WO2009034916A1 - 蒸気放出装置、有機薄膜蒸着装置及び有機薄膜蒸着方法 - Google Patents
蒸気放出装置、有機薄膜蒸着装置及び有機薄膜蒸着方法 Download PDFInfo
- Publication number
- WO2009034916A1 WO2009034916A1 PCT/JP2008/065986 JP2008065986W WO2009034916A1 WO 2009034916 A1 WO2009034916 A1 WO 2009034916A1 JP 2008065986 W JP2008065986 W JP 2008065986W WO 2009034916 A1 WO2009034916 A1 WO 2009034916A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- vapor deposition
- emission
- emission section
- organic thin
- vapor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008801072226A CN101803462B (zh) | 2007-09-10 | 2008-09-04 | 蒸气放出装置、有机薄膜蒸镀装置及有机薄膜蒸镀方法 |
EP08830347.4A EP2187709B1 (en) | 2007-09-10 | 2008-09-04 | Vapor emission device, organic thin-film vapor deposition apparatus and method of organic thin-film vapor deposition |
JP2009532158A JPWO2009034916A1 (ja) | 2007-09-10 | 2008-09-04 | 蒸気放出装置、有機薄膜蒸着装置及び有機薄膜蒸着方法 |
KR1020107005203A KR101128745B1 (ko) | 2007-09-10 | 2008-09-04 | 증기 방출 장치, 유기 박막 증착 장치 및 유기 박막 증착 방법 |
US12/719,216 US20100209609A1 (en) | 2007-09-10 | 2010-03-08 | Vapor emission device, organic thin film vapor deposition apparatus, and method for depositing organic thin film |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-234441 | 2007-09-10 | ||
JP2007234441 | 2007-09-10 | ||
JP2007-299139 | 2007-11-19 | ||
JP2007299139 | 2007-11-19 | ||
JP2008043480 | 2008-02-25 | ||
JP2008-043480 | 2008-02-25 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/719,216 Continuation US20100209609A1 (en) | 2007-09-10 | 2010-03-08 | Vapor emission device, organic thin film vapor deposition apparatus, and method for depositing organic thin film |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009034916A1 true WO2009034916A1 (ja) | 2009-03-19 |
Family
ID=40451925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/065986 WO2009034916A1 (ja) | 2007-09-10 | 2008-09-04 | 蒸気放出装置、有機薄膜蒸着装置及び有機薄膜蒸着方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100209609A1 (ja) |
EP (1) | EP2187709B1 (ja) |
JP (1) | JPWO2009034916A1 (ja) |
KR (1) | KR101128745B1 (ja) |
CN (1) | CN101803462B (ja) |
TW (1) | TWI428460B (ja) |
WO (1) | WO2009034916A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011028867A1 (en) * | 2009-09-03 | 2011-03-10 | Universal Display Corporation | Organic vapor jet printing device with a chiller plate |
KR101132834B1 (ko) | 2009-10-29 | 2012-04-02 | 한국생산기술연구원 | 유기박막 증착 장치 |
JP2018500716A (ja) * | 2014-09-30 | 2018-01-11 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングOSRAM OLED GmbH | 有機電子素子の製造方法及び有機電子素子 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101084234B1 (ko) | 2009-11-30 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 증착원, 이를 구비하는 증착 장치 및 박막 형성 방법 |
KR101256193B1 (ko) * | 2011-05-06 | 2013-04-19 | 주식회사 에스에프에이 | 박막 증착장치 및 이에 사용되는 선형증발원 |
CN103947301B (zh) * | 2011-11-22 | 2017-07-25 | 株式会社神户制钢所 | 等离子产生源及具备它的真空等离子处理装置 |
JP2013211137A (ja) * | 2012-03-30 | 2013-10-10 | Samsung Display Co Ltd | 真空蒸着方法及びその装置 |
KR101375527B1 (ko) * | 2012-05-02 | 2014-03-17 | 주식회사 에스에프에이 | 일체형 증발 소스 및 그를 구비하는 평판표시소자용 기판 증착장치 |
KR101325864B1 (ko) * | 2012-08-27 | 2013-11-05 | 에스엔유 프리시젼 주식회사 | 유기발광다이오드 봉지공정용 증착장치 |
DE102012220986B4 (de) * | 2012-11-16 | 2015-04-02 | Innovent E.V. Technologieentwicklung | Dosiereinheit und ihre Verwendung |
KR102192500B1 (ko) * | 2013-10-24 | 2020-12-17 | 히다치 조센 가부시키가이샤 | 진공증착장치용 매니폴드 |
JP6345899B2 (ja) * | 2016-02-23 | 2018-06-20 | 鴻海精密工業股▲ふん▼有限公司 | 蒸着マスク、蒸着マスクの製造方法および有機el表示装置の製造方法 |
CN110573647B (zh) * | 2017-04-26 | 2021-10-08 | 株式会社爱发科 | 蒸发源和成膜装置 |
US11842907B2 (en) | 2020-07-08 | 2023-12-12 | Applied Materials, Inc. | Spot heating by moving a beam with horizontal rotary motion |
Citations (4)
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JP2004214185A (ja) * | 2002-12-19 | 2004-07-29 | Sony Corp | 蒸着装置および有機エレクトロルミネッセンス素子の製造方法 |
JP2005330537A (ja) * | 2004-05-20 | 2005-12-02 | Hitachi Zosen Corp | 蒸着装置 |
JP2006249541A (ja) * | 2005-03-14 | 2006-09-21 | Hitachi Zosen Corp | 蒸着装置 |
JP2007070679A (ja) * | 2005-09-06 | 2007-03-22 | Tohoku Univ | 成膜装置、成膜装置系、成膜方法、及び電子機器または有機エレクトロルミネッセンス素子の製造方法 |
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JPH04187760A (ja) * | 1990-11-22 | 1992-07-06 | Mitsubishi Electric Corp | 薄膜形成装置 |
JP3176968B2 (ja) * | 1991-12-24 | 2001-06-18 | 日本真空技術株式会社 | 分子線エピタキシィ用蒸発源装置 |
US6613692B1 (en) * | 1999-07-30 | 2003-09-02 | Tokyo Electron Limited | Substrate processing method and apparatus |
US6572706B1 (en) * | 2000-06-19 | 2003-06-03 | Simplus Systems Corporation | Integrated precursor delivery system |
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JP4216522B2 (ja) * | 2002-04-23 | 2009-01-28 | 株式会社アルバック | 蒸発源及びこれを用いた薄膜形成装置 |
US7067170B2 (en) * | 2002-09-23 | 2006-06-27 | Eastman Kodak Company | Depositing layers in OLED devices using viscous flow |
TWI371501B (en) * | 2004-03-29 | 2012-09-01 | Tadahiro Ohmi | Deposition apparatus and deposition method |
JP4558375B2 (ja) * | 2004-05-17 | 2010-10-06 | 株式会社アルバック | 有機材料用蒸発源及び有機蒸着装置 |
JP4602054B2 (ja) * | 2004-11-25 | 2010-12-22 | 東京エレクトロン株式会社 | 蒸着装置 |
KR100628888B1 (ko) * | 2004-12-27 | 2006-09-26 | 삼성전자주식회사 | 샤워 헤드 온도 조절 장치 및 이를 갖는 막 형성 장치 |
JP4789551B2 (ja) * | 2005-09-06 | 2011-10-12 | 株式会社半導体エネルギー研究所 | 有機el成膜装置 |
US20070098891A1 (en) * | 2005-10-31 | 2007-05-03 | Eastman Kodak Company | Vapor deposition apparatus and method |
-
2008
- 2008-09-04 WO PCT/JP2008/065986 patent/WO2009034916A1/ja active Application Filing
- 2008-09-04 CN CN2008801072226A patent/CN101803462B/zh active Active
- 2008-09-04 EP EP08830347.4A patent/EP2187709B1/en active Active
- 2008-09-04 JP JP2009532158A patent/JPWO2009034916A1/ja active Pending
- 2008-09-04 KR KR1020107005203A patent/KR101128745B1/ko active IP Right Grant
- 2008-09-09 TW TW097134565A patent/TWI428460B/zh active
-
2010
- 2010-03-08 US US12/719,216 patent/US20100209609A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004214185A (ja) * | 2002-12-19 | 2004-07-29 | Sony Corp | 蒸着装置および有機エレクトロルミネッセンス素子の製造方法 |
JP2005330537A (ja) * | 2004-05-20 | 2005-12-02 | Hitachi Zosen Corp | 蒸着装置 |
JP2006249541A (ja) * | 2005-03-14 | 2006-09-21 | Hitachi Zosen Corp | 蒸着装置 |
JP2007070679A (ja) * | 2005-09-06 | 2007-03-22 | Tohoku Univ | 成膜装置、成膜装置系、成膜方法、及び電子機器または有機エレクトロルミネッセンス素子の製造方法 |
Non-Patent Citations (1)
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011028867A1 (en) * | 2009-09-03 | 2011-03-10 | Universal Display Corporation | Organic vapor jet printing device with a chiller plate |
CN102597299A (zh) * | 2009-09-03 | 2012-07-18 | 通用显示公司 | 具有冷却器板的有机蒸汽喷射装置 |
CN102597299B (zh) * | 2009-09-03 | 2015-05-13 | 通用显示公司 | 有机蒸汽喷射印刷装置和方法 |
KR101132834B1 (ko) | 2009-10-29 | 2012-04-02 | 한국생산기술연구원 | 유기박막 증착 장치 |
JP2018500716A (ja) * | 2014-09-30 | 2018-01-11 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングOSRAM OLED GmbH | 有機電子素子の製造方法及び有機電子素子 |
US11040988B2 (en) | 2014-09-30 | 2021-06-22 | Novaled Gmbh | Method for producing an organic electronic component, and organic electronic component |
US11731988B2 (en) | 2014-09-30 | 2023-08-22 | Novaled Gmbh | Method for producing an organic electronic component, and organic electronic component |
Also Published As
Publication number | Publication date |
---|---|
TWI428460B (zh) | 2014-03-01 |
KR101128745B1 (ko) | 2012-03-27 |
EP2187709A4 (en) | 2011-11-09 |
US20100209609A1 (en) | 2010-08-19 |
EP2187709A1 (en) | 2010-05-19 |
JPWO2009034916A1 (ja) | 2010-12-24 |
TW200925303A (en) | 2009-06-16 |
CN101803462B (zh) | 2012-06-27 |
CN101803462A (zh) | 2010-08-11 |
KR20100053631A (ko) | 2010-05-20 |
EP2187709B1 (en) | 2018-03-21 |
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