WO2010021547A1 - Ensemble transporteur et procédé pour transporter un support de substrat - Google Patents

Ensemble transporteur et procédé pour transporter un support de substrat Download PDF

Info

Publication number
WO2010021547A1
WO2010021547A1 PCT/NL2009/050505 NL2009050505W WO2010021547A1 WO 2010021547 A1 WO2010021547 A1 WO 2010021547A1 NL 2009050505 W NL2009050505 W NL 2009050505W WO 2010021547 A1 WO2010021547 A1 WO 2010021547A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate carrier
track
guide rail
orientation
substrate
Prior art date
Application number
PCT/NL2009/050505
Other languages
English (en)
Inventor
Eduard Renier Francisca Clerkx
Ernst Dullemeijer
Franciscus Cornelius Dings
Original Assignee
Otb Solar B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otb Solar B.V. filed Critical Otb Solar B.V.
Priority to KR1020117006481A priority Critical patent/KR101625249B1/ko
Priority to EP09788284.9A priority patent/EP2323932B1/fr
Priority to CN200980139046.9A priority patent/CN102171116B/zh
Priority to US13/059,890 priority patent/US8528722B2/en
Publication of WO2010021547A1 publication Critical patent/WO2010021547A1/fr

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B65G47/64Switching conveyors
    • B65G47/644Switching conveyors by a pivoting displacement of the switching conveyor
    • B65G47/645Switching conveyors by a pivoting displacement of the switching conveyor about a horizontal axis
    • B65G47/646Switching conveyors by a pivoting displacement of the switching conveyor about a horizontal axis the axis being parallel to the conveying direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B65G47/64Switching conveyors
    • B65G47/644Switching conveyors by a pivoting displacement of the switching conveyor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B65G47/64Switching conveyors
    • B65G47/644Switching conveyors by a pivoting displacement of the switching conveyor
    • B65G47/645Switching conveyors by a pivoting displacement of the switching conveyor about a horizontal axis
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • C23C14/505Substrate holders for rotation of the substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582Rigid and flat substrates, e.g. plates or discs
    • C23C16/4587Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
    • C23C16/4588Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically the substrate being rotated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • C23C16/545Apparatus specially adapted for continuous coating for coating elongated substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67271Sorting devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02Controlled or contamination-free environments or clean space conditions
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/139Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Definitions

  • the invention relates to a conveyor assembly that is suitable for use with a substrate processing system, comprising at least one substrate carrier having a substrate-carrying surface for supporting at least one substrate; a processing track; a return track; and a drive system for driving the at least one substrate carrier along the processing track and the return track.
  • Such a conveyor assembly is known from, for example, European patent EP 1,365,040 in the name of applicant.
  • Fracture of a substrate may for example be caused by processing conditions, such as extreme temperatures, or by mechanical contact with the substrate either during the actual treatment or during substrate handling in loading and unloading stations.
  • Conveyor systems of the above- described type are employed to convey substrates along one or more processing stations using a substrate carrier that provides a surface for the substrates to rest on. When a substrate fractures during processing, its pieces are left on the substrate- carrying surface of the carrier. Before the carrier can be reloaded with a new substrate, the remnants of the broken substrate will need to be removed.
  • the substrate treatment assembly disclosed in EP 1,365,040 is therefore fitted with special stations for hoovering up substrate remnants from the carrier's surface.
  • a hoovering station is a relatively complicated, expensive en sizable device that takes a relatively long time to clean up a carrier surface.
  • the present invention aims to provide an improved conveyor assembly, particularly an assembly that is relatively compact, and capable of efficiently disposing of the remnants of a fractured substrate and/or other contaminants.
  • the invention provides a conveyor assembly of the above-referenced type, that is characterized in that it comprises a swivel unit configured to pivot the substrate carrier around a substantially horizontal axis from a first orientation into a second orientation, and/or vice versa.
  • Such a conveyor assembly allows a substrate carrier, and with it its substrate carrying surface, to be tilted or even turned so that any loose contaminations, for example remnants of a fractured substrate or deposition waste due to parasitic deposition, fall off the carrier.
  • the material coming off from the carrier may be collected in a container disposed below the swivel unit.
  • a swivel unit can be constructed from relatively few mechanical components, making it a simple, reliable and economically manufacturable device. As the swivel unit can operate quickly, it is also suitable for use with a high-throughput substrate processing system having a production capacity above 1000 wafers per hour, or more.
  • the conveyor assembly for example the swivel unit, can also be configured to subject the substrate carrier to a supplementary translational motion to transfer the substrate carrier from the first to the second orientation.
  • the swivel unit — or a different part of the assembly - may impose a rocking motion on the substrate carrier, so as to shake off any debris of the carrier's surface. It may also comprise a stop against which the carrier may be gently beaten to dislodge remnants that are somewhat sticky, for example due to a preceding processing treatment. Alternatively, the swivel unit may be exposed to a gas/air flow or vibrations to break sticky pieces free of the carrier. The swivel unit may be disposed in the processing track, in the return track, or in between the processing track and the return track, for example depending on the likelihood of a substrate fracture occurring at a certain location along the tracks. Further, the swivel unit may be operated automatically or manually.
  • An automatically operated swivel unit may be activated either incidentally, depending on the output of a substrate fracture sensor such as a camera that inspects the carrier surface of every passing substrate carrier, or continually for every passing carrier, independent of any indication of the condition of the carrier's surface.
  • a substrate fracture sensor such as a camera that inspects the carrier surface of every passing substrate carrier, or continually for every passing carrier, independent of any indication of the condition of the carrier's surface.
  • the phrase 'substantially horizontal' is intended to comprise any direction that includes an acute angle of less than 45 degrees, particularly 20 degrees, with a plane normal to the direction of gravity.
  • the phrase 'substantially vertical' is intended to comprise any direction that includes an acute angle between 45 and 90 degrees, particularly between 70 and 90 degrees, with a plane normal to the direction of gravity.
  • the processing track and the return track may not constitute wholly separate tracks, but for example one and the same track instead, or tracks that partially coincide.
  • the first orientation corresponds to a substantially horizontally oriented substrate- carrying surface of the substrate carrier.
  • the second orientation departing from the first orientation — can, for example, obtained by a pivoting motion through an angle between 70 and 270 degrees, for example through an angle of 90 and 270 degrees.
  • the first orientation is preferably horizontal, corresponding to a substrate carrier that supports one or more substrates from below.
  • the second orientation is best chosen such that the carrying surface does not support the debris to be disposed of, allowing gravity to use the full weight of the debris to remove it. Departing from the first, horizontal orientation, this is achieved by pivoting the carrier through an angle between 70 and 270 degrees.
  • the substrate carrier is rotated around an axis that is located much to the side of the carrying surface, rotation through angles of around 180 degrees may require a significant amount of space.
  • rotation of a rectangularly shaped carrier around an axis coinciding with one of its rectangular sides through an angle of 180 degrees, whereby the axis extends in a transport direction of the carrier would double the width of the transport track in terms of its effective footprint.
  • Apparatus for use in commercial production lines are preferably kept compact, with special attention for footprint minimization. Consequently, the second orientation is preferably obtained by pivoting the carrier through an angle between 70 and 120 degrees departing from the first orientation, for example an angle in the range of 90 - 120 degrees, more particularly an angle of 110 degrees.
  • the conveyor assembly may comprise two swivel units, a first swivel unit for example being disposed between an end point of the processing track and a starting point of the return track, and a second swivel unit for example being disposed between an end point of the return track and a starting point of the processing track.
  • the two swivel units may be used to perform opposite actions.
  • the first swivel unit for example disposed downstream of a discharge station that unloads substrates from the carrier's surface, may pivot the carrier from its first, horizontal position into its second, tilted position to remove any contaminants.
  • the substrate carrier may then be transported along the return track, back to the starting point of the processing track, where it is pivoted back into its first horizontal position to be loaded with new substrates.
  • An advantage of this setup is that the footprint of the return track may be relatively small as the substrate carriers may be transported in a tilted, possibly (near) vertical position.
  • the processing track and the return track may be provided with guide means, for example guide rails, that help ensure that the substrate carrier maintains its given orientation during transport.
  • the processing track is disposed substantially above or below the return track. This not only minimizes the footprint of the conveyor assembly, it may also enable improved compactness of a respective system in which it is implemented, as a whole.
  • the processing track is disposed above or below the return track, and substrate carriers are transported along the processing track in a first, substantially horizontal orientation and along the return track in a second, more or less upright orientation, an elongate space below respectively above the processing track (and next to the return track) is rendered available, which space may be exploited to accommodate one or more other parts of the system, e.g. vacuum pumps, power supplies, control units etc.
  • the conveyor assembly comprises a number of rollers, for example wheels, mounted on the substrate carrier, and at least one rail extending along at least a part of the processing track and/or the return track, said rail being configured for cooperation with the roller(s) on the substrate carrier, such that the substrate carrier is rollably moveable over the rail along said part of said track.
  • At least a portion of the processing track is defined by a first guide rail
  • the substrate carrier comprises a first set of rollers that are configured for cooperation with the first guide rail, such that the substrate carrier is rollably moveable over the first guide rail along said portion of the processing track.
  • At least a portion of the return track is defined by a second guide rail
  • the substrate carrier comprises a second set of rollers that are configured for cooperation with the second guide rail, such that the substrate carrier is rollably moveable over the second guide rail along said portion of the return track.
  • At least one swivel unit may be configured for transferring a substrate carrier from the first guide rail of the processing track onto the second guide rail of the return track, and/or vice versa, by pivoting the substrate carrier around a substantially horizontal axis between its first orientation and its second orientation.
  • the at least one swivel unit may comprise a first and a second guide rail extension, arranged such that the first guide rail extension is in alignment with the first guide rail when the swivel unit holds the substrate carrier in its first orientation, and wherein the second guide rail extension is in alignment with the second guide rail when the swivel unit holds the substrate carrier in its second orientation.
  • the at least one swivel unit may thus serve as a switch between the processing track and the return track, allowing substrate carriers to be easily moved onto and off the swivel unit when it is in alignment with either the processing or the return track.
  • the return track extends at least partly through a conditioned environment, e.g. an environment wherein an inert gas is present and/or certain temperature conditions are enforced, and/or e.g. an interior environment that is sealed from an exterior environment, for example a vacuum environment.
  • a conditioned environment e.g. an environment wherein an inert gas is present and/or certain temperature conditions are enforced
  • an interior environment that is sealed from an exterior environment for example a vacuum environment.
  • the invention also provides for a method for conveying a substrate carrier, comprising: providing a substrate carrier; positioning the substrate carrier in a first orientation, conveying the substrate carrier along a first track, and rotating the substrate carrier around a substantially horizontal axis into a second orientation.
  • the method may, inter alia, be used advantageously in substrate processing systems, for example semiconductor wafer processing systems, wherein more sizeable and costly equipment, such as hoovering stations, tend to be used.
  • the method may further comprise conveying the substrate carrier in the second orientation along a second track, and rotating the substrate carrier around a substantially horizontal axis, back into its first orientation; and/or collecting any material falling off the substrate carrier due to a change in its orientation or any other specific action taken to dislodge contaminants from the carrier, for example subjecting it to a gas flow or vibrations.
  • first track and the second track may not constitute wholly separate tracks, but for example one and the same track instead, or tracks that partially coincide.
  • first and the second track are connected, for example by means of an aforementioned swivel unit, to form an endless path along which substrate carriers may be driven continuously.
  • the first and second tracks may be disposed one above the other, so as to minimize the footprint and space occupation of a device that executes the method.
  • Fig. 1 is a schematic perspective view of an exemplary disclosed conveyor assembly
  • Fig. 2 is a side view of an exemplary substrate carrier that may be used in the conveyor assembly according to the present invention
  • Fig. 3 is a perspective view of a bottom side of the substrate carrier shown in Fig. 2;
  • Fig. 4 is a perspective view of a top side of the substrate carrier shown in Fig. 2;
  • Fig. 5 is a side view of an exemplary disclosed swivel unit with the substrate carrier of Fig. 2 inserted therein;
  • Fig. 6 is a perspective view of an exemplary disclosed swivel unit with the substrate carrier of Fig. 2 inserted therein, and illustrates the situation shown in Fig. 5 from a different angle;
  • Fig. 7 schematically illustrates the operation of an optional carrier exchange unit;
  • Fig. 8 diagrammatically illustrates a substrate processing system in which a conveyor assembly according to the invention may be incorporated.
  • Fig. 1 schematically shows an exemplary conveyor assembly 100 according to the present invention.
  • Conveyor assembly 100 comprises an upper processing track, which is embodied by two guide rails 102, 103. It is contemplated that in other embodiments of the conveyor assembly 100 the processing track may be embodied by a different number of guide rails. A further guide rail may for example be used to offer extra support to relatively heavy parts of the substrate carrier 108, such as the area's onto which magnets 112 - to be discussed hereafter - are mounted.
  • the processing track leads from a starting point 104 to an end point 106 thereof.
  • the starting point 104 may be associated with a loading position for placing substrates onto a substrate carrier 108 having a substrate- carrying surface 109 that is subsequently sent off along guide rails 102, 103 of the processing track.
  • end point 106 of the processing track may be associated with a discharge or unloading position for removing properly processed substrates from the substrate carrier 108.
  • One or more processing stations for performing substrate treatments may be disposed along the processing track, in between starting point 104 and end point 106 (see also Fig. 8).
  • a return track is provided.
  • the return track is embodied by a guiderail 110.
  • swivel units 500 which operate much like switches that allow a substrate carrier 108 to be transferred rotationally from the processing track to the return track, or vice versa. Swivel unit 500 and its operation will be discussed in more detail later on. Together with swivel units 500, the processing track and the return track form an endless path along which substrate carriers 108 can be conveyed.
  • the return track is arranged substantially below the processing track to minimize the footprint of the return track, and that of the conveyor assembly 100 as a whole. It is noted however, that the position of the processing track relative to the return track may, in principle, be chosen arbitrarily.
  • the substrate carrier 108 may be subjected to a supplementary translational motion, executed either by the swivel unit 500 or another translating device.
  • a drive system is provided to drive a substrate carrier 108 along the endless path made up of the processing track and the return track.
  • the exemplary drive system depicted in Fig. 1 is twofold. That is, the drive mechanism used for transporting substrate carriers along the processing track differs from the mechanism used for transporting substrate carriers 108 along the return track. In both cases though, use is made of a series of permanent magnets 112 (not visible in Fig. 1; see Fig. 3) that are mounted on a bottom side the substrate carrier 108.
  • electric coils 114 are provided alongside of guide rail 102.
  • the electric coils may be powered to generate a magnetic field that interacts with the magnetic field of the magnets 112 mounted on the substrate carrier, thereby transferring energy to the carrier 108 so as to move it in transport direction 118.
  • Such an electromagnetic drive system offers the advantage of independent control over the motion of individual carriers 108, while maintenance requirements are kept to a minimum as the parts of the drive system hardly demonstrate any wear.
  • the electric coils 114 may be disposed outside of a conditioned processing environment — particularly a vacuum environment — , which is especially advantageous in case substrate treatments are performed that might soil or harm the coils.
  • the drive system to drive the carriers 108 along the processing track can be the same as, or correspond to, the conveyor system described by EP 1,365,040, incorporated to that aim in this text by reference.
  • a belt 116 extending in a direction parallel to guide rail 110, is provided to drive substrate carriers 108 in a direction 120 along the return track.
  • Belt 116 is provided with or made of a magnetizable material such as iron, which is magnetized in the presence of the magnets 112 mounted on a substrate carrier 108. Once magnetized, belt 116 and a carrier 108 are magnetically linked, and movement of the belt will drive the carrier along guide rail 110.
  • belt 116 can include permanently magnetic material that interacts with magnets 112. It is clear from Fig. 1 that substrate carriers 108 on the processing track are oriented differently from substrate carriers 108 on the return track. Carriers 108 on the processing track are oriented substantially horizontally, while carriers 108 on the return track are oriented substantially vertically.
  • substrate carriers 108 are re-oriented by pivoting them around a substantially horizontal axis that extends in a direction parallel to guide rails 102, 110.
  • the re-orientation is performed by the swivel units 500. Pivoting a substrate carrier 108 from its substantially horizontal position into its substantially vertical position may particularly serve to throw off remnants of fractured substrates or other loose contaminations from the substrate-carrying surface 109 of the substrate carrier.
  • the drive system shown in Fig. 1 is exemplary.
  • a multitude of alternative drive systems for driving a substrate carrier along a track are known in the art, and the topic need not be elaborated on here.
  • the drive system though advantageous — need not be magnetic in nature: for example, a conventional chain conveyor may be used to transport a substrate carrier 108 along the processing track.
  • driven belt 116 or another type of drive means may couple with the substrate carrier 108 through mechanical friction, clamping, gripping, or otherwise, to drive it along the return track.
  • Fig. 1 provides a relatively high level overview of an exemplary embodiment of a conveyor assembly 100 according to the present invention.
  • a substrate carrier 108 and a swivel unit 500 will be disclosed.
  • Substrate carrier 108 plays an important role in achieving a substrate processing system having a high throughput capacity. Its dimensions are preferably chosen such that it can support a significant amount of wafers, e.g. 10 or more, for simultaneous processing.
  • the depicted substrate carrier 108 comprises a rectangular carrier plate 200, and a U- shaped profile 202 that is connected to a bottom side 204 of the carrier plate 200, nearby and parallel to a rectangular side thereof.
  • a top side 206 of carrier plate 200 is provided with a number of substantially square recesses 208 configured for receiving a same number of substrates.
  • a bottom side of the U-profile is provided with the series of permanent magnets 112, whose function as part of the drive system has already been discussed above.
  • Bottom side 204 of carrier plate 200 is provided with two pairs of mutually aligned rollers 210, disposed close to a rectangular side of carrier plate 200 opposite to the U-profile 202.
  • the U-profile 202 itself is also provided with four correspondingly aligned rollers 212.
  • the rollers 210, 212 are configured for cooperation with guide rails 102, 103 of the processing track, and have an axis of rotation that extends substantially parallel to the carrier plate 200.
  • the rollers 210, 212 support substrate carrier 108 as it moves along the processing track, and allow it to be conveyed smoothly.
  • rollers 214 Besides the rollers 212, the U-profile is provided with another pair of rollers 214. These rollers 214, having a somewhat larger diameter than rollers 210, 212 and an axis of rotation that extends almost perpendicularly to the carrier plate 200, are configured for cooperation with guide rail 110 of the return track. The angle included by the axes of rotation of rollers 214 and the carrier plate 200 is related to the angle through which the substrate carrier 108 is pivoted by swivel unit 500 to be discussed hereafter.
  • FIG. 5 and 6 illustrate an exemplary swivel unit 500 in which the exemplary substrate carrier 108 of Fig. 2 - 4 is inserted.
  • Swivel unit 500 comprises a cylinder-piston assembly 502, 520, a cylinder end 504 thereof being pivotably connectable to the fixed world, and a piston rod end 506 thereof being pivotably connected to a casing 508 of the swivel unit.
  • the casing 508 can be pivotably suspended by means of two bearing mounts 512 having a pre-assembled shaft portion 510.
  • the two bearing mounts 512 are provided on opposite sides of the casing 508 of the swivel unit 500, such that only one is visible in Fig. 5.
  • the swivel unit 500 further comprises two rail extensions 514, 516 configured for cooperation with rollers 210 and 212 respectively, and one rail extension 518 configured for cooperation with rollers 214.
  • Swivel unit 500 also comprises a flange 522 which engages rollers 212.
  • a swivel unit 500 disposed at end point 106 of the processing track may be as follows.
  • the rail extensions 514, 516 are aligned with guide rails 102 and 103 of the processing track.
  • a substrate carrier 108 being driven along guide rails 102 and 103, and reaching end point 106 of the processing track, is thus automatically driven into swivel unit 500.
  • rollers 212, 210 will engage the rail extensions 514, 516.
  • roller 214 will engage rail extension 518. At this point substrate carrier 108 is still supported by rollers 212, 210.
  • piston rod 520 When a substrate carrier 108 is fully inserted, cylinder-piston assembly 502, 520 may be activated to retract piston rod 520 into the cylinder 502, thereby causing casing 508, and thus substrate carrier 108 inserted therein, to rotate downward around shaft 510.
  • the precise, final angle through which casing 508 and carrier 108 are rotated depends on the distance over which piston rod 520 is retracted, and is for the shown embodiment set to approximately 110 degrees. It is noted that piston rod 520 need not necessarily be retracted in a single, fluent motion. It may, for example, be made to intermittently slide in and out of cylinder 502 to impose a shaking motion on substrate carrier 108.
  • flange 522 may serve to maintain proper contact between swivel unit 500 and substrate carrier 108.
  • casing 508 and carrier 108 have reached their second orientation.
  • Substrate carrier 108 is now supported by rollers 214 that rest on rail extension 518, which — due to the rotation — has come into alignment with guide rail 110 of the return track.
  • the re-orientation has also brought magnets 112, provided on a bottom side of U-profile 202, into the reach of belt 116.
  • the movement of belt 116 will draw substrate carrier 108 from swivel unit 500, onto guide rail 110 of the return track, and convey it towards the starting point of the processing track.
  • a substrate carrier is preferably made to maintain its orientation. If this orientation tends to be negated by for example gravity, an extra guide rail may be provided, e.g. a guide rail in alignment with flange 522.
  • FIG. 7 schematically illustrates the operation of an optional carrier exchange unit 700 (see FIG. 8) that may be included in a conveyor assembly 100 according to the present invention.
  • a carrier exchange 700 unit allows a substrate carrier 108 already on the processing or return track to be sidetracked, or a new substrate carrier 108 to be inserted into a stream of carriers present on either one of the tracks, without halting the assembly 100 as a whole.
  • Side-tracking of a substrate carrier may for example be desired in case one or more substrate carriers 108 need thorough inspection or maintenance, while insertion of a carrier 108 may allow a so called 'dummy carrier' to be slipped into a substrate carrier stream.
  • the dummy carrier can be fitted with measurement equipment, such as a thermocouple and temperature data recorder, to assess the precise conditions substrates are subjected to during processing.
  • a carrier exchange unit 700 incorporated in the return track of conveyor assembly 100 shown in Fig. 1 may operate as follows.
  • Situation A depicting a schematic top view of the return track, illustrates normal operating conditions.
  • Belt 116 which is now divided into two sections, conveys substantially vertically oriented substrate carriers 108 along the return track in direction 120.
  • the exchange unit 700 is disposed between the two sections of belt 116, and comprises two belts 702, 704.
  • belt 704 is aligned with both sections of belt 116 such that a substrate carrier 108 being transported along the return track is automatically handed over from a first section of belt 116, to belt 704, and on to a second section of belt 116.
  • Belts 116 and 704 operate as a single continuous belt.
  • belts 702 and 704 which may be mounted in a slideable frame, can be brought forward swiftly by an actuator, such as a hydraulic cylinder. This is shown in situation B.
  • Belt 702 thereby takes the place of belt 704, while belt 704 - together with substrate carrier 108 to be exchanged - is brought outside of the stream of substrate carriers moving along the return track.
  • the respective substrate carrier can now be inspected, serviced, replaced etc., as shown in situation C.
  • the carrier exchange unit 700 is placed inside a vacuum environment, the vacuum may need to be cancelled first, possibly leading to downtime of the production line.
  • the carrier exchange unit 700 is preferably disposed in an atmospheric part of the return track.
  • the described steps may be executed in reverse.
  • the two belts 702, 704 may be moved backwards, so as to line up belt 704 with both sections of belt 116, thus inserting the substrate carrier held by belt 704 into the stream, as shown in situation E.
  • no guide rails, in particular no guide rail 110, are shown in Fig. 7 for reasons of clarity. In reality however, they may be present, in which case they are sectioned in the same way that belt 116 is.
  • the substrate carrier exchange unit 700 may, of course, by analogy with the belts 702, 704, also provide for exchanger guide rail sections mounted on the frame of the unit. Each of these exchanger guide rail sections is then brought into alignment with the primary sections of guide rail 110 of the return track when their respective associated exchanger belt 702, 704 is aligned with the sections of belt 116.
  • Fig. 8 diagrammatically illustrates an exemplary substrate processing system 800 in which a conveyor assembly 100 according to the present invention may be used advantageously.
  • the system can comprise a first load lock 804 and a second load lock 810, being configured to seal a conditioned (interior) environment of one or more processing stations, for example a vacuum environment, from an exterior environment.
  • Substrate processing system 800 comprises a loading station 802 where substrate carriers 108 may be loaded with one or more substrates that require processing. The substrates may be taken from supplied cassettes by a substrate handler such as a Bernoulli gripper, and be placed on a substantially horizontally oriented substrate carrying surface 109 of the substrate carriers 108.
  • the substrate carriers 108 may then be moved through the first load lock 804, into the conditioned (for example vacuum) environment.
  • the conditioned environment may accommodate a number of processing stations, such as a heating station 806, and/or one or more deposition stations 808 for subjecting substrates to for example a sputtering, CVD, PECVD or lithography treatment.
  • the substrates may then be conveyed through the second load lock 810, into an atmospheric exterior environment, and on to a discharge location 812 where the processed substrates may be inspected. Properly processed and unfractured substrates may be unloaded from the substrate carriers 108 and be placed into transport cassettes.
  • the discharged substrate carriers 108 may then be conveyed further to a swivel unit 500, which pivots the substrate carriers 108 around a substantially horizontal axis to dispose of any material purposefully left on the carriers 108 at the unloading location 812.
  • the substrate carriers may be transported back to their point of departure via a return track that includes a substrate carrier exchange unit 700.
  • a second swivel unit 500 may be provided ahead of loading station 802 to pivot the carriers 108 back into their desired orientation.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention porte sur un ensemble transporteur (100) approprié pour être utilisé dans un système de traitement de substrat (800). Ledit ensemble comprend : au moins un support de substrat (108) comportant une surface de support de substrat (109) servant de support à au moins un substrat; une piste de traitement; une piste de retour; un système d'entraînement pour entraîner le support de substrat (108) le long de la piste de traitement et de la piste de retour; et au moins une unité de pivotement (500) configurée pour faire pivoter le support de substrat (108) autour d'un axe sensiblement horizontal, d'une première orientation à une deuxième orientation et/ou inversement. L'invention porte également sur un procédé pour transporter un support de substrat (108), comprenant : la mise à disposition d'un support de substrat (108); le positionnement du support de substrat (108) dans une première orientation; le transport du support de substrat (108) le long d'une première piste; et la rotation du support de substrat (108) autour d'un axe sensiblement horizontal, jusqu'à une deuxième orientation.
PCT/NL2009/050505 2008-08-22 2009-08-21 Ensemble transporteur et procédé pour transporter un support de substrat WO2010021547A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020117006481A KR101625249B1 (ko) 2008-08-22 2009-08-21 컨베이어 조립체 및 기판 캐리어를 운반하기 위한 방법
EP09788284.9A EP2323932B1 (fr) 2008-08-22 2009-08-21 Ensemble transporteur et procédé pour transporter un support de substrat
CN200980139046.9A CN102171116B (zh) 2008-08-22 2009-08-21 用于传送基板承载器的传送器组件和方法
US13/059,890 US8528722B2 (en) 2008-08-22 2009-08-21 Conveyor assembly and method for conveying a substrate carrier

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2001910 2008-08-22
NL2001910A NL2001910C (en) 2008-08-22 2008-08-22 Conveyor assembly and method for conveying a substrate.

Publications (1)

Publication Number Publication Date
WO2010021547A1 true WO2010021547A1 (fr) 2010-02-25

Family

ID=40460014

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2009/050505 WO2010021547A1 (fr) 2008-08-22 2009-08-21 Ensemble transporteur et procédé pour transporter un support de substrat

Country Status (7)

Country Link
US (1) US8528722B2 (fr)
EP (1) EP2323932B1 (fr)
KR (1) KR101625249B1 (fr)
CN (1) CN102171116B (fr)
NL (1) NL2001910C (fr)
TW (1) TWI457265B (fr)
WO (1) WO2010021547A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110206485A1 (en) * 2008-08-22 2011-08-25 Otb Solar B.V. Conveyor assembly and method for conveying a substrate carrier
WO2015117638A1 (fr) * 2014-02-04 2015-08-13 Applied Materials, Inc. Source d'évaporation pour matériau organique, appareil doté d'une source d'évaporation pour matériau organique, système doté d'un appareil de dépôt d'évaporation avec une source d'évaporation pour matériaux organiques et procédé de fonctionnement d'une source d'évaporation pour matériau organique
JP2017214654A (ja) * 2017-05-24 2017-12-07 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 有機材料用の蒸発源、有機材料用の蒸発源を有する装置、有機材料用の蒸発源を含む蒸発堆積装置を有するシステム、及び有機材料用の蒸発源を操作するための方法
CN117381456A (zh) * 2023-12-08 2024-01-12 山西军昊实业有限公司 一种用于声屏障金属单元板滚压一体成型设备

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201327712A (zh) * 2011-11-01 2013-07-01 Intevac Inc 以電漿處理太陽能電池晶圓之系統架構
KR20130049080A (ko) * 2011-11-03 2013-05-13 삼성디스플레이 주식회사 회전식 박막 증착 장치 및 그것을 이용한 박막 증착 방법
WO2014059134A1 (fr) * 2012-10-11 2014-04-17 Siemens Healthcare Diagnostics Inc. Porteur de maintenance d'automatisation
TWI505981B (zh) * 2014-01-02 2015-11-01 All Ring Tech Co Ltd Material to undertake positioning device
WO2015127191A1 (fr) * 2014-02-20 2015-08-27 Intevac, Inc. Système et procédé pour le traitement bifacial de substrats
CN105261575B (zh) * 2014-05-30 2020-07-28 盛美半导体设备(上海)股份有限公司 磁性连接装置
JP2016199376A (ja) * 2015-04-13 2016-12-01 三星ダイヤモンド工業株式会社 基板搬送装置
US10533264B1 (en) * 2015-12-02 2020-01-14 General Graphene Corp. Apparatus for producing graphene and other 2D materials
TWI614822B (zh) * 2016-06-29 2018-02-11 All Ring Tech Co Ltd 基板檢查方法及裝置
TWI644383B (zh) 2016-08-29 2018-12-11 因特瓦克公司 線內扇出系統
JP6846943B2 (ja) * 2017-02-10 2021-03-24 東京エレクトロン株式会社 塗布装置、および塗布方法
CN108946093B (zh) * 2017-05-25 2021-04-30 Ykk株式会社 搬送装置及搬送方法
CN108398240B (zh) * 2018-05-30 2024-04-16 苏州精濑光电有限公司 一种回转装置及宏观检查装置
CN109264405B (zh) * 2018-09-10 2020-08-28 安徽省富鑫雅光电科技有限公司 一种大功率超长led板用移动设备
DE102018216878A1 (de) * 2018-10-01 2020-04-02 centrotherm international AG Transporteinheit für paralleles Einfahren oder Ausfahren von Substratträgern, in parallele Prozessrohre und Verfahren zum gleichzeitigen Beladen von parallelen, horizontal beabstandeten Prozessrohren
US11869791B2 (en) 2019-01-08 2024-01-09 Ulvac, Inc. Vacuum processing apparatus
WO2020144891A1 (fr) * 2019-01-08 2020-07-16 株式会社アルバック Appareil de traitement sous vide
US20200350188A1 (en) * 2019-05-02 2020-11-05 Intevac, Inc. Inline vacuum processing system with substrate and carrier cooling
CN110257793A (zh) * 2019-07-04 2019-09-20 深圳市捷佳伟创新能源装备股份有限公司 倾斜运输托盘的镀膜设备
FR3121922B1 (fr) * 2021-04-16 2023-05-12 Synerlink Système de manutention de plaques dans une machine traitant des récipients
CN117187789A (zh) * 2023-08-29 2023-12-08 德鸿半导体设备(浙江)有限公司 一种在真空中翻转基片的基片加工系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2038993C1 (ru) * 1991-04-16 1995-07-09 Николай Григорьевич Григорьев Транспортирующее устройство
US6008476A (en) * 1997-08-04 1999-12-28 Motorola, Inc. Apparatus for indexing and affixing components to a substrate
DE19903798A1 (de) * 1999-02-01 2000-08-10 Angew Solarenergie Ase Gmbh Verfahren und Anordnung zur Wärmebehandlung von flächigen Gegenständen
US20030010449A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Automatic wafer processing and plating system
EP1365040A1 (fr) * 2002-05-21 2003-11-26 OTB Group B.V. Installation pour traitement de substrates
US20080034990A1 (en) * 2006-03-27 2008-02-14 Thieme Gmbh & Co. Kg. Method of transporting and printing of printed material and printing table for a flatbed printing machine

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1841640A (en) * 1932-01-19 Transfer device for overhead track systems
US3757700A (en) * 1972-05-01 1973-09-11 Rail vehicle with electromagnet engaging belt drive
EP0043059B1 (fr) * 1980-06-28 1985-09-25 Alfred Bilsing Transporteur automatique
US5119732A (en) * 1991-01-18 1992-06-09 R.R. Donnelley & Sons Company Portable gantry robot
KR100603100B1 (ko) * 1999-05-06 2006-07-20 동경 엘렉트론 주식회사 유리 기판의 반송 시스템
US6413145B1 (en) * 2000-04-05 2002-07-02 Applied Materials, Inc. System for polishing and cleaning substrates
US20030188997A1 (en) * 2002-03-29 2003-10-09 Tan Beng Soon Semiconductor inspection system and method
US7234584B2 (en) * 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
US20040197179A1 (en) * 2003-04-03 2004-10-07 Applied Materials, Inc. Method and apparatus for vertical transfer of semiconductor substrates between cleaning modules
US7249670B2 (en) * 2005-02-22 2007-07-31 Interlab Incorporated Processing transport apparatus
JP4515331B2 (ja) * 2005-05-30 2010-07-28 東京エレクトロン株式会社 基板の処理システム
DE102006019233A1 (de) * 2006-04-26 2007-10-31 Kolbus Gmbh & Co. Kg Vorrichtung zum Wenden von kontinuierlich geförderten, flachliegenden Druckprodukten
NL2001910C (en) * 2008-08-22 2010-03-10 Otb Solar Bv Conveyor assembly and method for conveying a substrate.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2038993C1 (ru) * 1991-04-16 1995-07-09 Николай Григорьевич Григорьев Транспортирующее устройство
US6008476A (en) * 1997-08-04 1999-12-28 Motorola, Inc. Apparatus for indexing and affixing components to a substrate
DE19903798A1 (de) * 1999-02-01 2000-08-10 Angew Solarenergie Ase Gmbh Verfahren und Anordnung zur Wärmebehandlung von flächigen Gegenständen
US20030010449A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Automatic wafer processing and plating system
EP1365040A1 (fr) * 2002-05-21 2003-11-26 OTB Group B.V. Installation pour traitement de substrates
US20080034990A1 (en) * 2006-03-27 2008-02-14 Thieme Gmbh & Co. Kg. Method of transporting and printing of printed material and printing table for a flatbed printing machine

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110206485A1 (en) * 2008-08-22 2011-08-25 Otb Solar B.V. Conveyor assembly and method for conveying a substrate carrier
US8528722B2 (en) * 2008-08-22 2013-09-10 Otb Solar B.V. Conveyor assembly and method for conveying a substrate carrier
WO2015117638A1 (fr) * 2014-02-04 2015-08-13 Applied Materials, Inc. Source d'évaporation pour matériau organique, appareil doté d'une source d'évaporation pour matériau organique, système doté d'un appareil de dépôt d'évaporation avec une source d'évaporation pour matériaux organiques et procédé de fonctionnement d'une source d'évaporation pour matériau organique
JP2017506703A (ja) * 2014-02-04 2017-03-09 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated キャリアによって支持された基板上に一又は複数の層を堆積させるためのシステム、及び当該システムを使用する方法
US9899635B2 (en) 2014-02-04 2018-02-20 Applied Materials, Inc. System for depositing one or more layers on a substrate supported by a carrier and method using the same
TWI652119B (zh) 2014-02-04 2019-03-01 應用材料股份有限公司 用於在由載具所支撐的基板上沉積一或多個層的系統、及使用其之方法
JP2017214654A (ja) * 2017-05-24 2017-12-07 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 有機材料用の蒸発源、有機材料用の蒸発源を有する装置、有機材料用の蒸発源を含む蒸発堆積装置を有するシステム、及び有機材料用の蒸発源を操作するための方法
CN117381456A (zh) * 2023-12-08 2024-01-12 山西军昊实业有限公司 一种用于声屏障金属单元板滚压一体成型设备
CN117381456B (zh) * 2023-12-08 2024-02-20 山西军昊实业有限公司 一种用于声屏障金属单元板滚压一体成型设备

Also Published As

Publication number Publication date
TW201029903A (en) 2010-08-16
KR20110044920A (ko) 2011-05-02
CN102171116A (zh) 2011-08-31
NL2001910C (en) 2010-03-10
US20110206485A1 (en) 2011-08-25
US8528722B2 (en) 2013-09-10
EP2323932A1 (fr) 2011-05-25
TWI457265B (zh) 2014-10-21
KR101625249B1 (ko) 2016-05-27
CN102171116B (zh) 2014-03-26
EP2323932B1 (fr) 2017-03-22

Similar Documents

Publication Publication Date Title
US8528722B2 (en) Conveyor assembly and method for conveying a substrate carrier
US11107715B2 (en) Semiconductor stocker systems and methods
JP4739532B2 (ja) Lcdガラス基板の搬送システム
JP5331687B2 (ja) 基板を処理することによる電子部品の製造における対象物用保存装置
US8998553B2 (en) High throughput load lock for solar wafers
KR101291630B1 (ko) 클린 스토커와 물품의 보관방법
US10161949B2 (en) Method and device for transferring sample tubes between a laboratory automation system and a sample archiving system
KR20100085128A (ko) 기판반송장치, 기판반송방법 및 진공처리장치
US20070296134A1 (en) Substrate transporting mechanism, substrate transporting method and substrate processing system
US7611319B2 (en) Methods and apparatus for identifying small lot size substrate carriers
JP2009094242A (ja) 基板保持機構、基板受渡機構、及び基板処理装置
US20030161714A1 (en) Storage and buffer system with transport elements
JP2004277003A (ja) 大型薄板用コンテナーおよび大型薄板給排装置
JP4505002B2 (ja) 搬送装置
CN112204164B (zh) 在真空系统中处理掩模的方法、和真空系统
JP3722688B2 (ja) 固形物の連続加圧加熱処理装置
JP2004210395A (ja) 大型薄板用コンテナーおよび大型薄板給排装置
JP2005175429A (ja) 基板カセット、基板保管搬送装置、基板搬入システム、基板搬出システム及び基板搬入/搬出システム
JP4451901B2 (ja) 搬送装置
CN113830558A (zh) 玻璃基板的传输装置
JP2010118593A (ja) 基板搬送処理装置及び方法
JP2002255328A (ja) 搬送装置
JP2002128022A (ja) 固形物移し替え装置

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980139046.9

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09788284

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

REEP Request for entry into the european phase

Ref document number: 2009788284

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2009788284

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20117006481

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 13059890

Country of ref document: US