WO2009004875A1 - 電装品ユニット - Google Patents

電装品ユニット Download PDF

Info

Publication number
WO2009004875A1
WO2009004875A1 PCT/JP2008/059899 JP2008059899W WO2009004875A1 WO 2009004875 A1 WO2009004875 A1 WO 2009004875A1 JP 2008059899 W JP2008059899 W JP 2008059899W WO 2009004875 A1 WO2009004875 A1 WO 2009004875A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
substrate
electric apparatus
apparatus unit
covering
Prior art date
Application number
PCT/JP2008/059899
Other languages
English (en)
French (fr)
Inventor
Akio Yoshimoto
Mitsuhiro Tanaka
Original Assignee
Daikin Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries, Ltd. filed Critical Daikin Industries, Ltd.
Priority to AU2008272285A priority Critical patent/AU2008272285B2/en
Priority to US12/601,839 priority patent/US8107242B2/en
Priority to EP08764868.9A priority patent/EP2164312B1/en
Priority to CN2008800228504A priority patent/CN101690438B/zh
Publication of WO2009004875A1 publication Critical patent/WO2009004875A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

　本発明は金型の精度を低減できる電装品ユニットである。基板（１）は方向（Ｄ）について相互に対面する一対の表面（１ａ，１ｂ）を有している。一方の表面（１ａ）には第１電子部品（２）が設けられている。他方の表面（１ｂ）には方向（Ｄ）についての第１電子部品（２）の高さの最大値よりも低い第２電子部品（３）が設けられている。絶縁性樹脂（５）は、第２電子部品（３）および他方の表面（１ｂ）と密着して被覆する被覆部（５ｂ）と、基板（１）の周縁から第２電子部品（２）側へと方向（Ｄ）に沿って延在する側面部（５ａ）とを備えている。蓋（６）は基板（１）とは反対側から第１電子部品（２）を覆い、基板（１）とは反対側から側面部（５ａ）と固定される。
PCT/JP2008/059899 2007-06-29 2008-05-29 電装品ユニット WO2009004875A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2008272285A AU2008272285B2 (en) 2007-06-29 2008-05-29 Electrical equipment unit
US12/601,839 US8107242B2 (en) 2007-06-29 2008-05-29 Electrical equipment unit
EP08764868.9A EP2164312B1 (en) 2007-06-29 2008-05-29 Electric apparatus unit
CN2008800228504A CN101690438B (zh) 2007-06-29 2008-05-29 电装品组件

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007172473 2007-06-29
JP2007-172473 2007-06-29
JP2008-104949 2008-04-14
JP2008104949A JP5098772B2 (ja) 2007-06-29 2008-04-14 電装品ユニット

Publications (1)

Publication Number Publication Date
WO2009004875A1 true WO2009004875A1 (ja) 2009-01-08

Family

ID=40225931

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059899 WO2009004875A1 (ja) 2007-06-29 2008-05-29 電装品ユニット

Country Status (7)

Country Link
US (1) US8107242B2 (ja)
EP (1) EP2164312B1 (ja)
JP (1) JP5098772B2 (ja)
KR (1) KR101065543B1 (ja)
CN (1) CN101690438B (ja)
AU (1) AU2008272285B2 (ja)
WO (1) WO2009004875A1 (ja)

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TWM378573U (en) * 2009-09-15 2010-04-11 Microelectronics Tech Inc Low noise block converter
KR101395358B1 (ko) * 2011-09-02 2014-05-14 주식회사 팬택 방수시트가 설치되는 이동통신 단말기 및 그 제조방법
DE102011089474A1 (de) * 2011-12-21 2013-06-27 Robert Bosch Gmbh Elektronikmodul für ein Fahrzeug
JP2015018971A (ja) * 2013-07-11 2015-01-29 富士通株式会社 放熱板、及び海中機器
DE102013215149A1 (de) * 2013-08-01 2015-02-19 Conti Temic Microelectronic Gmbh Mehrstufiges Dichtsystem zum Einsatz in einem Kraftfahrzeugsteuergerät
KR101518965B1 (ko) * 2014-05-15 2015-05-11 (주)엑스엠더블유 방열 특성을 향상시킨 소형화된 주파수 상향 변환기
JP6312527B2 (ja) * 2014-05-23 2018-04-18 新日本無線株式会社 放熱板を備えた電子部品の実装構造
DE102015207310A1 (de) * 2015-04-22 2016-10-27 Zf Friedrichshafen Ag Elektronikmodul und Verfahren zum Umkapseln desselben
EP3232751B1 (de) * 2016-04-12 2018-07-18 MD Elektronik GmbH Elektrische steckkupplungsvorrichtung
JP2019102485A (ja) * 2017-11-28 2019-06-24 株式会社村田製作所 電子装置
JP7134819B2 (ja) * 2018-10-03 2022-09-12 川崎重工業株式会社 制御装置
JP6880128B2 (ja) * 2019-09-04 2021-06-02 三菱電機株式会社 電子機器ユニット

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321472A (ja) * 1994-05-30 1995-12-08 Inax Corp 便器用コントロールボックス
JPH0918176A (ja) * 1995-06-29 1997-01-17 Toyota Autom Loom Works Ltd 回路基板内蔵筐体
JP2004111435A (ja) 2002-09-13 2004-04-08 Hitachi Ltd コネクタと電子部品の一体モールド構造を有する電気・電子モジュールとその成形方法
JP2004111502A (ja) * 2002-09-17 2004-04-08 Matsushita Electric Ind Co Ltd 外装部品および携帯型電子機器
JP2006190726A (ja) 2005-01-04 2006-07-20 Hitachi Ltd 電子制御装置及びその製造方法
JP2007184507A (ja) * 2006-01-10 2007-07-19 Furukawa Electric Co Ltd:The 回路モジュール及びその製造方法並びに電気接続箱

Also Published As

Publication number Publication date
KR20090130875A (ko) 2009-12-24
KR101065543B1 (ko) 2011-09-19
EP2164312B1 (en) 2021-02-24
EP2164312A4 (en) 2016-11-30
AU2008272285A1 (en) 2009-01-08
JP2009033104A (ja) 2009-02-12
US20100177483A1 (en) 2010-07-15
US8107242B2 (en) 2012-01-31
JP5098772B2 (ja) 2012-12-12
CN101690438B (zh) 2012-06-20
EP2164312A1 (en) 2010-03-17
AU2008272285B2 (en) 2011-05-19
CN101690438A (zh) 2010-03-31

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