MY161594A - Mold conditioning rubber composition - Google Patents

Mold conditioning rubber composition

Info

Publication number
MY161594A
MY161594A MYPI2010003310A MYPI2010003310A MY161594A MY 161594 A MY161594 A MY 161594A MY PI2010003310 A MYPI2010003310 A MY PI2010003310A MY PI2010003310 A MYPI2010003310 A MY PI2010003310A MY 161594 A MY161594 A MY 161594A
Authority
MY
Malaysia
Prior art keywords
rubber
mold
cure
rubber composition
seconds
Prior art date
Application number
MYPI2010003310A
Inventor
Kiyohito Hiromitsu
Hiroaki Nomura
Osamu Sunago
Original Assignee
Nippon Carbide Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kk filed Critical Nippon Carbide Kogyo Kk
Publication of MY161594A publication Critical patent/MY161594A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides

Abstract

A COMPRESSION TYPE, MOLD CONDITIONING RUBBER COMPOSITION FOR IMPARTING RELEASE PROPERTIES TO A MOLD SURFACE AFTER REMOVAL OF STAINS DEPOSITED DURING MOLDING OF A CURING RESIN. THE COMPOSITION CONTAINS AN UNVULCANIZED RUBBER COMPRISING AN ETHYLENE-PROPYLENE RUBBER AND A BUTADIENE RUBBER IN A WEIGHT MIXING RATIO OF 90/10 TO 50/50 AS A BASE RESIN AND A SPECIFIC RELEASE AGENT. THE UNVULCANIZED RUBBER HAS A 90% CURE TIME (OPTIMUM CURE POINT) TC (90) OF FROM 50 TO 100 SECONDS OR FROM 200 TO 400 SECONDS AT A MOLD TEMPERATURE OF 175°C AND, AFTER CURE, AN ELONGATION OF 80% TO 800%, A TENSILE STRENGTH OF 3 TO 10 MPA, AND A RUBBER HARDNESS (DUROMETER A HARDNESS) OF 60 TO 95.
MYPI2010003310A 2008-03-31 2009-03-24 Mold conditioning rubber composition MY161594A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008091360 2008-03-31
JP2008091359 2008-03-31
JP2009007239 2009-01-16

Publications (1)

Publication Number Publication Date
MY161594A true MY161594A (en) 2017-04-28

Family

ID=41135335

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010003310A MY161594A (en) 2008-03-31 2009-03-24 Mold conditioning rubber composition

Country Status (7)

Country Link
JP (1) JP5726517B2 (en)
KR (1) KR101591894B1 (en)
CN (1) CN101945746B (en)
MY (1) MY161594A (en)
SG (1) SG194416A1 (en)
TW (1) TWI449615B (en)
WO (1) WO2009122955A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013035965A (en) * 2011-08-09 2013-02-21 Fujikura Ltd Insulating composition and molding
WO2014042199A1 (en) * 2012-09-14 2014-03-20 日本カーバイド工業株式会社 Resin composition for mold release recovery and mold release recovery method
WO2014119485A1 (en) * 2013-01-31 2014-08-07 日本カーバイド工業株式会社 Resin composition for mold cleaning, and mold cleaning method
CN103171065A (en) * 2013-03-14 2013-06-26 西北工业大学 Mould releasing glue for mould and preparation method thereof
WO2016167415A1 (en) * 2015-04-17 2016-10-20 주식회사 나라켐 Rubber composition with excellent filling ability
CN106800785B (en) * 2017-01-17 2019-07-12 华南理工大学 A kind of environment-friendly rubber flowing dispersing agent and preparation method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0271107B1 (en) 1986-12-11 1993-06-02 Nitto Denko Corporation Mold cleaning composition, sheet for cleaning mold, and method for cleaning mold using said cleaning sheet
JPS63159019A (en) * 1986-12-23 1988-07-01 Kyushu Nitto Denko Kk Sheet for release
CN87104240A (en) * 1987-06-17 1988-12-28 中国原子能科学研究院 Releasing agent for rubber
JP2633101B2 (en) 1991-04-12 1997-07-23 日東電工株式会社 Mold regeneration composition
JP2974267B2 (en) * 1991-09-30 1999-11-10 日本カーバイド工業株式会社 Rubber composition for mold cleaning
JP3764239B2 (en) * 1996-12-10 2006-04-05 日東電工株式会社 Mold cleaning composition for molding semiconductor device and mold cleaning method using the same
KR100300063B1 (en) * 1998-12-31 2001-09-22 김영환 Manufacturing method for semiconductor memory
CN100473686C (en) * 2004-07-28 2009-04-01 纳拉化学株式会社 Rubber composition for cleaning and stripping mould
KR101491757B1 (en) * 2007-10-29 2015-02-11 닛뽕 카바이도 고교 가부시키가이샤 Mold cleaning rubber compositon

Also Published As

Publication number Publication date
TW201000289A (en) 2010-01-01
WO2009122955A1 (en) 2009-10-08
CN101945746A (en) 2011-01-12
SG194416A1 (en) 2013-11-29
JPWO2009122955A1 (en) 2011-07-28
KR101591894B1 (en) 2016-02-18
JP5726517B2 (en) 2015-06-03
CN101945746B (en) 2013-09-18
TWI449615B (en) 2014-08-21
KR20100138878A (en) 2010-12-31

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