WO2010038782A1 - 密封装置および密封構造 - Google Patents
密封装置および密封構造 Download PDFInfo
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- WO2010038782A1 WO2010038782A1 PCT/JP2009/067039 JP2009067039W WO2010038782A1 WO 2010038782 A1 WO2010038782 A1 WO 2010038782A1 JP 2009067039 W JP2009067039 W JP 2009067039W WO 2010038782 A1 WO2010038782 A1 WO 2010038782A1
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- Prior art keywords
- conductive member
- electromagnetic wave
- layer
- opening
- conductive
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- 238000007789 sealing Methods 0.000 title claims abstract description 60
- 239000010410 layer Substances 0.000 claims description 75
- 238000003780 insertion Methods 0.000 claims description 18
- 230000037431 insertion Effects 0.000 claims description 18
- 239000011241 protective layer Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 11
- 229920001971 elastomer Polymers 0.000 description 10
- 239000005060 rubber Substances 0.000 description 10
- 239000011324 bead Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000013039 cover film Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene naphthalate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/064—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces the packing combining the sealing function with other functions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/73—Means for mounting coupling parts to apparatus or structures, e.g. to a wall
- H01R13/74—Means for mounting coupling parts in openings of a panel
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0018—Casings with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6598—Shield material
- H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Definitions
- the present invention relates to a sealing device and a sealing structure in which a conductive conductive seal member is integrated with a flexible flat conductive member.
- EMC electromagnetic compatibility
- an electromagnetic wave shield that prevents the radiation and intrusion of electromagnetic waves is known as one of the effective countermeasures.
- the sealing component does not have electrical conductivity, an electrical gap is generated in the mounting portion of the sealing component, and it is impossible to prevent electromagnetic waves from radiating and entering.
- Patent Document 1 the gasket that seals the joint surface between the lid of the casing and the casing is made conductive so that the lid and the casing are electrically connected to form an electromagnetic wave shield on the entire casing. is doing.
- the surface of the electromagnetic wave shielding layer of the FPC drawn out from the inside of the casing is covered with a protective film for surface protection and electrical insulation, sufficient electric power is provided between the electromagnetic wave shielding layer of the FPC and the casing. Connection cannot be made. Therefore, there is a possibility that the electromagnetic wave cannot be sufficiently shielded, for example, the shield layer serves as an antenna to generate secondary electromagnetic wave radiation.
- the present invention has been made to solve the above-described problems of the prior art, and an object of the present invention is to provide a sealing device and a sealing structure with improved shielding properties against electromagnetic waves.
- a sealing device comprises: A conductive sealing member that is integrated with a flexible flat conductive member drawn out from the inside of the housing and seals a gap between the conductive member and the insertion portion of the conductive member in the housing.
- a sealing device comprising: In the conductive member, an electromagnetic wave shielding layer is laminated on a protective layer that protects the surface of the base layer on which wiring is applied, an insulating layer is laminated on the electromagnetic wave shielding layer, and the insulating layer is made of the electromagnetic wave. An opening that exposes a portion of the planar portion of the shield layer; The seal member is integrated with the conductive member so as to cover the opening, and is in contact with the electromagnetic wave shielding layer through the opening.
- the sealing structure in the present invention is: A flat conductive member having flexibility; A housing having an insertion part through which the conductive member is inserted; A conductive sealing member that seals a gap between the conductive member and the insertion portion;
- an electromagnetic wave shielding layer is laminated on a protective layer that protects the surface of the base layer to which wiring is applied, an insulating layer is laminated on the electromagnetic wave shielding layer, and the insulating layer is made of the electromagnetic wave.
- the seal member is integrated with the conductive member so as to cover the opening, and is in contact with the electromagnetic wave shielding layer through the opening.
- the sealing structure in the present invention is: A flat conductive member having flexibility; A casing composed of a lid and a main body to which the lid is joined; A conductive sealing member that is attached to a joint surface between the lid and the main body to seal the joint surface, and that forms an insertion portion for pulling out the conductive member from the inside of the housing; , With In the conductive member, an electromagnetic wave shielding layer is laminated on a protective layer that protects the surface of the base layer on which wiring is applied, an insulating layer is laminated on the electromagnetic wave shielding layer, and the insulating layer is made of the electromagnetic wave. An opening that exposes a portion of the planar portion of the shield layer; The seal member is integrated with the conductive member so as to cover the opening, and is in contact with the electromagnetic wave shielding layer through the opening.
- the electromagnetic wave shielding layer by providing an opening in the insulating layer that protects the electromagnetic wave shielding layer, and by configuring a part of the flat portion of the electromagnetic wave shielding layer to contact the sealing member, the electromagnetic wave shielding layer and the housing of the conductive member The electrical gap between the two can be reduced. Thereby, the electromagnetic wave shield which covers the whole case and conductive member with a small electrical gap can be formed, and radiation and intrusion of electromagnetic waves from the seal portion can be more effectively suppressed.
- the shielding property against electromagnetic waves is enhanced.
- FIG. 1A is a schematic diagram illustrating the configuration of the conductive member according to the first embodiment, and is a plan view of the conductive member.
- FIG. 1B is a schematic diagram illustrating the configuration of the conductive member according to the first embodiment, and is a cross-sectional view taken along line AA in FIG. 1A.
- FIG. 1C is a schematic diagram illustrating the configuration of the conductive member according to the first embodiment, and is a BB cross-sectional view of FIG. 1A.
- FIG. 2A is a schematic diagram illustrating the configuration of the sealing device according to the first embodiment, and is a plan view of the conductive member and the seal member.
- FIG. 2B is a schematic diagram illustrating the configuration of the sealing device according to the first embodiment and is a cross-sectional view taken along the CC line in FIG. 2A.
- FIG. 2C is a schematic diagram illustrating the configuration of the sealing device according to the first embodiment and is a DD cross-sectional view of FIG. 2A.
- FIG. 3 is a schematic perspective exploded view illustrating the configuration of the housing.
- FIG. 4 is a schematic cross-sectional view of the sealing structure according to the first embodiment.
- FIG. 5A is a schematic diagram illustrating the configuration of the sealing device according to the second embodiment, and is a plan view of a conductive member and a seal member.
- FIG. 5B is a schematic diagram illustrating the configuration of the sealing device according to the second embodiment and is a cross-sectional view taken along the line EE in FIG. 5A.
- FIG. 5C is a schematic diagram illustrating the configuration of the sealing device according to the second embodiment and is a cross-sectional view taken along the line FF in FIG. 5A.
- 1A and 1B are schematic views for explaining a configuration of a conductive member, in which FIG. 1A is a plan view of the conductive member, FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A, and FIG. 2A and 2B are schematic diagrams for explaining a configuration in which the sealing member is integrated with the conductive member, FIG. 2A is a plan view of the conductive member and the sealing member, FIG. 2B is a cross-sectional view of CC in FIG. It is DD sectional drawing of.
- FIG. 3 is a schematic perspective exploded view illustrating the configuration of the housing.
- FIG. 4 is a schematic cross-sectional view of the sealing structure according to the present embodiment.
- the conductive member 1 has a configuration in which an electromagnetic wave shielding layer 11 and an insulating layer 12 are laminated on both surfaces of an FPC 10.
- the conductive member (FPC) 1 is a flat belt-like member as a whole and has flexibility.
- the FPC10 has a cover film made of the same material on both sides of a base film made of polyimide, polyamide, polyester, liquid crystal polymer, polyethylene naphthalate, etc. And a cover film.
- the electromagnetic wave shielding layer 11 is laminated and formed on the outside of the cover film of the FPC 10 using a silver paste.
- the insulating layer 12 is a protective film made of an alkyd resin called a top coat, and is formed for surface protection and electrical insulation of the electromagnetic wave shielding layer 11.
- the insulating layer 12 is provided with an opening 12 a that exposes a part of the upper surface (planar portion) of the electromagnetic wave shielding layer 11.
- the electromagnetic wave shielding layer 11 is laminated and formed in a range narrower than the width of the FPC 10, and is in a state where it is completely covered by the insulating layer 12 in a region other than the opening 12a.
- the electromagnetic wave shielding layer 11 and the insulating layer 12 are not limited to the configuration provided on both sides of the FPC 10 as in this embodiment, and may be provided only on one side.
- the seal member 2 is provided so as to wrap a part of the conductive member 1 over the entire circumference in a direction orthogonal to the longitudinal direction of the conductive member 1.
- the opening 12 a of the insulating layer 12 is formed at a position that is completely covered by the seal member 2.
- the sealing member 2 is a grommet made of conductive rubber, resin, or the like.
- an insertion hole for pulling out the conductive member 1 from the inside of the housing to the outside of the housing
- This is for sealing a gap between the insertion portion 32 and the conductive member 1.
- the seal member 2 can be integrally formed with the conductive member 1 by compression molding using a solid conductive rubber or by injection molding using a liquid conductive resin material. Or you may integrate by attaching what was shape
- the sealing member 2 has a convex portion 20 corresponding to the shape of the opening 12a of the insulating layer 12, and the convex portion 20 is in contact with the electromagnetic wave shielding layer 11 through the opening 12a.
- a groove portion 21 narrower than the width of the opening portion 12 extending in the short direction of the conductive member 1 is provided on the upper surface of the seal member 2.
- the groove portion 21 is configured such that the opening edge portion of the insertion hole 32 is fitted when the seal member 2 is mounted between the conductive member 1 and the insertion hole 32.
- the groove part 21 is provided so that the position in the longitudinal direction of the conductive member 1 may be within the range in which the opening 12a is provided.
- the degree of adhesion between the convex portion 20 and the opening 12a is increased, and the sealing performance is improved. That is, there may be a dimensional gap between the convex portion 20 and the opening 12a due to sink marks after curing in the case of integral molding, or dimensional errors when attached later. However, even if such a gap occurs, the convex portion 20 of the seal member 2 is deformed so as to expand in the longitudinal direction of the conductive member 1 by fitting the opening edge portion of the insertion hole 32 into the groove portion 21. This gap can be filled. Moreover, the contact area between the sealing member 2 and the electromagnetic wave shielding layer 11 can be ensured by filling the gap.
- the sealing member 2 is in direct contact with the electromagnetic wave shielding layer 11 through the opening 12a of the insulating layer 12, thereby reducing an electrical gap between the electromagnetic wave shielding layer 11 of the conductive member 1 and the housing 3. can do.
- an electromagnetic wave shield that covers the entire housing 3 and the conductive member 1 with a small electrical gap can be formed, and radiation and intrusion of electromagnetic waves from the seal portion of the housing 3 can be more effectively suppressed. it can.
- ground line of the FPC 10 may be connected to the electromagnetic wave shielding layer 11. Thereby, the ground line and the housing 3 are electrically connected, and it is easy to form an electrically connected state between the ground line and the housing 3.
- FIG. 5 is a schematic diagram illustrating a configuration in which a sealing member is integrated with a conductive member
- FIG. 5A is a plan view of the conductive member and the sealing member
- FIG. 5B is an EE cross-sectional view of FIG. 5A
- FIG. It is FF sectional drawing of.
- symbol is attached
- the sealing device according to the second embodiment is different from the first embodiment in the configuration of the seal portion.
- the seal member 2a according to the second embodiment is a gasket made of conductive rubber, resin, or the like, and a joint surface between the housing body 30 and the lid portion 31 of the housing 3 in the housing 3 shown in FIG. It is sandwiched between 30a and 31a, seals between the housing body 30 and the lid portion 31, and forms an insertion portion for pulling out the conductive member 1 from the inside of the housing to the outside of the housing.
- the seal member 2a is integrally formed with the conductive member 1 by compression molding using a solid conductive rubber or by injection molding using a liquid conductive rubber material. can do. Or you may integrate by attaching what was shape
- a bead portion 22 protruding in the bonding direction with the housing body 30 or the lid portion 31 is provided over the entire upper surface. It has been.
- This bead part 22 is for improving a sealing performance by being compressed by joining with the housing body 30 or the lid part 31.
- the bead portion 22 is provided so as to extend within the range in which the opening 12a is provided.
- the degree of adhesion between the convex portion 20 and the opening 12a is increased, and the sealing performance is improved. That is, there may be a dimensional gap between the convex portion 20 and the opening 12a due to sink marks after curing in the case of integral molding, or dimensional errors when attached later. However, even if such a gap occurs, the bead portion 22 is compressed, so that the convex portion 20 of the seal member 2a is deformed to expand in the longitudinal direction of the conductive member 1, and the gap can be filled. It becomes possible. Moreover, the contact area of the sealing member 2a and the electromagnetic wave shielding layer 11 can be reliably ensured by filling the gap.
- the configuration of the sealing structure according to the present embodiment is the same as that of the sealing structure according to the first embodiment, and description thereof is omitted.
- a grommet in which conductive rubber was integrally formed on an FPC having a width of 30 mm, a length of 300 mm, and a thickness of 0.15 mm was prepared.
- the exposed range of the electromagnetic shielding layer of the FPC was 26 mm wide and 6 mm long on both sides, and the ground line was connected to the electromagnetic shielding layer.
- the shape of the grommet was based on the shape shown in FIGS. 2A to 2C, and the tightening margin of the seal portion was 0.3 mm for the grommet insertion hole size 40 ⁇ 10 mm of the metal housing.
- the FPC was set in a mold produced based on this shape, and solid conductive rubber was compression molded and integrated.
- the integration of the FPC and the rubber differs depending on the type of rubber, but is generally integrated and molded by vulcanization at about 130 to 180 ° C. for about 2 to 10 minutes. After molding, the burrs were removed, and an FPC-integrated grommet was produced.
- the obtained grommet was attached to the grommet insertion hole 32 of the metal casing 3 as shown in FIG. 4, and the radiated electromagnetic field from the inside of the metal casing was measured.
- the difference from the radiated electric field intensity when a non-conductive grommet was attached was defined as a shielding property.
- the shielding property was 30 to 40 dB, and the electromagnetic shielding performance was confirmed.
- the resistance value between the ground line and the housing was measured. As a result, the resistance value was several ⁇ , and the electrical connection between the FPC shield layer and ground line and the casing was confirmed.
Abstract
Description
筐体の内部から外部に引き出される柔軟性を有する平たい伝導部材に一体化され、前記伝導部材と前記筐体における前記伝導部材の挿通部との間の隙間を封止する導電性を有するシール部材を備える密封装置において、
前記伝導部材は、配線が施されたベース層の表面を保護する保護層の上に電磁波シールド層が積層され、該電磁波シールド層の上に絶縁層が積層されるとともに、該絶縁層が前記電磁波シールド層の平面部の一部を露出する開口部を有し、
前記シール部材は、前記開口部を覆うように前記伝導部材に一体化されるとともに、前記開口部を介して前記電磁波シールド層と接触することを特徴とする。
柔軟性を有する平たい伝導部材と、
該伝導部材が挿通される挿通部を有する筐体と、
前記伝導部材と前記挿通部との間の隙間を封止する導電性を有するシール部材と、を備え、
前記伝導部材は、配線が施されたベース層の表面を保護する保護層の上に電磁波シールド層が積層され、該電磁波シールド層の上に絶縁層が積層されるとともに、該絶縁層が前記電磁波シールド層の平面部の一部を露出する開口部を有し、
前記シール部材は、前記開口部を覆うように前記伝導部材に一体化されるとともに、前記開口部を介して前記電磁波シールド層と接触することを特徴とする。
柔軟性を有する平たい伝導部材と、
蓋部と該蓋部が接合される本体部とから構成される筐体と、
前記蓋部と前記本体部の接合面に取り付けられて該接合面を封止するとともに、前記伝導部材を前記筐体の内部から外部に引き出すための挿通部を形成する導電性を有するシール部材と、
を備え、
前記伝導部材は、配線が施されたベース層の表面を保護する保護層の上に電磁波シールド層が積層され、該電磁波シールド層の上に絶縁層が積層されるとともに、該絶縁層が前記電磁波シールド層の平面部の一部を露出する開口部を有し、
前記シール部材は、前記開口部を覆うように前記伝導部材に一体化されるとともに、前記開口部を介して前記電磁波シールド層と接触することを特徴とする。
図1A~図4を参照して、本発明の実施例1に係る密封構造について説明する。図1は、伝導部材の構成について説明する模式図であり、図1Aは伝導部材の平面図、図1Bは図1AのAA断面図、図1Cは図1AのBB断面図である。図2は、伝導部材にシール部材が一体化された構成について説明する模式図であり、図2Aは伝導部材およびシール部材の平面図、図2Bは図2AのCC断面図、図2Cは図2AのDD断面図である。図3は、筐体の構成ついて説明する模式的斜視分解図である。図4は、本実施例に係る密封構造の模式的断面図である。
図1A~図1Cに示すように、伝導部材1は、FPC10の両面に電磁波シールド層11と絶縁層12が積層された構成となっている。伝導部材(FPC)1は、全体が平たい帯状の部材となっており、柔軟性を有している。
図2A~図2Cに示すように、シール部材2は、伝導部材1の長手方向に直交する方向において伝導部材1の一部を全周にわたって包み込むように設けられている。絶縁層12の開口部12aは、シール部材2によって完全に覆われる位置に形成される。
図4に示すように、伝導部材1が筐体3の挿通孔32に挿通されてシール部材2が挿通孔32と伝導部材1との間に装着されると、筐体3と伝導部材1の電磁波シールド層11がシール部材2を介して電気的に接続された状態となる。
図5を参照して、本発明の実施例2に係る密封装置および密封構造について説明する。図5は、伝導部材にシール部材が一体化された構成について説明する模式図であり、図5Aは伝導部材およびシール部材の平面図、図5Bは図5AのEE断面図、図5Cは図5AのFF断面図である。なお、上記実施例1と同様の構成については同じ符号を付して説明を省略する。
次に、本発明を具体例について説明する。
10 FPC
11 電磁波シールド層
12 絶縁層
12a 開口部
2 シール部材
20 凸部
21 溝部
3 筐体
Claims (3)
- 筐体の内部から外部に引き出される柔軟性を有する平たい伝導部材に一体化され、前記伝導部材と前記筐体における前記伝導部材の挿通部との間の隙間を封止する導電性を有するシール部材を備える密封装置において、
前記伝導部材は、配線が施されたベース層の表面を保護する保護層の上に電磁波シールド層が積層され、該電磁波シールド層の上に絶縁層が積層されるとともに、該絶縁層が前記電磁波シールド層の平面部の一部を露出する開口部を有し、
前記シール部材は、前記開口部を覆うように前記伝導部材に一体化されるとともに、前記開口部を介して前記電磁波シールド層と接触することを特徴とする密封装置。 - 柔軟性を有する平たい伝導部材と、
該伝導部材が挿通される挿通部を有する筐体と、
前記伝導部材と前記挿通部との間の隙間を封止する導電性を有するシール部材と、を備え、
前記伝導部材は、配線が施されたベース層の表面を保護する保護層の上に電磁波シールド層が積層され、該電磁波シールド層の上に絶縁層が積層されるとともに、該絶縁層が前記電磁波シールド層の平面部の一部を露出する開口部を有し、
前記シール部材は、前記開口部を覆うように前記伝導部材に一体化されるとともに、前記開口部を介して前記電磁波シールド層と接触することを特徴とする密封構造。 - 柔軟性を有する平たい伝導部材と、
蓋部と該蓋部が接合される本体部とから構成される筐体と、
前記蓋部と前記本体部の接合面に取り付けられて該接合面を封止するとともに、前記伝導部材を前記筐体の内部から外部に引き出すための挿通部を形成する導電性を有するシール部材と、
を備え、
前記伝導部材は、配線が施されたベース層の表面を保護する保護層の上に電磁波シールド層が積層され、該電磁波シールド層の上に絶縁層が積層されるとともに、該絶縁層が前記電磁波シールド層の平面部の一部を露出する開口部を有し、
前記シール部材は、前記開口部を覆うように前記伝導部材に一体化されるとともに、前記開口部を介して前記電磁波シールド層と接触することを特徴とする密封構造。
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KR1020117006123A KR101270846B1 (ko) | 2008-09-30 | 2009-09-30 | 밀봉장치 및 밀봉 구조 |
US13/063,996 US8525024B2 (en) | 2008-09-30 | 2009-09-30 | Hermetic sealing device and hermetic sealing structure |
EP09817814.8A EP2330323B1 (en) | 2008-09-30 | 2009-09-30 | Hermetically sealing device and hermetically sealing structure |
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JP2008253566A JP5169696B2 (ja) | 2008-09-30 | 2008-09-30 | 密封装置および密封構造 |
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EP (1) | EP2330323B1 (ja) |
JP (1) | JP5169696B2 (ja) |
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WO2019174748A1 (en) * | 2018-03-16 | 2019-09-19 | Huawei Technologies Co., Ltd. | Assembly for electro-magnetic interference shielding and method |
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FR3031000A1 (fr) * | 2014-12-19 | 2016-06-24 | Commissariat Energie Atomique | Blindage magnetique en sortie d'une enceinte blindee magnetiquement |
US9704539B2 (en) | 2015-12-09 | 2017-07-11 | Western Digital Technologies, Inc. | Hermetic sealing of hard disk drive using laminated film seal |
US9721620B2 (en) * | 2015-12-09 | 2017-08-01 | Western Digital Technologies, Inc. | Hermetic sealing of hard disk drive using laminated film seal |
US9721619B2 (en) | 2015-12-09 | 2017-08-01 | Western Digital Technologies, Inc. | Hermetic sealing of hard disk drive using laminated film seal |
US9839117B2 (en) * | 2016-04-11 | 2017-12-05 | Microsoft Technology Licensing, Llc | Flexible printed circuit with enhanced ground plane connectivity |
EP3232751B1 (de) * | 2016-04-12 | 2018-07-18 | MD Elektronik GmbH | Elektrische steckkupplungsvorrichtung |
DE102017202386A1 (de) * | 2017-02-15 | 2018-08-16 | Bayerische Motoren Werke Aktiengesellschaft | Leitungselement, insbesondere für ein Fahrzeug, sowie Anordnung eines solchen Leitungselements an einem Gehäuse |
US10973128B2 (en) * | 2017-08-30 | 2021-04-06 | Panasonic Intellectual Property Management Co., Ltd. | Flexible printed circuit and imaging apparatus including same |
US11268616B2 (en) * | 2017-10-06 | 2022-03-08 | Virginia Sealing Products, Inc. | Envelope gasket |
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EP2330323B1 (en) | 2013-11-13 |
US20110162864A1 (en) | 2011-07-07 |
EP2330323A4 (en) | 2012-06-20 |
EP2330323A1 (en) | 2011-06-08 |
KR20110050677A (ko) | 2011-05-16 |
US8525024B2 (en) | 2013-09-03 |
JP5169696B2 (ja) | 2013-03-27 |
KR101270846B1 (ko) | 2013-06-05 |
JP2010084832A (ja) | 2010-04-15 |
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