CN202196814U - 一种三通道共极式发光二极管 - Google Patents

一种三通道共极式发光二极管 Download PDF

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CN202196814U
CN202196814U CN2011203061136U CN201120306113U CN202196814U CN 202196814 U CN202196814 U CN 202196814U CN 2011203061136 U CN2011203061136 U CN 2011203061136U CN 201120306113 U CN201120306113 U CN 201120306113U CN 202196814 U CN202196814 U CN 202196814U
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light
emitting diode
emitting
pad
welding disk
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李革胜
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ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co Ltd
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ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Abstract

本实用新型涉及一种三通道共极式发光二极管。主要解决了传统6引脚发光二极管尺寸大、发光曲线不够匹配的问题。发光二极管包括基座、发光芯片、穿置在基座上的六个引脚，每个引脚连接有一个焊盘，所述发光芯片设有三个，发光芯片设置在焊盘上，其特征在于：所述三个发光芯片设置在同一焊盘上，且三个发光芯片的P极和N极各自连接到一个焊盘上。本实用新型的优点是：发光芯片设置在一个焊盘上，焊盘布置更加紧凑，减小了二极管的尺寸；发光芯片呈一字形排列，发光曲线匹配，混光均匀，作出来的显示屏显示效果更好；碗杯通孔采用方形设计，使得内部焊盘尺寸最大化，提高了小尺寸发光二极管固晶焊线的可靠性。

Description

一种三通道共极式发光二极管
技术领域
本实用新型涉及一种发光二极管，尤其涉及一种尺寸小、混光均匀的三通道共极式发光二极管。
背景技术
传统6个引脚的发光二极管由于发光芯片分散设置在焊盘上，使得发光二极管尺寸较大，一般为3.5×2.8mm，或是5.0×5.0mm，这样由于自身尺寸的限制，只能做P6以上的大间距显示屏，无法做到P3以下的高密高清LED显示屏，另外发光芯片成品字形分布，这样RGB发光曲线不够匹配，易产生花屏，且做出的全彩LED显示屏水平角度小。如公开号为CN201549499U，名称为陶瓷基大功率红绿蓝LED的封装结构的中国实用新型专利，器包括陶瓷基板、红色晶片、绿色晶片、蓝色晶片、金线、散热热沉，电路及反射层通过蚀刻镀银方式设置在陶瓷基板上，散热热沉位于陶瓷基座下次的固晶区域，陶瓷基板分二层压合形成凹杯形放射腔体，银胶将红色晶片、绿色晶片、蓝色晶片呈品字形固定在陶瓷基板凹杯形反射腔体内。该专利就具有上述的缺点，红色晶片、绿色晶片、蓝色晶片呈品字形排布，分散设置在焊盘上，这样使得制造的发光二极管尺寸较大，不能用在高清的LED显示屏上；另外，红色晶片、绿色晶片、蓝色晶片品字形排列，RGB发光曲线不够匹配，混光不均匀，容易产生花屏，且作出的全彩LED显示屏角度小。
发明内容
本实用新型主要解决了传统6引脚发光二极管尺寸大、发光曲线不够匹配的问题，提供了一种尺寸小、发光曲线匹配、混光均匀的三通道共极式发光二极管。
本实用新型解决其技术问题所采用的技术方案是：一种三通道共极式发光二极管，包括基座、发光芯片、穿置在基座上的六个引脚，每个引脚连接有一个焊盘，所述发光芯片设有三个，发光芯片设置在焊盘上，所述三个发光芯片设置在同一焊盘上，且三个发光芯片的P极和N极各自连接到一个焊盘上。本实用新型中三个发光芯片设置在同一焊盘上，焊盘布置更加紧凑，从而减小了二极管的尺寸，二极管尺寸可以做到1.7×1.8mm，这样可以做到每平米92000点，使得二极管可以做到更加高清的LED显示屏上。三个发光芯片的P极和N极各自连接到一个焊盘上，这样三个发光芯片可以由不同的信号驱动，且应用端可针对RGB的特性，选择不同的电源供电，从而可以灵活使用电源。
作为一种优选方案，所述三个发光芯片在焊盘上呈“一”字形排列。不仅可以使得焊盘布置更紧凑，而且发光芯片配光曲线好，混光均匀，作出来的显示屏显示效果更好。
作为一种优选方案，在所述基座上安装有碗杯，所述碗杯的中间设置有通孔，该通孔为圆角方形孔。碗杯中间的通孔采用方形孔设计，使得内部焊盘尺寸最大化，提高了小尺寸发光二极管固晶焊线的可靠性。
作为一种优选方案，所述碗杯由黑色硅树脂制成。使得发光二极管完全不受外界环境亮度影响，同时也提高了LED显示屏的对比度和灰度，保证了画面的色彩层次分明。
作为一种优选方案，所述基座由黑色硅树脂制成。使得发光二极管完全不受外界环境亮度影响，同时也提高了LED显示屏的对比度和灰度，保证了画面的色彩层次分明。
本实用新型的优点是：1.发光芯片设置在一个焊盘上，焊盘布置更加紧凑，减小了二极管的尺寸；2.发光芯片呈一字形排列，发光曲线匹配，混光均匀，作出来的显示屏显示效果更好；3.碗杯通孔采用方形设计，使得内部焊盘尺寸最大化，提高了小尺寸发光二极管固晶焊线的可靠性。
附图说明
图1是本实用新型的一种结构透视图。
1-基座  2-碗杯  3-引脚  4-焊盘  5-发光芯片  6-通孔  51-红色发光芯片  52-绿色发光芯片  53-蓝色发光芯片。
具体实施方式：
下面通过实施例，并结合附图，对本实用新型的技术方案作进一步的说明。
实施例：
本实施例一种三通道共极式发光二极管，如图1所示，包括基座1，在该基座上穿置有6个引脚，引脚分成两组均匀设置在基座两边，在基座表面上设置有6个焊盘4，每个引脚连接一个焊盘，其中一个焊盘呈L形设置在基座表面中间，其他5个焊盘为一字形设置在L形焊盘两侧，在L形焊盘上设置有三个发光芯片5，发光芯片为贴片型发光芯片，发光芯片呈一字形排列，三个发光芯片5分别为红色发光芯片51、绿色发光芯片52、蓝色发光芯片53，三个发光芯片都具有P极和N极， 如图1中所示，红色发光芯片的P极与左上引脚连接的焊盘相连，红色发光芯片的N极与右上引脚连接的焊盘相连，绿色发光芯片的P极与左中引脚连接的焊盘相连，绿色发光芯片的N极与右中引脚连接的焊盘相连，蓝色发光芯片的P极与左下引脚连接的焊盘相连，蓝色发光芯片的N极与右下引脚连接的焊盘相连。在基座上设置有碗杯2，该碗杯中间具有通孔6，通孔为圆角方形状孔。在碗杯和基座由黑色硅树脂制成。本实施例中的发光二极管三个发光芯片引脚各自连接一个焊盘，这样发光芯片可以由不同信号驱动，且可针对RGB特性选择不同的电源供电。
本文中所描述的具体实施例仅仅是对本发明精神作举例说明。本发明所属技术领域的技术人员可以对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代，但并不会偏离本发明的精神或者超越所附权利要求书所定义的范围。
尽管本文较多地使用了基座、发光芯片、引脚、焊盘、碗杯等术语，但并不排除使用其它术语的可能性。使用这些术语仅仅是为了更方便地描述和解释本发明的本质；把它们解释成任何一种附加的限制都是与本发明精神相违背的。

Claims (5)

1.一种三通道共极式发光二极管，包括基座、发光芯片、穿置在基座上的六个引脚，每个引脚连接有一个焊盘，所述发光芯片设有三个，发光芯片设置在焊盘上，其特征在于：所述三个发光芯片（5）设置在同一焊盘（4）上，且三个发光芯片的P极和N极各自连接到一个焊盘上。
2.根据权利要求1所述的一种三通道共极式发光二极管，其特征是所述三个发光芯片（5）在焊盘（4）上呈“一”字形排列。
3.根据权利要求1所述的一种三通道共极式发光二极管，其特征是在所述基座（1）上安装有碗杯（2），所述碗杯的中间设置有通孔（6），该通孔为圆角方形孔。
4.根据权利要求3所述的一种三通道共极式发光二极管，其特征是所述碗杯（2）由黑色硅树脂制成。
5.根据权利要求1或2或3所述的一种三通道共极式发光二极管，其特征是所述基座（1）由黑色硅树脂制成。
CN2011203061136U 2011-08-22 2011-08-22 一种三通道共极式发光二极管 Expired - Lifetime CN202196814U (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102709279A (zh) * 2012-05-30 2012-10-03 东莞市凯昶德电子科技股份有限公司 高亮度全彩显示屏led封装结构
CN103779485A (zh) * 2014-01-28 2014-05-07 深圳市蓝科电子有限公司 户外smd全彩led灯珠及其制造方法
CN106783826A (zh) * 2017-01-20 2017-05-31 钟斌 一种高密度高对比度户内全彩贴片top型发光二极管

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102709279A (zh) * 2012-05-30 2012-10-03 东莞市凯昶德电子科技股份有限公司 高亮度全彩显示屏led封装结构
CN103779485A (zh) * 2014-01-28 2014-05-07 深圳市蓝科电子有限公司 户外smd全彩led灯珠及其制造方法
CN106783826A (zh) * 2017-01-20 2017-05-31 钟斌 一种高密度高对比度户内全彩贴片top型发光二极管

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