WO2009133756A1 - ウエハレンズ集合体の製造方法及びウエハレンズの製造方法 - Google Patents
ウエハレンズ集合体の製造方法及びウエハレンズの製造方法 Download PDFInfo
- Publication number
- WO2009133756A1 WO2009133756A1 PCT/JP2009/057185 JP2009057185W WO2009133756A1 WO 2009133756 A1 WO2009133756 A1 WO 2009133756A1 JP 2009057185 W JP2009057185 W JP 2009057185W WO 2009133756 A1 WO2009133756 A1 WO 2009133756A1
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- WIPO (PCT)
- Prior art keywords
- substrate
- wafer lens
- spacer
- diaphragm
- resin
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00365—Production of microlenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/006—Handling moulds, e.g. between a mould store and a moulding machine
Definitions
- the present invention relates to a method for manufacturing a wafer lens assembly and a method for manufacturing a wafer lens.
- a diaphragm made of a metal film on the surface of a glass flat plate for adjusting the amount of incident light is formed, and an optical member made of a cured resin is formed on the surface of the diaphragm.
- a plurality of so-called “wafer lenses” are formed.
- the description of the glass flat plate is not limited to being made of glass, and other transparent flat plates such as plastic and ceramic are used. And does not limit the scope of rights of the present invention).
- the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a wafer lens assembly and a method for manufacturing a wafer lens capable of reliably bonding another substrate such as a wafer lens and a spacer. It is said.
- Said subject has the surface and back surface, and provided the 1st board
- substrate A second substrate joined to the optical member, and a diaphragm member provided between the first substrate and the second substrate for adjusting the amount of light incident on the optical member.
- the substrate and the second substrate are a method of manufacturing a wafer lens assembly which is bonded via an adhesive made of a photocurable resin, wherein the first substrate is bonded to the second substrate or the second substrate.
- a plurality of first optical members made of curable resin on one surface of a substrate having a front surface and a back surface, a plurality of second optical members made of curable resin on the other surface, the front surface or the back surface of the substrate A wafer lens manufacturing method in which a diaphragm member is provided on each of the first or second optical members, the step of forming an alignment mark on the one surface of the substrate, and the alignment mark with respect to the alignment mark.
- the second molding in a state in which the second molding die having the molding surface of the second optical member is positioned with respect to the alignment mark, the step of forming a diaphragm member on the front or back surface of the substrate Between the mold and the substrate Filling the curable resin and curing to form the second optical member, and the diaphragm member formed by the process of forming the diaphragm member includes the first or second molding die.
- the wafer lens manufacturing method is characterized in that it is formed at a position that does not hinder positioning with the alignment mark.
- a wafer lens assembly is formed by forming a diaphragm member on one surface of the substrate and laminating wafer lenses each having an optical member made of a curable resin on the surface of the diaphragm member with a spacer interposed therebetween.
- a wafer lens assembly manufacturing method for manufacturing a wafer lens wherein a light curable resin adhesive is applied between one surface of one wafer lens and one surface of the spacer, and is irradiated with light. By doing so, the spacer and the one wafer lens are bonded together, and the other wafer lens is formed at the position corresponding to the other surface of the spacer without forming the diaphragm member.
- the other surface of the spacer is disposed on the surface of the lens facing the one wafer lens where the diaphragm member is not formed, and the other surface of the spacer and the other A wafer lens assembly, wherein the spacer and the other wafer lens are bonded together by applying the adhesive and irradiating light with a portion of the wafer lens where the diaphragm member is not formed. It is also solved by a method for manufacturing a body.
- a first diaphragm member is provided on one surface of the substrate, a first optical member made of a curable resin is provided on the surface of the first diaphragm member, and a second optical member is formed on the other surface of the substrate.
- a wafer lens manufacturing method comprising a diaphragm member, and a second optical member made of a curable resin on a surface of the second diaphragm member, wherein a plurality of alignment marks are formed on the one surface of the substrate. And forming the first diaphragm member, and then positioning the first mold having the molding surface of the first optical member with respect to a predetermined alignment mark among the plurality of alignment marks.
- the first optical member is molded by filling and curing the curable resin between the surface of one aperture member and the first mold, and then forming a predetermined alignment mark among the plurality of alignment marks.
- the second diaphragm member is formed with the mask positioned on the other surface of the substrate, and then the molding surface of the second optical member is formed with respect to a predetermined alignment mark among the plurality of alignment marks.
- the second optical member is molded by filling and curing the curable resin between the surface of the second drawing member and the second master molding die in a state where the second molding die is positioned. This problem can also be solved by using a method for manufacturing a wafer lens.
- the substrate here is not limited to a glass substrate, but may be a thermosetting or thermoplastic plastic substrate, or a transparent ceramic substrate. These substrate materials do not limit the scope of the present invention.
- a diaphragm is formed at a position corresponding to a bonding with another substrate to be bonded in the other wafer lens (when the other substrate is a spacer, a position corresponding to the other surface of the spacer). Therefore, the curing light is directly incident on the adhesive, and the other substrate such as the spacer and the wafer lens can be securely bonded.
- the optical members and the diaphragms on both sides may be stacked in a state where they are shifted in a plane perpendicular to each other (shift error). For this reason, the more members are stacked, the more errors are accumulated, making it difficult to match the optical members and diaphragms on both sides with high precision in the optical axis direction.
- the first optical member and the second optical member With reference to the above, they can be matched with high accuracy in the optical axis direction. This is particularly advantageous in that, when the optical member and the diaphragm are formed on both surfaces of the substrate, they can be matched with high accuracy in the optical axis direction.
- 1 is a schematic cross-sectional view of a wafer lens according to a preferred embodiment (first embodiment) of the present invention.
- 1 is a schematic exploded perspective view of a wafer lens according to a preferred embodiment (first embodiment) of the present invention. It is drawing for demonstrating schematically the manufacturing method of the wafer lens which concerns on preferable embodiment (1st Embodiment) of this invention. It is drawing for demonstrating the manufacturing method of a master. It is drawing for demonstrating positioning with the alignment mark of a stop, and a master. It is drawing for demonstrating positioning with the alignment mark of a stop, and a master. It is drawing for demonstrating the modification of a structure of an aperture_diaphragm
- FIG. 3 is a schematic exploded perspective view of a wafer lens according to a preferred embodiment (second embodiment) of the present invention. It is drawing for demonstrating schematically the manufacturing method of the wafer lens assembly which concerns on preferable embodiment (2nd Embodiment) of this invention. It is drawing for demonstrating schematically the manufacturing method of the wafer lens which concerns on preferable embodiment (2nd Embodiment) of this invention.
- FIG. 11 is a diagram for schematically explaining a subsequent process of FIG. 10. It is drawing for demonstrating schematically the manufacturing method of the wafer lens which concerns on preferable embodiment (3rd Embodiment) of this invention.
- FIG. 19 is a diagram for explaining a modification of FIG. 18.
- the wafer lens 1 is mainly composed of a glass substrate 10, diaphragms 20 and 30, and resin portions 40 and 50.
- 1 is a cross-sectional view taken along the line II of FIG.
- the glass substrate 10 is disposed at the center of the wafer lens 1, and diaphragms 20 and 30 are formed above and below the glass substrate 10.
- a resin portion 40 is formed on the upper portion of the glass substrate 10, and the resin portion 40 covers a gap between the apertures 20.
- a resin part 50 is formed in the lower part of the glass substrate 10, and the resin part 50 covers a gap between the diaphragms 30.
- the glass substrate 10 has a disk shape and has a predetermined thickness.
- the diaphragms 20 and 30 are elements for adjusting the amount of light with respect to the wafer lens 1.
- the diaphragms 20 and 30 are made of light-shielding metal films 20A and 30A, and are formed on the upper surface and the lower surface of the glass substrate 10, respectively.
- the diaphragms 20 and 30 may be made of a light-shielding resist, a silicon film, a carbon film, or the like. Further, instead of the glass substrate 10, a transparent plastic substrate such as a thermosetting resin, a photocurable resin, or a thermoplastic resin may be used, or a transparent ceramic substrate may be used, which corresponds to the glass substrate 10. If the board
- the diaphragm 20 is formed with a plurality of light transmission portions 22 having a circular shape.
- the light transmission portion 22 is a portion where the metal film 20A is not formed, and allows light transmission.
- Three pairs of alignment marks 24 a, 24 b, 24 c are formed on the peripheral edge of the diaphragm 20.
- the alignment mark 24 a is arranged at a position symmetrical to the center portion on a line passing through the center portion of the diaphragm 20.
- the alignment marks 24b and 24c have the same arrangement as the alignment mark 24a.
- a plurality of light transmission portions 32 having a circular shape are formed in the diaphragm 30.
- the light transmitting portion 32 is a portion where the metal film 30A is not formed, and allows light transmission.
- a pair of openings 34 c having a circular shape are formed on the peripheral edge of the diaphragm 30.
- the opening 34 c is arranged at a position symmetrical to the center on a line passing through the center of the diaphragm 30.
- Resin portions 40 and 50 are made of transparent resins 40A and 50A. Resins 40A and 50A are photocurable resins. A plurality of lens portions 42 are formed on the resin portion 40. The lens portion 42 is a convex portion on the upper side, and its surface is an optical surface. A plurality of lens portions 52 are also formed on the resin portion 50. The lens portion 52 is a portion having a convex shape on the lower side, and the surface thereof is an optical surface.
- the lens part 42, the light transmission part 22, the light transmission part 32, and the lens part 52 are arranged at corresponding positions in the vertical direction in order from the top. The positions are all consistent with each other.
- the alignment mark 24c of the diaphragm 20 and the opening 34c of the diaphragm 30 are also arranged at corresponding positions in the vertical direction, and the positions coincide when viewed in plan.
- a diaphragm 20 is formed on the glass substrate 10 using a known photoetching technique.
- a metal film 20A is formed on the glass substrate 10 by a method such as vapor deposition or sputtering, and then a photoresist is coated. Thereafter, the resist is exposed and developed using a mask and an exposure apparatus.
- a mask having a pattern capable of forming the light transmitting portion 22 and the alignment marks 24a, 24b, and 24c with respect to the stop 20 is used. Thereafter, the metal film 20A is etched to form the diaphragm 20 having the light transmission part 22 and the alignment marks 24a, 24b, and 24c.
- the resin 40A in a monomer state (before curing) is placed on the glass substrate 10, the master 60 is pressed from above, and the cavity 40 of the master 60 is filled with the resin 40A. To do.
- the master 60 is a mold that is transferred from the mother master 70 (matrix), and is made of a transparent photocurable resin.
- the mother master 70 is made of silicon, metal, quartz, or the like.
- the mother master 70 includes a convex portion 72 having the same shape as the lens portion 42 of the resin portion 40 and alignment marks 24 a, 24 b, 24 c of the diaphragm 20. Corresponding positioning portions 74 are formed.
- the mother master 70 is filled with a transparent photocurable resin, and is irradiated with light and cured.
- a cavity 62 corresponding to the convex portion 72 of the mother master 70 and a positioning portion 64 corresponding to the positioning portion 74 of the mother master 70 are formed in the master 60.
- this is the resin portion 40. It is used as a mold for molding.
- the master 60 is pressed against the glass substrate 10 with the alignment mark 24a of the diaphragm 20 and the positioning portion 64 of the master 60 positioned, and then irradiated with light.
- the focus is set on the alignment mark 24a of the diaphragm 20 from above the glass substrate 10 (see (1) in FIG. 5). Thereafter, the microscope 90 is moved upward to place the master 60 at a position between the microscope 90 and the glass substrate 10, and while adjusting the height position of the microscope 90, the focus position is set to the positioning portion 64 of the master 60 or Match the vicinity (see (2) in FIG. 5).
- the glass substrate 10 on which the resin part 40 is formed is released from the master 60 and turned over, and the diaphragm 30 is formed on the other surface of the glass substrate 10 as shown in FIG.
- the diaphragm 30 is formed on the glass substrate 10 using a known lift-off technique. Specifically, a photoresist is coated (coated) on the glass substrate 10, and then the photoresist is exposed with a mask interposed between the photoresist and the exposure apparatus to form a resist image.
- a mask having a pattern shape capable of forming the light transmitting portion 32 and the opening 34c with respect to the stop 30 and having a positioning portion corresponding to the alignment mark 24b of the stop 20 is used.
- the mask positioning portion with respect to the alignment mark 24b is the same as the alignment portion 24a of the diaphragm 20 with the positioning portion 64 of the master 60 in the step of FIG. 3B.
- the exposure is performed in a state of matching.
- a metal film 30A is formed on a portion where there is no photoresist, and finally the remaining photoresist is peeled off to form a diaphragm 30.
- the resin 50A in a monomer state (before curing) is placed on the glass substrate 10 and the master 80 is pressed from above to fill the cavity 50 of the master 80 with the resin 50A. To do.
- the master 80 is manufactured by the same method as the master 60. That is, the master 80 is also a mold that is transferred from the mother master and is made of a transparent photocurable resin. Similarly to the master 60, the master 80 is also formed with a cavity 82 having a shape corresponding to the lens portion 52 of the resin portion 50 and a positioning portion (84) corresponding to the alignment mark 24c of the diaphragm 20. In the present embodiment, this is used as a mold for molding the resin portion 50.
- the alignment mark 24c of the diaphragm 20 is the same as the alignment mark 24a of the diaphragm 20 matched with the alignment mark 24a of the diaphragm 20 in the process of FIG.
- the master 80 is pressed against the glass substrate 10 and then irradiated with light.
- the alignment mark 24c and a positioning portion since the opening 34c is formed in the diaphragm 30 in the step of FIG. 3C, the visibility of the microscope 90 is sufficiently secured, and the glass substrate 10 On the other hand, it is prevented that the master 80 is pressed in a shifted state.
- the glass substrate 10 on which the resin part 50 is formed is released from the master 80, and the wafer lens 1 is manufactured.
- three pairs of alignment marks 24a, 24b, and 24c are formed on the diaphragm 20, and the resin portion 40, the diaphragm 30, and the resin portion 50 are positioned and formed on the basis of the alignment marks 24a, 24b, and 24c, respectively. is doing.
- the resin mark 40 (lens part 42) is used for the alignment mark 24a using the positioning part 64 of the master 60
- the aperture 30 is used for the alignment mark 24b using the positioning part of the exposure mask.
- the resin part 50 (lens part 52) is formed using the positioning part 84 of the master 80 (see FIG. 2).
- the positioning reference can be concentrated on the diaphragm 20, and the diaphragms 20, 30, and the resin parts 40, 50 can be suppressed to the minimum error range when stacked in a state where they are displaced in the horizontal direction.
- the lens part 42, the light transmission part 22 of the diaphragm 20, the light transmission part 32 of the diaphragm 30, and the lens 52 of the resin part 50 can be matched with high accuracy in the optical axis direction.
- an alignment mark may be attached to one place of the glass substrate 10 and used as a reference for positioning the diaphragms 20, 30 and the resin parts 40, 50.
- the apertures 20 and 30 may be formed by matching the alignment portions of the mask with the alignment marks, and the resin portions 40 and 50 may be formed by matching the positioning portions 64 and 84 of the masters 60 and 80.
- the apertures 20 and 30 need to be formed with openings through which the alignment marks can be visually recognized, and the alignment marks are aligned with the positioning portions 64 and 84 of the masters 60 and 80 through the openings.
- the diaphragms 20 and 30 may be configured by printing (printing / drawing) instead of the metal films 20A and 30A.
- the diaphragms 20 and 30 may be made of a photoresist containing a light shielding material such as carbon black instead of the metal films 20A and 30A. That is, a predetermined pattern of apertures may be formed by applying a photoresist containing carbon black on one surface of the substrate and then exposing and developing the photoresist. For example, taking the case of forming the aperture 20 as an example, as shown in FIG. 7, a photoresist 20B containing carbon black is applied to the glass substrate 10, exposed and developed, and the remaining photoresist 20B is applied. The diaphragm 20 is used as it is. In this case, the process (sputtering, vapor deposition, etching, etc.) concerning the metal films 20A and 20B can be omitted, and the manufacturing process of the wafer lens 1 can be simplified.
- a photoresist containing a light shielding material such as carbon black
- the second embodiment is different from the first embodiment mainly in the following points, and is otherwise the same as the first embodiment.
- a wafer lens 101 is laminated on the wafer lens 1 to form a wafer lens assembly 100.
- a spacer 140 is bonded to the lower portion of the resin portion 50 of the wafer lens 1 through an adhesive layer 142.
- the spacer 140 is a disk-shaped member made of glass or transparent resin, and an opening is formed at a position corresponding to the lens portion 52 of the wafer lens 1 (the lens portion 52 is exposed from the opening. ing).
- the adhesive layer 142 is composed of an adhesive 142A made of a photocurable resin.
- a spacer 150 is also provided between the wafer lens 1 and the wafer lens 101 via adhesive layers 152 and 154.
- the spacer 150 is also a disk-shaped member made of glass or transparent resin, and an opening is formed at a position corresponding to the lens part 42 of the wafer lens 1 and the lens part 52 of the wafer lens 101 (the relevant part). The lens portions 42 and 52 are exposed from the opening).
- the adhesive layers 152 and 154 are composed of adhesives 152A and 154A made of a photocurable resin.
- the wafer lens 101 uses diaphragms 120 and 130 instead of the diaphragms 20 and 30 of the wafer lens 1.
- the diaphragms 120 and 130 have slightly different pattern shapes from the diaphragms 20 and 30 of the wafer lens 1.
- the diaphragm 120 is not formed with the alignment marks 24a, 24b, and 24c of FIG. 2, but is composed of a metal film 120A.
- the diaphragm 130 is formed with a metal film 130A so as to surround the light transmitting portion 32, and does not have the opening 34c of FIG.
- the spacer 150 (adhesive layer 154) is opposed to a portion where the diaphragm 130 is not formed.
- the diaphragms 120 and 130 may be made of a light-shielding resist, a silicon film, a carbon film, or the like.
- the wafer lens 1 is manufactured, and the spacer 140 is erected on the manufactured wafer lens 1.
- an adhesive 142 ⁇ / b> A is applied to the upper surface of the resin portion 50 of the wafer lens 1 or the lower surface of the spacer 140, and the spacer 140 is placed on the wafer lens 1.
- light is irradiated from above the spacer 140 to cure the adhesive 142 ⁇ / b> A, and the spacer 140 is fixed to the wafer lens 1.
- the spacer 150 is fixed to the resin portion 40 of the wafer lens 1 as shown in FIG. 10B (the product manufactured thereby is referred to as “precursor 160A”). That said.)
- a part of the wafer lens 101 is manufactured separately from the process of FIG. Specifically, as shown in FIG. 11A, a metal film 130A is formed on the glass substrate 10 using a known photoetching technique or lift-off technique, and the aperture 130 is formed. In this case, a mask having a pattern shape capable of forming the diaphragm 130 is used as the mask.
- the resin 82A is irradiated with light in a state where the cavity 82 of the master 80 is filled with the resin 50A. 50 (the manufactured product is referred to as “precursor 160B”).
- an adhesive 154A is applied to the upper surface of the spacer 150 of the precursor 160A or the lower surface of the resin portion 50 of the precursor 160B, and the precursor 160B is placed on the precursor 160A. . Thereafter, light is irradiated from above the glass substrate 10 of the precursor 160B to cure the adhesive 154A, and the spacer 150 is fixed between the precursors 160A and 160B.
- a metal film is formed on the glass substrate 10 of the precursor 160B by using a known photo-etching technique or lift-off technique, and the diaphragm 120 is formed.
- a mask having a positioning portion at a position corresponding to any of the alignment marks 24a, 24b, and 24c of the diaphragm 20 of the precursor 160A is preferably used as a mask, and the horizontal displacement of the diaphragm 120 with respect to the diaphragm 20 is prevented. To prevent.
- the diaphragm 160 is not formed on the upper surface of the glass substrate 10 of the precursor 160B (the surface on which the optical surface is not formed) from the beginning.
- the aperture 120 is formed after the precursor 160A is bonded to the precursor 160A, and the upper surface of the glass substrate 10 of the precursor 160B from the beginning before the precursor 160B and the precursor 160A are bonded.
- a diaphragm pattern capable of entering light is formed in advance on the glass substrate 10 of the precursor 160B at a portion that is bonded (opposed) to the spacer 150, and the precursor 160B is directly bonded to the precursor 160A. You may do it.
- the resin 62A is irradiated with light in a state where the cavity 62 of the master 60 is filled with the resin 40A. 40 is formed.
- an opening is formed at a position corresponding to the alignment mark 24a of the precursor 160A with respect to the diaphragm 120, and the master 60 is formed on the alignment mark 24a through the opening. If the positioning portions 64 are matched, the horizontal displacement of the resin portion 40 on the precursor 160B with respect to the diaphragm 20 can be prevented.
- the glass substrate 10 on which the resin portion 40 is formed is released from the master 60, and the wafer lens assembly 100 is manufactured.
- the diaphragm 130 is not formed at a position facing the spacer 150 (see FIG. 11). Therefore, when the precursor 160A and the precursor 160B are bonded, the bonding is performed.
- the light for curing the agent 154A is directly incident on the adhesive 154A through the glass substrate 10 of the precursor 160B (see FIG. 12A), and the adhesive 154A can be reliably cured.
- the precursor 160A is described as an example in which separate spacers 140 and 150 are bonded to a glass substrate. However, as shown in FIG.
- the structure body A in which the spacer portion 251A for defining the interval between the other substrate and the resin portion 250A to be formed is integrally formed, may be bonded to the other substrate. Similarly, the spacer portion 251B may be joined to the structure B formed integrally.
- the structures A and B are joined and then cured by light irradiation.
- the diaphragm 254 is formed only on both surfaces of the substrate of the structure A as shown in FIG. 18 so that the diaphragm 254 does not hinder the light irradiation to the adhesive to be cured. What is necessary is just to take the structure irradiated from the bottom part side of B.
- the resin portion 250A corresponding to the lens portion is molded on the bottom side of the structure B, or a separate spacer 253 is bonded via an adhesive. Also good.
- a diaphragm may be formed in advance on the bottom surface side of the glass substrate to be joined to the spacer 253 at a portion where the adhesive is not applied.
- the spacers 140 and 150 may be made of frosted glass.
- the surface roughness Ra of the side wall of the hole portion (opening portion corresponding to the lens portions 42 and 52) is 0.1 ⁇ m or more.
- the spacer is usually glass, it is bonded to the substrate surface as a glass flat plate by an adhesive made of a photo-curable resin or the like.
- glass generally reflects the irradiation light, and the amount of light that can enter the glass from air is reduced by a fraction of the time, especially under conditions with a large incident angle. This may cause a problem that it is not incident on the surface and cannot be securely bonded.
- the incident direction of the light for curing the adhesive is usually the optical axis direction of the optical surface formed to avoid the shadow of the diaphragm, which is against the side wall of the optical path hole formed in the spacer.
- the angle is very shallow (incident angle is large)
- the surface roughness of the side wall is small, most of the incident light amount is reflected.
- Rayleigh scattering occurs, so if there is a surface roughness of this level on the side wall of the spacer, the incident light enters the spacer due to the scattering effect. Can be expected.
- the average unevenness width (Rz, Rty, etc.) of the surface roughness is a value 3 to 4 times the average surface roughness Ra. Accordingly, it can be said that the Ra value is preferably about 0.1 ⁇ m or more in order to obtain the scattering effect. On the other hand, if the Ra value is too large, the side wall surface becomes a completely crushed surface, which is not preferable because it is easily broken and the upper limit value is about 1 ⁇ m.
- the wafer lens assembly 100 is fragmented for each of the lens portions 42 and 52 and used for an optical system or the like of the imaging apparatus.
- the wafer lens assembly 100 is thick enough to stack the wafer lens 101 and the spacers 140 and 150 on the wafer lens 1 alone. Is getting bigger. For this reason, the diaphragm 20, 30, 120 may not be formed at the cutting portion C (see FIG. 12C) between the lens portions 42, 52, and the cutting process may be easily performed.
- [Third Embodiment] 3rd Embodiment forms the resin part 50 using the 1st jig
- the axial thickness of the optical member is regulated by the amount of the curable resin that is the molding material of the optical member, the viscosity, and the moving distance of the mold to the glass flat plate. Since the axial thickness is directly affected by the measurement error of the resin volume, the accuracy of the wafer lens cannot be improved.
- the embodiment has been made in view of the above circumstances, and a wafer lens manufacturing method and a wafer lens capable of manufacturing a highly accurate wafer lens with the axial thicknesses of the optical members provided on both surfaces being constant, respectively. It is an object of the present invention to provide a method for manufacturing a wafer lens assembly in which a plurality of layers are stacked to manufacture a wafer lens assembly.
- a method for producing a wafer lens wherein a first optical member made of a curable resin is provided on one surface of a substrate, and a second optical member made of a curable resin is provided on the other surface of the substrate, Using the first master mold having the molding surface of the first optical member, the first optical member is molded on one surface of the substrate, and the surface on the first optical member side Of the second master molding die having the first contact surface that contacts the second optical member and the molding surface of the second optical member, the second contact surface that abuts the pressing surface that presses the other surface of the substrate. The first optical member side surface is brought into contact with the first contact surface, and the other surface of the substrate and the second surface are used. Filling the molding surface of the master mold with the curable resin and bringing the pressing surface into contact with the second contact surface Therefore those forming said second optical member.
- a method of manufacturing a wafer lens assembly for manufacturing a wafer lens assembly by laminating wafer lenses manufactured by the wafer lens manufacturing method of the above-described embodiment with a spacer interposed therebetween.
- the one surface of the spacer is disposed on the surface of the one wafer lens on the second optical member side, the pressing portion that presses the other surface of the spacer, and the first surface of the one wafer lens.
- a second abutting surface comprising a third abutting surface that abuts the surface of the first optical member and a fourth abutting surface that abuts a pressing surface that presses the other surface of the spacer of the pressing portion.
- first optical member side surface of the one wafer lens is brought into contact with the third contact surface, and the second optical member side of the one wafer lens is used.
- Surface and spacer An adhesive made of a photo-curable resin is applied to one surface of the spacer, and the other surface of the spacer is pressed by the pressing portion to bring the pressing surface into contact with the fourth contact surface. After that, the spacer is adhered by light irradiation.
- the first jig 210 has a base 211, and a recess 212 on which the wafer lens 1 is placed is formed on the upper surface of the base 211.
- the central portion of the concave portion 212 is opened up and down, and the wafer lens 1 is placed on the bottom surface 213 forming the concave portion 212.
- the bottom surface 213 is a first contact surface 213 ⁇ / b> A with which the outer peripheral edge of the lower surface of the resin portion 40 contacts.
- the upper surface 214 of the base 211 is a second contact surface 214A with which the pressing surface 81 that presses the resin 50A filled in the upper surface of the glass substrate 10 in the master 80 contacts.
- first jig 210 Using such a first jig 210, first, the outer peripheral edge of the lower surface of the resin portion 40 is brought into contact with the first contact surface 213A. Then, the resin 50A in the monomer state is placed on the glass substrate 10, the master 80 is moved downward from above, and the pressing surface 81 of the master 80 is brought into contact with the second contact surface 214A. . Thus, the resin 50A is filled into the cavity 82 of the master 80.
- the resin portion 50 (lens portion 52) is formed by irradiating light in the same manner as in the first embodiment and curing the resin 50A.
- the first jig 210 may have a configuration in which a jig portion 215a is installed on the upper surface of the base 211a as shown in FIG.
- the upper surface of the base 211a is a first contact surface 213Aa
- the upper surface of the jig portion 215a is a second contact surface 214Aa.
- the spacer 140 is first placed on the wafer lens 1 manufactured as described above, using the pressing portion 230 and the second jig 220.
- the pressing portion 230 presses the upper surface of the spacer 140 placed on the upper surface of the resin portion 50 of the wafer lens 1.
- the pressing surface 231 of the pressing portion 230 is a horizontal plane.
- the second jig 220 is basically similar in shape to the first jig 210, but has a third contact surface 223 ⁇ / b> A and a fourth contact surface 224 ⁇ / b> A as compared to the first jig 210.
- the height between the two is approximately the height of the spacer 140.
- the second jig 220 has a base 221 in which a recess 222 is formed.
- the bottom surface 223 that forms the concave portion 222 is a third contact surface 223 ⁇ / b> A with which the outer peripheral edge of the lower surface of the resin portion 40 contacts.
- the upper surface 224 of the base 221 is a fourth contact surface 224 ⁇ / b> A that contacts the pressing surface 231 of the pressing portion 230.
- the spacer 140 is bonded to the wafer lens 1 by irradiating light from above the spacer 140 and curing the adhesive 142A.
- the second jig 220 may have a configuration in which two jig portions 226a and 227a are sequentially installed on the upper surface of the base 221a as shown in FIG.
- the upper surface of the base 221a is the third contact surface 223Aa
- the upper surface of the jig portion 227a is the fourth contact surface 224Aa.
- the height of the spacer 140 can be increased by appropriately changing only the height of the jig part 227a. The position can be easily adjusted.
- the first contact surface 213A of the first jig 210 is used as a reference surface, and the lower surface of the resin portion 40 is brought into contact with the first contact surface 213A, so that the cavity of the master 80
- the resin 50A between 82 and the upper surface of the glass substrate 10 is pressed by bringing the pressing surface 81 of the master 80 into contact with the second contact surface 214A. Therefore, even if the substrate thickness varies, the distance between the first contact surface 213A and the second contact surface 214A can be kept constant. As a result, a highly accurate wafer lens 1 in which the axial thickness M (see FIG. 8) of the two lens portions 42 and 52 is constant can be obtained.
- the third contact surface 223A of the second jig 220 is used as a reference surface, and the lower surface of the resin portion 40 is brought into contact with the third contact surface 223A.
- the adhesive 142A between the lower surface of the resin portion 50 and the upper surface of the resin portion 50 is pressed by bringing the pressing surface 231 of the pressing portion 230 into contact with the fourth contact surface 224A. Therefore, the distance between the third contact surface 223A and the fourth contact surface 224A can be kept constant.
- the distance between the lens portion 52 of the wafer lens 1 and the lens portion 42 on the lower surface side of the other wafer lens 101 laminated above the wafer lens 1 (for example, the lens portion 42 of the wafer lens 1 in FIG. 8). N) between the surface and the lens portion 52 of the wafer lens 101 can be made constant.
- the resin portion 50 is formed on the lower surface of the glass substrate 10, and the spacer 140 is bonded using the pressing portion 330 and the third jig 310. Thereafter, as shown in FIG. 17B, the resin portion 40 is formed on the upper surface of the glass substrate 10 using the fourth jig 320.
- the spacer 140 is bonded to the glass substrate 10 without forming the diaphragm 20 from the beginning on the upper surface of the glass substrate 10 (the surface on which the optical surface is not formed). After that, the diaphragm 20 is formed, but before the spacer 140 is bonded, the diaphragm 20 is formed in advance on the upper surface of the glass substrate 10 and the spacer 140 is bonded to the glass substrate 10. You may make it do.
- the third jig 310 has a base 311, and a recess 312 on which the spacer 140 is placed is formed on the upper surface of the base 311.
- the bottom surface 313 forming the recess 312 is a fifth contact surface 313A with which the lower surface of the spacer 140 contacts.
- the upper surface 314 of the base 311 is a sixth contact surface 314 ⁇ / b> A that contacts the pressing surface 331 of the pressing portion 330.
- the lower surface of the spacer 140 is brought into contact with the fifth contact surface 313A, and the spacer 140 is placed at a predetermined position.
- the adhesive 142 ⁇ / b> A is applied to the upper surface of the spacer 140 or the lower surface of the resin portion 50.
- the pressing portion 330 is moved downward, and the pressing surface 331 of the pressing portion 330 is brought into contact with the sixth contact surface 314A.
- the upper surface of the spacer 140 is pressed by the lower surface of the resin portion 50.
- the spacer 140 is bonded to the resin portion 50 by irradiating light from below the spacer 140 to cure the adhesive 142A.
- the resin part 40 is molded on the upper surface of the glass substrate 10 to which the spacer 140 is bonded as described above, using the fourth jig 320.
- the fourth jig 320 is basically the same in shape as the third jig 310, but compared with the third jig 310, the seventh contact surface 323A and the eighth contact surface 324A. The height between the two is increased by the thickness of the diaphragm 20.
- the fourth jig 320 has a base 321 in which a recess 322 is formed.
- a bottom surface 323 that forms the recess 322 is a seventh contact surface 323A on which the lower surface of the spacer 140 contacts.
- the upper surface 324 of the base 321 is an eighth contact surface 324A with which the pressing surface 61 of the master 60 contacts.
- the lower surface of the spacer 140 is first brought into contact with the seventh contact surface 323A. Then, the resin 40A in the monomer state is placed on the glass substrate 10 and the master 60 is moved downward from above, and the pressing surface 61 of the master 60 is brought into contact with the eighth contact surface 324A. Thus, the resin 40A is filled in the cavity 62 of the master 360.
- the resin portion 40 (lens portion 42) is formed by irradiating light in the same manner as in the first embodiment and curing the resin 40A.
- the lower surface of the spacer 140 is brought into contact with the fifth contact surface 313A using the fifth contact surface 313A of the third jig 310 as a reference surface, and the upper surface of the spacer 140 and the resin
- the adhesive 142 ⁇ / b> A between the lower surface of the portion 50 is pressed by bringing the pressing surface 331 of the pressing portion 330 into contact with the sixth contact surface 314 ⁇ / b> A. Therefore, the distance between the fifth contact surface 313A and the sixth contact surface 314A can be kept constant.
- the distance between the lens portion 52 of the wafer lens 1 and the lens portion 42 on the upper surface side of the other wafer lens 101 to be laminated below the wafer lens 1 (for example, the surface distance N shown in FIG. 8) is constant. Can be.
- the lower surface of the spacer 140 is brought into contact with the seventh contact surface 323A with reference to the seventh contact surface 323A of the fourth jig 320, and the cavity of the master 60
- the resin 40A between 62 and the upper surface of the glass substrate 10 is pressed by bringing the pressing surface 61 of the master 60 into contact with the eighth contact surface 324A. Therefore, even if the substrate thickness varies, the distance between the seventh contact surface 323A and the eighth contact surface 324A can be kept constant. As a result, a highly accurate wafer lens 1 in which the axial thickness M (see FIG. 8) of the two lens portions 42 and 52 is constant can be obtained.
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Abstract
Description
図1に示す通り、ウエハレンズ1は主にガラス基板10、絞り20,30、樹脂部40,50で構成されている。図1は図2のI-I線断面図である。ガラス基板10はウエハレンズ1の中央部に配置されており、ガラス基板10の上下には絞り20,30がそれぞれ形成されている。ガラス基板10の上部には樹脂部40が形成されており、樹脂部40は絞り20間の隙間を覆っている。ガラス基板10の下部には樹脂部50が形成されており、樹脂部50は絞り30間の隙間を覆っている。
絞り20にアライメントマーク24a,24b,24cを形成せずに、ガラス基板10の1箇所にアライメントマークを付してこれを絞り20,30、樹脂部40,50の位置決めの基準としてもよい。すなわち、当該アライメントマークに対し、マスクの位置決め部を合致させて絞り20,30を形成し、マスター60,80の位置決め部64,84を合致させて樹脂部40,50を形成すればよい。この場合、絞り20,30には当該アライメントマークを視認可能な開口部を形成する必要があり、その開口部を介して当該アライメントマークとマスター60,80の位置決め部64,84を合致させる。
絞り20,30は、金属膜20A,30Aに代えて、プリント(印刷・描画)により構成されてもよい。
第2の実施形態は主には下記の点で第1の実施形態と異なっており、それ以外は第1の実施形態と同様である。
スペーサー140,150をすりガラスで構成してもよく、好ましくは穴部分(レンズ部42,52に対応する開口部分)の側壁の表面粗さRaを0.1μm以上とする。スペーサーは通常ガラスであるので、ガラス平板としての基板表面に光硬化性樹脂製の接着剤等によって接着される。しかしながらガラスは一般的に照射光を反射し、特に入射角が大きい条件では空気からガラス内に入射できる光量は数分の一に減少してしまい、光を照射した際でも接着剤に光が十分に入射せず、確実に接着できないという問題が生じ得る。
ウエハレンズ101の絞り130,樹脂部50に関し、前駆体160Aと前駆体160Bとを接着する場合に精密な位置決めをしないから、ウエハレンズ1のレンズ部42,52とウエハレンズ101のレンズ部52とが多少ずれる可能性がある。そのため、樹脂部50のレンズ部52の光学精度は多少低下してもよいし、又は絞り130,樹脂部50を形成せずに前駆体160Bのガラス基板10をそのまま前駆体160Aに接着するようにしてもよい。
接着剤142A,152A,154Aを光・熱硬化併用樹脂製の接着剤に代えて、これらを硬化させる場合に、先に光照射して半硬化させ、その後に熱を加えて完全に硬化させるようにしてもよい。
ウエハレンズ集合体100は、レンズ部42,52ごとに断片化され撮像装置の光学系等に使用されるが、ウエハレンズ1単体に対しウエハレンズ101やスペーサー140,150を積み重ねている分だけ厚みが大きくなっている。そのため、レンズ部42,52間の切断部位C(図12(c)参照)には絞り20,30,120を形成せず、切断処理を容易に行えるようにしてもよい。
第3の実施形態は、第1の実施の形態の図3(d)の工程で、図13に示す通り、第1の治具210を使用して樹脂部50を形成する。さらに、第2の実施の形態の図10(a)の工程で、図15に示す通り、押さえ部230及び第2の治具220を使用してスペーサー140を接着する場合であり、それ以外は第1の実施の形態と同様である。 そもそも、光学部材をガラス平板の両面に形成する場合、互いに上下に配置された2つの光学部材の軸上厚をそれぞれ一定にすることは高精度なウエハレンズとしての要求仕様である。しかしながら、従来では、光学部材の成形材料である硬化性樹脂の量、粘度及び成形型のガラス平板への移動距離によって光学部材の軸上厚を規制していたため、保管や成形中の温度変化あるいは樹脂体積の計量誤差によって直接、軸上厚が影響を受けるため、ウエハレンズの精度向上を図れなかった。
基板の一方の面に硬化性樹脂製の第1の光学部材が設けられ、前記基板の他方の面に硬化性樹脂製の第2の光学部材が設けられたウエハレンズの製造方法であって、前記第1の光学部材の成形面を有する第1のマスター成形型を使用して、前記基板の一方の面に前記第1の光学部材を成形しておき、前記第1の光学部材側の表面が当接する第1の当接面と、前記第2の光学部材の成形面を有する第2のマスター成形型のうち、前記基板の前記他方の面を押圧する押圧面が当接する第2の当接面と、を備える第1の治具を使用して、前記第1の当接面に前記第1の光学部材側の表面を当接させ、前記基板の前記他方の面と前記第2のマスター成形型の成形面との間に前記硬化性樹脂を充填して、前記押圧面を前記第2の当接面に当接させることによって前記第2の光学部材を成形するものである。
変形例では、図17(a)に示す通り、ガラス基板10の下面に樹脂部50を成形し、押さえ部330及び第3の治具310を使用してスペーサー140を接着する。その後、図17(b)に示す通り、ガラス基板10の上面に第4の治具320を使用して樹脂部40を成形する。
10 ガラス基板
20 絞り(第1の絞り)
20A 金属膜
22 光透過部
24a,24b,24c アライメントマーク
30 絞り(第2の絞り)
30A 金属膜
32 光透過部
34c 開口部
40 樹脂部(第1の光学部材)
40A 樹脂
42 レンズ部
50 樹脂部(第2の光学部材)
50A 樹脂
52 レンズ部
60 マスター(第1のマスター成形型)
62 キャビティ
64 位置決め部
70 マザーマスター(母型)
72 凸部
74 位置決め部
80 マスター(第2のマスター成形型)
81 押圧面
82 キャビティ
84 位置決め部
100 ウエハレンズ集合体
101 ウエハレンズ
120 絞り
130 絞り
134 開口部
140 スペーサー
142 接着層
142A 接着剤
150 スペーサー
152,154 接着層
152A,154A 接着剤
160A,160B 前駆体
210 第1の治具
213A 第1の当接面
214A 第2の当接面
220 第2の治具
223A 第3の当接面
224A 第4の当接面
230 押さえ部
231 押圧面
Claims (9)
- 表面と裏面とを有し、前記表面及び裏面のうち少なくとも一方の面に、硬化性樹脂製の複数の光学部材を設けた第1基板と、前記第1基板の表面又は裏面に接合される第2基板と、前記第1基板と前記第2基板との間に設けられ、前記光学部材に対して入射する光の量を調整する絞り部材と、を有し、前記第1基板と前記第2基板とは光硬化性樹脂からなる接着剤を介して接合されるウエハレンズ集合体の製造方法であって、
前記第1基板の前記第2基板との接合部又は前記第2基板の前記第1基板との接合部に光硬化性樹脂からなる接着剤を塗布する接着剤塗布工程と、
前記第1基板と前記第2基板との間に絞り部材を形成する工程と、
前記絞り部材を形成する工程後、前記接着剤塗布工程で塗布された接着剤に対して、光を照射して前記接着剤の硬化を進める光硬化工程と、を有し、
前記絞り部材は、前記光硬化工程で照射される光が前記接着剤に到達することを妨げない位置に形成されることを特徴とするウエハレンズ集合体の製造方法。 - 表面と裏面とを有する基板の一方の面に硬化性樹脂製の複数の第1の光学部材、他方の面に硬化性樹脂製の複数の第2の光学部材、前記基板の表面又は裏面の前記複数の第1又は第2光学部材の各々に絞り部材が設けられたウエハレンズの製造方法であって、
前記基板の前記一方の面にアライメントマークを形成する工程と、
前記アライメントマークに対して前記第1の光学部材の成形面を有する第1成形型を位置決めした状態で、前記第1成形型と前記基板との間に前記硬化性樹脂を充填し硬化させて前記第1の光学部材を成形する工程と、
前記基板の表面又は裏面に絞り部材を形成する工程と、
前記アライメントマークに対して前記第2の光学部材の成形面を有する第2成形型を位置決めした状態で、前記第2成形型と前記基板との間に前記硬化性樹脂を充填し硬化させて前記第2の光学部材を成形する工程と、を有し、
前記絞り部材を形成する工程により形成される絞り部材は、前記第1又は第2成形型と前記アライメントマークとの位置決めを阻害しない位置に形成されることを特徴とするウエハレンズの製造方法。 - 前記絞り部材を形成する工程により形成される絞り部材は、前記第1又は第2成形型と前記アライメントマークとの位置決めの際に用いられる顕微鏡での焦点合わせを阻害しないような開口部が形成されていることを特徴とする請求項2記載のウエハレンズの製造方法。
- 前記絞り部材を形成する工程は、前記基板の表面及び裏面の少なくとも一方の面に形成する工程であることを特徴とする請求項2又は3記載のウエハレンズの製造方法。
- 基板の一方の面に絞り部材を形成し、前記絞り部材の表面に硬化性樹脂製の光学部材を設けたウエハレンズを、スペーサーを介在させて、互いに上下に積層させてウエハレンズ集合体を製造するためのウエハレンズ集合体の製造方法であって、
一方のウエハレンズの一方の面と、前記スペーサーの一方の面との間に光硬化性樹脂製の接着剤を塗布して光照射することによって、前記スペーサーと前記一方のウエハレンズとを接着し、
前記他方のウエハレンズのうち前記スペーサーの他方の面に対応する位置には、前記絞り部材を形成せずに、
前記他方のウエハレンズの前記一方のウエハレンズに対向する面で、前記絞り部材が形成されていない部位に、前記スペーサーの他方の面を配置して、
前記スペーサーの他方の面と、前記他方のウエハレンズの前記絞り部材が形成されていない部位との間に、前記接着剤を塗布して光照射することによって、前記スペーサーと前記他方のウエハレンズとを接着することを特徴とするウエハレンズ集合体の製造方法。 - 前記絞り部材は、前記第2基板と接合する前記第1基板の面上に形成されていることを特徴とする請求項1記載のウエハレンズ集合体の製造方法。
- 前記第2基板は、前記第1基板の複数の光学部材に対応する位置に複数の開口部が形成されたスペーサー部材であることを特徴とする請求項1記載のウエハレンズ集合体の製造方法。
- 前記絞り部材は、前記第1基板の表面又は裏面の一方にカーボンブラックを含むフォトレジストを塗布した後に、前記フォトレジストを露光・現像することによって形成されていることを特徴とする請求項1記載のウエハレンズ集合体の製造方法。
- 基板の一方の面に第1の絞り部材が設けられ、前記第1の絞り部材の表面に硬化性樹脂製の第1の光学部材が設けられ、前記基板の他方の面に第2の絞り部材が設けられ、前記第2の絞り部材の表面に硬化性樹脂製の第2の光学部材が設けられたウエハレンズの製造方法であって、
前記基板の前記一方の面に複数のアライメントマーク及び前記第1の絞り部材を形成し、 次いで、前記複数のアライメントマークのうち所定のアライメントマークに対して前記第1の光学部材の成形面を有する第1成形型を位置決めした状態で、前記第1の絞り部材の表面と前記第1成形型との間に前記硬化性樹脂を充填し硬化させて前記第1の光学部材を成形し、
次いで、前記複数のアライメントマークのうち所定のアライメントマークに対して、前記基板の前記他方の面にマスクを位置決めした状態で、前記第2の絞り部材を形成し、
次いで、前記複数のアライメントマークのうち所定のアライメントマークに対して前記第2の光学部材の成形面を有する第2成形型を位置決めした状態で、前記第2の絞りの表面と前記第2のマスター成形型との間に前記硬化性樹脂を充填し硬化させて前記第2の光学部材を成形することを特徴とするウエハレンズの製造方法。
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US12/682,460 US8194323B2 (en) | 2008-04-28 | 2009-04-08 | Method for producing wafer lens assembly and method for producing wafer lens |
JP2009536949A JP4420141B2 (ja) | 2008-04-28 | 2009-04-08 | ウエハレンズの製造方法及びウエハレンズ |
CN2009801144619A CN102016653B (zh) | 2008-04-28 | 2009-04-08 | 晶圆透镜聚合体的制造方法及晶圆透镜的制造方法 |
EP09738693.2A EP2273289B1 (en) | 2008-04-28 | 2009-04-08 | Method for producing wafer lens assembly |
US13/462,069 US8456743B2 (en) | 2008-04-28 | 2012-05-02 | Method for producing wafer lens assembly and method for producing wafer lens |
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US12/682,460 A-371-Of-International US8194323B2 (en) | 2008-04-28 | 2009-04-08 | Method for producing wafer lens assembly and method for producing wafer lens |
US13/462,069 Continuation US8456743B2 (en) | 2008-04-28 | 2012-05-02 | Method for producing wafer lens assembly and method for producing wafer lens |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2011114883A1 (ja) * | 2010-03-18 | 2011-09-22 | コニカミノルタオプト株式会社 | レジストパターン形成装置およびレジストパターン形成方法ならびにウエハレンズの製造方法 |
WO2011136138A1 (ja) * | 2010-04-27 | 2011-11-03 | コニカミノルタオプト株式会社 | 撮像用レンズ、ウエハレンズ、ウエハレンズ積層体、撮像用レンズの製造方法、撮像用レンズの中間物、撮像用レンズの中間物の製造方法 |
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JP2014508331A (ja) * | 2011-03-11 | 2014-04-03 | アンテルヨン インターナショナル ビー.ブイ. | 光学ユニット |
CN104854483A (zh) * | 2012-12-15 | 2015-08-19 | 柯尼卡美能达株式会社 | 透镜阵列构造体的制造方法以及透镜阵列构造体 |
CN104937445A (zh) * | 2012-12-27 | 2015-09-23 | 赫普塔冈微光有限公司 | 光学元件制造以及并入有所述光学元件的模块 |
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Also Published As
Publication number | Publication date |
---|---|
EP2273289A4 (en) | 2012-02-29 |
US8194323B2 (en) | 2012-06-05 |
EP2273289A1 (en) | 2011-01-12 |
JP4466789B2 (ja) | 2010-05-26 |
JPWO2009133756A1 (ja) | 2011-09-01 |
EP2273289B1 (en) | 2015-01-21 |
CN103323893A (zh) | 2013-09-25 |
US20120212829A1 (en) | 2012-08-23 |
US8456743B2 (en) | 2013-06-04 |
CN102016653A (zh) | 2011-04-13 |
JP5310569B2 (ja) | 2013-10-09 |
JP2009301061A (ja) | 2009-12-24 |
JP2010072665A (ja) | 2010-04-02 |
CN103323893B (zh) | 2015-07-29 |
CN102016653B (zh) | 2013-07-10 |
US20100208354A1 (en) | 2010-08-19 |
JP4420141B2 (ja) | 2010-02-24 |
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