Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
  • B32B7/04—Interconnection of layers
  • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
  • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
  • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
  • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
  • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
  • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
  • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
  • H05K3/0047—Drilling of holes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
  • B32B2307/56—Damping, energy absorption
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
  • B32B2457/08—PCBs, i.e. printed circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
  • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling

Definitions

• the present invention relates to a sheet for drilling, which is used for drilling, which is one of the manufacturing processes of a printed circuit board, and more specifically, an organic resin layer containing an ethylene copolymer, a low melting point polyolefin resin, and a compatibilizer is a thermosetting adhesive.
• the sheet for punching processing which is laminated
• a printed circuit board represents a board
• a process punching process process
• a printed circuit board is composed of a composite material in which a conductive layer made of copper foil and an insulating layer impregnated with an epoxy resin are laminated on a cross-web woven from glass fiber.
• a conductive layer made of copper foil and an insulating layer impregnated with an epoxy resin are laminated on a cross-web woven from glass fiber.
• Korean Patent Publication No. 2002-0018984 discloses a mixture containing a metal foil having a thickness of 5 to 500 ⁇ m, a polyether ester, a solid water-soluble lubricant, and polyethylene glycol or Lubricant sheets for perforation of printed circuit boards comprising an organic material layer comprising a mixture containing a polyetherester, a solid water soluble lubricant and a liquid water soluble lubricant are disclosed.
• Korean Patent No. 10-0657427 discloses 57 to 65 weight of polyethylene wax.
• US Patent Nos. 4,781,495 and 4,929,370 disclose a method of arranging a water-soluble lubricant impregnated sheet on one or both sides of a laminated substrate, and using this sheet as a cover plate to perform drilling by drill.
• the lubricant impregnated sheet used in the drilling method is a porous, such as paper, made of a mixture of glycols such as diethylene glycol and dipropylene glycol, which are solid water-soluble lubricants, and synthetic waxes such as fatty acids and nonionic surfactants. It is impregnated with the material.
• Japanese Patent Application Laid-Open No. 2002-120198 also uses a water-soluble resin-coated metal sheet obtained by adhering a mixture of polyethylene glycol dimethyl terephthalate polycondensate and polyoxymethylene monostearate, both of which are water-soluble compounds, to one surface of an aluminum sheet.
• a method of drilling by a drill is disclosed.
• the present inventors have tried to develop a new sheet for punching which can solve the above problems, when using a water-insoluble organic resin layer containing an ethylene copolymer, a low melting point polyolefin resin and a compatibilizer,
• the present invention was completed by confirming that the problems caused by the use can be solved, and local vibration caused by the high speed rotation of the drill bit can be absorbed to improve the positional accuracy and wear resistance of the drill.
• the perforated sheet of the present invention is composed of a water-insoluble organic resin layer containing an ethylene copolymer, a low melting point polyolefin resin, and a compatibilizer, problems due to water-soluble resin, that is, adhesion to a metal substrate is poor, or coating Due to the large difference in water absorption from the substrate metal of the resin, warpage occurs in the resin-coated metal sheet, and in particular, since the film itself is easily sticky, the surface of the film may be sticky under high temperature and humidity conditions in the rainy season and summer, which may interfere with handling and workability. It can solve the problem that is caused.
• the organic resin layer of the sheet for punching of the present invention absorbs local vibration due to the high-speed rotation of the drill bit, the wear resistance of the drill can be improved to extend the drill replacement time, and ultimately, the straightness during drilling. That is, the positional accuracy of the drill can be improved.
• the positional accuracy of the drill is improved, the phenomenon that the chip is buried in the substrate during drilling, that is, the smear can be reduced, so that the quality of the punched substrate can be improved.
• the organic resin layer of this invention can achieve the lubrication effect by bit frictional heat, and can improve the wear resistance of a drill bit.
• the present invention relates to a sheet for punching, characterized in that an organic resin layer comprising an ethylene copolymer, a low melting point polyolefin resin, and a compatibilizer is laminated with a metal layer by a thermosetting adhesive.
• the organic resin layer includes an ethylene copolymer, a low melting point polyolefin resin, and a compatibilizer.
• the low melting point polyolefin resin is added to the ethylene copolymer to induce phase separation between the ethylene chain and the olefin chain. It is prepared by adding.
• ethylene chains and olefin chains are representative polymers known to cause phase separation due to differences in cohesive energy.
• the organic resin layer of the present invention takes the form of phase separation of ethylene resin and olefin resin. have.
• the compatibilizer which is another component included in the organic resin layer of the present invention, is added to improve the processability of the olefin resin and to induce the refinement of the olefin resin domain.
• the organic resin layer of the present invention has a form in which ethylene-based resins and olefin-based resins are phase-separated, and thus exhibits an effect of reducing vibration due to a phenomenon in which vibration energy transfer capability at the interface is reduced. That is, since the organic resin layer of the present invention serves as a buffer layer for absorbing local vibration due to the high speed rotation of the drill bit at the interface between the ethylene resin and the olefin resin, the vibration of the drill can be reduced, so that the drill By improving the wear resistance, it is possible to prolong the drill replacement time and ultimately improve the straightness during drilling, that is, the positional accuracy of the drill. When the positional accuracy of the drill is improved, the phenomenon that the chip is buried in the substrate during drilling, that is, the smear can be reduced, so that the quality of the punched substrate can be improved.
• the organic resin layer of the present invention is also water-insoluble or substantially water-insoluble. Therefore, a problem may occur due to the use of the water-soluble resin in the sheet for punching, that is, the adhesion to the metal substrate is poor, or due to the difference in absorption rate of the coating resin with the substrate metal, warping occurs in the resin-coated metal sheet, especially during the rainy season and summer It is possible to solve the problem of sticking of the surface of the film under high temperature and high humidity conditions such as causing trouble in handling or workability.
• substantially insoluble in water means that the organic resin layer may be insoluble in water or may have some water solubility within the range capable of exerting the above-described effects such as storage stability of the product. Therefore, even if some water-soluble substances are contained in the material inevitably incorporated in the organic resin layer in addition to the components of the organic resin layer specified in the present invention, such an organic resin layer is also included in the present invention.
• the organic resin layer of this invention contains 100 weight part of ethylene copolymers, 1-20 weight part of low melting point polyolefin resins, and 1-20 weight part of compatibilizers.
• the thickness of the organic resin layer of this invention is 20-300 micrometers. If the thickness is too thin, it may be difficult to sufficiently absorb the vibration, the role of lubricant, and the discharge of cutting waste during the drilling process. On the contrary, if the thickness is too thick, the positioning accuracy of the drilling may be deteriorated or the drill may be broken. have.
• the copolymer in which ethylene and 1 or more types chosen from the group which consists of vinyl acetate, ethylene vinyl acetate, ethyl acrylic acid, and ethyl methacrylic acid polymerized is preferable.
• low-melting-point polyolefin-based resin refers to a polyolefin-based polymerized using a metalocene catalyst, and generally using a zigro-nata catalyst. Since the melting point is lowered when the metalocene system is used as compared to the polymerized polyolefin system, it is called a low melting point polyolefin system.
• low melting point polyolefins of the present invention low melting point propylene and PE wax are preferred, and low melting point propylene resin is particularly preferable.
• the present invention uses a low melting point resin, the lubrication action due to the bit frictional heat can be achieved to prevent puncture and bit breakage.
• a compatibilizer contained in the organic resin layer of this invention 1 or more types chosen from the group which consists of an ethylene propylene copolymer, an ethylene propylene ethylene copolymer, and an alpha olefin copolymer are preferable.
• the organic resin layer may further include an antioxidant, and such antioxidants include phenolic antioxidants and organic sulfur compound-based antioxidants.
• the phenolic antioxidant can improve the electrical insulation without damaging other properties such as drillability, 1,2,3-trihydroxybenzene, 2,6-di-t-butyl-p-cresol, butyl Monophenols such as hydrogenated hydroxyanisole and 2,6-di-t-butyl-4-ethylphenol, 2,2'-methylene-bis (4-methyl-6-t-butylphenol), 4,4 ' -Thiobis (3-methyl-6-t-butylphenol), 2,2-methylenebis (4-ethyl-6-t-butylphenol), 4.4'-butylidenebis (3-methyl-6-t -Butylphenol), 3,9-bis [1,1-dimethyl-2- [ ⁇ -3-t-butyl-4-hydroxy-5-methylphenyl) propionyloxy] ethyl, and 2,4,8, Bisphenols such as 10-tetraoxaspiro [5,5] undecane, and 1,1,3-tris (2-methyl-4-hydroxy-5-t-but
• organic sulfur compound-based antioxidants examples include dilauryl-thiodipropionate, distearyl-thiodipropionate and dimyristyl-thiodipropionate.
• a colorant may be included in the organic resin layer of the present invention.
• coloring agent examples include known conventional coloring agents such as phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, crystal violet, titanium oxide, carbon black, naphthalene black, but are not limited thereto.
• Various colorants can be used as long as they do not affect the properties of the organic resin layer.
• the organic resin layer of the present invention may include an antistatic agent.
• glycerol monostearate or a glycerol monostearate / ethoxylated amine mixture (2/1 mol%) is preferable, but any monostearate compound may be used.
• thermosetting adhesive included in the sheet for punching of the present invention may include one selected from the group consisting of phenol resins, epoxy resins, acrylic resins, maleimides, unsaturated polyesters, polyurethanes, alkyl resins, and silicone resins. It is not limited to this.
• seat for punching process of this invention is an aluminum layer, and it is most preferable that it is pure aluminum with a purity of 99.0%. Since these aluminum plates have appropriate hardness and strength, they are preferable because they can suppress the occurrence of burrs and warpage during use as a cover plate during drilling, and do not deteriorate the drill.
• 5-500 micrometers is preferable, as for the thickness of the metal layer of this invention, 30-300 micrometers is more preferable, 50-200 micrometers is the most preferable.
• the sheet for punching processing of the present invention is manufactured by laminating an organic resin layer with a metal layer with a thermosetting adhesive, wherein the adhesion of the organic resin layer and the metal layer may be performed by a method such as a dry laminate, a wet laminate, and a high temperature laminate method. It is also possible to bond using an adhesive.
• commercially available adhesives for dry lamination such as acrylic, urethane, and ester
• adhesives for high temperature lamination such as ethylene-vinylacetate copolymer resin, olefin, and rubber can be appropriately selected and used.
• the present invention also provides a sheet for punching processing of the present invention on a drill entry side surface of a printed circuit board on which one or several layers are stacked, as a cover plate, and the punching process is performed by a drill. It relates to a method for producing a printed circuit board comprising a step.
• positioning a sheet for a punching process to a cover plate on the drill entrance side surface of a printed circuit board, and performing a punching process by a drill depends on the method normally used in the manufacturing field of a printed circuit board.
• the raw material was used at a cylinder temperature of 200 to 220 ⁇ and a die temperature of 180 to 200.
• the product was fed into an extruder maintained at ⁇ ⁇ and then extruded slowly at a high speed.
• the speed is adjusted for several minutes so that the discharge amount is 800 to 1200 g / min, blow-extruded to be about 30 ⁇ m thick, and one side and the laminate of the pure aluminum plate having a thickness of 130 ⁇ m using urethane-based adhesive To prepare a sheet for drilling.
• the raw materials were prepared at a cylinder temperature of 200 to 220 ° C and a die temperature of 180 to 200 ° C. It was fed into an extruder maintained at 0, and then started at a low speed and gradually extruded at a high speed.
• the speed is adjusted for several minutes so that the discharge amount is 800 to 1200 g / min, blow-extruded to be about 30 ⁇ m thick, and one side and the laminate of the pure aluminum plate having a thickness of 130 ⁇ m using urethane-based adhesive To prepare a sheet for drilling.
• the raw material was used at a cylinder temperature of 200 to 220 ⁇ , It was fed into an extruder maintained at a die temperature of 180 to 200 ° C. and then extruded slowly at a high speed.
• the speed is adjusted for several minutes so that the discharge amount is 800 to 1200 g / min, blow-extruded to a thickness of 35 ⁇ m, and laminated with one surface of a pure aluminum plate having a thickness of 130 ⁇ m using a urethane-based adhesive. A sheet for punching was produced.
• Drilling was performed on the sheet
• the drill processing method puts the sheet
• Drill bit diameter 0.25 mm
• Determination of the hole position accuracy was carried out with respect to the board
• Determination of the inner wall roughness was performed on the fifth substrate from above, and the inner wall roughnesses on the right and left of each of the through holes (drilling holes) of the 4000th-th hole and the front and rear two holes were measured, and the average value was less than 5.0 ⁇ m.
• Circle and the thing of less than 10 micrometers (DELTA) and the thing of 10 micrometers or more were made into what is less than 7.0 micrometers.
• EVA copolymer of ethylene and vinyl acetate
• EEA copolymer of ethylene and ethylene vinyl acetate
• EAA copolymer of ethylene and ethyl acrylic acid

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Laminated Bodies (AREA)
• Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
• Drilling And Boring (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (2)

Family

ID=40698508

Family Applications (1)

Country Status (5)

Cited By (1)

Families Citing this family (6)

Family Cites Families (13)

• 2008
  • 2008-06-06 KR KR1020080053408A patent/KR100889702B1/ko not_active Expired - Fee Related
• 2009
  • 2009-05-07 CN CN200980113891.9A patent/CN102015286B/zh not_active Expired - Fee Related
  • 2009-05-07 JP JP2011504938A patent/JP5543431B2/ja not_active Expired - Fee Related
  • 2009-05-07 WO PCT/KR2009/002411 patent/WO2009148222A2/ko not_active Ceased
  • 2009-06-06 TW TW098118895A patent/TW201000307A/zh unknown

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