WO2009028657A1 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
WO2009028657A1
WO2009028657A1 PCT/JP2008/065521 JP2008065521W WO2009028657A1 WO 2009028657 A1 WO2009028657 A1 WO 2009028657A1 JP 2008065521 W JP2008065521 W JP 2008065521W WO 2009028657 A1 WO2009028657 A1 WO 2009028657A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
light
emitting device
emitting element
excited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/065521
Other languages
English (en)
French (fr)
Inventor
Yoshinori Murazaki
Masafumi Harada
Suguru Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to CN2008801043327A priority Critical patent/CN101785121B/zh
Priority to JP2009530202A priority patent/JPWO2009028657A1/ja
Priority to US12/675,713 priority patent/US8384092B2/en
Priority to KR1020107006845A priority patent/KR101152066B1/ko
Publication of WO2009028657A1 publication Critical patent/WO2009028657A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7732—Halogenides
    • C09K11/7733—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/774—Borates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Led Devices (AREA)

Abstract

　優れた演色性を有する発光装置を提供する。 　発光素子と、窒化物蛍光体より成り、前記発光素子の光により励起されて発光する赤色蛍光体と、ハロシリケートより成り、前記発光素子の光により励起されて発光する緑色蛍光体と、前記発光素子の光により励起されて発光するＹＡＧ系蛍光体と、を含みことを特徴とする発光装置である。
PCT/JP2008/065521 2007-08-30 2008-08-29 発光装置 Ceased WO2009028657A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008801043327A CN101785121B (zh) 2007-08-30 2008-08-29 发光装置
JP2009530202A JPWO2009028657A1 (ja) 2007-08-30 2008-08-29 発光装置
US12/675,713 US8384092B2 (en) 2007-08-30 2008-08-29 Light emitting device
KR1020107006845A KR101152066B1 (ko) 2007-08-30 2008-08-29 발광 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-224034 2007-08-30
JP2007224034 2007-08-30

Publications (1)

Publication Number Publication Date
WO2009028657A1 true WO2009028657A1 (ja) 2009-03-05

Family

ID=40387367

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2008/065521 Ceased WO2009028657A1 (ja) 2007-08-30 2008-08-29 発光装置
PCT/JP2008/065520 Ceased WO2009028656A1 (ja) 2007-08-30 2008-08-29 発光装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065520 Ceased WO2009028656A1 (ja) 2007-08-30 2008-08-29 発光装置

Country Status (7)

Country Link
US (2) US8384092B2 (ja)
JP (2) JPWO2009028656A1 (ja)
KR (2) KR101152066B1 (ja)
CN (2) CN101785120B (ja)
RU (2) RU2423757C1 (ja)
TW (2) TWI416756B (ja)
WO (2) WO2009028657A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011022399A1 (en) 2009-08-17 2011-02-24 Osram Sylvania Inc. Phosphor blend for an led light source and led light source incorporating same
JP2011072388A (ja) * 2009-09-29 2011-04-14 Panasonic Corp Ｌｅｄ照明光源及び照明装置
CN102088054A (zh) * 2009-10-15 2011-06-08 Lg伊诺特有限公司 发光设备
JP2011139026A (ja) * 2009-12-29 2011-07-14 Samsung Electronics Co Ltd 発光装置及びこれを含む表示装置
CN103242833A (zh) * 2012-02-09 2013-08-14 电气化学工业株式会社 荧光体及发光装置
US8592829B2 (en) 2009-08-17 2013-11-26 Osram Sylvania Inc. Phosphor blend for an LED light source and LED light source incorporating same
JP2014520184A (ja) * 2011-06-07 2014-08-21 クリー インコーポレイテッド ガリウム置換イットリウムアルミニウムガーネット蛍光体及びこれを含む発光デバイス
US9647181B2 (en) 2010-12-09 2017-05-09 Sharp Kabushiki Kaisha Light emitting device with phosphors
WO2023074525A1 (ja) * 2021-10-28 2023-05-04 日亜化学工業株式会社 発光装置及び光源装置

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US8475683B2 (en) 2006-10-20 2013-07-02 Intematix Corporation Yellow-green to yellow-emitting phosphors based on halogenated-aluminates
US8133461B2 (en) 2006-10-20 2012-03-13 Intematix Corporation Nano-YAG:Ce phosphor compositions and their methods of preparation
US8529791B2 (en) 2006-10-20 2013-09-10 Intematix Corporation Green-emitting, garnet-based phosphors in general and backlighting applications
US9120975B2 (en) 2006-10-20 2015-09-01 Intematix Corporation Yellow-green to yellow-emitting phosphors based on terbium-containing aluminates
TWI416756B (zh) * 2007-08-30 2013-11-21 日亞化學工業股份有限公司 發光裝置
JP5310087B2 (ja) * 2009-02-26 2013-10-09 日亜化学工業株式会社 蛍光体及びこれを用いた発光装置
KR101098006B1 (ko) * 2009-09-29 2011-12-23 한국화학연구원 (할로)실리케이트계 형광체 및 이의 제조방법
US8963178B2 (en) 2009-11-13 2015-02-24 Seoul Viosys Co., Ltd. Light emitting diode chip having distributed bragg reflector and method of fabricating the same
TWI531088B (zh) * 2009-11-13 2016-04-21 首爾偉傲世有限公司 具有分散式布拉格反射器的發光二極體晶片
JP5498145B2 (ja) * 2009-12-11 2014-05-21 Ｊｘ日鉱日石エネルギー株式会社 潤滑油劣化モニター装置
US9142715B2 (en) 2010-06-24 2015-09-22 Seoul Viosys Co., Ltd. Light emitting diode
DE112011102506B4 (de) * 2010-07-28 2021-03-25 Seoul Viosys Co., Ltd. Lichtemittierende Diode und lichtemittierende Diodeneinheit
WO2012118310A2 (ko) * 2011-02-28 2012-09-07 성균관대학교산학협력단 형광체, 및 이의 제조 방법
JP2013004692A (ja) * 2011-06-15 2013-01-07 Rohm Co Ltd 半導体発光装置およびその製造方法
US8704440B2 (en) * 2011-07-06 2014-04-22 Osram Sylvania Inc. LED lighting device having a phosphor composition
TWI464241B (zh) 2011-08-02 2014-12-11 億光電子工業股份有限公司 螢光粉組成及使用該螢光粉組成的白色發光裝置
CN105932141A (zh) * 2011-08-02 2016-09-07 亿光电子(中国)有限公司 荧光粉组成及使用该荧光粉组成的白色发光装置
DE102011113802A1 (de) 2011-09-20 2013-03-21 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Modul mit einer Mehrzahl von derartigen Bauelementen
RU2518181C2 (ru) * 2012-03-20 2014-06-10 Амтай Медикал Эквипмент, Инк. Источник света на светодиодах для медицинских светильников
WO2014014079A1 (ja) * 2012-07-20 2014-01-23 三菱化学株式会社 発光装置、波長変換部材、蛍光体組成物、及び蛍光体混合物
JP2014170895A (ja) * 2013-03-05 2014-09-18 Mitsubishi Chemicals Corp 波長変換部材及びこれを用いた発光装置
JP2014130998A (ja) * 2012-07-20 2014-07-10 Mitsubishi Chemicals Corp 発光装置、波長変換部材、蛍光体組成物、及び蛍光体混合物
KR101476000B1 (ko) * 2012-08-03 2014-12-24 에스앤비인더스트리 주식회사 원예용 ｌｅｄ조명장치의 ｌｅｄ칩 제조방법
CN104718633B (zh) * 2012-10-04 2017-09-26 株式会社东芝 白色发光装置、照明装置、以及牙科用照明装置
US8890196B2 (en) * 2013-03-14 2014-11-18 Goldeneye, Inc. Lightweight self-cooling light sources
JP6853614B2 (ja) * 2013-03-29 2021-03-31 株式会社朝日ラバー Ｌｅｄ照明装置、その製造方法及びｌｅｄ照明方法
JP6356005B2 (ja) * 2013-12-27 2018-07-11 シチズン電子株式会社 発光装置及び発光装置の設計方法
EP3091585A4 (en) * 2013-12-27 2017-07-26 Citizen Electronics Co., Ltd Light-emitting device and method for designing light emitting device
JP6356018B2 (ja) * 2014-09-03 2018-07-11 シチズン電子株式会社 発光装置及び発光装置の製造方法
US9328878B2 (en) 2014-07-02 2016-05-03 General Electric Company Phosphor compositions and lighting apparatus thereof
EP3546544B1 (en) * 2014-10-08 2024-05-01 Seoul Semiconductor Co., Ltd. Light emitting device
EP3045963B1 (en) * 2015-01-13 2018-04-04 Samsung Display Co., Ltd. Display device
JPWO2016159141A1 (ja) * 2015-04-03 2018-01-18 シャープ株式会社 発光装置
US9974138B2 (en) 2015-04-21 2018-05-15 GE Lighting Solutions, LLC Multi-channel lamp system and method with mixed spectrum
JP6106307B2 (ja) * 2016-04-12 2017-03-29 シャープ株式会社 発光装置、並びに、当該発光装置を用いた照明器具及び表示装置
US11094857B2 (en) * 2017-03-28 2021-08-17 Asahi Rubber Inc. Method for manufacturing lighting device
JP7025424B2 (ja) * 2017-06-28 2022-02-24 京セラ株式会社 発光装置および照明装置
JP6940764B2 (ja) * 2017-09-28 2021-09-29 日亜化学工業株式会社 発光装置
JP6741056B2 (ja) * 2017-10-31 2020-08-19 日亜化学工業株式会社 希土類アルミン酸塩蛍光体の製造方法
JP6769449B2 (ja) * 2018-01-30 2020-10-14 日亜化学工業株式会社 照明装置
WO2019203322A1 (ja) * 2018-04-20 2019-10-24 Ｄｏｗａエレクトロニクス株式会社 深紫外発光素子
EP3576168B1 (en) * 2018-05-31 2023-05-31 Nichia Corporation Light emitting device
JP2021133557A (ja) 2020-02-26 2021-09-13 セイコーエプソン株式会社 記録装置
WO2023107239A1 (en) * 2021-12-09 2023-06-15 Lumileds Llc Oxonitridoberyllosilicate phosphors

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JP2006219636A (ja) * 2005-02-14 2006-08-24 Matsushita Electric Works Ltd 蛍光体及びその製造方法、発光装置
JP2006523245A (ja) * 2003-03-28 2006-10-12 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 粒子または原材料上に被覆物を形成させる方法および属する製品
JP2006306981A (ja) * 2005-04-27 2006-11-09 Nichia Chem Ind Ltd 窒化物蛍光体及びそれを用いた発光装置
JP2006332134A (ja) * 2005-05-23 2006-12-07 Ijin Jo 白色発光ダイオード
JP2007088248A (ja) * 2005-09-22 2007-04-05 Fujikura Ltd 有色発光ダイオードランプ、装飾用照明装置及びカラーディスプレイサイン装置
JP2007145958A (ja) * 2005-11-25 2007-06-14 Matsushita Electric Works Ltd 蛍光体及び発光装置

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US20100224895A1 (en) 2010-09-09

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