KR100988184B1 - 전자 부품용 접착제 - Google Patents

전자 부품용 접착제 Download PDF

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Publication number
KR100988184B1
KR100988184B1 KR1020107001276A KR20107001276A KR100988184B1 KR 100988184 B1 KR100988184 B1 KR 100988184B1 KR 1020107001276 A KR1020107001276 A KR 1020107001276A KR 20107001276 A KR20107001276 A KR 20107001276A KR 100988184 B1 KR100988184 B1 KR 100988184B1
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KR
South Korea
Prior art keywords
inorganic fine
value
adhesive
less
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020107001276A
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English (en)
Korean (ko)
Other versions
KR20100018624A (ko
Inventor
아키노부 하야카와
히데아키 이시자와
고헤이 다케다
료헤이 마스이
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20100018624A publication Critical patent/KR20100018624A/ko
Application granted granted Critical
Publication of KR100988184B1 publication Critical patent/KR100988184B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
KR1020107001276A 2007-07-19 2008-07-17 전자 부품용 접착제 Expired - Fee Related KR100988184B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-188623 2007-07-19
JP2007188623 2007-07-19

Publications (2)

Publication Number Publication Date
KR20100018624A KR20100018624A (ko) 2010-02-17
KR100988184B1 true KR100988184B1 (ko) 2010-10-18

Family

ID=40259715

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107001276A Expired - Fee Related KR100988184B1 (ko) 2007-07-19 2008-07-17 전자 부품용 접착제

Country Status (6)

Country Link
US (1) US7838577B2 (https=)
JP (1) JP4376957B2 (https=)
KR (1) KR100988184B1 (https=)
CN (1) CN101755328B (https=)
TW (1) TW200911946A (https=)
WO (1) WO2009011383A1 (https=)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6962940B2 (en) 2002-03-20 2005-11-08 Celgene Corporation (+)-2-[1-(3-Ethoxy-4-methoxyphenyl)-2-methylsulfonylethyl]-4-acetylaminoisoindoline-1,3-dione: methods of using and compositions thereof
TWI435887B (zh) * 2008-02-26 2014-05-01 Toray Industries 環氧樹脂組成物、預浸透物及纖維強化複合材料
JP4729130B2 (ja) * 2009-01-29 2011-07-20 積水化学工業株式会社 電子部品用接着剤
EP2558543B1 (en) 2010-04-16 2017-08-30 Valspar Sourcing, Inc. Coating compositions for packaging articles and methods of coating
JP5527816B2 (ja) * 2010-06-22 2014-06-25 信越化学工業株式会社 ダイボンド剤組成物及び半導体装置。
PL3425011T3 (pl) 2011-02-07 2021-05-17 Swimc Llc Kompozycje powłokowe do pojemników i innych wyrobów i sposoby powlekania
WO2013061183A1 (de) * 2011-09-27 2013-05-02 Rupprecht Gabriel Elektrisch isolierendes harz - gehäuse für halbleiterbauelemente oder baugruppen und herstellungsverfahren mit einem moldprozess
RU2618704C2 (ru) 2012-08-09 2017-05-11 Вэлспар Сорсинг, Инк. Композиции для контейнеров и других изделий и способы их применения
WO2014025411A1 (en) 2012-08-09 2014-02-13 Valspar Sourcing, Inc. Container coating system
KR102429146B1 (ko) 2014-04-14 2022-08-04 에스더블유아이엠씨 엘엘씨 용기 및 기타 물품용 조성물의 제조방법 및 상기 조성물의 사용 방법
KR101808472B1 (ko) 2014-07-18 2017-12-12 세키스이가가쿠 고교가부시키가이샤 반도체 소자 보호용 재료 및 반도체 장치
JP6093880B2 (ja) * 2014-12-04 2017-03-08 積水化学工業株式会社 硬化性組成物、硬化性組成物の製造方法及び半導体装置
JP2017041633A (ja) * 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
KR102195623B1 (ko) * 2016-03-30 2020-12-28 세키스이가가쿠 고교가부시키가이샤 인덕터용 접착제 및 인덕터
JP7028545B2 (ja) * 2016-03-30 2022-03-02 株式会社日本触媒 ブロック共重合体及び樹脂組成物
KR102268270B1 (ko) * 2018-01-23 2021-06-23 주식회사 엘지화학 접착제 조성물
JP7515403B2 (ja) 2018-12-17 2024-07-12 日本製鉄株式会社 ステータ用接着積層コア、その製造方法、および回転電機
PL3902107T3 (pl) * 2018-12-17 2026-03-09 Nippon Steel Corporation Laminowany rdzeń, sposób jego wytwarzania i silnik elektryczny
JP7055209B2 (ja) 2018-12-17 2022-04-15 日本製鉄株式会社 積層コアおよび回転電機
RS66007B1 (sr) 2018-12-17 2024-10-31 Nippon Steel Corp Laminirano jezgro i rotaciona električna mašina
CN113196634B (zh) 2018-12-17 2024-10-18 日本制铁株式会社 层叠铁芯及旋转电机
KR102631738B1 (ko) * 2018-12-17 2024-02-01 닛폰세이테츠 가부시키가이샤 적층 코어, 적층 코어의 제조 방법 및 회전 전기 기기
CN113228468B (zh) 2018-12-17 2025-04-11 日本制铁株式会社 定子用粘接层叠铁芯、其制造方法及旋转电机
MY206339A (en) 2018-12-17 2024-12-12 Nippon Steel Corp Laminated core, core block, electric motor and method of producing core block
SG11202108950YA (en) 2018-12-17 2021-09-29 Nippon Steel Corp Adhesively-laminated core for stator and electric motor
WO2020129926A1 (ja) 2018-12-17 2020-06-25 日本製鉄株式会社 積層コアおよび回転電機
TWI724690B (zh) 2018-12-17 2021-04-11 日商日本製鐵股份有限公司 積層鐵芯及旋轉電機
EP3902120A4 (en) 2018-12-17 2022-10-05 Nippon Steel Corporation STACKED CORE AND ROTATING ELECTRICAL MACHINE
KR102607691B1 (ko) 2018-12-17 2023-11-30 닛폰세이테츠 가부시키가이샤 스테이터용 접착 적층 코어 및 회전 전기 기계
EA202192064A1 (ru) 2018-12-17 2021-11-24 Ниппон Стил Корпорейшн Шихтованный сердечник и электродвигатель
TWI732384B (zh) 2018-12-17 2021-07-01 日商日本製鐵股份有限公司 積層鐵芯及旋轉電機
EP3902106B1 (en) 2018-12-17 2025-10-29 Nippon Steel Corporation Adhesively laminated core for stator, method of manufacturing the same, and electric motor
EP3902110B1 (en) 2018-12-17 2026-01-28 Nippon Steel Corporation Laminated core and electric motor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5827632A (en) * 1994-12-05 1998-10-27 Canon Kabushiki Kaisha Toner for developing electrostatic image containing hydrophobized inorganic fine powder
JP3521373B2 (ja) * 1996-03-29 2004-04-19 コニカミノルタホールディングス株式会社 フルカラー電子写真用トナーキット
EP0992549B1 (en) * 1998-04-21 2004-10-06 BASF NOF Coatings Co., Ltd., Antifouling agent, method for antifouling treatment, and article obtained through antifouling treatment
JP2000178342A (ja) 1998-12-17 2000-06-27 Sumitomo Bakelite Co Ltd 絶縁ペースト
KR100944467B1 (ko) * 2004-09-02 2010-03-03 니폰 쇼쿠바이 컴파니 리미티드 흡수성 물질, 표면 가교된 흡수성 수지의 제조 방법, 및흡수성 물질의 평가 방법
JP2006181838A (ja) * 2004-12-27 2006-07-13 Fuji Photo Film Co Ltd 平版印刷版原版
KR101031973B1 (ko) * 2005-10-26 2011-04-29 캐논 가부시끼가이샤 토너
US7915743B2 (en) * 2006-07-20 2011-03-29 Sekisui Chemical Co., Ltd. Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
US7838577B2 (en) 2010-11-23
WO2009011383A1 (ja) 2009-01-22
US20100197830A1 (en) 2010-08-05
JPWO2009011383A1 (ja) 2010-09-24
TWI321148B (https=) 2010-03-01
TW200911946A (en) 2009-03-16
CN101755328B (zh) 2011-08-31
CN101755328A (zh) 2010-06-23
KR20100018624A (ko) 2010-02-17
JP4376957B2 (ja) 2009-12-02

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