Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70216—Mask projection systems
  • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
  • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
  • F16H—GEARING
  • F16H21/00—Gearings comprising primarily only links or levers, with or without slides
  • F16H21/10—Gearings comprising primarily only links or levers, with or without slides all movement being in, or parallel to, a single plane
  • F16H21/44—Gearings comprising primarily only links or levers, with or without slides all movement being in, or parallel to, a single plane for conveying or interconverting oscillating or reciprocating motions
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
  • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
  • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
  • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
  • H02N1/002—Electrostatic motors
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
  • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
  • H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
  • H02N2/021—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors using intermittent driving, e.g. step motors, piezoleg motors
  • H02N2/023—Inchworm motors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
  • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
  • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
  • H10P76/2041—Photolithographic processes
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T74/00—Machine element or mechanism
  • Y10T74/18—Mechanical movements
  • Y10T74/18992—Reciprocating to reciprocating

Definitions

• the invention relates to an actuator for the high-precision positioning or manipulation of components, in particular of optical elements or other functional elements in projection exposure systems for semiconductor lithography, and to a method for operating such an actuator.
• actuator is to be seen as synonymous with the terms “actuator” and “actuator”.
• a positioning or manipulation in the nanometer range is regularly required for the above components in order to ensure the overall functionality of the parent system. In this case, it is often necessary to monitor the position of the positioned / manipulated component or its orientation in space with a high-resolution and thus cost-intensive and, if appropriate, fault-prone measuring and control electronics.
• the actuators of the prior art have the common problem that the step size of the drive in response to the load acting on the rotor of the actuator, changes. As a result, the output movement becomes incalculable, so that it must be monitored with a measuring system. In addition, over longer travel distances of the actuator adds the mentioned deviation of the step size.
• the problem described will be explained below with reference to the piezoactuator described in the German Offenlegungsschrift DE 100 225 266 A1.
• an actuator is described, in which the actuator rotor (ie the moving part of the actuator, which usually acts on the component to be manipulated or positioned) is driven by one or more feed elements ("feet"), the stand perpendicular to the runner. In this case, the feed elements move perpendicular to their own longitudinal direction in the rotor direction.
• the step width which is provided by the foot depends on the one hand on the force which the foot itself can apply (feed force). on the other hand by the force against which the foot is working or by the force exerted on the rotor of the actuator train or pressure.
• the step size becomes greater than the nominal step size, that is the increment to which the actuator is designed. If, on the other hand, a force acts against the direction opposite to the direction of action, the step size will be smaller than the nominal step size.
• step size In cases where the load on the rotor changes during the process of the actuator, the step size also changes with it. Therefore, the step size must be checked with an additional high-precision displacement sensor, but this is not always desirable or possible due to space or handling reasons.
• An alternative type of high-resolution stepper drives are inertial drives. In these drives, a feed element, for example a piezoceramic, pushes the rotor slowly in one direction via a frictional contact. The load on the runner and the acceleration force of the runner must be smaller than the frictional force that can be transmitted in frictional contact. Subsequently, the feed element is pulled back jerkily, wherein the necessary acceleration force of the rotor for the fast reverse movement is greater than the frictional contact transferable frictional force.
• the runner since the runner is not held in the jerky retraction of the feed element, the runner can be "misaligned" at this moment by an external force on the rotor.
• the actuator according to the invention with a direction of action has a housing and a rotor which can be moved relative to the housing in the direction of action of the actuator, wherein the actuator has a feed unit which is at least temporarily in communication with the rotor.
• the feed unit shows at least one defor- mation unit and at least one deformator for deformation of the deformation unit; the at least one deformator is suitable for deforming the deformation unit with a vector component, in particular a force component, perpendicular to the direction of action of the actuator in such a way that the total length of the deformation unit changes in the effective direction as a result of the deformation.
• the housing may consist of at least two housing parts, which are connected to one another via the deformation unit and which may each have at least one locking unit, with which the rotor can be locked to the respective housing part.
• the deformation unit may comprise at least one leaf spring, in particular it may be formed as a spring pair of two opposing leaf springs, wherein at least two deformers can be arranged on the spring pair such that they can bend the springs from each other from the outside.
• the rotor may have a first and a second part runner, wherein the two part runners are connected via the deformation unit formed as part of the runner.
• At least two locking units may be present, which can each lock one of the part runners relative to the housing.
• the actuator may have damping elements.
• the deformation unit can have at least one pressurizable tube.
• the deformation unit may have at least one tempe- Bable bimetal, a magnetic bending spring, a wire spring or a combination of different bending springs have different cross-section and / or different lengths.
• the deformator can have a piezoelectric element, in particular a piezoelectric bag, an electromagnetic coil, a hydraulic or pneumatic cylinder or even a pneumatic bellows.
• the deformator can be formed as a capacitor with capacitor plates whose electric field leads to a deformation of bending elements arranged between the capacitor plates.
• a possible method for operating an actuator according to the invention with a rotor, which has a deformation unit comprises the following steps:
• FIG. 1 shows in subfigures Ia to Id a first embodiment of the invention
• Figure 2 shows in the sub-figures 2a to 2d a variant of the invention, in which a virtually unlimited travel of the actuator is possible;
• FIG. 3 shows an arrangement in which damping elements are used
• FIG. 4 shows, in the subfigures 4a to 4e, a possibility for a smooth process of the actuator
• Figure 5 shows a use of the actuator for highly accurate
• FIGS. 6 to 19 show possibilities of realizing deformers and deformation elements using various technical principles
• Figure 20 shows a schematic representation of the mechanical basic principle of the invention
• FIG. 21 shows a z-manipulator for a projection exposure apparatus for semiconductor lithography, in which an actuator according to the invention is used;
• FIG. 22 shows a projection exposure apparatus for semiconductor lithography, in which an actuator according to the invention or a manipulator, as shown in FIG. 21, is used.
• FIG. 1 shows a first embodiment of the invention.
• the tuator 1 consists of the housing 2 and the rotor 3 arranged therein, which is held at least temporarily by the locking units 41 and 42, respectively.
• the locking units 41 and 42 need not necessarily hold the rotor 3 by means of mechanical contact; also a non-contact locking, for example by electrical or magnetic forces can be used.
• the deformers 5 are arranged in the housing 2, which act on the deformation unit 6.
• the deformation unit 6 is designed in the example shown so that it consists of the two leaf springs 601, which connect the two part runners 31 and 32 of the rotor 3 together.
• the operation of the actuator 1 according to the invention is explained below with reference to the figure parts Ia to Ic. '
• FIG. 1a shows the first step for moving the rotor 3 relative to the housing 2.
• the rotor 3 is fixed at its partial runner 31 in the method step shown in FIG. 1a by means of the locking units 41; the right part runner 32 freely movable; the locking units 42 are open.
• the deformers 5, which act perpendicular to the direction of action of the actuator 1 and thus perpendicular to the direction of movement of the rotor 3, are moved back into the housing 2.
• the two deformators 5 are extended and deform the leaf springs 601, which are arranged opposite one another, towards each other, so that as a result of the deflection of the two leaf springs 601 a shortening of the rotor 3 in the direction of the arrow 700 results.
• the right part runner 32 moves to the left, in the direction of the left part runner 31.
• the right partial runner 32 is locked by the associated locking units 42, while the deformators 5 are retracted into the housing 2 and release the leaf springs 601, however are the locking units 41, by which the left part runner 31 is supported, still closed in this state, so that as a result, no movement of the left part runner 31 results.
• FIGS. 1a to 1d can, in principle, be repeated as long as the geometrical conditions of the actuator 1, in particular the extension of the leaf springs 601 in the direction of action of the actuator 1, allow. Furthermore, it is possible to operate the actuator 1 shown in FIG. 1 in both tension and compression directions, ie. H. either to connect the right part runner 32 or the left part runner 31 with an element to be moved.
• the maximum force which can be applied by the actuator 1 shown in Figure 1 corresponds to a pressure operation of the actuator 1 of the Euler buckling force of the leaf springs 601 in an operation of the actuator to train this limitation does not exist, but the maximum applied tensile force is in essentially of the force that can be applied by deformers 5 and by the modulus of elasticity of the leaf springs 601. borders.
• the very high reduction also allows the maintenance of a constant defined increment regardless of the load on the rotor 3 by the relatively large deformation of the leaf springs 601 is defined perpendicular to the effective direction by a deformation limit, which also the step size in the effective direction by the high reduction very accurate is determined.
• this deformation limitation can be realized, for example, by bending the leaf springs 601 until they collide.
• Figure 2 shows a variant of the invention, in which the travel of the rotor 3 is practically unlimited.
• the housing of the actuator 1 is made in two parts from the two housing parts 21 and 22, which communicate with each other via the leaf springs 601.
• the first locking units 41 are arranged, while in the second housing part 22, the second locking units 42 are arranged.
• the deformators 5, which act on the leaf springs 601 substantially analogously to the variant shown in FIG.
• the left-hand locking units 41 are closed and hold the rotor 3, while the right-hand locking units 42 are opened so that the right part of the rotor 3 is released.
• the leaf springs 601 are relaxed because the deformers 5 are retracted into the first housing part 21.
• the deformators 5 extend out of the first housing part 21 and deform the leaf springs 601 in the manner already known from FIG. 1, whereby the right housing part 22 with the opened locking units 42 in the direction of the first housing part 21 moves along the rotor 3. Subsequently, (shown in Figure 2c), the right locking units 42 are closed, whereby the rotor 3 is locked and the left locking units 41 are opened.
• the deformators 5 are withdrawn into the first housing part 21, whereby the leaf springs 601 relax. Due to the fact that, in the example shown in FIG. 2, the deformation unit 6, ie the leaf springs 601, are connected to the housing parts 21 and 22 and not to the rotor 3, it becomes possible for the rotor 3 to be substantially opposite to the housing parts 21 and 22 to move unlimited range.
• the dampers 7 can be designed, for example, as hydraulic or as electromagnetic dampers, which are designed as plunger coils.
• FIG. 4 shows in the subfigures 4a to 4e an alternative possibility of preventing the momentum when the leaf springs 601 relax.
• the illustration in Figure 4 corresponds to the illustration in Figure 1; the difference is that the leaf springs 601, as shown in Figure 4d and Figure 4e, are only relaxed when the deformation unit 41 has released the left-hand rotor part 31.
• the left-hand rotor part 31 can then be extended in a controlled manner by a controlled retraction of the deformers 5 into the housing 2.
• This variant of the invention makes it possible, in particular, to use a measuring system of low resolution for monitoring the travel path, since only the comparatively large travel path of the deformators 5 has to be measured.
• this path can be determined from the sum of the deformator movements, taking into account the exactly known reduction ratio between the deformator 5 and the rotor 3. As a result, it is no longer necessary to provide a high-precision measuring system for the entire rotor travel, as is currently necessary. With the actuator according to the invention, it is sufficient for this purpose to use a measuring system for the deformator 5, which covers only the small range of movement of the deformator 5, and because of the high reduction does not require as high a resolution as the measuring systems previously used for this purpose.
• the deformation units 6 are realized as leaf springs 601 (in each case only one leaf spring).
• the deformator is embodied in FIG. 6 as a piezoelement 501, in FIG. 7 as an electromagnetic coil 502 with an iron core, in FIG. 8 as a hydraulic cylinder with associated hydraulic ram 503, and in FIG. 9 as a pneumatic bellows 504 between the two leaf springs 601.
• the deformation unit is realized as a thin-walled tube 610, which can be subjected to a certain pressure from the inside of the tube.
• the tube 610 shows a double functionality as a bellows or bending spring.
• FIG. 11 shows the possibility of a thermal drive, in which the deformation unit 6 is realized as a pair of bimetallic strips; The deflection of the bimetallic strip 620 takes place, as shown in the subfigures IIb and 11c, by densityzu- or heat dissipation.
• Figure IIa shows the arrangement in the neutral state.
• the deformation unit can be realized as a combination of two magnetic coils 505 with the magnetic bending springs 630, as shown in FIG.
• a capacitor may also be used with the capacitor plates 506 for use as a deformator, the electric field of which leads to a deformation of the bending elements 640 arranged between the capacitor plates 506.
• FIG. 14 shows the already presented possibility of a leaf spring 601 whereas in FIG. 15 a wire spring 650 is used.
• FIG. 16 it may also be a deformation element 660 with an arbitrary cross section.
• FIG. 17 shows a variant in which a combination of different torsion springs 670 with different cross-section and different length is used as the deformation element, this makes it possible to adapt the actuator effect to the respectively prevailing Seeing requirements of the use of the actuator according to the invention.
• FIG. 18 shows a possibility in which the deformation unit has at least two sections with different elastic properties in the effective direction of the actuator. This is realized by arranging a solid intermediate piece 681 in the bending spring 680.
• the solid intermediate piece 681 creates a defined bearing surface for the deformers (not shown in FIG. 18). As a result, defined conditions for the force effect of the deformers on the deformation element prevail over a limited range even when the rotor moves sideways.
• FIG. 19 shows in subfigures a, b and c various possibilities for the design of a thin-walled tube which can be subjected to pressure from the inside, as deformation element 610.
• the runner with deformation unit is modeled by a mechanical substitute model, which consists of four rods, which are connected to each other with three pivot joints, wherein the central pivot a torsion spring is arranged in parallel.
• the inner rods each have the length a; the torsion spring has the torsion spring stiffness k 9.
• the rod on the right-hand side is held in place by a locking unit, while the rod on the left-hand side is linearly guided (eg by an open locking unit).
• the middle pivot has been deflected by a deformator about the path v, whereby the inner rods the angle ⁇ to Ho occupy horizontal.
• the path v depends on the flexion angle 2 * ⁇ of the central pivot joint.
• the bending moment M Bend can be represented ⁇ of the middle hinge to differentiate the half angle of bend.
• the torsion spring exerts on the middle pivot joint the stretching moment M strec k, which would like to extend the pivot joint and the entire rotor.
• the extension moment M Strec k is given by the flexion angle 2 * ⁇ of the central pivot and the torsion spring stiffness k ⁇ .
• the critical force F crit corresponds to the Euler buckling force in the corresponding buckling load case.
• the deformation unit does not necessarily have to have elastic components. It is also conceivable that the deformation of the deformation unit via a deformator, which can exert both pressure and train. As a result, the deformation unit itself would not necessarily have to apply a restoring force.
• Actuator for applications where at a very high required position accuracy is a position measurement of the object to be adjusted to control the actuator is very difficult to implement and or very large masses must be positioned.
• a z-manipulator can be constructed in such a way that a lens 100 is gripped in an inner ring 101, which in turn is supported by three actuators 1 according to the invention whose direction of action is oriented parallel to the z-direction.
• the three actuators 1 are embedded in an outer ring 102, which forms the interface to the lens structure, not shown, in its outer region.
• the actuators 1 can support the inner ring 101 together with the lens 100 directly in the z-direction, without the system of lens 100, inner ring 101 and actuators 1 becoming susceptible to vibration.
• the actuators 1 can move to the center z position of the lens 100 in the step mode, and a sensor which accurately detects the z position of the lens 100 is not necessary since the step size is quite high because of its substantial load independence exactly defined. Around to reach the desired z-position, but the number of executed steps must be counted.
• the actuator 1 can be used in the fine adjustment mode according to FIG.
• FIG. 22 shows a projection exposure apparatus 310 for semiconductor lithography, in which the actuator according to the invention is used.
• the system is used to illuminate structures on a substrate coated with photosensitive materials, which generally consists predominantly of silicon and is referred to as wafer 320, for the production of semiconductor components, such as e.g. Computer chips.
• the projection exposure apparatus 310 essentially consists of an illumination system 330, a device 340 for recording and exact positioning of a structured mask, a so-called reticle 350, through which the later structures on the wafer 320 are determined, a device 360 for mounting, Movement and exact positioning of just this wafer 320 and an imaging device, namely a projection lens 370, with a plurality of optical elements 380, which are mounted on sockets 390 in a lens housing 400 of the projection lens 370.
• the basic principle of operation provides that the structures introduced into the reticle 350 are imaged onto the wafer 320; the image is usually scaled down.
• the illumination system 330 provides a projection beam 410 required for imaging the reticle 350 on the wafer 320, such as light or similar electromagnetic radiation.
• the source of this radiation may be a laser or the like.
• the radiation is formed in the illumination system 330 via optical elements so that the projection beam 410 has the desired properties with respect to diameter, polarization, shape of the wavefront and the like when it hits the reticle 350.
• the projection objective 370 has a plurality of individual refractive, diffractive and / or reflective optical elements 380, such as e.g. Lenses, mirrors, prisms, end plates and the like.
• the optical elements can be arranged in a manipulator in the manner of the manipulator shown in FIG. 21.
• the z-direction is indicated in the present illustration corresponding to FIG. 21.

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• General Physics & Mathematics (AREA)
• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Public Health (AREA)
• Environmental & Geological Engineering (AREA)
• Epidemiology (AREA)
• Health & Medical Sciences (AREA)
• General Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Lens Barrels (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
• General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)

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• 2008
  • 2008-07-22 DE DE102008034285A patent/DE102008034285A1/de not_active Ceased
• 2009
  • 2009-07-07 KR KR1020117003957A patent/KR101449792B1/ko not_active Expired - Fee Related
  • 2009-07-07 JP JP2011519055A patent/JP5127985B2/ja not_active Expired - Fee Related
  • 2009-07-07 WO PCT/EP2009/004892 patent/WO2010009807A1/de not_active Ceased
  • 2009-07-07 EP EP09776995.4A patent/EP2300877B1/de not_active Not-in-force
• 2011
  • 2011-01-19 US US13/009,438 patent/US20110128521A1/en not_active Abandoned
• 2012
  • 2012-02-22 US US13/402,115 patent/US20120147344A1/en not_active Abandoned
• 2015
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