WO2009084630A1 - 搬送ロボットの診断システム - Google Patents
搬送ロボットの診断システム Download PDFInfo
- Publication number
- WO2009084630A1 WO2009084630A1 PCT/JP2008/073731 JP2008073731W WO2009084630A1 WO 2009084630 A1 WO2009084630 A1 WO 2009084630A1 JP 2008073731 W JP2008073731 W JP 2008073731W WO 2009084630 A1 WO2009084630 A1 WO 2009084630A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- robot
- robot arm
- detected
- detection means
- substrate
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40562—Position and orientation of end effector, teach probe, track them
Definitions
- the present invention relates to a diagnostic system for a low-cost transfer robot using a sensor for detecting a substrate position installed in an existing processing apparatus.
- a load lock chamber for a substrate S is provided so as to surround a central transfer chamber A in which a transfer robot 1 is disposed.
- B and a plurality of processing chambers C are arranged so that the substrate S put into the load lock chamber B by the transfer robot 1 is transferred to each processing chamber C or between the processing chambers C.
- Devices so-called cluster tool devices are known.
- the transfer robot 1 includes a robot arm 11 and drive means for driving the robot arm 11 to be rotatable and extendable on the same plane, and supports the substrate S in a state where the substrate S is placed on the tip of the robot arm 11. It has a robot hand 12.
- the robot hand 12 appropriately holds the substrate S existing at a predetermined position, and the target position of the substrate S (for example, a substrate stage (not shown) in each processing chamber C). N))) and transfer it to the proper position.
- detection means 2 such as an optical sensor is provided on the ceiling or bottom of the boundary region of the transfer chamber A with each processing chamber C (see FIG. 1B).
- the detection unit 2 checks whether or not the substrate S is accurately supported by the robot hand 12 in addition to detecting the presence or absence of the substrate S. Is found, the operation of the robot arm 11 is adjusted so as to cancel out the displacement (see, for example, Patent Document 1).
- the above-mentioned positional deviation of the substrate may be caused by a failure of a part such as a robot arm or a motor or a bearing constituting a driving means for driving the robot arm.
- a positional deviation occurs due to a decrease in the positional deviation measurement accuracy and the positional deviation canceling operation accuracy. If the transfer robot is left with the position accuracy lowered, it causes a product processing failure or a device failure, resulting in a large damage.
- a diagnosis system for a transfer robot includes a transfer robot having a robot arm having a robot hand that supports a substrate to be processed at the tip, and a driving means for driving the robot arm, and the robot. And at least one detection means arranged to detect a substrate supported by a robot hand when the substrate is transferred between a plurality of processing chambers by an arm, and the substrate is transferred by the robot arm between the processing chambers.
- the operation data of the robot arm detected by the detection means is acquired to create a reference value, and the predetermined value of the robot arm is determined.
- the operation data at that time is acquired, and the operation data is compared with the reference value. , Characterized in that so as to determine the abnormality of the transfer robot when changes beyond a predetermined range.
- the detection is arranged to detect the presence or absence of the substrate and its position.
- the detection means is used to determine the health of the transfer robot.
- the operation data of the robot arm detected by the detection means is acquired, and a reference value is prepared. Then, for example, when the predetermined portion of the robot arm is detected by the detection means during a predetermined prescribed operation such as an initialization operation of the transfer robot or various processes (production) on the substrate, operation data at that time is detected. The operation data and the reference value are compared, and when the change exceeds a predetermined range, the abnormality of the transfer robot is determined.
- the health of the transfer robot can be easily determined using the existing one, the number of parts is not increased, and the cost can be reduced.
- the health of the transfer robot is judged, so that it is possible to grasp the signs of occurrence of an abnormality at an early stage and perform planned maintenance, and as a result, the operating rate can be improved. it can.
- the robot arm is configured to be driven to rotate and extend and retract at least on the same plane, and the detection means projects light perpendicular to the plane.
- the present invention can be applied to a robot arm configured to move up and down in order to deliver a substrate.
- the drive means may be a motor equipped with an encoder, and the operation data may be acquired from the address of the encoder when the robot arm is detected by the detection means.
- the time until the predetermined part of the robot arm is detected by another detection means or the operation start instruction of the transfer robot is detected.
- the operation data can be acquired from the time until a predetermined portion of the robot arm is detected by any of the means.
- the abnormality determination of the transfer robot is performed during a predetermined prescribed operation.
- the prescribed operation refers to an operation for operating the transfer robot in accordance with a predetermined operation program other than transferring the substrate for various processes to the substrate, such as an initialization operation of the transfer robot.
- the transfer robot used in the cluster tool device when detecting a predetermined portion of the robot arm, only the specific operation data is extracted and acquired, and the detection becomes a criterion for determining the health of the transfer robot. If a means is determined, the control for the determination may be simplified.
- the robot arm is configured to be movable up and down, it is only necessary to determine whether or not the transfer robot is abnormal at a predetermined height position. In this case, if an abnormality of the transfer robot is determined at the same height position, a sign of failure can be detected from the tilt of the robot arm or the robot hand with respect to the optical axis of the optical sensor.
- a transfer robot 1 having a known structure is provided, and a detection means 2 is provided in the vicinity of a connection portion with each processing chamber C.
- the detecting means 2 for example, an optical sensor having a known structure such as a laser sensor or an LED fiber sensor is used.
- the detection means 2 is a transmissive type that is arranged so as to project light vertically to a robot arm that is driven to rotate and expand and contract on the same plane, and includes a light projector 21 and a light receiver 22.
- a reflective type can also be used.
- the conveyance robot 1 has two motors which are the drive means which abbreviate
- the rotation shafts 10a and 10b of each motor are concentrically arranged, and a robot arm 11 is connected to each rotation shaft 10a and 10b through a link mechanism, and a robot hand 12 is provided at the tip thereof via a gear box G. .
- the robot arm 11 and the robot hand 12 can be expanded and contracted and swiveled by appropriately controlling the rotation angles of the rotation shafts 10a and 10b of each motor.
- raising / lowering means such as an air cylinder of the rotation shaft of each motor may be provided so that the robot arm 11 itself moves up and down (up and down).
- the operation of the transfer robot 1 and the information processing of the detection result by the detection means 2 are comprehensively controlled by a control means (not shown).
- the robot arm 11 and the robot hand 12 are formed of a heat-resistant material, for example, a plate material such as Al alloy, Al2O3, Si02, or SiC.
- the robot hand 12 includes a pair of finger portions 14 that branch from the base end portion 13 connected to the robot arm 11 into a bifurcated shape and extend forward.
- a seat surface 15 on which the outer peripheral portion of the lower surface of the substrate S can be seated at three places in the circumferential direction is provided at the base end portion 13 and the distal end portions of both finger portions 14, and the lower surface other than the outer peripheral portion of the substrate S is a robot. It is supported so as to float from the hand 12.
- the robot arm 11 is expanded and contracted or rotated, and the substrate S put into the load lock chamber B is placed in one of the processing chambers C or in each processing chamber.
- the substrate S is transported between C.
- the presence or absence of the substrate S and whether or not the substrate S is accurately supported by the robot hand 13 is confirmed by any of the detection means 2.
- the robot arm 11 is contracted and the tip of the finger portion 14 is the first end.
- the robot arm 11 is extended from the standby position directed to the first processing chamber C1, receives the substrate S from the first processing chamber C1, and returns to the standby position.
- the robot arm 11 is turned to a position where the tip of the finger portion 15 is directed to the second processing chamber C2.
- the robot arm 11 is extended to deliver the substrate S in the first processing chamber C1, and return to the original state (standby position) (see FIG. 3).
- the robot arm 11 including the robot hand 12 is provided with each detection means provided in the transfer chamber A in the vicinity of the connection point with the first and second processing chambers C1 and C2. 2 crosses each of the detection positions 2a and 2b. Therefore, when the transport robot 1 is operated, a predetermined portion detected by the detection means 2 is positioned on the trajectory crossing the detection position of the detection means 2 and the base end portion 13 and both finger portions 14 of the robot hand 12 are detected.
- the through-holes 17 and 18 which comprise are each formed (refer FIG. 2).
- the signal of the detection means 2 is turned off, and the signal is turned on when any of the through holes 17 and 18 is reached. . Finally, when the robot arm 13 completely crosses the detection position, the signal of the detection means 2 is turned off again.
- the detection units 2a and 2b From the timing at which the signal is switched, that is, the time from the detection timing of one detection means 2a to the detection timing of the other detection means 2b, the operation data of the transfer robot 1 is acquired and a reference value is prepared (in this case, As the operation data as the reference value, for example, an identification number assigned to each detection means and its elapsed time are registered in the control means).
- the operation data that is the reference value is created based on the elapsed time from the detection timing of one of the detection means 2a, but is detected by either the detection means 2a or 2b from the start of the operation of the motor. Operation data as a reference value may be created from the elapsed time until.
- the operation data as a reference value is prepared from the relationship between the elapsed time from the detection timing of one detection means 2a to the detection timing of the other detection means 2b and the motor rotation speed (turning speed and expansion / contraction speed data).
- the motor rotation speed turning speed and expansion / contraction speed data.
- the example of diagnosing the health of the transport robot from the timing at which the signals of the detection means 2 are switched by the detection means 2a and 2b has been described as an example, but the present invention is not limited to this.
- the motor as the driving means includes an encoder
- the reference value is obtained from the encoder coordinates and the encoder value (address) when a predetermined portion of the robot arm 11 or the robot hand 12 is detected by either the detection means 2a or 2b. It is also possible to acquire the operating data. Then, the encoder coordinates and the encoder value when the predetermined portion is detected by the same detection means are compared with the operation data as the reference value. Judging.
- the health of the transfer robot 1 may be determined at a preset height position. As described above, if the abnormality of the transfer robot 1 is determined at the same height position, when a part such as a bearing is deteriorated when the robot arm 11 is turned or expanded / contracted, the light of the optical sensor serving as the detection unit 2 is deteriorated. The inclination of the robot arm 11 or the robot hand 12 with respect to the axis is changed, whereby the time until detection by the detection means 2 changes, so that a sign of failure can be grasped.
- the health (abnormality) determination of the transfer robot 1 can be performed, for example, when the robot hand 12 does not support the substrate S during a predetermined specified operation such as an initialization operation of the transfer robot.
- the predetermined part of the robot arm 11 detected by the detection unit 2 is transferred by one of the detection units 2 while being transferred from one processing chamber to another processing chamber during various processes (production) on the substrate S.
- the health of the transfer robot 1 can be determined even during various processes (production) on the substrate.
- the predetermined portion of the robot arm 11 detected by the detection means 2 is not limited to the through holes 17 and 18.
- the surface is exposed even when the substrate S is supported by the robot hand 12. You may comprise from the notch formed in the edge part.
- both robot arms simultaneously perform turning and extending and contracting operations.
- a predetermined portion of both robot arms is simultaneously detected by any one of the detection means 2, and there is a possibility that the amount of data increases and the control for judging the health is complicated.
- the same problem may occur if a predetermined portion of the robot arm is detected for each detection means 2.
- the transfer robot 1 is operated when the predetermined operation is performed. Only the specific operation data may be extracted and acquired, and the health determination may be performed by determining a detection unit that is a criterion for the health determination of the transfer robot 1. In this case, it is only necessary to allocate each detection means 2 and two motors and register an identification number in the control means, and to create specific operation data only for the identification number selected from them.
- the transfer robot 1 determines the health of the transfer robot 1 by using the detection means 2 for detecting the substrate position provided as the equipment of the existing processing apparatus 1. As a result, the cost can be reduced without increasing the number of parts. In addition, it is possible to grasp a sign of occurrence of an abnormality at an early stage to enable planned maintenance, and as a result, it is possible to improve the operation rate.
- the present invention is not limited to this.
- the present invention can be applied as long as the detection means is provided in the processing apparatus and the detection means 2 detects when the transfer robot 1 is operated.
- the regulation operation and the health judgment during production are mainly described.
- the robot arm 11 is expanded and contracted, and the position at which the signal is switched ON and OFF is obtained by each of the detection means 2a and 2b, and the center of the through hole 17 is determined from the average value of the encoder address when the signal is switched ON and OFF. Is identified.
- (A) And (b) is the top view and sectional view which show typically the substrate processing apparatus which comprises a conveyance robot.
- the top view which shows the robot hand of embodiment of this invention.
- the typical top view explaining conveyance of the substrate by the robot hand between processing chambers.
- Robot arm 12 Robot hand 2 Detection means 2a, 2b Detection position S Substrate A load lock room C treatment room
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
12 ロボットハンド
2 検知手段
2a、2b 検知位置
S 基板
A ロードロック室
C 処理室
Claims (7)
- 処理すべき基板を支持するロボットハンドを先端に有するロボットアーム及び当該ロボットアームを駆動する駆動手段を有する搬送ロボットと、
当該ロボットアームにより複数の処理室間で基板を搬送する際にロボットハンドにより支持された基板を検知するように配置された少なくとも1個の検知手段とを備え、
前記処理室間でロボットアームにより基板を搬送する際にいずれかの検知手段にてロボットアームの所定部分が検知される場合に、当該検知手段にて検知されるロボットアームの作動データを取得して基準値を作製し、前記ロボットアームの所定部分が前記検知手段で検知されると、そのときの作動データを取得し、この作動データと前記基準値とを比較し、所定の範囲を超えて変化した場合に搬送ロボットの異常を判断するようにしたことを特徴とする搬送ロボットの診断システム。 - 前記ロボットアームは、少なくとも同一平面上を旋回及び伸縮自在に駆動されるように構成されたものであり、前記検知手段は、前記平面に対し垂直に投光するように配置した光学センサであることを特徴とする請求項1記載の搬送ロボットの診断システム。
- 前記駆動手段はエンコーダを備えたモータであり、検知手段にてロボットアームの所定部分が検知されたときのエンコーダのアドレスから前記作動データを取得するようにしたことを特徴とする請求項1または請求項2記載の搬送ロボットの診断システム。
- 前記検知手段のいずれかにてロボットアームの所定部分が検知された後、他の検知手段にてロボットアームの所定部分が検知されるまでの時間、または搬送ロボットの作動開始指示から前記検知手段のいずれかにてロボットアームの所定部分が検知されるまでの時間から前記作動データを取得することを特徴とする請求項1または請求項2記載の搬送ロボットの診断システム。
- 前記搬送ロボットの異常判断を所定の規定動作の際に行うことを特徴とする請求項1乃至請求項4のいずれか1項に記載の搬送ロボットの診断システム。
- 前記ロボットアームの所定部分を検出する場合、特定の作動データのみを抽出して取得することを特徴とする請求項1乃至請求項5のいずれか1項に記載の搬送ロボットの診断システム。
- 前記ロボットアームを昇降自在に構成し、所定の高さ位置にて搬送ロボットの異常判断を行うことを特徴とする請求項1乃至請求項6のいずれか1項に記載の搬送ロボットの診断システム。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008801226544A CN101911274B (zh) | 2007-12-27 | 2008-12-26 | 传送机器人的诊断系统 |
JP2009548089A JP5053388B2 (ja) | 2007-12-27 | 2008-12-26 | 搬送ロボットの診断システム |
US12/745,823 US20100256811A1 (en) | 2007-12-27 | 2008-12-26 | Diagnosis system for transport robot |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007337164 | 2007-12-27 | ||
JP2007-337164 | 2007-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009084630A1 true WO2009084630A1 (ja) | 2009-07-09 |
Family
ID=40824343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/073731 WO2009084630A1 (ja) | 2007-12-27 | 2008-12-26 | 搬送ロボットの診断システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100256811A1 (ja) |
JP (1) | JP5053388B2 (ja) |
KR (1) | KR101209020B1 (ja) |
CN (1) | CN101911274B (ja) |
TW (1) | TWI507278B (ja) |
WO (1) | WO2009084630A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012238762A (ja) * | 2011-05-12 | 2012-12-06 | Tokyo Electron Ltd | 基板搬送装置、これを備える塗布現像装置、及び基板搬送方法 |
CN104022051A (zh) * | 2014-04-22 | 2014-09-03 | 上海华力微电子有限公司 | 一种检测机台机械臂出现异常的方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101098556B1 (ko) * | 2011-01-20 | 2011-12-26 | (주)해피글로벌솔루션 | 로봇 진단시스템 및 이를 이용한 로봇 진단방법 |
JP5572758B2 (ja) * | 2011-03-16 | 2014-08-13 | 株式会社アルバック | 搬送装置、真空装置 |
KR102022804B1 (ko) * | 2017-11-02 | 2019-09-18 | 조재용 | 웨이퍼 이송용 로봇 감지장치 |
CN110834334B (zh) * | 2019-11-20 | 2023-11-07 | 常州捷佳创精密机械有限公司 | 机械手的控制方法、装置及处理槽设备 |
KR102597583B1 (ko) * | 2020-12-29 | 2023-11-02 | 세메스 주식회사 | 이송 로봇의 이상 진단 장치 및 방법 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06326172A (ja) * | 1993-05-10 | 1994-11-25 | Tel Varian Ltd | 移載装置 |
JPH10244479A (ja) * | 1997-03-03 | 1998-09-14 | Sumitomo Eaton Noba Kk | ディスク搬送装置 |
JP2000127069A (ja) * | 1998-10-27 | 2000-05-09 | Tokyo Electron Ltd | 搬送システムの搬送位置合わせ方法 |
JP2001332604A (ja) * | 2000-05-25 | 2001-11-30 | Nec Kyushu Ltd | 搬送位置ずれ検出機構 |
JP2002178279A (ja) * | 2000-12-12 | 2002-06-25 | Ulvac Japan Ltd | 基板搬送方法 |
JP2004241484A (ja) * | 2003-02-04 | 2004-08-26 | Tokyo Electron Ltd | 基板の搬送装置及び搬送装置の位置ずれ検出方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5044752A (en) * | 1989-06-30 | 1991-09-03 | General Signal Corporation | Apparatus and process for positioning wafers in receiving devices |
SE508161C2 (sv) * | 1995-03-30 | 1998-09-07 | Asea Brown Boveri | Förfarande och anordning för kalibrering av rörelseaxlar hos en industrirobot |
JPH1068759A (ja) * | 1996-05-31 | 1998-03-10 | Advantest Corp | 吸着物検知装置、該装置を用いた吸着物検知方法、該装置を用いた位置ずれ検知方法、および該装置を用いた清掃方法 |
US5980194A (en) * | 1996-07-15 | 1999-11-09 | Applied Materials, Inc. | Wafer position error detection and correction system |
US5783834A (en) * | 1997-02-20 | 1998-07-21 | Modular Process Technology | Method and process for automatic training of precise spatial locations to a robot |
JPH10233426A (ja) * | 1997-02-20 | 1998-09-02 | Tokyo Electron Ltd | 自動ティ−チング方法 |
JP3288250B2 (ja) * | 1997-03-25 | 2002-06-04 | ファナック株式会社 | ロボット制御装置 |
US5963315A (en) * | 1997-08-18 | 1999-10-05 | Motorola, Inc. | Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection |
JPH11254359A (ja) * | 1998-03-12 | 1999-09-21 | Toyota Autom Loom Works Ltd | 部材搬送システム |
GB2349204B (en) * | 1999-04-19 | 2004-03-03 | Applied Materials Inc | A method of detecting the position of a wafer |
JP2001127136A (ja) * | 1999-10-29 | 2001-05-11 | Applied Materials Inc | 基板搬送ロボットの検査装置 |
TW512478B (en) * | 2000-09-14 | 2002-12-01 | Olympus Optical Co | Alignment apparatus |
US6556887B2 (en) * | 2001-07-12 | 2003-04-29 | Applied Materials, Inc. | Method for determining a position of a robot |
TW528709B (en) * | 2002-08-01 | 2003-04-21 | Nanya Technology Corp | Wafer carrying device with blade position detection |
KR101015778B1 (ko) * | 2003-06-03 | 2011-02-22 | 도쿄엘렉트론가부시키가이샤 | 기판 처리장치 및 기판 수수 위치의 조정 방법 |
US7031802B2 (en) * | 2003-08-13 | 2006-04-18 | Hewlett-Packard Development Company, L.P. | Semi-autonomous operation of a robotic device |
US20050137751A1 (en) * | 2003-12-05 | 2005-06-23 | Cox Damon K. | Auto-diagnostic method and apparatus |
JP4534886B2 (ja) * | 2005-07-15 | 2010-09-01 | 東京エレクトロン株式会社 | 処理システム |
CN100478789C (zh) * | 2005-09-28 | 2009-04-15 | 中国科学院自动化研究所 | 掩模传输系统四象限对准装置 |
-
2008
- 2008-12-26 US US12/745,823 patent/US20100256811A1/en not_active Abandoned
- 2008-12-26 TW TW097151285A patent/TWI507278B/zh active
- 2008-12-26 WO PCT/JP2008/073731 patent/WO2009084630A1/ja active Application Filing
- 2008-12-26 KR KR1020107014561A patent/KR101209020B1/ko active IP Right Grant
- 2008-12-26 CN CN2008801226544A patent/CN101911274B/zh active Active
- 2008-12-26 JP JP2009548089A patent/JP5053388B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06326172A (ja) * | 1993-05-10 | 1994-11-25 | Tel Varian Ltd | 移載装置 |
JPH10244479A (ja) * | 1997-03-03 | 1998-09-14 | Sumitomo Eaton Noba Kk | ディスク搬送装置 |
JP2000127069A (ja) * | 1998-10-27 | 2000-05-09 | Tokyo Electron Ltd | 搬送システムの搬送位置合わせ方法 |
JP2001332604A (ja) * | 2000-05-25 | 2001-11-30 | Nec Kyushu Ltd | 搬送位置ずれ検出機構 |
JP2002178279A (ja) * | 2000-12-12 | 2002-06-25 | Ulvac Japan Ltd | 基板搬送方法 |
JP2004241484A (ja) * | 2003-02-04 | 2004-08-26 | Tokyo Electron Ltd | 基板の搬送装置及び搬送装置の位置ずれ検出方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012238762A (ja) * | 2011-05-12 | 2012-12-06 | Tokyo Electron Ltd | 基板搬送装置、これを備える塗布現像装置、及び基板搬送方法 |
CN104022051A (zh) * | 2014-04-22 | 2014-09-03 | 上海华力微电子有限公司 | 一种检测机台机械臂出现异常的方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100256811A1 (en) | 2010-10-07 |
CN101911274B (zh) | 2012-07-04 |
KR101209020B1 (ko) | 2012-12-06 |
CN101911274A (zh) | 2010-12-08 |
TW200942383A (en) | 2009-10-16 |
JP5053388B2 (ja) | 2012-10-17 |
KR20100091237A (ko) | 2010-08-18 |
JPWO2009084630A1 (ja) | 2011-05-19 |
TWI507278B (zh) | 2015-11-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5053388B2 (ja) | 搬送ロボットの診断システム | |
JPWO2010013732A1 (ja) | 搬送ロボットのティーチング方法 | |
WO2016125752A1 (ja) | 基板搬送ロボットおよび基板搬送方法 | |
JP6979012B2 (ja) | 基板搬送装置及び基板搬送ロボットの教示方法 | |
JP2010162611A (ja) | 相対ティーチング方法 | |
KR101810112B1 (ko) | 로봇 및 로봇의 제어 방법 | |
JP2000127069A (ja) | 搬送システムの搬送位置合わせ方法 | |
WO2010013422A1 (ja) | 搬送ロボットの制御方法 | |
US7532940B2 (en) | Transfer mechanism and semiconductor processing system | |
KR101503119B1 (ko) | 반송 시스템 | |
CN113226664B (zh) | 机器人的位置修正方法以及机器人 | |
CN113226660B (zh) | 机器人的位置修正方法以及机器人 | |
KR102195817B1 (ko) | 기판 반송 장치 | |
JP2008300608A (ja) | 昇降位置確認手段を有する基板搬送装置及びそれを備えた半導体製造装置 | |
JP2009049251A (ja) | ウエハ搬送装置 | |
JP3674063B2 (ja) | ウェハ搬送装置 | |
JP7149815B2 (ja) | ロボットシステム及びその運転方法 | |
JP2022104003A (ja) | ロボットおよびロボットの制御方法 | |
WO2022137917A1 (ja) | 基板搬送ロボットの制御装置及び関節モータの制御方法 | |
TW202221439A (zh) | 機器人系統及滑動判定方法 | |
JP7414426B2 (ja) | ロボットシステム | |
US20240025671A1 (en) | Substrate conveying robot system | |
KR20050052744A (ko) | 반도체 제조 장치용 로봇 블레이드 | |
JP2011108923A (ja) | 真空処理装置 | |
KR20060030678A (ko) | 반도체 제조 장비 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880122654.4 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08866725 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009548089 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12745823 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20107014561 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08866725 Country of ref document: EP Kind code of ref document: A1 |