WO2009072525A1 - 半導体装置用ボンディングワイヤ - Google Patents

半導体装置用ボンディングワイヤ Download PDF

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Publication number
WO2009072525A1
WO2009072525A1 PCT/JP2008/071969 JP2008071969W WO2009072525A1 WO 2009072525 A1 WO2009072525 A1 WO 2009072525A1 JP 2008071969 W JP2008071969 W JP 2008071969W WO 2009072525 A1 WO2009072525 A1 WO 2009072525A1
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WO
WIPO (PCT)
Prior art keywords
bonding wire
loop
core
semiconductor devices
metal
Prior art date
Application number
PCT/JP2008/071969
Other languages
English (en)
French (fr)
Inventor
Tomohiro Uno
Keiichi Kimura
Takashi Yamada
Original Assignee
Nippon Steel Materials Co., Ltd.
Nippon Micrometal Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Materials Co., Ltd., Nippon Micrometal Corporation filed Critical Nippon Steel Materials Co., Ltd.
Priority to US12/669,612 priority Critical patent/US8389860B2/en
Priority to JP2009544692A priority patent/JP5073759B2/ja
Priority to CN2008801120319A priority patent/CN101828255B/zh
Priority to KR1020097026397A priority patent/KR101055957B1/ko
Publication of WO2009072525A1 publication Critical patent/WO2009072525A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • C—CHEMISTRY; METALLURGY
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    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
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    • C22C5/06—Alloys based on silver
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    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
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    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
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  • Engineering & Computer Science (AREA)
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  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
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  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Powder Metallurgy (AREA)

Abstract

本発明は、ネック部の損傷を低減でき、また、ループの直線性、ループ高さの安定性、ボンディングワイヤの接合形状の安定化に優れている、低ループ化、細線化、狭ピッチ化、三次元実装等の半導体実装技術にも適応する、高機能のボンディングワイヤを提供することを目的とする。 導電性金属からなる芯材と、該芯材の上に芯材とは異なる面心立方晶の金属を主成分とする表皮層を有するボンディングワイヤであって、前記表皮層の表面における長手方向の結晶方位の内&<100>の占める割合が50%以上であることを特徴とする半導体装置用ボンディングワイヤである。
PCT/JP2008/071969 2007-12-03 2008-12-03 半導体装置用ボンディングワイヤ WO2009072525A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/669,612 US8389860B2 (en) 2007-12-03 2008-12-03 Bonding wire for semiconductor devices
JP2009544692A JP5073759B2 (ja) 2007-12-03 2008-12-03 半導体装置用ボンディングワイヤ
CN2008801120319A CN101828255B (zh) 2007-12-03 2008-12-03 半导体装置用接合线
KR1020097026397A KR101055957B1 (ko) 2007-12-03 2008-12-03 반도체 장치용 본딩 와이어

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JP2007-312239 2007-12-03
JP2007312239 2007-12-03

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WO2009072525A1 true WO2009072525A1 (ja) 2009-06-11

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US (1) US8389860B2 (ja)
JP (1) JP5073759B2 (ja)
KR (1) KR101055957B1 (ja)
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WO2010150814A1 (ja) * 2009-06-24 2010-12-29 新日鉄マテリアルズ株式会社 半導体用銅合金ボンディングワイヤ
JP2011033600A (ja) * 2009-08-06 2011-02-17 Kobe Steel Ltd 鋼板成形品の耐遅れ破壊性の評価方法
JP5985127B1 (ja) * 2015-06-15 2016-09-06 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2016203899A1 (ja) * 2015-06-15 2016-12-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP2016225610A (ja) * 2015-05-26 2016-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP2017005256A (ja) * 2015-06-15 2017-01-05 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP2017045924A (ja) * 2015-08-28 2017-03-02 田中電子工業株式会社 銅合金ボンディングワイヤ
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MY164643A (en) * 2009-07-30 2018-01-30 Nippon Steel & Sumikin Mat Co Bonding wire for semiconductor
JP5325201B2 (ja) * 2010-12-27 2013-10-23 田中貴金属工業株式会社 イリジウム含有合金からなる金属線材
US8692118B2 (en) * 2011-06-24 2014-04-08 Tessera, Inc. Reliable wire structure and method
DE102013000057B4 (de) * 2012-01-02 2016-11-24 Wire Technology Co., Ltd. Legierungsdraht und verfahren zur herstellung desselben
US20130319726A1 (en) * 2012-05-30 2013-12-05 Freescale Semiconductor, Inc Multi-core wire
EP2703116B1 (en) * 2012-09-04 2017-03-22 Heraeus Deutschland GmbH & Co. KG Method for manufacturing a silver alloy wire for bonding applications
US20160078980A1 (en) * 2013-05-03 2016-03-17 Heraeus Materials Singapore Pte., Ltd. Copper bond wire and method of making the same
US9773612B2 (en) 2013-10-30 2017-09-26 The Board Of Trustees Of The Leland Stanford Junior University Integrated magnetic devices with multi-axial magnetic anisotropy
JP6254841B2 (ja) * 2013-12-17 2017-12-27 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
MY162021A (en) * 2014-03-31 2017-05-31 Nippon Micrometal Corp Bonding wire for semiconductor device use and method of production of same
WO2015152191A1 (ja) * 2014-03-31 2015-10-08 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ及びその製造方法
CN107195609B (zh) * 2014-07-10 2021-03-23 日铁化学材料株式会社 半导体装置用接合线
JP6467281B2 (ja) * 2015-04-30 2019-02-13 日鉄マイクロメタル株式会社 ボンディングワイヤのボール形成方法
TWI628671B (zh) * 2015-05-26 2018-07-01 日鐵住金新材料股份有限公司 Bonding wire for semiconductor device
EP3147938B1 (en) * 2015-07-23 2024-06-12 Nippon Micrometal Corporation Bonding wire for semiconductor device
SG10201508104TA (en) * 2015-09-29 2017-04-27 Heraeus Materials Singapore Pte Ltd Alloyed silver wire
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JP4866490B2 (ja) * 2009-06-24 2012-02-01 新日鉄マテリアルズ株式会社 半導体用銅合金ボンディングワイヤ
KR20120031005A (ko) * 2009-06-24 2012-03-29 신닛테츠 마테리알즈 가부시키가이샤 반도체용 구리 합금 본딩 와이어
CN102459668A (zh) * 2009-06-24 2012-05-16 新日铁高新材料株式会社 半导体用铜合金接合线
JP2012084878A (ja) * 2009-06-24 2012-04-26 Nippon Steel Materials Co Ltd 半導体用銅合金ボンディングワイヤ
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CN106119595A (zh) * 2009-06-24 2016-11-16 新日铁住金高新材料株式会社 半导体用铜合金接合线
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KR20100013329A (ko) 2010-02-09
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US20110011619A1 (en) 2011-01-20
US8389860B2 (en) 2013-03-05
CN101828255A (zh) 2010-09-08
KR101055957B1 (ko) 2011-08-09

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