TW200804159A - Substrate transporting mechanism, substrate transporting method and substrate processing system - Google Patents

Substrate transporting mechanism, substrate transporting method and substrate processing system Download PDF

Info

Publication number
TW200804159A
TW200804159A TW095146877A TW95146877A TW200804159A TW 200804159 A TW200804159 A TW 200804159A TW 095146877 A TW095146877 A TW 095146877A TW 95146877 A TW95146877 A TW 95146877A TW 200804159 A TW200804159 A TW 200804159A
Authority
TW
Taiwan
Prior art keywords
substrate
chamber
magnet
transport
processing
Prior art date
Application number
TW095146877A
Other languages
Chinese (zh)
Inventor
Takahiro Horiguchi
Original Assignee
Future Vision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Future Vision Inc filed Critical Future Vision Inc
Publication of TW200804159A publication Critical patent/TW200804159A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a substrate transporting mechanism and a substrate transporting method, in which driving force can be separated or combined together without using a mechanical synchronizing mechanism such as gear. A substrate transporting mechanism in a chamber 31 comprises a fixed stage 310 and a movable stage 320. On the movable stage 320, a first, a second, and a third driven magnets 331, 332, and 333 are supported by bearing units 322. These driven magnets are magnetically coupled with each other, and the third driven magnet 333 is magnetically coupled with the roller magnet 323. Further, the first driven magnet 331 is magnetically coupled with the driving magnet 330, and the driving force from the driving magnet 330 can be separated or combined.

Description

200804159 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於輸送使用於液晶顯示（LCD : liquid crystal display)面板之玻璃基板等基板之基板輸送 裝置、基板輸送方法、以及使用該基板輸送之基板處理系 統。 【先前技術】 先如’對於通常之半導體基板或LCD玻璃基板之處理系 統而言，於輸送系統中並設有塗佈顯影處理裝置或蝕刻裝 置之複數個處理裝置。於該LCD玻璃基板之處理系統之輸 送系統中，為將基板於真空系統之處理裝置内搬入搬出而 具有於真空下（或減壓下）輸送基板之功能。 於上述輸送裝置中，於真空腔室内使用傳送帶（材質： ^屬或彈性體）或齒輪進行動力傳送，並藉由輕或機器手 臂、移動板之機構而輸送基板。為於真空腔室内驅動該等 機構，必須將藤動力自配置於大氣側之驅動源傳送至配置 於，腔室内的真空側之輸送裝置，並於間隔壁上開孔，於其 中插入旋轉軸，以將動力傳送至真空内。 、/、 :而’於先前之驅動力傳送方法中’在將旋轉驅動力向 —内傳运時’雖對旋轉軸使用密封襯墊或磁性流體 具有由該等構件產生之微粒或氣體排放之問題。 - ^此直於下述專利文獻1中，揭示有基板輪送用直空機 益人’其使用包含大氣側之外環磁 —械 之磁性叙合，將驅動力傳送至真空中之機二内環磁鐵 116854.doc 200804159 【專利文獻】】特開雇_66976號公報σρ_Α·2〇()2_66 [發明所欲解決之問題] ▲且說近年來，為了減小輸送裝置之設置面積，並且更有 效地輪运基板’要求進行下述高度動作控制：切斷在直* 腔室内對部分輸送機構之驅動力傳送後使輪送機構全體上 下移動等。為進行如此高度之動作控制，需要經由齒輪而 =驅動軸與從動轴分離、麵合自如的同步機構。機械同步 機構之構造複雜’因齒輪等產生物理接觸、摩擦而成為微 拉源。又’與使用傳送帶等之情形亦相同，因金屬或彈性 體摩擦而產生微粒。再者’也擔心來自使用於產生物理接 觸'摩擦之部&之潤滑劑之氣體排放或真空污染 【發明内容】 因此，本發明之特徵在於：於真空褒置内之基板輸送， ⑴利用自大氣側經由真空腔室間隔壁與真空側磁性輕合 (magnet coupling)而進行驅動力之傳送，（勾於真空腔室= 亦利用磁仙合而進行驅動力之傳送，（3)於真空腔室;， 利用分離、麵合驅動力傳送之磁性耗合，藉此無需如齒輪 之機械同步機構。 [發明之效果] 根據本發明’對於能夠在真空裝置内進行高度動作 之基板輸送裝置而言’可極力排除機械接觸、摩擦，使產 生之微粒、排放氣體極少，可使結構簡化。 【實施方式】 以下，利用圖式對本發明之實施例進行說明。 116854.doc 200804159 [實施例1] 一邊參照圖1，一邊對本發明之基板處理系統之一例進 行說明。圖1所示之LCD玻璃基板處理系統1包含以下部分 而構成·搬入搬出裝置10，其將LCD玻璃基板（以下僅稱 為「基板」）L搬入該處理系、统，並於處理結束後搬出；大 氣系統之處理裝置20、21，其等於大氣壓下對基板實施處 理；真空系統之處理裝置3〇,其於減壓下對基板L實施處 • 理’·以及輸送系統40，其將搬入搬出裝置10、大氣系統處 理裝置20、21以及真空系統處理裝置3〇之間相連，輸送基 板L。以大氣系統之處理裝置而言，例如具有洗淨裝置、 塗佈顯影裝置、曝光裝置等，以真空系統之處理裝置而 言，具有蝕刻裝置、成膜裝置、離子植入裝置等。 於圖1之LCD玻璃基板處理系統丨中，搬入搬出裝置1〇具 有搬入部130與搬出部140，並且該等連接於使基板L升降 移動之搬入搬出輸送帶150。 • 又，一端部連接於搬入搬出裝置10之輸送系統40具有與 搬入部130連接之上側輸送帶410以及與搬出部14〇連接之 下侧輸送帶420。再者，於輸送路徑之各處配設有於上側 輸送帶410與下側輸送帶420之間輸送基板l之垂直輸送帶 461 、 462 、 463 、 464 、 465 ° 大氣系統之處理裝置20、21沿著輸送系統4〇之輸送路徑 而與垂直輸送帶462、464分別對應地配置。又，於輸送系 統40之他端側，與垂直輸送帶465鄰接而配置有真空系統 之處理裝置30。 116854.doc 200804159 此處，以垂直輸送帶4 6 2為例，一邊參照圖2，一邊對垂 直輸送帶機構進行說明。如圖2所示，垂直輸送帶462於上 側輸送帶410與下側輪送帶420之間，於垂直方向輸送基板 L。於圖2所示之一例中，輸送台480設置為4段，對應於各 輸送台480而設置有馬達490及滾珠螺桿495。各輸送台480 經由連接部486而與所對應之滾珠螺桿495連接，並且利用 馬達490之驅動而上下移動。根據該結構，可使各輸送台 480各自上下移動。再者，亦可採用於各輸送臺上逐個設 置共用馬達及滾珠螺桿以使各輸送台連動而上下移動之結 構。 其次，一邊參照圖3，一邊對垂直輸送帶462之緩衝功能 進行說明。如圖3所示，垂直輸送帶462具備自下方支持基 板L且與其連動地進行升降移動之複數個輸送台480。於圖 3中，僅圖示有輸送台48(^、48(^、*"、48011。垂直輸送. 帶462之輸送台數量可根據系統規模等而適當設計。再 者，由於各輸送台480a、480b .......480h實質上具有相同 結構，故當說明各輸送台480a、480b、…、480h之共同結 構、功能時，總稱為轉送台480，並省略重複說明。 於複數個輸送台480中，一個輸送台構成上側輪送帶410 之一部分，另一個輸送台構成下側輸送帶420之一部分。 於圖3所示之例中，輸送台480c構成上側輸送帶410之一部 分，輸送台480f構成下側輸送帶420之一部分。其他輸送 台 480a、480b、480d、480e、480g、4 80h構成基板 L之收 回部（緩衝部）。即，具有如下情形：為與操作處理時間之 116854.doc 200804159 變動對應，有時必須使基板L從上側輸送帶410或者下側輸 送帶420暫時收回。輸送台480a、480b、480d、480e、 4 80g、480h作為該基板L之收回部（緩衝部）而發揮作用。 對於使2塊基板缓衝之情形，一邊參照圖3—邊進行說 明。於將一塊基板載置於輸送台480f上之狀態下，使上侧 輸送帶410及下侧輸送帶420停止。其次，使垂直輸送帶 462僅上升一段，則輸送台480d與480g各自構成上側輸送 帶410與下側輸送帶420之一部分。繼而，使上側輸送帶 410及下側輸送帶420動作，則可使其他LCD玻璃基板載置 於輸送台480g。其次，使垂直輸送帶462僅上升一段時， 則輸送台480e、480h各自構成上側輸送帶410與下側輸送 帶420之一部分。於該狀態下，輸送台480f、480g作為緩 衝部而發揮作用。 其後，輸送台480f、480g上之基板利用下述輸送臂而依 序取出，並於處理裝置中受到處理。處理後之基板再次返 回至輸送台480f、480g上。其後，垂直輸送帶462上之基 板因與上述相反之動作而下降移動，並且藉由下側輸送帶 420而沿返回方向輸送。如此，由於垂直輸送帶462作為緩 衝部而發揮作用，故上側輸送帶41 〇與下側輸送帶420於對 2塊基板進行處理之過程中亦可輸送其他基板。 已對使下側輸送帶420上輸送之基板緩衝之情形進行說 明，對於上側輸送帶410上輸送之基板亦可同樣使其緩 衝。又，有以垂直輸送帶462為例而進行了說明，其他垂 直輸送帶亦相同。 116854.doc 200804159 於本實施形態之輸送系統40中，配設於各處之垂直輸送 帶各自具有如下功能。 垂直輸送帶461配設於最靠近搬入部13〇(搬出部14〇)之位 置’具有使基板L之輸入緩衝或輪出缓衝之功能，或者， 具有切換上側輸送帶410與下側輸送帶42〇之輸送路徑之功 能。 垂直輸送帶462配設於與處理裝置2〇對應之位置，具有 _ 使基板L緩衝之功能，或者具有收受與處理裝置2〇之間的 基板L之作用。垂直輸送帶462與處理裝置20之間的基板乙 之收受藉由輸送臂471而進行。由於大氣系統之處理裝置 20、21之結構功能與已有之處理系統相同，故省略詳細說 明。 輸送臂471具備用以载置並輸送基板L之釺子（叉架），使 載置於垂直輸送帶462之輸送台480上之基板L搬入至處理 vc置20中。輸送臂471具有向垂直方向進行駆動之機構， 馨 可自圖3所示之輸送台480c、480 d、480e、48 Of中任一輸 运堂上取出基板L。再者，當輸送臂471自構成部分上側輸 送帶410分之輸送台48〇c上取出基板£時，輸送台48〇c之各 輸送輥R停止旋轉驅動。同樣地，當輸送臂471自構成部分 下側輸送帶420之輸送台480f上取出基板£時，輸送台料吖 之各輸送輥R停止旋轉驅動。 垂直輸送帶463配設於處理裝置2〇與處理裝置21之間， 具有使基板L缓衝之功能，或者具有切換上側輸送帶41〇與 下侧輸送帶420之輸送路徑之功能。 116854.doc 200804159 垂直輸送帶464配設於與處理裝置21對應之位置，具有 使基板L缓衝之功能，或者具有收受與處理裝置2〗之間的 基板L之作用。垂直輸送帶464與處理裝置21之間的基板l 之收X藉由輪送臂472而進行。輸送臂472具有與上述輸送 臂471相同之功能。 垂直輸送帶465將上側輸送帶410之最下游與下側輸送帶 420之最上游連接，並且具有使基板L緩衝之功能，或者具 有使上側輸送帶410與下侧輸送帶420連接之功能。又，垂 直輸送帶465與處理裝置30鄰接而配設，具有與設置於下 述處理裝置30之負載同步腔室31内的基板輸送裝置％之間 收受基板L之作用。 [實施例2] 其次，參照圖4而說明真空系統之處理裝置3〇之詳情。 圖4係對基板L實施成膜處理之處理裝置3〇之概略圖。該處 理裝置由3室而構成，即，負載同步腔室31、傳送腔室 33、及處理腔室35。 於圖4中’負載同步腔室3 1為自大氣中經由第」閘閥g ^搬 入基板L，而具有反覆進行減壓、恢復常壓之功能。該負 载同步腔室31與傳送腔室33經由第2閘閥G2而連接，傳送 腔室33與處理腔室35經由第3閘閥G3而連接。傳送腔室μ 具有-邊保持處理腔室35之壓力，—邊利用輸送㈣進行 基板L之搬入及搬出之功能。處理腔室35具有於特定之減 壓環境下，在基板上形成化學氣相沈積（CVD : chemieal Vapor Deposition)膜、氧氮化膜之功能及進行疏水處理之 116854.doc 200804159 功能。 基板L自輸送系統40之垂直輸送帶邨5侧，經由設有第1 閑閥G1之開口而輸送至負载同步腔㈣内，並且利用系進 行排氣直至負載同步腔室31内自常廢變為特定之減壓Μ 後，經過傳送腔室33而輸送至處於特定減壓環境之處运腔 室35内’形成CVD膜、氧氮化膜，或者進行疏水處理。 於負载同步腔室31内設有本發明之基板輸送裝D，將 自垂直輸送帶465側沿箭頭符號χ之軸線方向而輸送 L搬入至負載同步腔室31内，並將結束處理後之基板垂 直輸送帶465側搬出。X，在與負載同步腔室以垂直輸 送帶465或傳送腔室33連接之面所不同之面上（例如箭頭符 號Y所指之侧），，亦可經由閘閥而設置第2搬人搬出裝置（未 圖不）。在無需大氣系統之處理裝置21、U之處理，而僅 於真空系統之處理裝置3〇中進行處理時，由於可於該第2 搬入搬出裝置與負制步腔室31之間直接進行基板l之搬 入搬出，故效率高。 圖5係圖4所示之基板輸送裝置”之平面圖。於圖$中， 虛線A - A’之剖面圖於圖6⑷所示，虛線B — B，之剖面圖於 圖6(b)所示。 圖5中，負載同步腔室31内之基板輸送裝置“包含固定 平臺310與可動平臺320，於該可動平臺320上，利用軸承 部322而保持有複數個輸送輕321之旋轉軸。於各個輸送棍 321上，安裝有磁輥323 ’又，於部分輸送輥μ】上，經由 輥旋轉軸324而安裝有輥321，。 I16854.doc -12- 200804159 又，如圖5之上部所示，於可動平臺320上，利用軸承部 322而保持有第1、第2、第3從動磁鐵331、332、333，該 等從動磁鐵分別磁性耦合，並且第3從動磁鐵333與磁輥 323亦磁性耦合。進而，第1從動磁鐵331與驅動磁鐵330磁 ^ 再者亦可僅由1個從動磁鐵，例如第3從動磁鐵 333而構成第1、第2、第3從動磁鐵331、332、333。 驅動磁鐵330收納於將負载同步腔室31之間隔壁向内側 • 形成為凸形之中空間隔壁340内之大氣中。由大氣中驅動 磁鐵330產生之旋轉驅動力經由間隔壁而傳送至第^從動磁 鐵33 1。使該驅動力與旋轉軸平行而傳送至第2、第3從動 磁鐵332 333。與第3從動磁鐵333磁性耦合之磁較323將 來自第3從動磁鐵333之驅動力作為正交驅動力而傳送。 複數個第3從動磁鐵333各自經由從動旋轉軸327而與複 數個磁輥323之各自磁性耦合。將該等磁性耦合後之驅動 力傳送至輸送輥321後，如圖6所示，輸送基板 瞻 經輸送之基板L如圖5中之白底箭頭符號所示，具有2個 支持接腳之定位部328移動，藉此與處理腔室之位置對應 而定位。再者，定位部328可於對角線上至少設置2個。 圖6係利用圖5所示之基板輸送裝置32進行基板輸送時之 nj面圖，圖6(a)係圖5所示之虛線A— A，之剖面圖，圖6(b) 係圖5所示之虛線B—B，之剖面圖。 於圖6中，驅動磁鐵330藉由置於大氣中之馬達等而驅 動並且將驅動磁鐵330之驅動力與第工從動磁鐵33〗耦合 而傳廷至第2、第3從動磁鐵332、333、及磁輥323，使輸 116854.doc 200804159 送親321及輥321·旋轉。由輸送概321所搬人之基板l利用 郾5所示之定位部328而定位，，固定平臺31〇由固定 支柱3丨1而固定，可動平臺32〇由可動支柱312而上下移 動，並於輸送基板L時向上升位置移動，使驅動磁鐵33〇與 第1從動磁鐵331耦合。 ' 圖7係利用圖5所示之基板輸送裝置32使基板停止後之剖 面圖，圖7⑷係圖5所示之虛線a_a,之剖面圖，圖叫係 _ 圖5所示之虛線B ~ B’之剖面圖。 於圖7中，如圖6所說明，在將基板L搬入後，停止基板l 之輸送，對負載同步腔室31内進行排氣。於真空中，如圖 7中之白底前頭符號所示，可動平臺32〇向下降位置移動， 將基板L載置於固定平臺31〇上。此時，驅動磁鐵與第^ 從動磁鐵331分離。 圖8係驅動磁鐵330與第〗從動磁鐵331之放大圖。於圖容 中，驅動磁鐵330與第1從動磁鐵331經中空間隔壁34〇之間 • 隔壁部351而分離、耦合。再者，352係驅動磁鐵330之驅 動旋轉軸，353係第2、第3從動磁鐵332、333之旋轉軸， 其他符號與上述所說明之符號相同。 圖9係圖8所示之虛線A_A，之剖面圖，圖9(幻係將驅動 磁鐵330與第1從動磁鐵331耦合時之剖面圖，圖9(b)係將驅 動磁鐵330與第1從動磁鐵331分離時之剖面圖。 於圖9(a)中’如白底箭頭符號所示，驅動磁鐵33〇之旋轉 驅動力經由半圓形狀之中空間隔壁34〇之間隔壁部35〗而傳 送至第1從動磁鐵331。而且第1從動磁鐵331之旋轉驅動力 116854.doc -14· 200804159 傳送至第2、第3從動磁鐵332、333，且第3從動磁鐵333之 旋轉驅動力傳送至.磁輥323，由此使由軸承部322所保持之 輸送親3 21旋轉。 u於圖9(b)中，利用從動磁鐵331、332、側下降，而使 驅動磁鐵330與第1從動磁鐵331由耦合狀態分離。 於先前之機械驅動力傳送方法中，為進行上述驅動力傳 C之耦δ及为離，必需複雜之同步機構。又，伴隨機械性 雄耦a，可此產生微粒等污染。於本發明之基板輸送 裝置中，利用磁性耦合使驅動力之傳送耦合與分離，由此 可解決該等問題。 於具有上述基板輸送裝置32之真空系統之處理裝置3〇 中於可動平堂320為上升狀態下（圖6)，將來自驅動磁鐵 330之驅動力傳送至從動磁鐵331，並將此經由從動磁鐵 一 專而使輸送知》3 21、3 2 Γ旋轉。輸送輥3 21、3 21， 將自垂直輸送帶465沿著圖4中箭頭符號x之軸線方向而輸 运之基板L引入至負載同步腔室31内，並使其停止於特定 位置、其後，利用第i閘閥G1而堵塞搬入有基板L之開口 4 ’並且如上所述，可動平臺32〇下降（圖7)，使基板乙载 置於固疋平堂31〇上。若使負載同步腔室Η内減壓至特定 壓力，則負載同步腔室31與傳送腔室33之間之第2閘閥σ2 打開，輸送臂34沿著與箭頭符號χ之轴線方向大致正交之 前頭符號Y之軸線方向而取出固定平臺3 1〇上之基板乙。此 時’由於可動平臺320處於下降狀態，故易將用以載置並 輸送基板L之釺子（叉架）插入基板£之下方。 116854.doc -15- 200804159 自傳送腔室33經由第3閘閥G3而輸送至處理腔室35並實 知特定成膜處理之基板L，沿著與搬入時相反之路徑返回 至基板輸送裝置32之固定平臺310上。繼而，使負載同步 腔至31内回復為大氣壓，並且可動平臺32〇上升，成為由 輸达輥321、32Γ將基板L向負載同步腔室31之外搬出之狀 態。 以此方式而結束真空系統之處理裝置3〇中之特定處理並 _ 自負載同步腔室31中搬出之基板L，藉由垂直輸送帶465與 下側輸送帶420而向搬出部140輸送後，由此使一連串處理 結束。 以上，一邊參照隨附圖式，一邊說明本發明之lcd玻璃 基板處理系統之較佳實施形態，但本發明並非限定於上述 例0 例如，於上述實施形態中，輸送系統4〇形成在暴露於潔 淨室内之環境狀態下輸送基板L之結構，亦可利用將内部 • 保持於高潔淨度環境之框體而覆蓋含有與處理裝置30連接 之連接部之輸送系統40全體，以更潔淨之狀態將基板1^輪 送至下一步驟。進而，使覆蓋該輸送系統4〇之框體内部為 真空狀態，以使於輸送時附著於基板L表面之微粒或水分 達到最小限度，由此可進行更高品質之基板處理。 如上所述可明確，業者可考慮於申請專利範圍所揭示之 技術思想之範轉内的各種變更例或修正例，當然該等亦屬 於本發明之技術範圍。 【圖式簡單說明】 I I6854.doc •16- 200804159 圖1係基板處理系統之概略圖。 圖2係垂直輸送帶機構之示意圖‘。 Ώ係利用垂直輸送帶進行基板輸送之說明圖 圖4係表示真空系铳處理裝置之概略圖。 圖5係圖4所示之基板輸送裝置32的平面圖。 圖6(a)、（b)係利用圖4所示 輸送時之剖面圖。 之基板輸送裝置32進行基板[Technical Field] The present invention relates to a substrate transfer apparatus for transporting a substrate such as a glass substrate for a liquid crystal display (LCD) panel, a substrate transfer method, and the use of the same Substrate processing system for substrate transport. [Prior Art] First, as for a conventional semiconductor substrate or LCD glass substrate processing system, a plurality of processing devices for coating a development processing device or an etching device are provided in the transport system. In the transport system of the processing system for the LCD glass substrate, the substrate is transported under vacuum (or under reduced pressure) in order to carry the substrate into and out of the processing apparatus of the vacuum system. In the above conveying device, a power transmission is carried out in a vacuum chamber using a conveyor belt (material: genus or elastomer) or a gear, and the substrate is conveyed by a mechanism of light or a robot arm or a moving plate. In order to drive the mechanisms in the vacuum chamber, it is necessary to transfer the vine power from the driving source disposed on the atmosphere side to the conveying device disposed on the vacuum side of the chamber, and open a hole in the partition wall to insert the rotating shaft therein. To transfer power into the vacuum. , /, : and 'in the previous driving force transmission method 'when the rotational driving force is transmitted to the inside', although the sealing pad or the magnetic fluid is used for the rotating shaft, there are particles or gas emissions generated by the members. problem. - ^ This is straightforward in Patent Document 1 below, which discloses a substrate for the use of a straight-line machine for the use of a magnetic wheel, which uses a magnetic recombination of the outer ring magnetic mechanism, and transmits the driving force to the vacuum machine. Internal ring magnet 116854.doc 200804159 [Patent Document] Japanese Patent Application Publication No. _66976 σρ_Α·2〇() 2_66 [Problems to be Solved by the Invention] ▲ In recent years, in order to reduce the installation area of the conveying device, and more The effective rotation of the substrate 'requires the following height operation control: cutting off the driving force transmission to the partial conveying mechanism in the straight chamber, and then moving the entire rolling mechanism up and down. In order to perform such a high degree of motion control, it is necessary to synchronize the drive shaft and the driven shaft via a gear. The structure of the mechanical synchronizing mechanism is complicated. 'The physical contact and friction caused by the gears become micro-sources. Further, in the same manner as in the case of using a conveyor belt or the like, fine particles are generated due to friction of metal or elastomer. Furthermore, 'there is also concern about gas discharge or vacuum pollution from lubricants used to generate physical contact 'friction parts'. [Inventive] Therefore, the present invention is characterized in that the substrate is transported in a vacuum chamber, (1) utilizing self At the atmospheric side, the driving force is transmitted by magnetic coupling between the vacuum chamber partition wall and the vacuum side, (the vacuum chamber is also used to transmit the driving force by the magnetism, and (3) in the vacuum chamber. The magnetic resonance of the separation and the surface driving force transmission, thereby eliminating the need for a mechanical synchronization mechanism such as a gear. [Effects of the Invention] According to the present invention, for a substrate conveying apparatus capable of performing a high degree of operation in a vacuum apparatus 'The mechanical contact and the friction can be eliminated as much as possible, and the generated particles and exhaust gas are extremely small, and the structure can be simplified. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 116854.doc 200804159 [Embodiment 1] An example of a substrate processing system of the present invention will be described with reference to Fig. 1. The LCD glass substrate processing system 1 shown in Fig. 1 includes the following parts. The loading/unloading device 10 is configured to carry an LCD glass substrate (hereinafter simply referred to as "substrate") L into the processing system and to carry it out after the processing is completed; the atmospheric system processing devices 20 and 21 are equal to the atmospheric pressure. The substrate is subjected to processing, and the processing device for the vacuum system is configured to perform the processing on the substrate L under reduced pressure and the transport system 40, which will carry in and out the device 10, the atmospheric system processing devices 20, 21, and the vacuum system processing device. 3〇 is connected to each other to transport the substrate L. For the treatment system of the atmospheric system, for example, there is a cleaning device, a coating and developing device, an exposure device, etc., and a processing device for a vacuum system has an etching device and a film forming device. In the LCD glass substrate processing system of FIG. 1, the loading/unloading device 1 has a loading unit 130 and a loading unit 140, and these are connected to a loading/unloading belt 150 that moves the substrate L up and down. Further, the transport system 40, in which one end portion is connected to the loading/unloading device 10, has a lower side conveyor belt 410 connected to the loading unit 130 and a lower side connected to the carry-out unit 14? The belt 420. Further, the vertical conveyor belts 461, 462, 463, 464, and 465 ° are disposed between the upper conveyor belt 410 and the lower conveyor belt 420 at the conveying path. The devices 20 and 21 are disposed corresponding to the vertical conveyor belts 462 and 464, respectively, along the conveying path of the conveying system 4, and are disposed adjacent to the vertical conveyor belt 465 on the other end side of the conveying system 40, and are disposed with a vacuum system. Apparatus 30. 116854.doc 200804159 Here, the vertical conveyor belt mechanism will be described with reference to FIG. 2 by taking the vertical conveyor belt 4 6 2 as an example. As shown in Fig. 2, a vertical conveyor belt 462 is disposed between the upper conveyor belt 410 and the lower carriage belt 420 to transport the substrate L in the vertical direction. In the example shown in Fig. 2, the transport table 480 is provided in four stages, and a motor 490 and a ball screw 495 are provided corresponding to each of the transport stages 480. Each of the transport stages 480 is connected to the corresponding ball screw 495 via the connecting portion 486, and is moved up and down by the driving of the motor 490. According to this configuration, each of the transport stages 480 can be moved up and down. Further, it is also possible to employ a configuration in which a common motor and a ball screw are provided one by one on each of the transport stages so that the respective transport stages move in the vertical direction. Next, the buffering function of the vertical conveyor belt 462 will be described with reference to Fig. 3 . As shown in Fig. 3, the vertical conveyor belt 462 is provided with a plurality of conveying tables 480 which are supported by the lower support base plate L and which are moved up and down in conjunction therewith. In Fig. 3, only the transport table 48 (^, 48 (^, *", 48011. Vertical transport. The number of transport stages of the belt 462 can be appropriately designed according to the system scale, etc. 480a, 480b, ..., 480h have substantially the same structure. Therefore, when the common structure and function of each of the transport stages 480a, 480b, ..., 480h are described, they are collectively referred to as a transfer table 480, and the repeated description is omitted. Among the conveying tables 480, one conveying table constitutes a part of the upper side conveying belt 410, and the other conveying table constitutes a part of the lower side conveying belt 420. In the example shown in Fig. 3, the conveying table 480c constitutes a part of the upper side conveying belt 410. The conveying table 480f constitutes a part of the lower conveying belt 420. The other conveying tables 480a, 480b, 480d, 480e, 480g, and 480h constitute a retracting portion (buffering portion) of the substrate L. That is, there are cases where the processing time is In accordance with the variation of 116854.doc 200804159, it is sometimes necessary to temporarily retract the substrate L from the upper conveyor belt 410 or the lower conveyor belt 420. The conveyor tables 480a, 480b, 480d, 480e, 480g, 480h serve as the retraction portion of the substrate L ( Buffer section) In the case where two substrates are buffered, the description will be made with reference to Fig. 3, and the upper conveyor belt 410 and the lower conveyor belt 420 are stopped in a state where one substrate is placed on the conveyance table 480f. Next, when the vertical conveyor belt 462 is only raised by one section, the conveyor tables 480d and 480g each constitute one of the upper conveyor belt 410 and the lower conveyor belt 420. Then, the upper conveyor belt 410 and the lower conveyor belt 420 are operated. The other LCD glass substrate is placed on the transport table 480g. Second, when the vertical transport belt 462 is raised only once, the transport tables 480e, 480h each constitute one of the upper transport belt 410 and the lower transport belt 420. In this state, The conveyance stages 480f and 480g function as a buffer part. Thereafter, the substrates on the conveyance stages 480f and 480g are sequentially taken out by the following transfer arm, and processed in the processing apparatus. The processed substrate is returned to the conveyance stage again. 480f, 480g. Thereafter, the substrate on the vertical conveyor belt 462 is moved downward by the opposite action, and is transported in the return direction by the lower conveyor belt 420. Since the vertical conveyor belt 462 functions as a buffer portion, the upper conveyor belt 41 〇 and the lower conveyor belt 420 can transport other substrates during the processing of the two substrates. The case of the substrate buffer to be transported will be described. The substrate transported on the upper conveyor belt 410 can be similarly buffered. The vertical conveyor belt 462 is also exemplified, and the other vertical conveyor belts are also the same. 116854.doc 200804159 In the transport system 40 of the present embodiment, each of the vertical transport belts disposed in each of the following functions has the following functions. The vertical conveyor belt 461 is disposed at a position closest to the loading unit 13 (the carrying-out portion 14A). It has a function of buffering the input of the substrate L or buffering the wheel, or has a switching between the upper conveyor belt 410 and the lower conveyor belt. The function of the 42-inch transport path. The vertical conveyor belt 462 is disposed at a position corresponding to the processing device 2, and has a function of buffering the substrate L or a substrate L between the receiving and processing device 2A. The receiving and receiving of the substrate B between the vertical conveyor belt 462 and the processing device 20 is performed by the transport arm 471. Since the structural functions of the processing devices 20, 21 of the atmospheric system are the same as those of the existing processing system, detailed descriptions are omitted. The transport arm 471 is provided with a dice (fork) for placing and transporting the substrate L, and the substrate L placed on the transport stage 480 of the vertical transport belt 462 is carried into the processing vc 20. The transport arm 471 has a mechanism for swaying in the vertical direction, and the substrate L can be taken out from any of the transport tables 480c, 480d, 480e, and 48 Of shown in Fig. 3. Further, when the transport arm 471 takes out the substrate from the transport table 48〇c which constitutes the upper side transport belt 410, the transport rollers R of the transport table 48〇c stop the rotational drive. Similarly, when the transport arm 471 takes out the substrate from the transport table 480f constituting the lower portion of the transport belt 420, the transport rollers R of the transport pallet stop driving is stopped. The vertical conveyance belt 463 is disposed between the processing apparatus 2 and the processing apparatus 21, has a function of buffering the substrate L, or has a function of switching the conveyance paths of the upper conveyance belt 41〇 and the lower conveyance belt 420. 116854.doc 200804159 The vertical conveyor belt 464 is disposed at a position corresponding to the processing device 21, and has a function of buffering the substrate L or a substrate L between the receiving and processing device 2. The receiving of the substrate 1 between the vertical conveyor belt 464 and the processing device 21 is performed by the wheel arm 472. The transport arm 472 has the same function as the above-described transport arm 471. The vertical conveyor belt 465 connects the most downstream of the upper conveyor belt 410 to the most upstream of the lower conveyor belt 420, and has a function of buffering the substrate L or a function of connecting the upper conveyor belt 410 to the lower conveyor belt 420. Further, the vertical conveyor belt 465 is disposed adjacent to the processing device 30, and has a function of receiving the substrate L between the substrate transporting device and the substrate transporting device 31 provided in the load synchronous chamber 31 of the processing device 30. [Embodiment 2] Next, details of the processing device 3 of the vacuum system will be described with reference to Fig. 4 . Fig. 4 is a schematic view showing a processing apparatus 3 for performing a film forming process on the substrate L. The processing apparatus is constituted by three chambers, that is, a load synchronizing chamber 31, a transfer chamber 33, and a processing chamber 35. In Fig. 4, the load synchronizing chamber 31 is loaded into the substrate L through the first gate valve g^ from the atmosphere, and has a function of repeatedly performing decompression and returning to normal pressure. The load synchronous chamber 31 and the transfer chamber 33 are connected via the second gate valve G2, and the transfer chamber 33 and the processing chamber 35 are connected via the third gate valve G3. The transfer chamber μ has a function of holding the pressure of the processing chamber 35 while carrying out the loading and unloading of the substrate L by transport (4). The processing chamber 35 has a function of forming a chemical vapor deposition (CVD: chemieal Vapor Deposition) film, an oxynitride film, and a hydrophobic treatment on a substrate under a specific pressure reducing environment. 116854.doc 200804159 Function. The substrate L is transported from the vertical conveyor belt village 5 side of the transport system 40 to the load synchronous chamber (4) via the opening provided with the first idle valve G1, and is exhausted by the system until the load synchronous chamber 31 is constantly a waste. After the specific pressure reduction, the CVD film, the oxynitride film, or the hydrophobic treatment is formed by transporting through the transfer chamber 33 to the operation chamber 35 at a specific pressure reduction environment. The substrate transporting device D of the present invention is provided in the load synchronizing chamber 31, and the transport L is carried into the load synchronizing chamber 31 from the vertical conveyor belt 465 side in the axial direction of the arrow symbol ,, and the processed substrate is finished. The vertical conveyor belt 465 side is carried out. X, on the surface different from the surface on which the load synchronous chamber is connected by the vertical conveyor belt 465 or the transfer chamber 33 (for example, the side indicated by the arrow Y), the second moving and unloading device may be provided via the gate valve (not shown). When processing is performed in the processing apparatus 3 of the vacuum system without the processing of the processing means 21 and U of the atmospheric system, the substrate 1 can be directly performed between the second loading/unloading apparatus and the negative step chamber 31. It is efficient to move in and out. Figure 5 is a plan view of the substrate transfer device shown in Figure 4. In Figure $, the cross-sectional view of the broken line A - A' is shown in Figure 6 (4), the broken line B - B, and the cross-sectional view shown in Figure 6 (b) In FIG. 5, the substrate transfer device in the load synchronizing chamber 31 includes a fixed platform 310 and a movable platform 320. On the movable platform 320, a plurality of rotating shafts for transporting the light 321 are held by the bearing portion 322. On each of the transporting rollers 321, a magnetic roller 323' is mounted, and on a partial transporting roller, a roller 321 is attached via a roller rotating shaft 324. I16854.doc -12- 200804159 Further, as shown in the upper part of FIG. 5, the first, second, and third driven magnets 331, 332, and 333 are held by the bearing portion 322 on the movable stage 320. The moving magnets are magnetically coupled, respectively, and the third driven magnet 333 is also magnetically coupled to the magnetic roller 323. Further, the first driven magnet 331 and the drive magnet 330 may be magnetically configured, and the first, second, and third driven magnets 331, 332 may be formed by only one driven magnet, for example, the third driven magnet 333. 333. The drive magnet 330 is housed in an atmosphere in which the partition wall of the load synchronous chamber 31 is formed inside the hollow partition wall 340 which is formed in a convex shape. The rotational driving force generated by the driving magnet 330 in the atmosphere is transmitted to the second driven magnet 33 1 via the partition wall. This driving force is transmitted to the second and third driven magnets 332 333 in parallel with the rotation axis. The magnetic phase 323 magnetically coupled to the third driven magnet 333 transmits the driving force from the third driven magnet 333 as a quadrature driving force. Each of the plurality of third driven magnets 333 is magnetically coupled to each of the plurality of magnet rollers 323 via the driven rotating shaft 327. After the magnetically coupled driving force is transmitted to the conveying roller 321, as shown in FIG. 6, the substrate L transporting the substrate is transported as shown by the white arrow symbol in FIG. 5, and has two supporting pins. Portion 328 moves, thereby positioning corresponding to the position of the processing chamber. Furthermore, the positioning unit 328 can be provided at least two on the diagonal. 6 is a view showing a nj surface when the substrate is transported by the substrate transfer device 32 shown in FIG. 5. FIG. 6(a) is a cross-sectional view taken along the line A-A of FIG. 5, and FIG. 6(b) is a view The broken line B-B shown is a sectional view. In FIG. 6, the drive magnet 330 is driven by a motor or the like placed in the atmosphere, and the driving force of the drive magnet 330 is coupled to the slave driven magnet 33 to transfer the second to third driven magnets 332. 333, and the magnetic roller 323, the transmission 116854.doc 200804159 to send the parent 321 and the roller 321 · rotate. The substrate 1 moved by the transport module 321 is positioned by the positioning portion 328 indicated by the crucible 5, and the fixed platform 31 is fixed by the fixed post 3丨1, and the movable platform 32 is moved up and down by the movable strut 312, and When the substrate L is transported, it moves to the rising position, and the drive magnet 33A is coupled to the first driven magnet 331. Fig. 7 is a cross-sectional view showing the substrate after stopping the substrate by the substrate transfer device 32 shown in Fig. 5. Fig. 7(4) is a cross-sectional view of the broken line a_a shown in Fig. 5, and the figure is called the dotted line B ~ B shown in Fig. 5. 'The section view. In FIG. 7, as shown in FIG. 6, after the substrate L is carried in, the conveyance of the substrate 1 is stopped, and the inside of the load synchronous chamber 31 is exhausted. In the vacuum, as shown by the symbol in front of the white background in Fig. 7, the movable stage 32 is moved toward the lowered position, and the substrate L is placed on the fixed stage 31A. At this time, the drive magnet is separated from the second driven magnet 331. FIG. 8 is an enlarged view of the drive magnet 330 and the first driven magnet 331. In the drawing, the drive magnet 330 and the first driven magnet 331 are separated and coupled via the partition wall portion 351 via the hollow partition wall 34. Further, the driving rotary shaft of the 352-series drive magnet 330 and the rotating shaft of the 353-series second and third driven magnets 332 and 333 are denoted by the same reference numerals as those described above. 9 is a cross-sectional view taken along the broken line A_A shown in FIG. 8, and FIG. 9 is a cross-sectional view showing the driving magnet 330 coupled to the first driven magnet 331, and FIG. 9(b) is a driving magnet 330 and the first A cross-sectional view of the driven magnet 331 when it is separated. In Fig. 9(a), the rotational driving force of the driving magnet 33 is indicated by the partition wall portion 35 of the semicircular hollow partition wall 34 as indicated by the white arrow symbol. The first driven magnet 331 is transmitted to the first driven magnet 331. The rotational driving force 116854.doc -14· 200804159 of the first driven magnet 331 is transmitted to the second and third driven magnets 332 and 333, and the third driven magnet 333 is rotated. The driving force is transmitted to the magnet roller 323, whereby the transporting member 32 held by the bearing portion 322 is rotated. In Fig. 9(b), the driven magnets 330, 332 are lowered by the side, and the driving magnet 330 is driven. The first driven magnet 331 is separated from the first driven magnet 331. In the prior mechanical driving force transmitting method, in order to perform the coupling of the above-mentioned driving force transmission C, it is necessary to have a complicated synchronizing mechanism. This can cause contamination such as particles. In the substrate transfer device of the present invention, the driving force is utilized by magnetic coupling. This problem can be solved by transfer coupling and separation. In the processing device 3 of the vacuum system having the substrate transfer device 32, the drive from the drive magnet 330 is driven in the ascending state (Fig. 6). The force is transmitted to the driven magnet 331, and this is rotated by the driven magnet. The conveying rollers 3 21, 3 21 will be transported from the vertical conveyor belt 465 along the arrow in FIG. The substrate L transported in the axial direction of the symbol x is introduced into the load synchronizing chamber 31 and stopped at a specific position, and thereafter, the opening 4' of the substrate L is jammed by the i-th gate valve G1 and as described above. The movable platform 32 is lowered (Fig. 7), and the substrate B is placed on the solid floor 31. If the load synchronous chamber is decompressed to a specific pressure, the load synchronous chamber 31 and the transfer chamber 33 are loaded. The second gate valve σ2 is opened, and the transport arm 34 takes out the substrate B on the fixed platform 3 1〇 in the direction of the axis of the head symbol Y substantially orthogonal to the direction of the axis of the arrow symbol 。. At this time, due to the movable platform 320 is in a falling state, so it will be used for loading The tweezers (forks) that transport the substrate L are inserted under the substrate. 116854.doc -15- 200804159 The transfer chamber 33 is transported to the processing chamber 35 via the third gate valve G3 and the substrate L of the specific film forming process is known. Returning to the fixed platform 310 of the substrate conveying device 32 along the opposite path to the loading. Then, the load synchronous chamber is returned to the atmospheric pressure in the chamber 31, and the movable platform 32 is raised to become the delivery rollers 321 and 32. The state in which the substrate L is carried out to the outside of the load synchronous chamber 31. In this manner, the specific processing in the processing unit 3 of the vacuum system is completed and the substrate L carried out from the load synchronous chamber 31 is passed through the vertical transfer belt 465. After the lower conveyor belt 420 is conveyed to the carry-out portion 140, a series of processes is completed. Hereinabove, a preferred embodiment of the lcd glass substrate processing system of the present invention will be described with reference to the accompanying drawings, but the present invention is not limited to the above example. For example, in the above embodiment, the transport system 4 is formed to be exposed to In the environment in which the substrate L is transported in the clean room, the entire transport system 40 including the connection portion connected to the processing device 30 may be covered by a frame that is held inside the high cleanliness environment, and the cleaning system 40 may be cleaned. The substrate 1 is rotated to the next step. Further, the inside of the casing covering the conveying system 4 is in a vacuum state, so that the particles or moisture adhering to the surface of the substrate L during transportation are minimized, whereby higher-quality substrate processing can be performed. As described above, various changes or modifications of the technical idea disclosed in the scope of the patent application can be considered, and of course, these are also within the technical scope of the present invention. [Simple description of the drawing] I I6854.doc •16- 200804159 Figure 1 is a schematic diagram of a substrate processing system. Figure 2 is a schematic view of a vertical conveyor belt mechanism. Description of the substrate transport by a vertical conveyor belt Fig. 4 is a schematic view showing a vacuum system processing apparatus. Figure 5 is a plan view of the substrate transfer device 32 shown in Figure 4. Fig. 6 (a) and (b) are cross-sectional views showing the conveyance shown in Fig. 4. Substrate transfer device 32 performs substrate

▲圖7(a)、（b)係利用圖4所示之基板輸送裝置如使基板 停止之後之剖面圖。▲ Figure 7 (a) and (b) are cross-sectional views of the substrate transfer apparatus shown in Figure 4, after stopping the substrate.

圖8係驅動磁鐵330與第動磁鐵331之放大圖 圖9(a)、(b)係圖8所示之虛線a_a，之剖面圖。 【主要元件符號說明】 1 10 20 ^ 21 30 31 32 33 34、471、472 35 40 130 140 LCD玻璃基板處理系統 搬入搬出裝置 大氣系統之處理裝詈 真空系統之處理裝置 負載同步腔室 基板輸送裝置 傳送腔室 輸送臂 處理腔室 輸送系統 搬入部 搬出部 116854.doc -17- 200804159Fig. 8 is an enlarged view of the driving magnet 330 and the movable magnet 331. Figs. 9(a) and 9(b) are cross-sectional views showing a broken line a_a shown in Fig. 8. [Description of main component symbols] 1 10 20 ^ 21 30 31 32 33 34, 471, 472 35 40 130 140 LCD glass substrate processing system Loading and unloading device Atmospheric system processing device Vacuum system processing device Load synchronous chamber substrate transfer device Transfer chamber transfer arm processing chamber transport system loading unit carry-out unit 116854.doc -17- 200804159

150 搬入搬出輸送機 310 固定平臺 311 固定支柱 312 可動支柱 320 可動平臺 321 輸送輥 3211 輥 322 軸承部 323 磁輥 324 輥旋轉軸 327 從動旋轉軸 328 定位部 330 驅動磁鐵 331 ' 332 > 333 從動磁鐵 340 中空間隔壁 351 間隔壁部 352 驅動旋轉軸 353 旋轉軸 410 上側輸送帶 420 下側輸送帶 461 、 462 ' 463 、 464 > 465 垂直輸送帶 480、480a、480b、 輸送台 480c、480d、480e、 -18- 116854.doc150 Loading and unloading conveyor 310 Fixing platform 311 Fixing post 312 Movable strut 320 Movable platform 321 Transporting roller 3211 Roller 322 Bearing part 323 Magnetic roller 324 Roller rotating shaft 327 Driven rotating shaft 328 Positioning part 330 Driving magnet 331 ' 332 > 333 From Moving magnet 340 hollow partition wall 351 partition wall portion 352 driving rotating shaft 353 rotating shaft 410 upper side conveyor belt 420 lower side conveyor belt 461, 462 '463, 464 > 465 vertical conveyor belts 480, 480a, 480b, conveying tables 480c, 480d , 480e, -18- 116854.doc

200804159 480f、 480g 、 480h 486 490 495 G1 G2 G3200804159 480f, 480g, 480h 486 490 495 G1 G2 G3

LL

R 連接部 馬達 滾珠螺桿 第1閘閥 第2閘閥 第3閘閥 基板 各輸送親 116854.doc -19-R Connection part Motor Ball screw 1st gate valve 2nd gate valve 3rd gate valve Substrate Each transport pro 116854.doc -19-

Claims (1)

200804159 十、申請專利範園： 1. -種基板輸送裝置’其包含設置於腔室内且載置基板之 固定平臺與輸送基板之可動平臺，其特徵在於·· 於上述可動平臺上配置有：複數個輸送基板之輸送 輥；安裝於該輸送輥上之磁輥；及與該磁輕磁性叙合之 從動磁鐵； 當上述可動平臺處於上升位置時，上述從動磁鐵與設 置於上述腔至外之驅動磁鐵磁性耦合而被驅動，並且上 述基板離開上述固定平臺而由上述輸送輥支持； 曰上述可動平$處於下降位置時’上述從動磁鐵與驅 動磁鐵磁性分離’並且上述基板載置於上述固定平臺 上。 2. 如請求们之基板輸送裝置，其中上述從動磁鐵包含依 序磁性耦合之複數個磁鐵，該複數個磁鐵中之一個與上 述磁輕磁性耗合，使輸送輥旋轉。 3. 如請求項！之基板輸送裝置’其中上述驅動磁鐵配設於 將上述腔室之部分間隔壁向腔室内側形成為凸形之中空 間隔壁内。 4·=請求項3之基板輸送裝置，其中上述中空間隔壁具有 nj面為大致半圓形狀之間隔壁部，並且經由該間隔壁部 而將來自驅動磁鐵之驅動力傳送至從動磁鐵。 月求員1之基板輸送裝置，其中上述腔室可將其内側 減壓至特定壓力。 6· -種基板輪送方法，其使用請求項⑴中任—項之基板 I16854.doc 200804159 輸送裝置，其特徵在於： 述可動平$處於上升位置時，利用上述輸送輥之 旋轉將基板沿著第一軸方向搬入上述可動平臺上，或者 自上述可動平臺上搬出； 當^述可動平臺處於下降位置時，將上述基板沿著與 上述第一軸方向大致正交之第二軸方向搬入上述固定平 臺上，或者自上述固定平臺上搬出。 _ 7. 一種基板處理系統’其特徵在於包含： 負載同步腔室，其可經由第1閘閥而與大氣側連通； 處理腔室，其於内部對基板實施特定處理；及 傳送腔室，其可經由第2閘閥而與上述負載同步腔室 連通’且可經由第3閘閥而與上述處理腔室連通，並於 内部具有輸送臂，該輸送臂係對於上述負載同步腔室及 上述處理腔室進行基板之搬入及搬出； 上述負載同步腔室於内部具備請求項5之基板輪送裝 春置。 二 116854.doc200804159 X. Application for Patent Park: 1. A substrate transport device comprising a fixed platform for mounting a substrate and a movable platform for transporting the substrate, wherein the movable platform is provided with: plural a conveying roller for conveying the substrate; a magnetic roller mounted on the conveying roller; and a driven magnet that is combined with the magnetic light magnetic; when the movable platform is in the raised position, the driven magnet is disposed outside the cavity The driving magnet is magnetically coupled to be driven, and the substrate is supported by the conveying roller away from the fixed platform; 曰 the movable magnet is magnetically separated from the driving magnet when the movable flat is in the lowered position, and the substrate is placed on the substrate On a fixed platform. 2. The substrate transfer apparatus of the request, wherein the driven magnet comprises a plurality of magnets magnetically coupled in sequence, and one of the plurality of magnets is magnetically coupled to the magnetic light to rotate the transport roller. 3. As requested! In the substrate transfer device, the drive magnet is disposed in a hollow partition wall in which a part of the partition wall of the chamber is formed into a convex shape toward the inside of the chamber. The substrate transfer device of claim 3, wherein the hollow partition wall has a partition wall portion having a substantially semicircular shape on the nj surface, and the driving force from the drive magnet is transmitted to the driven magnet via the partition wall portion. The substrate transfer device of the 1st, wherein the chamber can decompress the inside thereof to a specific pressure. A substrate transfer method using the substrate I16854.doc 200804159 of any one of the claims (1), wherein: when the movable flat $ is in the raised position, the substrate is rotated along with the rotation of the transport roller The first axial direction is carried into the movable platform or is carried out from the movable platform; when the movable platform is in the lowered position, the substrate is carried into the fixed direction along a second axial direction substantially orthogonal to the first axial direction. On the platform, or move out from the above fixed platform. A substrate processing system characterized by comprising: a load synchronization chamber that is communicable with the atmosphere side via a first gate valve; a processing chamber that internally performs specific processing on the substrate; and a transfer chamber that can And communicating with the load synchronization chamber via the second gate valve and communicating with the processing chamber via the third gate valve, and having a transfer arm therein for performing the load synchronization chamber and the processing chamber The substrate is loaded and unloaded; and the load synchronization chamber is provided with the substrate wheel of the request item 5 in the spring. Two 116854.doc
TW095146877A 2006-06-26 2006-12-14 Substrate transporting mechanism, substrate transporting method and substrate processing system TW200804159A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006175661A JP2008004898A (en) 2006-06-26 2006-06-26 Substrate transport apparatus, substrate transport method, and substrate processing system

Publications (1)

Publication Number Publication Date
TW200804159A true TW200804159A (en) 2008-01-16

Family

ID=38872825

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095146877A TW200804159A (en) 2006-06-26 2006-12-14 Substrate transporting mechanism, substrate transporting method and substrate processing system

Country Status (5)

Country Link
US (1) US20070296134A1 (en)
JP (1) JP2008004898A (en)
KR (1) KR100778208B1 (en)
CN (1) CN101096245A (en)
TW (1) TW200804159A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103419962A (en) * 2013-08-06 2013-12-04 常州天合光能有限公司 Automatic box packaging equipment for subfissure preventing assembly

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008015982B3 (en) * 2008-03-27 2009-07-30 Grenzebach Maschinenbau Gmbh Method and device for fixing and further transporting impact-sensitive plates in sputter coating systems, computer program for carrying out the method and machine-readable carrier for this purpose
CN101654199B (en) * 2009-07-30 2013-01-09 江苏华宇印涂设备集团有限公司 Continuous stock collecting device
JP5224612B2 (en) * 2010-09-09 2013-07-03 東京エレクトロン株式会社 Substrate delivery device and substrate delivery method
FI123653B (en) * 2010-11-23 2013-08-30 Raute Oyj Device for clipping veneer sheets
CN102286725B (en) * 2011-06-30 2013-06-26 东莞市华科制造工程研究院有限公司 Novel adjustable substrate delivery roll device
DE102012103533A1 (en) * 2012-04-20 2013-10-24 Köra-Packmat Maschinenbau GmbH Device for conveying a substrate and system for printing on a substrate
CN102826335B (en) * 2012-08-23 2016-05-11 京东方科技集团股份有限公司 A kind of glass substrate conveying device
CN103878835B (en) * 2014-03-26 2016-02-24 泗阳县祥和木业有限公司 The material collecting device of wooden plane sheet plate joggling apparatus
TWI732285B (en) * 2015-01-23 2021-07-01 美商應用材料股份有限公司 Semiconductor process equipment
JP6456177B2 (en) * 2015-02-12 2019-01-23 株式会社ディスコ Wafer processing system
TWI602757B (en) * 2016-04-11 2017-10-21 由田新技股份有限公司 Transfer device
CN105752687A (en) * 2016-04-26 2016-07-13 东旭（昆山）显示材料有限公司 Conveying device and processing system
JP6704423B2 (en) * 2018-01-17 2020-06-03 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ Substrate processing apparatus, semiconductor device manufacturing method, and program
FR3079507A1 (en) * 2018-03-29 2019-10-04 Saint-Gobain Glass France IMPROVED CONVEYOR ASSEMBLY
JP7097759B2 (en) * 2018-06-22 2022-07-08 東京エレクトロン株式会社 Board processing equipment and board processing method
DE102018217660B4 (en) * 2018-10-15 2020-10-08 Hegla Gmbh & Co. Kg Laminated glass cutting system and method for cutting laminated glass sheets
JP7242414B2 (en) * 2019-05-08 2023-03-20 株式会社アルバック Vacuum transfer device and film forming device
CN114803281B (en) * 2022-05-05 2024-03-29 深圳市创新特科技有限公司 Hoist that conversion of butt joint dustless workshop was used
CN115057236B (en) * 2022-08-08 2023-06-30 河南工业职业技术学院 Material feeding unit for machine-building

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2512782B2 (en) * 1988-02-26 1996-07-03 東京エレクトロン株式会社 Pantograph type wafer carrier
JP2808826B2 (en) * 1990-05-25 1998-10-08 松下電器産業株式会社 Substrate transfer device
JPH0492446A (en) * 1990-08-07 1992-03-25 Plasma Syst:Kk Substrate conveyance robot
JPH06122642A (en) * 1992-09-14 1994-05-06 Mitsubishi Kasei Corp Novel phosphite compound and production of aldehyde with the same
JPH08172121A (en) * 1994-12-20 1996-07-02 Hitachi Ltd Substrate carrier device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103419962A (en) * 2013-08-06 2013-12-04 常州天合光能有限公司 Automatic box packaging equipment for subfissure preventing assembly
CN103419962B (en) * 2013-08-06 2015-09-23 常州天合光能有限公司 Anti-hiddenly split assembly automatic packaging device

Also Published As

Publication number Publication date
JP2008004898A (en) 2008-01-10
US20070296134A1 (en) 2007-12-27
CN101096245A (en) 2008-01-02
KR100778208B1 (en) 2007-11-22

Similar Documents

Publication Publication Date Title
TW200804159A (en) Substrate transporting mechanism, substrate transporting method and substrate processing system
KR100603100B1 (en) Transfer system for lcd glass substrate
KR101830598B1 (en) Substrate processing system and substrate inverting apparatus
JP5068738B2 (en) Substrate processing apparatus and method
JP4999487B2 (en) Substrate processing equipment
JP3208562B2 (en) Positioning device and positioning method
KR100790557B1 (en) Buffer system adjusting fist-in first-out
JP2003170384A (en) Scalar robot for carrying flat plate-like object and processing system for flat plate-like object
TWI401200B (en) End effector and robot for transferring a substrate having the same
JP2012218844A (en) Plate-like member inverting system, and inversion transfer method of the same
JPWO2007088927A1 (en) Substrate exchange apparatus, substrate processing apparatus, and substrate inspection apparatus
JP4582450B2 (en) Vacuum film deposition system transport mechanism
JPH11288988A (en) Alignment high-speed processing mechanism
KR101725472B1 (en) Substrate transfer antechamber mechanism
TWI413204B (en) Apparatus for processing substrate
JP2739413B2 (en) SCARA robot for substrate transfer
JP2004106105A (en) Delivery robot
JPH06140492A (en) Cluster device
JPH06247507A (en) Conveyer arm
WO2016132651A1 (en) Carrier transport device and carrier transport method
JP2512782B2 (en) Pantograph type wafer carrier
JP2005203452A (en) Substrate supporting and reversing device
JPH09124147A (en) Substrate conveying device
TW200521055A (en) Wafer transportation system
JP4230973B2 (en) Substrate transfer device