CN106783821B - 一种无荧光粉的全光谱led封装结构及其封装方法 - Google Patents
一种无荧光粉的全光谱led封装结构及其封装方法 Download PDFInfo
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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CN201611214568.9A CN106783821B (zh) | 2016-12-26 | 2016-12-26 | 一种无荧光粉的全光谱led封装结构及其封装方法 |
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CN201611214568.9A CN106783821B (zh) | 2016-12-26 | 2016-12-26 | 一种无荧光粉的全光谱led封装结构及其封装方法 |
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CN107170734A (zh) * | 2017-06-06 | 2017-09-15 | 南昌大学 | 一种直接板上芯片的led封装结构及其封装方法 |
CN108878624A (zh) * | 2018-06-27 | 2018-11-23 | 朗昭创新控股(深圳)有限公司 | 一种白光led光源及照明装置 |
CN108807359A (zh) * | 2018-07-26 | 2018-11-13 | 中山市光圣半导体科技有限责任公司 | 一种led器件及制造方法 |
CN108957857B (zh) * | 2018-08-01 | 2021-05-28 | Tcl华星光电技术有限公司 | 背光模块及显示装置 |
CN112277423B (zh) * | 2020-10-30 | 2022-10-18 | 中国兵器工业集团第二一四研究所苏州研发中心 | 一种复合填充塞及其制作、使用方法 |
CN112863317A (zh) * | 2021-01-26 | 2021-05-28 | 南昌大学 | 一种led光源可调的光学实验箱 |
CN114335305B (zh) * | 2021-11-09 | 2024-04-16 | 南昌大学 | 一种无荧光粉多基色led侧发光模块及侧发光装置 |
CN117878224A (zh) * | 2024-03-12 | 2024-04-12 | 南昌实验室 | Led封装结构、封装方法和无荧光粉的led |
CN118042672A (zh) * | 2024-04-12 | 2024-05-14 | 南昌大学 | 一种多基色led无粉光源的配光装置及配光方法 |
Citations (3)
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CN101764067A (zh) * | 2009-12-24 | 2010-06-30 | 复旦大学 | 一种类太阳光谱led的封装方法 |
CN102779814A (zh) * | 2011-05-09 | 2012-11-14 | 光芯科技股份有限公司 | 可发出白光的发光元件及其混光方法 |
CN206401317U (zh) * | 2016-12-26 | 2017-08-11 | 南昌大学 | 一种无荧光粉的全光谱led封装结构 |
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US9425172B2 (en) * | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
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CN101764067A (zh) * | 2009-12-24 | 2010-06-30 | 复旦大学 | 一种类太阳光谱led的封装方法 |
CN102779814A (zh) * | 2011-05-09 | 2012-11-14 | 光芯科技股份有限公司 | 可发出白光的发光元件及其混光方法 |
CN206401317U (zh) * | 2016-12-26 | 2017-08-11 | 南昌大学 | 一种无荧光粉的全光谱led封装结构 |
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Address after: 330047 No. 235 East Nanjing Road, Jiangxi, Nanchang Applicant after: Nanchang University Applicant after: NANCHANG GUIJI SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 330047 No. 235 East Nanjing Road, Jiangxi, Nanchang Applicant before: Nanchang University Applicant before: NANCHANG HUANGLYU LIGHTING CO.,LTD. |
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Effective date of registration: 20231031 Address after: 999 No. 330031 Jiangxi province Nanchang Honggutan University Avenue Patentee after: Nanchang University Address before: 330047 No. 235 East Nanjing Road, Jiangxi, Nanchang Patentee before: Nanchang University Patentee before: NANCHANG GUIJI SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20240202 Address after: Room B13, Anaya South District, No. 20 Senhai Road, Jiyang District, Sanya City, Hainan Province, 572099 Patentee after: Jingtai Semiconductor Technology (Hainan) Co.,Ltd. Country or region after: China Address before: 999 No. 330031 Jiangxi province Nanchang Honggutan University Avenue Patentee before: Nanchang University Country or region before: China |