CN201956349U - 分离式全彩贴片发光二极管 - Google Patents

分离式全彩贴片发光二极管 Download PDF

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CN201956349U
CN201956349U CN2011200237131U CN201120023713U CN201956349U CN 201956349 U CN201956349 U CN 201956349U CN 2011200237131 U CN2011200237131 U CN 2011200237131U CN 201120023713 U CN201120023713 U CN 201120023713U CN 201956349 U CN201956349 U CN 201956349U
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李革胜
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ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Abstract

本实用新型公开了一种分离式全彩贴片发光二极管，包括封装体、焊盘、红色晶片、绿色晶片、蓝色晶片和6个引脚，所述的封装体包括封装腔，所述的焊盘包括固晶焊盘和非固晶焊盘，所述的红色晶片、绿色晶片、蓝色晶片按直线排列。本实用新型无论是从正面观察还是从侧面观察，按直线排列的红色晶片、绿色晶片和蓝色晶片与观察者眼睛的距离相同，不会出现混光颜色的差异，应用到显示屏上时，不会产生偏色现象。

Description

分离式全彩贴片发光二极管
[技术领域]
本实用新型涉及发光二极管，尤其涉及一种分离式全彩贴片发光二极管。
[背景技术]
如图1所示，传统的分离式全彩贴片发光二极管包括封装体、6个电源引脚，在封装体腔体底部的固晶焊盘上布置红色晶片1、绿色晶片2和蓝色晶片3，红色晶片1、绿色晶片2和蓝色晶片3呈品字形分布。蓝色晶片3红色晶片1、绿色晶片2和蓝色晶片3品字形的布置方式使得二极管发光时的混光效果有一定的局限性。在正面观察时混光效果较好，但从左、右侧面观察时会发现混光颜色有差异。原因是传统全彩贴片发光二极管的晶片呈品字型排列，人眼离三种晶片的距离产生差异，故造成混光颜色的不同。这种发光二极管应用到LED显示屏上时，会产生偏色现象。
[发明内容]
本实用新型要解决的技术问题是提供一种分离式全彩贴片发光二极管，不管是正面观察还是从侧面观察都不会出现混光颜色的差异，应用到显示屏上时，不会产生偏色现象。
为了解决上述技术问题，本实用新型采用的技术方案是，一种分离式全彩贴片发光二极管，包括封装体、焊盘、红色晶片、绿色晶片、蓝色晶片和6个引脚，所述的封装体包括封装腔，所述的焊盘包括固晶焊盘和非固晶焊盘，所述的红色晶片、绿色晶片、蓝色晶片按直线排列。
所述的引脚布置在封装体的两侧，所述的红色晶片、绿色晶片、蓝色晶片布置在封装腔的竖轴上。
所述的蓝色晶片、绿色晶片和红色晶片按上、中、下的次序排列。
所述引脚中的阳极引脚布置在封装体的一侧，阴极引脚布置在封装体的另一侧。
所述蓝色晶片的固晶焊盘与蓝色晶片的阴极引脚连接，蓝色晶片的第二焊点焊盘与蓝色晶片的阳极引脚连接；绿色晶片的固晶焊盘与绿色晶片的阳极引脚连接，绿色晶片的第二焊点焊盘与绿色晶片的阴极引脚连接；红色晶片的固晶焊盘与红色晶片的阴极引脚连接，红色晶片的第二焊点焊盘与红色晶片的阳极引脚连接与红色晶片的阴极引脚连接；蓝色晶片的阴极接蓝色晶片的固晶焊盘，蓝色晶片的阳极接蓝色晶片的第二焊点焊盘；绿色晶片的阳极接绿色晶片的固晶焊盘，绿色晶片的阴极接绿色晶片的第二焊点焊盘；红色晶片的阴极接红色晶片的固晶焊盘，红色晶片的阳极接红色晶片的第二焊点焊盘。
本实用新型分离式全彩贴片发光二极管的红色晶片、绿色晶片和蓝色晶片按直线排列，无论是从正面观察还是从侧面观察，按直线排列的红色晶片、绿色晶片和蓝色晶片与观察者眼睛的距离相同，不会出现混光颜色的差异，应用到显示屏上时，不会产生偏色现象。
[附图说明]
下面结合附图和具体实施方式对本实用新型作进一步详细的说明。
图1是现有的贴片分离式发光二极管的结构图；
图2是本实用新型分离式全彩贴片发光二极管的结构图。
[具体实施方式]
在图2所示的本实用新型离式全彩贴片发光二极管实施例中，6个引脚布置在封装体4的两侧，阳极引脚5、6、7布置在封装体的右侧，阴极引脚8、9、10布置在封装体的左侧。红色晶片1、绿色晶片2、蓝色晶片3按直线排列。蓝色晶片3、绿色晶片2和红色晶片1按上、中、下的次序排列在封装腔401的竖轴A-A上。
蓝色晶片的固晶焊盘11与蓝色晶片的阴极引脚10连接，蓝色晶片的第二焊点焊盘12与蓝色晶片的阳极引脚7连接；绿色晶片的固晶焊盘13与绿色晶片的阳极引脚6连接，绿色晶片的第二焊点焊盘14与绿色晶片的阴极引脚9连接；红色晶片的固晶焊盘15与红色晶片的阴极引脚8连接，红色晶片的第二焊点焊盘16与红色晶片的阳极引脚5连接与红色晶片的阴极引脚连接；蓝色晶片3的阴极接蓝色晶片的固晶焊盘11，蓝色晶片3的阳极接蓝色晶片的第二焊点焊盘12；绿色晶片2的阳极接绿色晶片的固晶焊盘13，绿色晶片2的阴极接绿色晶片的第二焊点焊盘14；红色晶片1的阴极接红色晶片的固晶焊盘15，红色晶片1的阳极接红色晶片的第二焊点焊盘16。
以上分离式全彩贴片发光二极管实施例的红色晶片1、绿色晶片2和蓝色晶片3按直线排列在封装腔401的竖轴A-A上，无论是从正面观察还是从侧面观察，按直线排列的红色晶片1、绿色晶片2和蓝色晶片3与观察者眼睛的距离相同，不会出现混光颜色的差异，应用到显示屏上时，也不会产生偏色现象。

Claims (5)

1.一种分离式全彩贴片发光二极管，包括封装体、焊盘、红色晶片、绿色晶片、蓝色晶片和6个引脚，所述的封装体包括封装腔，所述的焊盘包括固晶焊盘和非固晶焊盘，其特征在于，所述的红色晶片、绿色晶片、蓝色晶片按直线排列。
2.根据权利要求1所述的分离式全彩贴片发光二极管，其特征在于，所述的引脚布置在封装体的两侧，所述的红色晶片、绿色晶片、蓝色晶片布置在封装腔的竖轴上。
3.根据权利要求2所述的分离式全彩贴片发光二极管，其特征在于，所述的蓝色晶片、绿色晶片和红色晶片按上、中、下的次序排列。
4.根据权利要求2所述的分离式全彩贴片发光二极管，其特征在于，所述引脚中的阳极引脚布置在封装体的一侧，阴极引脚布置在封装体的另一侧。
5.根据权利要求1至4中任一权利要求所述的分离式全彩贴片发光二极管，其特征在于，所述蓝色晶片的固晶焊盘与蓝色晶片的阴极引脚连接，蓝色晶片的第二焊点焊盘与蓝色晶片的阳极引脚连接；绿色晶片的固晶焊盘与绿色晶片的阳极引脚连接，绿色晶片的第二焊点焊盘与绿色晶片的阴极引脚连接；红色晶片的固晶焊盘与红色晶片的阴极引脚连接，红色晶片的第二焊点焊盘与红色晶片的阳极引脚连接与红色晶片的阴极引脚连接；蓝色晶片的阴极接蓝色晶片的固晶焊盘，蓝色晶片的阳极接蓝色晶片的第二焊点焊盘；绿色晶片的阳极接绿色晶片的固晶焊盘，绿色晶片的阴极接绿色晶片的第二焊点焊盘；红色晶片的阴极接红色晶片的固晶焊盘，红色晶片的阳极接红色晶片的第二焊点焊盘。
CN2011200237131U 2010-08-26 2011-01-25 分离式全彩贴片发光二极管 Expired - Lifetime CN201956349U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103413851A (zh) * 2013-08-10 2013-11-27 冯春阳 光伏旁路器件及应用该器件的保护电路、接线盒及发电系统
CN106332440B (zh) * 2016-10-28 2019-09-10 浙江宏友电气有限公司 一种led电路板结构及led灯头

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103413851A (zh) * 2013-08-10 2013-11-27 冯春阳 光伏旁路器件及应用该器件的保护电路、接线盒及发电系统
CN106332440B (zh) * 2016-10-28 2019-09-10 浙江宏友电气有限公司 一种led电路板结构及led灯头

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Granted publication date: 20110831