WO2009011302A1 - Ｌｅｄモジュールおよびｌｅｄドットマトリクス表示装置 - Google Patents

Ｌｅｄモジュールおよびｌｅｄドットマトリクス表示装置 Download PDF

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Publication number
WO2009011302A1
WO2009011302A1 PCT/JP2008/062566 JP2008062566W WO2009011302A1 WO 2009011302 A1 WO2009011302 A1 WO 2009011302A1 JP 2008062566 W JP2008062566 W JP 2008062566W WO 2009011302 A1 WO2009011302 A1 WO 2009011302A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
module
dot matrix
matrix display
led module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062566
Other languages
English (en)
French (fr)
Inventor
Taisuke Okada
Jun Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US12/668,803 priority Critical patent/US8421093B2/en
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2009523629A priority patent/JP5368987B2/ja
Publication of WO2009011302A1 publication Critical patent/WO2009011302A1/ja
Anticipated expiration legal-status Critical
Priority to US13/796,402 priority patent/US8835946B2/en
Priority to US14/461,871 priority patent/US10147759B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)

Abstract

　ＬＥＤモジュールＡ１は、ＬＥＤチップ３Ｒ，３Ｇ，３Ｂと、ＬＥＤチップ３Ｒ，３Ｇ，３Ｂが搭載されたモジュール基板１と、を備えており、ＬＥＤチップ３Ｒには、ワイヤ４Ｒが接続されており、ＬＥＤチップ３Ｇ，３Ｂは、ワイヤ４Ｒを挟んで配置されている。これにより、ＬＥＤモジュールＡ１の小型化を図るとともに、赤色光、緑色光、青色光を適切に混色させることができる。
PCT/JP2008/062566 2007-07-13 2008-07-11 Ｌｅｄモジュールおよびｌｅｄドットマトリクス表示装置 Ceased WO2009011302A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/668,803 US8421093B2 (en) 2007-07-13 2008-06-11 LED module and LED dot matrix display
JP2009523629A JP5368987B2 (ja) 2007-07-13 2008-07-11 Ｌｅｄモジュールおよびｌｅｄドットマトリクス表示装置
US13/796,402 US8835946B2 (en) 2007-07-13 2013-03-12 LED module and LED dot matrix display
US14/461,871 US10147759B2 (en) 2007-07-13 2014-08-18 LED module and LED dot matrix display

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007184095 2007-07-13
JP2007-184094 2007-07-13
JP2007184094 2007-07-13
JP2007-184095 2007-07-13
JP2007328169 2007-12-20
JP2007-328169 2007-12-20

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/668,803 A-371-Of-International US8421093B2 (en) 2007-07-13 2008-06-11 LED module and LED dot matrix display
US13/796,402 Continuation US8835946B2 (en) 2007-07-13 2013-03-12 LED module and LED dot matrix display

Publications (1)

Publication Number Publication Date
WO2009011302A1 true WO2009011302A1 (ja) 2009-01-22

Family

ID=40259635

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062566 Ceased WO2009011302A1 (ja) 2007-07-13 2008-07-11 Ｌｅｄモジュールおよびｌｅｄドットマトリクス表示装置

Country Status (3)

Country Link
US (3) US8421093B2 (ja)
JP (1) JP5368987B2 (ja)
WO (1) WO2009011302A1 (ja)

Cited By (16)

* Cited by examiner, † Cited by third party
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US20110291124A1 (en) * 2009-02-05 2011-12-01 Koninklijke Philips Electronics N.V. Improved Packaging for LED Combinations
JP2012169326A (ja) * 2011-02-10 2012-09-06 Rohm Co Ltd Ｌｅｄ照明ユニット、ｌｅｄ照明装置、およびｌｅｄ照明システム
WO2013175990A1 (ja) * 2012-05-23 2013-11-28 船井電機株式会社 照明装置
JP2016015489A (ja) * 2014-06-30 2016-01-28 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光ダイオードデバイス
JP2016021554A (ja) * 2014-06-16 2016-02-04 シチズン電子株式会社 Ｌｅｄ発光装置
JP2016127059A (ja) * 2014-12-26 2016-07-11 日亜化学工業株式会社 発光装置
KR20170101064A (ko) * 2016-02-26 2017-09-05 엘지이노텍 주식회사 발광소자 패키지, 발광모듈 및 이를 포함하는 디스플레이 장치
JP2017212354A (ja) * 2016-05-26 2017-11-30 ローム株式会社 Ｌｅｄモジュール
CN108511431A (zh) * 2018-05-21 2018-09-07 佛山市国星光电股份有限公司 一种led显示单元组及显示面板
JP2018207063A (ja) * 2017-06-09 2018-12-27 ローム株式会社 光学装置
JP2019204905A (ja) * 2018-05-24 2019-11-28 大日本印刷株式会社 自発光型表示体
JPWO2021192788A1 (ja) * 2020-03-23 2021-09-30
US11366261B2 (en) 2019-12-26 2022-06-21 Nichia Corporation Light source device
JP2022103204A (ja) * 2018-05-24 2022-07-07 大日本印刷株式会社 自発光型表示体
JP2023510810A (ja) * 2020-01-09 2023-03-15 ソウル セミコンダクター カンパニー リミテッド 表示装置
JP2023088914A (ja) * 2022-04-26 2023-06-27 大日本印刷株式会社 自発光型表示体

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WO2011033433A1 (en) * 2009-09-17 2011-03-24 Koninklijke Philips Electronics N.V. Light-source module and light-emitting device
US9722157B2 (en) 2010-04-09 2017-08-01 Rohm Co., Ltd. LED module
DE102011003608A1 (de) * 2010-08-20 2012-02-23 Tridonic Gmbh & Co. Kg Gehäustes LED-Modul
CN102403306B (zh) * 2010-09-10 2015-09-02 展晶科技(深圳)有限公司 发光二极管封装结构
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JP2013026510A (ja) * 2011-07-22 2013-02-04 Rohm Co Ltd Ｌｅｄモジュールおよびｌｅｄモジュールの実装構造
TWI495056B (zh) * 2012-04-24 2015-08-01 新世紀光電股份有限公司 基板結構
USD709464S1 (en) 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
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US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
JP2014220287A (ja) * 2013-05-02 2014-11-20 アルプス電気株式会社 樹脂封止品及び樹脂封止品の製造方法
CN104979338B (zh) * 2014-04-10 2018-07-27 光宝光电(常州)有限公司 发光二极管封装结构
US9741286B2 (en) 2014-06-03 2017-08-22 Apple Inc. Interactive display panel with emitting and sensing diodes
US9570002B2 (en) * 2014-06-17 2017-02-14 Apple Inc. Interactive display panel with IR diodes
JP2016167518A (ja) * 2015-03-09 2016-09-15 パナソニックＩｐマネジメント株式会社 発光装置、及び、照明装置
JP1553788S (ja) * 2015-11-05 2016-07-11
KR102455084B1 (ko) * 2016-02-23 2022-10-14 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 이를 갖는 표시장치
JP6796400B2 (ja) * 2016-05-31 2020-12-09 デクセリアルズ株式会社 発光装置、及び発光装置の製造方法
JP6693370B2 (ja) * 2016-09-21 2020-05-13 豊田合成株式会社 発光装置
WO2018100252A1 (fr) 2016-12-01 2018-06-07 Lrx Investissement Mode d'adressage et principe de réalisation d'écrans matriciels d'affichage d'images couleur a comportement quasi-statique
US10256218B2 (en) * 2017-07-11 2019-04-09 Samsung Electronics Co., Ltd. Light emitting device package
JP7194518B2 (ja) * 2018-05-31 2022-12-22 浜松ホトニクス株式会社 電子部品、電子部品の製造方法、電子装置
WO2021018646A1 (en) * 2019-07-30 2021-02-04 Signify Holding B.V. Color controllable led filament and lamp with such a filament
US11438991B2 (en) 2020-01-21 2022-09-06 Brightlogic, Inc. Light emitting diode package and electronic display
CN112289780A (zh) * 2020-10-14 2021-01-29 深圳市同一方光电技术有限公司 Led封装结构、加工方法、灯带及灯具
CN115692388A (zh) * 2021-07-26 2023-02-03 王定锋 一种rgb led灯珠
CN115708207A (zh) * 2021-08-18 2023-02-21 王定锋 用于led显示屏的led灯珠和led模组
USD1117119S1 (en) * 2023-03-20 2026-03-10 Rohm Co., Ltd. Light-emitting semiconductor module
CN121285132A (zh) * 2024-07-11 2026-01-06 泉州三安半导体科技有限公司 一种发光装置及显示装置
CN118969786B (zh) * 2024-07-30 2025-10-21 泉州三安半导体科技有限公司 一种发光装置及显示装置

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Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110291124A1 (en) * 2009-02-05 2011-12-01 Koninklijke Philips Electronics N.V. Improved Packaging for LED Combinations
JP2012169326A (ja) * 2011-02-10 2012-09-06 Rohm Co Ltd Ｌｅｄ照明ユニット、ｌｅｄ照明装置、およびｌｅｄ照明システム
WO2013175990A1 (ja) * 2012-05-23 2013-11-28 船井電機株式会社 照明装置
JP2016021554A (ja) * 2014-06-16 2016-02-04 シチズン電子株式会社 Ｌｅｄ発光装置
JP2016015489A (ja) * 2014-06-30 2016-01-28 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光ダイオードデバイス
JP2016127059A (ja) * 2014-12-26 2016-07-11 日亜化学工業株式会社 発光装置
US10283489B2 (en) 2014-12-26 2019-05-07 Nichia Corporation Light emitting device
KR20170101064A (ko) * 2016-02-26 2017-09-05 엘지이노텍 주식회사 발광소자 패키지, 발광모듈 및 이를 포함하는 디스플레이 장치
KR102522798B1 (ko) 2016-02-26 2023-04-18 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지, 발광모듈 및 이를 포함하는 디스플레이 장치
JP2017212354A (ja) * 2016-05-26 2017-11-30 ローム株式会社 Ｌｅｄモジュール
JP2018207063A (ja) * 2017-06-09 2018-12-27 ローム株式会社 光学装置
JP7004397B2 (ja) 2017-06-09 2022-01-21 ローム株式会社 光学装置
JP2019204072A (ja) * 2018-05-21 2019-11-28 佛山市国星光電股▲ふん▼有限公司 Ｌｅｄ表示セル及び表示パネル
CN108511431A (zh) * 2018-05-21 2018-09-07 佛山市国星光电股份有限公司 一种led显示单元组及显示面板
JP7067269B6 (ja) 2018-05-24 2023-12-20 大日本印刷株式会社 自発光型表示体
JP7067269B2 (ja) 2018-05-24 2022-05-16 大日本印刷株式会社 自発光型表示体
JP2022103204A (ja) * 2018-05-24 2022-07-07 大日本印刷株式会社 自発光型表示体
JP7243897B2 (ja) 2018-05-24 2023-03-22 大日本印刷株式会社 自発光型表示体
JP2019204905A (ja) * 2018-05-24 2019-11-28 大日本印刷株式会社 自発光型表示体
US11366261B2 (en) 2019-12-26 2022-06-21 Nichia Corporation Light source device
JP2023510810A (ja) * 2020-01-09 2023-03-15 ソウル セミコンダクター カンパニー リミテッド 表示装置
JP7750842B2 (ja) 2020-01-09 2025-10-07 ソウル セミコンダクター カンパニー リミテッド 表示装置
JPWO2021192788A1 (ja) * 2020-03-23 2021-09-30
JP7534385B2 (ja) 2020-03-23 2024-08-14 ローム株式会社 半導体装置
US12568830B2 (en) 2020-03-23 2026-03-03 Rohm Co., Ltd. Semiconductor device with x-shaped die pad to reduce thermal stress and ion migration from bonding layer
JP2023088914A (ja) * 2022-04-26 2023-06-27 大日本印刷株式会社 自発光型表示体
JP7444309B2 (ja) 2022-04-26 2024-03-06 大日本印刷株式会社 自発光型表示体

Also Published As

Publication number Publication date
US20140353697A1 (en) 2014-12-04
US10147759B2 (en) 2018-12-04
US8835946B2 (en) 2014-09-16
JPWO2009011302A1 (ja) 2010-09-24
US8421093B2 (en) 2013-04-16
JP5368987B2 (ja) 2013-12-18
US20130234175A1 (en) 2013-09-12
US20100277919A1 (en) 2010-11-04

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