WO2009104463A1 - 真空処理装置、真空処理装置のメンテナンス方法および真空処理工場 - Google Patents
真空処理装置、真空処理装置のメンテナンス方法および真空処理工場 Download PDFInfo
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- WO2009104463A1 WO2009104463A1 PCT/JP2009/051415 JP2009051415W WO2009104463A1 WO 2009104463 A1 WO2009104463 A1 WO 2009104463A1 JP 2009051415 W JP2009051415 W JP 2009051415W WO 2009104463 A1 WO2009104463 A1 WO 2009104463A1
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- vacuum processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Definitions
- the present invention relates to a vacuum processing apparatus that performs vacuum processing on an object to be processed and a maintenance method for the vacuum processing apparatus, and in particular, a first processing chamber that accommodates an object to be processed and performs vacuum processing, and before the vacuum processing is performed.
- the present invention relates to a vacuum processing apparatus having a second processing chamber that can be evacuated to accommodate the object to be processed and the object to be processed after vacuum processing, and a maintenance method for the vacuum processing apparatus.
- Conventional vacuum processing apparatuses used for film formation and etching of semiconductor films, insulating films, metal films, and the like generally include a load lock chamber and a vacuum processing chamber.
- the load lock chamber After the substrate is carried in, evacuation is performed and the substrate is preheated.
- the vacuum processing chamber the substrate heated in the load lock chamber is carried in, and film formation or etching processing is performed on the substrate.
- a vacuum processing apparatus in order to improve production efficiency, it is necessary to process a substrate continuously in a vacuum processing chamber, and it is necessary to continuously supply a preheated substrate. For this reason, a vacuum processing apparatus further provided with an unload lock chamber in which a substrate is carried out of the vacuum processing chamber is used.
- Patent Document 1 discloses a vacuum processing apparatus provided with a vacuum preheating chamber serving both as a load lock chamber and an unload lock chamber. Such a configuration has an advantage that the installation area of the vacuum processing apparatus can be reduced.
- a vacuum processing apparatus described in Japanese Patent Application Laid-Open No. 2001-239144 includes a vacuum preheating apparatus that preheats a substrate and a processing chamber that processes the substrate conveyed from the vacuum preheating apparatus.
- the substrate processed in the processing chamber is transferred by an arbitrary substrate transfer unit among the plurality of substrate transfer units in the vacuum preheating device.
- Patent Document 2 discloses a plasma processing apparatus in which a plurality of pairs of cathode electrodes and anode electrodes are arranged. JP 2001-239144 A US Pat. No. 4,289,598
- Patent Document 1 a plurality of members for performing vacuum processing on the substrate are arranged, and inside the vacuum processing chamber, The maintainability of the positioned member is poor.
- a pair of a cathode electrode and an anode electrode as described in US Pat. No. 4,289,598 Patent Document 2 is added to a vacuum device described in JP-A-2001-239144 (Patent Document 1).
- Patent Document 2 a configuration in which a plurality of pairs are arranged in the direction perpendicular to the transport direction is adopted, the maintainability of the members located inside the vacuum processing chamber is further deteriorated.
- An ordinary vacuum processing apparatus is provided with an opening door for opening an upper surface or a side surface of a vacuum processing chamber, and maintenance is performed through the opening door.
- an opening door for opening an upper surface or a side surface of a vacuum processing chamber
- maintenance is performed through the opening door.
- the maintainability of the members inside the vacuum processing chamber disposed near the opening door is good, but the inside of the vacuum processing chamber ( The maintainability of the member located at a position far from the opening door) is deteriorated.
- the distance from the opening door to the internal member of the vacuum processing apparatus is long, maintenance of the vacuum processing apparatus corresponding to a large substrate is very difficult.
- the present invention has been made to solve the above problems, and a main object of the present invention is to improve the maintainability of the inside of the vacuum processing chamber of the vacuum processing apparatus.
- a vacuum processing apparatus for performing vacuum processing on an object to be processed.
- the vacuum processing apparatus includes a first processing chamber that receives and accommodates an object to be processed through the first opening.
- the first processing chamber includes a vacuum processing unit that supports a workpiece and performs vacuum processing.
- the vacuum processing apparatus further includes a second processing chamber that can be evacuated and accommodates an object to be processed before vacuum processing and an object to be processed after vacuum processing.
- the second processing chamber includes a carry-in unit that supports the workpiece before being vacuum-processed and a carry-out unit that supports the workpiece after being vacuum-processed.
- the vacuum processing apparatus further includes a gate portion that is detachably interposed with the first processing chamber between the first opening and the second processing chamber.
- the gate unit blocks and communicates the first processing chamber and the second processing chamber connected via the gate unit.
- a vacuum processing apparatus carries in the to-be-processed object before vacuum processing from a carrying-in part to a vacuum processing part through a 1st opening part and a gate part, and the to-be-processed object after vacuum processing from a vacuum processing part.
- the apparatus further includes a transfer device for carrying out to the carry-out section, and a moving mechanism for separating the first processing chamber and the second processing chamber.
- the vacuum processing apparatus further includes a base portion that supports the moving mechanism and the second processing chamber.
- the moving mechanism includes a wheel attached to a lower portion of the first processing chamber and a rail placed on the base portion.
- the vacuum processing apparatus further includes at least one other first processing chamber.
- the moving mechanism separates the other first processing chamber from the second processing chamber.
- the vacuum processing apparatus further includes a slide mechanism that slides the other first processing chamber in a direction perpendicular to the moving direction of the first processing chamber by the moving mechanism.
- the first processing chamber includes a plurality of vacuum processing units arranged in an arrangement direction perpendicular to the loading direction of the workpiece.
- the second processing chamber includes a plurality of carry-in units arranged in the arrangement direction and a plurality of carry-out units arranged in the arrangement direction.
- the arrangement interval of the plurality of carry-in units, the arrangement interval of the plurality of carry-out units, and the arrangement interval of the plurality of vacuum processing units are substantially the same.
- the first opening is formed to be larger than the cross section of the vacuum processing part at the connection point with the gate part.
- a second opening is formed on a wall surface facing the first opening.
- the first processing chamber further includes a door for sealing and opening the second opening.
- the second opening is formed larger than the cross section of the vacuum processing unit.
- the vacuum processing factory where said vacuum processing apparatus is arrange
- positioned is provided.
- the vacuum processing factory includes a vacuum processing area in which a first processing chamber and a second processing chamber connected to each other through a gate portion are disposed, and a first processing chamber in a state of being separated from the second processing chamber.
- a maintenance area in which the processing chamber is arranged is defined. The first processing chamber is moved to the maintenance area by the moving mechanism when the maintenance is performed, and is moved to the vacuum processing area by the moving mechanism when the maintenance is completed.
- a maintenance method for a vacuum processing apparatus that performs vacuum processing on an object to be processed.
- the vacuum processing apparatus includes a first processing chamber that receives and accommodates an object to be processed through the first opening.
- the first processing chamber includes a vacuum processing unit that supports a workpiece and performs vacuum processing.
- the vacuum processing apparatus further includes a second processing chamber that can be evacuated and accommodates an object to be processed before vacuum processing and an object to be processed after vacuum processing.
- the second processing chamber includes a carry-in unit that supports the workpiece before being vacuum-processed and a carry-out unit that supports the workpiece after being vacuum-processed.
- the vacuum processing apparatus further includes a gate portion that is detachably interposed with the first processing chamber between the first opening and the second processing chamber.
- the gate unit blocks and communicates the first processing chamber and the second processing chamber connected via the gate unit.
- a vacuum processing apparatus carries in the to-be-processed object before vacuum processing from a carrying-in part to a vacuum processing part through a 1st opening part and a gate part, and the to-be-processed object after vacuum processing from a vacuum processing part.
- the apparatus further includes a transfer device for carrying out to the carry-out section, and a moving mechanism for separating the first processing chamber and the second processing chamber.
- the maintenance method includes a step of separating the first processing chamber and the second processing chamber using a moving mechanism, a step of maintaining the first processing chamber, and a gate mechanism using the moving mechanism. Connecting the first processing chamber and the second processing chamber.
- the vacuum processing apparatus further includes at least one other first processing chamber.
- the moving mechanism separates the other first processing chamber from the second processing chamber.
- the vacuum processing apparatus further includes a slide mechanism that slides the other first processing chamber in a direction perpendicular to the moving direction of the first processing chamber by the moving mechanism.
- the maintenance method includes a step of separating the other first processing chamber and the second processing chamber using the moving mechanism, a step of sliding the other first processing chamber using the slide mechanism, and the like. And maintaining the first processing chamber.
- the maintainability of the inside of the vacuum processing chamber of the vacuum processing apparatus can be improved.
- FIG. 1 is a schematic plan sectional view showing a vacuum processing apparatus according to an embodiment. It is a schematic side view which shows a to-be-processed object and a conveyance part.
- FIG. 4B is a schematic cross-sectional view taken along arrow IVB-IVB in FIG. 4A. It is a schematic side view which shows the state which separated the vacuum processing chamber from the gate valve.
- FIG. 6 is a schematic rear view taken along the arrow VI in FIG. 5.
- FIG. 7 is a schematic front view taken along arrow VII in FIG. 5.
- FIG. 6 is a schematic rear view as viewed in the direction of arrow VIII in FIG. 5. It is a flowchart which shows the process sequence of the vacuum processing method in the vacuum processing apparatus which concerns on embodiment. It is a flowchart which shows the process sequence of an installation process. It is a flowchart which shows the process sequence of an installation / extraction process. It is a flowchart which shows the process sequence of a maintenance process. It is a schematic plan view which shows the modification of a vacuum processing apparatus.
- vacuum processing chamber 101 first processing chamber (vacuum processing chamber), 102 second processing chamber (preliminary vacuum chamber), 103 gate valve, 104, 104a to 104e, vacuum processing section, 105 cathode electrode, 106 anode electrode, 107 to-be-processed object, 107a to-be-processed surface, 108, 108a-108e carry-in part, 111, 111a-111e heating device, 114a maintenance door, 114b installation / extraction door, 119, 119a-119e carry-out part, 200 moving mechanism, 202 transport part 204 support section, 210 slide mechanism, 223 wheels, 224, 224a to 224d rails.
- FIG. 1 is a schematic side view showing a vacuum processing apparatus 1 according to the present embodiment.
- FIG. 2 is a functional block diagram showing a functional configuration of the vacuum processing apparatus 1 according to the present embodiment.
- an object 107 to be processed before vacuum processing is installed in a carry-in section 108 in a preliminary vacuum chamber 102 (second processing chamber).
- the gate valve 103 is opened.
- the gate valve 103 While the gate valve 103 is opened, the workpiece 107 after vacuum processing is unloaded from the vacuum processing unit 104 in the vacuum processing chamber 101 (first processing chamber) to the unloading unit 119 in the preliminary vacuum chamber 102. . Then, the object 107 to be processed before vacuum processing is carried from the carry-in unit 108 in the preliminary vacuum chamber 102 to the vacuum processing unit 104 in the vacuum processing chamber 101 (first processing chamber).
- the workpiece 107 is subjected to vacuum processing in the vacuum processing unit 104.
- the vacuum processing the workpiece 107 after vacuum processing is taken out from the carry-out unit 119, and the workpiece 107 before vacuum processing is installed in the carry-in unit 108.
- the vacuum processing chamber 101 and the preliminary vacuum chamber 102 are separated by the moving mechanism 200.
- a maintenance person or the like of the vacuum processing apparatus 1 can easily perform maintenance inside the vacuum processing chamber 101 in a state where the vacuum processing chamber 101 and the preliminary vacuum chamber 102 (gate valve 103) are separated from each other.
- the vacuum processing apparatus 1 can be evacuated by a vacuum processing chamber 101 in which vacuum processing is performed, a gate valve 103, and a vacuum processing chamber 101 and the gate valve 103 connected to each other. And a preliminary vacuum chamber 102.
- the vacuum processing chamber 101 is connected to a vacuum exhaust device 113a for exhausting the inside of the vacuum processing chamber 101 via an exhaust pipe 313a.
- a pressure adjusting valve 118 is provided between the vacuum exhaust device 113a and the vacuum processing chamber 101 for keeping the pressure of the gas introduced from the gas introduction pipe 112a in the vacuum processing chamber 101 constant.
- the exhaust pipe 313 a is provided with a quick coupling 315, and the exhaust pipe 313 a is easily removed from the vacuum processing chamber 101 in the quick coupling 315.
- a vacuum exhaust device 113b for exhausting the inside of the preliminary vacuum chamber 102 is connected to the preliminary vacuum chamber 102 via an exhaust pipe 313b.
- a vacuum pump or the like is used for the vacuum exhaust devices 113a and 113b.
- the vacuum processing chamber 101 is provided with a gas introduction pipe 112a for introducing a gas used for vacuum processing such as plasma processing.
- the gas introduction pipe 112 a is provided with a quick coupling 316, and the gas introduction pipe 112 a is easily detached from the vacuum processing chamber 101 using the quick coupling 316.
- a power source 219 for supplying power to the electrodes in the vacuum processing chamber 101 is connected to the vacuum processing chamber 101.
- the power source 219 is connected to the vacuum processing chamber 101 by the power supply line 221 through the impedance matching device 220.
- the vacuum processing chamber 101 and the power supply line 221 are connected via an electrical connector 222 provided on the outer wall of the vacuum processing chamber 101, and the power supply line 221 can be easily detached from the vacuum processing chamber 101. ing.
- a maintenance door 114 a for performing maintenance in the vacuum processing chamber 101 is provided on the wall surface of the vacuum processing chamber 101 opposite to the gate valve 103.
- the maintenance door 114a preferably has the size of the entire wall surface on the opposite side of the gate valve 103 of the vacuum processing chamber 101 so that maintenance in the vacuum processing chamber 101 can be easily performed.
- the preliminary vacuum chamber 102 is provided with a gas introduction pipe 112b for gradually introducing leakage gas when the inside of the preliminary vacuum chamber 102 is opened to the atmosphere.
- an installation / extraction door for installing the workpiece 107 in the preliminary vacuum chamber 102 and taking out the workpiece 107 from the preliminary vacuum chamber 102.
- the installation / extraction door 114b is preferably configured to have a size that allows the workpiece 107 to be taken in and out without moving the carry-in unit 108 and the carry-out unit 119. That is, it is preferable that the installation / extraction door 114b is formed to have a height that is longer than the height of the carry-in portion 108 and the carry-out portion 119, and a width that is longer than the width of the carry-in portion 108 and the carry-out portion 119. In this case, the user can take out the workpiece 107 from the carry-out unit 119 without moving the carry-in unit 108 and the carry-out unit 119 after placing the workpiece 107 on the carry-in unit 108. become.
- the preliminary vacuum chamber 102 is mounted on the base unit 201 via the support unit 204.
- a moving mechanism 200 is provided below the vacuum processing chamber 101.
- the moving mechanism 200 is disposed on the base unit 201. More specifically, wheels 223 are rotatably attached to the lower part of the vacuum processing chamber 101.
- a rail 224 is laid on the base portion 201 from the preliminary vacuum chamber 102 toward the vacuum processing chamber 101.
- the moving mechanism 200 includes a wheel 223 and a rail 224, and the wheel 223 is disposed on the rail 224.
- the rotation of the wheel 223 allows the vacuum processing chamber 101 to move away from or approach the gate valve 103 and the preliminary vacuum chamber 102.
- the diameter of the wheel 223 is increased, lubricating oil is supplied onto the rail, and an air ejection device is provided to float the vacuum processing chamber 101 with air. It is preferable.
- FIG. 3 is a schematic plan view showing the inside of the vacuum processing apparatus 1 according to the present embodiment.
- a plurality of vacuum processing units 104 a to 104 e are provided in the vacuum processing chamber 101.
- the vacuum processing units 104a to 104e are also collectively referred to as a vacuum processing unit 104.
- Each vacuum processing unit 104 includes a pair of a cathode electrode 105 and an anode electrode 106 having a parallel plate type electrode structure. AC power is supplied to the cathode electrode 105 from the power source 219 via the impedance matching device 220 and the power supply line 221.
- the anode electrode 106 is grounded.
- a vacuum processing side heating device 110 for heating the workpiece 107 is installed on the anode electrode 106 side of each vacuum processing unit 104.
- a lamp heater or a heater utilizing heat generated by a resistor is generally used for the vacuum processing side heating device 110.
- the vacuum processing side heating device 110 does not need to be integrated with the anode electrode 106 and may be provided separately from the anode electrode 106.
- the workpiece 107 is installed so as to be parallel to the anode electrode 106 and electrically connected to the anode electrode 106.
- each vacuum processing unit 104 the workpiece 107 is subjected to plasma processing (vacuum processing) by plasma generated between the cathode electrode 105 and the anode electrode 106.
- plasma processing vacuum processing
- the vacuum treatment include film formation by plasma CVD (Chemical Vapor Deposition), but are not limited thereto, and include film formation by sputtering or vapor deposition, plasma etching, or the like.
- each carry-in unit 108 In the preliminary vacuum chamber 102, a plurality of carry-in portions 108a to 108e are provided.
- the carry-in units 108a to 108e are collectively referred to as the carry-in unit 108.
- a workpiece 107 to be processed before being vacuum processed in the vacuum processing chamber 101 is disposed in each carry-in unit 108.
- Each carry-in part 108 has a heater (carry-in side heating device) 111 for preheating the object 107 to be processed.
- the heaters 111a to 111e provided in the respective carry-in portions 108a to 108e have a relative positional relationship between the workpiece 107 held in each carry-in portion 108a to 108e and each heater 111a to 111e (the interval between the two is ) And are installed so as to be substantially the same between the respective carry-in portions 108a to 108e. That is, the relative positional relationship between the object 107 to be processed and the heater 111a stored in the carry-in unit 108a is substantially the same in the other carry-in units 108b to 108e.
- each unloading unit 119 is loaded with an object 107 to be processed after being vacuum-treated in the vacuum processing chamber 101, and the object 107 to be processed after being vacuum-treated is transferred from each unloading unit 119 to the outside of the preliminary vacuum chamber 102. It is taken out.
- the plurality of carry-in portions 108a to 108e are held by the plurality of vacuum processing portions 104a to 104e and the intervals (between the treatment surfaces 107a) of the workpieces 107 held by the carry-in portions 108a to 108e.
- the respective objects to be processed 107 are arranged side by side so that the intervals (between the surfaces to be processed 107a) are substantially the same.
- the interval between the workpieces 107 held by the unloading units 119a to 119e and the interval between the workpieces 107 held by the plurality of vacuum processing units 104a to 104e are substantially the same. They are arranged side by side to be the same.
- the carry-in sections 108a to 108e and the carry-out sections 119a to 119e in the preliminary vacuum chamber 102 are alternately arranged along the movement direction Y.
- the carry-in units 108a to 108e and the carry-out units 119a to 119e are arranged along the movement direction Y of the carry-in units 108a to 108e and the carry-out units 119a to 119e from the right (upper in FIG. 3).
- -Unloading part 119b ... It arranges in order of the carrying-in part 108e.
- the carry-in sections 108a to 108e and the carry-out sections 119a to 119e are arranged at a predetermined distance in a direction Y perpendicular to the conveyance direction X of the workpiece 107, and are predetermined in their arrangement direction Y (vertical direction in FIG. 3). It is configured to be movable by a distance.
- the movement distances of the carry-in sections 108a to 108e and the carry-out sections 119a to 119e are substantially equal to the interval between the treatment surfaces 107a of the workpiece 107 held by the carry-in section 108a and the carry-out section 119a adjacent to each other.
- Distance For example, the carry-in units 108a to 108e and the carry-out units 119a to 119e can move by a distance 117 corresponding to the distance between the treatment surface 107a of the workpiece 107 held by the carry-in unit 108a and the carry-out unit 119a.
- each of the carry-in units 108a to 108e is moved in the Y direction by the carry-in unit moving device 150a.
- the carry-out units 119a to 119e are moved in the Y direction by the carry-out unit moving device 150b.
- the carry-in units 108a to 108e and the carry-out units 119a to 119e may be configured to move separately in the Y direction, or may be configured to move together in the Y direction. good.
- the carry-in unit moving device 150a and the carry-out unit moving device 150b move in conjunction with each other, and the carry-in units 108a to 108e and the carry-out units 119a to 119e are integrated. Therefore, the structure which moves is preferable.
- the moving direction Y of the carrying-in part 108 and the carrying-out part 119 is a direction orthogonal to the conveyance direction X (left-right direction in FIG. 3) of the workpiece 107.
- the movement direction Y may be the Y direction shown in FIG. 3 or a direction perpendicular to the paper surface in FIG. 3 (a direction perpendicular to both the transport direction X and the movement direction Y, hereinafter referred to as the Z direction). There may be. That is, it is only necessary that the carry-in unit 108 and the carry-out unit 119 can move to a position where the workpiece 107 can be easily delivered to the transfer unit 202A of the vacuum processing unit 104 described later.
- the carry-in unit 108 and the carry-out unit 119 are arranged in a direction including at least one of the components in the Y direction and the Z direction, and the carry-in unit 108 and the carry-out unit 119 can be moved in that direction. preferable.
- FIG. 3 is a plan view and the Z direction is a vertical direction.
- FIG. 3 may be a side view and the Y direction may be a vertical direction.
- the gate valve 103 provided between the vacuum processing chamber 101 and the preliminary vacuum chamber 102 can be opened and closed. By opening the gate valve 103, the interior of the vacuum processing chamber 101 and the interior of the preliminary vacuum chamber 102 are communicated. By opening the gate valve 103 in a state where the preliminary vacuum chamber 102 is evacuated, the object to be processed is maintained between the vacuum processing chamber 101 and the preliminary vacuum chamber 102 while maintaining the vacuum state in the vacuum processing chamber 101. 107 can be conveyed.
- the vacuum processing chamber 101 and the preliminary vacuum chamber 102 are provided with a transfer unit 202.
- the transfer unit 202 only needs to be able to transfer the workpiece 107 from the carry-in unit 108 to the vacuum processing unit 104 and to transfer the workpiece 107 from the vacuum processing unit 104 to the carry-out unit 119. It may be provided in either or both of the vacuum chambers 102.
- the carry-in unit 108 and the carry-out unit 119 can be moved in the direction in which they are arranged (arrangement direction Y), and the vacuum processing unit 104, the carry-in unit 108, However, the vacuum processing unit 104 and the unloading unit 119 are configured to be linearly aligned in the transport direction X of the workpiece 107. That is, as described above, the vacuum processing apparatus 1 is equipped with the moving devices (the loading portion moving device 150a and the unloading portion moving device 150b) for moving the loading portion 108 and the unloading portion 119, so that the conveying portion 202 The workpiece 107 can be conveyed linearly.
- the moving devices the loading portion moving device 150a and the unloading portion moving device 150b
- the transport unit 202 in the present embodiment is provided in a carry-in transport unit 202 ⁇ / b> B that is provided in the carry-in unit 108 and holds the workpiece 107 before vacuum processing, and a carry-out unit 119.
- FIG. 4A is a side view of the object to be processed 107 and the conveyance unit 202 as viewed from the surface to be processed 107a of the object to be processed 107
- FIG. 4B is a schematic cross-sectional view taken along arrow IVB-IVB in FIG.
- the workpiece 107 is placed on a driving roller 202c having a rotating shaft in the horizontal direction.
- the side surface of the workpiece 107 is supported from the side by a driven roller 202a and a driven roller 202b.
- the driving roller 202c is rotated by a motor or the like, and moves the workpiece 107 linearly in the transport direction X.
- the workpiece 107 before being subjected to vacuum processing can be transported to the vacuum processing unit 104, and the processing target surface 107a can be subjected to vacuum processing.
- the subsequent workpiece 107 can be conveyed to the carry-out unit 119.
- the transport unit 202B of the carry-in unit 108 and the transport unit 202A of the vacuum processing unit 104 carry the workpiece 107 before being vacuum processed from the carry-in unit 108 to the vacuum processing unit 104, and the vacuum processing unit 104.
- the conveying section 202A and the conveying section 202C of the unloading section 119 are configured to unload the workpiece 107 after vacuum processing from the vacuum processing section 104 to the unloading section 119.
- the workpiece 107 is installed so that the workpiece surface 107a is in a direction perpendicular to the horizontal plane. However, as described above, the workpiece 107 is at any angle. May be held.
- FIG. 5 is a schematic side view showing a state in which the vacuum processing chamber 101 is separated from the gate valve 103.
- the exhaust pipe 313 a is removed from the vacuum processing chamber 101 by removing the quick coupling 315.
- the gas introduction pipe 112 a is removed from the vacuum processing chamber 101.
- the power supply line 221 is removed from the vacuum processing chamber 101 by removing the power supply line 221 from the electrical connector 222.
- the wheel 223 attached to the lower portion of the vacuum processing chamber 101 rotates on the rail 224, whereby the vacuum processing is performed.
- the chamber 101 moves away from or approaches the gate valve 103.
- FIG. 6 is a schematic rear view taken along arrow VI in FIG. That is, FIG. 6 is a schematic rear view showing the gate valve 103 viewed from the vacuum processing chamber 101 side in a state where the vacuum processing chamber 101 is separated from the gate valve 103.
- a vacuum seal O-ring 103 a is provided around the gate valve 103.
- the O-ring 103 a is fitted in a dovetail groove (packing groove) formed around the gate valve 103.
- the portion protruding from the dovetail groove of the O-ring 103 a is deformed by the pressure when the vacuum processing chamber 101 is connected to the gate valve 103, and comes into close contact with the periphery of the vacuum processing chamber 101. In this way, the space between the vacuum processing chamber 101 and the gate valve 103 is sealed.
- a rib 123 is formed around the rear end of the gate valve 103.
- Bolt holes 123 b are formed in the ribs 123.
- FIG. 7 is a schematic front view taken along arrow VII in FIG. That is, FIG. 7 is a schematic front view showing the vacuum processing chamber 101 viewed from the gate valve 103 side in a state where the vacuum processing chamber 101 is separated from the gate valve 103.
- a first opening 317 is formed on the side of the vacuum processing chamber 101 connected to the gate valve 103.
- the first opening 317 has a size of the vacuum processing units 104a to 104e in front view. It is preferable that the opening is larger than that. That is, the first opening 317 is formed so that the first opening 317 includes the vacuum processing units 104a to 104e disposed in the vacuum processing chamber 101 when viewed from the front.
- a rib 124 a is formed around the front end of the vacuum processing chamber 101.
- Bolt holes 124b are formed in the ribs 124a.
- FIG. 8 is a schematic rear view taken along the line VIII in FIG. That is, FIG. 8 is a schematic rear view showing the vacuum processing chamber 101 viewed from the opposite side of the gate valve 103 in a state where the maintenance door 114a is opened.
- the vacuum processing chamber 101 has a second opening 318 that can be opened and closed by a maintenance door 114a.
- the second opening 318 is also preferable for maintenance as the opening size is larger.
- the second opening 318 is formed so that the entire back surface in the vacuum processing chamber 101 is opened by opening the maintenance door 114a.
- the second opening 318 is opened larger than the size of the vacuum processing units 104a to 104e in rear view in order to ensure good maintainability in the vacuum processing chamber 101. It is preferable. That is, the second opening 318 is formed so that the second opening 318 includes the vacuum processing units 104 a to 104 e disposed in the vacuum processing chamber 101 in the rear view.
- a dovetail groove is formed around the second opening 318 on the back surface of the vacuum processing chamber 101, as in the case of the gate valve 103, and an O-ring 101a is fitted in the dovetail groove.
- the maintenance door 114a is connected to the vacuum processing chamber 101 so as to be rotatable about the left side.
- a rib 124 c is formed around the rear end of the vacuum processing chamber 101.
- a bolt hole 124d is formed in the rib 124c.
- a rib 125 is formed around the maintenance door 114a.
- a bolt hole (not shown) is formed in the rib 125.
- the maintenance door 114a is rotated so that the maintenance door 114a is in close contact with the O-ring 101a, and the rib 125 of the maintenance door 114a and the rib 124c of the vacuum processing chamber 101 are Are fastened with fastening bolts 127 to seal the rear part of the vacuum processing chamber 101. Conversely, the fastening bolt 127 is removed to release the fastening between the rib 125 of the maintenance door 114a and the rib 124c of the vacuum processing chamber 101, and the maintenance door 114a is rotated to open the rear portion of the vacuum processing chamber 101.
- the vacuum processing chamber 101 can be easily maintained by moving the vacuum processing chamber 101 away from the gate valve 103. That is, since the first opening 317 of the vacuum processing chamber 101 is formed, the user of the vacuum processing apparatus 1 is not obstructed by a structure such as an electrode in the vacuum processing chamber 101, and the vacuum processing chamber 101. The space required for the internal cleaning operation can be secured, and the components in the vacuum processing chamber 101 can be easily replaced from the front of the vacuum processing chamber 101.
- the rear of the vacuum processing chamber 101 can be opened, so that the user of the vacuum processing chamber 101 can access the inside of the vacuum processing chamber 101 from the rear of the vacuum processing chamber 101.
- the workability of maintenance in the vacuum processing chamber 101 is improved.
- maintenance personnel or the like can enter the interior of the vacuum processing chamber 101 from the front (first opening 317) and rear (second opening 318) of the vacuum processing chamber 101. Maintenance can be performed, and both the front part and the rear part in the vacuum processing chamber 101 can be easily maintained.
- the moving mechanism 200 may be provided on the preliminary vacuum chamber 102 and the gate valve 103 side. That is, the vacuum processing chamber 101 is placed on the support portion 204, and the wheel 203 is pivotally supported below the preliminary vacuum chamber 102. In this case, a rail 224 is laid on the preliminary vacuum chamber 102 side. Then, when performing maintenance in the vacuum processing chamber 101, the preliminary vacuum chamber 102 is moved in a direction away from the vacuum processing chamber 101.
- a control device 100 is connected to each device of the vacuum processing apparatus 1 through a cable or an interface, and the following steps are mainly performed by operations by the control device 100.
- the control device 100 includes a memory 98 that stores a control program for the vacuum processing apparatus 1 and a CPU 99 that reads the program and controls the vacuum processing apparatus 1.
- the vacuum processing performed by the vacuum processing apparatus 1 is controlled by software executed on the control device 100.
- FIG. 9 is a flowchart showing a processing procedure of the vacuum processing method in the vacuum processing apparatus 1 according to the present embodiment.
- the control device 100 opens the gas introduction pipe 112b to introduce nitrogen gas into the preliminary vacuum chamber 102 and leaks.
- the installation / extraction door 114b is opened and the interior of the preliminary vacuum chamber 102 is opened to the atmosphere.
- the object 107 to be processed before being vacuum-processed is placed in the carry-in unit 108.
- the installation / extraction door 114b is sealed (step 10, hereinafter, step is abbreviated as S).
- a gate valve 103 that communicates and blocks the vacuum processing chamber 101 and the preliminary vacuum chamber 102 is provided. Opened. Then, in a state where the vacuum processing chamber 101 and the preliminary vacuum chamber 102 are maintained in a vacuum, the transfer unit 202 performs a vacuum from the carry-in unit 108 in the preliminary vacuum chamber 102 to the vacuum processing unit 104 in the vacuum processing chamber 101.
- the to-be-processed object 107 before a process is carried in (S30).
- the heater 111 is turned off and the gate valve 103 is shut off.
- the timing at which the carry-in unit 108 is moved to a predetermined position for conveyance is the timing before or after the gate valve 103 is opened. It may be open or open.
- the control device 100 applies a cathode-side voltage to form a silicon film or the like on the workpiece 107 carried into the vacuum processing unit 104 by plasma CVD or the like (S40-1).
- the vacuum processing side heating device 110 in the vacuum processing chamber 101 is always turned on while the vacuum processing device 1 is in operation, and the control device 100 keeps the temperature of the workpiece 107 at, for example, 170 ° C.
- the output is controlled by.
- a reaction gas composed of hydrogen gas and silane gas is first introduced into the vacuum processing chamber 101 from the gas introduction pipe 112a, and the pressure inside the vacuum processing chamber 101 is controlled by the pressure adjustment valve 118. Is adjusted to a predetermined pressure.
- high-frequency power for example, a frequency of 13.56 MHz
- plasma is generated between the cathode electrode 105 and the anode electrode 106.
- the reactive gas is decomposed by the plasma, and a silicon film is formed on the workpiece 107.
- the control device 100 stops the power supply to the cathode electrode 105, stops the introduction of the reaction gas, and evacuates the vacuum processing chamber 101.
- FIG. 10 is a flowchart showing the processing procedure of the installation step (S40-2). As shown in FIG. 9 and FIG. 10, the workpiece installation step (S41), the heating step (S42), and the carry-in / unload-portion movement step (S43) are combined (the installation step S40-2 together with these steps).
- the vacuum processing step (S40-1) is performed in parallel with the execution.
- the control device 100 introduces nitrogen gas from the gas introduction pipe 112b into the preliminary vacuum chamber 102 and leaks. After the inside of the preliminary vacuum chamber 102 is at atmospheric pressure, the installation / extraction door 114b is opened and the inside of the preliminary vacuum chamber 102 is opened to the atmosphere. If the to-be-processed object 107 before vacuum processing is arrange
- control device 100 operates the exhaust device 113b to start evacuation of the preliminary vacuum chamber 102, turns on the power of the heater 111, and heats the workpiece 107 before being vacuum-processed ( S42).
- the carry-in unit 108 and the carry-out unit 119 are connected to the workpiece 107 so that the workpiece 107 after vacuum processing can be linearly carried out from the vacuum processing unit 104 to the carry-out unit 119 along the carrying direction X. It is moved in the direction Y perpendicular to the direction of conveyance (S43). That is, the relative positions of the vacuum processing unit 104 and the carry-out unit 119 are adjusted so that the vacuum processing unit 104 and the carry-out unit 119 are aligned on the axis line in the transport direction X. However, this step may be performed after the workpiece installation step (S41), and may be performed while the workpiece 107 is heated by the heater 111.
- the conveyance unit 202A can linearly move the workpiece 107 before vacuum processing accommodated in the carry-in unit 108 to the vacuum process unit 104, that is, the carry-in unit 108 and the vacuum processing unit 104 are pivoted.
- the carry-in unit 108 and the carry-out unit 119 are moved in a direction Y perpendicular to the direction X in which the workpiece 107 is conveyed so as to line up on the line (S60).
- the workpiece 107 before being vacuum-treated is linearly carried into the vacuum processing unit 104 from the carry-in unit 108 by the vacuum processing side conveyance unit 202A and the carry-in side conveyance unit 202B (S70).
- the gate valve 103 is sealed, and the heater 111 is turned off.
- FIG. 11 is a flowchart showing the processing procedure of the installation / removal process. As shown in FIG. 9 and FIG. 11, while the vacuum processing step (S80-1) is being carried out, the following workpiece removal step (S82), determination step (S83), and workpiece installation step (S84) and, in some cases, a maintenance process (these processes are collectively referred to as an installation / removal process S80-2) are performed in parallel.
- the gas introduction pipe 112b introduces nitrogen gas into the preliminary vacuum chamber 102 and leaks.
- the installation / extraction door 114b is opened, the preliminary vacuum chamber 102 is opened to the atmosphere, and the workpiece 107 that has been vacuum processed is taken out from the unloading section 119 (S82). .
- the CPU 99 of the control device 100 determines whether or not maintenance should be performed based on management items such as the number of times of vacuum processing stored in the memory 98 (S83). Specifically, the CPU 99 updates the number of times of vacuum processing in the memory 98 every time the vacuum processing step (S40-1, S80-1) is completed. Then, the CPU 100 determines whether or not the number of times of vacuum processing exceeds a preset number stored in the memory 98 every time the processing object extraction step (S82) ends or during the processing object extraction step (S82). Judgment is made (S83).
- FIG. 12 is a flowchart showing the procedure of the maintenance process (S90).
- the workpiece removal step (S91) and workpiece removal step are performed after the workpiece removal step (S82) is completed.
- (S92) is performed.
- the workpiece unloading step (S91) the same processing as that of the workpiece unloading step (S50) described above is performed.
- the workpiece removal step (S92) the same processing as that of the workpiece removal step (S82) described above is performed.
- the exhaust pipe 313 a and the gas introduction pipe 112 a of the vacuum processing chamber 101 are removed from the vacuum processing chamber 101 by removing the quick couplings 315 and 316. Further, the power supply line 221 is detached from the vacuum processing chamber 101 by removing the electric connector 222. Further, signal lines and power supply lines for controlling each part of the vacuum processing chamber 101 are also removed from the electrical connector 222. Then, the fastening bolt 126 that fastens the vacuum processing chamber 101 and the gate valve 103 is removed, and the connection between the vacuum processing chamber 101 and the gate valve 103 is released (S94).
- the evacuation apparatus 113a evacuates the inside of the vacuum processing chamber 101 and confirms the degree of increase in the exhaust pressure, or confirms the leakage of air in the vacuum processing chamber 101 by a helium leak test or the like (S98).
- the control device 100 starts evacuation in the preliminary vacuum chamber 102, turns on the power of the heater 111, and heats the workpiece 107 before being vacuum-treated in the carry-in unit 108. (S20). Then, a workpiece carrying-in process (S30), a vacuum processing process (S40-1), and an installation process (S40-2) are performed. Thereafter, as shown in FIGS. 9 to 12, in the control device 100, the vacuum processing step (S80-1) and the installation / removal step (S80-2) are repeated from the workpiece unloading step (S50).
- the workpiece 107 to be vacuum-processed in the vacuum processing unit 104 can be efficiently replaced, and the workpiece 107 that has been vacuum-processed before the vacuum processing step is performed.
- the workpiece 107 to be vacuum-processed and the workpiece 107 to be vacuum-processed next can be heated, and the tact time of the vacuum processing apparatus 1 (process work time required for each workpiece 107) can be shortened.
- the tact time of the vacuum processing apparatus 1 process work time required for each workpiece 107
- the vacuum processing apparatus 1b may include a plurality of vacuum processing chambers 101a and 101b. In this case, it is preferable that the vacuum processing chamber 101a separated from the gate valve 103 can be replaced with another vacuum processing chamber 101b for which maintenance has been completed in advance. Thereby, a maintenance time can be shortened and the stop time of the vacuum processing apparatus 1 can be shortened.
- FIG. 13 is a schematic plan view showing a modification of the vacuum processing apparatus 1b.
- the vacuum processing apparatus 1 b includes a plurality of vacuum processing chambers 101 a and 101 b and a slide mechanism 210.
- the rail 224 is fixed to the base portion 201, the first rail 224a fixed to the base portion 201, the second rail 224b provided to be slidable in the direction perpendicular to the direction in which the rail 224a is laid, and the base portion 201.
- the third rail 224c (224d) is included.
- the third rails 224c and 224d are provided in the base portion 201 for each of the vacuum processing chambers 101a and 101b. That is, the moving mechanism 200 includes a wheel 203 pivotally supported at the lower portion of the first vacuum processing chamber 101a, a wheel 203 pivotally supported at the lower portion of the second vacuum processing chamber 101b, and a first portion laid on the base portion 201.
- the slide mechanism 210 allows the second rail 224b to be slidable from the axis between the first rail 224a and the third rail 224c to the axis of the third rail 224d. Yes. More specifically, the second rail 224b is placed on the slide mechanism 210, and the slide mechanism 210 may be configured to slide with a motor (not shown) or may be configured to slide manually.
- the vacuum processing apparatus 1b may be configured not to include the second rail 224b, and the third rails 224c and 224d may be slid by the slide mechanism 210.
- the vacuum processing chamber 101a that requires maintenance is removed from the gate valve 103, and the first rail 224a, the second rail 224b, the slide mechanism 210, and the third rail 224c are removed. Can be moved from the vacuum processing area 402 to the maintenance area 401.
- another vacuum processing chamber 101b in which maintenance has been completed is moved from the maintenance area 401 to the gate valve via the third rail 224d, the second rail 224b, the slide mechanism 210, and the first rail 224a. It is also possible to move to 103 (vacuum processing area 402) and connect to the gate valve 103. More specifically, the vacuum processing chamber 101b is moved onto the slide mechanism 210 via the third rail 224d and the second rail 224b, and the slide mechanism 210 is moved to the second rail 224b and the first rail 224a. Slide so that and are aligned on a straight line. Then, the vacuum processing chamber 101b is connected to the gate valve 103 via the second rail 224b and the first rail 224a.
- the processing procedure of the vacuum processing in the vacuum processing apparatus 1b according to this modification is the same as the processing procedure shown in FIGS. 9 to 12, but the processing procedure in the maintenance step (S90) is different.
- the vacuum processing chamber replacement process is executed instead of the cleaning / part replacement process (S96). May be. That is, in the vacuum processing chamber moving step (S95, S97), the vacuum processing chamber 101a is separated from the gate valve 103 and moved, and another vacuum processing chamber 101b for which maintenance has been completed in advance is connected to the gate valve 103. Is possible.
- the vacuum processing chamber 101b is connected to the gate valve 103, and the vacuum processing chamber 101 can be maintained after the vacuum processing apparatus 1 returns to the vacuum processing.
- the time for stopping the vacuum treatment can be shortened.
- the vacuum processing apparatus 1b can be used in a vacuum processing factory 400.
- a vacuum processing area 402 in which the vacuum processing chamber 101 and the preliminary vacuum chamber 102 connected to each other via the gate valve 103 are disposed, and a vacuum in a state of being separated from the preliminary vacuum chamber 102.
- a maintenance area 401 in which the processing chamber 101 is disposed is defined (partitioned).
- a fence or glass for preventing an operator from entering is stretched around the vacuum processing area 402, the maintenance area 401, and the retreat area.
- the vacuum processing chamber 101 is moved to the maintenance area 401 by the moving mechanism 200 when maintenance is performed, and is moved to the vacuum processing area 402 by the moving mechanism 200 when the maintenance is completed.
- the vacuum processing apparatus 1b when the preliminary vacuum chamber 102 is configured to move by the moving mechanism 200, the vacuum processing chamber 101 and the preliminary vacuum that are connected via the gate valve 103 are used.
- a vacuum processing area 402 in which the chamber 102 is arranged and a retreat area (not shown) in which the preliminary vacuum chamber 102 in a state of being separated from the vacuum vacuum chamber 101 are arranged are defined.
- the preliminary vacuum chamber 102 is moved to the retreat area by the moving mechanism 200 when maintenance of the vacuum processing chamber 101 or the preliminary vacuum chamber 102 is performed, and the vacuum processing is performed by the moving mechanism 200 when the maintenance is completed. Move to area 402.
- FIG. 13 demonstrated the case where the vacuum processing apparatus 1b was arrange
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Abstract
Description
この発明の別の局面に従うと、上記の真空処理装置が配置される真空処理工場が提供される。真空処理工場は、ゲート部を介して接続された状態の第1の処理室と第2の処理室とが配置される真空処理エリアと、第2の処理室から離間された状態の第1の処理室が配置されるメンテナンスエリアとが規定される。第1の処理室は、メンテナンスが行われる際に、移動機構によってメンテナンスエリアへと移動し、メンテナンスが終了した際に、移動機構によって真空処理エリアへと移動する。
以下では、本実施の形態に係る真空処理装置1の全体構成について、図面を参照しながら説明する。図1は本実施の形態に係る真空処理装置1を示す概略側面図である。図2は本実施の形態に係る真空処理装置1の機能構成を示す機能ブロック図である。
図1および図2に示すように、真空処理装置1は、真空処理が行われる真空処理室101と、ゲートバルブ103と、真空処理室101とゲートバルブ103を介して接続される真空排気可能な予備真空室102とを含む。
次に、真空処理室101を予備真空室102に対して移動させるための移動機構200の構成について説明する。図5は、真空処理室101をゲートバルブ103から離間させた状態を示す概略側面図である。図5に示すように、クイックカップリング315を取り外すことによって、排気配管313aが真空処理室101から取り外される。また、クイックカップリング316を取り外すことによって、ガス導入管112aが真空処理室101から取り外される。また、電力供給線221が電気コネクタ222から取り外されることによって、電力供給線221が真空処理室101から取り外される。
以下、本実施の形態に係る真空処理装置1を用いた真空処理方法の実施の形態について、図面を参照して説明する。図2に示したように、真空処理装置1の各装置には、ケーブルやインタフェースを介して制御装置100が接続されており、以下の工程は主に制御装置100による操作によって行われるものである。具体的には、制御装置100には、真空処理装置1の制御用のプログラムが記憶されているメモリ98や、当該プログラムを読み込んで真空処理装置1を制御するCPU99とが内蔵されている。本実施の形態においては、真空処理装置1によって行われる真空処理は、制御装置100上で実行されるソフトウェアによって制御されるものとする。
図9に示すように、まず、制御装置100は、ガス導入管112bを開放して予備真空室102内に窒素ガスを導入しリークする。予備真空室102内が大気圧になると、設置取出扉114bが開放されて予備真空室102内部が大気開放される。この状態において、真空処理される前の被処理物107が搬入部108へと配置される。被処理物107が搬入部108に配置されると、設置取出扉114bが密閉される(ステップ10、以下ステップをSと略す。)。
次に、排気装置113bが稼動され、予備真空室102内の真空排気が行われる。同時に、ヒータ111の電源がONされ、被処理物107が加熱される(S20)。
被処理物107の温度が所定の温度になり、予備真空室102内の真空度が所定の真空度に達した後、真空処理室101と予備真空室102とを連通および遮断するゲートバルブ103が開放される。そして、真空処理室101内と予備真空室102内とが真空に維持された状態において、搬送部202によって予備真空室102内の搬入部108から真空処理室101内の真空処理部104へと真空処理前の被処理物107が搬入される(S30)。被処理物107が真空処理部104へ搬入された後、ヒータ111の電源がOFFになり、ゲートバルブ103が遮断される。ここで、搬入部108が搬送用の所定位置(搬入部108と真空処理部104とが一直線上に並ぶ位置)まで移動されるタイミングについては、ゲートバルブ103が開放される前であっても後であっても開放中であっても良いものとする。
制御装置100は、カソード側の電圧を印加して、真空処理部104に搬入された被処理物107に対してプラズマCVD法等によりシリコン膜等を成膜する(S40-1)。真空処理室101内の真空処理側加熱装置110は、真空処理装置1の稼動中は常に電源が入れられており、被処理物107の温度を、たとえば170℃に保持するように、制御装置100によって出力制御されている。
図10は、設置工程(S40-2)の処理手順を示すフローチャートである。図9および図10に示すように、被処理物設置工程(S41)と加熱工程(S42)と搬入部・搬出部移動工程(S43)とは(これらの工程をまとめて設置工程S40-2とする。)、真空処理工程(S40-1)を実施中に並行して実施されるものである。
予備真空室102においては、制御装置100が、搬出部119の温度が所定の温度に下がった後に、ガス導入管112bから予備真空室102内へと窒素ガスを導入してリークする。予備真空室102内が大気圧になった後に、設置取出扉114bが開放されて予備真空室102内が大気開放される。真空処理前の被処理物107が搬入部108に配置されると、設置取出扉114bが密閉される(S41)。
次に、制御装置100は、排気装置113bを稼動して予備真空室102内の真空排気を開始し、ヒータ111の電源をONして、真空処理される前の被処理物107を加熱する(S42)。
次に、真空処理された後の被処理物107を真空処理部104から搬出部119に搬送方向Xに沿って直線的に搬出できるように、搬入部108および搬出部119が被処理物107が搬送される方向と垂直な方向Yへと移動される(S43)。つまり、真空処理部104と搬出部119とが搬送方向Xの軸線上に並ぶように、真空処理部104と搬出部119との相対位置を調整する。但し、本工程は、被処理物設置工程(S41)の後であればよく、ヒータ111による被処理物107の加熱中に実施される形態であってもよい。
予備真空室102内の真空処理前の被処理物107の温度が所定の温度になり、予備真空室102内の真空度が所定の真空度に達し、真空処理室101内の真空処理工程が終了し、真空処理室101内の圧力が所望の圧力となった後に、真空処理室101と予備真空室102とを連通するゲートバルブ103が開放される。次に、搬送部202Cと搬送部202Bとが、真空処理部104から搬出部119へと真空処理された後の被処理物107を直線的に搬出する(S50)。
次に、搬送部202Aが搬入部108に収容されている真空処理前の被処理物107を真空処理部104まで直線的に移動できるように、つまり、搬入部108と真空処理部104とが軸線上に並ぶように、搬入部108および搬出部119を被処理物107が搬送される方向Xと直角の方向Yに移動する(S60)。
次に、真空処理側搬送部202Aと搬入側搬送部202Bによって、搬入部108から真空処理部104へ、真空処理される前の被処理物107を直線的に搬入する(S70)。真空処理前の被処理物107を真空処理部104に搬入した後、ゲートバルブ103が密閉され、ヒータ111の電源がOFFになる。
前述同様、真空処理部104に搬入された真空処理前の被処理物107にプラズマCVD法によってシリコン膜が成膜される(S80-1)。本工程は前述した真空処理工程(S40-1)と同一の処理が行われるものである。
シリコン膜が成膜された真空処理後の被処理物107の温度が所定の温度に下がると、ガス導入管112bが予備真空室102内へと窒素ガスを導入してリークする。予備真空室102内が大気圧と略同一になると、設置取出扉114bが開放されて予備真空室102が大気開放されて、真空処理された被処理物107が搬出部119から取り出される(S82)。
被処理物取出工程(S82)後、制御装置100のCPU99は、メモリ98に記憶されている真空処理回数等の管理項目に基づいてメンテナンスすべきか否かを判断する(S83)。具体的には、CPU99は、真空処理工程(S40-1,S80-1)が終了する度に、メモリ98の真空処理回数を更新する。そして、CPU100は被処理物取出工程(S82)が終了する度に、もしくは被処理物取出工程(S82)中に、真空処理回数が予めメモリ98に記憶されている設定回数を超えたか否かを判断する(S83)。
図12は、メンテナンス工程(S90)の処理手順を示すフローチャートである。図12に示すように、メンテナンス要と判断された場合(S83にてYESの場合)、被処理物取出工程(S82)が終了した後に、被処理物搬出工程(S91)と被処理物取出工程(S92)が行われる。被処理物搬出工程(S91)では、前述した被処理物搬出工程(S50)と同様の処理が行われる。被処理物取出工程(S92)では、前述した被処理物取出工程(S82)と同様の処理が行われる。
被処理物取出工程(S92)後、ヒータ110の電源をOFFにし、真空処理部104の温度が所定の温度に下がると、ガス導入管112aから真空処理室101内へと窒素ガスがリークされる(S93)。具体的には、真空処理室101内の残留ガスを充分にパージした後、真空処理室101を大気開放する。
真空処理室101の排気配管313aおよびガス導入管112aは、クイックカップリング315および316を取り外すことにより真空処理室101から取り外される。また、電力供給線221は、電気コネクタ222を取り外すことにより真空処理室101から取り外される。さらに、真空処理室101の各部を制御するための信号線および電源供給線も、電気コネクタ222から取り外される。そして、真空処理室101とゲートバルブ103とを締結している締結ボルト126を外して、真空処理室101とゲートバルブ103との連結を解除する(S94)。
真空処理室101の下部に取り付けられた車輪223がレール224上を回転することによって、真空処理室101がゲートバルブ103から離間するように移動する(S95)。この際、移動に必要な動力を軽減するためにガス圧力等により真空処理室101に浮力を与えるシステムを併用しても良い。
真空処理室101をゲートバルブ103から離間させた後、ゲートバルブ103と反対側に設けられたメンテナンス扉114aと真空処理室101後部とを締結している締結ボルト127を外して、メンテナンス扉114aを開放し、真空処理室101内の清掃および部品交換等を行う(S96)。これにより、真空処理装置1の使用者が、真空処理室101のゲートバルブ103側の第1の開口部317およびゲートバルブ103と反対側の第2の開口部318から、真空処理室101内にアクセス可能となり、容易に真空処理室101内の清掃および部品交換等のメンテナンス作業を行うことができる。
メンテナンス作業が終了すると、締結ボルト127によってメンテナンス扉114aと真空処理室101とを締結する。真空処理室101の下部に取り付けられた車輪223をレール224上で回転させることによって、真空処理室101をゲートバルブ103に接触させる(S97)。
真空処理室101をゲートバルブ103に接触させると、締結ボルト126によって真空処理室101とゲートバルブ103とを締め付ける。排気装置113aによって、真空処理室101内の真空排気を行い、排圧の上昇の程度を確認したり、ヘリウムリークテストなどによって真空処理室101内の空気の漏れを確認したりする(S98)。
被処理物設置工程(S84)あるいはメンテナンス工程(S90)が終了すると、真空処理される前の被処理物107が搬入部108に配置されて、設置取出扉114bが密閉される(S84)。
真空処理装置1bは複数の真空処理室101a,101bを含んでもよい。この場合には、ゲートバルブ103から切り離した真空処理室101aを、予めメンテナンスが完了した別の真空処理室101bと交換できることが好ましい。これにより、メンテナンス時間を短縮することができ、真空処理装置1の停止時間を短くすることができる。
本変形例に係る真空処理装置1bにおける真空処理の処理手順は、図9~図12に示した処理手順と同様であるが、メンテナンス工程(S90)における処理手順が異なる。真空処理装置1bが複数の真空処理室101a,101bを有する場合は、図12に示すメンテナンス工程(S90)において、清掃・部品交換工程(S96)を実施する代わりに、真空処理室交換工程を実行してもよい。すなわち、真空処理室移動工程(S95,S97)において、真空処理室101aをゲートバルブ103から切り離して移動させた上で、予めメンテナンスが完了している別の真空処理室101bをゲートバルブ103に連結することが可能である。
Claims (10)
- 被処理物(107)に真空処理を施すための真空処理装置(1)であって、
前記被処理物を第1の開口部(317)を通じて受け入れて収容する第1の処理室(101)を備え、
前記第1の処理室は、前記被処理物を支持して真空処理を施す真空処理部(104)を含み、
真空処理される前の被処理物と、真空処理された後の被処理物とを収容する真空排気可能な第2の処理室(102)をさらに備え、
前記第2の処理室は、
前記真空処理される前の被処理物を支持する搬入部(108)と、
前記真空処理された後の被処理物を支持する搬出部(119)とを含み、
前記第1の開口部と第2の処理室との間に、前記第1の処理室と着脱可能に介装されるゲート部(103)をさらに備え、
前記ゲート部は、当該ゲート部を介して接続された前記第1の処理室と前記第2の処理室とを遮断および連通し、
前記第1の開口部および前記ゲート部を通じて、前記真空処理される前の被処理物を前記搬入部から前記真空処理部へと搬入し、前記真空処理された後の被処理物を前記真空処理部から前記搬出部へと搬出する搬送装置(202)と、
前記第1の処理室と前記第2の処理室とを離間させる移動機構(200)とをさらに備える、真空処理装置。 - 前記移動機構と前記第2の処理室とを支持するベース部(201)をさらに備え、
前記移動機構は、
前記第1の処理室の下部に取り付けられた車輪(203)と、
前記ベース部に載置されるレール(224)とを含む、請求の範囲第1項に記載の真空処理装置。 - 少なくとも1つの他の第1の処理室(101b)をさらに備え、
前記移動機構は、前記他の第1の処理室と前記第2の処理室とを離間させ、
前記他の第1の処理室を、前記移動機構による前記第1の処理室の移動方向と垂直な方向にスライドさせるスライド機構をさらに備える、請求の範囲第1項に記載の真空処理装置。 - 前記第1の処理室は、前記被処理物の搬入方向に垂直な配列方向に並べて配置される複数の前記真空処理部を含み、
前記第2の処理室は、
前記配列方向に並べて配置される複数の前記搬入部と、
前記配列方向に並べて配置される複数の前記搬出部とを含み、
前記複数の搬入部の配列間隔と、前記複数の搬出部の配列間隔と、前記複数の真空処理部の配列間隔とが略同一である、請求の範囲第1項に記載の真空処理装置。 - 前記第1の開口部は、前記ゲート部との接続箇所に、前記真空処理部の断面よりも大きく形成される、請求の範囲第1項に記載の真空処理装置。
- 前記第1の処理室には、前記第1の開口部と対向する壁面に第2の開口部(318)が形成され、
前記第1の処理室は、前記第2の開口部を密閉および開放するための扉(114a)をさらに含む、請求の範囲第1項に記載の真空処理装置。 - 前記第2の開口部は、前記真空処理部の断面よりも大きく形成される、請求の範囲第6項に記載の真空処理装置。
- 請求の範囲第1項に記載の真空処理装置が配置される真空処理工場(400)であって、
前記ゲート部を介して接続された状態の前記第1の処理室と前記第2の処理室とが配置される真空処理エリア(402)と、
前記第2の処理室から離間された状態の前記第1の処理室が配置されるメンテナンスエリア(401)とが規定され、
前記第1の処理室は、
メンテナンスが行われる際に、前記移動機構によって前記メンテナンスエリアへと移動し、
メンテナンスが終了した際に、前記移動機構によって前記真空処理エリアへと移動する、真空処理工場。 - 被処理物に真空処理を施す真空処理装置のメンテナンス方法であって、
前記真空処理装置は、
前記被処理物を第1の開口部を通じて受け入れて収容する第1の処理室を備え、
前記第1の処理室は、前記被処理物を支持して真空処理を施す真空処理部を含み、
真空処理される前の被処理物と、真空処理された後の被処理物とを収容する真空排気可能な第2の処理室をさらに備え、
前記第2の処理室は、
前記真空処理される前の被処理物を支持する搬入部と、
前記真空処理された後の被処理物を支持する搬出部とを含み、
前記第1の開口部と第2の処理室との間に、前記第1の処理室と着脱可能に介装されるゲート部をさらに備え、
前記ゲート部は、当該ゲート部を介して接続された前記第1の処理室と第2の処理室とを遮断および連通し、
前記第1の開口部および前記ゲート部を通じて、前記真空処理される前の被処理物を前記搬入部から前記真空処理部へと搬入し、前記真空処理された後の被処理物を前記真空処理部から前記搬出部へと搬出する搬送装置と、
前記第1の処理室と前記第2の処理室とを離間させる移動機構とをさらに備え、
前記メンテナンス方法は、
前記移動機構を用いて、前記第1の処理室と前記第2の処理室とを離間させるステップと、
前記第1の処理室をメンテナンスするステップと、
前記移動機構を用いて、前記ゲート部を介して前記第1の処理室と前記第2の処理室とを接続させるステップとを備える、真空処理装置のメンテナンス方法。 - 前記真空処理装置は、
少なくとも1つの他の第1の処理室をさらに備え、
前記移動機構は、前記他の第1の処理室と前記第2の処理室とを離間させ、
前記他の第1の処理室を、前記移動機構による前記第1の処理室の移動方向と垂直な方向にスライドさせるスライド機構をさらに備え
前記メンテナンス方法は、
前記移動機構を用いて、前記他の第1の処理室と前記第2の処理室とを離間させるステップと、
前記スライド機構を用いて、前記他の第1の処理室をスライドさせるステップと、
前記他の第1の処理室をメンテナンスするステップとをさらに備える、請求の範囲第9項に記載の真空処理装置のメンテナンス方法。
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US12/918,674 US20100329828A1 (en) | 2008-02-20 | 2009-01-29 | Vacuum processing device, maintenance method for vacuum processing device, and vacuum processing factory |
CN2009801057979A CN101952935B (zh) | 2008-02-20 | 2009-01-29 | 真空处理装置、真空处理装置的维护方法和真空处理工厂 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011024749A1 (ja) * | 2009-08-26 | 2011-03-03 | シャープ株式会社 | 真空処理装置、および真空処理工場 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4842370B2 (ja) * | 2007-03-07 | 2011-12-21 | 株式会社アルバック | 真空装置、基板搬送方法 |
JP5469507B2 (ja) * | 2010-03-31 | 2014-04-16 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
KR101116316B1 (ko) | 2011-07-12 | 2012-03-14 | 주식회사 누리텍 | 플라즈마 표면 처리장치의 전극 조립체 |
SG10201605000PA (en) * | 2011-12-23 | 2016-08-30 | Applied Materials Inc | Methods and apparatus for cleaning substrate surfaces with atomic hydrogen |
KR101452828B1 (ko) * | 2012-08-28 | 2014-10-23 | 주식회사 유진테크 | 기판처리장치 |
US9991139B2 (en) | 2012-12-03 | 2018-06-05 | Asm Ip Holding B.V. | Modular vertical furnace processing system |
KR102401836B1 (ko) * | 2014-05-07 | 2022-05-25 | 에이에스엠엘 네델란즈 비.브이. | 타겟 가공 기계용 봉입체 |
JP6412782B2 (ja) * | 2014-11-26 | 2018-10-24 | 株式会社日立ハイテクノロジーズ | 処理装置およびその据え付け方法 |
CN105112881A (zh) * | 2015-09-15 | 2015-12-02 | 苏州普京真空技术有限公司 | 一种真空镀膜系统 |
JP6141479B1 (ja) * | 2016-03-18 | 2017-06-07 | エスペック株式会社 | 乾燥装置 |
KR102102653B1 (ko) * | 2017-03-14 | 2020-04-21 | 엘지전자 주식회사 | 전기습윤소자를 이용한 표면세정장치 및 이의 제어방법 |
WO2018169233A1 (en) | 2017-03-14 | 2018-09-20 | Lg Electronics Inc. | Device for cleaning surface using electrowetting element and method for controlling the same |
JP7176823B2 (ja) * | 2018-10-09 | 2022-11-22 | 株式会社スギノマシン | 洗浄装置、及び、対象物の洗浄及び乾燥方法 |
KR102108312B1 (ko) * | 2018-10-31 | 2020-05-12 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4289598A (en) | 1980-05-03 | 1981-09-15 | Technics, Inc. | Plasma reactor and method therefor |
JP2001239144A (ja) | 2000-02-29 | 2001-09-04 | Shimadzu Corp | ロードロック式真空装置 |
JP2006352010A (ja) * | 2005-06-20 | 2006-12-28 | Nissin Ion Equipment Co Ltd | 真空処理装置およびその運転方法 |
JP2008034480A (ja) * | 2006-07-26 | 2008-02-14 | Kaneka Corp | 半導体製造装置及び半導体製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2620049B2 (fr) * | 1986-11-28 | 1989-11-24 | Commissariat Energie Atomique | Procede de traitement, stockage et/ou transfert d'un objet dans une atmosphere de haute proprete, et conteneur pour la mise en oeuvre de ce procede |
JPH0668962B2 (ja) * | 1987-12-21 | 1994-08-31 | 株式会社東芝 | 真空装置及びそれを用いてプロセスを行う方法 |
JPH081923B2 (ja) * | 1991-06-24 | 1996-01-10 | ティーディーケイ株式会社 | クリーン搬送方法及び装置 |
JPH07283099A (ja) * | 1994-04-04 | 1995-10-27 | Kokusai Electric Co Ltd | 半導体製造装置 |
JPH0936198A (ja) * | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
US6053687A (en) * | 1997-09-05 | 2000-04-25 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
JP3632812B2 (ja) * | 1997-10-24 | 2005-03-23 | シャープ株式会社 | 基板搬送移載装置 |
US6393716B1 (en) * | 2000-04-20 | 2002-05-28 | Ritek Display Technology Co. | Method and apparatus for transporting substrates in OLED process |
EP1231626A1 (en) * | 2001-02-10 | 2002-08-14 | Infineon Technologies SC300 GmbH & Co. KG | Measurement arrangement |
JP2003258058A (ja) * | 2002-02-27 | 2003-09-12 | Anelva Corp | 基板処理装置の運転方法 |
DE102005039453B4 (de) * | 2005-08-18 | 2007-06-28 | Asys Automatic Systems Gmbh & Co. Kg | Bearbeitungsanlage modularen Aufbaus für flächige Substrate |
US8097084B2 (en) * | 2006-01-24 | 2012-01-17 | Vat Holding Ag | Vacuum chamber system for semiconductor processing |
JP4766500B2 (ja) * | 2009-08-26 | 2011-09-07 | シャープ株式会社 | 真空処理装置、および真空処理工場 |
-
2008
- 2008-02-20 JP JP2008038853A patent/JP4406666B2/ja not_active Expired - Fee Related
-
2009
- 2009-01-29 US US12/918,674 patent/US20100329828A1/en not_active Abandoned
- 2009-01-29 CN CN2009801057979A patent/CN101952935B/zh not_active Expired - Fee Related
- 2009-01-29 KR KR1020107020916A patent/KR101120862B1/ko not_active IP Right Cessation
- 2009-01-29 EP EP09712373A patent/EP2246875A4/en not_active Withdrawn
- 2009-01-29 WO PCT/JP2009/051415 patent/WO2009104463A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4289598A (en) | 1980-05-03 | 1981-09-15 | Technics, Inc. | Plasma reactor and method therefor |
JP2001239144A (ja) | 2000-02-29 | 2001-09-04 | Shimadzu Corp | ロードロック式真空装置 |
JP2006352010A (ja) * | 2005-06-20 | 2006-12-28 | Nissin Ion Equipment Co Ltd | 真空処理装置およびその運転方法 |
JP2008034480A (ja) * | 2006-07-26 | 2008-02-14 | Kaneka Corp | 半導体製造装置及び半導体製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2246875A4 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011024749A1 (ja) * | 2009-08-26 | 2011-03-03 | シャープ株式会社 | 真空処理装置、および真空処理工場 |
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EP2246875A1 (en) | 2010-11-03 |
CN101952935A (zh) | 2011-01-19 |
US20100329828A1 (en) | 2010-12-30 |
KR101120862B1 (ko) | 2012-03-16 |
JP4406666B2 (ja) | 2010-02-03 |
EP2246875A4 (en) | 2012-03-14 |
KR20100125337A (ko) | 2010-11-30 |
JP2009200159A (ja) | 2009-09-03 |
CN101952935B (zh) | 2012-11-21 |
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