WO2010050397A1 - 多ピース基板及びその製造方法 - Google Patents
多ピース基板及びその製造方法 Download PDFInfo
- Publication number
- WO2010050397A1 WO2010050397A1 PCT/JP2009/068170 JP2009068170W WO2010050397A1 WO 2010050397 A1 WO2010050397 A1 WO 2010050397A1 JP 2009068170 W JP2009068170 W JP 2009068170W WO 2010050397 A1 WO2010050397 A1 WO 2010050397A1
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- Prior art keywords
- piece
- substrate
- frame
- good
- recess
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Definitions
- the present invention relates to a multi-piece board having a frame part and a plurality of piece parts made of a wiring board, and a method for manufacturing the same.
- Patent Documents 1 to 3 disclose multi-piece substrates. These multi-piece substrates include a frame part and a plurality of piece parts connected to the frame part. When the multi-piece substrate includes defective pieces, the user cuts the defective pieces from the frame and attaches good pieces instead.
- the frame portion and the piece portion are joined only by fitting the uneven portions. For this reason, the adhesive strength of the joint portion is weak.
- the frame portion and the piece portion are joined only with an adhesive. For this reason, we are anxious about the position accuracy of a piece part getting worse by hardening shrinkage of an adhesive.
- the joint portion of the multi-piece substrate described in Patent Document 3 is covered with an upper layer. Thereby, it is thought that a joint part is reinforced.
- this method complicates the work for reinforcement (design, manufacturing process, etc.).
- the present invention has been made in view of such circumstances, and can provide a high connection strength at a joint portion between a frame portion and a piece portion with a simple process, and a multi-piece substrate with high mounting reliability of electronic components. And it aims at providing the manufacturing method.
- a manufacturing method of a multi-piece board according to a first aspect of the present invention is a manufacturing method of a multi-piece board having a frame and a plurality of pieces made of a wiring board and connected to the frame. Forming a first recess in the joint, forming a first fitting portion in the frame by cutting off the defective piece, and forming a second recess in the joint of a good piece on another substrate.
- a multi-piece substrate according to a second aspect of the present invention is a multi-piece substrate including a frame portion and a piece portion bonded to the frame portion with an adhesive, and the frame portion and the piece portion.
- the joint portion is flattened, and a first opening formed in the joint portion of the frame portion with the piece portion, and a second opening formed in the joint portion of the piece portion with the frame portion. Part forms a third opening filled with the adhesive.
- FIG. 2 is a partially enlarged view of FIG. 1.
- FIG. 1 It is a flowchart which shows the procedure of the manufacturing method of the multi-piece board
- substrate) fixed with the pin It is a figure for demonstrating the process of forming an opening part in the joint part of a defective piece and a frame part.
- FIG. 5A It is a figure for demonstrating the process of making a cut into the joint part of a defective piece and a frame part.
- FIG. 6B is a sectional view taken along line AA in FIG. 6B. It is a figure which shows another multi-piece board
- FIG. 9A It is a figure for demonstrating the process of making a cut in the joint part of a good piece and a frame part. It is a figure which shows the good piece cut
- FIG. 10B is a sectional view taken along line AA in FIG. 10B. It is a figure for demonstrating the process of fitting a good piece in a multi-piece board
- FIG. 13 is a partially enlarged view of FIG. 12. It is AA sectional drawing of FIG. 13A. It is a figure for demonstrating the process of planarizing the joint part of a flame
- a method for manufacturing a multi-piece substrate according to this embodiment will be described.
- the worker first manufactures a predetermined number of multi-piece substrates on the workpiece 100 as shown in FIG. FIG. 2 shows one multi-piece substrate 10.
- the multi-piece substrate 10 has frame parts 11a and 11b and piece parts 12a, 12b, 12c, and 12d.
- the frame portions 11a and 11b are two elongated rod-like portions sandwiching the continuous piece portions 12a to 12d.
- the shape of the frame parts 11a and 11b is not limited to this.
- the shapes of the frame portions 11a and 11b are arbitrary, and may be, for example, a parallelogram, circle, or ellipse frame surrounding the piece portions 12a to 12d.
- the frame parts 11a and 11b are made of the same material as the piece parts 12a to 12d, for example. However, this is not essential, and it may be made of a material different from that of the piece portions 12a to 12d. For example, you may manufacture only with an insulating material.
- the frame portions 11a and 11b are manufactured by, for example, a well-known photolithography technique.
- the piece parts 12a to 12d are made of a wiring board. Specifically, the piece portions 12a to 12d are formed of a rectangular rigid wiring board. This rigid wiring board includes, for example, a circuit of an electronic device.
- the piece portions 12a to 12d are formed by, for example, a general manufacturing method of a laminated wiring board, for example, an uncured epoxy resin, a polyimide resin, a phenol resin, or the like on a substrate such as a glass cloth, an aramid fiber nonwoven fabric, or paper. It can be manufactured by laminating prepregs impregnated with.
- the structure of the piece portions 12a to 12d is not limited to this.
- the piece portions 12a to 12d may be a wiring board in which wiring layers and insulating layers are alternately laminated on a ceramic base material, for example. Further, the piece portions 12a to 12d are not limited to the rigid wiring board, and may be a flexible wiring board or a flex rigid wiring board.
- the shape of the piece parts 12a to 12d is also arbitrary, and may be, for example, a parallelogram, a circle, an ellipse, or the like.
- Slits 13a and 13b are formed between the frame parts 11a and 11b and the piece parts 12a to 12d except for the bridges 121a to 121d and 122a to 122d. That is, the frame portion 11a and the piece portions 12a, 12b, 12c, and 12d are connected by the bridges 121a, 121b, 121c, and 121d, respectively. The frame portion 11b and the piece portions 12a, 12b, 12c, and 12d are connected by bridges 122a, 122b, 122c, and 122d, respectively.
- a plurality of multi-piece substrates having the above structure are manufactured in a single workpiece 100. And each multi-piece board
- step S11 the worker performs an energization inspection on each of the piece portions 12a, 12b, 12c, and 12d of the multi-piece substrate 10 (first substrate).
- step S12 it is determined whether or not there is a defective piece in the piece portions 12a to 12d.
- the energization inspection when it is determined that all piece parts are good pieces (step S12: NO), the process of FIG. 3 is terminated and the process proceeds to a subsequent process such as an assembly process.
- step S12: YES the process proceeds to step S13 in order to replace the defective piece with a good piece.
- the description will be continued with an example in which it is determined that the piece portion 12c is a defective piece.
- the operator stands the pins 31 and 32 on the frame portions 11a and 11b and the piece portion 12c, respectively, and fixes the multi-piece substrate 10.
- the alignment position of the piece part 12c is read with an alignment router machine.
- the geometric gravity center position 33 is obtained.
- a predetermined number of non-penetrating recesses 141c (openings) that are recessed with respect to the substrate surface are formed in the joint portions 14a and 14b between the portion 12c and the frame portions 11a and 11b.
- FIGS. 5A and 5B show only the frame portion 11b side, but the same applies to the frame portion 11a side.
- the operator cuts the seam portions 14a and 14b (FIG. 4) using the alignment router.
- Cutting the alignment router requires a cutting allowance (extra length). That is, as shown in FIG. 6A, the material of the cut portion 111b is lost by cutting the alignment router. Since the piece portion 12c (defective piece) will not be used later, the operator preferentially gives the frame portions 11a and 11b to a predetermined outer dimension (design value) by this cutting. And piece part 12c and frame parts 11a and 11b are separated. As a result, as shown in FIG.
- the joint portions 14a and 14b of the frame portions 11a and 11b are recessed into the concave portions 142c (recessed with respect to the side surfaces of the frame portions 11a and 11b, more specifically, the surface facing the piece portion) Nail receiving part) is formed.
- the recess 142c has a trapezoidal shape extending from the piece part 12c side to the frame parts 11a and 11b side.
- FIG. 6C (AA cross-sectional view of FIG. 6B), two quarter-spherical concave portions 141c remain in a predetermined number, for example, for every concave portion 142c, in the adjacent portion of the concave portion 142c.
- FIGS. 6A to 6C show only the frame portion 11b side, but the same applies to the frame portion 11a side.
- step S14 the operator prepares another multi-piece substrate 20 (second substrate) as shown in FIG. 7, for example.
- the multi-piece substrate 20 has the same structure as the multi-piece substrate 10. That is, the multi-piece substrate 20 includes frame portions 21a and 21b and piece portions 22a, 22b, 22c, and 22d. Slits 23a and 23b are formed between the frame portions 21a and 21b and the piece portions 22a to 22d except for the portions of the bridges 221a to 221d and 222a to 222d.
- the multi-piece substrate 20 may be manufactured with the same workpiece as the multi-piece substrate 10 or may be manufactured with a different workpiece.
- a multi-piece substrate that is determined to include both a defective piece and a good piece by an energization inspection is referred to as a multi-piece substrate 20.
- the piece parts 22a and 22c are defective pieces
- the piece parts 22b and 22d are good pieces.
- FIG. 8 the worker stands the pins 41 and 42 on the frame portions 21 a and 21 b and the piece portion 22 d to fix the multi-piece substrate 20.
- the alignment position of piece part 22d is read with an alignment router machine.
- the geometric gravity center position 43 is obtained.
- FIG. 9A and FIG. A predetermined number of non-penetrating recesses 241d (openings) that are recessed with respect to the substrate surface are formed in the joint portions 24a and 24b between the portion 22d and the frame portions 21a and 21b.
- FIGS. 9A and 9B show only the frame portion 21b side, but the same applies to the frame portion 21a side.
- the operator cuts the joint portions 24a and 24b (FIG. 8) using the alignment router.
- the material of the cut portion 211b is lost by cutting the alignment router. Since the frame portions 21a and 21b will not be used later, the operator preferentially finishes the piece portion 22d (good piece) and finishes it to a predetermined external dimension (design value) by this cutting. And piece part 22d and frame parts 21a and 21b are cut off.
- convex portions 242d fitting claws
- the convex part 242d has a trapezoidal shape extending from the piece part 22d side to the frame parts 21a and 21b side, and fits with the concave part 142c of the multi-piece substrate 10.
- the convex portions 242d are formed at, for example, four locations of the piece portion 22d.
- a quarter-spherical concave portion 241d remains at a predetermined number, for example, two per convex portion 242d, at the protruding end of each convex portion 242d.
- the concave portion 241d has a symmetrical shape with the concave portion 141c.
- FIGS. 10A to 10C show only the frame portion 21b side, but the same applies to the frame portion 21a side.
- step S15 the operator removes the piece portion 12c (defective piece) of the multi-piece substrate 10 to the piece portion 22d (good) of the multi-piece substrate 20. Insert a piece).
- the operator manually fits the convex portion 242d of the piece portion 22d into the concave portion 142c of the frame portions 11a and 11b.
- FIGS. 13A and 13B AA cross-sectional view in FIG. 13A
- the multi-piece substrate 10 and the piece portion 22d are positioned so that the concave portion 141c and the concave portion 241d face each other.
- the hemispherical concave portion 341 (opening) is formed by abutting the concave portion 141c and the concave portion 241d.
- the positional relationship is maintained even after fitting by the frictional force between the concave portion 142c and the convex portion 242d.
- step S16 the operator presses and flattens the substrate by, for example, a manual press machine 301a.
- the joint portion between the frame portions 11a and 11b and the piece portion 22d is flattened.
- the flattening means is arbitrary.
- flattening may be performed using an automatic press machine 301b shown in FIG. 14B or a roller press machine 301c shown in FIG. 14C.
- the automatic press machine 301b or the roller press machine 301c there is an effect that workability is improved.
- step S17 the operator inspects the flatness of the substrate with the laser displacement meter 302 as shown in FIG.
- step S18 it is determined whether or not the flatness is good. If it is determined in step S18 that the flatness is not good (step S18: NO), the process returns to step S16 and press is performed again.
- step S18 If it is determined in step S18 that the flatness is good (step S18: YES), in step S19 (FIG. 3), the operator places UV in resin in the recess 341 as shown in FIG. A curable adhesive 342 is filled.
- the UV curable adhesive 342 is filled in the gaps (joint portions) between the frame portions 11a and 11b and the piece portion 22d through the recesses 341.
- step S20 the operator spot-irradiates ultraviolet rays to cure the UV curable adhesive 342 as shown in FIG.
- substrate 10 are adhere
- piece part 22d is fixed to frame parts 11a and 11b.
- step S12 when it is determined that all piece parts are good pieces (step S12: NO), the process of FIG. 3 is terminated and the process proceeds to a subsequent process such as an assembly process. On the other hand, if it is determined that any piece part is a defective piece (step S12: YES), the process proceeds to step S13 to replace the defective piece with a good piece, and the above-described processing is executed again. .
- a so-called jigsaw substrate in which only good pieces are collected is formed.
- the multi-piece substrate can be repaired by exchanging the defective piece and the good piece.
- By performing such repair when a defect occurs in a part of the multi-piece substrate, it is not necessary to discard the entire substrate, and other good pieces are not wasted. Accordingly, the yield and the number of products can be improved.
- the tape for temporary fixing is not required. Therefore, no tape fixing process is required. For this reason, manufacturing cost can be reduced.
- the concave portion 341 is filled with the UV curable adhesive 342, and the both are bonded by the UV curable adhesive 342. For this reason, the connection strength between the frame portions 11a and 11b and the good piece is high.
- the frame parts 11a and 11b and the good piece are firmly fixed, the positional accuracy of both after bonding is high.
- the UV curable adhesive 342 is filled in the non-penetrating recess 341.
- the UV curable adhesive 342 is more reliably filled in the gaps (joint portions) between the frame portions 11a and 11b and the good pieces than in the case of the through holes.
- the frame portions 11 a and 11 b and the good piece are more reliably bonded by the UV curable adhesive 342.
- the area where the frame portions 11a and 11b are in contact with the good piece is larger than in the case of the through hole. For this reason, the friction force between both is also large.
- the alignment router In the above manufacturing method, an incision is made in the joint portions 14a and 14b between the piece portion 12c and the frame portions 11a and 11b by the alignment router. Moreover, the piece part 22d (good piece) is cut out from the multi-piece substrate 20 by the alignment router. For this reason, the dimensional accuracy of the recessed part 142c of frame part 11a, 11b and the convex part 242d of piece part 22d is high. According to the alignment router, the outer shape can be processed with an error level of ⁇ 20 ⁇ m, for example. Further, by improving the dimensional accuracy of the joint portion, the accuracy of the alignment between the frame portions 11a and 11b and the good piece after connection is also improved.
- the joint portion between the frame portions 11a and 11b and the good piece is flattened.
- the positional accuracy of the height of the part (good piece) which replaced and other parts also improves. For this reason, when mounting an electronic component on the piece part which consists of a wiring board, there are few mounting defects and a favorable mounting board can be manufactured with a high yield.
- the concave portion 341 is filled with the UV curable adhesive 342.
- UV curable adhesives do not require heat treatment.
- a photocurable adhesive is an adhesive that cures upon irradiation with electromagnetic waves such as ultraviolet rays and visible light.
- an energy irradiation type or a two-component curable acrylic adhesive is also effective. Since the acrylic adhesive does not require heat treatment, changes in the substrate shape (such as curing shrinkage) can be suppressed.
- a good piece is cut out from another multi-piece substrate 20 including both a defective piece and a good piece, and is replaced with a defective piece of the multi-piece substrate 10.
- the seam portions 14a and 14b are cut by the alignment router and the piece portion 22d (good piece) is cut out.
- the operator may use other means instead of the alignment router.
- a normal router bit router without an alignment function
- a laser or the like may be used depending on the application.
- the concave portion 341 is formed in a hemispherical shape, but the shape of the concave portion 341 may be other shapes.
- the planar shape of the recess 341 may be a parallel or inclined square shape to the frame portion.
- the cross-sectional shape of the recess 341 may be a triangular shape or a rectangular shape.
- the concave portion 141c and the concave portion 241d have a symmetric shape.
- FIG. 20A a figure corresponding to FIG. 13A
- FIG. 20B a figure corresponding to FIG. 13B
- both are asymmetrical.
- the shape may also be
- the concave portion 341 is not penetrating, but may be penetrating as shown in FIG. 21 (a diagram corresponding to FIG. 13B), for example.
- a plurality of substrates can be stacked and processed when the through hole is formed, and thus the production capacity is improved.
- the concave portion 142c (claw receiving portion) and the convex portion 242d (fitting claw) are formed at four locations of the frame portion or the good piece, but the number of fitting claws and claw receiving portions is arbitrary. As the number of the fitting claws and the claw receiving portions is increased, the fixing of the good pieces becomes stronger, but the manufacture becomes difficult.
- thermosetting adhesive can be used.
- the adhesive strength is high, but there is a concern about a change in the substrate shape accompanying a temperature change.
- Two or more types of adhesives may be used.
- a photocurable adhesive or an acrylic adhesive it may be reinforced with a thermosetting adhesive.
- the shape of the concave portion 142c (claw receiving portion) and the convex portion 242d (fitting claw) is not limited to a trapezoidal shape.
- the convex portion 242d may be T-shaped or L-shaped.
- the side of the convex portion 242d may be formed in a zigzag shape.
- the shape of the fitting portion is basically arbitrary. However, it is preferable that when the good piece is pulled parallel to the main surface of the substrate, the fitting portion is caught by the frame portion, and the good piece does not come out of the frame portion.
- the claw receiving portion is formed on the frame portion, and the fitting claw is formed on the good piece.
- the fitting claw is formed on the frame portion, and the claw receiving portion is formed on the good piece. Good.
- the good piece is cut out from the multi-piece substrate 20, but the good piece may be cut out from another substrate.
- a good piece may be cut out from a substrate that does not have a frame and has only a piece part alone.
- the concave portion 141c is formed before the defective piece is separated from the multi-piece substrate 10.
- the concave portion 141c may be formed after the defective piece is separated from the multi-piece substrate 10.
- the recess 241d may be formed.
- the step of inspecting the flatness can be omitted when strict flatness is not required.
- the material, size, number of layers, etc. of each layer can be arbitrarily changed.
- the multi-piece substrate of the present invention is suitable for forming an electric circuit. Moreover, the manufacturing method of the multi-piece board
- Multi-piece substrate (other substrate) 100 Workpiece 111b, 211b Cut portion 121a to 121d, 122a to 122d Bridge 141c Recessed portion (first opening) 142c Concave portion (first fitting portion) 221a to 221d, 222a to 222d Bridge 241d Recess (second opening) 242d Convex part (second fitting part) 301a Manual press machine 301b Automatic press machine 301c Roller press machine 302 Laser displacement meter 341 Recessed part (third opening) 342 UV curable adhesive
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Abstract
Description
作業者は、まず、図1に示すように、ワーク100に、所定の数の多ピース基板を製造する。図2に、その1つの多ピース基板10を示す。
11a、11b、21a、21b フレーム部
12a~12d、22a~22d ピース部
13a、13b、23a、23b スリット
14a、14b、24a、24b 継ぎ目部分
20 多ピース基板(他の基板)
100 ワーク
111b、211b 切り目部分
121a~121d、122a~122d ブリッジ
141c 凹部(第1の開口部)
142c 凹部(第1の嵌合部)
221a~221d、222a~222d ブリッジ
241d 凹部(第2の開口部)
242d 凸部(第2の嵌合部)
301a 手動プレス機
301b 自動プレス機
301c ローラープレス機
302 レーザ変位計
341 凹部(第3の開口部)
342 UV硬化型接着剤
Claims (12)
- フレームと、配線基板からなり前記フレームに接続された複数のピースと、を有する多ピース基板の製造方法であって、
不良ピースの継ぎ目に第1の凹部を形成することと、
前記不良ピースを切り離すことにより、前記フレームに第1の嵌合部を形成することと、
他の基板の良ピースの継ぎ目に、第2の凹部を形成することと、
前記他の基板から、第2の嵌合部を有する良ピースを切り出すことと、
前記第1の凹部に前記第2の凹部を合わせて、前記第1の嵌合部に、前記第2の嵌合部を嵌め込むことと、
前記第1の凹部と、前記第2の凹部とからなる第3の凹部に接着材を充填し、前記フレームと前記良ピースとを接着することと、
を含む、
ことを特徴とする多ピース基板の製造方法。 - 前記フレームと前記良ピースとの継ぎ目を平坦化すること、
を更に含む、
ことを特徴とする請求項1に記載の多ピース基板の製造方法。 - 前記第3の凹部は、非貫通の凹部である、
ことを特徴とする請求項1に記載の多ピース基板の製造方法。 - 前記他の基板は、不良ピースと良ピースとの両方を含む多ピース基板である、
ことを特徴とする請求項1に記載の多ピース基板の製造方法。 - アライメントルータにより、前記フレームに切り目を入れる、
ことを特徴とする請求項1に記載の多ピース基板の製造方法。 - アライメントルータにより、前記良ピースを切り出す、
ことを特徴とする請求項1に記載の多ピース基板の製造方法。 - 前記第3の凹部に充填された光硬化型接着剤により、前記フレームと良ピースを接着する、
ことを特徴とする請求項1に記載の多ピース基板の製造方法。 - 前記第3の凹部に充填されたアクリル系接着剤により、
前記フレームと良ピースとを接着する、
ことを特徴とする請求項1に記載の多ピース基板の製造方法。 - フレーム部と、
前記フレーム部に接着剤により接着されたピース部と、
からなる多ピース基板であって、
前記フレーム部と前記ピース部との継ぎ目部分は平坦化され、前記フレーム部の、前記ピース部との継ぎ目部分に形成された第1の開口部と、前記ピース部の、前記フレーム部との継ぎ目部分に形成された第2の開口部とが、前記接着剤が充填される第3の開口部を形成している、
ことを特徴とする多ピース基板。 - 前記第3の開口部は、非貫通の凹部である、
ことを特徴とする請求項9に記載の多ピース基板。 - 前記接着剤は、光硬化型接着剤である、
ことを特徴とする請求項9に記載の多ピース基板。 - 前記接着剤は、アクリル系接着剤である、
ことを特徴とする請求項9に記載の多ピース基板。
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KR1020117004777A KR101195648B1 (ko) | 2008-10-27 | 2009-10-22 | 다피스 기판 및 그의 제조 방법 |
JP2010535764A JPWO2010050397A1 (ja) | 2008-10-27 | 2009-10-22 | 多ピース基板及びその製造方法 |
CN200980100839XA CN101843180B (zh) | 2008-10-27 | 2009-10-22 | 多连片基板及其制造方法 |
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JP (1) | JPWO2010050397A1 (ja) |
KR (1) | KR101195648B1 (ja) |
CN (2) | CN101843180B (ja) |
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US8547702B2 (en) * | 2009-10-26 | 2013-10-01 | Ibiden Co., Ltd. | Multi-piece board and method for manufacturing the same |
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Also Published As
Publication number | Publication date |
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US20100101844A1 (en) | 2010-04-29 |
MY169426A (en) | 2019-04-08 |
US20120047728A1 (en) | 2012-03-01 |
CN101843180A (zh) | 2010-09-22 |
CN102413635B (zh) | 2015-03-18 |
CN102413635A (zh) | 2012-04-11 |
KR20110036856A (ko) | 2011-04-11 |
JPWO2010050397A1 (ja) | 2012-03-29 |
US9055668B2 (en) | 2015-06-09 |
CN101843180B (zh) | 2011-12-07 |
US8698004B2 (en) | 2014-04-15 |
KR101195648B1 (ko) | 2012-10-30 |
TW201031289A (en) | 2010-08-16 |
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