WO2009011383A1 - 電子部品用接着剤 - Google Patents

電子部品用接着剤 Download PDF

Info

Publication number
WO2009011383A1
WO2009011383A1 PCT/JP2008/062906 JP2008062906W WO2009011383A1 WO 2009011383 A1 WO2009011383 A1 WO 2009011383A1 JP 2008062906 W JP2008062906 W JP 2008062906W WO 2009011383 A1 WO2009011383 A1 WO 2009011383A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
electronic component
fine particles
value
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062906
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Akinobu Hayakawa
Hideaki Ishizawa
Kohei Takeda
Ryohei Masui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to CN200880024920XA priority Critical patent/CN101755328B/zh
Priority to US12/669,081 priority patent/US7838577B2/en
Priority to JP2008534590A priority patent/JP4376957B2/ja
Publication of WO2009011383A1 publication Critical patent/WO2009011383A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
PCT/JP2008/062906 2007-07-19 2008-07-17 電子部品用接着剤 Ceased WO2009011383A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880024920XA CN101755328B (zh) 2007-07-19 2008-07-17 电子器件用胶粘剂
US12/669,081 US7838577B2 (en) 2007-07-19 2008-07-17 Adhesive for electronic component
JP2008534590A JP4376957B2 (ja) 2007-07-19 2008-07-17 電子部品用接着剤

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-188623 2007-07-19
JP2007188623 2007-07-19

Publications (1)

Publication Number Publication Date
WO2009011383A1 true WO2009011383A1 (ja) 2009-01-22

Family

ID=40259715

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062906 Ceased WO2009011383A1 (ja) 2007-07-19 2008-07-17 電子部品用接着剤

Country Status (6)

Country Link
US (1) US7838577B2 (https=)
JP (1) JP4376957B2 (https=)
KR (1) KR100988184B1 (https=)
CN (1) CN101755328B (https=)
TW (1) TW200911946A (https=)
WO (1) WO2009011383A1 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010087444A1 (ja) * 2009-01-29 2010-08-05 積水化学工業株式会社 電子部品用接着剤
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
WO2016010067A1 (ja) * 2014-07-18 2016-01-21 積水化学工業株式会社 半導体素子保護用材料及び半導体装置
JP2017041633A (ja) * 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
JP2017179154A (ja) * 2016-03-30 2017-10-05 株式会社日本触媒 ブロック共重合体及び樹脂組成物
WO2017170492A1 (ja) * 2016-03-30 2017-10-05 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
US11040024B2 (en) 2002-03-20 2021-06-22 Amgen Inc. Methods of using (+)-2-[1-(3-ethoxy-4-methoxyphenyl)-2-methylsulfonylethyl]-4-acetylaminoisoindoline-1,3-dione

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI435887B (zh) * 2008-02-26 2014-05-01 Toray Industries 環氧樹脂組成物、預浸透物及纖維強化複合材料
EP2558543B1 (en) 2010-04-16 2017-08-30 Valspar Sourcing, Inc. Coating compositions for packaging articles and methods of coating
EP3878912B1 (en) 2011-02-07 2023-04-05 Swimc Llc Coating compositions for containers and other articles and methods of coating
DE112012004032A5 (de) * 2011-09-27 2014-07-24 Rupprecht Gabriel Elektrisch isolierendes Harz-Gehäuse für Halbleiterbauelemente oder Baugruppen und Herstellungsverfahren mit einem Mold-Prozess
AU2013299578A1 (en) 2012-08-09 2015-02-19 Valspar Sourcing, Inc. Compositions for containers and other articles and methods of using same
EP2882658B1 (en) 2012-08-09 2021-09-08 Swimc Llc Container coating system
CN110790914A (zh) 2014-04-14 2020-02-14 宣伟投资管理有限公司 制备用于容器和其它制品的组合物的方法以及使用所述组合物的方法
WO2016088832A1 (ja) * 2014-12-04 2016-06-09 積水化学工業株式会社 硬化性組成物、硬化性組成物の製造方法及び半導体装置
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
KR102268270B1 (ko) * 2018-01-23 2021-06-23 주식회사 엘지화학 접착제 조성물
MY204004A (en) 2018-12-17 2024-07-31 Nippon Steel Corp Adhesively-laminated core, manufacturing method thereof, and electric motor
EP3902104A4 (en) 2018-12-17 2022-10-05 Nippon Steel Corporation LAMINATED CORE AND ROTATING ELECTRICAL MACHINE
CA3131673C (en) * 2018-12-17 2024-02-20 Nippon Steel Corporation Laminated core, method of manufacturing same, and electric motor
PL3902105T3 (pl) 2018-12-17 2024-12-02 Nippon Steel Corporation Laminowany rdzeń oraz wirująca maszyna elektryczna
CN113169594B (zh) 2018-12-17 2025-08-12 日本制铁株式会社 层叠铁芯以及旋转电机
EP3902123B1 (en) * 2018-12-17 2025-10-29 Nippon Steel Corporation Laminated core, laminated core manufacturing method, and electric motor
EA202192072A1 (ru) 2018-12-17 2021-11-09 Ниппон Стил Корпорейшн Шихтованный сердечник и электродвигатель
TWI744743B (zh) 2018-12-17 2021-11-01 日商日本製鐵股份有限公司 積層鐵芯及旋轉電機
US11990795B2 (en) 2018-12-17 2024-05-21 Nippon Steel Corporation Adhesively-laminated core for stator, method of manufacturing same, and electric motor
EP3902120A4 (en) 2018-12-17 2022-10-05 Nippon Steel Corporation STACKED CORE AND ROTATING ELECTRICAL MACHINE
EA202192059A1 (ru) 2018-12-17 2021-12-31 Ниппон Стил Корпорейшн Клеено-шихтованный сердечник для статора и электродвигатель
EP3902109A4 (en) 2018-12-17 2022-10-05 Nippon Steel Corporation LAMINATED CORE AND ROTARY MACHINE
JP7515403B2 (ja) 2018-12-17 2024-07-12 日本製鉄株式会社 ステータ用接着積層コア、その製造方法、および回転電機
CA3131358A1 (en) 2018-12-17 2020-06-25 Nippon Steel Corporation Laminated core, core block, electric motor and method of producing core block
RS67409B1 (sr) 2018-12-17 2025-12-31 Nippon Steel Corp Lepljivo laminirano jezgro za stator i električni motor
MY207178A (en) 2018-12-17 2025-02-04 Nippon Steel Corp Laminated core and electric motor
WO2020129937A1 (ja) 2018-12-17 2020-06-25 日本製鉄株式会社 積層コアおよび回転電機

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
WO2008010555A1 (fr) * 2006-07-20 2008-01-24 Sekisui Chemical Co., Ltd. Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5827632A (en) * 1994-12-05 1998-10-27 Canon Kabushiki Kaisha Toner for developing electrostatic image containing hydrophobized inorganic fine powder
JP3521373B2 (ja) * 1996-03-29 2004-04-19 コニカミノルタホールディングス株式会社 フルカラー電子写真用トナーキット
KR100435515B1 (ko) * 1998-04-21 2004-06-10 니혼유시비에이에스에프코팅즈 가부시키가이샤 오염방지처리물품
JP2000178342A (ja) 1998-12-17 2000-06-27 Sumitomo Bakelite Co Ltd 絶縁ペースト
CN101010364B (zh) * 2004-09-02 2011-07-27 株式会社日本触媒 吸水性材料、用于表面交联的吸水性树脂的生产方法以及用于吸水性材料的评价方法
JP2006181838A (ja) * 2004-12-27 2006-07-13 Fuji Photo Film Co Ltd 平版印刷版原版
CN101103314B (zh) * 2005-10-26 2010-11-24 佳能株式会社 调色剂

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
WO2008010555A1 (fr) * 2006-07-20 2008-01-24 Sekisui Chemical Co., Ltd. Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11260046B2 (en) 2002-03-20 2022-03-01 Amgen Inc. (+)-2-[1-(3-Ethoxy-4- methoxyphenyl)-2-methylsulfonylethyl]- 4-acetylaminoisoindoline-1,3-dione: methods of using and compositions thereof
US11040024B2 (en) 2002-03-20 2021-06-22 Amgen Inc. Methods of using (+)-2-[1-(3-ethoxy-4-methoxyphenyl)-2-methylsulfonylethyl]-4-acetylaminoisoindoline-1,3-dione
WO2010087444A1 (ja) * 2009-01-29 2010-08-05 積水化学工業株式会社 電子部品用接着剤
JP4729130B2 (ja) * 2009-01-29 2011-07-20 積水化学工業株式会社 電子部品用接着剤
CN102292407B (zh) * 2009-01-29 2014-01-01 积水化学工业株式会社 电子零件用胶粘剂
US8901207B2 (en) 2009-01-29 2014-12-02 Sekisui Chemical Co., Ltd. Adhesive for electronic components
TWI481685B (zh) * 2009-01-29 2015-04-21 積水化學工業股份有限公司 Adhesive for electronic parts
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
TWI704649B (zh) * 2014-07-18 2020-09-11 日商積水化學工業股份有限公司 半導體元件保護用材料及半導體裝置
WO2016010067A1 (ja) * 2014-07-18 2016-01-21 積水化学工業株式会社 半導体素子保護用材料及び半導体装置
JP2017041633A (ja) * 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
WO2017170492A1 (ja) * 2016-03-30 2017-10-05 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP6232167B1 (ja) * 2016-03-30 2017-11-15 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP2018031019A (ja) * 2016-03-30 2018-03-01 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP2017179154A (ja) * 2016-03-30 2017-10-05 株式会社日本触媒 ブロック共重合体及び樹脂組成物
JP7028545B2 (ja) 2016-03-30 2022-03-02 株式会社日本触媒 ブロック共重合体及び樹脂組成物

Also Published As

Publication number Publication date
US20100197830A1 (en) 2010-08-05
US7838577B2 (en) 2010-11-23
KR20100018624A (ko) 2010-02-17
TW200911946A (en) 2009-03-16
CN101755328B (zh) 2011-08-31
CN101755328A (zh) 2010-06-23
JPWO2009011383A1 (ja) 2010-09-24
TWI321148B (https=) 2010-03-01
KR100988184B1 (ko) 2010-10-18
JP4376957B2 (ja) 2009-12-02

Similar Documents

Publication Publication Date Title
WO2009011383A1 (ja) 電子部品用接着剤
WO2009069974A3 (en) Coating composition and coating film having enhanced abrasion resistance and fingerprint traces removability
WO2006069376A3 (en) Improved superprimer
WO2008133108A1 (ja) エポキシシリコーン及びその製造方法、並びに、それを用いた硬化性樹脂組成物とその用途
WO2008000457A3 (de) Hydrophob beschichtetes molekularsieb
WO2008133253A1 (ja) 異方導電性フィルム及び接続構造体
WO2004110671A3 (de) Antiadhäsive hochtemperaturschichten
WO2008046166A3 (en) Use of a marine anti-biofouling and fouling release coating composition
WO2006075774A8 (en) Threaded joint for steel pipes
WO2008131985A3 (de) Biozide zusammensetzung, sowie harzzusammensetzungen, kompositmaterialien und laminate, die diese enthalten
WO2007121110A3 (en) Flooring substrate having a coating of a curable composition
WO2007017195A3 (de) Metalleffektpigmente mit anorganisch/organischer mischschicht, verfahren zur herstellung solcher metalleffektpigmente und deren verwendung
WO2007064895A3 (en) Polymer compositions, coatings and devices, and methods of making and using the same
WO2009032062A3 (en) Conductive composite compositions with fillers
MXPA04003586A (es) Composiciones de recubrimiento transportadas por agua, que contienen materiales dispersados con materiales de carbamato solubles en agua.
WO2009076609A3 (en) Glycidyl carbamate coatings having improved corrosion resistance
WO2007138399A3 (en) Heat-curable powder coating composition
WO2009086515A3 (en) Protective coating compositions
WO2009038960A3 (en) Flexible epoxy-based compositions
WO2008118567A3 (en) Polythioether amine resins and compositions comprising same
WO2009117334A3 (en) Powder coating composition for metal deposition
WO2011163100A3 (en) Powder coatings compositions
WO2009014115A1 (ja) 電子部品用接着剤、半導体チップの積層方法及び半導体装置
WO2009060708A1 (ja) 新規樹脂組成物およびこれを含有する複合材料、並びにその利用
EP1958991A3 (en) Water-based anti-fouling paint composition

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880024920.X

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2008534590

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08791260

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20107001276

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 12669081

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 08791260

Country of ref document: EP

Kind code of ref document: A1