WO2009011383A1 - 電子部品用接着剤 - Google Patents

電子部品用接着剤 Download PDF

Info

Publication number
WO2009011383A1
WO2009011383A1 PCT/JP2008/062906 JP2008062906W WO2009011383A1 WO 2009011383 A1 WO2009011383 A1 WO 2009011383A1 JP 2008062906 W JP2008062906 W JP 2008062906W WO 2009011383 A1 WO2009011383 A1 WO 2009011383A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
electronic component
fine particles
value
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062906
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Akinobu Hayakawa
Hideaki Ishizawa
Kohei Takeda
Ryohei Masui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to US12/669,081 priority Critical patent/US7838577B2/en
Priority to CN200880024920XA priority patent/CN101755328B/zh
Priority to JP2008534590A priority patent/JP4376957B2/ja
Publication of WO2009011383A1 publication Critical patent/WO2009011383A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
PCT/JP2008/062906 2007-07-19 2008-07-17 電子部品用接着剤 Ceased WO2009011383A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/669,081 US7838577B2 (en) 2007-07-19 2008-07-17 Adhesive for electronic component
CN200880024920XA CN101755328B (zh) 2007-07-19 2008-07-17 电子器件用胶粘剂
JP2008534590A JP4376957B2 (ja) 2007-07-19 2008-07-17 電子部品用接着剤

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007188623 2007-07-19
JP2007-188623 2007-07-19

Publications (1)

Publication Number Publication Date
WO2009011383A1 true WO2009011383A1 (ja) 2009-01-22

Family

ID=40259715

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062906 Ceased WO2009011383A1 (ja) 2007-07-19 2008-07-17 電子部品用接着剤

Country Status (6)

Country Link
US (1) US7838577B2 (https=)
JP (1) JP4376957B2 (https=)
KR (1) KR100988184B1 (https=)
CN (1) CN101755328B (https=)
TW (1) TW200911946A (https=)
WO (1) WO2009011383A1 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010087444A1 (ja) * 2009-01-29 2010-08-05 積水化学工業株式会社 電子部品用接着剤
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
WO2016010067A1 (ja) * 2014-07-18 2016-01-21 積水化学工業株式会社 半導体素子保護用材料及び半導体装置
JP2017041633A (ja) * 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
JP2017179154A (ja) * 2016-03-30 2017-10-05 株式会社日本触媒 ブロック共重合体及び樹脂組成物
WO2017170492A1 (ja) * 2016-03-30 2017-10-05 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
US11040024B2 (en) 2002-03-20 2021-06-22 Amgen Inc. Methods of using (+)-2-[1-(3-ethoxy-4-methoxyphenyl)-2-methylsulfonylethyl]-4-acetylaminoisoindoline-1,3-dione

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI435887B (zh) * 2008-02-26 2014-05-01 Toray Industries 環氧樹脂組成物、預浸透物及纖維強化複合材料
EP2558543B1 (en) 2010-04-16 2017-08-30 Valspar Sourcing, Inc. Coating compositions for packaging articles and methods of coating
PL3425011T3 (pl) 2011-02-07 2021-05-17 Swimc Llc Kompozycje powłokowe do pojemników i innych wyrobów i sposoby powlekania
WO2013061183A1 (de) * 2011-09-27 2013-05-02 Rupprecht Gabriel Elektrisch isolierendes harz - gehäuse für halbleiterbauelemente oder baugruppen und herstellungsverfahren mit einem moldprozess
RU2618704C2 (ru) 2012-08-09 2017-05-11 Вэлспар Сорсинг, Инк. Композиции для контейнеров и других изделий и способы их применения
WO2014025411A1 (en) 2012-08-09 2014-02-13 Valspar Sourcing, Inc. Container coating system
KR102429146B1 (ko) 2014-04-14 2022-08-04 에스더블유아이엠씨 엘엘씨 용기 및 기타 물품용 조성물의 제조방법 및 상기 조성물의 사용 방법
JP6093880B2 (ja) * 2014-12-04 2017-03-08 積水化学工業株式会社 硬化性組成物、硬化性組成物の製造方法及び半導体装置
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
KR102268270B1 (ko) * 2018-01-23 2021-06-23 주식회사 엘지화학 접착제 조성물
JP7515403B2 (ja) 2018-12-17 2024-07-12 日本製鉄株式会社 ステータ用接着積層コア、その製造方法、および回転電機
PL3902107T3 (pl) * 2018-12-17 2026-03-09 Nippon Steel Corporation Laminowany rdzeń, sposób jego wytwarzania i silnik elektryczny
JP7055209B2 (ja) 2018-12-17 2022-04-15 日本製鉄株式会社 積層コアおよび回転電機
RS66007B1 (sr) 2018-12-17 2024-10-31 Nippon Steel Corp Laminirano jezgro i rotaciona električna mašina
CN113196634B (zh) 2018-12-17 2024-10-18 日本制铁株式会社 层叠铁芯及旋转电机
KR102631738B1 (ko) * 2018-12-17 2024-02-01 닛폰세이테츠 가부시키가이샤 적층 코어, 적층 코어의 제조 방법 및 회전 전기 기기
CN113228468B (zh) 2018-12-17 2025-04-11 日本制铁株式会社 定子用粘接层叠铁芯、其制造方法及旋转电机
MY206339A (en) 2018-12-17 2024-12-12 Nippon Steel Corp Laminated core, core block, electric motor and method of producing core block
SG11202108950YA (en) 2018-12-17 2021-09-29 Nippon Steel Corp Adhesively-laminated core for stator and electric motor
WO2020129926A1 (ja) 2018-12-17 2020-06-25 日本製鉄株式会社 積層コアおよび回転電機
TWI724690B (zh) 2018-12-17 2021-04-11 日商日本製鐵股份有限公司 積層鐵芯及旋轉電機
EP3902120A4 (en) 2018-12-17 2022-10-05 Nippon Steel Corporation STACKED CORE AND ROTATING ELECTRICAL MACHINE
KR102607691B1 (ko) 2018-12-17 2023-11-30 닛폰세이테츠 가부시키가이샤 스테이터용 접착 적층 코어 및 회전 전기 기계
EA202192064A1 (ru) 2018-12-17 2021-11-24 Ниппон Стил Корпорейшн Шихтованный сердечник и электродвигатель
TWI732384B (zh) 2018-12-17 2021-07-01 日商日本製鐵股份有限公司 積層鐵芯及旋轉電機
EP3902106B1 (en) 2018-12-17 2025-10-29 Nippon Steel Corporation Adhesively laminated core for stator, method of manufacturing the same, and electric motor
EP3902110B1 (en) 2018-12-17 2026-01-28 Nippon Steel Corporation Laminated core and electric motor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
WO2008010555A1 (fr) * 2006-07-20 2008-01-24 Sekisui Chemical Co., Ltd. Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur

Family Cites Families (7)

* Cited by examiner, † Cited by third party
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US5827632A (en) * 1994-12-05 1998-10-27 Canon Kabushiki Kaisha Toner for developing electrostatic image containing hydrophobized inorganic fine powder
JP3521373B2 (ja) * 1996-03-29 2004-04-19 コニカミノルタホールディングス株式会社 フルカラー電子写真用トナーキット
EP0992549B1 (en) * 1998-04-21 2004-10-06 BASF NOF Coatings Co., Ltd., Antifouling agent, method for antifouling treatment, and article obtained through antifouling treatment
JP2000178342A (ja) 1998-12-17 2000-06-27 Sumitomo Bakelite Co Ltd 絶縁ペースト
KR100944467B1 (ko) * 2004-09-02 2010-03-03 니폰 쇼쿠바이 컴파니 리미티드 흡수성 물질, 표면 가교된 흡수성 수지의 제조 방법, 및흡수성 물질의 평가 방법
JP2006181838A (ja) * 2004-12-27 2006-07-13 Fuji Photo Film Co Ltd 平版印刷版原版
KR101031973B1 (ko) * 2005-10-26 2011-04-29 캐논 가부시끼가이샤 토너

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
WO2008010555A1 (fr) * 2006-07-20 2008-01-24 Sekisui Chemical Co., Ltd. Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11260046B2 (en) 2002-03-20 2022-03-01 Amgen Inc. (+)-2-[1-(3-Ethoxy-4- methoxyphenyl)-2-methylsulfonylethyl]- 4-acetylaminoisoindoline-1,3-dione: methods of using and compositions thereof
US11040024B2 (en) 2002-03-20 2021-06-22 Amgen Inc. Methods of using (+)-2-[1-(3-ethoxy-4-methoxyphenyl)-2-methylsulfonylethyl]-4-acetylaminoisoindoline-1,3-dione
WO2010087444A1 (ja) * 2009-01-29 2010-08-05 積水化学工業株式会社 電子部品用接着剤
JP4729130B2 (ja) * 2009-01-29 2011-07-20 積水化学工業株式会社 電子部品用接着剤
CN102292407B (zh) * 2009-01-29 2014-01-01 积水化学工业株式会社 电子零件用胶粘剂
US8901207B2 (en) 2009-01-29 2014-12-02 Sekisui Chemical Co., Ltd. Adhesive for electronic components
TWI481685B (zh) * 2009-01-29 2015-04-21 積水化學工業股份有限公司 Adhesive for electronic parts
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
TWI704649B (zh) * 2014-07-18 2020-09-11 日商積水化學工業股份有限公司 半導體元件保護用材料及半導體裝置
WO2016010067A1 (ja) * 2014-07-18 2016-01-21 積水化学工業株式会社 半導体素子保護用材料及び半導体装置
JP2017041633A (ja) * 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
WO2017170492A1 (ja) * 2016-03-30 2017-10-05 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP6232167B1 (ja) * 2016-03-30 2017-11-15 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP2018031019A (ja) * 2016-03-30 2018-03-01 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP2017179154A (ja) * 2016-03-30 2017-10-05 株式会社日本触媒 ブロック共重合体及び樹脂組成物
JP7028545B2 (ja) 2016-03-30 2022-03-02 株式会社日本触媒 ブロック共重合体及び樹脂組成物

Also Published As

Publication number Publication date
US7838577B2 (en) 2010-11-23
US20100197830A1 (en) 2010-08-05
JPWO2009011383A1 (ja) 2010-09-24
TWI321148B (https=) 2010-03-01
TW200911946A (en) 2009-03-16
CN101755328B (zh) 2011-08-31
CN101755328A (zh) 2010-06-23
KR100988184B1 (ko) 2010-10-18
KR20100018624A (ko) 2010-02-17
JP4376957B2 (ja) 2009-12-02

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