2, and extends in the X-axis direction, on the Y-axis stage 35a.
- a moving plate 35c provided to be movable in the X-axis direction on the X-axis stage 35b.
- the camera unit 36 has a configuration in which a first camera 36 a with an imaging surface facing downward and a second camera 36 b with an imaging surface facing upward are attached to a moving plate 35 c of an XY robot 35. Yes.
- the cleaning device 37 contacts the lower surface of the mask member 33 from below while the cleaning paper 37a is stretched in the horizontal direction, and sends the cleaning paper 37a in the horizontal direction by a pair of rollers 37b. Can be cleaned.
- the substrate PB is transported and positioned by the carry-in conveyor 21, the positioning conveyor 22 and the carry-out conveyor 23 constituting the substrate transport path 3, and the control device 40 (FIG. 5) included in the screen printing machine 1 includes an actuator or the like (not shown). This is done by controlling the operation of the transport path operating mechanism 41 (FIG. 5).
- the controller 40 controls the Y table to move the first elevating plate 31e (with respect to the table 31c), the second elevating plate 31f with respect to the first elevating plate 31e (that is, the lowering unit 31g) and the opening / closing operation of the clamper 31h. This is done by controlling the operation of the substrate moving unit operating mechanism 42 (FIG. 5) including actuators such as the drive motor My and the X table drive motor Mx (FIG. 3).
- the movement of the paste supply head 34 in the horizontal plane direction is performed when the control device 40 controls the operation of the paste supply head horizontal movement mechanism 43 (FIG. 5) including an actuator (not shown).
- the operation is performed when the control device 40 controls the operation of the paste supply head lifting mechanism 44 (FIG. 5) including an actuator (not shown).
- the paste supply operation from the paste supply head 34 is performed by the control device 40 controlling the operation of a paste supply mechanism 45 (FIG. 5) including an actuator (not shown).
- the movement operation of the X-axis stage 35b constituting the XY robot 35 in the Y-axis direction and the movement operation of the movement plate 35c in the X-axis direction are performed by an XY robot operation mechanism 46 (FIG. 5) including an actuator (not shown). ).
- the first camera 36a is controlled by the control device 40, and the cavity portion side alignment mark 11m provided on the lower layer side substrate member 11 of the substrate PB and the flat portion side alignment mark 12m provided on the upper layer side substrate member 12.
- the second camera 36b is controlled by the control device 40 to image the cavity portion corresponding mask region side alignment mark MKC and the flat portion corresponding mask region side alignment mark MKF.
- Image data obtained by imaging with the first camera 36a and image data obtained by imaging with the second camera 36b are input to the control device 40 (FIG. 5).
- the moving operation of the cleaning device 37 in the horizontal plane direction is performed by the control device 40 controlling the operation of the cleaning device horizontal moving mechanism 47 (FIG. 5) including an actuator (not shown). This is done by controlling the operation of the cleaning device lifting mechanism 48 including an actuator (not shown) by the control device 40.
- the cleaning operation by the cleaning device 37 (the feeding operation of the cleaning paper 37a by the pair of rollers 37b) is performed by the control device 40 controlling the operation of a cleaning operation mechanism 49 (FIG. 5) including an actuator (not shown). .
- the control device 40 first corresponds to the cavity portion side alignment mark 11m provided on the lower layer side substrate member 11 of the substrate PB and the cavity portion of the mask member 33.
- the cavity region corresponding mask region side alignment mark MKC provided in the mask region MRC aligned in the vertical direction (FIG. 6A)
- the substrate PB and the mask member 33 are relatively close to each other in the vertical direction ( 6A, the fitting portion 33a in the mask portion MRC corresponding to the cavity portion of the mask member 33 is fitted into the corresponding cavity portion CV of the substrate PB from above (FIG. 6B).
- the paste PT is fed from above to each fitting portion 33a in the cavity portion corresponding mask region MRC by the paste supply head 34, and the cavity portion electrode pattern is passed through each pattern hole h1 constituting the cavity portion corresponding mask pattern MPC.
- the paste PT is supplied onto each cavity part electrode 11d constituting 11dp (FIG. 6C).
- the paste PT is printed (transferred) on each cavity electrode 11d (FIG. 6). (D)).
- the control device 40 first sets the flat portion side alignment mark 12m provided on the upper layer side substrate member 12 of the substrate PB and the flatness of the mask member 33.
- the substrate PB and the mask member 33 With the flat portion corresponding mask region side alignment mark MKF provided in the portion corresponding mask region MRF aligned in the vertical direction (FIG. 7A), the substrate PB and the mask member 33 are relatively close to each other in the vertical direction. Then, the substrate PB and the mask member 33 are brought into contact with each other (arrow B1 shown in FIG. 7A) (FIG. 7B).
- the alignment between the flat part corresponding mask region MRF of the mask member 33 and the flat part electrode pattern 12dp of the substrate PB is performed.
- the paste PT is fed from above to the flat portion corresponding mask region MRF by the paste supply head 34, and each flat portion constituting the flat portion electrode pattern 12dp is passed through each pattern hole h2 constituting the flat portion corresponding mask pattern MPF.
- the paste PT is supplied onto the electrode 12d (FIG. 7C).
- the paste PT is printed (transferred) on each flat portion electrode 12d (FIG. 7). (D)).
- the flat portion corresponding mask region MRF of the mask member 33 Since the flat portion corresponding mask region MRF of the mask member 33 is flat, the flat portion corresponding mask region MRF of the mask member 33 is brought into contact with the upper surface of the substrate PB in a state where the paste PT is printed on the cavity electrode 11d. However, the paste PT on the cavity electrode 11d and the mask member 33 do not interfere with each other. Therefore, the printing of the paste PT on the flat part electrode pattern 12dp using the flat part corresponding mask region MRF of the mask member 33 can be performed in a state where the paste PT is printed on the cavity part electrode 11d (see FIG. 7). ).
- the paste PT is printed on the cavity electrode pattern 11dp before the paste PT is printed on the flat electrode pattern 12dp, the printing of the paste PT on the cavity electrode pattern 11dp and the flat part are performed. Both the printing of the paste PT on the electrode pattern 12dp can be performed.
- the control device 40 detects that the substrate PB has been input from the operator (or another device (not shown) installed on the upstream side of the screen printing machine 1) to the substrate transport path 3 (loading conveyor 21) by a detection means (not shown). Then, the carry-in conveyor 21 and the positioning conveyor 22 are operated in conjunction to carry the substrate PB into the screen printer 1 (step ST1 in FIG. 8).
- the control device 40 fixes the substrate PB to the substrate moving unit 31 (step ST2 in FIG. 8).
- the second lifting plate 31f of the substrate moving unit 31 is raised relative to the first lifting plate 31e (arrow C1 shown in FIG. 9A), and the upper surface of the lower receiving unit 31g is placed on the substrate PB.
- the substrate PB is supported on the lower receiving unit 31g by contacting the lower surface with the lower surface (FIG. 9A).
- the substrate PB is clamped by the clamper 31h, and then the second elevating plate 31f is further raised (arrow C2 shown in FIG. 9B), and the lower receiving unit 31g is used for the substrate.
- control device 40 aligns the cavity portion corresponding mask region MRC of the mask member 33 and the cavity portion electrode pattern 11dp of the substrate PB (step ST3 in FIG. 8).
- the control device 40 first moves the camera unit 36 and controls the imaging operation of the first camera 36a to acquire image data of the cavity portion side alignment mark 11m provided on the lower layer side substrate member 11. Then, the position of the cavity part electrode pattern 11dp is grasped, and the image data of the cavity part corresponding mask area side alignment mark MKC provided on the mask member 33 by controlling the movement of the camera unit 36 and the imaging operation of the second camera 36b. And the position of the cavity portion corresponding mask region MRC is grasped.
- the control device 40 After grasping the position of the cavity part electrode pattern 11dp and the position of the cavity part corresponding mask region MRC, the control device 40 performs a movement operation of the substrate PB in the horizontal plane by the substrate moving unit 31 to move the substrate PB to the mask member 33. After being positioned directly below the cavity region corresponding mask region MRC, the substrate moving unit 31 performs a vertical movement of the substrate PB (upward movement of the first elevating plate 31e) to bring the substrate PB into contact with the mask member 33 from below. (Arrow C3 shown in FIG. 10A). Thereby, alignment between the cavity portion corresponding mask region MRC of the mask member 33 and the cavity portion electrode pattern 11dp of the substrate PB is performed (FIG. 10A).
- the control device 40 When the alignment between the cavity portion corresponding mask region MRC of the mask member 33 and the cavity portion electrode pattern 11dp of the substrate PB is completed, the control device 40 performs screen printing on the cavity portion electrode pattern 11dp (step ST4 in FIG. 8). .
- the control device 40 first moves the paste supply head 34 above the cavity portion corresponding mask region MRC, and the upper surface of the mask member 33 (the cavity portion corresponding mask region MRC) from the paste supply head 34.
- the paste PT is filled into the pattern hole h1 of the cavity portion corresponding mask pattern MPC by supplying the paste PT between the guide members 34g (inside) (FIG. 10B).
- the control device 40 After filling the pattern hole h1 of the cavity part corresponding mask pattern MPC with the paste PT, the control device 40 lowers the first elevating plate 31e (arrow C4 shown in FIG. 11A), and the substrate PB and the mask. The member 33 is separated (step ST5 in FIG. 8). As a result, the plate separation is performed, and the paste PT filled in the pattern hole h1 of the cavity part corresponding mask pattern MPC is printed on the cavity part electrode pattern 11dp (FIG. 11A).
- step ST5 for the cavity electrode pattern 11dp is completed, and the screen printing process (second screen printing process, step) for the flat part electrode pattern 12dp described below. Steps ST6 to ST9) are executed.
- control device 40 first aligns the flat portion corresponding mask region MRF of the mask member 33 with the flat portion electrode pattern 12dp of the substrate PB (step ST6 in FIG. 8).
- the control device 40 first moves the camera unit 36 and controls the imaging operation of the first camera 36a to acquire image data of the flat portion side alignment mark 12m provided on the upper layer side substrate member 12.
- the image data of the flat portion corresponding mask region side alignment mark MKF provided on the mask member 33 by grasping the position of the flat portion electrode pattern 12dp and controlling the movement of the camera unit 36 and the imaging operation of the second camera 36b. And the position of the flat portion corresponding mask region MRF is grasped.
- the control device 40 After grasping the position of the flat part electrode pattern 12dp and the position of the flat part corresponding mask region MRF, the control device 40 performs a movement operation of the substrate PB in the horizontal plane by the substrate moving unit 31 (in FIG. 11B). Arrow C5), after the substrate PB is positioned immediately below the flat portion corresponding mask region MRF of the mask member 33 (FIG. 11B), the substrate moving unit 31 moves the substrate PB in the vertical direction (first lifting plate). 31e is raised), the substrate PB is brought into contact with the lower surface of the mask member 33 from below (arrow C6 shown in FIG. 12A). As a result, the flat portion corresponding mask region MRF of the mask member 33 and the flat portion electrode pattern 12dp of the substrate PB are aligned (FIG. 12A).
- the flat portion corresponding mask region MRF and the flat portion electrode pattern 12dp are aligned by the flat portion corresponding mask region MRF of the mask member 33 and the flat portion electrode pattern of the substrate PB.
- the first mark (flat portion corresponding mask region side alignment mark MKF and flat portion side position) provided on the upper surface of the mask portion 33 corresponding to the flat portion of the mask member 33 and the upper layer side substrate member 12 for alignment with 12 dp.
- the alignment mark 12m) is used.
- the alignment of the cavity portion corresponding mask region MRC and the cavity portion electrode pattern 11dp is performed by aligning the cavity of the mask member 33 with respect to the alignment of the cavity portion corresponding mask region MRC of the mask member 33 and the cavity portion electrode pattern 11dp of the substrate PB.
- Second mark (cavity part corresponding mask region side alignment mark MKC and second part mark provided on the upper surface of the lower layer side substrate member 11 which is the bottom surface of the opening part (cavity part CV) of the upper part side substrate member 12 and the part corresponding mask region MRC.
- the cavity portion side alignment mark 11m) is used.
- the alignment of the flat portion corresponding mask region MRF and the flat portion electrode pattern 12dp and the alignment of the cavity portion corresponding mask region MRC and the cavity portion electrode pattern 11dp are performed using different marks.
- control device 40 When the alignment between the flat portion corresponding mask region MRF of the mask member 33 and the flat portion electrode pattern 12dp of the substrate PB is completed, the control device 40 performs screen printing on the flat portion electrode pattern 12dp (step ST7 in FIG. 8). .
- the control device 40 first moves the paste supply head 34 above the flat portion corresponding mask region MRF, and the upper surface of the mask member 33 (flat portion corresponding mask region MRF) from the paste supply head 34.
- the paste PT is filled into the pattern hole h2 of the flat part corresponding mask pattern MPF by supplying the paste PT between the guide members 34g (inside) (FIG. 12B).
- the control device 40 After filling the pattern hole h2 of the flat part corresponding mask pattern MPF with the paste PT, the control device 40 lowers the first elevating plate 31e to separate the substrate PB and the mask member 33 (step ST8 in FIG. 8). . As a result, plate separation is performed, and the paste PT filled in the pattern hole h2 in the flat part corresponding mask pattern MPF is printed on the flat part electrode pattern 12dp. Thus, the second screen printing process for the flat portion electrode pattern 12dp is completed.
- the control device 40 opens the clamper 31h and releases the fixation of the substrate PB to the substrate moving unit 31 (step ST9 in FIG. 8). Then, the second elevating plate 31f is lowered to place the substrate PB on the positioning conveyor 22, and the substrate moving unit 31 is operated to adjust the position of the positioning conveyor 22 relative to the carry-out conveyor 23.
- the control device 40 operates the positioning conveyor 22 and the carry-out conveyor 23 in an interlocked manner to carry out the substrate PB from the screen printing machine 1 (step ST10 in FIG. 8).
- the control device 40 determines whether there is another substrate PB to be screen-printed (step ST11 in FIG. 8). As a result, when there is another substrate PB to be screen-printed, the process returns to step ST1 to carry in the substrate PB, and when there is no substrate PB to be screen-printed, the series of screen printing steps is terminated.
- the control device 40 performs screen printing on the flat portion electrode pattern 12dp first, the mask member 33 (cavity portion corresponding mask region MRC) for the cavity portion electrode pattern 11dp to be performed later and the substrate are used.
- the paste PT previously printed on the flat portion electrode pattern 12dp adheres to the lower surface of the mask member 33 at the time of contact with the PB.
- the control device 40 performs a step (first screen printing step) of performing screen printing on the cavity portion electrode pattern 11dp by aligning the cavity portion corresponding mask region MRC of the mask member 33 with the cavity portion electrode pattern 11dp of the substrate PB.
- the mask region MR corresponding to the flat portion of the mask member 33 And the flat part electrode pattern 12dp of the substrate PB are aligned to perform a screen printing process (second screen printing process) on the flat part electrode pattern 12dp. Can be prevented.
- the control device 40 cleans the lower surface of the mask member 33 by the cleaning device 37 after completing a series of screen printing steps. In the cleaning of the lower surface of the mask member 33, the cleaning for the cavity portion corresponding mask region MRC and the cleaning for the flat portion corresponding mask region MRF are performed separately.
- the cleaning of the mask member 33 corresponding to the cavity portion corresponding mask region MRC is performed by placing the cleaning paper 37a of the cleaning device 37 on the bottom surface of the fitting portion 33a in the cavity portion corresponding mask region MRC. After the contact, the cleaning device 37 is moved in the horizontal plane (arrow D1 shown in FIG. 13A), and the cleaning paper 37a is sent by the pair of rollers 37b, and the lower surface of the cavity corresponding mask region MRC. This is performed by removing the remaining residue of the paste PT adhering to (a first cleaning step). Further, as shown in FIG.
- the cleaning of the mask portion 33 corresponding to the flat portion corresponding mask region MRF is performed by bringing the cleaning paper 37a of the cleaning device 37 into contact with the lower surface of the flat portion corresponding mask region MRF. While moving the cleaning device 37 in the horizontal plane direction (arrow D2 shown in FIG. 13B), the cleaning paper 37a is sent by a pair of rollers 37b, and the paste PT adhered to the lower surface of the flat portion corresponding mask region MRF is sent. It is performed by removing the remaining soot (second cleaning step).
- the screen printer 1 has the flat portion electrode pattern 12dp (first electrode pattern) formed on the upper surface of the substrate PB and the opening provided in a part of the upper surface of the substrate PB.
- the cavity portion electrode pattern 11dp (second electrode pattern) formed on the bottom surface of the cavity portion CV, which is a portion, is subjected to screen printing, and the cavity portion electrode is formed on the bottom surface of the fitting portion 33a that fits into the cavity portion CV.
- MRC second electrode pattern corresponding mask region
- MPC second electrode pattern corresponding mask pattern
- Flat part corresponding mask pattern MPF (first electrode pattern corresponding mask pattern A mask member 33 having a flat portion corresponding mask region MRF (first electrode pattern corresponding mask region) formed as a separate region and a fitting portion in the cavity portion corresponding mask region MRC of the mask member 33.
- the cleaning method of the screen printer 1 in the present embodiment includes a flat electrode pattern 12dp (first electrode pattern) formed on the upper surface of the substrate PB and an opening provided in a part of the upper surface of the substrate PB.
- the cavity portion electrode pattern 11dp (second electrode pattern) formed on the bottom surface of the cavity portion CV is a cavity portion corresponding to the cavity portion electrode pattern 11dp on the bottom surface of the fitting portion 33a fitted to the cavity portion CV.
- a cavity portion corresponding mask region MRC (second electrode pattern corresponding mask region) in which a mask pattern MPC (second electrode pattern corresponding mask pattern) is formed and a flat portion corresponding mask pattern MPF (first portion) corresponding to the flat portion electrode pattern 12dp. 1 electrode pattern corresponding mask pattern).
- a step of cleaning the cavity region corresponding mask region MRC by bringing the cleaning device 37 into contact with the lower surface (bottom surface) of the fitting portion 33a in the mask region MRC, and a flat portion corresponding mask of the mask member 33 This includes a cleaning process (second cleaning process) in which the cleaning device 37 is brought into contact with the lower surface of the region MRF to clean the flat portion corresponding mask region MRF.
- the mask member 33 is formed on the bottom surface of the fitting portion 33a that fits into the opening (cavity portion CV) of the substrate PB.
- the cavity portion corresponding mask region MRC in which the cavity portion corresponding mask pattern MPC is formed and the flat portion corresponding mask region MRF in which the flat portion corresponding mask pattern MPF corresponding to the flat portion electrode pattern 12dp are formed are respectively separate regions.
- the cleaning of the mask area MRF corresponding to the flat part of the mask member 33 and the cleaning of the mask area MRC corresponding to the cavity part are performed separately. Therefore, the flat portion corresponding mask region MRF can be cleaned without obstructing the fitting portion 33a in the cavity portion corresponding mask region MRC, and the three-dimensional mask member 33 targeted for the cavity substrate can be cleaned well. Can be done.
- the present invention is not limited to those shown in the above-described embodiments.
- the case where the substrate PB is a cavity substrate formed by bonding two substrate members (the lower layer side substrate member 11 and the upper layer side substrate member 12) is exemplified.
- the substrate PB to be formed only needs to have the cavity part electrode pattern 11dp formed on the bottom surface of the cavity part CV provided open on the upper surface and the flat part electrode pattern 12dp formed on the upper surface.
- the configuration of is not particularly limited.
- the paste supply method may be an open squeegee supply and is not limited to a paste cartridge.
- a screen printing machine and a cleaning method for a screen printing machine that can satisfactorily clean a three-dimensional mask member for a cavity substrate.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
Abstract
Description
11dp キャビティ部電極パターン(第2の電極パターン)
12dp フラット部電極パターン(第1の電極パターン)
33 マスク部材
33a 嵌合部
37 クリーニング装置
MPC キャビティ部対応マスクパターン(第2の電極パターン対応マスクパターン)
MPF フラット部対応マスクパターン(第1の電極パターン対応マスクパターン)
MRC キャビティ部対応マスク領域(第2の電極パターン対応マスク領域)
MRF フラット部対応マスク領域(第1の電極パターン対応マスク領域)
PB 基板
CV キャビティ部(開口部)
CL マスク部材の中心線
Claims (4)
- 基板の上面に形成された第1の電極パターン及び基板の上面の一部に設けられた開口部の底面に形成された第2の電極パターンにスクリーン印刷を施すスクリーン印刷機であって、
基板の開口部に嵌合する嵌合部の底面に第2の電極パターンに対応する第2の電極パターン対応マスクパターンが形成された第2の電極パターン対応マスク領域及び第1の電極パターンに対応する第1の電極パターン対応マスクパターンが形成された第1の電極パターン対応マスク領域をそれぞれ別個の領域として有するマスク部材と、
マスク部材の第2の電極パターン対応マスク領域内の嵌合部の下面に接触して第2の電極パターン対応マスク領域のクリーニングを行い、マスク部材の第1の電極パターン対応マスク領域の下面に接触して第1の電極パターン対応マスク領域のクリーニングを行うクリーニング装置と、
を備えたことを特徴とするスクリーン印刷機。 - 第1の電極パターン対応マスク領域は基板の搬送方向と平行なマスク部材の中心線を挟んで位置する2つのマスク部材の領域のうちの一方側から成り、
第2の電極パターン対応マスク領域は基板の搬送方向と平行なマスク部材の中心線を挟んで位置する2つのマスク部材の領域のうちの他方側から成ることを特徴とする請求項1に記載のスクリーン印刷機。 - 基板の上面に形成された第1の電極パターン及び基板の上面の一部に設けられた開口部の底面に形成された第2の電極パターンに、基板の開口部に嵌合する嵌合部の底面に第2の電極パターンに対応する第2の電極パターン対応マスクパターンが形成された第2の電極パターン対応マスク領域及び第1の電極パターンに対応する第1の電極パターン対応マスクパターンが形成された第1の電極パターン対応マスク領域をそれぞれ別個の領域として有するマスク部材を用いてスクリーン印刷を施すスクリーン印刷機のクリーニング方法であって、
マスク部材の第2の電極パターン対応マスク領域内の嵌合部の下面にクリーニング装置を接触させて第2の電極パターン対応マスク領域のクリーニングを行う工程と、
マスク部材の第1の電極パターン対応マスク領域の下面にクリーニング装置を接触させて第1の電極パターン対応マスク領域のクリーニングを行うクリーニング工程と、
を含むことを特徴とするスクリーン印刷機のクリーニング方法。 - 第1の電極パターン対応マスク領域は基板の搬送方向と平行なマスク部材の中心線を挟んで位置する2つのマスク部材の領域のうちの一方側から成り、
第2の電極パターン対応マスク領域は基板の搬送方向と平行なマスク部材の中心線を挟んで位置する2つのマスク部材の領域のうちの他方側から成ることを特徴とする請求項3に記載のスクリーン印刷機のクリーニング方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/123,240 US20110192301A1 (en) | 2009-03-16 | 2010-02-22 | Screen printer and method for cleaning screen printer |
GB1106206.4A GB2480725B (en) | 2009-03-16 | 2010-02-22 | Screen printer and method for cleaning screen printer |
CN2010800031230A CN102202891A (zh) | 2009-03-16 | 2010-02-22 | 丝网印刷机和清洁丝网印刷机的方法 |
DE112010001113T DE112010001113T5 (de) | 2009-03-16 | 2010-02-22 | Siebdruckmaschine und Verfahren zum Reinigen der Siebdruckmaschine |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-062316 | 2009-03-16 | ||
JP2009062316A JP2010214680A (ja) | 2009-03-16 | 2009-03-16 | スクリーン印刷機及びスクリーン印刷機のクリーニング方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010106742A1 true WO2010106742A1 (ja) | 2010-09-23 |
Family
ID=42739409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/001162 WO2010106742A1 (ja) | 2009-03-16 | 2010-02-22 | スクリーン印刷機及びスクリーン印刷機のクリーニング方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110192301A1 (ja) |
JP (1) | JP2010214680A (ja) |
KR (1) | KR20110126581A (ja) |
CN (1) | CN102202891A (ja) |
DE (1) | DE112010001113T5 (ja) |
GB (1) | GB2480725B (ja) |
WO (1) | WO2010106742A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2014091603A1 (ja) * | 2012-12-13 | 2017-01-05 | 富士機械製造株式会社 | 粘性流体印刷装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5240069B2 (ja) * | 2009-05-25 | 2013-07-17 | パナソニック株式会社 | スクリーン印刷用マスクのクリーニング装置、スクリーン印刷機及びスクリーン印刷用マスクのクリーニング方法 |
JP5126172B2 (ja) | 2009-07-13 | 2013-01-23 | パナソニック株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
US9254641B2 (en) * | 2013-08-05 | 2016-02-09 | Asm Technology Singapore Pte. Ltd. | Screen printer, and method of cleaning a stencil of a screen printer |
US20230064682A1 (en) * | 2021-08-24 | 2023-03-02 | Robert Bosch Gmbh | Stencil for stencil printing process |
US11622452B2 (en) | 2021-08-24 | 2023-04-04 | Robert Bosch Gmbh | Method of manufacturing a conductive track on a board via stencil printing |
US11718087B2 (en) | 2021-08-24 | 2023-08-08 | Robert Bosch Gmbh | Squeegee for stencil printing |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04201261A (ja) * | 1990-11-29 | 1992-07-22 | Toshiba Corp | マスククリーニング装置 |
JPH11179883A (ja) * | 1997-12-19 | 1999-07-06 | Matsushita Electric Ind Co Ltd | クリーム半田印刷装置とその印刷用マスククリーニング方法 |
JP2001130160A (ja) * | 1999-11-08 | 2001-05-15 | Matsushita Electric Ind Co Ltd | スクリーン印刷方法とその装置及びそれらに用いるスクリーンマスクと回路基板 |
JP2001199177A (ja) * | 2000-01-18 | 2001-07-24 | Sony Corp | スクリーン及びスクリーン印刷方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61164895A (ja) * | 1985-01-18 | 1986-07-25 | Matsushita Electric Ind Co Ltd | クリ−ム半田の印刷版 |
GB2307446A (en) * | 1995-11-25 | 1997-05-28 | Ibm | Solder paste deposition |
JPH09314814A (ja) * | 1996-05-28 | 1997-12-09 | Matsushita Electric Ind Co Ltd | クリーニング装置およびクリーニング方法 |
JP3478958B2 (ja) * | 1997-11-28 | 2003-12-15 | 株式会社 日立インダストリイズ | スクリーン印刷装置および印刷方法並びにマスククリーニング方法 |
JP2001062993A (ja) * | 1999-08-31 | 2001-03-13 | Minami Kk | スクリーン印刷機 |
JP3846554B2 (ja) * | 2001-06-01 | 2006-11-15 | 日本電気株式会社 | 印刷用マスクおよび印刷方法、実装構造体およびこの実装構造体の製造方法 |
JP4696450B2 (ja) * | 2004-01-21 | 2011-06-08 | パナソニック株式会社 | スクリーン印刷装置 |
JP5194505B2 (ja) | 2007-03-23 | 2013-05-08 | パナソニック株式会社 | キャビティ付きプリント配線基板とその製造方法 |
JP2009062316A (ja) | 2007-09-06 | 2009-03-26 | Kunio Tsuji | フラン脂肪酸乃至はその誘導体を含有する皮膚外用剤 |
-
2009
- 2009-03-16 JP JP2009062316A patent/JP2010214680A/ja active Pending
-
2010
- 2010-02-22 DE DE112010001113T patent/DE112010001113T5/de not_active Withdrawn
- 2010-02-22 GB GB1106206.4A patent/GB2480725B/en not_active Expired - Fee Related
- 2010-02-22 US US13/123,240 patent/US20110192301A1/en not_active Abandoned
- 2010-02-22 WO PCT/JP2010/001162 patent/WO2010106742A1/ja active Application Filing
- 2010-02-22 CN CN2010800031230A patent/CN102202891A/zh active Pending
- 2010-02-22 KR KR1020117009072A patent/KR20110126581A/ko not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04201261A (ja) * | 1990-11-29 | 1992-07-22 | Toshiba Corp | マスククリーニング装置 |
JPH11179883A (ja) * | 1997-12-19 | 1999-07-06 | Matsushita Electric Ind Co Ltd | クリーム半田印刷装置とその印刷用マスククリーニング方法 |
JP2001130160A (ja) * | 1999-11-08 | 2001-05-15 | Matsushita Electric Ind Co Ltd | スクリーン印刷方法とその装置及びそれらに用いるスクリーンマスクと回路基板 |
JP2001199177A (ja) * | 2000-01-18 | 2001-07-24 | Sony Corp | スクリーン及びスクリーン印刷方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2014091603A1 (ja) * | 2012-12-13 | 2017-01-05 | 富士機械製造株式会社 | 粘性流体印刷装置 |
Also Published As
Publication number | Publication date |
---|---|
US20110192301A1 (en) | 2011-08-11 |
GB2480725A (en) | 2011-11-30 |
GB2480725B (en) | 2013-02-27 |
JP2010214680A (ja) | 2010-09-30 |
KR20110126581A (ko) | 2011-11-23 |
DE112010001113T5 (de) | 2012-09-13 |
CN102202891A (zh) | 2011-09-28 |
GB201106206D0 (en) | 2011-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5018812B2 (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
WO2010106742A1 (ja) | スクリーン印刷機及びスクリーン印刷機のクリーニング方法 | |
JP4985753B2 (ja) | スクリーン印刷システム及びスクリーン印刷システムのマスクのクリーニング方法 | |
JP5381830B2 (ja) | スクリーン印刷機及びスクリーン印刷機におけるマスク設置方法 | |
JP5240069B2 (ja) | スクリーン印刷用マスクのクリーニング装置、スクリーン印刷機及びスクリーン印刷用マスクのクリーニング方法 | |
WO2013168328A1 (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
KR20130004038A (ko) | 스크린 인쇄 시스템 및 스크린 인쇄 시스템의 마스크의 클리닝 방법 | |
JP2013018123A (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
JP5471860B2 (ja) | スクリーン印刷機 | |
JP5229244B2 (ja) | 電子部品実装用装置及び電子部品実装用装置による作業方法 | |
JP5062193B2 (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
JP5062198B2 (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
JP5251585B2 (ja) | 基板支持装置、電子部品実装用装置、基板支持方法及び電子部品実装用装置による作業方法 | |
JP5487660B2 (ja) | スクリーン印刷機 | |
JP5218181B2 (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
JP5146473B2 (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
JP5370229B2 (ja) | 電子部品実装用装置及び電子部品実装用装置による作業方法 | |
JP5347453B2 (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
JP5257282B2 (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
JP5903574B2 (ja) | スクリーン印刷機 | |
JP5040903B2 (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
JP4952697B2 (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
JP4957685B2 (ja) | スクリーン印刷機及びスクリーン印刷方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080003123.0 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10753239 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13123240 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 1106206 Country of ref document: GB Kind code of ref document: A Free format text: PCT FILING DATE = 20100222 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1106206.4 Country of ref document: GB |
|
ENP | Entry into the national phase |
Ref document number: 20117009072 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 112010001113 Country of ref document: DE Ref document number: 1120100011133 Country of ref document: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10753239 Country of ref document: EP Kind code of ref document: A1 |