WO2010055899A1 - 樹脂組成物とそれを用いた透明な樹脂成形体および塗膜 - Google Patents
樹脂組成物とそれを用いた透明な樹脂成形体および塗膜 Download PDFInfo
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- WO2010055899A1 WO2010055899A1 PCT/JP2009/069310 JP2009069310W WO2010055899A1 WO 2010055899 A1 WO2010055899 A1 WO 2010055899A1 JP 2009069310 W JP2009069310 W JP 2009069310W WO 2010055899 A1 WO2010055899 A1 WO 2010055899A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/67—Particle size smaller than 100 nm
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/68—Particle size between 100-1000 nm
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/69—Particle size larger than 1000 nm
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
Definitions
- the present invention relates to a resin composition, a resin molded body, and a coating film, and more specifically, a resin composition in which scaly particles are dispersed in a transparent resin, and a transparent resin molded body and a coating formed from the resin composition. Relates to the membrane.
- Patent Document 1 discloses a method for improving mechanical strength by adding calcium carbonate and / or magnesium carbonate to an aliphatic polyester resin.
- a filler such as particles is added to the resin composition.
- the method of adding these fillers has a problem that the transparency is lowered when a transparent resin is used. Although a decrease in transparency can be suppressed by reducing the amount of filler added, there is also a problem that the modification effect due to the addition of filler becomes small.
- the present invention has been made in view of such circumstances, and an object of the present invention is to provide a resin composition and a resin molded article excellent in transparency despite containing a filler.
- the present inventors have used scale-like particles as a filler to be added to the transparent resin, and the difference between the refractive index of the transparent resin and the refractive index of the scale-like particles.
- the content By setting the content to 0.05 or less, a resin composition excellent in transparency can be obtained even when the filling amount of the filler is increased, and by adding a fibrous inorganic substance (C) to this composition, the heat can be obtained.
- C fibrous inorganic substance
- the present invention 1.
- the flaky particles (B) treated with the transparent resin (A) and the organic compound, the flaky particles (B) and the organic compound are chemically bonded, and the refractive index of the transparent resin (A) and the The resin composition, wherein the difference between the refractive index of the scaly particles (B) is within 0.05, 2.
- a transparent coating film formed from any one of the resin compositions 1 to 4 is provided.
- the resin composition of the present invention uses the scaly particles (B) as the filler, and the difference between the refractive index of the transparent resin (A) and the scaly particles (B) is within 0.05.
- the transparency of the transparent resin can also be maintained.
- by treating the scaly particles (B) with an organic compound the dispersibility of the scaly particles (B) with respect to the transparent resin (A) can be improved, so by using the resin composition of the present invention, A transparent resin molded product having excellent transparency and excellent moldability and mechanical properties can be obtained.
- the scaly particles (B) have a function of imparting flame retardancy, in addition to the above characteristics, a transparent resin molded article having excellent flame retardancy can be obtained. Moreover, a thermal expansion coefficient can be further suppressed by adding a fibrous inorganic substance (C) to the said composition further.
- the resin composition and transparent resin molded product of the present invention can be used for resin molded products that are required to have a small dimensional change as well as transparency, for example, a housing for home appliances. It can also be used for paints that require hardness as well as transparency.
- the resin composition according to the present invention includes a transparent resin (A) and scaly particles (B) treated with an organic compound, and the scaly particles (B) and the organic compound are chemically bonded to each other.
- the difference between the refractive index of (A) and the refractive index of the scaly particles (B) is within 0.05.
- the transparent resin (A) is not particularly limited as long as it is a transparent resin, and is a urethane resin, urea resin, melamine resin, acrylic resin, epoxy resin, styrene resin, silicone resin. Fluorine resin, polycarbonate resin, vinyl resin, olefin resin, ester resin, amide resin, imide resin, carbodiimide resin, alkyd resin, and copolymers thereof.
- the transparent resin (A) may be used by mixing a curing agent of the transparent resin (A), other additives, and the like as necessary.
- the scale-like particles (B) are thin plate-like particles such as scales, and the planar shape thereof is not particularly limited, such as a circle, an ellipse, a square, and an indefinite shape.
- the average particle diameter of the scale-like particles (B) is preferably 10 nm to 100 ⁇ m from the viewpoint of the transparency of the obtained resin molded product and the suppression of the thermal expansion coefficient. More preferably, the thickness is 20 nm to 50 ⁇ m, particularly 30 nm to 30 ⁇ m.
- the thickness of the scale-like particles (B) is preferably 1 nm to 10 ⁇ m from the viewpoint of the transparency of the obtained resin molded product and the suppression of the coefficient of thermal expansion.
- the aspect ratio (average particle diameter / thickness) of the scaly particles (B) is preferably 2 to 50 in terms of transparency and suppression of the thermal expansion coefficient. More preferably, it is 3 to 30, particularly 5 to 20.
- the average particle diameter and the particle thickness are values measured by a particle size distribution meter (MICROTRACHRA 9320-X100, manufactured by Nikkiso Co., Ltd.).
- the material of the scaly particles (B) is not particularly limited, and is a metal silicate such as calcium silicate, barium silicate, magnesium silicate, zinc silicate, aluminum silicate, copper silicate, calcium phosphate, phosphorus Metal phosphates such as barium phosphate and magnesium phosphate, metal sulfates such as calcium sulfate, barium sulfate and magnesium sulfate, silicon oxide (silica), magnesium oxide, aluminum oxide, zinc oxide, iron oxide, titanium oxide, cobalt oxide , Nickel oxide, manganese oxide, antimony oxide, tin oxide, calcium oxide, potassium oxide, silicon oxide, chromium oxide and other metal oxides, iron hydroxide, nickel hydroxide, aluminum hydroxide, magnesium hydroxide, calcium hydroxide, Metal hydroxides such as chromium hydroxide, potassium hydroxide and zinc hydroxide, nitriding Metal nitrides such as iodine, aluminum nitride and boron nitride
- silicon oxide silicon oxide (silica), magnesium oxide, aluminum oxide, zinc oxide, iron oxide, titanium oxide, cobalt oxide, Metal oxides such as nickel oxide, manganese oxide, antimony oxide, tin oxide, calcium oxide, potassium oxide, silicon oxide, chromium oxide, iron hydroxide, nickel hydroxide, aluminum hydroxide, magnesium hydroxide, calcium hydroxide, water Metal hydroxides such as chromium oxide, potassium hydroxide and zinc hydroxide, metal nitrides such as silicon nitride, aluminum nitride and boron nitride, metal fluorides such as boron fluoride, silicate minerals such as wollastonite and zonotonite , Talc, mica, hydrotalcite, potassium titanate, calcium titanate, glass It is preferable to use metal hydroxide, silicon oxide, and glass, which are usually used industrially in order to reduce the thermal expansion coefficient of the resin composition and to impart flame retardancy. I
- the surface of the scaly particles (B) used as the filler is treated with an organic compound for the purpose of improving dispersibility in the transparent resin (A).
- organic compound examples include fatty acids, fatty acid amides, fatty acid salts, fatty acid esters, aliphatic alcohols, silane coupling agents, titanium coupling agents, silicone polymers, phosphate esters and the like, and do not impair the effects of the present invention. If it is a thing, it will not specifically limit.
- the organic compound is preferably bonded to the scaly particles (B) by a chemical bond.
- the chemical bond is not particularly limited, and examples thereof include a covalent bond, a coordination bond, a hydrogen bond, and an ionic bond.
- Examples of the method for chemically bonding the organic compound to the scaly particles (B) include, for example, a method in which an organic compound having a functional group capable of reacting with a functional group on the surface of the scaly particles (B) is reacted and bonded. Examples thereof include a method of forming an organic compound layer (polymer layer) on the scaly particles (B) by graft polymerization as described in Kaikai 2005-179576 and WO 2006/137430.
- the refractive index of the transparent resin (A) and the refractive index of the scaly particles (B) it is important to make the refractive index of the transparent resin (A) and the refractive index of the scaly particles (B) the same or to reduce the difference therebetween.
- the difference in refractive index within 0.05, preferably within 0.03, and more preferably within 0.02, even when a large amount of filler is added to the resin composition, a resin molded article having high transparency. This is because
- the amount of scale-like particles (B) added is preferably 25 to 900 parts by weight, more preferably 40 to 600 parts by weight, and particularly preferably 100 to 400 parts by weight with respect to 100 parts by weight of the transparent resin (A). If it is 25 parts by mass or less, the effect of reforming as a filler is difficult to be exhibited, and if it is 900 parts by mass or more, the amount of the filler is too large and its dispersibility is lowered or the mechanical strength is lowered. May happen.
- the resin composition of the present invention contains the transparent resin (A) and the scaly particles (B) as main components, but other fillers, flame retardants, and low elasticity agents as long as the object of the present invention is not impaired. Additives such as adhesion promoters, diluents, antifoaming agents, and coupling agents may be added.
- the fibrous inorganic substance (C) as another filler, the thermal expansion coefficient of the obtained molded body can be further reduced.
- the fibrous inorganic material (C) in the present invention is not particularly limited, and examples thereof include aluminum hydroxide, basic magnesium sulfate, aluminum borate, calcium carbonate, and glass.
- the fiber length of the fibrous inorganic substance is preferably 1 to 500 ⁇ m, more preferably 5 to 200 ⁇ m.
- the fiber diameter is preferably 100 nm to 50 ⁇ m, more preferably 500 nm to 20 ⁇ m.
- the refractive index of the fibrous inorganic substance (C) is the same as or smaller than the refractive index of the transparent resin (A) for the same reason as described above. Is preferably within 0.05, more preferably within 0.03, and most preferably within 0.02. Further, the fibrous inorganic substance (C) may be treated with an organic compound for the purpose of improving dispersibility in the transparent resin (A), like the scaly particles (B).
- the amount of the fibrous inorganic substance (C) added is not particularly limited as long as it does not impair the object of the present invention. For example, it is preferably 2 to 200 parts by weight, more preferably 100 parts by weight of the transparent resin (A). Is 4 to 100 parts by mass.
- the resin composition of the present invention can be mixed and prepared by a conventionally known method.
- it can be prepared by mixing the above-described components with a stirring type disperser, disperse and mix with a bead mill, or disperse and mix with three rolls, but is limited to these methods.
- a known dispersion mixing means that can prepare a uniform resin composition can be employed.
- an organic solvent may be added as necessary. Examples of such an organic solvent include, but are not limited to, methyl ethyl ketone, N, N-dimethylformamide, and the like.
- a transparent resin molded body can be obtained by molding the resin composition of the present invention.
- a conventionally known method can be used as a method of molding the resin molded body, and is not particularly limited. Examples thereof include blow molding, injection molding, extrusion molding, and compression molding. Moreover, you may form a transparent coating film by apply
- the obtained molded body or film can be suitably used as an optical material, an electric / electronic material, a building material, an electrode material, a pharmaceutical cosmetic material, an automobile part, a clothing item, or the like.
- the IR spectrum of the particles was measured by FT-IR8900 ((Ltd.) manufactured by Shimadzu Corporation), it appeared absorbed from the benzene ring in the vicinity of 700 cm -1, further absorption derived from a carboxylic acid in the vicinity of 1700 cm -1 From the appearance, it was confirmed that the styrene-methacrylic acid copolymer was grafted.
- the refractive index of the magnesium hydroxide particles surface-treated with the obtained styrene-methacrylic acid copolymer was 1.56.
- Example 1 Synthesis Example 1 in 100 parts by mass of epoxy resin (main agent: Pernox ME-540 CLEAR, curing agent: Percure HV-540, compounding ratio 100: 60 (mass ratio, hereinafter the same) Pernox Co., Ltd., refractive index 1.55) 120 parts by mass of filler and 30 parts by mass of methyl ethyl ketone were added and stirred by a rotating / revolving mixer (Awatori Rentaro, manufactured by Shinkey Co., Ltd., the same shall apply hereinafter) so that the filler was uniformly dispersed. Obtained. The obtained resin composition was heated and cured at 150 ° C. for 16 hours to obtain a transparent resin molded product. The size and thickness of the test piece were respectively prepared according to the evaluation method described above.
- Example 2 A resin molded body was obtained in the same manner as in Example 1 except that the filler of Synthesis Example 1 was changed to the filler of Synthesis Example 2.
- Example 3 A resin molded body was obtained in the same manner as in Example 1 except that the blending amount of the filler was changed to 43 parts by mass.
- Example 4 A resin molded body was obtained in the same manner as in Example 1 except that the amount of the filler was changed to 25 parts by mass.
- Example 5 A resin molded body was obtained in the same manner as in Example 1 except that 20 parts by mass of the fibrous glass used in Synthesis Example 5 was further added as a filler.
- Example 6 A resin molded body was obtained in the same manner as in Example 1, except that 10 parts by mass of the fibrous glass used in Synthesis Example 5 was further added as a filler.
- Example 7 A resin molded body was obtained in the same manner as in Example 1 except that the filler of Synthesis Example 1 was changed to the filler of Synthesis Example 7.
- Epoxy resin main agent: Pernox ME-540 CLEAR, curing agent: Percure HV-540, blending ratio 100: 60 Pernox Co., Ltd., refractive index 1.55), 100 parts by weight of scaly hydroxylation without surface treatment 25 parts by mass of magnesium (Kisuma 5, manufactured by Kyowa Chemical Co., Ltd.) and 30 parts by mass of methyl ethyl ketone were added, and the mixture was stirred by a rotating / revolving mixer so that the filler was uniformly dispersed to obtain a resin composition.
- the obtained resin composition was molded and cured in the same manner as in Example 1 to obtain a resin molded body.
- Epoxy resin (main agent: Pernox ME-540 CLEAR, curing agent: Percure HV-540, blending ratio 100: 60 Pernox Co., Ltd., refractive index 1.55), 100 parts by weight of scaly hydroxylation without surface treatment 120 parts by mass of magnesium (Kisuma 5, manufactured by Kyowa Chemical Co., Ltd.), 2.4 parts by mass of the resin (styrene / methacrylic acid resin) used for the surface treatment of magnesium hydroxide in Synthesis Example 1, and 30 parts by mass of methyl ethyl ketone were added.
- the resin composition was obtained by stirring with a rotating / revolving mixer so that the filler was uniformly dispersed. In the obtained resin composition, the filler was not uniformly dispersed.
- the obtained resin composition was molded in the same manner as in Example 1, it was not possible to obtain a resin molded body in which the filler was uniformly dispersed.
- Comparative Example 7 A resin composition was obtained in the same manner as in Comparative Example 6 except that the styrene / methacrylic acid resin was changed to KBE402 used for the surface treatment of magnesium hydroxide in Synthesis Example 2. In the obtained resin composition, the filler was not uniformly dispersed. When the obtained resin composition was molded in the same manner as in Example 1, it was not possible to obtain a resin molded body in which the filler was uniformly dispersed.
- Epoxy resin (main agent: Pernox ME-540 CLEAR, curing agent: Percure HV-540, blending ratio 100: 60 Pernox Co., Ltd., refractive index 1.55), 100 parts by weight of scaly hydroxylation without surface treatment 25 parts by mass of magnesium (Kisuma 5, manufactured by Kyowa Chemical Co., Ltd.), 0.5 parts by mass of the resin (styrene / methacrylic acid resin) used for the surface treatment of magnesium hydroxide in Synthesis Example 1, and methyl ethyl ketone 30 Mass parts were added, and the mixture was stirred by a rotation / revolution mixer so that the filler was uniformly dispersed to obtain a resin composition. The obtained resin composition was molded and cured in the same manner as in Example 1 to obtain a resin molded body.
- Example 10 A resin molded body was obtained in the same manner as in Example 1 except that the filler of Synthesis Example 1 was changed to the filler of Synthesis Example 6. In the obtained resin composition, the filler was not uniformly dispersed. When the obtained resin composition was molded in the same manner as in Example 1, it was not possible to obtain a resin molded body in which the filler was uniformly dispersed.
- Comparative Example 11 A resin molded body was obtained in the same manner as in Comparative Example 10 except that the amount of the filler was 25 parts by mass. The obtained resin composition was molded and cured in the same manner as in Example 1 to obtain a resin molded body.
- Epoxy resin main agent: Pernox ME-562, curing agent: Percure HV-562, mixing ratio 100: 100, manufactured by Pernox Co., Ltd., refractive index 1.50
- 30 parts by mass of methyl ethyl ketone is added to 100 parts by mass and agitated by a rotating / revolving mixer.
- a resin composition was obtained.
- the obtained resin composition was heated and cured at 110 ° C. for 3 hours to obtain a transparent resin molded product.
- the size and thickness of the test piece were respectively prepared according to the evaluation method described above.
- Example 13 A resin composition was obtained in the same manner as in Example 1 except that the resin was changed to the resin of Comparative Example 12. The obtained resin composition was molded and cured in the same manner as in Example 1 to obtain a resin molded body.
- the resin molded bodies obtained in each Example were filled with fillers even in the case where the fillers were blended in an amount capable of exhibiting practically sufficient flame retardancy. It turns out that it has transparency equivalent to the comparative example 5 which is not mix
- the difference between the refractive index of the resin and the refractive index of the filler is excellent in transparency as compared with Comparative Examples 2, 11 and 13 in which the difference exceeds 0.05, It turns out that it is excellent in transparency and intensity
- the resin molded bodies obtained in Examples 5 and 6 are blended with linear inorganic substances, the linear expansion coefficient is smaller than that of the resin molded bodies obtained in Examples 1 to 4, and thermal expansion is achieved. It turns out that it is hard to do.
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Abstract
Description
例えば、特許文献1には、脂肪族ポリエステル樹脂に対して炭酸カルシウムおよび/または炭酸マグネシウムを添加して機械的強度を向上させる方法などが開示されている。
また、線膨張率を小さくして寸法安定性の高い樹脂成形体を得る目的で、樹脂組成物中に粒子等の充填材を加えることも行われている。
1. 透明樹脂(A)および有機化合物で処理された鱗片状粒子(B)を含み、この鱗片状粒子(B)と有機化合物とは化学結合しており、前記透明樹脂(A)の屈折率と前記鱗片状粒子(B)の屈折率との差が0.05以内であることを特徴とする樹脂組成物、
2. 前記鱗片状粒子(B)の平均粒径が10nm~100μm、厚みが1nm~10μmである1の樹脂組成物、
3. 前記鱗片状粒子(B)が、前記透明樹脂(A)100質量部に対して25~900質量部含まれる1または2の樹脂組成物、
4. さらに繊維状無機物(C)が含まれる1~3のいずれかの樹脂組成物、
5. 1~4のいずれかの樹脂組成物より形成される透明な樹脂成形体、
6. 1~4のいずれかの樹脂組成物より形成される透明な塗膜
を提供する。
この際、鱗片状粒子(B)を有機化合物で処理することで、鱗片状粒子(B)の透明樹脂(A)に対する分散性を向上させ得るので、本発明の樹脂組成物を用いることによって、透明性に優れるとともに、成形性や機械的物性にも優れた透明な樹脂成形体を得ることができる。
さらに、鱗片状粒子(B)が難燃性を付与する機能を有している場合は、上記の特性に加え、さらに難燃性にも優れた透明な樹脂成形体を得ることができる。
また、当該組成物に、さらに繊維状無機物(C)を添加することで熱膨張率をより一層抑制し得る。
本発明に係る樹脂組成物は、透明樹脂(A)および有機化合物で処理された鱗片状粒子(B)を含み、この鱗片状粒子(B)と有機化合物とは化学結合しており、透明樹脂(A)の屈折率と鱗片状粒子(B)の屈折率との差が0.05以内であるものである。
透明樹脂(A)は、必要に応じて透明樹脂(A)の硬化剤やその他の添加剤等を混合して用いてもよい。
鱗片状粒子(B)の平均粒径は10nm~100μmであることが、得られる樹脂成形体の透明性と熱膨張率の抑制の点から好ましい。より好ましくは20nm~50μm、特に30nm~30μmが好適である。
鱗片状粒子(B)の厚みは1nm~10μmであることが、得られる樹脂成形体の透明性と熱膨張率の抑制の点から好ましい。より好ましくは2nm~5μm、特に3nm~3μmが好適である。
鱗片状粒子(B)のアスペクト比(平均粒径/厚み)は2~50が透明性と熱膨張率の抑制の点で好ましい。より好ましくは3~30、特に5~20が好適である。
なお、本発明において、平均粒径および粒子の厚みは、粒度分布計(MICROTRACHRA 9320-X100,日機装(株)製)による測定値である。
有機化合物としては、例えば、脂肪酸、脂肪酸アミド、脂肪酸塩、脂肪酸エステル、脂肪族アルコール、シランカップリング剤、チタンカップリング剤、シリコーンポリマー、リン酸エステル等が挙げられ、本発明の効果を損なわないものであれば特に限定されない。
有機化合物は鱗片状粒子(B)と化学結合により結合していることが好ましい。この化学結合としては、特に制限はなく、共有結合、配位結合、水素結合、イオン結合等が挙げられる。
有機化合物を鱗片状粒子(B)と化学結合させる方法としては、例えば、鱗片状粒子(B)の表面の官能基と反応可能な官能基を有する有機化合物を反応させて結合させる方法、あるいは特開2005-179576号公報や国際公開第2006/137430号パンフレットに記載のように、鱗片状粒子(B)に有機化合物層(ポリマー層)をグラフト重合により形成する方法などが挙げられる。
特に、その他の充填材として、繊維状無機物(C)を添加することで、得られる成形体の熱膨張率をより一層低下させることができる。本発明における繊維状無機物(C)としては特別の制限は無く、水酸化アルミニウム、塩基性硫酸マグネシウム、硼酸アルミニウム、炭酸カルシウム、ガラス等が挙げられる。
繊維状無機物の繊維長は、1~500μmが好ましく、5~200μmがより好ましい。
繊維直径は、100nm~50μmが好ましく、500nm~20μmがより好ましい。
さらに、繊維状無機物(C)は、鱗片状粒子(B)と同様、透明樹脂(A)への分散性の向上などの目的で、有機化合物で処理してもよい。
繊維状無機物(C)の添加量は、本発明の目的を損なわない範囲であれば特に限定されないが、例えば、透明樹脂(A)100質量部に対して好ましくは2~200質量部、さらに好ましくは4~100質量部である。
例えば、前述した各成分を撹拌型の分散機で混合したり、ビーズミルで分散混合したり、3本ロールで分散混合したりすることによって調製することができるが、これらの方法に限定されるものではなく、均一な樹脂組成物を調製することができる公知の分散混合手段を採用することができる。
なお、混合・分散の際には、必要に応じて有機溶媒を添加してもよい。このような有機溶媒としては、例えば、メチルエチルケトン、N,N-ジメチルホルムアミド等が挙げられるが、これらに限定されるものではない。
また、本発明の樹脂組成物を物品等に塗布することにより、透明な塗膜を形成してもよい。
得られた成形体や膜は、光学材料、電気・電子材料、建築材料、電極材料、医薬化粧品材料、自動車部品、衣料品等として好適に用いることができる。
[1]線膨張係数
熱分析により測定した。具体的には、各実施例および比較例で得られた成形体より、幅5mm、長さ15mm、厚さ150μmの試験片を作製した。
この試験片について、熱分析装置(TMA8310,(株)リガク製)を用い、昇温速度5.0℃/分で30~200℃の範囲を測定した。
[2]透明性(ヘーズ)
JIS K 7136に準拠し、ヘーズメーター(NDH-500 日本電色工業(株)製)を用いて測定した。
[3]透明性(透過率)
JIS K 7361-1に準拠し、ヘーズメーター(NDH-500 日本電色工業(株)製)を用いて測定した。
[4]難燃性試験
UL94V「垂直難燃性試験方法(プラスチック材料の燃焼規格)」に準拠し、試験片の厚みを150μmとして燃焼試験の評価を行った。その結果を、判定基準に従い、94-V0、94-V1、94-V2、燃焼の4基準で評価した。
[5]粒径および厚み
充填材の平均粒径および粒子の厚みは、粒度分布計(MICROTRACHRA9320-X100,日機装(株)製)を用いて測定した。
[6]屈折率
屈折率計(モデル2010プリズムカプラ,セキテクロン(株)製)により測定した。
[7]硬度
JIS K 6253に準拠し、タイプDデュロメーター アスカ-D型(高分子計器(株)製)を用いて測定した。
[8]曲げ強さ
JIS K 6911に準拠して測定した。
[9]吸水率
JIS K 6911に準拠して測定した。
100mlのナスフラスコ中でジメチルホルムアミド(アルドリッチジャパン(株)製)30.0gに、平均粒径700nm、厚み100nm、屈折率1.56の鱗片状水酸化マグネシウム(キスマ5:表面未処理Mg(OH)2、協和化学(株)製)20.0gをよく分散させた。続いて3-メタクリロキシプロピルトリメトキシシラン(シランカップリング剤、チッソ(株)製)0.04gを添加し、70℃で30分間撹拌した。その後、アゾビスイソブチロニトリル(関東化学(株)製)0.02g、スチレン(関東化学(株)製)1.0g、メタクリル酸(関東化学(株)製)1.0gを添加し、70℃で約15時間加熱して反応させた。
反応終了後、未反応モノマー、グラフト化していないポリマーを除くため、水酸化マグネシウム粒子をテトラヒドロフラン(和光純薬工業(株)製)で洗浄し、吸引・ろ別する操作を3回繰り返した。洗浄後、この粒子のIRスペクトルをFT-IR8900((株)島津製作所製)で測定したところ、700cm-1付近にベンゼン環由来の吸収が現れ、さらに1700cm-1付近にカルボン酸由来の吸収が現れたことから、スチレン-メタクリル酸共重合ポリマーがグラフトされたことが確認された。得られたスチレン-メタクリル酸共重合体で表面処理された水酸化マグネシウム粒子の屈折率は1.56であった。
100mlのナスフラスコ中でジメチルホルムアミド(アルドリッチジャパン(株)製)30.0gに、平均粒径700nm、厚み100nm、屈折率1.56の鱗片状水酸化マグネシウム(キスマ5:表面未処理Mg(OH)2、協和化学(株)製)20.0gをよく分散させた。続いてエポキシ基含有シランカップリング剤(KBE402,信越化学工業(株)製)3.0gを添加し、70℃で15時間加熱して反応させた。
反応終了後、未反応のシランカップリング剤を除くため、水酸化マグネシウム粒子をテトラヒドロフラン(和光純薬工業(株)製)で洗浄し、吸引・ろ別する操作を3回繰り返した。洗浄後、この粒子のIRスペクトルをFT-IR8900((株)島津製作所製)で測定したところ、900cm-1付近にエポキシ基由来の吸収が現れたことからKBE402が水酸化マグネシウム表面と化学結合されたことが確認された。得られたエポキシ基含有シランカップリング剤で表面処理された水酸化マグネシウム粒子の屈折率は1.56であった。
鱗片状水酸化マグネシウムを球状水酸化マグネシウム(MGZ-3、協和化学(株)製、平均粒径100nm、屈折率1.56)に変更した以外は、合成例1と同様にして表面処理された充填材を得た。
鱗片状水酸化マグネシウムを球状シリカ(電気化学工業(株)製、平均粒径35nm、屈折率1.458)に変更した以外は、合成例1と同様にして表面処理された充填材を得た。
鱗片状水酸化マグネシウムを繊維状無機物である繊維状ガラス(富士ファイバーグラス(株)製、直径10μm、繊維長50~100μm、屈折率1.56)に変更した以外は、合成例1と同様にして表面処理された充填材を得た。
鱗片状水酸化マグネシウムを酸化アルミニウム(河合石灰工業(株)製、板状ベーマイトBMT、粒子径4μm、アスペクト比5~15、屈折率1.65)に変更した以外は、合成例1と同様にして表面処理された充填材を得た。
鱗片状水酸化マグネシウムを平均粒径4.0μm、厚み340nm、屈折率1.56のものに変更した以外は、合成例2と同様にして表面処理された充填材を得た。
エポキシ樹脂(主剤:ペルノックス ME-540 CLEAR、硬化剤:ペルキュアHV-540 配合比100:60(質量比、以下同様) ペルノックス(株)製、屈折率1.55)100質量部に、合成例1の充填材120質量部、メチルエチルケトン30質量部を添加し、充填材が均一に分散するよう自転・公転ミキサー(あわとり錬太郎、(株)シンキー製、以下同様)により撹拌し、樹脂組成物を得た。
得られた樹脂組成物を、150℃で16時間の条件で加熱・硬化し、透明な樹脂成形体を得た。試験片の大きさ、厚みは上述した評価方法に合わせてそれぞれ作製した。
合成例1の充填材を合成例2の充填材に変更した以外は、実施例1と同様にして樹脂成形体を得た。
充填材の配合量を43質量部に変更した以外は、実施例1と同様にして樹脂成形体を得た。
充填材の配合量を25質量部に変更した以外は、実施例1と同様にして樹脂成形体を得た。
充填材として、さらに合成例5で使用した繊維状ガラスを20質量部加えた以外は、実施例1と同様にして樹脂成形体を得た。
充填材として、さらに合成例5で使用した繊維状ガラスを10質量部加えた以外は、実施例1と同様にして樹脂成形体を得た。
合成例1の充填材を合成例7の充填材に変更した以外は、実施例1と同様にして、樹脂成形体を得た。
合成例1の充填材を合成例3の充填材に変更した以外は、実施例1と同様にして樹脂成形体を得た。
合成例1の充填材を合成例4の充填材に変更した以外は、実施例1と同様にして成形体を得た。
エポキシ樹脂(主剤:ペルノックス ME-540 CLEAR、硬化剤:ペルキュアHV-540 配合比100:60 ペルノックス(株)製、屈折率1.55)100質量部に、表面処理をしていない鱗片状水酸化マグネシウム(キスマ5、協和化学(株)製)120質量部、メチルエチルケトン30質量部を添加し、充填材が均一に分散するよう自転・公転ミキサーにより撹拌し、樹脂組成物を得た。しかしながら、充填材が均一に分散された樹脂組成物は得られなかった。
得られた樹脂組成物を、実施例1の方法と同様にして成形しようとしたが、均一に充填材が分散し硬化した樹脂成形体を得ることはできなかった。
エポキシ樹脂(主剤:ペルノックス ME-540 CLEAR、硬化剤:ペルキュアHV-540 配合比100:60 ペルノックス(株)製、屈折率1.55)100質量部に、表面処理をしていない鱗片状水酸化マグネシウム(キスマ5、協和化学(株)製)25質量部、メチルエチルケトン30質量部を添加し、充填材が均一に分散するよう自転・公転ミキサーにより撹拌し、樹脂組成物を得た。
得られた樹脂組成物を、実施例1の方法と同様にして成形・硬化し、樹脂成形体を得た。
エポキシ樹脂(主剤:ペルノックス ME-540 CLEAR、硬化剤:ペルキュアHV-540 配合比100:60 ペルノックス(株)製、屈折率1.55)のみを、実施例1の方法と同様にして成形・硬化し、樹脂成形体を得た。
エポキシ樹脂(主剤:ペルノックス ME-540 CLEAR、硬化剤:ペルキュアHV-540 配合比100:60 ペルノックス(株)製、屈折率1.55)100質量部に、表面処理をしていない鱗片状水酸化マグネシウム(キスマ5、協和化学(株)製)120質量部、合成例1で水酸化マグネシウムの表面処理に用いた樹脂(スチレン/メタクリル酸樹脂)2.4質量部、メチルエチルケトン30質量部を添加し、充填材が均一に分散するよう自転・公転ミキサーにより撹拌して樹脂組成物を得た。得られた樹脂組成物中では、充填材が均一に分散していなかった。
得られた樹脂組成物を、実施例1の方法と同様にして成形したところ、均一に充填材が分散した樹脂成形体を得ることはできなかった。
スチレン/メタクリル酸樹脂を、合成例2で水酸化マグネシウムの表面処理に用いたKBE402に変更した以外は、比較例6と同様にして樹脂組成物を得た。得られた樹脂組成物中では、充填材が均一に分散していなかった。
得られた樹脂組成物を、実施例1の方法と同様にして成形したところ、均一に充填材が分散した樹脂成形体を得ることはできなかった。
エポキシ樹脂(主剤:ペルノックス ME-540 CLEAR、硬化剤:ペルキュアHV-540 配合比100:60 ペルノックス(株)製、屈折率1.55)100質量部に、表面処理をしていない鱗片状水酸化マグネシウム(キスマ5、協和化学(株)製)を樹脂組成物の25質量部、合成例1で水酸化マグネシウムの表面処理に用いた樹脂(スチレン/メタクリル酸樹脂)0.5質量部、メチルエチルケトン30質量部を添加し、充填材が均一に分散するよう自転・公転ミキサーにより撹拌し、樹脂組成物を得た。得られた樹脂組成物を、実施例1の方法と同様にして成形・硬化し、樹脂成形体を得た。
スチレン/メタクリル酸樹脂を、合成例2で水酸化マグネシウムの表面処理に用いたKBE402に変更した以外は、比較例8と同様にして、樹脂組成物を得た。得られた樹脂組成物を、実施例1の方法と同様にして成形・硬化し、樹脂成形体を得た。
合成例1の充填材を合成例6の充填材に変更した以外は、実施例1と同様にして樹脂成形体を得た。得られた樹脂組成物中では、充填材が均一に分散していなかった。
得られた樹脂組成物を、実施例1の方法と同様にして成形したところ、均一に充填材が分散した樹脂成形体を得ることはできなかった。
充填材の量を25質量部とした以外は、比較例10と同様にして樹脂成形体を得た。得られた樹脂組成物を、実施例1の方法と同様にして成形・硬化し、樹脂成形体を得た。
エポキシ樹脂(主剤:ペルノックス ME-562、硬化剤:ペルキュアHV-562 配合比100:100 ペルノックス(株)製、屈折率1.50)100質量部にメチルエチルケトン30質量部を加え自転・公転ミキサーにより撹拌し、樹脂組成物を得た。
得られた樹脂組成物を、110℃で3時間の条件で加熱・硬化し、透明な樹脂成形体を得た。試験片の大きさ、厚みは上述した評価方法に合わせてそれぞれ作製した。
樹脂を比較例12の樹脂に変更した以外は、実施例1と同様にして樹脂組成物を得た。
得られた樹脂組成物を、実施例1の方法と同様にして成形・硬化し、樹脂成形体を得た。
また、各実施例で得られた成形体では、樹脂の屈折率と充填材の屈折率との差が0.05を超えている比較例2,11および13に比べ、透明性に優れるとともに、表面処理されていない充填材を用いた比較例8および9に比べ、透明性および強度に優れていることがわかる。
さらに、実施例5,6で得られた樹脂成形体は、線状無機物が配合されているから、実施例1~4で得られた樹脂成形体に比べて、線膨張係数が小さく、熱膨張しにくいものであることがわかる。
Claims (6)
- 透明樹脂(A)および有機化合物で処理された鱗片状粒子(B)を含み、この鱗片状粒子(B)と有機化合物とは化学結合しており、前記透明樹脂(A)の屈折率と前記鱗片状粒子(B)の屈折率との差が0.05以内であることを特徴とする樹脂組成物。
- 前記鱗片状粒子(B)の平均粒径が10nm~100μm、厚みが1nm~10μmである請求項1記載の樹脂組成物。
- 前記鱗片状粒子(B)が、前記透明樹脂(A)100質量部に対して25~900質量部含まれる請求項1または2記載の樹脂組成物。
- さらに繊維状無機物(C)が含まれる請求項1~3のいずれか1項記載の樹脂組成物。
- 請求項1~4のいずれか1項に記載の樹脂組成物より形成される透明な樹脂成形体。
- 請求項1~4のいずれか1項に記載の樹脂組成物より形成される透明な塗膜。
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JPS62148532A (ja) * | 1985-12-23 | 1987-07-02 | Sumitomo Bakelite Co Ltd | ガスバリア性透明プラスチツクフイルム及びその製造方法 |
JPH04126762A (ja) * | 1990-09-18 | 1992-04-27 | Toshiba Corp | 注型樹脂組成物 |
JP2004176031A (ja) * | 2002-02-06 | 2004-06-24 | Sekisui Chem Co Ltd | 樹脂組成物 |
JP2006176586A (ja) * | 2004-12-21 | 2006-07-06 | Sumitomo Bakelite Co Ltd | 透明複合体組成物及び光学シート並びに表示素子用プラスチック基板 |
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WO2011033751A1 (ja) * | 2009-09-18 | 2011-03-24 | 三井化学株式会社 | 透明熱可塑性ポリイミド、およびそれを含む透明基板 |
JP2011252112A (ja) * | 2010-06-03 | 2011-12-15 | Sekisui Chem Co Ltd | ガスバリアフィルム及びこれを用いた太陽電池用裏面保護シート |
WO2013021937A1 (ja) * | 2011-08-08 | 2013-02-14 | 日東電工株式会社 | 粘着テープ又はシート |
JP2013116944A (ja) * | 2011-12-01 | 2013-06-13 | Nitto Denko Corp | 粘着テープ又はシート |
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TW201031701A (en) | 2010-09-01 |
CN102216396B (zh) | 2014-06-25 |
CN102216396A (zh) | 2011-10-12 |
JPWO2010055899A1 (ja) | 2012-04-12 |
JP5821190B2 (ja) | 2015-11-24 |
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