US20070296134A1

US20070296134A1 - Substrate transporting mechanism, substrate transporting method and substrate processing system

Info

Publication number: US20070296134A1
Application number: US11/686,992
Authority: US
Inventors: Takahiro Horiguchi
Original assignee: Individual
Current assignee: Individual
Priority date: 2006-06-26
Filing date: 2007-03-16
Publication date: 2007-12-27
Also published as: JP2008004898A; CN101096245A; KR100778208B1; TW200804159A

Abstract

The present invention provides a substrate transporting mechanism and a substrate transporting method, in which driving force can be separated or combined together without using a mechanical synchronizing mechanism such as gear. A substrate transporting mechanism in a chamber 31 comprises a fixed stage 310 and a movable stage 320. On the movable stage 320, a first, a second, and a third driven magnets 331, 332, and 333 are supported by bearing units 322. These driven magnets are magnetically coupled with each other, and the third driven magnet 333 is magnetically coupled with the roller magnet 323. Further, the first driven magnet 331 is magnetically coupled with the driving magnet 330, and the driving force from the driving magnet 330 can be separated or combined.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a substrate transporting mechanism and a substrate transporting method for transporting substrates such as glass substrates to be used in liquid crystal display (LCD) panel. The invention also relates to a substrate processing system using the transport of the substrates.
2. Description of the Related Art
In a conventional type processing system for general semiconductor substrate or LCD glass substrate, a plurality of processing apparatuses such as coating-developing apparatus, etching apparatus, etc. are provided along the transport system. Some of the transport systems of the processing system for LCD glass substrate have the function to transport the substrates under vacuum condition (or under reduced pressure) in order to carry in or carry out the substrate to or from a vacuum side processing system.
In such a transporting system as described above, motive power is transmitted by using a belt (metal or elastomer belt) or using a gear within a vacuum chamber, and the substrates are transported by means such as roller, robot arm, or moving plate. For the purpose of driving these mechanisms in a vacuum chamber, driving force must be transmitted from a driving source arranged on an atmospheric side to the transport unit arranged on the vacuum side in the chamber. For this purpose, it has been practiced in the past to form an opening on partition wall and to transmit the motive power to the vacuum side by placing a rotation shaft.
However, according to the conventional driving force transmitting method, seal packing or magnetic fluid is used on the rotation shaft when the rotating driving force is transmitted into vacuum. In such case, problems arise such as the release of particles or gas from these elements.
To solve the problems, the Patent Document 1 as given below describes a vacuum robot for substrate transport, by which driving force is transmitted to the robot arm under vacuum condition by using magnetic coupling, and which comprises an outer ring magnet on the atmospheric side and an inner ring magnet on the vacuum side.
[Patent Document 1] JP-A-2002-66976

SUMMARY OF THE INVENTION

In recent years, however, there have been strong demands on high-grade operation control such as the moving of the entire transport mechanism upward or downward after separating the transmission of the driving force to be applied on a part of the transport mechanism within the vacuum chamber to reduce installation area of the transporting system and to achieve more efficient substrate transport. In order to accomplish such high-grade operation control, it is necessary to have a synchronizing mechanism, which can freely separate and combine the driving shaft and the driven shaft from each other via gears. Mechanical synchronizing mechanism has complicated structure, and particles are generated from physical contact and friction of gears. When the means such as belt is used, particles are generated as the result of friction and contact of materials such as metal, elastomer, etc. Also, there are problems such as the release of gas or the contamination of vacuum condition from lubricants used for the portions where physical contact and friction occur.
It is an object of the present invention to provide a substrate transporting mechanism and a substrate transporting method in the substrate transport within a vacuum system, by which it is possible: (1) to transmit driving force from atmospheric side to vacuum side by magnetic coupling via a vacuum chamber partition wall; (2) to transmit the driving force within the vacuum chamber by magnetic coupling; and (3) to use magnetic coupling for separating and combining the transmission of the driving force within the vacuum chamber without using mechanical synchronizing mechanism such as gears.
The present invention provides a substrate transporting mechanism, which can achieve high-grade operation control in a vacuum system, and by which it is possible to extensively reduce mechanical contact and friction and to minimize the generation of particles and gas release, and also to attain simple structure of the system.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematical perspective view of a substrate processing system;

FIG. 2 is a perspective view to show a structure of a vertical conveyor;

FIG. 3 is a schematical drawing to explain substrate transport using the vertical conveyor;

FIG. 4 is a schematical perspective view to show general features of a vacuum side processing system;

FIG. 5 is a plan view of a substrate transporting mechanism 32 shown in FIG. 4;

FIG. 6 (a) and FIG. 6 (b) each represents a cross-sectional view of a substrate being transported by a substrate transporting mechanism 32 as shown in FIG. 4;

FIG. 7 (a) and FIG. 7 (b) each represents a cross-sectional view after the substrate is stopped by the substrate transporting mechanism 32 as shown in FIG. 4;

FIG. 8 is an enlarged view of a driving magnet 330 and a first driven magnet 331; and

FIG. 9 (a) and FIG. 9 (b) each represents a cross-sectional view along the dotted line A-A′ in FIG. 8.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Description will be given below on an embodiment of the present invention referring to the drawings.

Embodiment 1

Description will be given below on an embodiment of a substrate processing system of the invention referring to FIG. 1. FIG. 1 shows an LCD glass substrate processing system 1, which comprises a carrying-in carrying-out unit 10 for carrying in an LCD glass substrate (hereinafter simply referred as “substrate”) L to the processing system and for carrying out the substrate after the completion of the processing, atmospheric processing apparatuses 20 and 21 for processing the substrates under atmospheric pressure, a vacuum processing apparatus 30 for carrying out the processing on the substrates L under reduced pressure, and a transport system 40 for connecting the carrying-in carrying-out unit 10 with the atmospheric processing apparatuses 20 and 21 and the vacuum processing apparatus 30 and for transporting the substrates L. Cleaning apparatus, coating-developing apparatus, exposure apparatus, etc. are included in the atmospheric processing systems. Etching apparatus, film depositing apparatus, ion implanter, etc. are included in the vacuum processing system.
In the LCD glass substrate processing system 1 as shown in FIG. 1, the carrying-in carrying-out unit 10 comprises a carrying-in unit 130 and a carrying-out unit 140, and these units are connected to a carrying-in carrying-out conveyor 150, which moves the substrates L up and down.
One end of a transport system 40 is connected to the carrying-in carrying-out unit 10, and the transport system 40 comprises an upper conveyor 410 connected to the carrying-in unit 130 and a lower conveyor 420 connected to the carrying-out unit 140. Further, at adequate points on the transport route, there are provided vertical conveyors 461, 462, 463, 464, and 465, each of which transports the substrates L between the upper conveyor 410 and the lower conveyor 420.
The atmospheric processing apparatuses 20 and 21 are arranged along the transport route of the transport system 40 to match each of the vertical conveyors 462 and 464 respectively. On the other end of the transport system 40, a vacuum processing apparatus 30 is arranged at a position adjacent to the vertical conveyor 465.
Now, referring FIG. 2, description will be given on a structure of the vertical conveyor by taking an example on the vertical conveyor 462. As shown in FIG. 2, the vertical conveyor 462 transports the substrate L in vertical direction between the upper conveyor 410 and the lower conveyor 420. In the example shown in FIG. 2, there are provided transport boards 480 in four stages. Motors 490 and ball screws 495 are arranged to match the transport boards 480 respectively. Each of the transport boards is connected to the matching ball screw 495 via a connection 486, and the transport boards 480 are moved up and down by driving force of the motor 490. By such arrangement, the transport boards 480 can be moved up or down independently from each other. It may be so arranged that the transport boards can be moved together up or down by providing a single motor and a single ball screw commonly used for the transport boards.
Next, referring to FIG. 3, description will be given on buffer function of the vertical conveyor 462. As shown in FIG. 3, the vertical conveyor 462 comprises a plurality of transport boards 480, each of which supports the substrate L from below and is moved up or down in combination with each other. In FIG. 3, only the transport boards 480 a, 480 b . . . 480 h are shown. The number of the transport boards of the vertical conveyor 462 can be varied as appropriate according to the scale of the system and other factors. The transport boards 480 a, 480 b . . . 480 h have substantially the same composition and the same arrangement. Accordingly, in the description of the arrangement and the functions of the transport boards 480 a, 480 b, . . . 480 h, these are collectively called as the transport boards 480, and detailed description on each transport board is not given here.
Among said plurality of transport boards 480, one transport board constitutes a part of the upper conveyor 410, and another transport board constitutes a part of the lower conveyor 420. In the example shown in FIG. 3, the transport board 480 c constitutes a part of the upper conveyor 410, and the transport board 480 f constitutes a part of the lower conveyor 420. Each of the other transport boards 480 a, 480 b, 480 d, 480 e, 480 g and 480 h plays the function of a buffer or a turnout for the substrates L. Specifically, to match the variation of the processing time, the substrates L must be temporarily turned out or shunted from the upper conveyor 410 or from the lower conveyor 420 in some cases. Each of the transport boards 480 a, 480 b, 480 d, 480 e, 480 g and 480 h plays the function of a buffer or a turnout of the substrates in such cases.
Now, referring to FIG. 3, description will be given on a case where two substrates are buffered or turned out. Under the condition that one substrate is placed on the transport board 480 f, the upper conveyor 410 and the lower conveyor 420 are stopped. Next, when the vertical conveyor 462 is moved up by one stage only, the transport board 480 d and the transport board 480 g become a part of the upper conveyor 410 and a part of the lower conveyor 420 respectively. When the upper conveyor 410 and the lower conveyor 420 are operated, the other LCD glass substrates are placed on the transport board 480 g. When the vertical conveyor 462 is moved up by one stage only, the transport boards 480 e and 480 h become a part of the upper conveyor 410 and the lower conveyor 420 respectively. Under this condition, the transport boards 480 f and 480 g fulfill the functions of buffer respectively.
Then, the substrates on the transport boards 480 f and 480 g are picked up by a transport arm (to be described later) one after another and are processed at the processing system. After the processing, the substrates are moved back to the transport boards 480 f and 480 g respectively. Subsequently, the substrates on the vertical conveyor 462 are moved down by a procedure reverse to the above, and it is transported in the returning direction by the lower conveyor 420. In this way, the vertical conveyor 462 fulfills the function of buffer. As a result, the upper conveyor 410 and the lower conveyor 420 can transport the other substrates even during the processing of the two substrates.
In the above, description has been given on the case where the substrate to be transported on the lower conveyor 420 is buffered or turned out. Buffering can be performed in similar manner on the substrate, which is transported on the upper conveyor 410. Also, description has been given in the above by taking an example on the vertical conveyor 462, while the same applies to the other vertical conveyors.
In the transport system 40 of the present embodiment, each of the vertical conveyors arranged at each point fulfills the functions as given below.
The vertical conveyor 461 is disposed at a position closest to the carrying-in unit 130 (the carrying-out unit 140), and it fulfills the function of an input buffer or an output buffer of the substrate L or fulfills the function to switch over the transport route between the upper conveyor 410 and the lower conveyor 420.
The vertical conveyor 462 is arranged at a position to match the processing system 20, and it plays a role as a buffer for the substrate L or a role to give or take the substrate L to or from the processing system 20. The substrate L is given or taken between the vertical conveyor 462 and the processing system 20 via a transport arm 471. The arrangement and the function of the atmospheric side processing systems 20 and 21 are the same as the conventional processing system, and detailed description is not given here.
The transport arm 471 is provided with a plate (a fork) to lift up and transport the substrate L. The substrate L placed on the transport board 480 of the vertical conveyor 462 is carried to the processing system 20. The transport arm 471 has a driving mechanism to drive in vertical direction, and the substrate L can be lifted up from any of the transport boards 480 c, 480 bd, 480 e, and 480 f as shown in FIG. 3. When the transport arm 471 lifts up the substrate L from the transport board 480 c, which constitutes a part of the upper conveyor 410, transport rollers R of the transport board 480 c are stopped to rotate and to drive. Similarly, when the transport arm 471 lifts up the substrate L from the transport board 480 f, which constitutes a part of the lower conveyor 420, the transport rollers R of the transport board 480 f are stopped to rotate and to drive.
The vertical conveyor 463 is provided between the processing systems 20 and 22, and it has the function as a buffer or the function to switch over the transport route between the upper conveyor 410 and the lower conveyor 420.
The vertical conveyor 464 is arranged at a position to match the processing apparatus 21, and it fulfills the function of a buffer for the substrate L or plays a role to give or take the substrate L to or from the processing apparatus 21. The substrate L is given or taken between the vertical conveyor 464 and the processing apparatus 21 via a transport arm 472. The transport arm 472 fulfills the function similar to that of the transport arm 471.
The vertical conveyor 465 connects the most downstream portion of the upper conveyor 410 with the most upstream portion of the lower conveyor 420, and it has the function as a buffer for the substrate L or fulfills the function to connect the upper conveyor 410 with the lower conveyor 420. Also, the vertical conveyor 465 is arranged at a position adjacent to the processing system 30 as mentioned later, and it plays a role to give or take the substrate L to or from the a substrate transporting device 32, which is provided in a load-lock chamber 31.

Embodiment 2

Next, referring to FIG. 4, detailed description will be given on the vacuum processing apparatus 30. FIG. 4 is a schematical perspective view of a processing system 30 for performing film deposition to the substrate L. This processing system 30 comprises a load-lock chamber 31, a transfer chamber 33, and a process chamber 35.
In FIG. 4, the load-lock chamber 31 has the function to repeat pressure reduction and restoration to normal pressure to carry the substrate L from the atmospheric environment via a first gate valve G1. The load-lock chamber 31 is connected to the transfer chamber 33 via a second gate valve G2, and the transfer chamber 33 is connected to the process chamber 35 via a third gate valve G3. The transfer chamber 33 has the function to carry in and carry out the substrate L via the transport arm 34 while maintaining the pressure in the process chamber 35. The process chamber 35 is under a predetermined reduced pressure condition and has the function to form CVD film and oxynitridation film on the substrate and to perform water repellent processing.
The substrate L is transported from the vertical conveyor 465 of the transport system 40 into the load-lock chamber 31 via an opening where the first gate valve G1 is provided. After the air is evacuated by pumping until the pressure in the load-lock chamber 31 is reduced from normal pressure to a predetermined reduced pressure, the substrate L is transported to the process chamber 35 under the predetermined reduced pressure condition via the transfer chamber 33, and CVD film oxynitridation film is formed on it or water repellent processing is performed.
The substrate transporting device 32 according to the present invention is disposed in the load-lock chamber 31. The substrate L is transported from the vertical conveyor 465 in axial direction as shown by the arrow X into the load-lock chamber 31. After the completion of the processing, the substrate L is carried out to the vertical conveyor 465. Or, a second carrying-in carrying-out device (not shown) may be provided via a gate valve on a surface (e.g. as shown by the arrow Y) of the load-lock chamber 31 different from the surface, with which the vertical conveyor 465 or the transfer chamber 33 is kept in contact. In case the processing in the atmospheric side processing systems 21 and 22 is not required and only the processing at the vacuum side processing system 30 is to be performed, the substrate L can be directly carried in or out between a second carrying-in carrying-out device and the load-lock chamber 31, and this is more efficient.
FIG. 5 is a plan view of the substrate transporting mechanism 32 as shown in FIG. 4. FIG. 6 (a) shows a cross-sectional view along the dotted line A-A′ in FIG. 5, and
FIG. 6 (b) represents a cross-sectional view along the dotted line B-B′.
In FIG. 5, the substrate transporting mechanism 32 in the load-lock chamber 31 comprises a fixed stage 310 and a movable stage 320. On the movable stage 320, rotation axes of a plurality of transport rollers 321 are supported by bearing units 322. On each of the transport rollers 321, a roller magnet 323 is mounted. Also, on some of the transport rollers 321, rollers 321′ are mounted via roller rotation shafts 324.
On the movable stage 320, a first, a second, and a third driven magnets 331, 332, and 333 are supported by a bearing unit 322 as shown in upper portion of FIG. 5. These driven magnets are magnetically coupled with each other. Also, the third driven magnet 333 is magnetically coupled with the roller magnet 323. Further, the first driven magnet 331 is magnetically coupled with the driving magnet 330. A single driven magnet, e.g. the third driven magnet 333, may be used instead of the first, the second, and the third driven magnets 331, 332, and 333.
A driving magnet 330 is accommodated in the atmospheric air in a hollow partition wall 340, which is prepared by forming the partition wall of the load-lock chamber 31 in convex shape. Rotating driving force from the driving magnet 330 in the atmospheric air is transmitted to the first driven magnet 331 via the partition wall. This driving force is turned to a direction in parallel to the rotation axis and is transmitted to the second and the third driven magnets 332 and 333. The roller magnet 323, which is magnetically coupled with the third driven magnet 333, transmits the driving force from the third driven magnet 333 as a driving force in a perpendicular crossing direction.
Each of the plurality of the third driven magnets 333 is magnetically coupled with each of the plurality of roller magnets 323 via the driven rotation shafts 327. The magnetically coupled driving force is transmitted to the transport roller 321, and the substrate L is transported as shown in FIG. 6.
The substrate L thus transported is disposed at a position to a pre-determined position of the process chamber, and positioning units 328 with two support pins are moved as shown by open arrows in FIG. 5. At least two positioning units 328 may be provided on diagonal lines.
FIG. 6 shows cross-sectional views, each showing a substrate being transported by the substrate transporting mechanism 32 shown in FIG. 5. FIG. 6 (a) represents a cross-sectional view along the dotted line A-A′ in FIG. 5, and FIG. 6 (b) represents a cross-sectional view along the dotted line B-B′ in FIG. 5.
In FIG. 6, the driving magnet 330 is driven by a motor arranged in the atmospheric air. The driving force of the driving magnet 330 is coupled with a first driven magnet 331 and is transmitted to the second and the third driven magnets 332 and 333 and the roller magnet 323, and the transport roller 321 and the roller 321′ are rotated. After being carried in by the transport roller 321, the substrate L is positioned by a positioning unit 328 shown in FIG. 5. The fixed stage 310 is fixed by fixing pillars 311. The movable stage 320 is moved up and down by movable pillars 312, and it is moved to upper position when the substrate L is being transported, and the driving magnet 330 is coupled with the first driven magnet 331.
FIG. 7 shows cross-sectional views after the substrate is stopped in the substrate transporting mechanism 32 shown in FIG. 5. FIG. 7 (a) represents a cross-sectional view along the dotted line A-A′ in FIG. 5, and FIG. 7 (b) represents a cross-sectional view along the dotted line B-B′ in FIG. 5.
As explained in connection with FIG. 6, after the substrate L is carried in as shown in FIG. 7, the transporting of the substrate L is stopped, and the air in the load-lock chamber 31 is evacuated. Under vacuum condition, the movable stage 320 is moved to lower position as shown by open arrows in FIG. 7, and the substrate L is placed on the fixed stage 310. In this case, the driving magnet 330 and the first driven magnet 331 are separated from each other.
FIG. 8 is an enlarged view of the driving magnet 330 and the first driven magnet 331. In FIG. 8, the driving magnet 330 and the first driven magnet 331 are separated from each other or are coupled with each other via a partition unit 351 of the hollow partition wall 340. Reference numeral 352 denotes a driving rotation shaft of the driving magnet 330, and numeral 353 denotes rotation shafts of the second and the third driven magnets 332 and 333 respectively. The other symbols are the same as those explained in the above.
FIG. 9 shows cross-sectional views along the dotted line A-A′ in FIG. 8. FIG. 9 (a) represents a cross-sectional view of a case where the driving magnet 330 and the first driven magnet 331 are coupled with each other, and FIG. 9 (b) shows a case where the driving magnet 330 and the first driven magnet 331 are separated from each other.
As shown by an open arrow in FIG. 9 (a), rotating driving force of the driving magnet 330 is transmitted to the first driven magnet 331 via the partition unit 351 of the hollow partition wall 340 in semi-circular shape. Then, the rotating driving force of the first driven magnet 331 is transmitted to the second and the third driven magnets 332 and 333. The rotating driving force of the third driven magnet 333 is further transmitted to the roller magnet 323 and rotates the transport roller 321, which is supported by the bearing unit 322.
When the driven magnets 331, 332 and 333 are moved down as shown in FIG. 9 (b), the driving magnet 330 and the first driven magnet 331 are separated from each other.
On the conventional mechanical driving force transmitting method, complicated synchronizing mechanism has been required for combination and separation of the driving force. Also, there has been the problem of the generation of contaminants such as particles as the result of mechanical coupling and separation. In the substrate transporting mechanism according to the present invention, the combination and the separation of the driving force are carried out by magnetic coupling to solve the problems.
In the vacuum processing apparatus 30 with the substrate transporting mechanism 32 as described above, the driving force from the driving magnet 330 is transmitted to the driven magnet 331 when the movable stage 320 is moved up (FIG. 6), and this force rotates the transport rollers 321 and 321′ via the driven magnets 332 and 333. The transport rollers 321 and 321′ carry the substrate L transported from the vertical conveyor 465 in axial direction as shown by the arrow X in FIG. 4 into the load-lock chamber 31. Then, the substrate is stopped at a predetermined position. Next, the opening, through which the substrate L has been carried in, is closed by the first gate valve G1. Then, as described above, the movable stage 320 is moved down (FIG. 7), and the substrate L is placed on the fixed stage 310. When the pressure in the load-lock chamber 31 is reduced to a predetermined pressure, the second gate valve G2 between the load-lock chamber 31 and the transfer chamber 33 is opened. Then, the transport arm 34 transports the substrate L on the fixed stage 310 in axial direction shown by the arrow Y, which perpendicularly crosses the axial direction shown by the arrow X. In this case, the movable stage 320 is moved down. Thus, the plate (fork) to lift up and transport the substrate L can be easily inserted under the substrate L.
The substrate L is transported from the transfer chamber 33 to the process chamber 35 via the third gate valve G3 and is processed by film forming processing. Then, the substrate L is sent back to the fixed stage 310 of the substrate transporting mechanism 32 along a route reverse to the route when it has been carried in. The pressure in the load-lock chamber 31 is brought back to the atmospheric pressure, and the movable stage 320 is moved up so that the substrate L can be carried out of the load-lock chamber 31 by the transport rollers 321 and 321′.
When the predetermined processing has been completed in the vacuum processing apparatus 30, the substrate L carried out of the load-lock chamber 31 is transported to the carrying-out unit 140 by the vertical conveyor 465 and the lower conveyor 420, and a series of processing is completed.
In the above, referring to the attached drawings, description has been given on the preferred embodiment of the LCD glass substrate processing system according to the present invention, while the invention is not limited to the above embodiment.
For instance, in the embodiment as described above, the substrate L is transported in the transport system 40 under the condition exposed to the atmosphere within a clean room, while it may be designed in such manner that the entire transport system 40 including the connection with the processing apparatus 30 is enclosed in a housing, which maintains an atmosphere with high-grade cleanness in its internal space, and that the substrate L is transported to the next process under clean condition. Further, the internal space of the housing for enclosing the transport system is turned to vacuum condition, and the attachment of particles and moisture on the surface of the substrate L can be minimized and the substrate processing with higher quality can be achieved.
As described above, it would be obvious to those skilled in the art that various modifications and changes can be made without departing from the spirit and the scope of the technical concept as set forth in the attached claims, and these modifications and changes naturally belong to the technical concept of the present invention.

Claims

1. A substrate transport mechanism arranged in a chamber and provided with a fixed stage where a substrate is placed and with a movable stage where the substrate is transported, wherein:

there are provided a plurality of transport rollers for transporting the substrates, roller magnets mounted on the transport rollers, and driven magnets magnetically coupled with the roller magnets on the movable stage;

when the movable stage is moved up to upper position, the driven magnet is magnetically coupled with driving magnet arranged outside of said chamber and is driven, and said substrate is separated from said fixed stage and is supported by said transport roller; and

when the movable stage is moved down to lower position, said driven magnets and the driving magnets are magnetically separated from each other, and said substrates are placed on said fixed stage.

2. A substrate transporting mechanism according to claim 1, wherein said driven magnets comprise a plurality of magnets sequentially and magnetically coupled with each other, and one of said plurality of magnets is magnetically coupled with said roller magnet and rotates the transport rollers.

3. A substrate transporting mechanism according to claim 1, wherein said driving magnet is arranged in a hollow partition wall prepared by turning a part of partition wall of said chamber in inward direction and formed in convex shape.

4. A substrate transporting mechanism according to claim 3, wherein said hollow partition wall has a partition unit with a cross-section in approximately semi-circular form, and driving force from the driving magnet is transmitted to the driven magnet via the partition unit.

5. A substrate transporting mechanism according to claim 1, wherein the pressure in internal space of said chamber can be reduced to a predetermined pressure.

6. A substrate transporting method using a substrate transporting mechanism according to one of claims 1 to 5, wherein said method comprises the steps of:

carrying in said substrate to said movable stage or carrying out the substrate from the movable stage along a first axial direction by rotation of said transport roller when the movable stage is at upper position; and

carrying in said substrate to said fixed stage along a second axial direction almost perpendicularly crossing said first axial direction and carrying out the substrate from the fixed stage when the movable stage is at lower position.

7. A substrate processing system, comprising a load-lock chamber able to communicate with an atmospheric side via a first gate valve, a process chamber for performing a predetermined processing to the substrate in the chamber, and a transfer chamber, said transfer chamber being able to communicate with said load-lock chamber via a second gate valve, and able to communicate with said process chamber via a third gate valve and having transport arms for carrying in and out the substrate to or from said load-lock chamber and said process chamber inside said transfer chamber; and

said load-lock chamber has the substrate transporting mechanism according to claim 5 inside said chamber.