JPH06140492A - Cluster device - Google Patents

Abstract

PURPOSE:To provide a cluster device which is provided with positioning devices in a chamber and can shorten not only the carrying time, but also positioning time of objects to be treated. CONSTITUTION:This device is provided with a chamber 1 to the walls of which treatment devices 4a, 4b, 4c, 4d, and 4e are respectively connected, carrying arm 2 which can carry objects to be treated into the devices 4a, 4b, 4c, 4d, and 4e and is incorporated in the chamber 1, and a plurality of positioning devices 3a, 3b, 3c, 3d, and 3e which can position the objects to be treated to the placing positions of the devices 4a, 4b, 4c, 4d, and 4e and is incorporated in the chamber 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cluster device having an alignment device in a chamber.

Since the number of processing steps has increased with the recent miniaturization and high integration of semiconductor devices, the steps become complicated, and it becomes necessary to carry the semiconductor substrate between the steps in a clean atmosphere. There is.

As a solution of such a transfer method, by connecting a plurality of processing devices via a cluster device having a high vacuum inside, the semiconductor substrates are transferred between the plurality of processing devices in a high vacuum atmosphere. However, since the semiconductor substrates are transferred between a plurality of processing devices by using the transfer arm, which can transfer only a limited number of sheets at one time, the transfer sequence becomes complicated and the transfer time increases. Since the total processing time is long and the mounting position of the semiconductor substrate in the processing apparatus is required to be accurate, the semiconductor substrate may be displaced in the processing apparatus. It is necessary to align the semiconductor substrate immediately before it is transferred to the device.

Under the circumstances as described above, there is a demand for a cluster apparatus which can shorten the transfer path and can perform the alignment in the chamber immediately before it is loaded into the processing apparatus.

[0005]

2. Description of the Related Art A conventional cluster device having two processing devices and one alignment device outside will be described in detail with reference to FIGS.

FIG. 12 is a diagram showing the configuration and operation of a conventional cluster device, and FIG. 13 is a time chart of the conventional cluster device. As shown in FIG. 12, two external processing units
In a cluster device including 14a and 14d and one alignment device 13b, when a processing object is transferred from the processing device 14a to the processing device 14d by the transfer arm 2, first, as shown in the time chart of FIG. The processed product is taken out from the device 14a and conveyed (11), and then the processed product is conveyed (12) to the alignment device 13b. After aligning (13) the processed product to a predetermined position in this alignment device 13b, the processed product is transported (14) from the alignment device 13b, and then the processed product is further transported (15) to the processing device 14d of the next step. ) Do.

[0007]

In the conventional cluster device described above, since the alignment device is provided outside the wall surface of the cluster device, the alignment device must be transported back and forth from inside the cluster device to the alignment device. Therefore, there is a problem that the transfer time itself becomes long, and since the alignment device and the processing device are provided outside the wall surface of the cluster device, the number of alignment devices connectable to the cluster device is limited. Therefore, it takes time to perform the alignment, and the transfer arm 2 has to wait until the alignment of the objects to be processed is completed, which causes a problem that the standby time increases.

In view of the above situation, the present invention has an object to provide a cluster apparatus capable of shortening the transportation time itself and also shortening the positioning time.

[0009]

A cluster apparatus of the present invention is provided with a chamber in which a plurality of processing apparatuses are connected to a wall surface and a chamber in which a processing object to be processed in the processing apparatus can be transported. A transfer arm provided, and a plurality of alignment devices provided in the chamber capable of aligning the position of the processed product with a position to be placed in the processing device. To configure.

[0010]

That is, in the present invention, since the transfer arm and the plurality of alignment devices are provided inside the chamber, the process object is taken out from the process device 4a and transferred as shown in FIG. Then, the processed material is conveyed to the alignment device 3d. Here, after aligning the processed product to a predetermined position in this alignment device 3d, the processed product can be conveyed from the alignment device 3d to the processing device 4d of the next step, as shown in the time chart of FIG. Since the above-mentioned transfer and transfer can be extremely shortened, the transfer time itself can be shortened. Further, since the alignment device is provided in the processing device, an external processing device connected to the cluster device can be used. Since it is possible to install the same number of alignment devices as the above, it is possible to temporarily place the semiconductor substrate on the alignment device and move the transfer arm, so that the standby time of the transfer arm can be effectively used. Becomes

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A cluster apparatus according to an embodiment of the present invention, which has five external processing devices and five alignment devices inside, will be described in detail below with reference to FIGS.

FIG. 1 is a diagram showing the configuration of a cluster device according to one embodiment of the present invention, FIG. 2 is a diagram for explaining the operation of the cluster device of one embodiment according to the present invention, and FIG. 3 is a diagram of an embodiment according to the present invention. 4 is a time chart of the cluster device, FIG. 4 is a diagram showing the structure of an embodiment of the alignment mechanism of the cluster device of the present invention, FIG. 5 is a view taken along the line AA of FIG. 4, and FIG. 6 is a line BB of FIG. FIG. 7 is a view taken in the direction of arrow CC in FIG. 4, and FIGS. 8 to 11 are views for explaining the operation of the embodiment of the alignment mechanism of the cluster device of the present invention.

As shown in FIG. 1, a cluster apparatus according to one embodiment of the present invention is provided with five external processing units 4a, 4b, 4c, 4d and 4e connected to the wall surface of a chamber 1 having five wall surfaces. In the interior of the cluster device, five alignment devices 3a, 3b, 3c, 3d, corresponding to the five external processing devices 4a, 4b, 4c, 4d, 4e, 3e is provided.

A processing object is taken out from the processing device 4a by using such a cluster device, and after positioning, the processing device is processed.
The case of transporting to 4d will be described in detail. As shown in FIGS. 2 and 3, first, the processed product is taken out of the processing device 4a and conveyed, and then the processed product is conveyed to the alignment device 3d. After aligning the processed product at a predetermined position in the alignment device 3d, the processed product is conveyed from the alignment device 3d to the processing device 4d of the next step.

Since the alignment device is provided in the chamber 1 of the cluster device as described above, the transportation and the transportation can be extremely shortened as shown in FIGS. 2 and 3, so that the transportation time itself can be shortened. Further, since the positioning devices are provided corresponding to the external processing devices, respectively, the time required for the positioning can be shortened, and the waiting time for the transfer arm 2 to wait can be shortened. Becomes

An embodiment of the alignment device is shown in FIGS.
This will be described in detail with reference to FIG. FIG. 4 is a diagram showing the structure of an embodiment of the alignment mechanism of the cluster device of the present invention.

A motor 7 having a pinion fixed to a rotating shaft and a sensor 13 are provided on the upper wall surface of the cluster device, and a rotatable wafer chuck 6 is provided on the lower part.
And an external processing device is connected to the side wall.

As shown in FIG. 5 which is a view taken along the line A--A of FIG.
For example, the semiconductor substrate 14 is mounted. As shown in FIG. 6 which is a view taken along the line BB of FIG. 5, the pinion 8 attached to the rotary shaft of the motor and the guide rod 10 guided by the slide bearings 9a of the bearing portions 9 on both sides are connected. A wafer guide 12 for positioning the semiconductor substrate 14 according to the outer shape of the semiconductor substrate is provided below the guide rod 10 so as to mesh with the rack 11.

As shown in FIG. 7 which is a view taken along the line CC in FIG. 4, the elevating stage 5 is provided at the center of the fork-shaped transfer arm 2 which supports the semiconductor substrate 14, and is capable of elevating. A wafer chuck 6 that supports the semiconductor substrate 14 is rotatably provided at the center of the semiconductor substrate 14.

With such an alignment apparatus, the semiconductor substrate 14
To align the semiconductor substrate 14 with the semiconductor substrate 14 mounted on the surface of the wafer chuck 6 as shown in FIG. 8, the semiconductor substrate 14 is moved to the position of the wafer guide 12 by raising the elevating stage 5. As shown in FIG. 9, the motor 7 is rotated to rotate the pinion 8 to move the rack 11 in the direction indicated by the arrow, and the semiconductor substrate 14 is positioned by the outer shape of the semiconductor substrate 14 using the wafer guide 12. Then, as shown in FIG. 10, the motor 7 is rotated in the reverse direction to rotate the pinion 8 in the reverse direction, the rack 11 is moved in the reverse direction, the wafer guide 12 is opened in the direction indicated by the arrow, and the wafer chuck 6 is rotated. The sensor detects the orientation flat of the semiconductor substrate 14 and aligns the semiconductor substrate 14. After the alignment of the semiconductor substrate 14 is completed, when the elevating stage 5 is lowered, the semiconductor substrate 14
Is placed on the transfer arm 2, and when the elevating stage 5 is further lowered, it stops at the position shown in FIG.

[0021]

As is apparent from the above description, according to the present invention, there is an advantage that the transport time can be greatly shortened by the extremely simple modification of the structure, which is extremely economical and reliable. It is possible to provide a cluster device that can be expected to be improved.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a cluster device according to an embodiment of the present invention,

FIG. 2 is a diagram for explaining the operation of a cluster device according to an embodiment of the present invention,

FIG. 3 is a time chart of a cluster device according to an embodiment of the present invention,

FIG. 4 is a diagram showing a structure of an embodiment of a positioning mechanism of a cluster device according to the present invention;

5 is a view on arrow AA of FIG. 4,

FIG. 6 is a view on arrow BB in FIG.

7 is a view taken along the line CC of FIG.

FIG. 8 is a diagram (1) for explaining the operation of the embodiment of the alignment mechanism of the cluster device according to the present invention;

FIG. 9 is a diagram (2) for explaining the operation of the embodiment of the alignment mechanism of the cluster device according to the present invention;

FIG. 10 is a diagram (3) for explaining the operation of the embodiment of the alignment mechanism of the cluster device according to the present invention;

FIG. 11 is a diagram (4) for explaining the operation of the embodiment of the alignment mechanism of the cluster device according to the present invention;

FIG. 12 is a diagram explaining the configuration and operation of a conventional cluster device;

FIG. 13 is a time chart of a conventional cluster device,

[Explanation of symbols]

1 is a chamber, 2 is a transfer arm, 3a, 3b, 3c, 3d and 3e are alignment devices, 4a, 4b, 4c, 4d and 4e are processing devices, 5 is a lifting stage, 6 is a wafer chuck, 7 is a motor, 8 is a pinion, 9 is a bearing, 9a is a slide bearing, 10 is a guide rod, 11 is a rack, 12 is a wafer guide, 13 is a sensor, 14 semiconductor substrates,

Claims (1)

[Claims] 1. A plurality of processing devices (4a, 4b, 4c, 4d, 4e) on the wall
A chamber (1) connected to the chamber (1), and a transfer device provided in the chamber (1) capable of transferring a processing object to be processed in the processing device (4a, 4b, 4c, 4d, 4e). The arm (2) and the processing device (4a, 4b, 4c, 4d, 4e) are provided in the chamber (1) capable of aligning the processing object at a position to be mounted in the chamber (1). Multiple alignment devices
(3a, 3b, 3c, 3d, 3e), and a cluster device comprising: