WO2009090743A1 - Dispositif de transport de substrat - Google Patents

Dispositif de transport de substrat Download PDF

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Publication number
WO2009090743A1
WO2009090743A1 PCT/JP2008/050539 JP2008050539W WO2009090743A1 WO 2009090743 A1 WO2009090743 A1 WO 2009090743A1 JP 2008050539 W JP2008050539 W JP 2008050539W WO 2009090743 A1 WO2009090743 A1 WO 2009090743A1
Authority
WO
WIPO (PCT)
Prior art keywords
transport
substrate
unit
glass substrate
transport direction
Prior art date
Application number
PCT/JP2008/050539
Other languages
English (en)
Japanese (ja)
Inventor
Makoto Fujiyoshi
Original Assignee
Hirata Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corporation filed Critical Hirata Corporation
Priority to CN2008801140350A priority Critical patent/CN101842302B/zh
Priority to PCT/JP2008/050539 priority patent/WO2009090743A1/fr
Priority to KR1020107010965A priority patent/KR101186348B1/ko
Priority to JP2009549933A priority patent/JP5006411B2/ja
Priority to TW097119741A priority patent/TWI484581B/zh
Publication of WO2009090743A1 publication Critical patent/WO2009090743A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B65G47/53—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices between conveyors which cross one another
    • B65G47/54—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices between conveyors which cross one another at least one of which is a roller-way
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Definitions

  • the present invention relates to an apparatus for transporting a substrate.
  • an FPD flat panel display
  • a liquid crystal display or a plasma display it is necessary to transport the substrate between a cassette for accommodating the substrate and the processing apparatus or between the processing apparatuses.
  • Japanese Patent Application Laid-Open No. 2005-64432 includes a mounting table for mounting a substrate unloaded from a cassette, and a substrate transporting apparatus for transporting the substrate unloaded from the mounting table to a processing apparatus.
  • An apparatus is disclosed. However, in this apparatus, while the substrate transfer device is transferring the substrate, the substrate cannot be transferred from the mounting table to the substrate transfer device, and the transfer efficiency of the substrate is reduced.
  • Japanese Patent Application Laid-Open No. 2004-292094 discloses an apparatus including a roller conveyor and a transfer device that loads a substrate on the roller conveyor into a cassette and unloads the substrate from the cassette onto the roller conveyor. Yes.
  • the substrate can be carried out of the cassette onto the roller conveyor by the transfer device.
  • the entire device is enlarged in order to secure an installation space for the transfer device.
  • FIG. 11 and FIG. 12 of Japanese Patent Application Laid-Open No. 2004-284772 disclose a device in which two sets of roller conveyors whose transport directions are orthogonal to each other are arranged so as to overlap each other and one of them is moved up and down. Even in this apparatus, even when one roller conveyor is transporting a substrate, the substrate is unloaded from the cassette onto the one roller conveyor, and is conveyed by the other roller conveyor by raising and lowering the other roller conveyor. Is possible. Further, the entire apparatus can be reduced in size by arranging two sets of roller conveyors whose conveying directions are orthogonal to each other so as to overlap each other.
  • the roller conveyor has a roller driving mechanism, and it is not easy to reduce its weight. Therefore, it takes time to move the roller conveyor up and down, and the substrate transfer efficiency may decrease.
  • the first transport means for supporting the substrate from the lower side and transporting it horizontally in the first transport direction, and the substrate on the first transport means from the lower side for supporting the first Second conveying means for horizontally conveying in a second conveying direction orthogonal to the one conveying direction, wherein the first conveying means is composed of a plurality of rows of first conveying units spaced apart from each other in the first conveying direction.
  • the second transport means includes a plurality of second transport units spaced apart from each other in the first transport direction, and each of the second transport units is disposed in a gap between the first transport units, and the substrate A support unit that supports the substrate on the first transport unit, the support unit disposed below the support unit, and connected to the support unit.
  • the support unit supports the substrate on the first transport unit.
  • Lift from unit An elevating unit that raises and lowers the support unit between a raised position and a lowered position where the support unit does not interfere with the substrate on the first transport unit, and is disposed below the first transport unit,
  • a substrate transfer apparatus comprising: a drive unit that moves the support unit and the elevating unit in the second transfer direction.
  • the second transport unit is disposed below the first transport unit, so that the size of the entire apparatus can be reduced.
  • the substrate is raised and lowered by raising and lowering the support unit by the raising and lowering unit.
  • the support unit only needs to have a function of supporting the substrate from below, and a driving mechanism for moving the substrate is unnecessary, so that the weight can be reduced. For this reason, the raising / lowering speed of the said board
  • the substrate transfer device A includes an orthogonal transfer device 1, conveyor devices 2 and 3, a transfer device 4, a plurality of conveyor devices 5, and a plurality of lifting devices 80.
  • the substrate transport apparatus A transports the glass substrate W from the storage cassette 70 that stores the rectangular thin glass substrate W to the processing apparatus (not shown), and transports the glass substrate W from the processing apparatus to the storage cassette 70.
  • the processing apparatus performs cleaning, drying, and other processing of the glass substrate W.
  • the first transport unit 11 is configured by the roller conveyor unit 60, but may be another transport unit that supports and transports the glass substrate W from the lower side, for example, a belt conveyor.
  • the second transport device 20 is configured by a plurality of second transport units 21 that are controlled synchronously and spaced apart from each other in the X direction, and are provided on the gantry body 501. In the case of this embodiment, three second transport units 21 are provided. Hereinafter, the configuration of each second transport unit 21 will be described in detail with reference to FIGS. 2 to 4.
  • FIG. 4 is a perspective view of the second transport unit 21.
  • the second transport unit 21 includes a support unit 30, an elevating unit 40, and a drive unit 50.
  • the support unit 30 includes a support member 31 extending in the Y direction.
  • the support member 31 is a hollow square steel pipe.
  • a plurality of rollers 32 are provided on the support member 31 so as to be separated from each other in the Y direction, and are supported by the support member 31 via brackets 33.
  • the roller 32 is rotatably attached to the bracket 33 and can rotate about an axis in the X direction.
  • the support member 31 may be provided with a pin member having a rolling bearing at the tip.
  • FIG. 5 is an operation explanatory diagram of the substrate holding unit 34. 5 shows a case where the glass substrate W is placed on the roller 32 and the contact member 35 of the substrate holding unit 34 is in the retracted position. By moving each contact member 35 in the direction approaching each other by the operation of each moving unit 36 from this mode, each contact member 35 is moved to the contact position as shown in the lower side of FIG. The glass substrate W is held in contact with each edge in the Y direction of the glass substrate W. Further, the glass substrate W can be positioned in the Y direction by holding the glass substrate W by the substrate holding unit 34. During the transport of the glass substrate W by the second transport device 20, the glass substrate W is positioned and held by the substrate holding unit 34.
  • the conveyor devices 2 and 3 each include a plurality of roller conveyor units 60 in the case of this embodiment.
  • the conveyor device 2 is disposed on the side in the + X direction of the first transport device 10 and transports the glass substrate W from the transport device 4 to the orthogonal transport device 1.
  • the conveyor device 3 is disposed on the + X side of the first transport device 10 and transports the glass substrate W from the orthogonal transport device 1 to the transport device 4.
  • the elevating device 80 includes a beam member 81 on which the beam member 72 at the bottom of the storage cassette 70 is placed. As each beam member 81 of each lifting device 80 moves in the Z direction synchronously, the storage cassette 70 is lifted and lowered.
  • the lifting device 80 includes a driving device (not shown), and the storage cassette 70 is lifted and lowered by lifting and lowering the beam member 81 by the driving device. Between each lifting device 80, a beam member 80a is installed on the upper end of the column.
  • the storage cassette 70 is lowered by the lifting device 80 (not shown in FIG. 7) from the state where the storage cassette 70 is positioned above the conveyor device 5, and the upper right diagram of FIG. 7.
  • the glass substrate W to be transported is placed on the conveyor device 5.
  • the conveyor device 5 enters the storage cassette 70 from below, and the glass substrate W to be transported floats from the wire 73 of the storage cassette 70 and is supported only by the conveyor device 5.
  • the conveyor device 5 is driven to carry out the glass substrate W to be transported from the storage cassette 70 as shown in the lower left diagram of FIG.
  • the lowering of the storage cassette 70 and the driving of the conveyor device 5 are repeated (lower right diagram in FIG. 7), and the glass substrates W are sequentially carried out from the lower side.
  • a communication interface (I / F) 206 is an interface between the host computer 300 that controls the entire substrate processing equipment including the substrate transfer apparatus A and the CPU 201.
  • the CPU 201 controls the substrate transfer apparatus A in response to a command from the host computer 300. To control.
  • Whether or not the support unit 30 is located directly below the glass substrate W is basically considered to be located directly below the glass substrate W when the support unit 30 is located at a predetermined position.
  • a sensor that detects the glass substrate W may be provided in the support unit 30 to detect the glass substrate W and control the position of the support unit 30.
  • the contact member 35 of the substrate holding unit 34 is positioned at the retracted position, and the support unit 30 is moved to the lowered position.
  • the first glass substrate W is placed on the first transfer device 10 again.
  • the first glass substrate W is transported in the + X direction by the first transport device 10 and the conveyor device 3, and the first glass substrate W is transferred to the transport device 4.
  • the transport apparatus 4 transports the first glass substrate W to the processing apparatus.
  • the support unit 30 is moved in the + Y direction by the operation of the drive unit 50 and is positioned directly below the second glass substrate W.
  • the position is directly below the glass substrate W transported through the support unit 30 (position in FIG. 9). Therefore, it is possible to improve the conveyance efficiency.
  • the unprocessed glass substrate W can be sequentially and continuously conveyed from the storage cassette 70 located on the + Y side to the processing apparatus. Since the conveyance of the glass substrate W in the orthogonal conveyance apparatus 1 in the X direction and the Y direction can be performed in parallel, the conveyance efficiency of the glass substrate W can be improved.
  • the processed glass substrate W is transported from the processing device to the conveyor device 2 by the transport device 4, and the conveyor device 2 transports the glass substrate W onto the orthogonal transport conveyor 1.
  • the operation of the first conveyance unit 10 of the first conveyance device 10 conveys the glass substrate W conveyed from the conveyor device 2 to the ⁇ X side, and the X direction of the orthogonal conveyance device 1.
  • the glass substrate W is positioned in the approximate center of (FIG. 14).
  • the support unit 30 is positioned at the lowered position, and is positioned directly below the glass substrate W being conveyed.
  • the contact member 35 of the substrate holding unit 34 is positioned at the retracted position.
  • the support unit 30 is moved to the raised position by the elevating unit 40, and thereby the glass substrate W is supported by the support unit 30 instead of the first transport device 10. Subsequently, the operation of the substrate holding unit 34 moves the contact member 35 to the contact position to hold the glass substrate W.
  • the contact member 35 of the substrate holding unit 34 is positioned at the retracted position, and the support unit 30 is moved to the lowered position.
  • the first glass substrate W is placed on the first transfer device 10 again.
  • the first glass substrate W is carried into the ⁇ Y side storage cassette 70 by the operations of the first transport device 10, the conveyor device 5, and the lifting device 80.
  • the support unit 30 is moved in the + Y direction by the operation of the drive unit 50 and is positioned directly below the second glass substrate W.
  • the position is directly below the glass substrate W being transported through the support unit 30 (the position in FIG. 13). ) And can be put on standby, so that the conveyance efficiency can be improved.
  • the processed glass substrates W can be sequentially and continuously transferred from the processing apparatus to the storage cassette 70 located on the ⁇ Y side. Since the conveyance of the glass substrate W in the orthogonal conveyance apparatus 1 in the X direction and the Y direction can be performed in parallel, the conveyance efficiency of the glass substrate W can be improved.
  • the conveyance of the glass substrate W in the X direction and the Y direction in the orthogonal conveyance device 1 can be performed in parallel, the conveyance efficiency of the glass substrate W can be improved.
  • the glass substrate W is raised and lowered by raising and lowering the support unit 30 by the raising and lowering unit 40. Since the support unit 30 itself does not have a drive mechanism for transporting the glass substrate W and only has a function of supporting the glass substrate W from the lower side, the weight can be reduced. For this reason, the glass substrate W can be moved up and down at high speed, and the conveyance efficiency of the glass substrate W can be improved.
  • the weight of the support unit 30 can be reduced, it can be moved at a higher speed in the Y direction, and the conveyance efficiency of the glass substrate W can be further improved. Further, since the support unit 30 is configured to move, the transport distance of the glass substrate W in the Y direction is defined by the total length of the drive unit 50 in the Y direction, and may be longer or shorter. This increases the degree of freedom of device layout.
  • the conveyor devices 2, 3 and 5 can be arranged on the + X side and the -X side of the orthogonal conveyance device 1, respectively, and the glass substrate W can be transferred between them and the orthogonal conveyance device 1, the degree of freedom in layout of the device Can be enhanced.
  • the second transport unit 21 can be stopped at an arbitrary position in the Y direction of the first transport unit 11.
  • the 1st conveyance unit 11 is comprised by the several roller conveyor unit 60 which can be driven independently.
  • the roller conveyor units 60 of the first transport unit 11 are arranged at substantially equal pitches in the Y direction, but the present invention is not limited to this. It is sufficient that the roller conveyor unit 60 is located at least on the side of the conveyor devices 2, 3, and 5 disposed on the side of the orthogonal conveyance device 1.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Intermediate Stations On Conveyors (AREA)
  • Relays Between Conveyors (AREA)

Abstract

La présente invention se rapporte à un dispositif de transport de substrat comprenant un premier moyen de transport qui transporte un substrat à l'horizontale dans une première direction de transport et un second moyen de transport qui transporte le substrat à l'horizontale dans une seconde direction de transport orthogonale à la première direction de transport. Le premier moyen de transport se compose d'une pluralité de lignes de premières unités de transport séparées les unes des autres dans la première direction de transport. Le second moyen de transport se compose d'une pluralité de secondes unités de transport séparées les unes des autres dans la seconde direction de transport. Chaque seconde unité de transport comprend une unité de support qui est disposée dans un espace entre les premières unités de transport pour soutenir le substrat depuis son côté inférieur, une unité de déplacement vertical qui est disposé sous l'unité de support pour déplacer à la verticale l'unité de support, et une unité d'entraînement qui est disposée sous la première unité de transport pour déplacer l'unité de support et l'unité de déplacement vertical dans la seconde direction de transport.
PCT/JP2008/050539 2008-01-17 2008-01-17 Dispositif de transport de substrat WO2009090743A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008801140350A CN101842302B (zh) 2008-01-17 2008-01-17 基板输送装置
PCT/JP2008/050539 WO2009090743A1 (fr) 2008-01-17 2008-01-17 Dispositif de transport de substrat
KR1020107010965A KR101186348B1 (ko) 2008-01-17 2008-01-17 기판 반송 장치
JP2009549933A JP5006411B2 (ja) 2008-01-17 2008-01-17 基板搬送装置
TW097119741A TWI484581B (zh) 2008-01-17 2008-05-28 Substrate handling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/050539 WO2009090743A1 (fr) 2008-01-17 2008-01-17 Dispositif de transport de substrat

Publications (1)

Publication Number Publication Date
WO2009090743A1 true WO2009090743A1 (fr) 2009-07-23

Family

ID=40885153

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050539 WO2009090743A1 (fr) 2008-01-17 2008-01-17 Dispositif de transport de substrat

Country Status (5)

Country Link
JP (1) JP5006411B2 (fr)
KR (1) KR101186348B1 (fr)
CN (1) CN101842302B (fr)
TW (1) TWI484581B (fr)
WO (1) WO2009090743A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011029427A1 (fr) * 2009-09-08 2011-03-17 Grenzebach Maschinenbau Gmbh Procédé et dispositif de classement et/ou d'entreposage de plaques de verre à revêtement dans des salles blanches
CN102280397A (zh) * 2010-06-10 2011-12-14 致茂电子(苏州)有限公司 一种晶圆输送分配装置及其方法
CN102807095A (zh) * 2011-05-31 2012-12-05 上海福耀客车玻璃有限公司 一种汽车玻璃包边流水线装置

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CN105731044B (zh) * 2016-03-31 2018-08-17 苏州康博特液压升降机械有限公司 一种用于型材转送的接驳装置及接驳机
CN106185340A (zh) * 2016-08-29 2016-12-07 天能电池(芜湖)有限公司 蓄电池极板负压收片装置
JP6887616B2 (ja) * 2017-05-09 2021-06-16 日本電気硝子株式会社 ガラス板の搬送装置及びガラス板の製造方法
CN109279305A (zh) * 2018-08-27 2019-01-29 河北卓达建材研究院有限公司 一种用于墙板生产线模具输送的转弯机
US11673749B2 (en) * 2019-09-06 2023-06-13 Billco Manufacturing Incorporated Glass cutting line with automatic remnant storage and retrieval including cutting table with integrated squaring stop and Y-break breaking bar facilitating sub-plate cutting
CN112758387B (zh) * 2020-12-28 2021-10-29 广东鑫光智能系统有限公司 玻璃出库分拣装置及其方法

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2004075203A (ja) * 2002-08-09 2004-03-11 Dainippon Printing Co Ltd バッファ装置
JP2004155569A (ja) * 2002-11-08 2004-06-03 Daifuku Co Ltd 板状体の取り扱い設備
JP2004284772A (ja) * 2003-03-24 2004-10-14 Toshiba Mitsubishi-Electric Industrial System Corp 基板搬送システム
WO2007029401A1 (fr) * 2005-09-02 2007-03-15 Hirata Corporation Systeme de chargement/dechargement de piece de fabrication et dispositif de transport

Family Cites Families (1)

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Publication number Priority date Publication date Assignee Title
KR100618918B1 (ko) * 2005-04-12 2006-09-01 주식회사 디엠에스 적층형 기판 이송장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004075203A (ja) * 2002-08-09 2004-03-11 Dainippon Printing Co Ltd バッファ装置
JP2004155569A (ja) * 2002-11-08 2004-06-03 Daifuku Co Ltd 板状体の取り扱い設備
JP2004284772A (ja) * 2003-03-24 2004-10-14 Toshiba Mitsubishi-Electric Industrial System Corp 基板搬送システム
WO2007029401A1 (fr) * 2005-09-02 2007-03-15 Hirata Corporation Systeme de chargement/dechargement de piece de fabrication et dispositif de transport

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011029427A1 (fr) * 2009-09-08 2011-03-17 Grenzebach Maschinenbau Gmbh Procédé et dispositif de classement et/ou d'entreposage de plaques de verre à revêtement dans des salles blanches
CN102280397A (zh) * 2010-06-10 2011-12-14 致茂电子(苏州)有限公司 一种晶圆输送分配装置及其方法
CN102807095A (zh) * 2011-05-31 2012-12-05 上海福耀客车玻璃有限公司 一种汽车玻璃包边流水线装置

Also Published As

Publication number Publication date
TW200933800A (en) 2009-08-01
JP5006411B2 (ja) 2012-08-22
JPWO2009090743A1 (ja) 2011-05-26
CN101842302B (zh) 2013-03-13
KR101186348B1 (ko) 2012-09-26
KR20100069712A (ko) 2010-06-24
CN101842302A (zh) 2010-09-22
TWI484581B (zh) 2015-05-11

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