JP6345899B2 - 蒸着マスク、蒸着マスクの製造方法および有機el表示装置の製造方法 - Google Patents
蒸着マスク、蒸着マスクの製造方法および有機el表示装置の製造方法 Download PDFInfo
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- 238000007740 vapor deposition Methods 0.000 title claims description 147
- 238000004519 manufacturing process Methods 0.000 title claims description 39
- 239000010408 film Substances 0.000 claims description 254
- 229920005989 resin Polymers 0.000 claims description 114
- 239000011347 resin Substances 0.000 claims description 114
- 239000010410 layer Substances 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 35
- 238000000151 deposition Methods 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 230000008021 deposition Effects 0.000 claims description 29
- 239000012044 organic layer Substances 0.000 claims description 24
- 239000011368 organic material Substances 0.000 claims description 22
- 230000015572 biosynthetic process Effects 0.000 claims description 21
- 230000003746 surface roughness Effects 0.000 claims description 13
- 238000004544 sputter deposition Methods 0.000 claims description 12
- 239000012528 membrane Substances 0.000 claims description 10
- -1 AlTiN Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 5
- 238000001771 vacuum deposition Methods 0.000 claims description 5
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 238000007733 ion plating Methods 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 28
- 230000005855 radiation Effects 0.000 description 9
- 238000000992 sputter etching Methods 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 229910001374 Invar Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 229910019015 Mg-Ag Inorganic materials 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920006350 polyacrylonitrile resin Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
2 樹脂フィルム
3 金属支持層
4 開口部
4a 開口部4の側面
4b 開口部4の段差の蒸着源と相対する面
5 低輻射率膜
6 高輻射率膜
7 蒸着源
8 被蒸着基板
9 有機材料
11 装置基板
12 第1電極
13 バンク
14 有機層の積層膜
15 第2電極
16 保護膜
Claims (13)
- 被蒸着基板上に蒸着により薄膜パターンを成膜形成するための開口部のパターンを有する樹脂フィルムを含む蒸着マスクであって、
前記樹脂フィルムよりも輻射率が小さい低輻射率膜が、前記樹脂フィルムの蒸着源に相対する面の少なくとも一部に形成され、
前記被蒸着基板と当接する前記樹脂フィルムの面に、該樹脂フィルムの面の輻射率よりも輻射率が大きい高輻射率膜が形成された蒸着マスク。 - 前記樹脂フィルムと前記低輻射率膜および/または前記高輻射率膜との間に、前記樹脂フィルムと前記低輻射率膜および/または前記高輻射率膜との密着性を向上させる密着層を備えた請求項1記載の蒸着マスク。
- 前記低輻射率膜の22℃以上であって60℃以下で、波長域8700nm以上であって9800nm以下での輻射率が、0.3以下である請求項1または2記載の蒸着マスク。
- 前記低輻射率膜が、Al、Ni、Cr、Mo、CuまたはTiから形成されたほぼ鏡面を有する膜である請求項3記載の蒸着マスク。
- 前記高輻射率膜の22℃以上であって60℃以下で、波長域8700nm以上であって9800nm以下での輻射率が、0.5以上である材料からなる請求項1〜4のいずれか1項に記載の蒸着マスク。
- 前記高輻射率膜が、Al2O3、AlTiN、CrO2、Cr2O3、MoO2、MoO3、SiCまたはグラファイトからなり、表面粗さが二乗平均平方根高さで0.1μm以上であって3.0μm以下である請求項5記載の蒸着マスク。
- 前記樹脂フィルムの前記低輻射率膜が設けられる側の前記樹脂フィルムの面の一部に金属支持層を備えた請求項1〜6のいずれか1項に記載の蒸着マスク。
- 開口部のパターンを有する樹脂フィルムを含み、蒸着材料を蒸着するためのマスクであって、蒸着源と相対する側の面の少なくとも一部に前記樹脂フィルムよりも輻射率が小さい低輻射率膜を有する蒸着マスクの製造方法であって、
前記低輻射率膜の形成を、前記樹脂フィルムを伸張して支持フレームに固定した後に行い、
前記樹脂フィルムを前記支持フレームに固定した後で、前記低輻射率膜の形成前または前記低輻射率膜の形成後に、前記樹脂フィルムの前記蒸着源と相対する側と反対側の面に前記低輻射率膜が設けられたときの該面の輻射率よりも輻射率が大きい高輻射率膜を形成する蒸着マスクの製造方法。 - 前記樹脂フィルムを前記支持フレームに固定する前に、前記樹脂フィルムの前記低輻射率膜が形成される側の面に金属支持層が密着されている請求項8記載の蒸着マスクの製造方法。
- 前記低輻射率膜および/または前記高輻射率膜の形成前に、前記樹脂フィルムと前記低輻射率膜および/または前記高輻射率膜との密着性を向上させる密着層をスパッタリング法およびイオンプレーティング法から選択される少なくとも1つの方法により形成する請求項8記載の蒸着マスクの製造方法。
- 前記低輻射率膜の形成を、スパッタリング法、真空蒸着法、イオンプレーティング法、CVD法、光沢めっき法、および塗布法から選択される少なくとも1つの方法により行う請求項8〜10のいずれか1項に記載の蒸着マスクの製造方法。
- 前記高輻射率膜の形成を、スパッタリング法、真空蒸着法、CVD法、コールドスプレー法、めっき法、および塗布法から選択される少なくとも1つの方法により行う請求項8〜10のいずれか1項に記載の蒸着マスクの製造方法。
- 装置基板上に有機層を積層して有機EL表示装置を製造する方法であって、
支持基板上にTFTおよび第1電極を少なくとも形成した前記装置基板上に請求項1〜7のいずれか1項に記載の蒸着マスクを位置合せして重ね合せ、前記第1電極上に有機材料を蒸着することで有機層の積層膜を形成し、前記積層膜上に第2電極を形成することを含む有機EL表示装置の製造方法。
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PCT/JP2016/072068 WO2017145402A1 (ja) | 2016-02-23 | 2016-07-27 | 蒸着マスク、蒸着マスクの製造方法および有機el表示装置の製造方法 |
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TW (1) | TWI618805B (ja) |
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KR102180071B1 (ko) * | 2017-10-31 | 2020-11-17 | 엘지디스플레이 주식회사 | 초미세 패턴 증착장치, 이를 이용한 초미세 패턴 증착방법 그리고 초미세 패턴 증착방법에 의해 제작된 전계발광표시장치 |
US11121321B2 (en) * | 2017-11-01 | 2021-09-14 | Emagin Corporation | High resolution shadow mask with tapered pixel openings |
CN107680497B (zh) * | 2017-11-03 | 2019-12-03 | 京东方科技集团股份有限公司 | 显示基板的制造方法、显示基板、显示面板和显示装置 |
US11189478B2 (en) | 2018-02-07 | 2021-11-30 | Shimadzu Corporation | Mass spectrometer |
US11107668B2 (en) | 2018-02-07 | 2021-08-31 | Shimadzu Corporation | Mass spectrometer |
US11139158B2 (en) | 2018-02-07 | 2021-10-05 | Shimadzu Corporation | Mass spectrometer including a fixation band |
JP6860092B2 (ja) | 2018-02-07 | 2021-04-14 | 株式会社島津製作所 | 質量分析装置 |
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