CN102316967A - 流体控制方法及流体控制装置 - Google Patents

流体控制方法及流体控制装置 Download PDF

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Publication number
CN102316967A
CN102316967A CN2010800072264A CN201080007226A CN102316967A CN 102316967 A CN102316967 A CN 102316967A CN 2010800072264 A CN2010800072264 A CN 2010800072264A CN 201080007226 A CN201080007226 A CN 201080007226A CN 102316967 A CN102316967 A CN 102316967A
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China
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fluid
acid
fluid control
concentration
mixed
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Pending
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CN2010800072264A
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English (en)
Chinese (zh)
Inventor
横田博
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Kurashiki Spinning Co Ltd
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Kurashiki Spinning Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/85—Investigating moving fluids or granular solids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80—Forming a predetermined ratio of the substances to be mixed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/40—Mixing liquids with liquids; Emulsifying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/40—Static mixers
    • B01F25/42—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions
    • B01F25/43—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction
    • B01F25/432—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction with means for dividing the material flow into separate sub-flows and for repositioning and recombining these sub-flows; Cross-mixing, e.g. conducting the outer layer of the material nearer to the axis of the tube or vice-versa
    • B01F25/4323—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction with means for dividing the material flow into separate sub-flows and for repositioning and recombining these sub-flows; Cross-mixing, e.g. conducting the outer layer of the material nearer to the axis of the tube or vice-versa using elements provided with a plurality of channels or using a plurality of tubes which can either be placed between common spaces or collectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00—Other mixers; Mixing plants; Combinations of mixers
    • B01F33/30—Micromixers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80—Forming a predetermined ratio of the substances to be mixed
    • B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
    • F15D1/00—Influencing flow of fluids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/33—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using ultraviolet light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Accessories For Mixers (AREA)
  • Weting (AREA)
CN2010800072264A 2009-02-12 2010-02-10 流体控制方法及流体控制装置 Pending CN102316967A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009030366A JP5340760B2 (ja) 2009-02-12 2009-02-12 流体制御方法及び流体制御装置
JP2009-030366 2009-02-12
PCT/JP2010/051973 WO2010092985A1 (ja) 2009-02-12 2010-02-10 流体制御方法及び流体制御装置

Publications (1)

Publication Number Publication Date
CN102316967A true CN102316967A (zh) 2012-01-11

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CN2010800072264A Pending CN102316967A (zh) 2009-02-12 2010-02-10 流体控制方法及流体控制装置

Country Status (6)

Country Link
US (1) US20110315228A1 (enExample)
JP (1) JP5340760B2 (enExample)
KR (1) KR20110114613A (enExample)
CN (1) CN102316967A (enExample)
TW (1) TWI494729B (enExample)
WO (1) WO2010092985A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102814143A (zh) * 2012-09-13 2012-12-12 中国海洋石油总公司 即时混配装置
CN102901713A (zh) * 2011-07-28 2013-01-30 株式会社东进世美肯 铜膜蚀刻工序控制方法及铜膜蚀刻液组合物的再生方法
CN105301174A (zh) * 2014-07-16 2016-02-03 中国科学院苏州纳米技术与纳米仿生研究所 用于微流控芯片的试剂滴定方法及装置、微流控芯片
CN106249773A (zh) * 2016-08-31 2016-12-21 张源兴 混合酸中单项酸检测控制装置
CN106841088A (zh) * 2017-01-17 2017-06-13 西安景辉信息科技有限公司 一种油料水分测定仪用传感器及其实施方法
CN108869410A (zh) * 2018-06-11 2018-11-23 中国科学院工程热物理研究所 一种叶片以及用于叶片的流体控制方法

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JP5180263B2 (ja) * 2010-07-23 2013-04-10 倉敷紡績株式会社 基板処理装置
JP5741056B2 (ja) * 2011-02-25 2015-07-01 栗田工業株式会社 ガス溶解水の製造装置
TW201706396A (zh) * 2011-08-22 2017-02-16 1366科技公司 用於酸性溼式化學蝕刻矽晶片之調配物
JP5752530B2 (ja) 2011-08-31 2015-07-22 倉敷紡績株式会社 基板処理装置
JP5642137B2 (ja) * 2012-10-25 2014-12-17 日機装株式会社 溶液の調製装置および溶液の調製方法
TWI641936B (zh) * 2012-11-13 2018-11-21 美商慧盛材料美國責任有限公司 漿料供應及／或化學品摻合物供應設備、方法、使用方法及製造方法
US9770804B2 (en) 2013-03-18 2017-09-26 Versum Materials Us, Llc Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture
WO2016071691A1 (en) * 2014-11-07 2016-05-12 Oxy Solutions As Apparatus for dissolving gas into a liquid
EP3408217B1 (en) * 2016-01-28 2020-12-23 Biolidics Limited Multi-stage target cell enrichment using a microfluidic device
JP7004333B2 (ja) * 2017-02-06 2022-01-21 イーエフエー―エンジニアリング フォー オール エルティーディー． 携帯用のデジタル診断デバイス
JP6909620B2 (ja) * 2017-04-20 2021-07-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7110558B2 (ja) * 2017-09-01 2022-08-02 日産自動車株式会社 混合燃料供給装置及び混合燃料供給方法
JP6899760B2 (ja) * 2017-12-18 2021-07-07 三菱重工機械システム株式会社 液体混合装置
JP2019158794A (ja) * 2018-03-16 2019-09-19 シスメックス株式会社 検体処理方法、検体処理チップおよび検体処理装置
JP2020055214A (ja) * 2018-10-02 2020-04-09 東芝テック株式会社 液体吐出ヘッド及びプリンタ
CN111640661B (zh) * 2019-03-01 2024-01-30 东京毅力科创株式会社 基板处理方法、基板处理装置以及存储介质
EP4153356A4 (en) * 2020-05-18 2024-09-25 National University of Singapore MICROFLUIDIC DEVICE AND ITS LIQUID CONTROL SYSTEM
CN112763450A (zh) * 2020-12-14 2021-05-07 中国原子能科学研究院 一种同时测定水溶液中硝酸铝和硝酸浓度的方法
TWI880391B (zh) * 2023-10-11 2025-04-11 弘塑科技股份有限公司 流體流量校正系統及校正方法
CN118253246B (zh) * 2024-02-29 2025-03-14 安瑞科(廊坊)能源装备集成有限公司 甲醇溶液的自动配制装置、方法和电子设备
WO2025239355A1 (ja) * 2024-05-15 2025-11-20 慶應義塾 マイクロ流体デバイスにおける流体の粘度を制御するためのシステム及びマイクロ流体デバイスにおける流体の粘度を制御する方法

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102901713A (zh) * 2011-07-28 2013-01-30 株式会社东进世美肯 铜膜蚀刻工序控制方法及铜膜蚀刻液组合物的再生方法
CN102814143A (zh) * 2012-09-13 2012-12-12 中国海洋石油总公司 即时混配装置
CN105301174A (zh) * 2014-07-16 2016-02-03 中国科学院苏州纳米技术与纳米仿生研究所 用于微流控芯片的试剂滴定方法及装置、微流控芯片
CN105301174B (zh) * 2014-07-16 2017-07-18 中国科学院苏州纳米技术与纳米仿生研究所 用于微流控芯片的试剂滴定方法及装置、微流控芯片
CN106249773A (zh) * 2016-08-31 2016-12-21 张源兴 混合酸中单项酸检测控制装置
CN106841088A (zh) * 2017-01-17 2017-06-13 西安景辉信息科技有限公司 一种油料水分测定仪用传感器及其实施方法
CN108869410A (zh) * 2018-06-11 2018-11-23 中国科学院工程热物理研究所 一种叶片以及用于叶片的流体控制方法

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Publication number Publication date
JP5340760B2 (ja) 2013-11-13
TWI494729B (zh) 2015-08-01
TW201044130A (en) 2010-12-16
WO2010092985A1 (ja) 2010-08-19
KR20110114613A (ko) 2011-10-19
US20110315228A1 (en) 2011-12-29
JP2010184203A (ja) 2010-08-26

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Application publication date: 20120111