WO2010092985A1 - 流体制御方法及び流体制御装置 - Google Patents

流体制御方法及び流体制御装置 Download PDF

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Publication number
WO2010092985A1
WO2010092985A1 PCT/JP2010/051973 JP2010051973W WO2010092985A1 WO 2010092985 A1 WO2010092985 A1 WO 2010092985A1 JP 2010051973 W JP2010051973 W JP 2010051973W WO 2010092985 A1 WO2010092985 A1 WO 2010092985A1
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WO
WIPO (PCT)
Prior art keywords
fluid
fluid control
acid
control method
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2010/051973
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English (en)
French (fr)
Japanese (ja)
Inventor
博 横田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kurashiki Spinning Co Ltd
Original Assignee
Kurashiki Spinning Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurashiki Spinning Co Ltd filed Critical Kurashiki Spinning Co Ltd
Priority to CN2010800072264A priority Critical patent/CN102316967A/zh
Priority to US13/201,155 priority patent/US20110315228A1/en
Publication of WO2010092985A1 publication Critical patent/WO2010092985A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/85—Investigating moving fluids or granular solids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/40—Static mixers
    • B01F25/42—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions
    • B01F25/43—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction
    • B01F25/432—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction with means for dividing the material flow into separate sub-flows and for repositioning and recombining these sub-flows; Cross-mixing, e.g. conducting the outer layer of the material nearer to the axis of the tube or vice-versa
    • B01F25/4323—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction with means for dividing the material flow into separate sub-flows and for repositioning and recombining these sub-flows; Cross-mixing, e.g. conducting the outer layer of the material nearer to the axis of the tube or vice-versa using elements provided with a plurality of channels or using a plurality of tubes which can either be placed between common spaces or collectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80—Forming a predetermined ratio of the substances to be mixed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/40—Mixing liquids with liquids; Emulsifying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00—Other mixers; Mixing plants; Combinations of mixers
    • B01F33/30—Micromixers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80—Forming a predetermined ratio of the substances to be mixed
    • B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
    • F15D1/00—Influencing flow of fluids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/33—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using ultraviolet light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems

Definitions

  • the flow rate is set according to the pump discharge rate and valve opening per fixed time, and the target liquid mixture is created by mixing the liquid flow rates for each fixed time.
  • a technology see, for example, Patent Document 1 and Patent Document 2.
  • the amount of hexafluorosilicic acid and water in the etching solution is somewhat reduced.
  • the extracted etching solution is processed to reduce hexafluorosilicic acid and water.
  • the optical measurement is performed by transporting a fluid to a light transmitting cell portion made of, for example, glass, irradiating the fluid there, and receiving the light transmitted through the fluid.
  • the fluid is transported to a flow path in the microfluidic system, and measurement is performed by projecting and receiving light on a predetermined cell portion using an optical fiber, for example.
  • This facilitates optical measurement of a plurality of measurement points.
  • pure water or the like is assigned to one of multiple cells as a calibration solution, measuring the location of the cell containing pure water makes it easy to calibrate the spectrometer including the optical fiber system and provides long-term reliability. And stability of measured values can be secured.
  • the flow rate of the fluid can be controlled by, for example, a proportional valve, but can be easily formed into a microfluidic system by using a method that positively utilizes the change in the viscosity of the liquid due to temperature.
  • the characteristics of the fluid include the temperature of the fluid and the concentration of the composition constituting the fluid.
  • the characteristics of the fluid in the fluid control method and the fluid control apparatus of the present invention are not limited to this.
  • the fluid before mixing is an alcohol solution and water
  • the fluid after mixing is a diluted alcohol solution
  • the fluid is a liquid
  • the characteristic of the fluid is the concentration of the composition constituting the liquid
  • the fluid before mixing is an alcohol solution and water
  • the fluid after mixing If is a diluted alcohol solution
  • the fluid control method and fluid control device of the present invention can be applied to, for example, a fuel cell.
  • the light incident on the incident side end surface of the light receiving side optical fiber 153 by the measuring unit 109 is incident on the convex lens 173 from the emission side end surface 153 a of the light receiving side optical fiber 153 by the spectroscopic unit 161, condensed, and incident on the light receiving element 179. Is done.
  • the light receiving element 179 converts the incident light into a photocurrent corresponding to the intensity thereof.
  • the electrical signal from the light receiving element 179 is sent to the control unit 143 also shown in FIG.
  • the etching solution after concentration adjustment flowing in the tube 123 is guided to the measurement unit 109 at the positions of symbols O and P.
  • the etching solution after concentration adjustment reaches the cell 123b.
  • the controller 143 operates the slider 159 to move the optical fibers 151 and 153 to the light transmission surface of the cell 123b, and measures the concentration of each component of the etching solution after concentration adjustment flowing in the tube 123. Thereby, it is confirmed whether the density

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Accessories For Mixers (AREA)
  • Weting (AREA)
PCT/JP2010/051973 2009-02-12 2010-02-10 流体制御方法及び流体制御装置 Ceased WO2010092985A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010800072264A CN102316967A (zh) 2009-02-12 2010-02-10 流体控制方法及流体控制装置
US13/201,155 US20110315228A1 (en) 2009-02-12 2010-02-10 Fluid control method and fluid control device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009030366A JP5340760B2 (ja) 2009-02-12 2009-02-12 流体制御方法及び流体制御装置
JP2009-030366 2009-02-12

Publications (1)

Publication Number Publication Date
WO2010092985A1 true WO2010092985A1 (ja) 2010-08-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/051973 Ceased WO2010092985A1 (ja) 2009-02-12 2010-02-10 流体制御方法及び流体制御装置

Country Status (6)

Country Link
US (1) US20110315228A1 (enExample)
JP (1) JP5340760B2 (enExample)
KR (1) KR20110114613A (enExample)
CN (1) CN102316967A (enExample)
TW (1) TWI494729B (enExample)
WO (1) WO2010092985A1 (enExample)

Cited By (2)

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JP2014085261A (ja) * 2012-10-25 2014-05-12 Nikkiso Co Ltd 溶液の調製装置および溶液の調製方法
JP2021026003A (ja) * 2017-02-06 2021-02-22 イーエフエー—エンジニアリング フォー オール エルティーディー． マイクロミキサー

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JP5180263B2 (ja) * 2010-07-23 2013-04-10 倉敷紡績株式会社 基板処理装置
JP5741056B2 (ja) * 2011-02-25 2015-07-01 栗田工業株式会社 ガス溶解水の製造装置
KR101958387B1 (ko) * 2011-07-28 2019-03-20 주식회사 동진쎄미켐 근적외선 분광기를 이용한 구리막 식각 공정 제어방법 및 구리막 식각액 조성물의 재생방법
TW201706396A (zh) * 2011-08-22 2017-02-16 1366科技公司 用於酸性溼式化學蝕刻矽晶片之調配物
JP5752530B2 (ja) 2011-08-31 2015-07-22 倉敷紡績株式会社 基板処理装置
CN102814143A (zh) * 2012-09-13 2012-12-12 中国海洋石油总公司 即时混配装置
TWI641936B (zh) * 2012-11-13 2018-11-21 美商慧盛材料美國責任有限公司 漿料供應及／或化學品摻合物供應設備、方法、使用方法及製造方法
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CN105301174B (zh) * 2014-07-16 2017-07-18 中国科学院苏州纳米技术与纳米仿生研究所 用于微流控芯片的试剂滴定方法及装置、微流控芯片
WO2016071691A1 (en) * 2014-11-07 2016-05-12 Oxy Solutions As Apparatus for dissolving gas into a liquid
EP3408217B1 (en) * 2016-01-28 2020-12-23 Biolidics Limited Multi-stage target cell enrichment using a microfluidic device
CN106249773A (zh) * 2016-08-31 2016-12-21 张源兴 混合酸中单项酸检测控制装置
CN106841088A (zh) * 2017-01-17 2017-06-13 西安景辉信息科技有限公司 一种油料水分测定仪用传感器及其实施方法
JP6909620B2 (ja) * 2017-04-20 2021-07-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7110558B2 (ja) * 2017-09-01 2022-08-02 日産自動車株式会社 混合燃料供給装置及び混合燃料供給方法
JP6899760B2 (ja) * 2017-12-18 2021-07-07 三菱重工機械システム株式会社 液体混合装置
JP2019158794A (ja) * 2018-03-16 2019-09-19 シスメックス株式会社 検体処理方法、検体処理チップおよび検体処理装置
CN108869410A (zh) * 2018-06-11 2018-11-23 中国科学院工程热物理研究所 一种叶片以及用于叶片的流体控制方法
JP2020055214A (ja) * 2018-10-02 2020-04-09 東芝テック株式会社 液体吐出ヘッド及びプリンタ
CN111640661B (zh) * 2019-03-01 2024-01-30 东京毅力科创株式会社 基板处理方法、基板处理装置以及存储介质
EP4153356A4 (en) * 2020-05-18 2024-09-25 National University of Singapore MICROFLUIDIC DEVICE AND ITS LIQUID CONTROL SYSTEM
CN112763450A (zh) * 2020-12-14 2021-05-07 中国原子能科学研究院 一种同时测定水溶液中硝酸铝和硝酸浓度的方法
TWI880391B (zh) * 2023-10-11 2025-04-11 弘塑科技股份有限公司 流體流量校正系統及校正方法
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WO2025239355A1 (ja) * 2024-05-15 2025-11-20 慶應義塾 マイクロ流体デバイスにおける流体の粘度を制御するためのシステム及びマイクロ流体デバイスにおける流体の粘度を制御する方法

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014085261A (ja) * 2012-10-25 2014-05-12 Nikkiso Co Ltd 溶液の調製装置および溶液の調製方法
JP2021026003A (ja) * 2017-02-06 2021-02-22 イーエフエー—エンジニアリング フォー オール エルティーディー． マイクロミキサー
US12023669B2 (en) 2017-02-06 2024-07-02 Efa—Engineering For All Ltd. Micromixer
JP7553936B2 (ja) 2017-02-06 2024-09-19 イーエフエー―エンジニアリング フォー オール エルティーディー． マイクロミキサー
US12115531B2 (en) 2017-02-06 2024-10-15 E.F.A. Engineering For All Ltd. Test chip in a portable digital diagnostic device

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US20110315228A1 (en) 2011-12-29
JP2010184203A (ja) 2010-08-26
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