WO2009028656A1 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
WO2009028656A1
WO2009028656A1 PCT/JP2008/065520 JP2008065520W WO2009028656A1 WO 2009028656 A1 WO2009028656 A1 WO 2009028656A1 JP 2008065520 W JP2008065520 W JP 2008065520W WO 2009028656 A1 WO2009028656 A1 WO 2009028656A1
Authority
WO
WIPO (PCT)
Prior art keywords
peak wavelength
light emitting
emitting device
value
relative emission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/065520
Other languages
English (en)
French (fr)
Inventor
Yoshinori Murazaki
Masafumi Harada
Suguru Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to CN2008801043172A priority Critical patent/CN101785120B/zh
Priority to JP2009530201A priority patent/JPWO2009028656A1/ja
Priority to US12/675,722 priority patent/US8648523B2/en
Priority to KR1020107006816A priority patent/KR101173741B1/ko
Publication of WO2009028656A1 publication Critical patent/WO2009028656A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7732—Halogenides
    • C09K11/7733—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/774—Borates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Led Devices (AREA)

Abstract

　優れた色再性を有する発光装置を提供する。 　発光素子と、窒化物蛍光体より成る赤色蛍光体と、ハロシリケートより成る緑色蛍光体とを含み、発光スペクトルが４４０ｎｍ以上４７０ｎｍ以下の第１のピーク波長と、５１０ｎｍ以上５５０ｎｍ以下の第２のピーク波長と、６３０ｎｍ以上６７０ｎｍ以下の第３のピーク波長とを有し、前記第２のピーク波長と前記第３のピーク波長との間の最低相対発光強度値が、前記第２のピーク波長における相対発光強度値と前記第３のピーク波長における相対発光強度値とのいずれか低い方の値の８０％以下であることを特徴とする発光装置である。
PCT/JP2008/065520 2007-08-30 2008-08-29 発光装置 Ceased WO2009028656A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008801043172A CN101785120B (zh) 2007-08-30 2008-08-29 发光装置
JP2009530201A JPWO2009028656A1 (ja) 2007-08-30 2008-08-29 発光装置
US12/675,722 US8648523B2 (en) 2007-08-30 2008-08-29 Light emitting device including light emitting element and phosphor
KR1020107006816A KR101173741B1 (ko) 2007-08-30 2008-08-29 발광 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-224034 2007-08-30
JP2007224034 2007-08-30

Publications (1)

Publication Number Publication Date
WO2009028656A1 true WO2009028656A1 (ja) 2009-03-05

Family

ID=40387367

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2008/065521 Ceased WO2009028657A1 (ja) 2007-08-30 2008-08-29 発光装置
PCT/JP2008/065520 Ceased WO2009028656A1 (ja) 2007-08-30 2008-08-29 発光装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065521 Ceased WO2009028657A1 (ja) 2007-08-30 2008-08-29 発光装置

Country Status (7)

Country Link
US (2) US8384092B2 (ja)
JP (2) JPWO2009028656A1 (ja)
KR (2) KR101152066B1 (ja)
CN (2) CN101785120B (ja)
RU (2) RU2423757C1 (ja)
TW (2) TWI416756B (ja)
WO (2) WO2009028657A1 (ja)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010195948A (ja) * 2009-02-26 2010-09-09 Nichia Corp 蛍光体及びこれを用いた発光装置
JP2011122968A (ja) * 2009-12-11 2011-06-23 Jx Nippon Oil & Energy Corp 潤滑油劣化モニター装置
WO2012118310A3 (ko) * 2011-02-28 2012-11-08 성균관대학교산학협력단 형광체, 및 이의 제조 방법
JP2013004692A (ja) * 2011-06-15 2013-01-07 Rohm Co Ltd 半導体発光装置およびその製造方法
JP2013506043A (ja) * 2009-09-29 2013-02-21 コリア リサーチ インスティテュート オブ ケミカル テクノロジー （ハロ）ケイ酸塩系蛍光体及びその製造方法
WO2014014079A1 (ja) * 2012-07-20 2014-01-23 三菱化学株式会社 発光装置、波長変換部材、蛍光体組成物、及び蛍光体混合物
JP2014131046A (ja) * 2012-07-20 2014-07-10 Mitsubishi Chemicals Corp 発光装置、波長変換部材、蛍光体組成物、及び蛍光体混合物
JP2014170895A (ja) * 2013-03-05 2014-09-18 Mitsubishi Chemicals Corp 波長変換部材及びこれを用いた発光装置
JP2014209617A (ja) * 2013-03-29 2014-11-06 株式会社朝日ラバー Ｌｅｄ照明装置、その製造方法及びｌｅｄ照明方法
KR101476000B1 (ko) * 2012-08-03 2014-12-24 에스앤비인더스트리 주식회사 원예용 ｌｅｄ조명장치의 ｌｅｄ칩 제조방법
CN104718633A (zh) * 2012-10-04 2015-06-17 株式会社东芝 白色发光装置、照明装置、以及牙科用照明装置
JP2015144231A (ja) * 2013-12-27 2015-08-06 三菱化学株式会社 発光装置及び発光装置の設計方法
JP2016054184A (ja) * 2014-09-03 2016-04-14 シチズン電子株式会社 発光装置及び発光装置の製造方法
JP2019067808A (ja) * 2017-09-28 2019-04-25 日亜化学工業株式会社 発光装置
DE112011102506B4 (de) * 2010-07-28 2021-03-25 Seoul Viosys Co., Ltd. Lichtemittierende Diode und lichtemittierende Diodeneinheit
JP2021108381A (ja) * 2014-10-08 2021-07-29 ソウル セミコンダクター カンパニー リミテッドＳｅｏｕｌ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｃｏ．， Ｌｔｄ． 白色発光装置
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US8475683B2 (en) 2006-10-20 2013-07-02 Intematix Corporation Yellow-green to yellow-emitting phosphors based on halogenated-aluminates
US8133461B2 (en) 2006-10-20 2012-03-13 Intematix Corporation Nano-YAG:Ce phosphor compositions and their methods of preparation
US8529791B2 (en) 2006-10-20 2013-09-10 Intematix Corporation Green-emitting, garnet-based phosphors in general and backlighting applications
US9120975B2 (en) 2006-10-20 2015-09-01 Intematix Corporation Yellow-green to yellow-emitting phosphors based on terbium-containing aluminates
TWI416756B (zh) * 2007-08-30 2013-11-21 日亞化學工業股份有限公司 發光裝置
WO2011022399A1 (en) 2009-08-17 2011-02-24 Osram Sylvania Inc. Phosphor blend for an led light source and led light source incorporating same
EP2467449B1 (en) 2009-08-17 2014-11-26 OSRAM SYLVANIA Inc. Phosphor blend for a led light source and led light source incorporating same
JP5824676B2 (ja) * 2009-09-29 2015-11-25 パナソニックＩｐマネジメント株式会社 Ｌｅｄ照明光源及び照明装置
KR101028304B1 (ko) 2009-10-15 2011-04-11 엘지이노텍 주식회사 발광 장치
US8963178B2 (en) 2009-11-13 2015-02-24 Seoul Viosys Co., Ltd. Light emitting diode chip having distributed bragg reflector and method of fabricating the same
TWI531088B (zh) * 2009-11-13 2016-04-21 首爾偉傲世有限公司 具有分散式布拉格反射器的發光二極體晶片
KR20110076447A (ko) * 2009-12-29 2011-07-06 삼성전자주식회사 발광 장치 및 이를 포함하는 표시 장치
US9142715B2 (en) 2010-06-24 2015-09-22 Seoul Viosys Co., Ltd. Light emitting diode
JP5864851B2 (ja) 2010-12-09 2016-02-17 シャープ株式会社 発光装置
US8747697B2 (en) * 2011-06-07 2014-06-10 Cree, Inc. Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same
US8704440B2 (en) * 2011-07-06 2014-04-22 Osram Sylvania Inc. LED lighting device having a phosphor composition
TWI464241B (zh) 2011-08-02 2014-12-11 億光電子工業股份有限公司 螢光粉組成及使用該螢光粉組成的白色發光裝置
CN105932141A (zh) * 2011-08-02 2016-09-07 亿光电子(中国)有限公司 荧光粉组成及使用该荧光粉组成的白色发光装置
DE102011113802A1 (de) 2011-09-20 2013-03-21 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Modul mit einer Mehrzahl von derartigen Bauelementen
WO2013118330A1 (ja) * 2012-02-09 2013-08-15 電気化学工業株式会社 蛍光体及び発光装置
RU2518181C2 (ru) * 2012-03-20 2014-06-10 Амтай Медикал Эквипмент, Инк. Источник света на светодиодах для медицинских светильников
US8890196B2 (en) * 2013-03-14 2014-11-18 Goldeneye, Inc. Lightweight self-cooling light sources
EP3091585A4 (en) * 2013-12-27 2017-07-26 Citizen Electronics Co., Ltd Light-emitting device and method for designing light emitting device
US9328878B2 (en) 2014-07-02 2016-05-03 General Electric Company Phosphor compositions and lighting apparatus thereof
EP3045963B1 (en) * 2015-01-13 2018-04-04 Samsung Display Co., Ltd. Display device
JPWO2016159141A1 (ja) * 2015-04-03 2018-01-18 シャープ株式会社 発光装置
US9974138B2 (en) 2015-04-21 2018-05-15 GE Lighting Solutions, LLC Multi-channel lamp system and method with mixed spectrum
JP6106307B2 (ja) * 2016-04-12 2017-03-29 シャープ株式会社 発光装置、並びに、当該発光装置を用いた照明器具及び表示装置
US11094857B2 (en) * 2017-03-28 2021-08-17 Asahi Rubber Inc. Method for manufacturing lighting device
JP7025424B2 (ja) * 2017-06-28 2022-02-24 京セラ株式会社 発光装置および照明装置
JP6741056B2 (ja) * 2017-10-31 2020-08-19 日亜化学工業株式会社 希土類アルミン酸塩蛍光体の製造方法
JP6769449B2 (ja) * 2018-01-30 2020-10-14 日亜化学工業株式会社 照明装置
WO2019203322A1 (ja) * 2018-04-20 2019-10-24 Ｄｏｗａエレクトロニクス株式会社 深紫外発光素子
EP3576168B1 (en) * 2018-05-31 2023-05-31 Nichia Corporation Light emitting device
WO2023074525A1 (ja) * 2021-10-28 2023-05-04 日亜化学工業株式会社 発光装置及び光源装置
WO2023107239A1 (en) * 2021-12-09 2023-06-15 Lumileds Llc Oxonitridoberyllosilicate phosphors

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JP2006523245A (ja) * 2003-03-28 2006-10-12 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 粒子または原材料上に被覆物を形成させる方法および属する製品
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JP2006332134A (ja) * 2005-05-23 2006-12-07 Ijin Jo 白色発光ダイオード
JP2007088248A (ja) * 2005-09-22 2007-04-05 Fujikura Ltd 有色発光ダイオードランプ、装飾用照明装置及びカラーディスプレイサイン装置
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