WO2009136707A3 - 가변강성 구조를 갖는 수직형 미세 접촉 프로브 - Google Patents

가변강성 구조를 갖는 수직형 미세 접촉 프로브 Download PDF

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Publication number
WO2009136707A3
WO2009136707A3 PCT/KR2009/002309 KR2009002309W WO2009136707A3 WO 2009136707 A3 WO2009136707 A3 WO 2009136707A3 KR 2009002309 W KR2009002309 W KR 2009002309W WO 2009136707 A3 WO2009136707 A3 WO 2009136707A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe bodies
variable
contact
contact probe
probe
Prior art date
Application number
PCT/KR2009/002309
Other languages
English (en)
French (fr)
Other versions
WO2009136707A2 (ko
Inventor
김정엽
이학주
김경식
Original Assignee
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Priority to US12/991,492 priority Critical patent/US8723541B2/en
Priority to JP2011508418A priority patent/JP5135470B2/ja
Publication of WO2009136707A2 publication Critical patent/WO2009136707A2/ko
Publication of WO2009136707A3 publication Critical patent/WO2009136707A3/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

본 발명의 일측면에 따른 미세 접촉 프로브는, 복수개의 단위유닛들이 서로 이어지며 길이방향으로 적층되어 형성된 기둥부, 및 상기 기둥부의 선단에 형성되어 반도체 칩의 전극 패드와 접촉되는 선단부를 포함한다. 상기 단위유닛은, 교번하여 좌우로 굴곡되는 프로브 몸체, 및 상기 프로브 몸체로부터 돌출되면서, 폭방향 중심을 기준으로 좌우로 배치되어, 압축 시 인접한 상기 프로브 몸체에 접촉되어 상기 프로브 몸체를 지지할 수 있는 돌기를 포함한다.
PCT/KR2009/002309 2008-05-08 2009-04-30 가변강성 구조를 갖는 수직형 미세 접촉 프로브 WO2009136707A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/991,492 US8723541B2 (en) 2008-05-08 2009-04-30 Vertical micro contact probe having variable stiffness structure
JP2011508418A JP5135470B2 (ja) 2008-05-08 2009-04-30 可変剛性構造を有する垂直型微細接触プローブ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0042931 2008-05-08
KR1020080042931A KR100984876B1 (ko) 2008-05-08 2008-05-08 가변강성 기능을 가진 수직형 미세 접촉 프로브

Publications (2)

Publication Number Publication Date
WO2009136707A2 WO2009136707A2 (ko) 2009-11-12
WO2009136707A3 true WO2009136707A3 (ko) 2010-03-11

Family

ID=41265136

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/002309 WO2009136707A2 (ko) 2008-05-08 2009-04-30 가변강성 구조를 갖는 수직형 미세 접촉 프로브

Country Status (4)

Country Link
US (1) US8723541B2 (ko)
JP (1) JP5135470B2 (ko)
KR (1) KR100984876B1 (ko)
WO (1) WO2009136707A2 (ko)

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TW201231977A (en) * 2011-01-20 2012-08-01 Pleader Yamaichi Co Ltd Structure of high-frequency vertical spring plate probe card
JP5879906B2 (ja) * 2011-10-14 2016-03-08 オムロン株式会社 接触子およびこれを用いたプローブ
KR101236312B1 (ko) * 2011-10-17 2013-02-28 (주)기가레인 반도체 검사용 프로브
JP6026130B2 (ja) * 2012-04-10 2016-11-16 富士通コンポーネント株式会社 コンタクト、コネクタ
KR101373642B1 (ko) * 2012-10-23 2014-03-12 (주)아이윈 고무 연결핀 및 그 제조 방법
WO2015023062A1 (ko) * 2013-08-13 2015-02-19 (주)기가레인 미세 전극 회로 검사용 핀 제조 방법 및 이의 방법으로 제조된 미세 전극 회로 검사용 핀
KR102018784B1 (ko) 2013-08-13 2019-09-05 (주)위드멤스 미세 전극 회로 검사용 핀 제조 방법 및 이의 방법으로 제조된 미세 전극 회로 검사용 핀
JP2016139545A (ja) * 2015-01-28 2016-08-04 富士通株式会社 コンタクト、コネクタ、及び電子機器
WO2020222327A1 (ko) * 2019-04-30 2020-11-05 (주)위드멤스 미세 전극 회로 검사용 핀
KR102132232B1 (ko) * 2019-05-10 2020-07-10 (주)루켄테크놀러지스 프로브 핀, 이의 제조 방법 및 이를 포함하는 반도체 검사 장치
KR102166677B1 (ko) * 2019-08-09 2020-10-16 주식회사 오킨스전자 멤스 포고 핀 및 이를 이용한 검사 방법
KR102086390B1 (ko) * 2019-11-05 2020-03-09 주식회사 플라이업 프로브 핀
KR102429358B1 (ko) * 2020-01-16 2022-08-04 주식회사 플라이업 프로브 핀 및 이를 구비하는 회로 검사장치
KR102509525B1 (ko) * 2021-02-22 2023-03-14 (주)포인트엔지니어링 전기 전도성 접촉핀 및 그 어셈블리
KR20230032057A (ko) * 2021-08-30 2023-03-07 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이를 구비하는 수직형 프로브 카드
KR20240016160A (ko) 2022-07-28 2024-02-06 (주)위드멤스 프로브 핀
KR102644534B1 (ko) * 2023-10-30 2024-03-07 (주)새한마이크로텍 접촉 프로브

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JP2002031648A (ja) * 2000-07-14 2002-01-31 Yamaichi Electronics Co Ltd コンタクトプローブ及びその製造方法
JP2003194847A (ja) * 2001-12-26 2003-07-09 Sumitomo Electric Ind Ltd コンタクトプローブ
JP2006064676A (ja) * 2004-08-30 2006-03-09 Tokyo Electron Ltd プローブ針、プローブ針の製造方法および三次元立体構造の製造方法
KR20080108726A (ko) * 2007-06-11 2008-12-16 주식회사 제이엠엘 마이크로 팁 및 니들의 제조방법과 이에 따라 얻어진프로브 카드용 버티칼형 프로브

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KR100869046B1 (ko) * 2007-02-09 2008-11-18 한국기계연구원 Ａｆｍ 프로브
CN101884139B (zh) * 2007-10-29 2015-03-04 忠诚概念股份有限公司 顺应性电触头和组件
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002031648A (ja) * 2000-07-14 2002-01-31 Yamaichi Electronics Co Ltd コンタクトプローブ及びその製造方法
JP2003194847A (ja) * 2001-12-26 2003-07-09 Sumitomo Electric Ind Ltd コンタクトプローブ
JP2006064676A (ja) * 2004-08-30 2006-03-09 Tokyo Electron Ltd プローブ針、プローブ針の製造方法および三次元立体構造の製造方法
KR20080108726A (ko) * 2007-06-11 2008-12-16 주식회사 제이엠엘 마이크로 팁 및 니들의 제조방법과 이에 따라 얻어진프로브 카드용 버티칼형 프로브

Also Published As

Publication number Publication date
JP2011523040A (ja) 2011-08-04
US20110057675A1 (en) 2011-03-10
WO2009136707A2 (ko) 2009-11-12
US8723541B2 (en) 2014-05-13
KR100984876B1 (ko) 2010-10-04
JP5135470B2 (ja) 2013-02-06
KR20090117053A (ko) 2009-11-12

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