TW200911946A - Adhesive for electronic component - Google Patents

Adhesive for electronic component Download PDF

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Publication number
TW200911946A
TW200911946A TW097127275A TW97127275A TW200911946A TW 200911946 A TW200911946 A TW 200911946A TW 097127275 A TW097127275 A TW 097127275A TW 97127275 A TW97127275 A TW 97127275A TW 200911946 A TW200911946 A TW 200911946A
Authority
TW
Taiwan
Prior art keywords
value
fine particles
inorganic fine
adhesive
less
Prior art date
Application number
TW097127275A
Other languages
English (en)
Chinese (zh)
Other versions
TWI321148B (https=
Inventor
Akinobu Hayakawa
Hideaki Ishizawa
Kohei Takeda
Ryohei Masui
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200911946A publication Critical patent/TW200911946A/zh
Application granted granted Critical
Publication of TWI321148B publication Critical patent/TWI321148B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
TW097127275A 2007-07-19 2008-07-18 Adhesive for electronic component TW200911946A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007188623 2007-07-19

Publications (2)

Publication Number Publication Date
TW200911946A true TW200911946A (en) 2009-03-16
TWI321148B TWI321148B (https=) 2010-03-01

Family

ID=40259715

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097127275A TW200911946A (en) 2007-07-19 2008-07-18 Adhesive for electronic component

Country Status (6)

Country Link
US (1) US7838577B2 (https=)
JP (1) JP4376957B2 (https=)
KR (1) KR100988184B1 (https=)
CN (1) CN101755328B (https=)
TW (1) TW200911946A (https=)
WO (1) WO2009011383A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI630252B (zh) * 2016-03-30 2018-07-21 日商積水化學工業股份有限公司 電感器用接著劑以及電感器
TWI653714B (zh) 2014-07-18 2019-03-11 Sekisui Chemical Co., Ltd. 半導體元件保護用材料及半導體裝置
TWI682958B (zh) * 2014-12-04 2020-01-21 日商積水化學工業股份有限公司 硬化性組合物、硬化性組合物之製造方法及半導體裝置

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* Cited by examiner, † Cited by third party
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US6962940B2 (en) 2002-03-20 2005-11-08 Celgene Corporation (+)-2-[1-(3-Ethoxy-4-methoxyphenyl)-2-methylsulfonylethyl]-4-acetylaminoisoindoline-1,3-dione: methods of using and compositions thereof
TWI435887B (zh) * 2008-02-26 2014-05-01 Toray Industries 環氧樹脂組成物、預浸透物及纖維強化複合材料
CN102292407B (zh) * 2009-01-29 2014-01-01 积水化学工业株式会社 电子零件用胶粘剂
EP2558543B1 (en) 2010-04-16 2017-08-30 Valspar Sourcing, Inc. Coating compositions for packaging articles and methods of coating
JP5527816B2 (ja) * 2010-06-22 2014-06-25 信越化学工業株式会社 ダイボンド剤組成物及び半導体装置。
EP3878912B1 (en) 2011-02-07 2023-04-05 Swimc Llc Coating compositions for containers and other articles and methods of coating
DE112012004032A5 (de) * 2011-09-27 2014-07-24 Rupprecht Gabriel Elektrisch isolierendes Harz-Gehäuse für Halbleiterbauelemente oder Baugruppen und Herstellungsverfahren mit einem Mold-Prozess
AU2013299578A1 (en) 2012-08-09 2015-02-19 Valspar Sourcing, Inc. Compositions for containers and other articles and methods of using same
EP2882658B1 (en) 2012-08-09 2021-09-08 Swimc Llc Container coating system
CN110790914A (zh) 2014-04-14 2020-02-14 宣伟投资管理有限公司 制备用于容器和其它制品的组合物的方法以及使用所述组合物的方法
JP2017041633A (ja) * 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
JP7028545B2 (ja) * 2016-03-30 2022-03-02 株式会社日本触媒 ブロック共重合体及び樹脂組成物
KR102268270B1 (ko) * 2018-01-23 2021-06-23 주식회사 엘지화학 접착제 조성물
MY204004A (en) 2018-12-17 2024-07-31 Nippon Steel Corp Adhesively-laminated core, manufacturing method thereof, and electric motor
EP3902104A4 (en) 2018-12-17 2022-10-05 Nippon Steel Corporation LAMINATED CORE AND ROTATING ELECTRICAL MACHINE
CA3131673C (en) * 2018-12-17 2024-02-20 Nippon Steel Corporation Laminated core, method of manufacturing same, and electric motor
PL3902105T3 (pl) 2018-12-17 2024-12-02 Nippon Steel Corporation Laminowany rdzeń oraz wirująca maszyna elektryczna
CN113169594B (zh) 2018-12-17 2025-08-12 日本制铁株式会社 层叠铁芯以及旋转电机
EP3902123B1 (en) * 2018-12-17 2025-10-29 Nippon Steel Corporation Laminated core, laminated core manufacturing method, and electric motor
EA202192072A1 (ru) 2018-12-17 2021-11-09 Ниппон Стил Корпорейшн Шихтованный сердечник и электродвигатель
TWI744743B (zh) 2018-12-17 2021-11-01 日商日本製鐵股份有限公司 積層鐵芯及旋轉電機
US11990795B2 (en) 2018-12-17 2024-05-21 Nippon Steel Corporation Adhesively-laminated core for stator, method of manufacturing same, and electric motor
EP3902120A4 (en) 2018-12-17 2022-10-05 Nippon Steel Corporation STACKED CORE AND ROTATING ELECTRICAL MACHINE
EA202192059A1 (ru) 2018-12-17 2021-12-31 Ниппон Стил Корпорейшн Клеено-шихтованный сердечник для статора и электродвигатель
EP3902109A4 (en) 2018-12-17 2022-10-05 Nippon Steel Corporation LAMINATED CORE AND ROTARY MACHINE
JP7515403B2 (ja) 2018-12-17 2024-07-12 日本製鉄株式会社 ステータ用接着積層コア、その製造方法、および回転電機
CA3131358A1 (en) 2018-12-17 2020-06-25 Nippon Steel Corporation Laminated core, core block, electric motor and method of producing core block
RS67409B1 (sr) 2018-12-17 2025-12-31 Nippon Steel Corp Lepljivo laminirano jezgro za stator i električni motor
MY207178A (en) 2018-12-17 2025-02-04 Nippon Steel Corp Laminated core and electric motor
WO2020129937A1 (ja) 2018-12-17 2020-06-25 日本製鉄株式会社 積層コアおよび回転電機

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5827632A (en) * 1994-12-05 1998-10-27 Canon Kabushiki Kaisha Toner for developing electrostatic image containing hydrophobized inorganic fine powder
JP3521373B2 (ja) * 1996-03-29 2004-04-19 コニカミノルタホールディングス株式会社 フルカラー電子写真用トナーキット
KR100435515B1 (ko) * 1998-04-21 2004-06-10 니혼유시비에이에스에프코팅즈 가부시키가이샤 오염방지처리물품
JP2000178342A (ja) 1998-12-17 2000-06-27 Sumitomo Bakelite Co Ltd 絶縁ペースト
JP4299685B2 (ja) 2004-01-27 2009-07-22 積水化学工業株式会社 半導体装置
CN101010364B (zh) * 2004-09-02 2011-07-27 株式会社日本触媒 吸水性材料、用于表面交联的吸水性树脂的生产方法以及用于吸水性材料的评价方法
JP2006181838A (ja) * 2004-12-27 2006-07-13 Fuji Photo Film Co Ltd 平版印刷版原版
CN101103314B (zh) * 2005-10-26 2010-11-24 佳能株式会社 调色剂
JP2007169448A (ja) 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
EP2045839A4 (en) * 2006-07-20 2009-08-05 Sekisui Chemical Co Ltd GLUE FOR ELECTRONIC COMPONENTS, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP LAMINATE AND SEMICONDUCTOR ARRANGEMENT

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI653714B (zh) 2014-07-18 2019-03-11 Sekisui Chemical Co., Ltd. 半導體元件保護用材料及半導體裝置
TWI682958B (zh) * 2014-12-04 2020-01-21 日商積水化學工業股份有限公司 硬化性組合物、硬化性組合物之製造方法及半導體裝置
TWI630252B (zh) * 2016-03-30 2018-07-21 日商積水化學工業股份有限公司 電感器用接著劑以及電感器

Also Published As

Publication number Publication date
US20100197830A1 (en) 2010-08-05
US7838577B2 (en) 2010-11-23
KR20100018624A (ko) 2010-02-17
WO2009011383A1 (ja) 2009-01-22
CN101755328B (zh) 2011-08-31
CN101755328A (zh) 2010-06-23
JPWO2009011383A1 (ja) 2010-09-24
TWI321148B (https=) 2010-03-01
KR100988184B1 (ko) 2010-10-18
JP4376957B2 (ja) 2009-12-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees