WO2009093845A3 - 발광소자 - Google Patents
발광소자 Download PDFInfo
- Publication number
- WO2009093845A3 WO2009093845A3 PCT/KR2009/000318 KR2009000318W WO2009093845A3 WO 2009093845 A3 WO2009093845 A3 WO 2009093845A3 KR 2009000318 W KR2009000318 W KR 2009000318W WO 2009093845 A3 WO2009093845 A3 WO 2009093845A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- emitting device
- layer
- reflective layer
- emissive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200980102755XA CN101926011B (zh) | 2008-01-21 | 2009-01-21 | 发光器件 |
EP09704913.4A EP2237332B1 (en) | 2008-01-21 | 2009-01-21 | Light emitting device |
JP2010544223A JP5888854B2 (ja) | 2008-01-21 | 2009-01-21 | 発光素子 |
US12/514,615 US8174040B2 (en) | 2008-01-21 | 2009-01-21 | Light emitting device |
US13/449,097 US20120199864A1 (en) | 2008-01-21 | 2012-04-17 | Light emitting device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080006073A KR101459764B1 (ko) | 2008-01-21 | 2008-01-21 | 질화물계 발광 소자 |
KR10-2008-0006073 | 2008-01-21 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/449,097 Continuation US20120199864A1 (en) | 2008-01-21 | 2012-04-17 | Light emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009093845A2 WO2009093845A2 (ko) | 2009-07-30 |
WO2009093845A3 true WO2009093845A3 (ko) | 2009-10-22 |
Family
ID=40901544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/000318 WO2009093845A2 (ko) | 2008-01-21 | 2009-01-21 | 발광소자 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8174040B2 (ko) |
EP (1) | EP2237332B1 (ko) |
JP (1) | JP5888854B2 (ko) |
KR (1) | KR101459764B1 (ko) |
CN (1) | CN101926011B (ko) |
WO (1) | WO2009093845A2 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100736623B1 (ko) | 2006-05-08 | 2007-07-09 | 엘지전자 주식회사 | 수직형 발광 소자 및 그 제조방법 |
KR101100681B1 (ko) * | 2009-09-10 | 2012-01-03 | 주식회사 에피밸리 | 반도체 발광소자 |
KR101007077B1 (ko) | 2009-11-06 | 2011-01-10 | 엘지이노텍 주식회사 | 발광소자, 발광소자 패키지 및 그 제조방법 |
KR101712094B1 (ko) | 2009-11-27 | 2017-03-03 | 포항공과대학교 산학협력단 | 질화물갈륨계 수직 발광다이오드 및 그 제조 방법 |
KR100993094B1 (ko) | 2010-02-01 | 2010-11-08 | 엘지이노텍 주식회사 | 발광소자 및 발광소자 패키지 |
KR101028250B1 (ko) * | 2010-02-25 | 2011-04-11 | 엘지이노텍 주식회사 | 발광 소자 및 이를 이용한 발광 소자 패키지 |
US8084776B2 (en) | 2010-02-25 | 2011-12-27 | Lg Innotek Co., Ltd. | Light emitting device, light emitting device package, and lighting system |
KR101028220B1 (ko) * | 2010-02-25 | 2011-04-11 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
KR100999771B1 (ko) * | 2010-02-25 | 2010-12-08 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
KR101047720B1 (ko) * | 2010-04-23 | 2011-07-08 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
KR101701510B1 (ko) | 2010-07-09 | 2017-02-01 | 엘지이노텍 주식회사 | 발광소자 |
JP2014103240A (ja) * | 2012-11-20 | 2014-06-05 | Stanley Electric Co Ltd | 半導体発光素子 |
JP6190585B2 (ja) * | 2012-12-12 | 2017-08-30 | スタンレー電気株式会社 | 多重量子井戸半導体発光素子 |
WO2014143043A1 (en) * | 2013-03-15 | 2014-09-18 | Abbott Cardiovascular Systems, Inc. | Crosslinked coatings delivered via a balloon |
KR101521081B1 (ko) * | 2013-10-01 | 2015-05-18 | 경희대학교 산학협력단 | 발광 다이오드 패키지 |
JP6826395B2 (ja) * | 2016-08-26 | 2021-02-03 | ローム株式会社 | 半導体発光素子 |
KR102555005B1 (ko) * | 2016-11-24 | 2023-07-14 | 삼성전자주식회사 | 반도체 발광 소자 및 반도체 발광 소자의 제조 방법 |
JP7316610B6 (ja) * | 2018-01-26 | 2024-02-19 | 丸文株式会社 | 深紫外led及びその製造方法 |
JP2022172792A (ja) * | 2021-05-07 | 2022-11-17 | 日機装株式会社 | 窒化物半導体発光素子 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0537017A (ja) * | 1991-07-31 | 1993-02-12 | Daido Steel Co Ltd | チヤープ状光反射層を備えた半導体装置 |
KR20010093778A (ko) * | 1999-08-20 | 2001-10-29 | 구사마 사부로 | 다중 파장의 발광 디바이스 및 전자 장치 |
JP2005051138A (ja) * | 2003-07-31 | 2005-02-24 | Oki Data Corp | 半導体発光装置、ledヘッド、画像形成装置、及び半導体発光装置の製造方法 |
KR20070009673A (ko) * | 2004-04-14 | 2007-01-18 | 오스람 옵토 세미컨덕터스 게엠베하 | 발광 다이오드 칩 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69132764T2 (de) | 1990-11-02 | 2002-07-11 | Norikatsu Yamauchi | Halbleitervorrichtung mit reflektierender Schicht |
JPH0527177A (ja) * | 1991-07-25 | 1993-02-05 | Fuji Photo Film Co Ltd | 走査型顕微鏡 |
US6486499B1 (en) | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
US6784462B2 (en) * | 2001-12-13 | 2004-08-31 | Rensselaer Polytechnic Institute | Light-emitting diode with planar omni-directional reflector |
JP2004056010A (ja) * | 2002-07-23 | 2004-02-19 | Toyota Central Res & Dev Lab Inc | 窒化物半導体発光素子 |
JP4350996B2 (ja) * | 2002-11-26 | 2009-10-28 | 日東電工株式会社 | 有機エレクトロルミネッセンス素子、面光源および表示装置 |
TWI312582B (en) * | 2003-07-24 | 2009-07-21 | Epistar Corporatio | Led device, flip-chip led package and light reflecting structure |
US7119372B2 (en) * | 2003-10-24 | 2006-10-10 | Gelcore, Llc | Flip-chip light emitting diode |
TWI292631B (en) * | 2005-02-05 | 2008-01-11 | Epistar Corp | Light emitting diode and method of the same |
US20070018182A1 (en) * | 2005-07-20 | 2007-01-25 | Goldeneye, Inc. | Light emitting diodes with improved light extraction and reflectivity |
US8487344B2 (en) * | 2005-12-16 | 2013-07-16 | Samsung Display Co., Ltd. | Optical device and method of fabricating the same |
KR100862505B1 (ko) * | 2006-02-01 | 2008-10-08 | 삼성전기주식회사 | 발광 다이오드 소자 및 그 제조방법 |
KR100736623B1 (ko) | 2006-05-08 | 2007-07-09 | 엘지전자 주식회사 | 수직형 발광 소자 및 그 제조방법 |
TWI370560B (en) * | 2007-12-14 | 2012-08-11 | Delta Electronics Inc | Light-emitting diode device and manufacturing method thereof |
US8143636B2 (en) * | 2008-11-18 | 2012-03-27 | Epistar Corporation | Light-emitting device |
-
2008
- 2008-01-21 KR KR1020080006073A patent/KR101459764B1/ko active IP Right Grant
-
2009
- 2009-01-21 CN CN200980102755XA patent/CN101926011B/zh active Active
- 2009-01-21 EP EP09704913.4A patent/EP2237332B1/en active Active
- 2009-01-21 WO PCT/KR2009/000318 patent/WO2009093845A2/ko active Application Filing
- 2009-01-21 US US12/514,615 patent/US8174040B2/en active Active
- 2009-01-21 JP JP2010544223A patent/JP5888854B2/ja active Active
-
2012
- 2012-04-17 US US13/449,097 patent/US20120199864A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0537017A (ja) * | 1991-07-31 | 1993-02-12 | Daido Steel Co Ltd | チヤープ状光反射層を備えた半導体装置 |
KR20010093778A (ko) * | 1999-08-20 | 2001-10-29 | 구사마 사부로 | 다중 파장의 발광 디바이스 및 전자 장치 |
JP2005051138A (ja) * | 2003-07-31 | 2005-02-24 | Oki Data Corp | 半導体発光装置、ledヘッド、画像形成装置、及び半導体発光装置の製造方法 |
KR20070009673A (ko) * | 2004-04-14 | 2007-01-18 | 오스람 옵토 세미컨덕터스 게엠베하 | 발광 다이오드 칩 |
Also Published As
Publication number | Publication date |
---|---|
KR20090080218A (ko) | 2009-07-24 |
US20120199864A1 (en) | 2012-08-09 |
CN101926011B (zh) | 2013-01-23 |
KR101459764B1 (ko) | 2014-11-12 |
CN101926011A (zh) | 2010-12-22 |
EP2237332A2 (en) | 2010-10-06 |
EP2237332A4 (en) | 2011-11-30 |
EP2237332B1 (en) | 2019-08-21 |
JP2011510512A (ja) | 2011-03-31 |
US8174040B2 (en) | 2012-05-08 |
JP5888854B2 (ja) | 2016-03-22 |
WO2009093845A2 (ko) | 2009-07-30 |
US20100314645A1 (en) | 2010-12-16 |
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