WO2009057479A1 - 金型清掃用ゴム系組成物 - Google Patents

金型清掃用ゴム系組成物 Download PDF

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Publication number
WO2009057479A1
WO2009057479A1 PCT/JP2008/069029 JP2008069029W WO2009057479A1 WO 2009057479 A1 WO2009057479 A1 WO 2009057479A1 JP 2008069029 W JP2008069029 W JP 2008069029W WO 2009057479 A1 WO2009057479 A1 WO 2009057479A1
Authority
WO
WIPO (PCT)
Prior art keywords
rubber
mold
sec
mold cleaning
small
Prior art date
Application number
PCT/JP2008/069029
Other languages
English (en)
French (fr)
Inventor
Hiroaki Nomura
Kiyohito Hiromitsu
Osamu Sunago
Original Assignee
Nippon Carbide Kogyo Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kabushiki Kaisha filed Critical Nippon Carbide Kogyo Kabushiki Kaisha
Priority to CN2008801106985A priority Critical patent/CN101821075B/zh
Priority to JP2009539017A priority patent/JP5391072B2/ja
Priority to KR20107007524A priority patent/KR101491757B1/ko
Publication of WO2009057479A1 publication Critical patent/WO2009057479A1/ja
Priority to HK10110202.1A priority patent/HK1143565A1/xx

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2021/00—Use of unspecified rubbers as moulding material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　硬化性樹脂の成形工程において発生する金型表面の汚れを取り除くための金型清掃用ゴム系組成物において、基材樹脂として、エチレン－プロピレンゴムとブタジエンゴムとの配合割合が、９０／１０～５０／５０重量部に設定されている未加硫ゴムであって、該未加硫ゴムを加硫硬化した後の伸び率が８０～８００％、引張強度が３～１０ＭＰａ、ゴム硬度（デュロメータ硬さ）がＡ６０～９５、金型温度１７５°Cにおける９０％加硫時間（適正加硫点）ｔｃ （９０）が５０～１００秒又は２００～４００秒の値の範囲にある未加硫ゴムを使用する。ＰＤＩＰやＳＯＩＣ等のようにキャビティが深い小型のパッケージ製造用金型や、小型のパッケージの中でも、ピン数が少ない特に小さなパッケージ製造用金型のクリーニングに使用する場合には、ｔｃ （９０）が２００～４００秒の値の範囲にある上記未加硫ゴムと共に、離型剤を含有させることが好ましい。
PCT/JP2008/069029 2007-10-29 2008-10-21 金型清掃用ゴム系組成物 WO2009057479A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008801106985A CN101821075B (zh) 2007-10-29 2008-10-21 模具清洁用橡胶系组合物
JP2009539017A JP5391072B2 (ja) 2007-10-29 2008-10-21 金型清掃用ゴム系組成物
KR20107007524A KR101491757B1 (ko) 2007-10-29 2008-10-21 금형 청소용 고무계 조성물
HK10110202.1A HK1143565A1 (en) 2007-10-29 2010-10-29 Mold cleaning rubber composition

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007279837 2007-10-29
JP2007-279837 2007-10-29
JP2008-075045 2008-03-24
JP2008-075044 2008-03-24
JP2008075045 2008-03-24
JP2008075044 2008-03-24
JP2008242103 2008-09-22
JP2008-242103 2008-09-22

Publications (1)

Publication Number Publication Date
WO2009057479A1 true WO2009057479A1 (ja) 2009-05-07

Family

ID=40590871

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069029 WO2009057479A1 (ja) 2007-10-29 2008-10-21 金型清掃用ゴム系組成物

Country Status (7)

Country Link
JP (1) JP5391072B2 (ja)
KR (1) KR101491757B1 (ja)
CN (1) CN101821075B (ja)
HK (1) HK1143565A1 (ja)
MY (1) MY155143A (ja)
TW (1) TWI428384B (ja)
WO (1) WO2009057479A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009122955A1 (ja) * 2008-03-31 2009-10-08 日本カーバイド工業株式会社 金型離型回復用ゴム系組成物
CN101955858A (zh) * 2009-07-17 2011-01-26 日东电工株式会社 模具清洗剂组合物及模具清洗材料、以及使用其的模具清洁方法
JP2011020416A (ja) * 2009-07-17 2011-02-03 Nitto Denko Corp 金型洗浄剤組成物および金型洗浄材、ならびにそれを用いた金型のクリーニング方法
WO2012173043A1 (ja) * 2011-06-13 2012-12-20 日本カーバイド工業株式会社 金型清掃用樹脂組成物
WO2014042199A1 (ja) * 2012-09-14 2014-03-20 日本カーバイド工業株式会社 金型離型回復用樹脂組成物及び金型離型回復方法
CN107022424A (zh) * 2017-03-08 2017-08-08 安徽国晶微电子有限公司 一种用于集成电路封装模具的清洗试剂

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103304901B (zh) * 2012-03-14 2017-03-01 日本电石工业株式会社 模具清扫用树脂组合物及模具清扫方法
CN102775656B (zh) * 2012-07-15 2015-06-03 湖州师范学院 一种用于清洗集成电路模具的橡胶组合物
CN104955627B (zh) * 2013-01-31 2018-02-13 日本电石工业株式会社 模具清扫用树脂组合物和模具清扫方法
CN103205032A (zh) * 2013-03-14 2013-07-17 西北工业大学 一种原位清洗模具用清模胶及其制备方法
KR101656255B1 (ko) * 2014-04-04 2016-09-12 (주)휴이노베이션 세정력이 향상된 친환경 고기능성 금형 세정용 고무 조성물
CN109957186A (zh) * 2017-12-22 2019-07-02 四川素恩吉科技有限公司 一种模具用组合物
KR102304403B1 (ko) 2019-12-18 2021-09-17 황진상 반도체 패키지 몰드용 이형필름 및 그 제조방법
KR102325676B1 (ko) 2019-12-18 2021-11-11 황진상 반도체 패키지 몰드용 이형필름 및 그 제조방법
CN114456504A (zh) * 2022-01-28 2022-05-10 厦门市麦华橡胶制品有限公司 一种适于自动化脱模的环保过氧硫化epdm材料及制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09262842A (ja) * 1996-03-28 1997-10-07 Nitto Denko Corp 成形用金型の清浄方法
JPH10226799A (ja) * 1996-12-10 1998-08-25 Nitto Denko Corp 半導体装置成形用金型洗浄剤組成物およびそれを用いた金型クリーニング方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069827B2 (ja) * 1987-07-24 1994-02-09 日東電工株式会社 金型洗浄剤組成物
JPH0381110A (ja) * 1989-08-24 1991-04-05 Matsushita Electric Works Ltd 金型清掃用成形材料および金型清掃方法
JP2974267B2 (ja) * 1991-09-30 1999-11-10 日本カーバイド工業株式会社 金型清掃用ゴム系組成物
JP2967842B2 (ja) * 1991-10-24 1999-10-25 日本カーバイド工業株式会社 金型清掃用ゴム系材料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09262842A (ja) * 1996-03-28 1997-10-07 Nitto Denko Corp 成形用金型の清浄方法
JPH10226799A (ja) * 1996-12-10 1998-08-25 Nitto Denko Corp 半導体装置成形用金型洗浄剤組成物およびそれを用いた金型クリーニング方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009122955A1 (ja) * 2008-03-31 2009-10-08 日本カーバイド工業株式会社 金型離型回復用ゴム系組成物
JP5726517B2 (ja) * 2008-03-31 2015-06-03 日本カーバイド工業株式会社 金型離型回復用ゴム系組成物
CN101955858A (zh) * 2009-07-17 2011-01-26 日东电工株式会社 模具清洗剂组合物及模具清洗材料、以及使用其的模具清洁方法
JP2011020416A (ja) * 2009-07-17 2011-02-03 Nitto Denko Corp 金型洗浄剤組成物および金型洗浄材、ならびにそれを用いた金型のクリーニング方法
TWI499668B (zh) * 2009-07-17 2015-09-11 Nitto Denko Corp 模具清潔組合物及模具清潔材料、與使用其之模具清潔方法
WO2012173043A1 (ja) * 2011-06-13 2012-12-20 日本カーバイド工業株式会社 金型清掃用樹脂組成物
JPWO2012173043A1 (ja) * 2011-06-13 2015-02-23 日本カーバイド工業株式会社 金型清掃用樹脂組成物
WO2014042199A1 (ja) * 2012-09-14 2014-03-20 日本カーバイド工業株式会社 金型離型回復用樹脂組成物及び金型離型回復方法
CN107022424A (zh) * 2017-03-08 2017-08-08 安徽国晶微电子有限公司 一种用于集成电路封装模具的清洗试剂

Also Published As

Publication number Publication date
JPWO2009057479A1 (ja) 2011-03-10
MY155143A (en) 2015-09-15
TWI428384B (zh) 2014-03-01
TW200930757A (en) 2009-07-16
JP5391072B2 (ja) 2014-01-15
KR20100085025A (ko) 2010-07-28
KR101491757B1 (ko) 2015-02-11
HK1143565A1 (en) 2011-01-07
CN101821075A (zh) 2010-09-01
CN101821075B (zh) 2013-11-20

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