WO2009151029A1 - Matériau d'étanchéité et module de batterie solaire dans lequel le matériau est utilisé - Google Patents
Matériau d'étanchéité et module de batterie solaire dans lequel le matériau est utilisé Download PDFInfo
- Publication number
- WO2009151029A1 WO2009151029A1 PCT/JP2009/060462 JP2009060462W WO2009151029A1 WO 2009151029 A1 WO2009151029 A1 WO 2009151029A1 JP 2009060462 W JP2009060462 W JP 2009060462W WO 2009151029 A1 WO2009151029 A1 WO 2009151029A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- component
- sealing material
- polymer
- functional group
- Prior art date
Links
- 239000003566 sealing material Substances 0.000 title claims abstract description 72
- 229920000642 polymer Polymers 0.000 claims abstract description 100
- -1 polypropylene Polymers 0.000 claims abstract description 81
- 125000000524 functional group Chemical group 0.000 claims abstract description 78
- 229920001155 polypropylene Polymers 0.000 claims abstract description 30
- 239000004743 Polypropylene Substances 0.000 claims abstract description 23
- 150000001993 dienes Chemical class 0.000 claims abstract description 23
- 239000000470 constituent Substances 0.000 claims abstract description 7
- 229920001577 copolymer Polymers 0.000 claims description 21
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 20
- 239000005977 Ethylene Substances 0.000 claims description 20
- 229920002554 vinyl polymer Polymers 0.000 claims description 17
- 125000004018 acid anhydride group Chemical group 0.000 claims description 13
- 125000003277 amino group Chemical group 0.000 claims description 13
- 125000003700 epoxy group Chemical group 0.000 claims description 13
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 claims description 9
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 9
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 9
- 229920000098 polyolefin Polymers 0.000 claims description 9
- 229920005992 thermoplastic resin Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 26
- 125000004432 carbon atom Chemical group C* 0.000 description 41
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 21
- 230000001681 protective effect Effects 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 19
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 239000011521 glass Substances 0.000 description 16
- 150000001875 compounds Chemical class 0.000 description 12
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000005984 hydrogenation reaction Methods 0.000 description 9
- 150000001451 organic peroxides Chemical class 0.000 description 9
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 9
- 238000003786 synthesis reaction Methods 0.000 description 9
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 239000006087 Silane Coupling Agent Substances 0.000 description 7
- 229920005601 base polymer Polymers 0.000 description 7
- 229920001400 block copolymer Polymers 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 125000005386 organosiloxy group Chemical group 0.000 description 7
- 125000004665 trialkylsilyl group Chemical group 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- 150000001339 alkali metal compounds Chemical class 0.000 description 6
- 125000003710 aryl alkyl group Chemical group 0.000 description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 239000004711 α-olefin Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 229920006132 styrene block copolymer Polymers 0.000 description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 4
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical group C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 229920013716 polyethylene resin Polymers 0.000 description 4
- 229920005996 polystyrene-poly(ethylene-butylene)-polystyrene Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 125000001118 alkylidene group Chemical group 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229920001038 ethylene copolymer Polymers 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- RYPKRALMXUUNKS-UHFFFAOYSA-N 2-Hexene Natural products CCCC=CC RYPKRALMXUUNKS-UHFFFAOYSA-N 0.000 description 2
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 2
- DIGKGWWSMMWBIZ-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]-n,n-bis(trimethylsilyl)propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN([Si](C)(C)C)[Si](C)(C)C DIGKGWWSMMWBIZ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical group [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GEHOXNCATGGWEH-UHFFFAOYSA-N [Li]CCCN1[Si](C)(C)CC[Si]1(C)C Chemical compound [Li]CCCN1[Si](C)(C)CC[Si]1(C)C GEHOXNCATGGWEH-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- UAHWPYUMFXYFJY-UHFFFAOYSA-N beta-myrcene Chemical compound CC(C)=CCCC(=C)C=C UAHWPYUMFXYFJY-UHFFFAOYSA-N 0.000 description 2
- 238000012661 block copolymerization Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920005629 polypropylene homopolymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- NSYRAUUZGRPOHS-BQYQJAHWSA-N (3E)-2-methylocta-1,3-diene Chemical compound CCCC\C=C\C(C)=C NSYRAUUZGRPOHS-BQYQJAHWSA-N 0.000 description 1
- AHAREKHAZNPPMI-AATRIKPKSA-N (3e)-hexa-1,3-diene Chemical compound CC\C=C\C=C AHAREKHAZNPPMI-AATRIKPKSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- APQIUTYORBAGEZ-UHFFFAOYSA-N 1,1-dibromoethane Chemical compound CC(Br)Br APQIUTYORBAGEZ-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- YGHPXZVBOJPPSX-UHFFFAOYSA-N 1-(4-ethenylphenyl)-n-methyl-n-trimethylsilylmethanamine Chemical compound C[Si](C)(C)N(C)CC1=CC=C(C=C)C=C1 YGHPXZVBOJPPSX-UHFFFAOYSA-N 0.000 description 1
- WHFHDVDXYKOSKI-UHFFFAOYSA-N 1-ethenyl-4-ethylbenzene Chemical compound CCC1=CC=C(C=C)C=C1 WHFHDVDXYKOSKI-UHFFFAOYSA-N 0.000 description 1
- UVHXEHGUEKARKZ-UHFFFAOYSA-N 1-ethenylanthracene Chemical compound C1=CC=C2C=C3C(C=C)=CC=CC3=CC2=C1 UVHXEHGUEKARKZ-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- WWYKARMEFKDXSX-UHFFFAOYSA-N 2,3-diethylterephthalic acid Chemical compound CCC1=C(C(O)=O)C=CC(C(O)=O)=C1CC WWYKARMEFKDXSX-UHFFFAOYSA-N 0.000 description 1
- RYRZSXJVEILFRR-UHFFFAOYSA-N 2,3-dimethylterephthalic acid Chemical compound CC1=C(C)C(C(O)=O)=CC=C1C(O)=O RYRZSXJVEILFRR-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- ZNHPPXDUJKXBNM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)hexane Chemical compound CC(C)(C)OOC(C)CCC(C)OOC(C)(C)C ZNHPPXDUJKXBNM-UHFFFAOYSA-N 0.000 description 1
- VUXLUEVJQUSPLA-UHFFFAOYSA-N 2-(4-ethenylphenyl)-n,n-bis(trimethylsilyl)ethanamine Chemical compound C[Si](C)(C)N([Si](C)(C)C)CCC1=CC=C(C=C)C=C1 VUXLUEVJQUSPLA-UHFFFAOYSA-N 0.000 description 1
- BIOCRZSYHQYVSG-UHFFFAOYSA-N 2-(4-ethenylphenyl)-n,n-diethylethanamine Chemical compound CCN(CC)CCC1=CC=C(C=C)C=C1 BIOCRZSYHQYVSG-UHFFFAOYSA-N 0.000 description 1
- JIDHFKQYRQEGCQ-UHFFFAOYSA-N 2-[diethoxy(methyl)silyl]-n,n-bis(trimethylsilyl)ethanamine Chemical compound CCO[Si](C)(OCC)CCN([Si](C)(C)C)[Si](C)(C)C JIDHFKQYRQEGCQ-UHFFFAOYSA-N 0.000 description 1
- ZPOBBCVISKKFBH-UHFFFAOYSA-N 2-[dimethoxy(methyl)silyl]-n,n-bis(trimethylsilyl)ethanamine Chemical compound CO[Si](C)(OC)CCN([Si](C)(C)C)[Si](C)(C)C ZPOBBCVISKKFBH-UHFFFAOYSA-N 0.000 description 1
- HFJJBKWBMFSLSG-UHFFFAOYSA-N 2-[ethoxy(dimethyl)silyl]-n,n-bis(trimethylsilyl)ethanamine Chemical compound CCO[Si](C)(C)CCN([Si](C)(C)C)[Si](C)(C)C HFJJBKWBMFSLSG-UHFFFAOYSA-N 0.000 description 1
- GJWWFCMRINZTKF-UHFFFAOYSA-N 2-[methoxy(dimethyl)silyl]-n,n-bis(trimethylsilyl)ethanamine Chemical compound CO[Si](C)(C)CCN([Si](C)(C)C)[Si](C)(C)C GJWWFCMRINZTKF-UHFFFAOYSA-N 0.000 description 1
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 description 1
- CBDWNRVMCWOYEK-UHFFFAOYSA-N 2-triethoxysilyl-n,n-bis(trimethylsilyl)ethanamine Chemical compound CCO[Si](OCC)(OCC)CCN([Si](C)(C)C)[Si](C)(C)C CBDWNRVMCWOYEK-UHFFFAOYSA-N 0.000 description 1
- RHAYEZASBOVCGH-UHFFFAOYSA-N 2-trimethoxysilyl-n,n-bis(trimethylsilyl)ethanamine Chemical compound CO[Si](OC)(OC)CCN([Si](C)(C)C)[Si](C)(C)C RHAYEZASBOVCGH-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- ZZNRMMYTKJBVPD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]-n,n-dimethylpropan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN(C)C ZZNRMMYTKJBVPD-UHFFFAOYSA-N 0.000 description 1
- YYYNTRZZIMLYDW-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]-n-methyl-n-trimethylsilylpropan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN(C)[Si](C)(C)C YYYNTRZZIMLYDW-UHFFFAOYSA-N 0.000 description 1
- JRFVCFVEJBDLDT-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]-n,n-bis(trimethylsilyl)propan-1-amine Chemical compound CO[Si](C)(OC)CCCN([Si](C)(C)C)[Si](C)(C)C JRFVCFVEJBDLDT-UHFFFAOYSA-N 0.000 description 1
- JXNGSNLOFNAVJI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]-n,n-dimethylpropan-1-amine Chemical compound CO[Si](C)(OC)CCCN(C)C JXNGSNLOFNAVJI-UHFFFAOYSA-N 0.000 description 1
- HBCGVXJJWUVENV-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]-n-methyl-n-trimethylsilylpropan-1-amine Chemical compound CO[Si](C)(OC)CCCN(C)[Si](C)(C)C HBCGVXJJWUVENV-UHFFFAOYSA-N 0.000 description 1
- ZIJAQDFHWMLVRT-UHFFFAOYSA-N 3-[ethoxy(dimethyl)silyl]-n,n-dimethylpropan-1-amine Chemical compound CCO[Si](C)(C)CCCN(C)C ZIJAQDFHWMLVRT-UHFFFAOYSA-N 0.000 description 1
- BHXXRWQTAFOYIX-UHFFFAOYSA-N 3-[ethoxy(dimethyl)silyl]-n-methyl-n-trimethylsilylpropan-1-amine Chemical compound CCO[Si](C)(C)CCCN(C)[Si](C)(C)C BHXXRWQTAFOYIX-UHFFFAOYSA-N 0.000 description 1
- GUFBOKVOZQUQOJ-UHFFFAOYSA-N 3-[methoxy(dimethyl)silyl]-n,n-bis(trimethylsilyl)propan-1-amine Chemical compound CO[Si](C)(C)CCCN([Si](C)(C)C)[Si](C)(C)C GUFBOKVOZQUQOJ-UHFFFAOYSA-N 0.000 description 1
- BNNQAWRZJYZWDX-UHFFFAOYSA-N 3-[methoxy(dimethyl)silyl]-n,n-dimethylpropan-1-amine Chemical compound CO[Si](C)(C)CCCN(C)C BNNQAWRZJYZWDX-UHFFFAOYSA-N 0.000 description 1
- AVBUBIQDYBSJLK-UHFFFAOYSA-N 3-[methoxy(dimethyl)silyl]-n-methyl-n-trimethylsilylpropan-1-amine Chemical compound CO[Si](C)(C)CCCN(C)[Si](C)(C)C AVBUBIQDYBSJLK-UHFFFAOYSA-N 0.000 description 1
- RKMBVCPRZVPTSF-UHFFFAOYSA-N 3-ethenyl-n,n-bis(trimethylsilyl)aniline Chemical compound C[Si](C)(C)N([Si](C)(C)C)C1=CC=CC(C=C)=C1 RKMBVCPRZVPTSF-UHFFFAOYSA-N 0.000 description 1
- YPVPQMCSLFDIKA-UHFFFAOYSA-N 3-ethylpent-1-ene Chemical compound CCC(CC)C=C YPVPQMCSLFDIKA-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- SLSKAIZCBJQHFI-UHFFFAOYSA-N 3-triethoxysilyl-n,n-bis(trimethylsilyl)propan-1-amine Chemical compound CCO[Si](OCC)(OCC)CCCN([Si](C)(C)C)[Si](C)(C)C SLSKAIZCBJQHFI-UHFFFAOYSA-N 0.000 description 1
- JOGZENPUTBJZBI-UHFFFAOYSA-N 3-trimethoxysilyl-n,n-bis(trimethylsilyl)propan-1-amine Chemical compound CO[Si](OC)(OC)CCCN([Si](C)(C)C)[Si](C)(C)C JOGZENPUTBJZBI-UHFFFAOYSA-N 0.000 description 1
- OCTVDLUSQOJZEK-UHFFFAOYSA-N 4,5-diethylocta-1,3-diene Chemical compound CCCC(CC)C(CC)=CC=C OCTVDLUSQOJZEK-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- CFCBFJBLDCNGDH-UHFFFAOYSA-N 4-ethenyl-n,n-bis(trimethylsilyl)aniline Chemical compound C[Si](C)(C)N([Si](C)(C)C)C1=CC=C(C=C)C=C1 CFCBFJBLDCNGDH-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- VZSCYDNKUMPKGV-UHFFFAOYSA-N 4-methyl-n-(3-trimethoxysilylpropyl)pentan-2-imine Chemical compound CO[Si](OC)(OC)CCCN=C(C)CC(C)C VZSCYDNKUMPKGV-UHFFFAOYSA-N 0.000 description 1
- UGWOAPBVIGCNOV-UHFFFAOYSA-N 5-ethenyldec-5-ene Chemical compound CCCCC=C(C=C)CCCC UGWOAPBVIGCNOV-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- JFRDOJYTMNTDBO-UHFFFAOYSA-N C[Si](C)(C)C(C)O[Si](C)(C)CCCN Chemical compound C[Si](C)(C)C(C)O[Si](C)(C)CCCN JFRDOJYTMNTDBO-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- VIZORQUEIQEFRT-UHFFFAOYSA-N Diethyl adipate Chemical compound CCOC(=O)CCCCC(=O)OCC VIZORQUEIQEFRT-UHFFFAOYSA-N 0.000 description 1
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- HXTGGPKOEKKUQO-VQHVLOKHSA-N N-BENZYLIDENEMETHYLAMINE Chemical compound C\N=C\C1=CC=CC=C1 HXTGGPKOEKKUQO-VQHVLOKHSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- XOMCQBNMWFKXMM-UHFFFAOYSA-N [Li]CC(C)(C)CN1[Si](C)(C)CC[Si]1(C)C Chemical compound [Li]CC(C)(C)CN1[Si](C)(C)CC[Si]1(C)C XOMCQBNMWFKXMM-UHFFFAOYSA-N 0.000 description 1
- ZBXLIIZBPBIYSE-UHFFFAOYSA-N [Li]CCN1[Si](C)(C)CC[Si]1(C)C Chemical compound [Li]CCN1[Si](C)(C)CC[Si]1(C)C ZBXLIIZBPBIYSE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- VYBREYKSZAROCT-UHFFFAOYSA-N alpha-myrcene Natural products CC(=C)CCCC(=C)C=C VYBREYKSZAROCT-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- FQEKAFQSVPLXON-UHFFFAOYSA-N butyl(trichloro)silane Chemical compound CCCC[Si](Cl)(Cl)Cl FQEKAFQSVPLXON-UHFFFAOYSA-N 0.000 description 1
- YMLFYGFCXGNERH-UHFFFAOYSA-K butyltin trichloride Chemical compound CCCC[Sn](Cl)(Cl)Cl YMLFYGFCXGNERH-UHFFFAOYSA-K 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 125000005708 carbonyloxy group Chemical group [*:2]OC([*:1])=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- UVEWQKMPXAHFST-SDNWHVSQSA-N chembl1256376 Chemical compound C=1C=CC=CC=1/C=N/C1=CC=CC=C1 UVEWQKMPXAHFST-SDNWHVSQSA-N 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cis-cyclohexene Natural products C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- UIPVMGDJUWUZEI-UHFFFAOYSA-N copper;selanylideneindium Chemical compound [Cu].[In]=[Se] UIPVMGDJUWUZEI-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- MKNXBRLZBFVUPV-UHFFFAOYSA-L cyclopenta-1,3-diene;dichlorotitanium Chemical compound Cl[Ti]Cl.C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 MKNXBRLZBFVUPV-UHFFFAOYSA-L 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical compound C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- CONHAJWVOAJZGC-UHFFFAOYSA-N ethene;oxiran-2-ylmethyl 2-methylprop-2-enoate Chemical compound C=C.CC(=C)C(=O)OCC1CO1 CONHAJWVOAJZGC-UHFFFAOYSA-N 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910000103 lithium hydride Inorganic materials 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JFTBTTPUYRGXDG-UHFFFAOYSA-N methyl violet Chemical compound Cl.C1=CC(=NC)C=CC1=C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 JFTBTTPUYRGXDG-UHFFFAOYSA-N 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- 125000005699 methyleneoxy group Chemical group [H]C([H])([*:1])O[*:2] 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- AQIQPUUNTCVHBS-UHFFFAOYSA-N n,n-dimethyl-3-triethoxysilylpropan-1-amine Chemical compound CCO[Si](OCC)(OCC)CCCN(C)C AQIQPUUNTCVHBS-UHFFFAOYSA-N 0.000 description 1
- QIOYHIUHPGORLS-UHFFFAOYSA-N n,n-dimethyl-3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN(C)C QIOYHIUHPGORLS-UHFFFAOYSA-N 0.000 description 1
- CNBZTHQYUOSCDJ-UHFFFAOYSA-N n-(3-triethoxysilylpropyl)butan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC CNBZTHQYUOSCDJ-UHFFFAOYSA-N 0.000 description 1
- PHYRCSSYBSJTMI-UHFFFAOYSA-N n-(3-triethoxysilylpropyl)ethanimine Chemical compound CCO[Si](OCC)(OCC)CCCN=CC PHYRCSSYBSJTMI-UHFFFAOYSA-N 0.000 description 1
- MPKNGASSKGJBSA-UHFFFAOYSA-N n-(3-triethoxysilylpropyl)propan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)C MPKNGASSKGJBSA-UHFFFAOYSA-N 0.000 description 1
- JXQJKHLMJOUZAP-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)ethanimine Chemical compound CO[Si](OC)(OC)CCCN=CC JXQJKHLMJOUZAP-UHFFFAOYSA-N 0.000 description 1
- CTOLUBVUNDDDOW-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)propan-2-imine Chemical compound CO[Si](OC)(OC)CCCN=C(C)C CTOLUBVUNDDDOW-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- QJNUYXYTHYWZDT-UHFFFAOYSA-N n-[3-[diethoxy(methyl)silyl]propyl]butan-2-imine Chemical compound CCO[Si](C)(OCC)CCCN=C(C)CC QJNUYXYTHYWZDT-UHFFFAOYSA-N 0.000 description 1
- KZBHWTCDBOCBLM-UHFFFAOYSA-N n-[3-[diethoxy(methyl)silyl]propyl]ethanimine Chemical compound CCO[Si](C)(OCC)CCCN=CC KZBHWTCDBOCBLM-UHFFFAOYSA-N 0.000 description 1
- HUKAMZCUIYKFAE-UHFFFAOYSA-N n-[3-[diethoxy(methyl)silyl]propyl]propan-2-imine Chemical compound CCO[Si](C)(OCC)CCCN=C(C)C HUKAMZCUIYKFAE-UHFFFAOYSA-N 0.000 description 1
- JLDFJBLNJLNBLF-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]butan-2-imine Chemical compound CCC(C)=NCCC[Si](C)(OC)OC JLDFJBLNJLNBLF-UHFFFAOYSA-N 0.000 description 1
- VQCKCFFHGHWLLI-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]ethanimine Chemical compound CO[Si](C)(OC)CCCN=CC VQCKCFFHGHWLLI-UHFFFAOYSA-N 0.000 description 1
- ZNQLBMLCIRWTNF-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]propan-2-imine Chemical compound CO[Si](C)(OC)CCCN=C(C)C ZNQLBMLCIRWTNF-UHFFFAOYSA-N 0.000 description 1
- ZZCCYXQORKUPMU-UHFFFAOYSA-N n-[3-[ethoxy(dimethyl)silyl]propyl]butan-2-imine Chemical compound CCO[Si](C)(C)CCCN=C(C)CC ZZCCYXQORKUPMU-UHFFFAOYSA-N 0.000 description 1
- CWTDXEAFFFEKSM-UHFFFAOYSA-N n-[3-[ethoxy(dimethyl)silyl]propyl]ethanimine Chemical compound CCO[Si](C)(C)CCCN=CC CWTDXEAFFFEKSM-UHFFFAOYSA-N 0.000 description 1
- UISZYLCKWPZORH-UHFFFAOYSA-N n-[3-[methoxy(dimethyl)silyl]propyl]-4-methylpentan-2-imine Chemical compound CO[Si](C)(C)CCCN=C(C)CC(C)C UISZYLCKWPZORH-UHFFFAOYSA-N 0.000 description 1
- PQYOXFNLMMADSB-UHFFFAOYSA-N n-[3-[methoxy(dimethyl)silyl]propyl]ethanimine Chemical compound CO[Si](C)(C)CCCN=CC PQYOXFNLMMADSB-UHFFFAOYSA-N 0.000 description 1
- OBRIAZPSMDSKOY-UHFFFAOYSA-N n-[3-[methoxy(dimethyl)silyl]propyl]propan-2-imine Chemical compound CO[Si](C)(C)CCCN=C(C)C OBRIAZPSMDSKOY-UHFFFAOYSA-N 0.000 description 1
- IADUISXJUXDNFB-UHFFFAOYSA-N n-butyl-1-phenylmethanimine Chemical compound CCCCN=CC1=CC=CC=C1 IADUISXJUXDNFB-UHFFFAOYSA-N 0.000 description 1
- IIVYBNBDIDWPQV-UHFFFAOYSA-N n-ethyl-1-phenylmethanimine Chemical compound CCN=CC1=CC=CC=C1 IIVYBNBDIDWPQV-UHFFFAOYSA-N 0.000 description 1
- SSCPGWQSPOOGNY-UHFFFAOYSA-N n-methyl-3-triethoxysilyl-n-trimethylsilylpropan-1-amine Chemical compound CCO[Si](OCC)(OCC)CCCN(C)[Si](C)(C)C SSCPGWQSPOOGNY-UHFFFAOYSA-N 0.000 description 1
- ZGHJEFHZUJECRJ-UHFFFAOYSA-N n-methyl-3-trimethoxysilyl-n-trimethylsilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN(C)[Si](C)(C)C ZGHJEFHZUJECRJ-UHFFFAOYSA-N 0.000 description 1
- AIKVCUNQWYTVTO-UHFFFAOYSA-N nicardipine hydrochloride Chemical compound Cl.COC(=O)C1=C(C)NC(C)=C(C(=O)OCCN(C)CC=2C=CC=CC=2)C1C1=CC=CC([N+]([O-])=O)=C1 AIKVCUNQWYTVTO-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 150000003902 salicylic acid esters Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000001981 tert-butyldimethylsilyl group Chemical group [H]C([H])([H])[Si]([H])(C([H])([H])[H])[*]C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- IEXRMSFAVATTJX-UHFFFAOYSA-N tetrachlorogermane Chemical compound Cl[Ge](Cl)(Cl)Cl IEXRMSFAVATTJX-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- KBMBVTRWEAAZEY-UHFFFAOYSA-N trisulfane Chemical compound SSS KBMBVTRWEAAZEY-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
- C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a sealing material and a solar cell module using the same. More specifically, the present invention relates to a sealing material that is easy to form a module and is excellent in transparency, heat resistance, adhesion, and the like.
- Solar cell modules generally protect solar cell elements such as silicon, gallium-arsenic, copper-indium-selenium with an upper transparent protective material and a lower substrate protective material, and fix the solar cell element and protective material with a sealing material. And packaged. For this reason, as a solar cell element sealing material, transparency, heat resistance, and adhesiveness with upper and lower protective materials, such as glass and a metal, are requested
- an ethylene / vinyl acetate copolymer having a high vinyl acetate content is used from the viewpoint of flexibility and transparency. Since this material lacks heat resistance and adhesiveness, it is necessary to crosslink using an organic peroxide or a silane coupling agent. For this reason, in order to manufacture a solar cell module, a sheet of an ethylene / vinyl acetate copolymer blended with these additives is prepared and temporarily bonded to the solar cell element in a laminator over several minutes to ten and several minutes.
- the present invention has been made in view of such problems of the prior art, and the problem is that crosslinking with an organic peroxide is not required, and thus the production efficiency of the solar cell module is remarkably increased.
- Another object of the present invention is to provide an alternative material that can be improved and has excellent characteristics as a solar cell element sealing material.
- the present inventors have found that the above-mentioned problems can be achieved by the sealing material shown below, and have completed the present invention. That is, according to the present invention, the following sealing materials and the like are provided.
- component polypropylene
- component hydrogenated diene polymer
- component a polymer having at least one functional group selected from the following functional group X
- a polymer (functional group-containing polymer) different from the component (ii) is used as a constituent component, the component (i) is 0 to 60 parts by mass, the component (ii) is 40 to 100 parts by mass (total amount is 100 masses).
- Part a sealing material containing 1 to 100 parts by mass of the component (iii).
- the component (ii) is a polymer including the following polymer block A and the following polymer block B, and at least 80% of the double bond of the following conjugated diene compound unit constituting the (ii) component is hydrogen.
- Polymer block A Polymer block containing 50% by mass or more of an aromatic vinyl compound unit
- Polymer block B Containing 50% by mass or more of a conjugated diene compound unit, its 1,2-bond content and 3 , 4- Polymer block in which the total content of bonds is in the range of 30-90%
- the element sealing material of the present invention is excellent in transparency and heat resistance, and without using an organic peroxide, a silane coupling agent, or the like, with solar cell elements, upper and lower protective materials such as glass and metal, and the like. Excellent adhesiveness.
- the sealing material of the present invention comprises (i) component: polypropylene, (ii) component: hydrogenated diene polymer, and (iii) component: a polymer having a specific functional group (functional group-containing polymer).
- component polypropylene
- component hydrogenated diene polymer
- component a polymer having a specific functional group (functional group-containing polymer).
- the component (i) is contained in an amount of 0 to 60 parts by mass
- the component (ii) is contained in an amount of 1 to 100 parts by mass of the component (iii) with respect to 40 to 100 parts by mass (total amount 100 parts by mass).
- each component will be described.
- Polypropylene (component (i)) The sealing material of the present invention contains polypropylene (hereinafter sometimes referred to as “component (i)”) as a constituent component.
- component (i) polypropylene
- heat resistance and molding processability tend to be improved.
- the polypropylene used in the present invention may be homopolypropylene, block polypropylene, random polypropylene, propylene / ⁇ -olefin copolymer, propylene / ethylene copolymer, propylene / butene copolymer, propylene / ethylene / butene copolymer, etc. Good.
- the weight average molecular weight is preferably 10,000 or more, more preferably 40,000 or more, and particularly preferably 80,000 or more.
- the "weight average molecular weight” here means the weight average molecular weight in terms of polymethyl methacrylate measured by gel permeation chromatography (GPC) using hexafluoroisopropanol as a solvent.
- the melting point of the component (i) is not particularly limited, but is preferably 120 ° C. or higher, and more preferably 140 ° C. or higher.
- the value measured with the differential scanning calorimeter (DSC) shall be shown.
- a component can be manufactured by a conventionally well-known polypropylene manufacturing method. Specific examples include radical polymerization and catalytic polymerization.
- the content of the component (i) needs to be 0 to 60 parts by mass and preferably 5 to 60 parts by mass with respect to 100 parts by mass of the total amount of the components (i) and (ii).
- component (i) is not present, heat resistance and moldability tend to be inferior.
- the amount exceeds 60 parts by mass the amount of the hydrogenated diene polymer (component (ii)) is small, so that it becomes hard and the sealing performance of the solar cell element is poor.
- the sealing material of the present invention contains, in addition to polypropylene (component (i)), a hydrogenated diene polymer (hereinafter sometimes referred to as “component (ii)”) as a constituent component. (Ii) By making a component into a component, it becomes flexible and has excellent sealing properties.
- the hydrogenated diene polymer (component (ii)) used in the present invention preferably contains a repeating unit derived from an aromatic vinyl compound and a repeating unit derived from a conjugated diene compound.
- aromatic vinyl compound examples include styrene, tert-butyl styrene, ⁇ -methyl styrene, p-methyl styrene, p-ethyl styrene, divinyl benzene, 1,1-diphenyl styrene, vinyl naphthalene. Vinyl anthracene, N, N-diethyl-p-aminoethylstyrene, vinylpyridine and the like.
- a conjugated diene polymer containing a repeating unit derived from styrene or tert-butylstyrene as a base polymer from the viewpoint of easy availability of monomers as raw materials and polymerizability.
- conjugated diene compound examples include 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, and 2-methyl-1,3-octadiene. 1,3-hexadiene, 1,3-cyclohexadiene, 4,5-diethyl-1,3-octadiene, 3-butyl-1,3-octadiene, myrcene and chloroprene.
- a conjugated diene polymer containing a repeating unit derived from 1,3-butadiene or isoprene is preferable from the viewpoint of availability of the monomer as a raw material and polymerizability.
- the mass ratio of aromatic vinyl compound: conjugated diene compound is preferably 3:97 to 60:40.
- the glass transition point of the component (ii) becomes too high and becomes hard and tends to have poor sealing properties.
- Examples of the polymer including the polymer block A and the polymer block B of (ii) include (A)-(B), [(A)-(B)] x -Y, (A)-(B )-(A), [(A)-(B)-(A)] x -Y, (A)-(B)-(A)-(B), (B)-(A)-(B) -(A), [(A)-(B)-(A)-(B)] x -Y, (A)-(B)-(A)-(B)-(A) and [(A) Examples thereof include block copolymers bonded to structures such as-(B)-(A)-(B)-(A)] x -Y and [(B)-(A)] x -Y. (However, (A): Polymer block A, (B): Polymer block B, x: integer of 2 or more, Y: coupling agent residue)
- the block copolymer containing two or more types of blocks as described above may be a tapered type or a random type in which the content of the aromatic vinyl compound or the conjugated diene compound continuously changes in the block.
- the “coupling agent” for coupling the polymer block include methyldichlorosilane, methyltrichlorosilane, butyltrichlorosilane, tetrachlorosilane, dibromoethane, tetrachlorotin, butyltrichlorotin, tetrachlorogermanium, bis Halogen compounds such as (trichlorosilyl) ethane; epoxy compounds such as epoxidized soybean oil; carbonyl compounds such as diethyl adipate, dimethyl adipate, dimethyl terephthalic acid and diethyl terephthalic acid; polyvinyl compounds such as divinylbenzene; Can be mentioned.
- the component (ii) is a polymer in which at least 80% of the double bond of the conjugated diene compound unit is hydrogenated.
- the upper limit of the hydrogenation rate is not particularly limited, but from the viewpoint of obtaining a material excellent in weather resistance and heat resistance, a polymer in which 90% or more of the double bonds are hydrogenated is preferable. It is more preferable that the polymer is hydrogenated in an amount of at least%.
- the component (ii) may be a polymer into which at least one functional group selected from the functional group group X is introduced.
- a functional group By introducing a functional group, the adhesiveness with upper and lower protective materials such as glass and metal tends to be improved.
- the component (ii) is preferably a polymer having an average of 0.01 to 100 (pieces / molecule) of the functional groups, and has an average of 0.1 to 10 (pieces / molecule). More preferably, it is a polymer. If the number of functional groups is less than 0.01 (pieces / molecule) on average, the adhesion with upper and lower protective materials such as glass and metal tends to be lowered. On the other hand, when the number of functional groups exceeds 100 (pieces / molecule), there is a possibility that a problem that molding processability deteriorates may occur.
- the molecular weight of component (ii) is not particularly limited, but the weight average molecular weight is preferably 30,000 to 2,000,000, more preferably 40,000 to 1,000,000, and more preferably 50,000 to 500,000. Particularly preferred. If the weight average molecular weight is less than 30,000, it is not preferable because the strength and dimensional stability of the solar cell element sealing material tend to be lowered. On the other hand, if the weight average molecular weight exceeds 2,000,000, the melt viscosity of the component (ii) becomes too high, and there is a tendency for the workability and productivity of the solar cell element sealing material to decrease, which is not preferable.
- “weight average molecular weight” means a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).
- the component can be produced, for example, by the method described in any of (a) to (e) below.
- Production method (a) is a method in which a conjugated diene compound is obtained alone, or a conjugated diene compound and an aromatic vinyl compound are block copolymerized in the presence of an organic alkali metal compound, and the copolymer is hydrogenated. is there.
- the resulting hydrogenated diene polymer is added to a (meth) acryloyl group-containing compound represented by the following general formula (1), an epoxy group-containing compound represented by the following general formula (2), and maleic anhydride. At least one selected from the group consisting of may be reacted in a solution or in a kneader such as an extruder.
- R 1 is a hydrogen atom or a methyl group
- R 2 is a hydrocarbon group having 1 to 20 carbon atoms which may contain a single bond or a hetero atom
- X 1 is an alkoxysilyl group or a hydroxyl group.
- q represents an integer of 1 to 3 in the case of an amino group, and 1 in the case of other functional groups.
- R 3 represents an alkenyl group having 2 to 18 carbon atoms
- R 4 represents a carbonyloxy group, a methyleneoxy group or a phenyleneoxy group.
- Examples of the polymer obtained by the production method (a) include (maleic anhydride-modified) styrene-ethylene / butylene-styrene block copolymer, (maleic anhydride-modified) styrene-ethylene / propylene-styrene block copolymer, (Maleic anhydride modified) styrene-ethylene / butylene / propylene / styrene block copolymer, epoxy modified styrene / ethylene / butylene / styrene block copolymer, epoxy modified styrene / ethylene / propylene / styrene block copolymer, epoxy modified Examples thereof include styrene-ethylene / butylene / propylene / styrene block copolymers.
- the notation of (maleic anhydride-modified) styrene-ethylene / butylene-styrene block copolymer, etc. refers to styrene-ethylene / butylene-styrene block copolymer and maleic anhydride-modified styrene-ethylene / butylene-styrene block copolymer. It shall refer to both of the polymers.
- R 5 and R 6 are both trialkylsilyl groups having 3 to 18 carbon atoms, or one of them is the above trialkylsilyl group, the other is an alkyl group having 1 to 20 carbon atoms, carbon R 6 represents an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms or an organosiloxy group having 1 to 100 carbon atoms, and R 7 represents an alkylene group or alkylidene group having 1 to 20 carbon atoms.
- R 7 is an alkylene group or alkylidene group having 1 to 20 carbon atoms
- R 8 is an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or 7 to 20 carbon atoms. Or an organosiloxy group having 1 to 100 carbon atoms.
- Examples of the organic alkali metal compound represented by the general formula (3) or (4) include 3-lithio-1- [N, N-bis (trimethylsilyl)] aminopropane, 2-lithio-1- [N, N-bis (trimethylsilyl)] aminoethane, 3-lithio-2,2-dimethyl-1- [N, N-bis (trimethylsilyl)] aminopropane, 2,2,5,5-tetramethyl-1- (3- Lithiopropyl) -1-aza-2,5-disilacyclopentane, 2,2,5,5-tetramethyl-1- (3-lithio-2,2-dimethyl-propyl) -1-aza-2, 5-disilacyclopentane, 2,2,5,5-tetramethyl-1- (2-lithioethyl) -1-aza-2,5-disilacyclopentane, 3-lithio-1- [N- (tert -Butyl-dimethylsilyl -N- trimethylsilyl
- R 9 and R 10 are both trialkylsilyl groups having 3 to 18 carbon atoms, or one of them is the above trialkylsilyl group, the other is an alkyl group having 1 to 20 carbon atoms, carbon An aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or an organosiloxy group having 1 to 100 carbon atoms, and n represents an integer of 1 to 3.
- R 9 and R 10 are both trialkylsilyl groups having 3 to 18 carbon atoms, or one of them is the above trialkylsilyl group, the other is an alkyl group having 1 to 20 carbon atoms, carbon An aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms or an organosiloxy group having 1 to 100 carbon atoms, R 11 is an alkylene group or alkylidene group having 1 to 20 carbon atoms, and n is an integer of 1 to 3. Show. ]
- Examples of the unsaturated monomer represented by the general formula (5) or (6) include p- [N, N-bis (trimethylsilyl) amino] styrene, p- [N, N-bis (trimethylsilyl) amino. Methyl] styrene, p- ⁇ 2- [N, N-bis (trimethylsilyl) amino] ethyl ⁇ styrene, m- [N, N-bis (trimethylsilyl) amino] styrene, p- (N-methyl-N-trimethylsilylamino) And styrene and p- (N-methyl-N-trimethylsilylaminomethyl) styrene.
- Production method (d) In the production method (d), a conjugated diene compound alone or a block copolymer of a conjugated diene compound and an aromatic vinyl compound in the presence of an organic alkali metal compound is used. In this method, after the alkoxysilane compound represented by the formula (7) is reacted, the polymer is hydrogenated.
- R 12 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or an organosiloxy group having 1 to 100 carbon atoms. If R 12 is plural, each R 12 may be a functional group different even for the same functional group.
- R 13 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms. When there are a plurality of OR 13 s , each R 13 may be the same functional group or a different functional group.
- R 14 represents a substituent having a polar group containing an N atom. If R 14 is plural, each R 14 may be a different functional group be the same functional group. Each R 14 may be an independent substituent or may form a cyclic structure. m and n each represents an integer of 1 to 3. However, the sum of m and n is an integer of 1 to 4. ]
- alkoxysilane compound represented by the general formula (7) examples include N, N-bis (trimethylsilyl) aminopropyltrimethoxysilane, N, N-bis (trimethylsilyl) aminopropyltriethoxysilane, and N, N-bis.
- N-methyl-N-trimethylsilylaminopropyltriethoxysilane N-methyl-N-trimethylsilylaminopropyldimethylethoxysilane, N-methyl-N-trimethylsilylaminopropyldimethylmethoxysilane, N-methyl-N-trimethylsilylaminopropylmethyldi Ethoxysilane, N-methyl-N-trimethylsilylaminopropylmethyldimethoxysilane, N, N-dimethylaminopropyltrimethoxysilane, N, N-dimethylaminopropyltriethoxysilane, N, N-dimethylaminopropyldimethylethoxysilane, N , N-dimethylaminopropyldimethylmethoxysilane, N, N-dimethylaminopropylmethyldiethoxysilane, N, N-dimethylaminopropylmethyldimethoxy
- Manufacturing method (e) In the production method (e), a conjugated diene compound is used alone, or a conjugated diene compound and an aromatic vinyl compound are block copolymerized in the presence of an organic alkali metal compound, and the resulting copolymer has an active site as an epoxy.
- This is a method in which a compound, a ketone compound, or a nitrogen-containing compound other than the above general formulas (3) to (7) is reacted, and then the polymer is hydrogenated.
- Epoxy compounds include ethylene oxide, propylene oxide, etc.
- ketone compounds include acetone, benzophenone, etc.
- nitrogen-containing compounds other than the above general formulas (3) to (7) are represented by the following general formula (8) The nitrogen-containing compound shown etc. can be mentioned.
- R 15 and R 16 are each the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or An organosiloxy group having 1 to 100 carbon atoms
- R 17 is a hydrogen atom, a trialkylsilyl group having 3 to 18 carbon atoms, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or 7 to 20 carbon atoms. Or an organosiloxy group having 1 to 100 carbon atoms.
- R 15 and R 16 are each the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or An organosiloxy group having 1 to 100 carbon atoms
- R 17 is a hydrogen atom, a trialkylsilyl
- Examples of the nitrogen-containing compound represented by the general formula (8) include N-benzylidenemethylamine, N-benzylideneethylamine, N-benzylidenebutylamine, and N-benzylideneaniline.
- the “functional group-containing polymer” means a polymer having at least one functional group selected from the following functional group group X and different from the component (ii). . That is, a polymer in which the functional group is introduced into a polymer serving as a basic skeleton (hereinafter sometimes referred to as “base polymer”) can be used as the component (iii). By introducing such a reactive functional group, it is possible to adhere to upper and lower protective materials such as a solar cell element and glass.
- a functional group-containing olefin polymer can be used as the functional group-containing polymer in the present invention.
- the “functional group-containing olefin polymer” means a polymer in which an olefin polymer is used as a base polymer and the functional group is introduced into the base polymer.
- the “olefin polymer” serving as the base polymer of the component is a polymer containing a repeating unit derived from an olefin compound (that is, ethylene and / or ⁇ -olefin). Specific examples include polymers obtained by polymerizing one or more ethylene and / or ⁇ -olefins. There is no restriction
- the base polymer of component (iii) may include a repeating unit derived from a compound other than the olefin compound.
- ⁇ -olefin examples include propene (hereinafter referred to as “propylene”), 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 3-methyl-1-pentene, 4 Examples thereof include ⁇ -olefins having 3 to 12 carbon atoms such as methyl-1-pentene, 3-ethyl-1-pentene, 1-octene, 1-decene and 1-undecene.
- Examples of the olefin polymer include polyethylene resins, polypropylene resins, polybutene resins, methylpentene resins, etc., and one of these may be used alone or in combination of two or more. it can.
- Examples of the “polyethylene resin” include low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, ethylene / propylene copolymer, ethylene / octene copolymer, and the like.
- polypropylene resin examples include homopolypropylene, block polypropylene, random polypropylene, propylene / ⁇ -olefin copolymer, propylene / ethylene copolymer, propylene / butene copolymer, propylene / ethylene / butene copolymer. Etc. Among these polyolefins, it is preferable to use a polyethylene resin or a polypropylene resin.
- the component (iii) is a polymer in which at least one functional group selected from the functional group group X is introduced into the base polymer.
- the method for introducing the functional group include a method of copolymerizing an olefin compound and a monomer having the functional group.
- a polymer in which a carboxy group is introduced by copolymerizing ethylene and (meth) acrylic acid and a polymer in which an acid anhydride group is introduced by copolymerizing ethylene and maleic anhydride.
- the component include ethylene / (meth) acrylic acid copolymer and ethylene / (meth) acrylic acid copolymer neutralized with a part of carboxyl group by metal ions such as Na, Zn, Mg, etc.
- polymers having an acid anhydride group excellent in adhesiveness with upper and lower protective materials such as solar cell elements and glass are preferable, and an acid anhydride group-containing polypropylene is more compatible with the component (ii).
- an ethylene glycidyl methacrylate copolymer is preferable.
- a polymer into which the functional group is introduced may be used as long as the balance between mechanical properties and molding processability of the obtained sealing material is improved.
- the polymer preferably has a functional group having an average of 0.01 to 1,000 (pieces / molecule), and preferably has an average of 0.1 to 500 (pieces / molecule). More preferred is a polymer.
- the number of functional groups is less than 0.01 (pieces / molecule) on average, there is a tendency that good solar cell elements, upper and lower protective materials such as glass, metal, and the like cannot be obtained.
- the average number of functional groups exceeds 1,000 (pieces / molecule), there is a risk that the fluidity of the composition is lowered and the moldability is significantly lowered.
- the molecular weight of the component (iii) is not particularly limited, but the weight average molecular weight is preferably from 10,000 to 2,000,000, more preferably from 50,000 to 1,500,000, 1 million is particularly preferred. When the weight average molecular weight is less than 10,000, the strength of the solar cell sealing material tends to decrease. On the other hand, when the weight average molecular weight exceeds 2 million, there is a possibility that the fluidity of the composition is lowered and the moldability is lowered.
- “weight average molecular weight” means a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).
- the content of the component (iii) needs to be 0.1 to 40 parts by mass, and 0.5 to 30 parts by mass with respect to 100 parts by mass of the total amount of the components (i) and (ii). Is preferred.
- the amount is less than 0.1 parts by mass, the amount of the functional group-containing polymer is small, and the adhesiveness to upper and lower protective materials such as glass and metal tends to be lowered. If it exceeds 40 parts by mass, the amount of the functional group-containing polymer becomes excessive, and the moldability may be lowered.
- a secondary additive other than the component (i), the component (ii), and the component (iii) can be added to the sealing material of the present invention as long as the physical properties are not impaired.
- Secondary additives include, for example, antioxidants, ultraviolet absorbers, organic peroxides, silane coupling agents, various fillers, lubricants, plasticizers, anti-coloring agents, coloring agents, antibacterial agents, and nucleating agents. And an antistatic agent.
- organic peroxide examples include benzoyl peroxide, 2,4-dichlorobenzoyl peroxide, t-butyl peroxyacetate, t-butyl peroxybenzoate, dicumyl peroxide, 2,5-dimethyl- Examples thereof include 2,5-di (t-butylperoxy) hexane, di-t-butylperoxide, and 2,5-dimethyl-2,5-di (t-butylperoxy) -3-hexyne.
- dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, di-t-butyl peroxide, 2,5-dimethyl-2,5-di (t-butyl) Peroxy) -3-hexyne or the like is more preferably used.
- the amount of the organic peroxide used is preferably 0.01 to 5 parts by weight, more preferably 0.02 to 2 parts by weight with respect to 100 parts by weight of component (i).
- Silane coupling agents include vinyl, epoxy, styryl, methacryloxy, acryloxy, amino, ureido, chloropropyl, mercapto, sulfide, isocyanate, alkyl, and aryl groups as functional groups. Examples thereof include known silane compounds. Especially, when carrying out the graft reaction using an organic peroxide, the silane compound which has a vinyl group and a methacryloxy group as a functional group is preferable. These silane coupling agents are preferably 0.01 to 5 parts by weight, more preferably 0.02 to 2 parts by weight with respect to 100 parts by weight of the polymer.
- antioxidant examples include phosphorus stabilizers, hindered phenol antioxidants, epoxy stabilizers, and sulfur stabilizers.
- ultraviolet absorbers examples include benzophenone, benzotriazole, triazine, and salicylic acid ester.
- silane coupling agent examples include compounds having a hydrolyzable group such as an alkoxy group together with an unsaturated group such as a vinyl group, an acryloxy group, and a methacryloxy group, an amino group, and an epoxy group.
- various fillers examples include silica and mica.
- the lubricant include fatty acid amide.
- the sealing material sheet of the present invention can be manufactured very easily by melt-mixing the above-described components and forming a sheet.
- the method and apparatus for mixing and molding are not particularly limited, but it is industrially advantageous and preferable to form a sheet by mixing with an extruder or a Banbury mixer, extrusion T-die molding or calendar molding.
- the melt mixing molding temperature is preferably in the range of 150 to 250 ° C.
- Protective material may be laminated on the sealing material sheet obtained as described above.
- the protective material can be laminated on one side of the sealing material sheet.
- Examples of the protective material include metals and thermoplastic resins.
- the protective material can be laminated by pressing and coextrusion molding after the sealing material sheets are overlaid. Or you may laminate
- the metal that can be used as the protective material may be any metal, but aluminum is preferred. These may be laminated on a protective material made of a sealing material sheet or a thermoplastic resin by vapor deposition. Further, silicon oxide or aluminum oxide may be used instead of metal.
- thermoplastic resin that can be used as the protective material
- any thermoplastic resin may be used.
- polyethylene resin, polypropylene resin, cyclic polyolefin resin, fluorine resin, polystyrene resin, and acrylonitrile-styrene copolymer may be used as in the case of the sheet.
- Polyester resins various polyamide resins such as nylon, polyimide resins, polyamideimide resins, polyaryl phthalate resins, silicone resins, polysulfone resins, polyphenylene sulfide resins, polyethers Sulfone-based resin, polyurethane-based resin, acetal resin, may be used films or sheets of cellulose-based resin, and other various resins.
- polyethylene terephthalate and polyvinylidene fluoride are preferred.
- the sealing material sheet of the present invention in which the protective material as described above is laminated / not laminated can be used for a solar cell module.
- component (ii) Prior to explaining the sealing material of the present invention, a component (ii) component [functional group-containing hydrogenated diene polymer] as a raw material was synthesized. The synthesis method is shown as a synthesis example. In addition, about the physical property value of (ii) component, it measured and evaluated with the following method.
- Weight average molecular weight The weight average molecular weight in terms of polystyrene was determined using gel permeation chromatography (GPC, trade name: HLC-8120, manufactured by Tosoh Corporation).
- MFR melt flow rate
- Functional group content means the ratio of functional groups in the polymer and can be represented by the following formula (9).
- Functional group content Functional group (individual) / Polymer (single molecular chain): (9)
- Example 1 As component (i), 20 parts by mass of polypropylene, and as component (ii), 80 parts by mass of “ii-1” synthesized in the above [1] and component (iii) (maleic anhydride modified polypropylene; manufactured by Sanyo Chemical Industries, Product name: Umex 1010) Each 10 parts by mass was sufficiently reduced in moisture content by a vacuum dryer, then mixed, and kneaded at 230 ° C. using a 40 mm diameter extruder (Ikegai Co., Ltd.) to be pelletized.
- the solar cell element sealing material of Example 1 was obtained as a sheet having a thickness of 0.5 mm at 230 ° C. using the obtained pellets using a T-die extruder. The evaluation results are shown in Table 2.
- Example 2 to 7 Comparative Examples 1 to 5
- Example 2 to 6 and Comparative Examples were the same as Example 1 except that the types and amounts of the components (i), (ii), and (iii) were changed as described in Table 2.
- 1 to 5 solar cell element sealing materials were obtained. The results are shown in Table 2.
- Example 8 As component (i), 40 parts by mass of polypropylene, and as component (ii), 60 parts by mass of “ii-2” synthesized in the above [1] and component (iii) (ethylene glycidyl methacrylate, trade name: Bond First CG5004, Sumitomo After 5 parts by mass of each chemical product) were sufficiently reduced in water content by a vacuum dryer, an organic oxide (dicumyl peroxide, trade name: Park Mill D, manufactured by NOF Corporation), a silane coupling agent (vinyl) Trimethoxysilane (trade name: KBM1003, manufactured by Shin-Etsu Chemical Co., Ltd.) was added and mixed, and kneaded at 200 ° C.
- an organic oxide dicumyl peroxide, trade name: Park Mill D, manufactured by NOF Corporation
- a silane coupling agent (vinyl) Trimethoxysilane (trade name: KBM1003, manufactured by Shin-Etsu Chemical Co., Ltd.) was added
- Example 2 The solar cell element sealing material of Example 1 was obtained as a sheet having a thickness of 0.5 mm at 230 ° C. using the obtained pellets using a T-die extruder. The evaluation results are shown in Table 2.
- Example 9 The solar cell element encapsulant of Example 9 is the same as Example 8 except that the types and amounts of the components (i), (ii), and (iii) are changed as described in Table 2. A stop material was obtained. The results are shown in Table 2.
- Total light transmittance indicates a value measured in accordance with JIS-K7105 (light transmittance and total light reflectance). The total light transmittance was measured using a haze meter (trade name: “NDH 2000”) manufactured by Nippon Denshoku Industries Co., Ltd.
- Adhesiveness to glass: A sheet sample having a thickness of 0.5 mm was sandwiched between transparent glass plates having a thickness of 5 mm, and a laminate was prepared by pressing the sheet sample to a thickness of 0.3 mm with a press adjusted to 200 ° C. After this laminate was cooled, the glass and sheet samples were peeled off by hand and the peel condition was observed and evaluated in the following two stages. Good: Good adhesion, bad: Adhesive failure
- the solar cell element sealing material of Comparative Example 1 lacking the component (iii) has insufficient adhesion to glass.
- the solar cell element sealing material of Comparative Examples 2 and 3 in which the component (i) is excessively contained has a low total light transmittance.
- the solar cell element sealing materials of Comparative Examples 4 and 5 lacking the component (i) are displaced in the 60-degree tilt test. Also, the hardness is insufficient.
- the sealing material and the solar cell module of the present invention are used when manufacturing a solar cell.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Photovoltaic Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Sealing Material Composition (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009801214039A CN102057501A (zh) | 2008-06-09 | 2009-06-08 | 密封材料和使用了该密封材料的太阳能电池模件 |
JP2010516849A JPWO2009151029A1 (ja) | 2008-06-09 | 2009-06-08 | 封止材料およびそれを用いた太陽電池モジュール |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-150428 | 2008-06-09 | ||
JP2008150428 | 2008-06-09 | ||
JP2008249825 | 2008-09-29 | ||
JP2008-249825 | 2008-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009151029A1 true WO2009151029A1 (fr) | 2009-12-17 |
Family
ID=41416736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/060462 WO2009151029A1 (fr) | 2008-06-09 | 2009-06-08 | Matériau d'étanchéité et module de batterie solaire dans lequel le matériau est utilisé |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2009151029A1 (fr) |
CN (1) | CN102057501A (fr) |
TW (1) | TW201018707A (fr) |
WO (1) | WO2009151029A1 (fr) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011096389A1 (fr) * | 2010-02-02 | 2011-08-11 | 日本ゼオン株式会社 | Composition de résine pour sceller un élément de pile solaire, et module de pile solaire |
WO2011102466A1 (fr) * | 2010-02-18 | 2011-08-25 | ソニーケミカル&インフォメーションデバイス株式会社 | Agent d'étanchéité pour cellule solaire, et cellule solaire mettant en œuvre celui-ci |
JP2012054365A (ja) * | 2010-08-31 | 2012-03-15 | Mitsubishi Plastics Inc | 太陽電池用カバーフィルム及びそれを用いて作製された太陽電池モジュール |
WO2012043708A1 (fr) * | 2010-09-29 | 2012-04-05 | 日本ゼオン株式会社 | Copolymère bloc hydrogéné comprenant un groupe alcoxysilyle et son utilisation |
JP2013132755A (ja) * | 2011-12-26 | 2013-07-08 | Nippon Zeon Co Ltd | 多層シート及びその利用 |
WO2013105392A1 (fr) * | 2012-01-11 | 2013-07-18 | 株式会社クラレ | Composition de polymère thermoplastique et article moulé |
CN103249746A (zh) * | 2010-09-29 | 2013-08-14 | 日本瑞翁株式会社 | 具有烷氧基甲硅烷基的嵌段共聚物氢化物及其利用 |
JP2013211452A (ja) * | 2012-03-30 | 2013-10-10 | Mitsubishi Plastics Inc | 太陽電池用封止材及びそれを用いた太陽電池モジュール |
WO2014077267A1 (fr) * | 2012-11-15 | 2014-05-22 | 日本ゼオン株式会社 | Composition de résine et article moulé la comprenant |
WO2014091941A1 (fr) * | 2012-12-10 | 2014-06-19 | 日本ゼオン株式会社 | Composition de résine pour le scellement de dispositifs électroniques organiques et dispositif électronique organique |
JP2015000821A (ja) * | 2013-06-13 | 2015-01-05 | 日本ゼオン株式会社 | 合わせガラス板 |
WO2015137376A1 (fr) * | 2014-03-13 | 2015-09-17 | 日本ゼオン株式会社 | Feuille multicouches composite |
WO2017217381A1 (fr) * | 2016-06-13 | 2017-12-21 | 株式会社クラレ | Composition de polymère thermoplastique, film multicouche mettant en œuvre cette composition, et corps moulé |
WO2018003713A1 (fr) * | 2016-06-29 | 2018-01-04 | 日本ゼオン株式会社 | Film électro-conducteur |
WO2018043182A1 (fr) * | 2016-08-29 | 2018-03-08 | 日本ゼオン株式会社 | Procédé de production d'une feuille adhésive |
JP2018536081A (ja) * | 2015-10-28 | 2018-12-06 | ボレアリス エージー | 層要素用ポリプロピレン組成物 |
WO2022138522A1 (fr) * | 2020-12-25 | 2022-06-30 | Eneos株式会社 | Composition élastomère thermoplastique et corps moulé |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3287426A4 (fr) * | 2015-04-22 | 2019-01-09 | Zeon Corporation | Verre feuilleté |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000015681A1 (fr) * | 1998-09-14 | 2000-03-23 | Asahi Kasei Kogyo Kabushiki Kaisha | Copolymeres blocs hydrogenes |
JP2001332750A (ja) * | 2000-05-23 | 2001-11-30 | Canon Inc | 太陽電池封止用組成物およびそれを用いた太陽電池モジュール、建材一体型太陽電池モジュール |
WO2006057361A1 (fr) * | 2004-11-25 | 2006-06-01 | Mitsui Chemicals, Inc. | Composition de resine de propylene et utilisation de celle-ci |
JP2006210905A (ja) * | 2004-12-28 | 2006-08-10 | Mitsui Chemical Fabro Inc | 太陽電池封止材 |
JP2006283010A (ja) * | 2005-03-07 | 2006-10-19 | Asahi Kasei Chemicals Corp | 光学フィルム |
JP2007294869A (ja) * | 2006-03-30 | 2007-11-08 | Sanyo Electric Co Ltd | 太陽電池モジュール |
JP2008163121A (ja) * | 2006-12-27 | 2008-07-17 | Nippon Shiima Kk | 樹脂組成物 |
-
2009
- 2009-06-08 CN CN2009801214039A patent/CN102057501A/zh active Pending
- 2009-06-08 WO PCT/JP2009/060462 patent/WO2009151029A1/fr active Application Filing
- 2009-06-08 JP JP2010516849A patent/JPWO2009151029A1/ja not_active Withdrawn
- 2009-06-09 TW TW098119230A patent/TW201018707A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000015681A1 (fr) * | 1998-09-14 | 2000-03-23 | Asahi Kasei Kogyo Kabushiki Kaisha | Copolymeres blocs hydrogenes |
JP2001332750A (ja) * | 2000-05-23 | 2001-11-30 | Canon Inc | 太陽電池封止用組成物およびそれを用いた太陽電池モジュール、建材一体型太陽電池モジュール |
WO2006057361A1 (fr) * | 2004-11-25 | 2006-06-01 | Mitsui Chemicals, Inc. | Composition de resine de propylene et utilisation de celle-ci |
JP2006210905A (ja) * | 2004-12-28 | 2006-08-10 | Mitsui Chemical Fabro Inc | 太陽電池封止材 |
JP2006283010A (ja) * | 2005-03-07 | 2006-10-19 | Asahi Kasei Chemicals Corp | 光学フィルム |
JP2007294869A (ja) * | 2006-03-30 | 2007-11-08 | Sanyo Electric Co Ltd | 太陽電池モジュール |
JP2008163121A (ja) * | 2006-12-27 | 2008-07-17 | Nippon Shiima Kk | 樹脂組成物 |
Cited By (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2011096389A1 (ja) * | 2010-02-02 | 2013-06-10 | 日本ゼオン株式会社 | 太陽電池素子封止用樹脂組成物及び太陽電池モジュール |
WO2011096389A1 (fr) * | 2010-02-02 | 2011-08-11 | 日本ゼオン株式会社 | Composition de résine pour sceller un élément de pile solaire, et module de pile solaire |
JP5765238B2 (ja) * | 2010-02-02 | 2015-08-19 | 日本ゼオン株式会社 | 太陽電池素子封止用樹脂組成物及び太陽電池モジュール |
CN102884097A (zh) * | 2010-02-02 | 2013-01-16 | 日本瑞翁株式会社 | 用于封装太阳能电池元件的树脂组合物和太阳能电池组件 |
WO2011102466A1 (fr) * | 2010-02-18 | 2011-08-25 | ソニーケミカル&インフォメーションデバイス株式会社 | Agent d'étanchéité pour cellule solaire, et cellule solaire mettant en œuvre celui-ci |
JP2011171512A (ja) * | 2010-02-18 | 2011-09-01 | Sony Chemical & Information Device Corp | 太陽電池用封止剤及びこれを用いた太陽電池 |
JP2012054365A (ja) * | 2010-08-31 | 2012-03-15 | Mitsubishi Plastics Inc | 太陽電池用カバーフィルム及びそれを用いて作製された太陽電池モジュール |
JP5807643B2 (ja) * | 2010-09-29 | 2015-11-10 | 日本ゼオン株式会社 | アルコキシシリル基を有するブロック共重合体水素化物及びその利用 |
CN103249746A (zh) * | 2010-09-29 | 2013-08-14 | 日本瑞翁株式会社 | 具有烷氧基甲硅烷基的嵌段共聚物氢化物及其利用 |
WO2012043708A1 (fr) * | 2010-09-29 | 2012-04-05 | 日本ゼオン株式会社 | Copolymère bloc hydrogéné comprenant un groupe alcoxysilyle et son utilisation |
JPWO2012043708A1 (ja) * | 2010-09-29 | 2014-02-24 | 日本ゼオン株式会社 | アルコキシシリル基を有するブロック共重合体水素化物及びその利用 |
EP2623526A4 (fr) * | 2010-09-29 | 2015-06-24 | Zeon Corp | Copolymère bloc hydrogéné comprenant un groupe alcoxysilyle et son utilisation |
JP2013132755A (ja) * | 2011-12-26 | 2013-07-08 | Nippon Zeon Co Ltd | 多層シート及びその利用 |
JPWO2013105392A1 (ja) * | 2012-01-11 | 2015-05-11 | 株式会社クラレ | 熱可塑性重合体組成物および成形品 |
KR102127961B1 (ko) * | 2012-01-11 | 2020-06-30 | 주식회사 쿠라레 | 열가소성 중합체 조성물 및 성형품 |
US10745598B2 (en) | 2012-01-11 | 2020-08-18 | Kuraray Co., Ltd. | Thermoplastic polymer composition and molded article |
US10767089B2 (en) | 2012-01-11 | 2020-09-08 | Kuraray Co., Ltd. | Thermoplastic polymer composition and molded article |
KR20190022887A (ko) * | 2012-01-11 | 2019-03-06 | 주식회사 쿠라레 | 열가소성 중합체 조성물 및 성형품 |
US20170226390A1 (en) * | 2012-01-11 | 2017-08-10 | Kuraray Co., Ltd. | Thermoplastic polymer composition and molded article |
EP3168024A1 (fr) * | 2012-01-11 | 2017-05-17 | Kuraray Co., Ltd. | Composition de polymère thermoplastique et article moulé |
WO2013105392A1 (fr) * | 2012-01-11 | 2013-07-18 | 株式会社クラレ | Composition de polymère thermoplastique et article moulé |
JP2013211452A (ja) * | 2012-03-30 | 2013-10-10 | Mitsubishi Plastics Inc | 太陽電池用封止材及びそれを用いた太陽電池モジュール |
EP2921524A4 (fr) * | 2012-11-15 | 2016-08-24 | Zeon Corp | Composition de résine et article moulé la comprenant |
JPWO2014077267A1 (ja) * | 2012-11-15 | 2017-01-05 | 日本ゼオン株式会社 | 樹脂組成物およびそれからなる成形体 |
US9493688B2 (en) | 2012-11-15 | 2016-11-15 | Zeon Corporation | Resin composition and molded article comprising same |
WO2014077267A1 (fr) * | 2012-11-15 | 2014-05-22 | 日本ゼオン株式会社 | Composition de résine et article moulé la comprenant |
KR102131330B1 (ko) * | 2012-12-10 | 2020-07-07 | 니폰 제온 가부시키가이샤 | 유기 일렉트로닉스 디바이스 봉지용 수지 조성물 및 유기 일렉트로닉스 디바이스 |
EP2930210A4 (fr) * | 2012-12-10 | 2016-09-28 | Zeon Corp | Composition de résine pour le scellement de dispositifs électroniques organiques et dispositif électronique organique |
US20150307758A1 (en) * | 2012-12-10 | 2015-10-29 | Zeon Corporation | Resin composition for sealing organic electronics devices and organic electronics device |
KR20150095639A (ko) * | 2012-12-10 | 2015-08-21 | 니폰 제온 가부시키가이샤 | 유기 일렉트로닉스 디바이스 봉지용 수지 조성물 및 유기 일렉트로닉스 디바이스 |
JPWO2014091941A1 (ja) * | 2012-12-10 | 2017-01-05 | 日本ゼオン株式会社 | 有機エレクトロニクスデバイス封止用樹脂組成物、及び有機エレクトロニクスデバイス |
WO2014091941A1 (fr) * | 2012-12-10 | 2014-06-19 | 日本ゼオン株式会社 | Composition de résine pour le scellement de dispositifs électroniques organiques et dispositif électronique organique |
JP2015000821A (ja) * | 2013-06-13 | 2015-01-05 | 日本ゼオン株式会社 | 合わせガラス板 |
WO2015137376A1 (fr) * | 2014-03-13 | 2015-09-17 | 日本ゼオン株式会社 | Feuille multicouches composite |
JPWO2015137376A1 (ja) * | 2014-03-13 | 2017-04-06 | 日本ゼオン株式会社 | 複合多層シート |
US10934422B2 (en) | 2015-10-28 | 2021-03-02 | Borealis Ag | Polypropylene compositions for a layer element |
JP2018536081A (ja) * | 2015-10-28 | 2018-12-06 | ボレアリス エージー | 層要素用ポリプロピレン組成物 |
WO2017217381A1 (fr) * | 2016-06-13 | 2017-12-21 | 株式会社クラレ | Composition de polymère thermoplastique, film multicouche mettant en œuvre cette composition, et corps moulé |
WO2018003713A1 (fr) * | 2016-06-29 | 2018-01-04 | 日本ゼオン株式会社 | Film électro-conducteur |
JPWO2018003713A1 (ja) * | 2016-06-29 | 2019-04-18 | 日本ゼオン株式会社 | 導電性フィルム |
US11322269B2 (en) | 2016-06-29 | 2022-05-03 | Zeon Corporation | Electrically conductive film |
JP7070410B2 (ja) | 2016-06-29 | 2022-05-18 | 日本ゼオン株式会社 | 導電性フィルム |
JPWO2018043182A1 (ja) * | 2016-08-29 | 2019-06-24 | 日本ゼオン株式会社 | 接着剤シートの製造方法 |
WO2018043182A1 (fr) * | 2016-08-29 | 2018-03-08 | 日本ゼオン株式会社 | Procédé de production d'une feuille adhésive |
WO2022138522A1 (fr) * | 2020-12-25 | 2022-06-30 | Eneos株式会社 | Composition élastomère thermoplastique et corps moulé |
Also Published As
Publication number | Publication date |
---|---|
TW201018707A (en) | 2010-05-16 |
CN102057501A (zh) | 2011-05-11 |
JPWO2009151029A1 (ja) | 2011-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009151029A1 (fr) | Matériau d'étanchéité et module de batterie solaire dans lequel le matériau est utilisé | |
US9670354B2 (en) | Thermoplastic polymer composition and molded article | |
EP2623526B1 (fr) | Copolymère bloc hydrogéné comprenant un groupe alcoxysilyle et son utilisation | |
CN106364103B (zh) | 具有一体化背部片材和封装性能且包括包含结晶嵌段共聚物复合物或嵌段共聚物复合物的层的基于聚烯烃的多层膜 | |
JP5807643B2 (ja) | アルコキシシリル基を有するブロック共重合体水素化物及びその利用 | |
WO2011068188A1 (fr) | Matériau d'étanchéité, feuille stratifiée pour module de cellules solaires et module de cellules solaires | |
RU2592608C2 (ru) | Материал для герметизации солнечных батарей и модуль солнечной батареи, изготовленный с его использованием | |
EP2532692A1 (fr) | Composition de résine pour sceller un élément de pile solaire, et module de pile solaire | |
US9922748B2 (en) | Electroconductive polyethylene resin composition, and molded article and laminate using the same | |
JP3988495B2 (ja) | 水添変性重合体及びその製造方法並びにそれを含む組成物 | |
WO2003085010A1 (fr) | Polymeres modifies et compositions contenant ceux-ci | |
CN110945034B (zh) | 嵌段共聚物的氢化物、树脂组合物和它们的各种用途 | |
JP2007211059A (ja) | 熱可塑性エラストマー組成物 | |
JPWO2006098290A1 (ja) | 新規接着剤およびそれを用いた積層体 | |
EP3805284A1 (fr) | Copolymère séquencé hydrogéné, composition de résine et différentes applications associées | |
WO2015137376A1 (fr) | Feuille multicouches composite | |
JP2007177034A (ja) | 熱可塑性エラストマー組成物およびその積層体 | |
JP2012107107A (ja) | 太陽電池封止用フィルムの組成物 | |
JP6073787B2 (ja) | 封止材及びその製造方法 | |
US20240166854A1 (en) | Thermoplastic elastomer composition | |
JP7010241B2 (ja) | 合わせガラス | |
JP7259856B2 (ja) | 積層体および合わせガラス | |
JPWO2019159672A1 (ja) | 酸無水物基含有ブロック共重合体、樹脂組成物、樹脂シート、および合わせガラス | |
WO2020137497A1 (fr) | Procédé de production d'un stratifié | |
CA3216968A1 (fr) | Feuille multicouche et son procede de production |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980121403.9 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09762459 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010516849 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09762459 Country of ref document: EP Kind code of ref document: A1 |