WO2010024174A1 - 粘着テープ又はシート - Google Patents
粘着テープ又はシート Download PDFInfo
- Publication number
- WO2010024174A1 WO2010024174A1 PCT/JP2009/064559 JP2009064559W WO2010024174A1 WO 2010024174 A1 WO2010024174 A1 WO 2010024174A1 JP 2009064559 W JP2009064559 W JP 2009064559W WO 2010024174 A1 WO2010024174 A1 WO 2010024174A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pressure
- sensitive adhesive
- weight
- parts
- adhesive tape
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/105—Compounds containing metals of Groups 1 to 3 or Groups 11 to 13 of the Periodic system
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
Definitions
- the present invention relates to an adhesive tape or sheet, and more particularly, to an adhesive tape or sheet that includes a base material and an adhesive layer and is suitably used for semiconductor wafer and / or substrate processing.
- a pressure-sensitive adhesive sheet coated with a pressure-sensitive adhesive layer that undergoes a polymerization and curing reaction with an electron beam is used.
- this pressure-sensitive adhesive sheet by irradiating the pressure-sensitive adhesive layer with an electron beam after dicing, the pressure-sensitive adhesive layer is polymerized and cured, the pressure-sensitive adhesive force is reduced, and a semiconductor wafer (chip) or the like can be easily picked up.
- the pressure-sensitive adhesive layer is formed containing a base polymer, a polyfunctional urethane acrylate oligomer having a predetermined molecular weight, a polyester plasticizer, and a photopolymerization initiator.
- the type of sealing resin and / or additive in the adherend and the amount of release agent (for example, wax) generally applied to the surface of the sealing resin are too small or uneven.
- the adhesive strength in the adhesive layer does not decrease to a predetermined value after ultraviolet irradiation. Therefore, the individual pieces may not be picked up in the pickup process. If the pick-up is forcibly picked up, there arises a problem that peeling occurs from the inside of the sealing resin or adhesive residue remains on the entire surface of the sealing resin.
- Patent Document 4 an adhesive sheet subjected to antistatic treatment has been proposed (for example, Patent Document 4).
- this pressure-sensitive adhesive sheet has an excellent antistatic effect, but it is not necessarily said that the above-mentioned chip flying at the time of dicing, workability at the time of pick-up, and adhesive residue all have satisfactory characteristics. Absent. Therefore, there is a demand for an adhesive sheet having good characteristics for all of antistatic, chip jump during dicing, workability during pick-up, and adhesive residue.
- One object of the present invention is to provide an adhesive tape or sheet having good characteristics for all of antistatic, chip skipping during dicing, workability during pickup, and adhesive residue.
- the pressure-sensitive adhesive tape or sheet of the present invention comprises methyl acrylate monomer, ethyl acrylate monomer or methyl acrylate monomer and ethyl acrylate monomer, Acrylic acid monomer,
- acrylic pressure-sensitive adhesive composed of a copolymer with 2-ethylhexyl acrylate monomer
- One feature is that it has a pressure-sensitive adhesive layer containing 0.3 to 10 parts by weight of a polyether polyol compound and 0.005 to 2 parts by weight of at least one alkali metal salt.
- the pressure-sensitive adhesive layer is formed on a base material that is permeable to ultraviolet rays and / or radiation, and the pressure-sensitive adhesive layer further comprises at least one ultraviolet curable oligomer. It is preferable to contain.
- the pressure-sensitive adhesive layer preferably further contains a tackifier having a hydroxyl value of 120 to 230 KOHmg / g.
- an antistatic treatment is performed on the base material in contact with the pressure-sensitive adhesive layer. Further, it is preferably used for semiconductor wafer or substrate processing applications.
- the polyether polyol compound preferably has a weight average molecular weight of 4000 or less.
- the alkali metal salt is selected from a cation composed of Li, Na, K, Mg, and Ca and an anion composed of Cl, Br, I, BF 4 , PF 6 , ClO 4 , NO 3 , and CO 3. It is preferable to combine one or more ions.
- the pressure-sensitive adhesive tape or sheet of the present invention when a semiconductor wafer or the like is diced, jumping of the wafer or the like can be reliably prevented. Moreover, in the pick-up process after irradiating an electron beam, work efficiency can be improved without producing adhesive residue. Furthermore, the occurrence of circuit breakdown, product defects, and the like in a semiconductor wafer or the like can be reduced by static electricity or peeling charging that occurs in the process.
- the pressure-sensitive adhesive tape or sheet in the present invention includes a predetermined pressure-sensitive adhesive layer.
- the pressure-sensitive adhesive layer is usually formed including an acrylic pressure-sensitive adhesive, a polyether polyol compound, and an alkali metal salt.
- Acrylic adhesive (1) copolymerization of methyl acrylate monomer, acrylic acid monomer and 2-ethylhexyl acrylate monomer; (2) Copolymerization of ethyl acrylate monomer, acrylic acid monomer, and 2-ethylhexyl acrylate monomer, or (3) Methyl acrylate monomer, ethyl acrylate monomer, acrylic acid monomer, and acrylic acid 2- It is constituted by copolymerization with ethylhexyl monomer.
- the pressure-sensitive adhesive By forming the pressure-sensitive adhesive by blending such a copolymer, it has been conventionally required to prevent charging, suppress chip skipping during dicing, improve workability during pickup, and reduce pressure-sensitive adhesive residues. Nevertheless, all of the characteristics that could not be realized can be satisfied. That is, while strongly adhering the adherend, the adhesive force can be reliably reduced at an appropriate time, and an appropriate strength can always be secured as the adhesive layer. In addition, while ensuring a sufficient amount of the components to be blended for antistatic, and having good compatibility with all the components constituting the pressure-sensitive adhesive layer, the components in the pressure-sensitive adhesive layer are incompatible. It is possible to maximize the individual performance of each component by eliminating uniformity, separation, bias, etc., and uniformly mixing and distributing.
- methyl acrylate monomer and / or ethyl acrylate monomer, acrylic acid monomer, and 2-ethylhexyl acrylate monomer are, for example, 40 to 70: 0.5 to 20:30 to 60
- Those polymerized in a proportion, preferably 45 to 75: 1 to 15:30 to 50, are suitable.
- compatibility with an additive is securable.
- even in a state of sticking for a long time it is possible to prevent an increase or decrease in adhesive force, an increase in adhesive force due to thermal influence, and the like.
- an adhesive layer having sufficient strength against stress can be provided, and problems such as adhesive residue can be prevented in the pickup process.
- the molecular weight of these copolymers is preferably, for example, 300,000 to 1,500,000, particularly 500,000 to 1,200,000. By setting it as this range, it can have sufficient intensity
- compatibility with the additive can be ensured, and stable characteristics can be obtained in terms of adhesive strength, antistatic properties, and the like.
- an ether bond in a polymer molecule usually forms a complex with an alkali metal and imparts conductivity by such a structure.
- the polymer molecule include polyoxyethylene glycol, polyoxypropylene glycol, and a block copolymer of polyoxyethylene glycol and polyoxypropylene glycol.
- the polyether polyol compound is not particularly limited, and any known one can be used.
- the conductivity-imparting agent described in JP-A-2007-70420 can be used.
- Specific examples include PP-400, PP-1000, PP-2000, GP-400, GP-600, TP-400 and the like under the trade name Sannix (manufactured by Sanyo Chemical Industries).
- the polyether polyol compound those having a weight average molecular weight of 4000 or less are suitable, and those having a weight average molecular weight of 200 to 1000 are preferred. This is to suppress the crystallization of the alkali metal salt over time in the acrylic pressure-sensitive adhesive, thereby preventing the increase of the surface specific resistance value of the pressure-sensitive adhesive and producing a stable pressure-sensitive adhesive tape.
- the polyether polyol compound is not less than 0.3 and not more than 10 parts by weight, preferably not less than 0.3 and not more than 7 parts by weight, more preferably not less than 0.45 parts by weight with respect to 100 parts by weight of the acrylic pressure-sensitive adhesive described above. It is preferably contained in an amount of less than 7 parts by weight, 0.45 parts by weight or more and 6 parts by weight or less, 0.45 parts by weight or more and 5 parts by weight or less. This is because the surface specific resistance value on the surface of the acrylic pressure-sensitive adhesive is reduced and a sufficient antistatic function is imparted. Moreover, it is for ensuring compatibility with all the components which comprise an adhesive, and preventing the segregation of each component effectively. As a result, it is possible to prevent the deterioration of the physical properties of the adhesive and improve the adhesiveness as an adhesive tape.
- the alkali metal salt is selected from, for example, a cation composed of Li, Na, K, Mg, and Ca and an anion composed of Cl, Br, I, BF 4 , PF 6 , ClO 4 , NO 3 , and CO 3 , respectively.
- a combination of one or more kinds of ions can be used.
- LiClO 4 having excellent ion conductivity and excellent antistatic function can be preferably used.
- the alkali metal salt is 0.005 to 2 parts by weight, preferably 0.005 to 1.8 parts by weight, more preferably 0.005 to 1.5 parts by weight, based on 100 parts by weight of the acrylic pressure-sensitive adhesive. It is preferably contained in an amount of 05 to 1.2 parts by weight, and more preferably 0.03 to 1.0 parts by weight.
- the pressure-sensitive adhesive layer in the pressure-sensitive adhesive tape or sheet of the present invention preferably further contains an ultraviolet curable oligomer.
- an ultraviolet curable oligomer any oligomer may be used as long as it is an oligomer having a function of being cured by ultraviolet irradiation.
- such an oligomer preferably has a molecular weight of about 500 to 50,000, more preferably about 1,000 to 30,000. By setting the molecular weight within this range, the strength of the pressure-sensitive adhesive after irradiation with ultraviolet rays or the like can be secured, and as a result, the pressure-sensitive adhesive can be prevented from adhering to the chip during operations such as pick-up operations.
- Such an oligomer may have, for example, two or more carbon-carbon double bonds in the molecule.
- urethane acrylate oligomers are preferred from the viewpoint of the flexibility of the pressure-sensitive adhesive after irradiation with ultraviolet rays or the like. Two or more kinds of oligomers may be used in combination.
- the urethane (meth) acrylate oligomer preferably has 2 to 4 and further 2 acryloyl groups in the molecule.
- it can be produced by a method in which a diisocyanate and a polyol are first reacted in a reaction vessel maintained at 60 to 90 ° C., and after the reaction is completed, hydroxy (meth) acrylate is added and further reacted.
- diisocyanate examples include toluene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, phenylene diisocyanate, dicyclohexylmethane diisocyanate, xylene diisocyanate, tetramethylxylene diisocyanate, and naphthalene diisocyanate.
- the polyol examples include ethylene glycol, propylene glycol, butanediol, hexanediol and the like.
- hydroxy (meth) acrylate examples include 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate.
- the ultraviolet curable oligomer is preferably contained in an amount of about 20 to 170 parts by weight, more preferably about 40 to 150 parts by weight, based on 100 parts by weight of the acrylic pressure-sensitive adhesive. By setting this range, it is possible to ensure good compatibility with any of the above-mentioned pressure-sensitive adhesive components, and to disperse uniformly in the pressure-sensitive adhesive layer without causing uneven distribution. This is because the layer can be cured and desired adhesive force can be easily provided.
- the pressure-sensitive adhesive layer in the pressure-sensitive adhesive tape or sheet of the present invention further contains a tackifier.
- a tackifier Any known tackifier can be used. Among them, those having a hydroxyl value of 120 to 230 mg / g, more preferably 120 to 210 mg / g are preferable.
- the hydroxyl value is too large or too small, there is a tendency that sufficient adhesiveness is not given to the semiconductor wafer or the sealing resin before the ultraviolet irradiation.
- the adhesive strength does not drop to a predetermined value after UV irradiation. This is because there is a tendency.
- the tackifier is preferably contained in an amount of about 0.1 to 70 parts by weight and more preferably about 1 to 50 parts by weight with respect to 100 parts by weight of the acrylic pressure-sensitive adhesive. By setting it within this range, it is possible to effectively increase the adhesive strength, ensure the storage stability of the adhesive sheet, and obtain stable characteristics for a long period of time.
- Examples of the tackifier having such a hydroxyl value include terpene phenol resins, rosin phenol resins, alkylphenol resins, and the like.
- Examples of the terpene phenol resin include alpha-pinene / phenol resin, beta-pinene / phenol resin, dipentene / phenol resin, and terpene bisphenol resin.
- the pressure-sensitive adhesive layer in the pressure-sensitive adhesive tape or sheet of the present invention further includes one or more of a softener, an anti-aging agent, a curing agent, a filler, an ultraviolet absorber, a light stabilizer, a (photo) polymerization initiator, and the like. May be appropriately selected and added.
- each agent may be used individually by 1 type, and may be used in combination of multiple types.
- softener examples include plasticizer, polybutene, liquid tackifier resin, polyisobutylene low polymer, polyvinyl isobutyl ether low polymer, lanolin, depolymerized rubber, process oil, and added oil.
- anti-aging agent examples include phenol-based anti-aging agents (for example, 2,6-di-tert-butyl-4-methylphenol, 1,1-bis (4-hydroxyphenol) cyclohexane), amine-based anti-aging agents (for example, phenol). Neil beta-naphthylamine, etc.), benzimidazole anti-aging agents (eg, mercaptobenzoidazole, etc.), 2,5-di-tert-butylhydroquinone, and the like.
- phenol-based anti-aging agents for example, 2,6-di-tert-butyl-4-methylphenol, 1,1-bis (4-hydroxyphenol) cyclohexane
- amine-based anti-aging agents for example, phenol.
- Neil beta-naphthylamine, etc. examples include benzimidazole anti-aging agents (eg, mercaptobenzoidazole, etc.), 2,5-di-tert-butylhydro
- Examples of the curing agent for the rubber adhesive include isocyanate, sulfur and vulcanization accelerator, polyalkylphenol, and organic peroxide.
- Examples of the isocyanate include phenylene diisocyanate, tolylene diisocyanate, diphenyl metadiisocyanate, hexamethylene diisocyanate, and cyclohexane diisocyanate.
- Examples of sulfur and vulcanization accelerators include thiazole vulcanization accelerators, sulfenamide vulcanization accelerators, thiuram vulcanization accelerators, and dithioate vulcanization accelerators.
- Examples of the polyalkylphenol include butylphenol, octylphenol, nonylphenol, and the like.
- Examples of the organic peroxide include dichromyl peroxide, ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, peroxyester, and peroxydicarbonate.
- filler examples include zinc white, titanium oxide, silica, aluminum hydroxide, calcium carbonate, barium sulfate, starch, clay, and talc.
- the photopolymerization initiator is excited and activated by irradiation with ultraviolet rays to generate radicals, and has a function of curing the polyfunctional oligomer by radical polymerization.
- polymerization initiator examples include peroxides such as hydrogen peroxide, benzoyl peroxide, and t-butyl peroxide. Although it is desirable to use it alone, it may be used as a redox polymerization initiator in combination with a reducing agent.
- the reducing agent include ionized salts such as sulfite, bisulfite, iron, copper, and cobalt salts, amines such as triethanolamine, and reducing sugars such as aldose and ketose.
- An azo compound such as a salt, 2,2′-azobisisobutyronitrile, 2,2′-azobis-2-methyl-N- (2-hydroxyethyl) propionamide may be used. These may be used alone or in combination of two or more.
- the pressure-sensitive adhesive tape or sheet of the present invention is formed by directly mixing the above-mentioned components, optionally using a solvent, to form a pressure-sensitive adhesive composition, and applying or spraying the composition onto a substrate. can do.
- the mixing of each component is preferably performed using a propeller stirrer, a disper stirrer, or the like in order to achieve sufficient and uniform mixing.
- the base material used in the present invention is not particularly limited, and examples thereof include conductive metal foils such as aluminum foil and silver foil, and materials having transparency to ultraviolet rays and / or radiation. . Among them, the latter is preferable, and those having transparency of, for example, about 75% or more, about 80% or more, or about 90% or more with respect to ultraviolet rays and / or radiation are preferable.
- polyesters such as polyvinyl chloride, polyvinylidene chloride, polyethylene terephthalate, polyimide, polyether ether ketone; low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer
- Polyolefins such as polymerized polypropylene, block copolymerized polypropylene, homopolypropylene, polybutene, polymethylpentene
- polyurethane ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) Acrylic ester (random, alternating) copolymers, ethylene-butene copolymers, ethylene-hexene copolymers, fluororesins, cellulose resins, and polymers such as cross-linked products thereof It can be mentioned.
- These may be a single layer or a multilayer structure.
- the thickness of the base material is usually
- the base material may have been subjected to surface treatment such as corona treatment on one or both surfaces thereof. Moreover, it is preferable that the base material which contact
- the antistatic treatment here is not particularly limited.
- the antistatic agent is kneaded into the base material and contained in the entire base material, or the base material kneaded with the antistatic agent is coextruded. And a method in which it is contained in at least one layer in the substrate, or is applied and formed as an undercoat layer on at least one side, preferably both sides of the substrate.
- gravure coating roll coating, reverse coating, dip coating, flow coating, or brush coating may be used as a method for applying the adhesive composition to the substrate. It is preferable to heat and dry after coating. For example, heating can be performed at 80 to 100 ° C. for about 30 seconds to 10 minutes.
- the thickness of the pressure-sensitive adhesive layer is not particularly limited, but about 1 to 50 ⁇ m is suitable.
- the surface of the pressure-sensitive adhesive layer does not substantially adhere to the pressure-sensitive adhesive layer. Or it is preferable to roll up into a product.
- the pressure-sensitive adhesive tape or sheet of the present invention can be used by a method usually used. For example, after affixing and fixing a semiconductor wafer and / or substrate, the semiconductor wafer or substrate is cut into element pieces (chips) with a rotating round blade. Thereafter, ultraviolet rays and / or radiation are irradiated from the substrate side of the processing adhesive sheet, and then the wafer processing adhesive sheet is expanded (enlarged) radially using a dedicated jig, and the element small pieces (chips) are spaced apart. And a method of picking up and picking up an element piece (chip) with a needle or the like and adsorbing it with an air tweezer or the like.
- the pressure-sensitive adhesive sheet of the present invention can be applied to various adherends such as a semiconductor wafer, a semiconductor substrate, and a sealing resin substrate in which one or a plurality of chips are individually or integrally sealed with a lead and a sealing resin.
- adherend surface of the adherend is not limited to a semiconductor, and various materials such as metals, plastics, glass, and inorganic materials such as ceramics can be used.
- the pressure-sensitive adhesive sheet of the present invention is particularly suitable for those having a surface with fine irregularities, such as a so-called pear-like surface, and those having a surface to be printed with a laser or the like.
- it can be satisfactorily used for a thing provided with an adherend surface having a recess having a depth of about 100 ⁇ m or less at least at one place on the adherend surface.
- hydroxyl value of the tackifier a value derived by the 7.1 neutralization titration method of JIS K0070-1992 was used.
- Example 1 A copolymer having a weight average molecular weight of 800,000 (solid content 35%) obtained by copolymerizing 60 parts by weight of methyl acrylate, 10 parts by weight of acrylic acid and 40 parts of 2-ethylhexyl acrylate was prepared.
- the obtained pressure-sensitive adhesive solution was applied to a 38 ⁇ m-thick polyester film subjected to silicone release treatment so that the thickness after drying was 20 ⁇ m. Dry at 120 ° C. for 5 minutes. Thereafter, a 150 ⁇ m polyethylene film as a substrate was laminated to prepare a semiconductor processing sheet.
- the obtained pressure-sensitive adhesive sheet for processing semiconductor wafers was aged at 50 ° C. for 4 days or longer, and then evaluated as follows.
- Example 2 Same as Example 1, except that the mixture of polyalkylene glycol compound and lithium perchlorate (trade name PEL-20A, manufactured by Nippon Carlit Co., Ltd.) was changed to 3 parts during the preparation of the adhesive solution of Example 1. A pressure-sensitive adhesive sheet was prepared by the above operation.
- Example 3 Except for changing to 5 parts of a mixed solution of polyalkylene glycol compound and lithium perchlorate (trade name PEL-20A, manufactured by Nippon Carlit Co., Ltd.) at the time of preparing the adhesive solution of Example 1, the same as Example 1 A pressure-sensitive adhesive sheet was prepared by operation.
- Example 4 Same as Example 1, except that the mixture of polyalkylene glycol compound and lithium perchlorate (trade name PEL-20A, manufactured by Nippon Carlit Co., Ltd.) was changed to 10 parts during the preparation of the adhesive solution of Example 1. A pressure-sensitive adhesive sheet was prepared by the above operation.
- Example 5 A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 2 except that the tackifier was removed during the preparation of the pressure-sensitive adhesive solution of Example 2.
- Example 6 Except that the terpene phenol resin (Mighty Ace K140 manufactured by Yashara Chemical Co., Ltd.) having a hydroxyl value of 200 to 210 KOH mg / g was changed to 20 parts by weight as the tackifier during the preparation of the adhesive solution of Example 1, A pressure-sensitive adhesive sheet was produced by the same operation.
- the terpene phenol resin (Mighty Ace K140 manufactured by Yashara Chemical Co., Ltd.) having a hydroxyl value of 200 to 210 KOH mg / g was changed to 20 parts by weight as the tackifier during the preparation of the adhesive solution of Example 1, A pressure-sensitive adhesive sheet was produced by the same operation.
- Example 7 A mixture of polyalkylene glycol compound and lithium perchlorate / lithium trifluoromethanesulfonate (trade name PEL-25 manufactured by Nippon Carlit Co., Ltd.) was changed to 5 parts at the time of preparing the pressure-sensitive adhesive solution of Example 1. Prepared an adhesive sheet by the same operation as in Example 1.
- Example 8 When preparing the pressure-sensitive adhesive solution of Example 1, 5 parts by weight of a polyether polyol (trade name Sannix PP-1000, manufactured by Sanyo Chemical Industries) instead of a mixed liquid of a polyalkylene glycol compound and lithium perchlorate and A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that 1 part by weight of lithium chlorate was used.
- a polyether polyol trade name Sannix PP-1000, manufactured by Sanyo Chemical Industries
- Example 9 When preparing the pressure-sensitive adhesive solution of Example 1, 10 parts by weight of polyether polyol (trade name Sannix PP-400, manufactured by Sanyo Kasei Kogyo Co., Ltd.) instead of the mixed liquid of polyalkylene glycol compound and lithium perchlorate and alkali A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that 0.5 part by weight of lithium perchlorate was used as the metal salt.
- polyether polyol trade name Sannix PP-400, manufactured by Sanyo Kasei Kogyo Co., Ltd.
- Example 10 A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the copolymer was changed to the following when preparing the pressure-sensitive adhesive solution of Example 1.
- a copolymer having a weight average molecular weight of 700,000 was prepared by copolymerizing 55 parts by weight of ethyl acrylate, 10 parts by weight of acrylic acid and 35 parts by weight of 2-ethylhexyl acrylate.
- Example 11 A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the copolymer was changed to the following when preparing the pressure-sensitive adhesive solution of Example 1.
- a copolymer having a weight average molecular weight of 1,000,000 was prepared by copolymerizing 10 parts by weight of methyl acrylate, 55 parts by weight of ethyl acrylate, 10 parts by weight of acrylic acid and 35 parts by weight of 2-ethylhexyl acrylate.
- Example 12 Example 1 except that the mixed liquid of polyalkylene glycol compound and lithium perchlorate (trade name PEL-20A, manufactured by Nippon Carlit Co., Ltd.) was changed to 0.333 parts during the preparation of the adhesive solution of Example 1.
- a pressure-sensitive adhesive sheet was prepared in the same manner as described above.
- Example 13 At the time of preparing the pressure-sensitive adhesive solution of Example 1, 5 parts by weight of polyether polyol (trade name Sannix PP-1000, manufactured by Sanyo Chemical Industries) instead of the mixed liquid of polyalkylene glycol compound and lithium perchlorate and A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that 0.076 parts by weight of lithium chlorate was used.
- polyether polyol trade name Sannix PP-1000, manufactured by Sanyo Chemical Industries
- Comparative Example 1 A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the mixed liquid of the polyalkylene glycol compound and lithium perchlorate was not blended when the pressure-sensitive adhesive solution of Example 1 was prepared.
- Example 2 A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the mixed liquid of the polyalkylene glycol compound and lithium perchlorate was changed to 0.1 parts by weight when the pressure-sensitive adhesive solution of Example 1 was prepared.
- Comparative Example 3 Same as Example 1 except that the mixture of polyalkylene glycol compound and lithium perchlorate (trade name PEL-20A, manufactured by Nippon Carlit Co., Ltd.) was changed to 20 parts during the preparation of the pressure-sensitive adhesive solution of Example 1. A pressure-sensitive adhesive sheet was prepared by the above operation.
- Comparative Example 4 A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the copolymer was changed to the following when preparing the pressure-sensitive adhesive solution of Example 1. 10 parts by weight of acrylic acid and 100 parts of 2-ethylhexyl acrylate were copolymerized to obtain a copolymer having a weight average molecular weight of 800,000 (solid content 35%).
- Comparative Example 5 A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the mixed liquid of the polyalkylene glycol compound and lithium perchlorate was changed to 0.3 parts by weight when preparing the pressure-sensitive adhesive solution of Example 1.
- Example 6 A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the mixed liquid of the polyalkylene glycol compound and lithium perchlorate was changed to 12 parts by weight when preparing the pressure-sensitive adhesive solution of Example 1.
- Comparative Example 7 When preparing the pressure-sensitive adhesive solution of Example 1, the procedure was the same as in Example 1 except that the copolymer was obtained by copolymerizing 60 parts by weight of methyl acrylate and 40 parts of 2-ethylhexyl acrylate. Thus, an adhesive sheet was prepared. Was prepared.
- Nitto Seiki's M-286N affixing device on the sealing resin surface of the substrate on which the tape-adhered semiconductor chip is mounted (a type with a 15 ⁇ m deep laser print on the resin surface), a speed of 60 mm / sec, a table temperature The adhesive sheet was bonded at 45 ° C. After pasting, the sample was taken out and the surface potential was measured from a height of 50 mm from the substrate surface using an electrostatic potential measuring device (KSD-0103S manufactured by Kasuga Electric Co., Ltd.).
- the pressure-sensitive adhesive layer was cured by irradiating with ultraviolet light for 30 seconds from the substrate side using a high-pressure mercury lamp of 20 mW / cm 2 . Then, it cooled to room temperature, the package was peeled by hand, and the presence or absence of the peelable with respect to 2000 packages and the presence or absence of the adhesive residue were confirmed.
- the method for manufacturing a semiconductor device of the present invention is an object that can be subjected to water jet laser dicing, that is, a semiconductor-related material (for example, a semiconductor wafer, a BGA package, a printed circuit, a ceramic plate, a glass component for a liquid crystal device, a sheet material). , Circuit boards, glass substrates, ceramic substrates, metal substrates, semiconductor laser light emitting / receiving element substrates, MEMS substrates, semiconductor packages, etc.), etc., and a wide range of materials.
- a semiconductor-related material for example, a semiconductor wafer, a BGA package, a printed circuit, a ceramic plate, a glass component for a liquid crystal device, a sheet material.
Abstract
Description
さらに、凹凸の有無にかかわらず、ダイシング時にチップ飛びを生じさせないために、粘着剤中に粘着付与剤を添加することが提案されている(例えば、特許文献3)。この粘着付与剤は、JIS K0070-1992の7.1中和滴定法によって導き出されるヒドロキシル価が50~150KOHmg/gに調整させることにより、粘着力を向上させ、PKG飛びを防止している。
従って、被着体である半導体装置等に用いられている封止樹脂等のこのような変遷に起因して、特許文献3で提案された特定の粘着付与剤を用いるのみでは、切断時のチップ飛びを完全に防止できないという不具合が新たに生じてきた。
これに対して、帯電防止処理が施された粘着シートが提案されている(例えば、特許文献4)。
よって、帯電防止、ダイシング時のチップ飛び、ピックアップ時の作業性及び粘着剤残渣の全てに対して良好な特性を有する粘着シートが要望されている。
アクリル酸モノマーと、
アクリル酸2-エチルヘキシルモノマーとの共重合体からなるアクリル系粘着剤100重量部に対し、
ポリエーテルポリオール化合物0.3~10重量部及び
少なくとも1種のアルカリ金属塩0.005~2重量部が含有されてなる粘着剤層を有することを一つの特徴とする。
また、粘着剤層は、さらに、ヒドロキシル価が120~230 KOHmg/gの粘着付与剤を含有してなることが好ましい。
さらに、粘着剤層と接する基材に、帯電防止処理が施されてなることが好ましい。
また、半導体ウェハ又は基板加工用途に使用されることが好ましい。
また、アルカリ金属塩が、Li、Na、K、Mg、Caからなるカチオンと、Cl、Br、I、BF4、PF6、ClO4、NO3、CO3からなるアニオンとからそれぞれ選択される1種以上のイオンを組合せてなることが好ましい。
粘着剤層は、通常、アクリル系粘着剤と、ポリエーテルポリオール化合物と、アルカリ金属塩とを含んで形成されている。
(1)アクリル酸メチルモノマーと、アクリル酸モノマーと、アクリル酸2-エチルヘキシルモノマーとの共重合、
(2)アクリル酸エチルモノマーと、アクリル酸モノマーと、アクリル酸2-エチルヘキシルモノマーとの共重合、または
(3)アクリル酸メチルモノマーと、アクリル酸エチルモノマーと、アクリル酸モノマーと、アクリル酸2-エチルヘキシルモノマーとの共重合によって構成されている。
ポリエーテルポリオール化合物は、重量平均分子量が4000以下のものが適しており、200~1000のものが好ましい。アクリル系粘着剤中で経時によるアルカリ金属塩の結晶化を抑制し、ひいては粘着剤の表面固有抵抗値の上昇を防止して、安定な粘着テープを作製するためである。
このようなオリゴマーは、例えば、分子内に2個以上の炭素-炭素二重結合を有していればよく、例えば、ウレタン系、ウレタン(メタ)アクリレート系、ポリエーテル系、ポリエステル系、ポリカーボネート系、ポリブタジエン系など種々のオリゴマーが挙げられる。なかでも、紫外線等の照射後の粘着剤の可撓性等の観点から、ウレタンアクリレート系オリゴマーが好ましい。また、2種以上のオリゴマーを併用してもよい。
ポリオールとしては、例えば、エチレングリコール、プロピレングリコール、ブタンジオール、ヘキサンジオール等を挙げることができる。
ヒドロキシ(メタ)アクリレートとしては、例えば、2-ヒドルキシエチル(メタ)アクリレート、2-ヒドルキシプロピル(メタ)アクリレート等を挙げることができる。
テルペンフェノール樹脂としては、アルファーピネン・フェノール樹脂、ベーターピネンフェノール樹脂、ジペンテン・フェノール樹脂、テルペンビスフェノール樹脂が挙げられる。このテルペンフェノール樹脂を用いることにより、粘着剤におけるベースポリマーに対する高い相溶性を得ることができる。よって、テープ保存中における粘着剤の変化が殆どなく、長期間安定した品質を維持することが可能となる。
各成分の混合は、十分かつ均一な混合を実現するために、プロペラ攪拌機、ディスパー攪拌機等を利用して行うことが好ましい。
また、粘着剤層と接する基材は、帯電防止処理されていることが好ましい。ここでの帯電防止処理は、特に限定されるものではなく、例えば、帯電防止剤を基材中に混練して基材全体に含有させるか、帯電防止剤を混練した基材を共押出しして、基材中の少なくとも1層に含有させるか、基材の少なくとも片側、好ましくは両側に下塗り層として塗布し、形成する方法等が挙げられる。
塗布した後、加熱乾燥することが好ましい。加熱は、例えば、80~100℃、30秒~10分間程度が挙げられる。
粘着剤層の厚さは特に限定されるものではないが、1~50μm程度が適している。
本発明の粘着シートは、半導体ウェハ、半導体基板、単数又は複数のチップ等をリード及び封止樹脂等で個々に又は一体的に封止した封止樹脂基板など、種々の被着体に対して用いることができる。また、被着体の貼り付け面は、半導体に限らず、金属、プラスチック、硝子、セラミック等の無機物など、種々の材料とすることができる。また、本発明の粘着シートは、特に表面に微細な凹凸、いわゆる梨子地状などの凹凸がある被着面を有するもの、レーザ等による印字がある被着面を有するものなどに対して、さらに、被着面の少なくとも1箇所以上に、100μm程度以下の深さの窪みを有する被着面を備えるものに良好に利用することができる。
アクリル酸メチル60重量部と、アクリル酸10重量部と、アクリル酸2エチルヘキシル40部とを共重合して得られた重量平均分子量80万の共重合体(固型分35%)を調製した。
この共重合体を100重量部、多官能アクリレート系オリゴマーである日本合成化学製UV-1700を100重量部、粘着付与剤としてヒドロキシル価が160~170KOHmg/gのテルペンフェノール樹脂(ヤスハラケミカル社製YSポリスターN125)を20重量部、ポリアルキレングリコール化合物と過塩素酸リチウムの混合液(日本カーリット(株)製、商品名PEL-20A(塩含有量:10重量%))を0.5部(酢酸エチルに固形分濃度が10%となるように溶解した溶液を配合)、架橋剤としてポリイソシアネート化合物(商品名「コロネートL」、日本ポリウレタン製)を1重量部、光重合開始剤としてチバスペシャリティーケミカルズ製イルガキュア651を3重量部を配合し、粘着剤溶液を配合・調製した。
その後、基材となる150μmのポリエチレンフィルムをラミネートし、半導体加工用シートを作製した。
得られた半導体ウェハ加工用粘着シートを、50℃加温にて、4日以上熟成した後、以下に示す評価を実施した。
実施例1の粘着剤溶液の調製時にポリアルキレングリコール化合物と過塩素酸リチウムの混合液(日本カーリット(株)製、商品名PEL-20A)を3部に変更した以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時にポリアルキレングリコール化合物と過塩素酸リチウムの混合液(日本カーリット(株)製、商品名PEL-20A)5部に変更した以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時にポリアルキレングリコール化合物と過塩素酸リチウムの混合液(日本カーリット(株)製、商品名PEL-20A)を10部に変更した以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例2の粘着剤溶液の調製時に粘着付与剤を除いた以外は、実施例2と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時に粘着付与剤としてヒドロキシル価が200~210 KOH mg/gのテルペンフェノール樹脂(ヤスハラケミカル社製マイティエースK140)を20重量部に変更した以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時にポリアルキレングリコール化合物と過塩素酸リチウム・トリフロオロメタンスルホン酸リチウムの混合液(日本カーリット(株)製、商品名PEL-25)を5部に変更した以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時に、ポリアルキレングリコール化合物と過塩素酸リチウムの混合液のかわりに、ポリエーテルポリオール(商品名サンニックスPP-1000、三洋化成工業社製)5重量部および過塩素酸リチウム1重量部を用いた以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時に、ポリアルキレングリコール化合物と過塩素酸リチウムの混合液のかわりに、ポリエーテルポリオール(商品名サンニックスPP-400、三洋化成工業社製)10重量部およびアルカリ金属塩として過塩素酸リチウム0.5重量部を用いた以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時に、共重合体を以下のものに変更した以外、実施例1と同様の操作にて粘着シートを作製した。
アクリル酸エチル55重量部と、アクリル酸10重量部と、アクリル酸2エチルヘキシル35重量とを共重合して重量平均分子量70万の共重合体を調製した。
実施例1の粘着剤溶液の調製時に、共重合体を以下のものに変更した以外、実施例1と同様の操作にて粘着シートを作製した。
アクリル酸メチル10重量部と、アクリル酸エチル55重量部と、アクリル酸10重量部と、アクリル酸2エチルヘキシル35重量とを共重合して重量平均分子量100万の共重合体を調製した。
実施例1の粘着剤溶液の調製時にポリアルキレングリコール化合物と過塩素酸リチウムの混合液(日本カーリット(株)製、商品名PEL-20A)を0.333部に変更した以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時に、ポリアルキレングリコール化合物と過塩素酸リチウムの混合液のかわりに、ポリエーテルポリオール(商品名サンニックスPP-1000、三洋化成工業社製)5重量部及び過塩素酸リチウム0.076重量部を用いた以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時にポリアルキレングリコール化合物と過塩素酸リチウムの混合液を配合しない以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時にポリアルキレングリコール化合物と過塩素酸リチウムの混合液を0.1重量部に変更した以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時にポリアルキレングリコール化合物と過塩素酸リチウムの混合液(日本カーリット(株)製、商品名PEL-20A)を20部に変更した以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時に、共重合体を以下のものに変更した以外、実施例1と同様の操作にて粘着シートを作製した。
アクリル酸10重量部と、アクリル酸2エチルヘキシル100部を共重合して重量平均分子量80万の共重合体(固型分35%)を得た。
実施例1の粘着剤溶液の調製時にポリアルキレングリコール化合物と過塩素酸リチウムの混合液を0.3重量部に変更した以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時にポリアルキレングリコール化合物と過塩素酸リチウムの混合液を12重量部に変更した以外は、実施例1と同様の操作にて粘着シートを作製した。
実施例1の粘着剤溶液の調製時に、アクリル酸メチル60重量部と、アクリル酸2エチルヘキシル40部とを共重合して得られた共重合体に変更した以外、実施例1と同様の操作にて粘着シートを作製した。
を調製した。
半導体チップが搭載された基板の封止樹脂面(樹脂面に深さ15μmのレーザー印字があるタイプ)に日東精機製M-286Nの貼り付け装置を用い、速度60mm/sec、テーブル温度45℃にて粘着シートを貼り合せた。
貼り付け後、サンプルを取り出し基板表面から50mmの高さより静電電位測定器(春日電機(株)製 KSD-0103S)を用い、表面電位を測定した。
DISCO製DFG-651のダイサーを用い、回転数:38000rpm、刃厚:300μmのレジンブレードを用いて、粘着層及び基材切り込みの総量を90μmとし、速度40mm/sec、切断時水量:1.5L/minの条件で切断を実施した。
この際に、5mm□に切断した2000個のパッケージに対して飛んだパッケージの数をカウントした。
切断後、基材側から20mW/cm2の高圧水銀ランプを用いて30秒間紫外線を照射し、粘着剤層を硬化させた。その後、室温まで冷却し、手でパッケージを剥離し、2000個のパッケージに対する剥離可能の有無と粘着剤残渣の有無を確認した。
紫外線照射後、サンプルを芝浦メカトロニクス性ダイボンダーFED-1780を用い、ピックアップ速度40mm/sec、ニードルハイト:500μm、ニードルR=500、ニードル本数1本の条件にて200個ピックアップし、成功数を評価した。
一方、比較例では、ウェハの飛びが発生し、電子線を照射した後のピックアップ工程においても、糊残りが生じ、工程中において、静電気又は剥離帯電を抑制することができなかった。特・BR>ノ、比較例7では、粘着剤層の相溶性が悪く、いずれの特性をも満たせなかった。
Claims (7)
- アクリル酸メチルモノマー、アクリル酸エチルモノマー又はアクリル酸メチルモノマー及びアクリル酸エチルモノマーと、
アクリル酸モノマーと、
アクリル酸2-エチルヘキシルモノマーとの共重合体からなるアクリル系粘着剤100重量部に対し、
ポリエーテルポリオール化合物0.3~10重量部及び
少なくとも1種のアルカリ金属塩0.005~2重量部が含有されてなる粘着剤層を有する粘着テープ又はシート。 - 粘着剤層が紫外線及び/又は放射線に対して透過性を有する基材上に形成されてなり、
前記粘着剤層は、さらに、少なくとも1種類以上の紫外線硬化型オリゴマーを含有する請求項1に記載の粘着テープ又はシート。 - 粘着剤層は、さらに、ヒドロキシル価が120~230 KOHmg/gの粘着付与剤を含有してなる請求項1又は2に記載の粘着テープ又はシート。
- 粘着剤層と接する基材に、帯電防止処理が施されてなる請求項1~3のいずれか1つに記載の粘着テープ又はシート。
- 半導体ウェハ又は基板加工用途に使用される請求項1~4のいずれか1つに記載の粘着テープ又はシート。
- ポリエーテルポリオール化合物が、4000以下の重量平均分子量を有する請求項1~5のいずれか1つに記載の粘着テープ又はシート。
- アルカリ金属塩が、Li、Na、K、Mg、Caからなるカチオンと、Cl、Br、I、BF4、PF6、ClO4、NO3、CO3からなるアニオンとからそれぞれ選択される1種以上のイオンを組合せてなる請求項1~6のいずれか1つに記載の粘着テープ又はシート。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/061,011 US20110151252A1 (en) | 2008-08-27 | 2009-08-20 | Adhesive tape or sheet |
CN2009801326617A CN102131878A (zh) | 2008-08-27 | 2009-08-20 | 粘合带或片 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008217502A JP2010053192A (ja) | 2008-08-27 | 2008-08-27 | 粘着テープ又はシート |
JP2008-217502 | 2008-08-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010024174A1 true WO2010024174A1 (ja) | 2010-03-04 |
Family
ID=41721342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/064559 WO2010024174A1 (ja) | 2008-08-27 | 2009-08-20 | 粘着テープ又はシート |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110151252A1 (ja) |
JP (1) | JP2010053192A (ja) |
CN (1) | CN102131878A (ja) |
TW (1) | TW201026808A (ja) |
WO (1) | WO2010024174A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012097234A (ja) * | 2010-11-04 | 2012-05-24 | Nitto Denko Corp | 粘着シート |
EP2474585A3 (en) * | 2011-01-06 | 2012-07-18 | Nitto Denko Corporation | Surface protective sheet for self-cleaning surface |
CN102746802A (zh) * | 2011-04-20 | 2012-10-24 | 株式会社迪思科 | 粘着带和晶片加工方法 |
JPWO2013105455A1 (ja) * | 2012-01-12 | 2015-05-11 | 電気化学工業株式会社 | 粘着シートおよび電子部品の製造方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
KR101194544B1 (ko) * | 2011-01-20 | 2012-10-25 | 도레이첨단소재 주식회사 | 다이 익스포즈드 플립칩 패키지(defcp)의 몰드 언더필 공정용 점착 마스킹 테이프 |
WO2012165368A1 (ja) * | 2011-05-27 | 2012-12-06 | 電気化学工業株式会社 | 粘着シート |
DE202012102188U1 (de) * | 2012-06-14 | 2013-09-26 | Polifilm Protection Gmbh | Partikelhaltige Klebefolie zum temporären Schutz einer Werkstückoberfläche, insbesondere bei Laserbearbeitung, und Verbund mit einer derartigen Folie |
WO2014097719A1 (ja) * | 2012-12-19 | 2014-06-26 | 昭和電工株式会社 | 光学フィルム用粘着剤組成物及び表面保護フィルム |
CN103333647A (zh) * | 2013-06-27 | 2013-10-02 | 苏州工业园区依利电子贸易有限公司 | 一种绝缘粘胶剂 |
JP6247571B2 (ja) * | 2014-03-17 | 2017-12-13 | 日本カーバイド工業株式会社 | 粘着剤組成物及び両面粘着材 |
CN104384708A (zh) * | 2014-10-08 | 2015-03-04 | 中国电子科技集团公司第五十五研究所 | 芯片封装外壳的激光加工方法 |
CN105428261A (zh) * | 2015-12-23 | 2016-03-23 | 南通富士通微电子股份有限公司 | 使用uv膜固定基板的smt方法 |
KR102063050B1 (ko) * | 2015-12-30 | 2020-01-07 | 주식회사 엘지화학 | 점착제 조성물 |
KR102600966B1 (ko) * | 2018-09-21 | 2023-11-09 | 엘지디스플레이 주식회사 | 롤러블 표시 장치 |
KR102135577B1 (ko) * | 2018-12-19 | 2020-07-20 | 전자부품연구원 | Uv 경화형 올리고머, 그의 제조 방법, 그를 포함하는 uv 경화형 점착제 및 점착 테이프 |
JP7311293B2 (ja) * | 2019-03-29 | 2023-07-19 | 日東電工株式会社 | バックグラインドテープ |
CN110607146B (zh) * | 2019-09-18 | 2021-03-12 | 广东东立新材料科技股份有限公司 | 用于pet保护膜的压敏胶及其制备方法 |
CN111057474A (zh) * | 2019-12-24 | 2020-04-24 | 合肥乐凯科技产业有限公司 | 一种uv减粘膜用粘合剂及其uv减粘膜 |
DE102021123617A1 (de) * | 2021-09-13 | 2023-03-16 | Precitec Gmbh & Co. Kg | Laserbearbeitungskopf mit Klebefalle |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06128539A (ja) * | 1992-10-14 | 1994-05-10 | Nitto Denko Corp | 粘着テープまたはシート |
JP2002285134A (ja) * | 2001-03-26 | 2002-10-03 | Sumitomo Bakelite Co Ltd | 半導体加工用粘着シート |
JP2005325255A (ja) * | 2004-05-14 | 2005-11-24 | Nitto Denko Corp | 粘着剤組成物、粘着シート類、および表面保護フィルム |
JP2007302797A (ja) * | 2006-05-12 | 2007-11-22 | Nitto Denko Corp | 半導体ウエハ又は半導体基板加工用粘着シート |
JP2008163276A (ja) * | 2007-01-05 | 2008-07-17 | Nitto Denko Corp | 半導体基板加工用粘着シート |
JP2008166651A (ja) * | 2007-01-05 | 2008-07-17 | Nitto Denko Corp | 半導体基板加工用粘着シート |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3639266A1 (de) * | 1985-12-27 | 1987-07-02 | Fsk K K | Haftfolie |
US5187007A (en) * | 1985-12-27 | 1993-02-16 | Lintec Corporation | Adhesive sheets |
-
2008
- 2008-08-27 JP JP2008217502A patent/JP2010053192A/ja active Pending
-
2009
- 2009-08-20 WO PCT/JP2009/064559 patent/WO2010024174A1/ja active Application Filing
- 2009-08-20 CN CN2009801326617A patent/CN102131878A/zh active Pending
- 2009-08-20 US US13/061,011 patent/US20110151252A1/en not_active Abandoned
- 2009-08-27 TW TW098128863A patent/TW201026808A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06128539A (ja) * | 1992-10-14 | 1994-05-10 | Nitto Denko Corp | 粘着テープまたはシート |
JP2002285134A (ja) * | 2001-03-26 | 2002-10-03 | Sumitomo Bakelite Co Ltd | 半導体加工用粘着シート |
JP2005325255A (ja) * | 2004-05-14 | 2005-11-24 | Nitto Denko Corp | 粘着剤組成物、粘着シート類、および表面保護フィルム |
JP2007302797A (ja) * | 2006-05-12 | 2007-11-22 | Nitto Denko Corp | 半導体ウエハ又は半導体基板加工用粘着シート |
JP2008163276A (ja) * | 2007-01-05 | 2008-07-17 | Nitto Denko Corp | 半導体基板加工用粘着シート |
JP2008166651A (ja) * | 2007-01-05 | 2008-07-17 | Nitto Denko Corp | 半導体基板加工用粘着シート |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012097234A (ja) * | 2010-11-04 | 2012-05-24 | Nitto Denko Corp | 粘着シート |
EP2474585A3 (en) * | 2011-01-06 | 2012-07-18 | Nitto Denko Corporation | Surface protective sheet for self-cleaning surface |
CN102746802A (zh) * | 2011-04-20 | 2012-10-24 | 株式会社迪思科 | 粘着带和晶片加工方法 |
JPWO2013105455A1 (ja) * | 2012-01-12 | 2015-05-11 | 電気化学工業株式会社 | 粘着シートおよび電子部品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20110151252A1 (en) | 2011-06-23 |
TW201026808A (en) | 2010-07-16 |
CN102131878A (zh) | 2011-07-20 |
JP2010053192A (ja) | 2010-03-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010024174A1 (ja) | 粘着テープ又はシート | |
JP5101111B2 (ja) | 半導体基板加工用粘着シート | |
JP4620028B2 (ja) | 基板加工用粘着シート | |
JP5057697B2 (ja) | 半導体ウエハ又は半導体基板加工用粘着シート | |
JP4721834B2 (ja) | 粘着シート及びこの粘着シートを用いた製品の加工方法 | |
EP1752507A1 (en) | Pressure-sensitive adhesive sheet and process for preparing it | |
JP5318474B2 (ja) | 半導体ウエハの裏面研削方法、及びこの半導体ウエハの裏面研削方法に用いる粘着シート | |
KR20070027465A (ko) | 점착 시트 및 이 점착 시트를 이용한 제품의 가공 방법 | |
JP6139515B2 (ja) | ダイシングシート | |
JP2011018669A (ja) | 半導体ウェハダイシング用粘着シート及び該粘着シートを用いる半導体ウェハのダイシング方法 | |
KR101559190B1 (ko) | 다이싱 방법 | |
JP6744930B2 (ja) | ダイシングシートおよび当該ダイシングシートを用いるチップの製造方法 | |
WO2010058727A1 (ja) | 電子部品の製造方法 | |
WO2012049938A1 (ja) | 電子部品の製造方法 | |
TWI712503B (zh) | 透明導電性膜用載膜及積層體 | |
KR20120117828A (ko) | 점착 시트 및 전자 부품의 제조 방법 | |
JP2008163276A (ja) | 半導体基板加工用粘着シート | |
JP2010168541A (ja) | 粘着テープ又はシート | |
JP4259050B2 (ja) | 半導体基板加工用粘着シート | |
JP4805549B2 (ja) | 粘着シート | |
JP2020107628A (ja) | ダイシングダイボンディングフィルム、及び、該ダイシングダイボンディングフィルムを用いた半導体装置の製造方法 | |
CN116391246A (zh) | 保护性胶带、由其制得的制品、以及其制造和使用方法 | |
JP2006036834A (ja) | 半導体ウエハ加工用粘着テープ | |
JP2008056744A (ja) | 再剥離用水分散型アクリル系粘着シート | |
JP2014110366A (ja) | ダイシングシート |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980132661.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09809826 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13061011 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09809826 Country of ref document: EP Kind code of ref document: A1 |